Battery piece production method, production device, and battery piece

Abstract

The application provides a battery piece production method, a production device and a battery piece. The battery piece production method comprises the following steps: providing a silicon piece; dispensing glue on a first surface and / or a second surface of the silicon piece; the first surface and the second surface are arranged oppositely; arranging a solder strip on the silicon piece, the solder strip corresponding to the dispensing position; curing the dispensing position to pre-fix the solder strip; and welding the pre-fixed solder strip and the silicon piece to form a battery piece. The battery piece production method provided by the application fixes the solder strip on the silicon piece by the mode of bonding first and then welding the solder strip, improves the connection strength of the solder strip and the silicon piece, and avoids the risk that the solder strip is easy to fall off during the transfer process of the silicon piece.

Description

[0001] This application claims priority to Chinese Patent Application No. 202421340901.0, filed on June 12, 2024, entitled “Battery Cell Production Equipment and Battery Cell”, the entire contents of which are incorporated herein by reference.

[0002] This application claims priority to Chinese Patent Application No. 202421341615.6, filed on June 12, 2024, entitled “Battery Cell String Welding Machine”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of photovoltaic panel processing technology, and more specifically, to a method for producing solar cells, production equipment, and solar cells. Background Technology

[0004] In related technologies, the solder ribbons of solar cells are fixed to the silicon wafer by first soldering and then applying adhesive. Since the solder ribbons are soldered first, the weld strength is actually quite weak, and there is a risk of the solder ribbons detaching during the handling and flipping of the silicon wafer.

[0005] In view of this, a new technical solution is needed to solve the above-mentioned technical problems. Summary of the Invention

[0006] The purpose of this application is to provide a method for producing solar cells, production equipment, and a new technology solution for solar cells.

[0007] In a first aspect, embodiments of this application provide a method for manufacturing solar cells. The method for manufacturing solar cells is characterized by comprising the following steps:

[0008] Silicon wafers are supplied;

[0009] Adhesive is applied to the first and / or second surfaces of the silicon wafer to form dispensing sites; the first and second surfaces are disposed opposite to each other.

[0010] Solder strips are laid on the silicon wafer, and the solder strips correspond to the adhesive dispensing positions.

[0011] The adhesive application site is cured to pre-fix the solder strip;

[0012] The pre-fixed solder strips and the silicon wafer are welded together to form a battery cell.

[0013] Optionally, the provision of the silicon wafer specifically includes:

[0014] A set of silicon wafers is provided, the set of silicon wafers including a first silicon wafer and a second silicon wafer, wherein a first surface of the first silicon wafer and a second surface of the second silicon wafer are on the same horizontal plane.

[0015] Optionally, having the first surface of the first silicon wafer and the second surface of the second silicon wafer on the same horizontal plane specifically includes:

[0016] One of the first silicon wafers and the second silicon wafer is flipped 180° so that the first surface of the first silicon wafer and the second surface of the second silicon wafer are on the same horizontal plane.

[0017] Optionally, the dispensing of adhesive on the first and second surfaces of the silicon wafer specifically includes:

[0018] First, apply adhesive to the first surface of the silicon wafer, and then apply adhesive to the second surface of the silicon wafer.

[0019] Optionally, the step of first applying adhesive to the first surface of the silicon wafer and then applying adhesive to the second surface of the silicon wafer specifically includes:

[0020] The silicon wafer is placed on a dispensing platform, wherein the second surface of the silicon wafer is in contact with the dispensing platform, and the long side of the silicon wafer extends along a first direction;

[0021] Apply adhesive to the first surface of the silicon wafer;

[0022] The silicon wafer with single-sided adhesive dispensing is transferred from the first conveyor line to the second conveyor line, wherein the long side of the silicon wafer extends along a second direction, and the first direction and the second direction are perpendicular.

[0023] The silicon wafer with single-sided adhesive is transferred from the second conveyor line to the third conveyor line, wherein the silicon wafer is rotated 180° so that the first surface of the silicon wafer is in contact with the third conveyor line;

[0024] The silicon wafers on the third conveyor line are transferred to the dispensing platform, with the long side of the silicon wafers extending along the first direction;

[0025] Apply adhesive to the second surface of the silicon wafer.

[0026] Optionally, the first conveyor line, the second conveyor line, and the third conveyor line are all equipped with adhesive-avoiding fixtures.

[0027] Optionally, the dispensing of adhesive on the first and / or second surfaces of the silicon wafer specifically includes:

[0028] The dispensing positions are arranged in a rectangular array on the first and / or second surfaces of the silicon wafer, and adjacent dispensing positions are spaced apart.

[0029] Optionally, the step of laying solder strips on the silicon wafer specifically includes:

[0030] Provides solder strips of preset length;

[0031] Flux is applied to the solder strip;

[0032] The silicon wafers that have been dispensed are transferred to the ribbon placement platform;

[0033] Solder strips containing flux are applied to the surface having the dispensing position.

[0034] Optionally, when both the first and second surfaces of the silicon wafer have dispensing areas, distributing the solder ribbon with flux onto the surface having the dispensing areas specifically includes:

[0035] First, the solder strip containing flux is laid on the solder strip laying platform;

[0036] The silicon wafer is then placed on a solder ribbon placement platform, wherein the solder ribbon corresponds to a dispensing position on one surface of the silicon wafer.

[0037] Then cut the solder strip at the preset position;

[0038] Finally, the cut solder ribbon is placed on the other surface of the silicon wafer, with the solder ribbon corresponding to the dispensing position on the other surface of the silicon wafer.

[0039] Optionally, transferring the silicon wafers after dispensing to the solder ribbon placement platform specifically includes:

[0040] The silicon wafers that have been dispensed are transferred from the dispensing platform to the fourth conveyor line, and then transferred to the first preset position via the fourth conveyor line.

[0041] The silicon wafer located at the first preset position is transferred to the ribbon laying platform.

[0042] Optionally, after applying the solder ribbon containing flux to the surface having the dispensing area, the process further includes:

[0043] The pressure mesh at the second preset position is placed on the solder strip, and the silicon wafer with the pressure mesh is transferred to the curing platform.

[0044] Optionally, the first preset position and the second preset position are spaced apart along the second direction.

[0045] Optionally, after curing the adhesive application site to pre-fix the solder ribbon, the process further includes:

[0046] Rotate the pressure mesh from the curing platform to the second preset position.

[0047] Optionally, welding the pre-fixed solder strips and the silicon wafer to form a solar cell specifically includes:

[0048] The silicon wafer is transferred from the curing platform to the welding platform;

[0049] The heating device located below the welding platform and the pressure head located above the welding platform work together to weld the pre-fixed solder strip and the silicon wafer.

