Device-level optical integrated light source

Abstract

The invention relates to the technical field of semiconductor photoelectricity, and discloses a device-level optical integrated light source which comprises a support, a light-emitting chip, a lens and a light-transmitting glue layer. The light-emitting chip is arranged on the support, and the lens is arranged above the support and covers the light-emitting chip. The lens includes a lower optical interface and an upper optical interface. And the light-transmitting glue layer is filled between the bracket and the lens and at least covers the light-emitting surface of the light-emitting chip. And a reflecting surface which forms a certain included angle with the light-emitting surface of the light-emitting chip is arranged on the peripheral side surface of the lower optical interface. And the reflecting surface is an intersection interface of the lens and the light-transmitting glue layer or / and an intersection interface of the lens and air. The device-level optical integrated light source is high in light energy utilization rate, concentrated in light spot energy and good in edge light cut-off effect; compared with a conventional one-time packaging light source, the light energy utilization rate is improved by at least 50%. Meanwhile, the overall structure is simple and reasonable, the size is small, integrated design of a device-level optical integrated light source is easy, and manufacturing is easy.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor optoelectronic technology, and in particular, relates to a device-level optical integrated light source. Background Art

[0002] The existing light sources are mainly Lambertian light sources, that is, the natural distribution of light without any influence of optical design. Specifically, the energy distribution of light gradually weakens from the center to the periphery, and the irradiation range is large. The large-angle edge light around the light source cannot be used, resulting in light waste and low light energy utilization. Device-level light sources with elliptical or rectangular spots have appeared in the market. The spot effect can match the lens, but there is still light energy waste, and the edge cannot be completely cut off.

[0003] Based on the above, the problem to be solved at present is: to provide a device-level optical integrated light source with high light energy utilization, high light spot quality, smaller device size and easier integration. Summary of the invention

[0004] The purpose of the present invention is to provide a device-level optical integrated light source, aiming to solve the problems in the prior art that the device-level optical integrated light source wastes light energy, has poor light cutoff effect around the light spot, and has a need to improve the thinness of the device.

[0005] The present invention is implemented as follows: a device-level optical integrated light source, comprising:

[0006] Bracket;

[0007] A light-emitting chip, wherein the light-emitting chip is arranged on the bracket;

[0008] A lens, the lens is arranged above the bracket and covers the light-emitting chip; the lens comprises a lower optical interface for inputting light and an upper optical interface for outputting light;

[0009] A light-transmitting adhesive layer, which is filled between the bracket and the lens and covers at least the light-emitting surface of the light-emitting chip;

[0010] The sides around the lower optical interface are provided with reflective surfaces which form a certain angle with the light-emitting surface of the light-emitting chip; the reflective surface is the intersection interface between the lens and the light-transmitting adhesive layer or / and the intersection interface between the lens and the air; the refractive index of the light-transmitting adhesive layer is less than the refractive index of the lens.

[0011] Furthermore, the lens is provided with an integrally formed protrusion on a side away from the upper optical interface, the bottom surface of the protrusion is the lower optical interface, and the side surface of the protrusion is the reflective surface; the cross section of the protrusion gradually shrinks away from the upper optical interface.

[0012] Furthermore, the included angle θ between the reflection surface and the light emitting surface of the light emitting chip is in the range of 20°≤θ≤70°; and the reflection surface is set to be a plane or a curved surface.

[0013] Furthermore, a gold wire for electrical connection is provided, wherein the gold wire is entirely disposed in the light-transmitting adhesive layer or part of the gold wire is disposed in the light-transmitting adhesive layer and part of the gold wire is disposed in the lens; the lens with the gold wire disposed therein is provided with a clearance for accommodating the gold wire.

[0014] Furthermore, the bracket is configured as a flat bracket, and the gap between the bracket and the lens is completely filled with the light-transmitting adhesive layer, and the light-transmitting adhesive layer covers the light-emitting surface and side surfaces of the light-emitting chip.

[0015] Furthermore, the bracket is configured as a bowl-shaped bracket with a cavity structure, and the gap between the bracket and the lens is completely or partially filled with the light-transmitting adhesive layer.

[0016] Furthermore, the light emitting surface of the light-transmitting adhesive layer is closely attached to the lower optical interface or there is a cavity between the light emitting surface of the light-transmitting adhesive layer and the lower optical interface.

[0017] Furthermore, the upper optical interface (32) is a convex surface.

[0018] Furthermore, the height from the light emitting surface of the light emitting chip to the lower optical interface is less than or equal to 0.3 mm.

