Display module and manufacturing method thereof

Abstract

The invention discloses a display module and a manufacturing method of a module lamp panel thereof, and the manufacturing method of the module lamp panel comprises the following steps: a module mainboard is provided, a plurality of installation groove bodies are concavely formed in the surface of one side of the module mainboard, and a bonding pad is arranged on the bottom wall of each installation groove body; and a plurality of lamp beads are provided, the lamp beads and the mounting groove bodies are arranged in a one-to-one correspondence mode, each lamp bead is arranged in the corresponding mounting groove body and connected with the corresponding bonding pad in a welded mode, and therefore the module lamp panel is obtained. According to the technical scheme, the structural design of the embedded bonding pad can be formed on the module lamp panel, and it is guaranteed that the lamp beads are not prone to falling off in the carrying or installing process.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a manufacturing method thereof. Background Art

[0002] With the upgrade of Micro-LED display products, the spacing and pad size are getting smaller and smaller, which puts higher requirements on PCBA patch assembly. In traditional processes, the PCB of the display module mainly adopts the following structural design: the pads that need to be bonded to the components are exposed on the surface of the module motherboard (TOP layer or BOT layer). In this way, since the display module product is illuminated by the bonded lamp beads to achieve the display purpose, and the lamp beads are exposed on the surface of the module motherboard through surface mounting, and there is no other structural parts to protect them, the lamp beads are prone to fall off during transportation or installation, affecting the normal use of the display module. Summary of the invention

[0003] The embodiments of the present application provide a display module and a method for manufacturing the same, aiming to improve the technical problem that lamp beads of existing display modules are prone to falling off during transportation or installation, thus affecting the normal use of the display module.

[0004] To this end, an embodiment of the present application provides a method for manufacturing a module light board, comprising the following steps:

[0005] A module mainboard is provided, wherein a plurality of mounting grooves are concavely arranged on a surface of one side of the module mainboard, and a solder pad is arranged on the bottom wall of each mounting groove;

[0006] A plurality of lamp beads are provided, and the plurality of lamp beads are arranged correspondingly to the plurality of mounting slots. Each lamp bead is placed in a corresponding mounting slot and connected to the corresponding soldering pad by welding to obtain a module lamp panel.

[0007] Optionally, in some embodiments of the present application, the method for manufacturing the module mainboard includes the following steps:

[0008] Providing an inner core board, and performing a first preset surface treatment on the inner core board to form a plurality of welding pads on a first side surface of the inner core board;

[0009] A first insulating dielectric plate is provided, and a preset opening process is performed on the first insulating dielectric plate to form a plurality of first pad avoidance holes on the first insulating dielectric plate, wherein the plurality of first pad avoidance holes are arranged in a one-to-one correspondence with the plurality of pads;

[0010] Providing a first surface core board, a second insulating medium board and a second surface core board, and sequentially pressing the first surface core board, the first insulating medium board, the inner core board, the second insulating medium board and the second surface core board together so that each of the pads is located in the corresponding pad avoidance hole, so as to obtain a prototype of a module mainboard;

[0011] The module mainboard prototype is subjected to a second preset surface treatment to obtain the module mainboard.

[0012] Optionally, in some embodiments of the present application, the step of performing a first preset surface treatment on the inner core board to form a plurality of pads on the first side surface of the inner core board includes:

[0013] Performing a plating-resist dry film treatment on the first side surface of the inner core board, so that a plurality of pad areas are formed on the first side surface of the inner core board;

[0014] Performing a selective silver immersion treatment on the first side surface of the inner core board, so that a silver layer having a first preset thickness is deposited on the surface of each of the pad regions;

[0015] The first side surface of the inner core board is selectively tinned and stripped in sequence, so that the surface of each silver layer is electroplated to form a tin layer with a second preset thickness, and thus each pad area forms a corresponding pad.

[0016] Optionally, in some embodiments of the present application, the step of applying a resist dry film to the first side surface of the inner core board so as to form a plurality of pad areas on the first side surface of the inner core board includes:

[0017] After the front side of the anti-plating dry film is attached to the first surface of the inner core board by heat pressing, the anti-plating dry film is sequentially exposed and developed to form a plurality of pad areas on the first side surface of the inner core board.

[0018] Optionally, in some embodiments of the present application, the first preset thickness is 0.3um to 0.5um; and / or,

[0019] The second preset thickness is 35um-40um.