[0050] Secondly, embodiments of this application also provide a solar cell manufacturing apparatus. The solar cell manufacturing apparatus uses the solar cell manufacturing method described in the first aspect to prepare solar cells.

[0051] Optionally, the solar cell production equipment includes:

[0052] The feeding device is used to provide silicon wafers;

[0053] A dispensing device for dispensing adhesive onto a first surface and / or a second surface of the silicon wafer;

[0054] A solder ribbon processing device is used to lay solder ribbons on the silicon wafer, wherein the solder ribbons correspond to the adhesive dispensing positions.

[0055] A curing device for curing the dispensing site to pre-fix the solder ribbon;

[0056] A welding apparatus for welding pre-fixed solder strips and silicon wafers to form a solar cell.

[0057] Thirdly, embodiments of this application also provide a battery cell. The battery cell is prepared using the battery cell manufacturing method described in the first aspect.

[0058] According to the embodiments of this application, the solder ribbon is fixed to the battery cell by first screen printing and then welding, which avoids the risk of the solder ribbon falling off the battery cell during transportation.

[0059] Other features and advantages of this specification will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0060] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments of this specification and, together with their description, serve to explain the principles of this specification.

[0061] Figure 1 The diagram shown is a flowchart of a battery cell manufacturing method provided in an embodiment of this application.

[0062] Figure 2The diagram shown is a frame diagram of the battery cell production equipment provided in an embodiment of this application.

[0063] Figure 3 The diagram shows the battery cell production flow provided in the embodiments of this application. Figure 1 .

[0064] Figure 4 The diagram shows the battery cell production flow provided in the embodiments of this application. Figure 2 .

[0065] Figure 5 The diagram shows the battery cell production flow provided in the embodiments of this application. Figure 3 .

[0066] Explanation of reference numerals in the attached figures:

[0067] 60. Feeding device;

[0068] 61. First transfer device;

[0069] 62. Dispensing device; 621. Dispensing platform; 622. First conveyor line; 623. Second conveyor line; 624. Third conveyor line;

[0070] 63. Welding strip processing device; 631. Welding strip pulling device; 632. Welding strip laying platform; 633. Six-axis robot; 634. Fourth conveyor line; A. First preset position; B. Second preset position;

[0071] 64. Curing device; 641. Curing platform; 642. Fifth conveyor line;

[0072] 65. Welding equipment; Detailed Implementation

[0073] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0074] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the scope of this application and its application or use.

[0075] Technologies and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such technologies and equipment should be considered part of the specification.

[0076] In all the examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0077] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0078] Currently, the connection method between solder ribbons and silicon wafers is to solder first and then bond. If the solder ribbon is fixed by soldering first and then bonding, the bonding strength of the solder is often less than that of the bond. After the solder ribbon is soldered, it may fall off during the subsequent handling of the silicon wafer. In addition, if the soldering first and then bonding method is used, the bonding can only be achieved by dispensing glue with a dispensing machine. However, it is difficult to control the dispensing position and amount. This results in uneven dispensing quality, which to some extent increases the overall thickness of the solar cell.

[0079] Based on the above-mentioned technical problems, this application provides a method for manufacturing solar cells. (Refer to...) Figure 1 The battery cell manufacturing method includes the following steps:

[0080] S1: Provides silicon wafers;

[0081] S2: Apply adhesive to the first and / or second surfaces of the silicon wafer to form adhesive application sites; the first and second surfaces are disposed opposite to each other;

[0082] S3: Solder strips are laid on the silicon wafer, and the solder strips correspond to the dispensing positions;

[0083] S4: Curing treatment is applied to the dispensing area to pre-fix the solder strip;

[0084] S5: The pre-fixed solder strip and the silicon wafer are welded together to form a battery cell.

[0085] In this application embodiment, a method for producing solar cells is provided, which includes steps S1 to S5.

[0086] In step S1, providing silicon wafers mainly refers to loading silicon wafers to ensure the smooth operation of subsequent processes. During the loading process, single silicon wafers can be loaded continuously, or a group of silicon wafers (at least two silicon wafers) can be loaded continuously.

[0087] Silicon wafers are the basic material for solar cells. In this step, the bare silicon wafers, the raw substrates for the solar cells, are loaded. For example, a loading device 60 can be used to load the silicon wafers.

[0088] In the cell manufacturing process, two silicon wafers are often connected together by solder ribbons. Therefore, in this step, the two silicon wafers can be regarded as a group of silicon wafers and the silicon wafers are fed in a group.

[0089] For example, in the cell manufacturing process, two silicon wafers are often arranged opposite each other and connected together by solder ribbon. In this case, the feeding device 60 may include a flipping mechanism that flips one of the two silicon wafers by 180° so that the two silicon wafers are arranged opposite each other when dispensing adhesive to a set of silicon wafers.

[0090] In one specific embodiment, step S1 specifically includes sub-step S10:

[0091] S10: Provide a set of silicon wafers, the set of silicon wafers including a first silicon wafer and a second silicon wafer, wherein a first surface of the first silicon wafer and a second surface of the second silicon wafer are on the same horizontal plane.

[0092] In step S10, two silicon wafers are considered as a group of silicon wafers. That is, when loading silicon wafers, two adjacent silicon wafers are considered as a group of silicon wafers and loaded at the same time.

[0093] A set of silicon wafers includes a first silicon wafer and a second silicon wafer. The first surface of the first silicon wafer (i.e., the front side of the first silicon wafer) and the second surface of the second silicon wafer (i.e., the back side of the second silicon wafer) are arranged on the same horizontal plane. That is, the first silicon wafer and the second silicon wafer are arranged opposite each other, in preparation for the smooth progress of subsequent processing steps.

[0094] For example, to more specifically describe how to align the first surface of the first silicon wafer and the second surface of the second silicon wafer to the same horizontal plane, sub-step S101 is introduced. The following is an explanation of step S101:

[0095] S101: Flip one of the first silicon wafer and the second silicon wafer by 180° so that the first surface of the first silicon wafer and the second surface of the second silicon wafer are on the same horizontal plane.

[0096] In step S101, a specific operation is performed: one of the first silicon wafers and the second silicon wafer is flipped 180°.

[0097] The purpose of flipping is to adjust the position of the silicon wafers so that the first surface of the first silicon wafer (i.e., the front side of the first silicon wafer) and the second surface of the second silicon wafer (i.e., the back side of the second silicon wafer) are on the same horizontal plane. Flipping 180° means completely inverting the silicon wafers, so that the surface that was originally facing up becomes facing down, and the surface that was originally facing down becomes facing up.

[0098] This flipping operation ensures that the two silicon wafers are arranged in opposite directions, meeting the requirements of subsequent processing steps.