[0019] Furthermore, the top view profile of the lower optical interface is circular or rectangular; the area of ​​the circle or rectangle is S, the area of ​​the light-emitting surface of the light-emitting chip is W, and W satisfies <S<3W。

[0020] Compared with the prior art, the device-level optical integrated light source provided by the present invention has the following beneficial effects:

[0021] The present invention provides a reflective surface at a certain angle to the light-emitting surface of the light-emitting chip on the lower optical interface of the lens. The reflective surface is used to reflect the large-angle light incident on the lower optical interface in the direction close to the optical axis, so that the large-angle light that is not used at the edge is deflected toward the center, thereby improving the utilization rate of light energy, concentrating the energy of the light spot, and having a good effect of cutting off the edge light.

[0022] The reflective surface and the lens are an integrated structure, and the reflective surface is the intersection interface between the lens and the light-transmitting adhesive layer or / and the intersection interface between the lens and the air. The structure is simple, easy to manufacture, and has a good reflection effect.

[0023] The light-transmitting adhesive layer is filled between the bracket and the lens. The light-transmitting adhesive layer at least covers the light-emitting surface of the light-emitting chip. The light-transmitting adhesive layer is set to fully cover or partially cover the reflective surface. The light-transmitting adhesive layer structure is set: 1. It can improve the light extraction rate; 2. It can change the light color; 3. The structure is reasonable and easy to make.

[0024] Compared with conventional one-time packaged light sources, the light energy utilization rate of the present invention is increased by at least 50%. At the same time, the overall structure is simple and reasonable, the volume is small, and the integrated design of the device-level optical integrated light source is easy, and it is easy to manufacture. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a schematic cross-sectional structure diagram of a device-level optical integrated light source according to Example 1 provided by the present invention;

[0026] Figure 2 is a schematic diagram of the cross-sectional structure of the lens provided by the present invention;

[0027] Figure 3 is a schematic cross-sectional structure diagram of a device-level optical integrated light source according to Embodiment 2 provided by the present invention;

[0028] Figure 4 is another cross-sectional structural schematic diagram of a device-level optical integrated light source according to Embodiment 2 provided by the present invention;

[0029] Figure 5 is a schematic cross-sectional structure diagram of a device-level optical integrated light source according to Embodiment 3 provided by the present invention;

[0030] Figure 6 is a schematic cross-sectional structure diagram of a device-level optical integrated light source according to Embodiment 4 provided by the present invention;

[0031] Figure 7 is a schematic cross-sectional structure diagram of a device-level optical integrated light source according to Embodiment 5 provided by the present invention;

[0032] Figure 8 is a schematic cross-sectional structure diagram of a device-level optical integrated light source according to Example 6 provided by the present invention;

[0033] Fig. 9 is a schematic cross-sectional structure diagram of a device-level optical integrated light source according to Example 7 provided by the present invention;

[0034] In the figure: 1- bracket; 2- light-emitting chip; 3- lens; 31- lower optical interface; 311- reflecting surface; 32- upper optical interface; 33- avoidance position; 4- light-transmitting adhesive layer; 41- inclined surface; 5- gold wire. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0036] The implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0037] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0038] Reference Figure 1-9 The figure shows a preferred embodiment of the present invention.

[0039] The device-level optical integrated light source comprises: a bracket 1, a light-emitting chip 2, a lens 3 and a light-transmitting adhesive layer 4. The light-emitting chip 2 is arranged on the bracket 1. Figure 1-2 , the lens 3 is arranged above the bracket 1 and covers the light emitting chip 2. The lens 3 includes a lower optical interface 31 for inputting light and an upper optical interface 32 for outputting light. The light-transmitting adhesive layer 4 is filled between the bracket 1 and the lens 3. The light-transmitting adhesive layer 4 at least covers the light-emitting surface of the light-emitting chip 2. The light emitted by the light-emitting chip 2 is incident on the lower optical interface 31 after passing through the light-transmitting adhesive layer 4, and the incident light is refracted by the lens 3 and then emitted from the upper optical interface 32. The functions of the light-transmitting adhesive layer 4: 1. It can improve the light extraction rate; 2. It can change the color of the emitted light. For example, the light-transmitting adhesive layer 4 is set to be a light-transmitting adhesive layer containing at least fluorescent powder, which can excite blue light into white light.