[0020] Optionally, in some embodiments of the present application, after the first preset surface treatment is performed on the inner core plate, and before the first surface core plate, the first insulating medium plate, the inner core plate and the second surface core plate are pressed together in sequence, the following steps are further included:

[0021] Performing a preset circuit pattern photolithography process on the first surface of the inner core board to photolithographically form a built-in signal connection circuit on the first surface of the inner core board;

[0022] The first surface of the inner core board is treated with an anti-etching ink to form an anti-etching ink coating with a third preset thickness on the surface of each of the pads.

[0023] Optionally, in some embodiments of the present application, the third preset thickness is 0.1 mm to 0.2 mm smaller than the thickness of the first insulating medium plate.

[0024] Optionally, in some embodiments of the present application, the step of performing a second preset surface treatment on the module mainboard prototype to obtain the module mainboard includes:

[0025] The module mainboard prototype is subjected to the second preset surface treatment including at least outer layer circuit lithography treatment, so that the first surface core board forms at least a plurality of second solder pad avoidance holes to obtain the module mainboard, and the plurality of second solder pad avoidance holes are arranged one-to-one with the plurality of the solder pads.

[0026] Optionally, in some embodiments of the present application, the step of placing each lamp bead in the corresponding mounting slot and welding it to the corresponding soldering pad to obtain a module lamp board includes:

[0027] After each of the lamp beads is placed in the corresponding installation slot, the pins of each of the lamp beads are welded and connected to the corresponding pads by reflow soldering to obtain a module lamp board.

[0028] In addition, an embodiment of the present application further provides a display module, including a module light board, and the module light board is manufactured by the above-mentioned manufacturing method.

[0029] The technical solution provided by the present application, through the method steps of the manufacturing method of the above-mentioned module light board, can make the module light board for the display module finally obtained form a structural design of an embedded solder pad, that is, a side surface of the module main board is concavely provided with a plurality of mounting grooves, and each solder pad is correspondingly arranged on the bottom wall of a mounting groove, so that when the lamp beads of the module light board are welded and connected with the corresponding solder pads, they can be at least partially placed in the corresponding mounting grooves, so as to form a certain surrounding protection for them through the corresponding mounting grooves, to ensure that they will not easily fall off during the transportation or installation of the display module. It can be seen that the present technical solution can effectively improve the technical problem that the lamp beads of the existing display modules are prone to fall off during the transportation or installation process, which affects the normal use of the display modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0031] Figure 1 It is a flowchart of the method for manufacturing the module light board in the embodiment of the present application;

[0032] Figure 2 This is a schematic diagram of the structure of the module light board in the embodiment of the present application;

[0033] Figure 3 This is a flowchart of a method for manufacturing a module motherboard in an embodiment of the present application;

[0034] Figure 4 This is a cross-sectional view of each layer structure before the module mainboard is pressed together in the embodiment of the present application;

[0035] Figure 5 This is a cross-sectional view of each layer structure after the module mainboard is pressed together in the embodiment of the present application;

[0036] Figure 6 This is a cross-sectional view of the module mainboard in the embodiment of the present application;

[0037] Figure 7 for Figure 3 The flowchart of step S210 of the method for manufacturing the module motherboard is shown. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0039] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0040] In addition, the descriptions of "first", "second", etc. in this application are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0041] like Figure 1 As shown, in one embodiment, the present application provides a method for manufacturing a module light board, and the manufacturing method specifically includes the following steps:

[0042] Step S110: providing a module mainboard, wherein a plurality of mounting grooves are concavely formed on a surface of one side of the module mainboard, and a solder pad is disposed on the bottom wall of each mounting groove.

[0043] It is understandable that if Figure 2 As shown, the manufacturing method of the embodiment of the present application can be specifically applied to the manufacture of the module light board 100 of the display module. Different from the prior art that generally sets the soldering pads for realizing the electrical connection of the lamp beads on the side surface of the module mainboard, the module mainboard 110 used in the steps of the present method has the following structural composition: a plurality of mounting grooves 11 are recessed on the side surface of the module mainboard 110, and a soldering pad 12 is provided on the bottom wall of each mounting groove 11. With such a design, each soldering pad 12 can be built into the module mainboard 110 instead of being set on the surface of the module mainboard 110. Generally speaking, a plurality of mounting grooves 11 are arranged and distributed in a certain regular pattern (including but not limited to matrix distribution) on the side surface of the module mainboard 110.

[0044] In addition, the other side surface of the module mainboard 110 is generally provided with a plurality of driver ICs 130 (the configuration method can adopt conventional component patch configuration, which will not be described here) to ensure the normal display function driving of the module mainboard 110.