[0099] In step S2, adhesive is applied to the first surface and / or the second surface of the silicon wafer. For example, adhesive can be applied to the first surface of the silicon wafer (i.e., the front side of the silicon wafer), i.e., single-sided adhesive application; or adhesive can be applied to the second surface of the silicon wafer (i.e., the back side of the silicon wafer), i.e., single-sided adhesive application; or adhesive can be applied to both the first surface of the silicon wafer (i.e., the front side of the silicon wafer) and the second surface of the silicon wafer (i.e., the back side of the silicon wafer), i.e., double-sided adhesive application.

[0100] Preferably, during the cell manufacturing process, it is often necessary to apply solder ribbons to both sides of each silicon wafer, so double-sided adhesive application to silicon wafers is quite common.

[0101] Dispensing refers to applying adhesive to the surface of the silicon wafer. This step is to better pre-fix the solder ribbon in subsequent steps and avoid the risk of solder ribbon detachment during the wafer transfer process.

[0102] In this step, there are various dispensing methods available, such as dispensing with a dispensing head, jet dispensing, or screen printing dispensing. Taking screen printing dispensing as an example, a screen is placed over the surface of the silicon wafer to be dispensed with adhesive, and a squeegee dips in the adhesive to print it onto the silicon wafer surface. This method allows for better control of the amount of adhesive dispensed.

[0103] In a specific embodiment, taking the double-sided dispensing of adhesive on a silicon wafer as an example, step S2, dispensing adhesive on the first and second surfaces of the silicon wafer, specifically includes sub-step S20:

[0104] Step S20: First apply adhesive to one surface of the silicon wafer, then apply adhesive to the other surface of the silicon wafer.

[0105] In this step, by applying adhesive to one surface of the silicon wafer first and then to the other surface, it can be ensured that both sides of the silicon wafer are evenly covered by the welding device 65, providing a good foundation for the placement and fixation of the solder ribbon in subsequent steps.

[0106] For example, taking the dispensing of adhesive onto a first silicon wafer as an example, adhesive is first dispensed onto the first surface of the first silicon wafer (i.e., the front side of the first silicon wafer), and then adhesive is dispensed onto the second surface of the first silicon wafer (i.e., the back side of the first silicon wafer).

[0107] For example, taking the dispensing of adhesive to a second silicon wafer as an example, adhesive is first dispensed onto the second surface of the second silicon wafer (i.e., the back side of the second silicon wafer), and then adhesive is dispensed onto the first surface of the second silicon wafer (i.e., the front side of the second silicon wafer).

[0108] Furthermore, referring to Figure 5 and Figure 3 Step S20 involves first applying adhesive to the first surface of the silicon wafer, and then applying adhesive to the second surface of the silicon wafer. Specifically, this includes sub-steps S201 to S206.

[0109] S201: The silicon wafer is placed on the dispensing platform 621, wherein the second surface of the silicon wafer is in contact with the dispensing platform 621, and the long side of the silicon wafer extends along the first direction;

[0110] S202: Apply adhesive to the first surface of the silicon wafer;

[0111] S203: The silicon wafer with single-sided adhesive dispensing is transferred from the first conveyor line 622 to the second conveyor line 623, wherein the silicon wafer is transferred to the second conveyor line 623, and the long side of the silicon wafer extends along the second direction, the first direction and the second direction being perpendicular;

[0112] S204: The silicon wafer with single-sided adhesive is transferred from the second conveyor line 623 to the third conveyor line 624, wherein the silicon wafer is rotated 180° on the third conveyor line 624 so that the first surface of the silicon wafer is in contact with the third conveyor line 624.

[0113] S205: The silicon wafer on the third conveyor line 624 is transferred to the dispensing platform 621, and the long side of the silicon wafer extends along the first direction;

[0114] S206: Apply adhesive to the second surface of the silicon wafer.

[0115] In this embodiment, the double-sided dispensing of adhesive on the first silicon wafer is used as an example for illustration.

[0116] In step S201, the silicon wafer is first placed on the dispensing platform 621. Specifically, the first silicon wafer is placed on the dispensing platform 621, and the second surface (back side) of the first silicon wafer is attached to the dispensing platform 621 to prepare for subsequent dispensing of adhesive on the first surface of the first silicon wafer.

[0117] It should be noted that when performing double-sided dispensing on the second silicon wafer, it is also necessary to place the second silicon wafer on the dispensing platform 621. The difference from the placement of the first silicon wafer is that the first surface (i.e., the front side) of the second silicon wafer mates with the dispensing platform 621 to prepare for subsequent dispensing on the second surface of the second silicon wafer.

[0118] Whether dispensing adhesive onto the first silicon wafer or the second silicon wafer, after placing the silicon wafer on the dispensing platform 621, the long side of the silicon wafer extends along the first direction, setting a directional reference for subsequent operations.

[0119] It should be noted that the main purpose of defining the placement orientation of the silicon wafer on the dispensing platform 621 is to facilitate the dispensing process. Optionally, those skilled in the art can adjust the placement position and orientation of the silicon wafer on the dispensing platform 621 according to the specific location and type of the dispensing equipment.

[0120] In step S202, after the first silicon wafer is placed, adhesive is applied to the first surface of the first silicon wafer.

[0121] Alternatively, after the first and second silicon wafers are placed, adhesive can be applied to the first surface of the first silicon wafer and the second surface of the second silicon wafer simultaneously; or adhesive can be applied to the first surface of the first silicon wafer first and then to the second surface of the second silicon wafer; or adhesive can be applied to the second surface of the second silicon wafer first and then to the first surface of the first silicon wafer.

[0122] In step S203, the first silicon wafer with single-sided adhesive dispensing is transferred to the second conveyor line 623. Alternatively, both the first and second silicon wafers with single-sided adhesive dispensing are transferred to the second conveyor line 623.

[0123] It should be noted that, whether the first silicon wafer with single-sided adhesive is transferred to the second conveyor line 623, or both the first and second silicon wafers with single-sided adhesive are transferred to the second conveyor line 623, the silicon wafer placed on the second conveyor line 623 is rotated 90° relative to the silicon wafer placed on the first conveyor line 622, and the long side of the silicon wafer extends along the second direction, with the first and second directions being perpendicular.

[0124] It should be noted that the main purpose of defining the placement direction of the silicon wafer on the second conveyor line 623 is to facilitate the transport of the silicon wafer in conjunction with the arrangement direction of the second conveyor line 623. Optionally, those skilled in the art can adjust the placement direction of the silicon wafer on the second conveyor line 623 according to the arrangement direction and position of the second conveyor line 623.

[0125] In step S204: The first silicon wafer with single-sided adhesive dispensing continues to flow to the third conveyor line 624. The silicon wafer placed on the third conveyor line 624 is rotated 180° compared to the silicon wafer placed on the second conveyor line 623, thus preparing for adhesive dispensing on the un-dispensed surface. The silicon wafer flows from the second conveyor line 623 to the third conveyor line 624.