[0040] The sides of the lower optical interface 31 are provided with a reflective surface 311 which is at a certain angle to the light-emitting surface of the light-emitting chip 2. The reflective surface 311 and the lens 3 are an integrally formed structure. The reflective surface 311 is used to reflect the large-angle light incident on the lower optical interface 31 in the direction close to the optical axis, so that the large-angle light that is not used at the edge is deflected toward the center, thereby improving the utilization rate of light energy and concentrating the energy of the light spot. The reflective surface 311 is the intersection interface of the lens 3 and the light-transmitting adhesive layer 4; or the intersection interface of the lens 3 and the air; or the combination of the intersection interface of the lens 3 and the light-transmitting adhesive layer 4 and the intersection interface with the air. The refractive index of the light-transmitting adhesive layer 4 is less than the refractive index of the lens 3.

[0041] Working principle of the reflective surface 311: The light-transmitting adhesive layer 4 is partially or completely filled between the bracket 1 and the lens 3, so that the reflective surface 311 can be set to three structures: 1. The reflective surface 311 is completely covered by the light-transmitting adhesive layer 4, that is, the reflective surface 311 is the interface between the lens 3 and the light-transmitting adhesive layer 4. 2. The reflective surface 311 is partially covered by the light-transmitting adhesive layer 4 and partially covered by air, that is, the reflective surface 311 is partially the interface between the lens 3 and the light-transmitting adhesive layer 4 and partially the interface between the lens 3 and the air. 3. The reflective surface 311 is not covered by the light-transmitting adhesive layer 4 and is exposed to the air, that is, the reflective surface 311 is the interface between the lens 3 and the air. When the refractive index of the transparent adhesive layer 4 is less than the refractive index of the lens 3, the light propagates from the lens 3 to the transparent adhesive layer 4 or the air, and the light propagates from the light-dense medium to the light-combing medium. Since the reflection surface 311 and the light-emitting surface of the light-emitting chip 2 form a certain angle, the incident angle of the large-angle light around the reflection surface 311 is large, and the incident angle is greater than or equal to the critical angle, and the emission is totally reflected. The edge light is deflected toward the middle, so that the energy in the middle is concentrated, the light energy utilization rate is improved, and the cutoff effect around the light spot is good.

[0042] Furthermore, the lens 3 is provided with an integrally formed protrusion on a side close to the light emitting chip 2. Figure 2 The bottom surface of the protrusion close to the light emitting chip 2 is the lower optical interface 31, and the side surface of the protrusion is the reflective surface 311. The cross-sectional area of ​​the protrusion gradually increases from the lower optical interface 31 to the upper optical interface 32.

[0043] The angle θ between the reflective surface 311 and the light-emitting surface of the light-emitting chip 2 is preferably in the range of 20°≤θ≤70°, with a good total reflection effect, and the reflective surface 311 is set to a flat surface or a curved surface. The height from the light-emitting surface of the light-emitting chip 2 to the lower optical interface 31 is preferably less than or equal to 0.3 mm, thereby realizing the miniaturization of the device-level optical integrated light source and making it easier to integrate the design.

[0044] The light-emitting surface of the light-transmitting adhesive layer 4 is closely attached to the lower optical interface 31 or there is a cavity between the light-emitting surface of the light-transmitting adhesive layer 4 and the lower optical interface 31. The upper optical interface 32 is preferably a convex surface.

[0045] The top view outline of the lower optical interface 31 is circular or rectangular. The optical axis of the light emitting chip 2 overlaps or is parallel to the optical axes of the upper optical interface 32 and the lower optical interface 31. The area of ​​the circle or rectangle is S, and the area of ​​the light emitting surface of the light emitting chip 2 is W, satisfying W <S<3W。

[0046] In a further optimized solution, a gold wire 5 for electrical connection is further provided. There are two ways to arrange the gold wire 5: 1. The gold wire 5 is completely covered by the light-transmitting adhesive layer 4; 2. The two ends of the gold wire 5 are arranged in the light-transmitting adhesive layer 4, and the middle of the gold wire 5 is arranged in the lens 3. In this case, a clearance 33 for accommodating the gold wire 5 is provided inside the lens 3. The clearance 33 can be set as a channel through which the gold wire 5 passes or a groove in which the lower optical interface 31 is recessed toward the inside of the lens 3.

[0047] Specific embodiment 1: reference Figure 1-2 , the bracket 1 is set as a flat bracket. The light-emitting chip 2 is fixed on the bracket 1. The light-transmitting adhesive layer 4 is completely filled between the bracket 1 and the lens 3. The light-transmitting adhesive layer 4 covers the light-emitting surface and side surfaces of the light-emitting chip 2. The light-emitting surface of the light-transmitting adhesive layer 4 is tightly fitted with the lower optical interface 31. The reflecting surface 311 is completely covered by the light-transmitting adhesive layer 4, that is, the reflecting surface 311 is the interface between the lens 3 and the light-transmitting adhesive layer 4. The gold wires 5 are all arranged in the light-transmitting adhesive layer 4. The light-transmitting adhesive layer 4 plays both an optical role and a role in supporting the lens 3. The overall structure is stable, tightly combined and easy to manufacture.