[0045] Step S120: providing a plurality of lamp beads, wherein the plurality of lamp beads are arranged in a one-to-one correspondence with the plurality of mounting slots, placing each lamp bead in a corresponding mounting slot, and welding and connecting the lamp bead to a corresponding soldering pad to obtain a module lamp panel.

[0046] It is understandable that if Figure 2As shown, when the module main board 110 is obtained through the above method steps, a plurality of lamp beads 120 can be further provided. The plurality of lamp beads 120 are arranged one by one corresponding to the plurality of mounting slots 11, so that each lamp bead 120 is placed in the corresponding mounting slot 11 and is welded and connected to the corresponding soldering pad 12, so that the plurality of lamp beads 120 are arranged on the module main board 110 in a certain regular pattern to obtain the corresponding module lamp board 100.

[0047] In this way, through the above method steps, the module light board 100 for the display module can be finally manufactured to form a structural design of an embedded solder pad, that is, a plurality of mounting grooves 11 are recessed on the surface of one side of the module main board 110, and each solder pad 12 is correspondingly arranged on the bottom wall of a mounting groove 11. In this way, when the lamp beads 120 of the module light board 100 are welded and connected to the corresponding solder pads 12, they can be at least partially placed in the corresponding mounting grooves 11, so as to form a certain surrounding protection for them through the corresponding mounting grooves 11, to ensure that they will not easily fall off during the transportation or installation of the display module.

[0048] In some examples, such as Figure 3 As shown, in order to better manufacture the module mainboard mentioned in the above method steps, the following method steps can be specifically used to manufacture the module mainboard, including:

[0049] Step S210: providing an inner core board, and performing a first preset surface treatment on the inner core board to form a plurality of welding pads on a first side surface of the inner core board.

[0050] It is understandable that the module mainboard 110 of the embodiment of the present application generally adopts a multi-layer structure, and the specific number of layers can be increased or decreased according to the actual circuit requirements. In order to form its multi-layer structure, the module mainboard 110 is generally formed by laminating multiple core boards. Generally speaking, Figures 4 to 6 As shown, the module main board 110 with a multi-layer structure should be formed by at least one inner core board 111 and two surface core boards (i.e., the first surface core board 112 and the second surface core board 113) pressed together, and in order to achieve the insulation setting between the inner core board 111 and the two surface core boards, an insulating dielectric board (i.e., the first insulating dielectric board 114 and the second insulating dielectric board 115) should be set between the two side surfaces of the inner core board 111 and the corresponding surface core boards. Figure 4 As shown, an inner core board 111 should be provided first, and a first preset surface treatment is performed on the inner core board 111 to form a plurality of welding pads 12 on a first side surface of the inner core board 111 .

[0051] Generally speaking, the inner core board 111 mentioned in the steps of the method is mainly arranged in a three-layer structure, that is, it includes an insulating medium layer located in the middle and two conductive layers located on the upper and lower sides, wherein the insulating medium layer is generally a PP material layer and the conductive layer is generally a copper layer. Therefore, the pad 12 of the steps of the method is mainly formed on the surface of one of the conductive layers (i.e., the copper layer).

[0052] Step S220: providing a first insulating dielectric plate, performing a preset opening process on the first insulating dielectric plate to form a plurality of first pad avoidance holes on the first insulating dielectric plate, wherein the plurality of first pad avoidance holes are arranged in a one-to-one correspondence with the plurality of pads.

[0053] It is understandable that if Figures 4 to 6 As shown, based on the above description, it can be known that in order to ensure the insulation setting between the first side surface of the inner core plate 111 and the surface core plate, an insulating dielectric plate (generally a PP material plate) needs to be set between the first side surface of the inner core plate 111 and the corresponding surface core plate, that is, a first insulating dielectric plate 114 is provided. At the same time, in order to ensure that the first insulating dielectric plate 114 will not press the pads 12 on the first side surface of the inner core plate 111 during pressing, the first insulating dielectric plate 114 will be pre-opened, that is, on the first insulating dielectric plate 114, the position corresponding to each pad 12 on the inner core plate 111 is opened to form a plurality of first pad avoidance holes 13 on the first insulating dielectric plate 114, and the plurality of first pad avoidance holes 13 are set one-to-one with the plurality of pads 12.

[0054] Step S230: Provide a first surface core board, a second insulating dielectric board and a second surface core board, and press the first surface core board, the first insulating dielectric board, the inner core board, the second insulating dielectric board and the second surface core board together in sequence so that each solder pad is located in the corresponding solder pad avoidance hole to obtain a prototype of a module motherboard.