[0126] Alternatively, both the first and second silicon wafers with single-sided adhesive dispensing are transferred to the third conveyor line 624. The first surface of the first silicon wafer placed on the third conveyor line 624 is bonded to the third conveyor line 624, i.e., the second surface of the first silicon wafer is facing upwards, in preparation for adhesive dispensing on the second surface of the first silicon wafer. Similarly, the second surface of the second silicon wafer placed on the third conveyor line 624 is bonded to the third conveyor line 624, i.e., the first surface of the second silicon wafer is facing upwards, in preparation for adhesive dispensing on the first surface of the second silicon wafer.

[0127] In step S205, the silicon wafer located on the third conveyor line 624 is transferred back to the dispensing platform 621; that is, the flipped silicon wafer is transferred from the third conveyor line 624 back to the dispensing platform 621. For example, a four-jaw gripper can be used to transport the silicon wafer located on the third conveyor line 624 to the dispensing platform 621.

[0128] At this time, the long side of the silicon wafer located on the dispensing platform 621 extends again along the first direction, ready to dispense on another surface, that is, to dispense on the first surface of the first silicon wafer and on the second surface of the second silicon wafer.

[0129] In step S206, adhesive is applied to the first surface of the first silicon wafer and to the second surface of the second silicon wafer, thus completing the double-sided adhesive application of the first silicon wafer and the second silicon wafer.

[0130] This process, through precise steps and the coordinated use of the conveyor line, achieves efficient and accurate double-sided dispensing of adhesive onto silicon wafers. Each step ensures that the silicon wafer is dispensed in the correct position and orientation, thereby improving production efficiency and product quality.

[0131] In one embodiment, the first conveyor line 622, the second conveyor line 623, and the third conveyor line 624 are all equipped with adhesive-avoiding fixtures.

[0132] In this embodiment, to ensure that the silicon wafers are not affected by the dispensing operation during transport, while maintaining their cleanliness and integrity, adhesive-avoiding fixtures are provided on the first transport line 622, the second transport line 623, and the third transport line 624. The structure of the first transport line 622, the second transport line 623, and the third transport line 624 includes, but is not limited to, conveyor belts.

[0133] It should be noted that during the process of transferring silicon wafers, both after dispensing the adhesive and before curing the adhesive at the dispensing points, the silicon wafer conveyor line needs to be equipped with adhesive-avoiding fixtures.

[0134] Adhesive-avoidance fixtures are designed to prevent adhesive from splashing or flowing onto the conveyor line during the dispensing process, thereby contaminating the silicon wafers or affecting the normal operation of the conveyor line. These fixtures may employ methods such as shielding, diversion, or adsorption to effectively prevent adhesive from contacting the conveyor line and non-dispensing areas of the silicon wafers.

[0135] Alternatively, adhesive avoidance can be achieved through physical isolation, airflow control, or other means to ensure that the screen-printed adhesive remains clean during transport. For example, the adhesive avoidance device can employ a four-corner support fixture combined with a grid-like support structure to avoid the adhesive dots.

[0136] Alternatively, the adhesive avoidance device can be an adhesive avoidance tool or an adhesive avoidance conveyor belt. For example, gaps, holes, or other avoidance structures can be provided on the adhesive avoidance tool or the adhesive avoidance conveyor belt to avoid the adhesive spot.

[0137] It should be noted that the specific structure of the adhesive-avoiding device is not limited in the embodiments of this application, as long as it can ensure that the adhesive is not contaminated or damaged during the transmission of the battery cells.

[0138] This design ensures that the silicon wafers remain clean throughout the transport and flipping process, providing a good foundation for subsequent soldering and other processing steps. At the same time, the use of adhesive-free fixtures helps extend the lifespan of the conveyor line and reduces maintenance needs caused by adhesive contamination.

[0139] In one embodiment, the dispensing of adhesive on the first and / or second surfaces of the silicon wafer further includes: the dispensing positions are arranged in a rectangular array on the first and / or second surfaces of the silicon wafer, and adjacent dispensing positions are spaced apart.

[0140] In this embodiment, the adhesive dots on the first and second surfaces of the silicon wafer are arranged in a rectangular array. This arrangement means that there is a certain gap between adjacent adhesive dots.

[0141] A rectangular array of dispensing points ensures uniformity and stability of the solder ribbon placement on the silicon wafer. Since the solder ribbons need to correspond to the dispensing points, the precise arrangement of these points is crucial for the secure placement of the solder ribbons and the success of subsequent soldering steps.

[0142] Furthermore, the spacing between adjacent dispensing sites prevents adhesive from spreading or overflowing on the silicon wafer surface, thus maintaining wafer cleanliness and dispensing accuracy. This spacing also helps control the heat-affected zone of the solder ribbon during soldering (e.g., soldering between adjacent dispensing sites), preventing damage to the silicon wafer due to overheating.

[0143] In step S3, after forming the dispensing positions on the surface of the silicon wafer, solder ribbons are then laid on the silicon wafer, with the solder ribbons corresponding to the dispensing positions, to achieve the purpose of pre-fixing the solder ribbons.

[0144] Solder ribbon is a metal strip used to connect solar cells, typically made of copper or aluminum. In this step, the solder ribbon is precisely placed on the silicon wafer, corresponding to the previously applied adhesive.

[0145] In a specific embodiment, step S3, which involves laying solder strips on the silicon wafer, specifically includes sub-steps S30 to S33.

[0146] S30: Provides solder strips of preset length;

[0147] S31: Apply flux to the solder strip;

[0148] S32: Transfer the silicon wafer with the adhesive applied to the ribbon placement platform 632;

[0149] S33: Apply the solder ribbon containing flux to the surface having the dispensing position.

[0150] In step S30, for example, a solder strip of a preset length can be provided by the solder strip processing device 63.

[0151] For example, the solder ribbon processing apparatus 63 includes a solder ribbon pulling device 631 and a solder ribbon laying platform 632. The solder ribbon pulling device 631 includes a solder ribbon stretching assembly, which is used to lay the solder ribbon on the surface of the silicon wafer.

[0152] The main function of the solder ribbon stretching assembly is to use mechanical force and technical manipulation to achieve the required length of solder ribbon. The stretched solder ribbon then needs to be precisely positioned on the dispensing area of ​​the silicon wafer.

[0153] Optionally, the welding strip feeding device 631 may also include a welding strip unwinding module, a welding strip buffer module, a flux module, and a cutter module, etc., through the cooperation of these modules to arrange the welding strip on the battery cell.