[0048] Specific embodiment 2: Reference Figure 3-4 , the bracket 1 is set as a flat bracket. The light-emitting chip 2 is fixed on the bracket 1. The light-transmitting adhesive layer 4 is completely filled between the bracket 1 and the lens 3. The light-transmitting adhesive layer 4 covers the light-emitting surface and side surfaces of the light-emitting chip 2. The light-emitting surface of the light-transmitting adhesive layer 4 is tightly fitted with the lower optical interface 31. The reflecting surface 311 is completely covered by the light-transmitting adhesive layer 4, that is, the reflecting surface 311 is the interface between the lens 3 and the light-transmitting adhesive layer 4. The two ends of the gold wire 5 are arranged in the light-transmitting adhesive layer 4, and the middle part of the gold wire 5 is arranged in the avoidance position 33 of the lens 3.

[0049] Specific embodiment 3: Reference Figure 5 , the bracket 1 is set as a bowl-shaped bracket with a cavity structure. The light-emitting chip 2 is fixed in the cavity structure. The light-transmitting adhesive layer 4 is completely filled between the bracket 1 and the lens 3, and the light-transmitting adhesive layer 4 covers the light-emitting surface and side surfaces of the light-emitting chip 2. The light-emitting surface of the light-transmitting adhesive layer 4 is tightly fitted with the lower optical interface 31. The reflective surface 311 is completely covered by the light-transmitting adhesive layer 4, that is, the reflective surface 311 is the interface between the lens 3 and the light-transmitting adhesive layer 4. The four sides of the lens 3 close to the light-transmitting adhesive layer 4 are directly connected to the bracket 1, and the bracket 1 plays a role of directly supporting the lens 3. The overall structure is stable, tightly combined and easy to manufacture.

[0050] Specific examples 4-7: Reference Figure 6-9 The support 1 is a bowl-shaped support with a cavity structure. The light-emitting chip 2 is fixed in the cavity structure. A light-transmitting adhesive layer 4 is partially filled between the support 1 and the lens 3. According to different forms of partial filling, embodiments 4-7 are listed as follows.

[0051] Embodiment 4-5: The light-transmitting adhesive layer 4 covers the light-emitting surface and side surfaces of the light-emitting chip 2. The light-emitting surface of the light-transmitting adhesive layer 4 is tightly fitted with the lower optical interface 31. The portion of the reflective surface 311 close to the light-emitting chip 2 is completely covered by the light-transmitting adhesive layer 4, and the portion away from the light-emitting chip 2 is exposed to the air, that is, a portion of the reflective surface 311 is the interface between the lens 3 and the light-transmitting adhesive layer 4, and the other portion is the interface between the lens 3 and the air. The light-transmitting adhesive layer 4 of embodiment 4 is configured to cover the entire bottom of the cavity structure of the bracket 1 and part of the surrounding side walls (refer to Figure 6 ); and the light-transmitting adhesive layer 4 of Example 5 is arranged to cover part of the bottom of the cavity structure of the bracket 1 (refer to Figure 7 )

[0052] In embodiments 6-7, the light-transmitting adhesive layer 4 is disposed between the light-emitting chip 2 and the lower optical interface 31, and the light-transmitting adhesive layer 4 covers the light-emitting surface of the light-emitting chip 2 or covers the light-emitting surface and part of the side surface of the light-emitting chip 2. The reflective surface 311 is exposed to the air, that is, the reflective surface 311 is the interface between the lens 3 and the air. The side surface of the light-transmitting adhesive layer 4 is disposed as an inclined surface 41 which is at a certain angle to the light-emitting surface of the light-emitting chip 2, and the inclined surface 41 is used to reflect the edge high-angle incident light of the light-emitting chip 2, and use the edge high-angle incident light to be deflected toward the direction close to the optical axis. The cross-sectional area of ​​the inclined surface 41 gradually increases in the direction away from the light-emitting chip 2. The inclined surface 41 is disposed as a plane or a curved surface, and the angle between the inclined surface 41 and the light-emitting surface of the light-emitting chip 2 can be disposed to be the same as or similar to the angle between the reflective surface 311 and the light-emitting surface of the light-emitting chip 2.