[0055] It is understandable that if Figures 4 to 6 As shown, after the above method steps are used to form a plurality of solder pads 12 on the first side surface of the inner core plate 111 and a plurality of first solder pad avoidance holes 13 on the first insulating dielectric plate 114, a first surface core plate 112, a second insulating dielectric plate 115 and a second surface core plate 113 can be further provided, and the first surface core plate 112, the first insulating dielectric plate 114, the inner core plate 111, the second insulating dielectric plate 115 and the second surface core plate 114 are pressed together in sequence so that each solder pad 12 is located in the corresponding solder pad avoidance hole 13, so as to obtain a prototype of a module mainboard (i.e. Figure 5 status shown).

[0056] Generally speaking, the first surface core board 112 and the second surface core board 113 mentioned in the steps of the method are mainly conductive material boards, such as copper foil. The second insulating medium board 115 mentioned in the steps of the method is mainly a PP material board. The inner core board 111 includes a first surface and a second surface arranged opposite to each other in the thickness direction, the first surface core board 112 and the first insulating medium board 114 are pressed on the first surface of the inner core board 111 in sequence, and the second surface core board 114 and the second insulating medium board 115 are pressed on the second surface of the inner core board 111 in sequence.

[0057] Step S240: performing a second preset surface treatment on the module mainboard prototype to obtain the module mainboard.

[0058] It is understandable that if Figures 4 to 6 As shown, after the prototype of the module mainboard is obtained through the above method steps, the prototype of the module mainboard can be further subjected to a second preset surface treatment, including but not limited to making each layer of the circuit of the prototype of the module mainboard conductive, photoetching its external circuit, and making the corresponding position on the first surface core board 112 avoid to expose each installation slot 11 and the pad 12, etc., to obtain the module mainboard (i.e. Figure 6 status shown in ).

[0059] In this way, through the above method steps, the module mainboard 110 mentioned in the above method steps can be well manufactured.

[0060] In some examples, such as Figure 7 As shown, the specific process of executing step S210 of the above method is as follows:

[0061] Step S211: performing a plating-resist dry film treatment on the first side surface of the inner core board, so that a plurality of pad areas are formed on the first side surface of the inner core board.

[0062] Step S212: selectively silvering the first side surface of the inner core board so that a silver layer having a first preset thickness is deposited on the surface of each pad region.

[0063] Step S213: selectively tinning and stripping the first side surface of the inner core board in sequence, so that the surface of each silver layer is electroplated to form a tin layer with a second preset thickness, thereby forming a corresponding pad in each pad area.

[0064] It is understandable that in order to achieve the welding connection between the pins of the lamp beads and the pads, the prior art will use a steel screen printing method to print solder paste on each pad before the welding operation. However, the pads in the embodiment of the present application adopt an embedded structure design, that is, there is a certain height difference between the location of the pads and the surface of the module mainboard 110, which makes it impossible to use a steel screen printing method to print solder paste on the pads. Therefore, when making the pads on the inner core board, the method steps will first perform a plating-resistant dry film treatment to form a plurality of pad areas on the first side surface of the inner core board, and then perform a selective silver deposition treatment to deposit a silver layer 121 having a first preset thickness on the surface of each pad area. Finally, selective tin plating and film stripping treatment are performed in sequence (i.e., the remaining part of the plating-resistant dry film is stripped off with a film stripping liquid) to electroplate the surface of each silver layer 121 to form a tin layer 122 having a second preset thickness, thereby forming a corresponding pad 12 for each pad area, that is, each pad 12 is composed of a pad area (not shown in the figure), a silver layer 121 and a tin layer 122.

[0065] In this way, through the above method steps, it is possible to complete the operation of setting the tin layer on each soldering pad while completing the production of the soldering pad on the inner core board, so as to effectively solve the problem of not being able to use steel screen printing to print solder paste on the soldering pad during the later stage of lamp bead welding.

[0066] In some examples, the specific process of performing the above method step S211 is as follows: after the front side of the anti-plating dry film is attached to the first surface of the inner core board by hot pressing, the anti-plating dry film is sequentially exposed and developed to form a plurality of pad areas on the first side surface of the inner core board. In this way, through the above method steps, the pad area that needs to be silver-plated / tin-plated can be well exposed on the first side surface of the inner core board.