[0154] This step involves preparing solder ribbon of appropriate length to ensure it covers all the dots on the silicon wafer.

[0155] In step S31, applying flux to the solder strip can be understood as follows: after the solder strip released through the solder strip unwinding module and the solder strip buffer module passes through the flux module, flux is applied to the solder strip. For example, flux can be applied to the solder strip by dipping or smearing it.

[0156] This helps improve wettability and flowability during the welding process, thereby improving weld quality and reliability.

[0157] In step S32, the silicon wafer with completed adhesive dispensing is transferred to the solder ribbon placement platform 632. Specifically, the silicon wafer with completed adhesive dispensing is transferred to the solder ribbon placement platform 632 in preparation for solder ribbon placement. This step ensures that the silicon wafer is in the correct position for subsequent solder ribbon placement operations.

[0158] In step S33, the solder ribbon is precisely applied to the surface of the silicon wafer with the dispensing points. Since flux has been applied to the solder ribbon, this facilitates the soldering process between the ribbon and the silicon wafer.

[0159] Through these sub-steps, step S3 ensures that the solder ribbon can be accurately placed on the dispensing sites on the silicon wafer, providing a good foundation for the soldering process in subsequent steps.

[0160] It should be noted that the above sub-steps S30 to S33 define one specific implementation method for laying solder strips on the silicon wafer. Optionally, steps S32 and S33 can be interchanged.

[0161] Furthermore, when both the first and second surfaces of the silicon wafer have dispensing sites, step S33, which involves placing the solder ribbon with flux on the surface having the dispensing sites, specifically includes the following sub-steps S331 to S333:

[0162] S331: First, lay the welding strip with flux on the welding strip laying platform 632;

[0163] S332: The silicon wafer is then placed on a solder ribbon placement platform 632 on which solder ribbons are laid out, the solder ribbons corresponding to the dispensing positions on one of the surfaces of the silicon wafer;

[0164] S333: Then cut the solder strip at the preset position;

[0165] S334: Finally, the cut solder ribbon is placed on the other surface of the silicon wafer, and the solder ribbon corresponds to the dispensing position on the other surface of the silicon wafer.

[0166] In step S331, the solder ribbon is pre-placed on the solder ribbon placement platform 632, ready to be aligned with one of the surfaces of the silicon wafer.

[0167] In step S332, the silicon wafer is placed on a platform where solder ribbons have been laid out, ensuring that the solder ribbons are precisely aligned with the dispensing points on one of the surfaces of the silicon wafer.

[0168] In step S333, the solder ribbon is cut at the appropriate position to lay a new solder ribbon segment on the other surface of the silicon wafer.

[0169] In step S334, the cut solder strip is repositioned and placed on another surface of the silicon wafer, ensuring that it is also aligned with the dispensing position on that surface.

[0170] Through these sub-steps, step S33 ensures that the solder ribbons are precisely positioned on the dispensing sites of the first and second surfaces of the silicon wafer. This double-sided solder ribbon placement is crucial for subsequent soldering and electrical connection of the solar cells, as it ensures that the cells possess good conductivity and mechanical stability.

[0171] In one specific embodiment, refer to Figure 3 Step S32 transfers the silicon wafer with the dispensing completed to the solder ribbon placement platform 632, specifically including the following sub-steps S321 to S322.

[0172] S321: The silicon wafer that has been dispensed is transferred from the dispensing platform 621 to the fourth conveyor line 634, and then transferred to the first preset position A through the fourth conveyor line 634;

[0173] S322: Transfer the silicon wafer located at the first preset position A to the ribbon laying platform 632.

[0174] In step S321: First, the silicon wafer with completed dispensing is transferred from the dispensing platform 621 to the fourth conveyor line 634. This step is accomplished by a robotic arm, conveyor belt, or other automated equipment to transfer the silicon wafer from the dispensing process to the next process. The silicon wafer moves steadily on the fourth conveyor line 634 until it reaches a specific position.

[0175] It should be noted that adhesive-avoiding fixtures also need to be installed on the fourth conveyor line 634.

[0176] Specifically, the double-sided coated silicon wafer located on the dispensing platform 621 can be transferred to the first conveyor line 622, and then transferred to the fourth conveyor line 634 via the first conveyor line 622. For example, a transfer mechanism can be used between the first conveyor line 622 and the fourth conveyor line 634 to transfer the double-sided coated silicon wafer from the first conveyor line 622 to the fourth conveyor line 634.

[0177] In step S322: Next, the silicon wafer located at the first preset position A is transferred to the ribbon placement platform 632. At the first preset position A, the position of the silicon wafer can be identified by sensors or markers to ensure that it is accurately transferred to the ribbon placement platform 632. This transfer is also accomplished by a robotic arm, conveyor belt, or other automated equipment.

[0178] Through these sub-steps, step S32 ensures that the silicon wafers that have completed dispensing can be smoothly and accurately transferred from the dispensing platform 621 to the solder ribbon placement platform 632, preparing for the subsequent solder ribbon placement process.

[0179] In one embodiment, refer to Figure 4 After step S33, where the solder ribbon containing flux is applied to the surface having the dispensing position, step S34 is further included:

[0180] S34: Place the pressure mesh at the second preset position B on the solder strip, and transfer the silicon wafer with the pressure mesh to the curing platform 641.

[0181] In step S34, a pre-set pressure mesh is first placed on the welding strip, for example, by using a robotic arm, conveyor belt or other automated equipment to complete the placement process.

[0182] The purpose of the pressure stencil is to apply pressure to the solder ribbon, making it adhere more tightly to the dispensing area on the silicon wafer. At the same time, the pressure stencil also helps to eliminate air bubbles between the solder ribbon and the silicon wafer, improving the soldering quality.

[0183] Next, the silicon wafer with the pressure mesh attached is transferred to the curing platform 641. On the curing platform 641, the solder ribbon and adhesive are cured under specific time and temperature conditions, ensuring that the solder ribbon adheres firmly to the silicon wafer. This step is crucial for ensuring the bonding strength between the solder ribbon and the silicon wafer.

[0184] Step S34 can further improve the adhesion of the solder ribbon to the silicon wafer and the welding quality, providing a solid foundation for the subsequent cell processing and electrical connection.

[0185] Alternatively, when the pressure mesh is placed over the welding strip, a magnetic suction device can be used in conjunction with the pressure mesh to make the welding strip adhere to the dispensing position.

[0186] Specifically, the magnetic suction device is used in conjunction with the pressure mesh. When the pressure mesh is placed on the welding strip, the magnetic suction device uses magnetic force to ensure close contact between the pressure mesh and the welding strip, so that the welding strip is firmly pressed onto the welding strip.