[0053] Among them, refer to Figure 8 The light-emitting surface of the light-transmitting adhesive layer 4 of Example 6 is closely attached to the lower optical interface 31. The inclined surface 41 of the light-transmitting adhesive layer 4 is connected to the reflective surface 311, which together play the role of reflecting the incident light at a large angle from the edge, further improving the light energy utilization rate. The light-transmitting adhesive layer 4 covers the light-emitting surface and part of the side surface of the light-emitting chip 2.

[0054] Reference Fig. 9 The light-emitting surface of the light-transmitting adhesive layer 4 of Example 7 is spaced from the lower optical interface 31, that is, there is a cavity between the two. The area of ​​the lower optical interface 31 is larger than the area of ​​the light-emitting surface of the light-transmitting adhesive layer 4, so as to ensure that all the light emitted from the light-transmitting adhesive layer 4 enters the lens 3 through the lower optical interface 31, and fully utilizes the light energy. The light-transmitting adhesive layer 4 covers the light-emitting surface of the light-emitting chip 2.

[0055] The present invention is not limited thereto; any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A device-level optical integrated light source, characterized in that: include: Bracket (1); A light-emitting chip (2), wherein the light-emitting chip (2) is arranged on the bracket (1); A lens (3), the lens (3) being arranged above the support (1) and covering the light-emitting chip (2); the lens (3) comprising a lower optical interface (31) for inputting light and an upper optical interface (32) for outputting light; A light-transmitting adhesive layer (4), the light-transmitting adhesive layer (4) being filled between the bracket (1) and the lens (3), the light-transmitting adhesive layer (4) at least covering the light-emitting surface of the light-emitting chip (2); The lower optical interface (31) is provided with a reflective surface (311) on all sides thereof, which forms a certain angle with the light-emitting surface of the light-emitting chip (2); the reflective surface (311) is the intersection interface between the lens (3) and the light-transmitting adhesive layer (4) or / and the intersection interface between the lens (3) and air; the refractive index of the light-transmitting adhesive layer (4) is less than the refractive index of the lens (3).

2. The device-level optical integrated light source according to claim 1, characterized in that: The lens (3) is provided with an integrally formed protrusion on a side facing away from the upper optical interface (32); the bottom surface of the protrusion is the lower optical interface (31), and the side surface of the protrusion is the reflective surface (311); the cross section of the protrusion gradually shrinks away from the upper optical interface (32).

3. The device-level optical integrated light source according to any one of claims 1 to 2, characterized in that: The included angle θ between the reflection surface (311) and the light-emitting surface of the light-emitting chip (2) is in the range of 20°≤θ≤70°; the reflection surface (311) is set as a plane or a curved surface.

4. The device-level optical integrated light source according to claim 1, characterized in that: A gold wire (5) for electrical connection is also provided, wherein the gold wire (5) is entirely disposed in the light-transmitting adhesive layer (4) or part of the gold wire (5) is disposed in the light-transmitting adhesive layer (4) and part of the gold wire (5) is disposed in the lens (3); the lens (3) having the gold wire (5) disposed therein is provided with a clearance position (33) for accommodating the gold wire (5).

5. The device-level optical integrated light source according to claim 1, characterized in that: The support (1) is configured as a flat support, the gap between the support (1) and the lens (3) is completely filled with the light-transmitting adhesive layer (4), and the light-transmitting adhesive layer (4) covers the light-emitting surface and side surfaces of the light-emitting chip (2).

6. The device-level optical integrated light source according to claim 1, characterized in that: The support (1) is configured as a bowl-shaped support with a cavity structure, and the gap between the support (1) and the lens (3) is completely or partially filled with the light-transmitting adhesive layer (4).

7. The device-level optical integrated light source according to claim 6, characterized in that: The light-emitting surface of the light-transmitting adhesive layer (4) is tightly fitted to the lower optical interface (31), or a cavity is provided between the light-emitting surface of the light-transmitting adhesive layer (4) and the lower optical interface (31).

8. The device-level optical integrated light source according to claim 1, characterized in that: The upper optical interface (32) is a convex surface.

9. The device-level optical integrated light source according to claim 1, characterized in that: The height from the light-emitting surface of the light-emitting chip (2) to the lower optical interface (31) is less than or equal to 0.3 mm.

10. The device-level optical integrated light source according to claim 1, characterized in that: The top view profile of the lower optical interface (31) is circular or rectangular; the area of ​​the circle or rectangle is S, the area of ​​the light-emitting surface of the light-emitting chip (2) is W, and W satisfies <S<3W。

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