[0187] For example, through precise control of magnetic force, the magnetic suction device can ensure that the bonding position of the solder ribbon and the adhesive application position is accurate, avoiding the offset or misalignment problems that may occur in traditional methods.

[0188] For example, when curing the first surface (front) of the solar cell, a combination of a pressure plate and a magnetic attraction device can be used to properly attach the solder ribbon to the dispensing area. When curing the second surface (back) of the solar cell, the magnetic attraction force is used to press the solar cell downwards as much as possible to facilitate the adhesion of the solder ribbon and the silicon wafer.

[0189] In one embodiment, refer to Figure 3 The first preset position A and the second preset position B are spaced apart along the second direction.

[0190] In this embodiment, the positions of the first preset position A and the second preset position B are defined so that a robotic arm or other mechanism can be set between the first preset position A and the second preset position B, and the silicon wafer and the mesh can be placed by the same robotic arm.

[0191] Alternatively, the robotic arm can be a six-axis robotic arm 633.

[0192] In step S4, the adhesive dispensing area is cured to pre-fix the solder ribbon, thereby improving the mechanical bond strength between the solder ribbon and the silicon wafer. The curing process involves hardening the welding device 65 by heating or other methods, thus firmly securing the solder ribbon to the silicon wafer. This step is a pre-fixation process to ensure that the solder ribbon will not move during subsequent welding steps.

[0193] In this step, the adhesive application area where the solder ribbon is laid is cured. This fixes the welding device 65 and strengthens the connection with the silicon wafer. It also improves the reliability of the connection between the solder ribbon and the adhesive.

[0194] Alternatively, curing methods may include heat curing, UV curing, or other curing technologies. Specific curing methods and parameters (such as temperature, time, and light intensity) may be adjusted depending on the properties of the adhesive and solder ribbon used.

[0195] In one embodiment, refer to Figure 4 After step S4, which involves curing the adhesive at the dispensing site to pre-fix the solder ribbon, step S41 is further included:

[0196] S41: Rotate the pressure mesh from the curing platform 641 to the second preset position B.

[0197] Specifically, in this step, after the pressing mesh has completed its curing and pressing process, it needs to be removed from the curing platform 641 and rotated back to its original second preset position B. This operation is to prepare for the processing of the next silicon wafer or cell, ensuring that the pressing mesh can be reused and that space on the curing platform 641 is freed up for subsequent processing steps. For example, the pressing mesh is rotated from the curing platform 641 to the second preset position B via the fifth conveyor line 642.

[0198] Step S41 enables the effective recycling and reuse of the pressed wire, improving production efficiency and resource utilization. Simultaneously, it ensures that the next silicon wafer can be processed promptly on the curing platform 641, thus maintaining the continuity and efficiency of the production line.

[0199] In step S5, welding techniques (such as pressure welding, laser welding, ultrasonic welding, or other welding techniques) are used to permanently connect the solder strip to the silicon wafer. After welding, a complete solar cell is formed, which can then be used for the assembly of solar panels.

[0200] In a specific embodiment, step S5, which involves welding the pre-fixed solder strip and the silicon wafer to form a solar cell, specifically includes the following sub-steps S51 to S52.

[0201] S51: The silicon wafer is transferred from the curing platform 641 to the welding platform;

[0202] S52: The heating device located below the welding platform and the pressure head located above the welding platform work together to weld the pre-fixed solder strip and the silicon wafer.

[0203] In step S51, the silicon wafer is first transferred from the curing platform 641 to the welding platform. This step is typically accomplished using automated equipment, such as robotic arms or conveyor belts, to ensure that the silicon wafer is transferred accurately and stably to the welding platform.

[0204] In step S52, after the silicon wafer reaches the welding platform, the heating device located below the welding platform starts working to heat the solder strips on the silicon wafer. Simultaneously, the pressure head located above the welding platform descends, contacts the solder strips, and applies a certain pressure. The combined effect of heating and pressure causes the solder between the solder strips and the silicon wafer to melt and flow, filling the weld seam and forming a strong welded joint.

[0205] Through sub-steps S51 and S52, step S5 achieves the process of welding the pre-fixed solder ribbon and silicon wafer to form a solar cell. This process ensures that the electrical and mechanical connections between the solder ribbon and the silicon wafer meet the requirements, laying a solid foundation for subsequent solar cell testing and assembly.

[0206] Optionally, to ensure the reliability of solder ribbon and silicon wafer welding, the pressure head is located between two adjacent dispensing positions, and one or more welding positions are formed between the two adjacent dispensing positions through the cooperation of the heating device and the pressure head.

[0207] Therefore, this embodiment provides a cell manufacturing method that adjusts the method of fixing the solder ribbon to the silicon wafer. Specifically, it adopts a method of first applying adhesive and then welding the solder ribbon to fix it. This results in a stronger bond between the solder ribbon and the adhesive after the adhesive has cured, making the solder ribbon less prone to detachment during silicon wafer turnover. Furthermore, by first applying adhesive to the cell, the thickness and dosage of the adhesive can be better controlled, thus allowing for better control of the overall thickness of the cell.

[0208] This application also provides a solar cell manufacturing apparatus. The solar cell manufacturing apparatus uses the solar cell manufacturing method described above to prepare solar cells.

[0209] In this embodiment, the cell manufacturing equipment uses the above-mentioned cell manufacturing method to prepare cells, that is, the cell manufacturing equipment first applies adhesive to the solder ribbon and then welds the solder ribbon to fix the solder ribbon on the silicon wafer.

[0210] In one embodiment, refer to Figure 2 The battery cell production equipment includes:

[0211] Feeding device 60, the feeding device 60 being used to provide silicon wafers;

[0212] Dispensing device 62, the dispensing device 62 being used to dispense adhesive onto the first surface and / or the second surface of the silicon wafer;

[0213] A solder ribbon processing device 63 is used to lay solder ribbons on the silicon wafer, and the solder ribbons correspond to the dispensing positions.

[0214] Curing device 64, the curing device 64 is used to cure the dispensing position to pre-fix the solder ribbon;

[0215] A welding device 65 is used to weld the pre-fixed solder strip and the silicon wafer to form a battery cell.

[0216] In this embodiment, the cell production equipment includes a feeding device 60, which is specifically responsible for automatically and accurately conveying the cells to the dispensing device 62 for subsequent processing.

[0217] Optionally, the feeding device 60 includes a flipping mechanism to flip one of the silicon wafers in a set of silicon wafers (two silicon wafers) by 180°.

[0218] The solar cell manufacturing equipment also includes a dispensing device 62, which forms a specific adhesive (i.e., dispensing position) on the silicon wafer through a dispensing method. Various dispensing methods can be used, such as dispensing head dispensing, jet dispensing, or screen printing dispensing. Taking screen printing dispensing as an example, a screen is placed on the silicon wafer, and a squeegee dips into the welding device 65, printing the welding device 65 onto the silicon wafer where the adhesive needs to be printed. By processing solar cells by first dispensing adhesive onto the silicon wafer and then welding, the amount of adhesive dispensed can be better controlled.

[0219] The dispensing device 62 can perform single-sided dispensing of adhesive onto a silicon wafer, forming adhesive on one surface of the wafer. Alternatively, the dispensing device 62 can perform double-sided dispensing of adhesive onto a silicon wafer, forming adhesive on two opposing surfaces of the wafer. When performing double-sided dispensing of adhesive onto the silicon wafer using the dispensing device 62, adhesive is first applied to the first surface of the wafer, and then, through a flipping mechanism or similar process, adhesive is applied to the second surface of the wafer.

[0220] Optionally, the dispensing device 62 includes a dispensing platform 621. The main function of the dispensing platform 621 is to support the solar cell and provide stable support for the solar cell during the dispensing process. For example, during the dispensing process, the platform needs to ensure that the solar cell is positioned accurately and stably so that the scraper dipped in the welding device 65 can accurately apply the welding device 65 to the solar cell according to a preset pattern or path.

[0221] Optionally, depending on the actual application of the solar cell, the dispensing device 62 can process a group of silicon wafers (two silicon wafers) simultaneously. When processing a group of silicon wafers simultaneously, it can be that the first surface (i.e., the front side) of one silicon wafer and the second surface (the back side) of the other silicon wafer are processed at the same time.

[0222] Optionally, a first transfer device 61 is provided between the feeding device 60 and the dispensing device 62. The first transfer device 61 is used to transfer the silicon wafer to the dispensing device 62. The silicon wafer can be a double-sided un-dispensed silicon wafer (that is, transfer the silicon wafer from the feeding device 60 to the dispensing device 62) or a single-sided dispensed solar cell (that is, transfer the silicon wafer from the third conveyor line 624 to the dispensing position).

[0223] Optionally, a second transfer device is also provided on one side of the dispensing platform 621 to facilitate the normal flow of the solar cells in the process line. The main function of the second transfer device is to accurately transfer the solar cells after dispensing to the first conveyor line 622. Whether the silicon wafer is transferred from the first conveyor line 622 to the second conveyor line 623 or directly from the first conveyor line 622 to the fourth conveyor line 634 depends on the dispensing state of the solar cells (adhesive formed on one side or adhesive formed on both sides).

[0224] The cell production equipment also includes a ribbon processing device 63, which may include one or more ribbon reels and a precise control mechanism to ensure that the ribbon can be uniformly laid on the silicon wafer according to a preset route and density.

[0225] Specifically, the solder ribbon processing device 63 is used to lay solder ribbons on the battery cells, wherein the solder ribbons are attached to the surface of the dispensing position, that is, the height of the solder ribbons is higher than the height of the welding device 65. In this way, the solder ribbons become a protective structure that isolates the adhesive, preventing the adhesive from coming into contact with other components during the transport of the battery cells.

[0226] Optionally, the solder ribbon processing apparatus 63 can simultaneously apply solder ribbons to one or more groups of silicon wafers. That is, in the embodiments of this application, dispensing sites are first formed on the silicon wafers, and then solder ribbons are applied on the silicon wafers in combination with the arrangement of the dispensing sites.

[0227] The cell production equipment also includes a curing device 64, which cures the adhesive on which the solder ribbons are laid. On the one hand, it fixes the welding device 65 and strengthens the connection with the cell. On the other hand, it fixes the welding device 65 and improves the reliability of the connection between the solder ribbons and the adhesive.

[0228] Alternatively, the curing apparatus 64 may use heat curing, UV curing, or other curing technologies. Specific curing methods and parameters (such as temperature, time, light intensity, etc.) may be adjusted depending on the properties of the adhesive and solder ribbon used.

[0229] The cell manufacturing equipment also includes a welding device 65, which typically employs pressure welding, laser welding, ultrasonic welding, or other welding techniques. The welding parameters and conditions (such as welding temperature, welding time, and welding pressure) ensure a strong bond between the solder strip and the silicon wafer.

[0230] Therefore, in this embodiment, a solar cell manufacturing device is provided, which adjusts the method of fixing the solder ribbon to the silicon wafer. Specifically, the solder ribbon is fixed by first applying adhesive and then welding it. After the adhesive cures, the bonding force between the solder ribbon and the adhesive is stronger during the turnover of silicon wafers, and the solder ribbon is less likely to fall off. In addition, by applying adhesive to the solar cell first, the thickness and dosage of the adhesive can be better controlled, thereby better controlling the overall thickness of the solar cell.

[0231] This application also provides a solar cell. The solar cell is manufactured using the solar cell manufacturing method described above. For example, the solar cell can be a photovoltaic solar cell.

[0232] Specifically, the solar cell includes a silicon wafer, solder ribbon, adhesive, and a welded section, wherein the solder ribbon connected to the adhesive is at least partially exposed, and the welded section connects the solder ribbon and the silicon wafer.

[0233] In this embodiment, the silicon wafer is the main structure of the solar cell, providing support and foundation for the entire cell. Solder ribbons are typically used as conductive lines within the solar cell to transmit the current generated by the photovoltaic effect. Solder ribbons need to possess good conductivity, mechanical strength, and corrosion resistance. Common solder ribbon materials include metals or alloys such as copper, silver, and aluminum.

[0234] In this embodiment, an adhesive is first applied to the silicon wafer, and then the solder ribbon is bonded to the adhesive for curing. This exposes at least a portion of the solder ribbon connected to the adhesive. The adhesive is used to fix the solder ribbon to the solar cell, ensuring a tight fit and stable connection between the solder ribbon and the solar cell. The welding section connects the solder ribbon and the solar cell by welding, enhancing the electrical connection strength and stability between the solder ribbon and the solar cell.

[0235] The above embodiments mainly describe the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0236] While specific embodiments of this application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and are not intended to limit the scope of this application. Those skilled in the art should understand that modifications can be made to the above embodiments without departing from the scope and spirit of this application. The scope of this application is defined by the appended claims.

Claims

1. A method for producing solar cells, characterized in that, Includes the following steps: Silicon wafers are supplied; Adhesive is applied to the first and second surfaces of the silicon wafer to form adhesive sites; the first and second surfaces are disposed opposite to each other. Solder strips are laid on the silicon wafer, and the solder strips correspond to the adhesive dispensing positions. The adhesive application site is cured to pre-fix the solder strip; The pre-fixed solder strips and the silicon wafer are welded together to form a battery cell; Specifically, the dispensing of adhesive on the first and second surfaces of the silicon wafer includes: First, apply adhesive to one surface of the silicon wafer, then apply adhesive to the other surface of the silicon wafer; The step of first applying adhesive to the first surface of the silicon wafer and then applying adhesive to the second surface of the silicon wafer specifically includes: The silicon wafer is placed on a dispensing platform (621), wherein the second surface of the silicon wafer is in contact with the dispensing platform (621), and the long side of the silicon wafer extends along a first direction; Adhesive is applied to the first surface of the silicon wafer using a dispensing device; The silicon wafer with single-sided adhesive is transferred from the first conveyor line (622) to the second conveyor line (623), wherein the silicon wafer is transferred to the second conveyor line (623) and the long side of the silicon wafer extends along a second direction, the first direction and the second direction being perpendicular; The silicon wafer with single-sided adhesive is transferred from the second conveyor line (623) to the third conveyor line (624), wherein the silicon wafer is rotated 180° on the third conveyor line (624) so ​​that the first surface of the silicon wafer is in contact with the third conveyor line (624); The silicon wafer on the third conveyor line (624) is transferred to the dispensing platform (621), and the long side of the silicon wafer extends along the first direction; The same dispensing device is used to dispense adhesive onto the second surface of the silicon wafer.

2. The method for producing battery cells according to claim 1, characterized in that, The provision of silicon wafers specifically includes: A set of silicon wafers is provided, the set of silicon wafers including a first silicon wafer and a second silicon wafer, wherein a first surface of the first silicon wafer and a second surface of the second silicon wafer are on the same horizontal plane.

3. The method for producing battery cells according to claim 2, characterized in that, Specifically, the first surface of the first silicon wafer and the second surface of the second silicon wafer being on the same horizontal plane includes: One of the first silicon wafers and the second silicon wafer is flipped 180° so that the first surface of the first silicon wafer and the second surface of the second silicon wafer are on the same horizontal plane.

4. The method for producing battery cells according to claim 1, characterized in that, The first conveyor line (622), the second conveyor line (623) and the third conveyor line (624) are all equipped with adhesive-avoiding fixtures.

5. The method for producing battery cells according to claim 1, characterized in that, The dispensing of adhesive onto the first and / or second surfaces of the silicon wafer specifically includes: The dispensing positions are arranged in a rectangular array on the first and / or second surfaces of the silicon wafer, and adjacent dispensing positions are spaced apart.

6. The method for producing battery cells according to claim 1, characterized in that, The specific steps of laying solder strips on the silicon wafer include: Provides solder strips of preset length; Flux is applied to the solder strip; The silicon wafers that have been dispensed are transferred to the ribbon placement platform (632). Solder strips containing flux are applied to the surface having the dispensing position.

7. The method for producing battery cells according to claim 6, characterized in that, When both the first and second surfaces of the silicon wafer have dispensing sites, the process of placing solder ribbons containing flux on the surfaces having the dispensing sites specifically includes: First, the welding strip containing flux is laid on the welding strip laying platform (632). The silicon wafer is then placed on a solder strip placement platform (632) with solder strips laid out, the solder strips corresponding to the dispensing positions on one of the surfaces of the silicon wafer; Then cut the solder strip at the preset position; Finally, the cut solder ribbon is placed on the other surface of the silicon wafer, with the solder ribbon corresponding to the dispensing position on the other surface of the silicon wafer.

8. The method for producing battery cells according to claim 6, characterized in that, The process of transferring the silicon wafers after dispensing to the ribbon placement platform (632) specifically includes: The silicon wafer that has been glued is transferred from the glued platform (621) to the fourth conveyor line (634), and then transferred to the first preset position (A) through the fourth conveyor line (634). The silicon wafer located at the first preset position (A) is transferred to the ribbon laying platform (632).

9. The method for producing battery cells according to claim 5, characterized in that, After applying the solder ribbon containing flux to the surface having the dispensing area, the process further includes: The pressure mesh at the second preset position (B) is placed on the solder strip, and the silicon wafer with the pressure mesh is transferred to the curing platform (641).

10. The method for producing battery cells according to claim 9, characterized in that, The first preset position (A) and the second preset position (B) where the silicon wafer is located are spaced apart along the second direction.

11. The method for producing battery cells according to claim 9, characterized in that, After the curing treatment at the dispensing site to pre-fix the solder strip, the process further includes: Rotate the pressure mesh from the curing platform (641) to the second preset position (B).

12. The method for producing battery cells according to claim 1, characterized in that, The process of welding the pre-fixed solder strip and the silicon wafer to form a solar cell specifically includes: The silicon wafer is transferred from the curing platform (641) to the welding platform; The heating device located below the welding platform and the pressure head located above the welding platform work together to weld the pre-fixed solder strip and the silicon wafer.

13. A battery cell manufacturing equipment, characterized in that, The battery cell production equipment uses the battery cell production method as described in any one of claims 1-12 to produce battery cells.

14. The battery cell production equipment according to claim 13, characterized in that, The battery cell production equipment includes: A feeding device (60) for providing silicon wafers; A dispensing device (62) is used to dispense adhesive onto a first surface and / or a second surface of the silicon wafer; Specifically, the dispensing of adhesive on the first and second surfaces of the silicon wafer includes: First, apply adhesive to one surface of the silicon wafer, then apply adhesive to the other surface of the silicon wafer; The step of first applying adhesive to the first surface of the silicon wafer and then applying adhesive to the second surface of the silicon wafer specifically includes: The silicon wafer is placed on a dispensing platform (621), wherein the second surface of the silicon wafer is in contact with the dispensing platform (621), and the long side of the silicon wafer extends along a first direction; Apply adhesive to the first surface of the silicon wafer; The silicon wafer with single-sided adhesive is transferred from the first conveyor line (622) to the second conveyor line (623), wherein the silicon wafer is transferred to the second conveyor line (623) and the long side of the silicon wafer extends along a second direction, the first direction and the second direction being perpendicular; The silicon wafer with single-sided adhesive is transferred from the second conveyor line (623) to the third conveyor line (624), wherein the silicon wafer is rotated 180° on the third conveyor line (624) so ​​that the first surface of the silicon wafer is in contact with the third conveyor line (624); The silicon wafer on the third conveyor line (624) is transferred to the dispensing platform (621), and the long side of the silicon wafer extends along the first direction; Apply adhesive to the second surface of the silicon wafer; A solder ribbon processing device (63) is used to lay solder ribbons on the silicon wafer, the solder ribbons corresponding to the dispensing positions; Curing device (64), the curing device (64) is used to cure the dispensing site to pre-fix the solder ribbon; A welding device (65) is used to weld the pre-fixed solder strip and the silicon wafer to form a battery cell.

15. A battery cell, characterized in that, The battery cell is a battery cell prepared using the battery cell production method described in any one of claims 1-12.

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