[0067] It can be understood that the hot pressing method in this example can be specifically to use a hot pressing roller to roll the anti-plating dry film so that the front side of the anti-plating dry film is well attached to the first surface of the inner core board 111. The exposure process in this example refers to exposure using an exposure machine to transfer the image that needs to be silver-plated / tin-plated to the anti-plating dry film. The development process in this example refers to immersing the entire inner core board 111 connected to the anti-plating dry film in a developer after exposure. The developer will dissolve the unexposed part of the dry film, and the solidified part will remain on the inner core board 111. After the development is completed, only the pad area that needs to be silver-plated or tin-plated is exposed, and the rest of the dry film is removed.

[0068] In some examples, such as Figure 4As shown, the first preset thickness mentioned above is 0.3um to 0.5um. It is understandable that during the selective silver treatment, the thickness of the silver layer 121 can be controlled between 0.3um and 0.5um by controlling the time and the concentration of the solution. In this way, the parameter design can ensure that the final formed pad 12 meets a certain welding strength while reducing the probability of silver catalytic defects.

[0069] In some examples, such as Figure 4 As shown, the second preset thickness mentioned above is 35um to 40um. It can be understood that the selective tin plating mentioned in the above example mainly refers to electrochemically plating a layer of tin metal on the exposed surface of the board. Therefore, the thickness of the tin layer 122 can be controlled between 35um and 40um by controlling the electroplating time and current size. In this way, the parameter design can ensure that the final formed pad 12 can better correspond to the pins of the lamp beads for welding connection.

[0070] In some examples, after executing the above method step S210 and before executing the above method step S230, the following steps are also included: the first surface of the inner core board is subjected to a preset circuit pattern photolithography process to form a built-in signal connection circuit on the first surface of the inner core board. And the first surface of the inner core board is subjected to an anti-etching ink printing process to form an anti-etching ink coating with a third preset thickness on the surface of each pad. In this way, by photolithography forming a built-in signal connection circuit (not shown) on the first surface of the inner core board 111, the signal connection circuit of the module light board 100 finally formed can also be placed in the inner layer at the same time, thereby effectively reducing its signal transmission loss and external interference. And by forming an anti-etching ink coating with a third preset thickness on the surface of each pad, the abnormal pressing collapse caused by the voids in the area corresponding to each pad 12 during the pressing process can be effectively prevented (that is, these voids can be filled as much as possible by the anti-etching ink coating during the pressing process).

[0071] It is understandable that the preset circuit pattern lithography process mentioned in this example is a conventional printed circuit board lithography process, which will not be elaborated in this article. Generally speaking, after the preset circuit pattern lithography process is performed, the inner layer circuit AOI will also be performed, that is, the inner layer circuit is automatically optically inspected to check the integrity and correctness of the inner layer circuit to ensure that there are no defects such as short circuits or open circuits, and solder mask treatment is performed, that is, solder mask ink 14 is coated on the surface of the circuit board to prevent short circuits in subsequent welding processes, while protecting the circuit from the external environment. The specific process of printing anti-etching ink treatment mentioned in this example is as follows: coating anti-etching ink, pre-curing (pre-baking 80°C / 40min) and exposure and development, so that the first pad avoidance hole 13 of the first insulating dielectric plate 114 is basically filled with the anti-etching ink coating after pressing. Preferably, the third preset thickness is 0.1mm to 0.2mm smaller than the thickness of the first insulating dielectric plate. In this way, it can effectively ensure that the above-mentioned pressing collapse abnormality will not occur during the pressing process.

[0072] In some examples, the specific process of executing the above method step S240 is as follows: the module mainboard prototype is subjected to a second preset surface treatment including at least an outer layer circuit photolithography treatment, so that the first surface core board forms at least a plurality of second pad avoidance holes to obtain the module mainboard, and the plurality of second pad avoidance holes are arranged one-to-one with the plurality of pads. In this way, through the above method steps, the module mainboard 110 finally formed can have a corresponding mounting slot 11 formed on one side surface, and each pad 12 is arranged on the bottom wall of the corresponding mounting slot 11.

[0073] It is understandable that the outer layer circuit lithography process mentioned in this example is also a conventional printed circuit board lithography process, which will not be described in detail in this article. The second preset surface treatment mentioned in this example, in addition to the above-mentioned outer layer circuit lithography process, generally also includes but is not limited to the following treatments: 1. Targeting / gong edge, that is, the edge of the module motherboard prototype is targeted or gong edge processed to ensure the accuracy of the outer dimensions and avoid burrs. 2. Drilling again, that is, before the outer layer circuit of the module motherboard prototype is formed, drilling is performed again to meet the subsequent installation and electrical connection requirements of components. 3. Copper plating, that is, after drilling again, repeat the copper plating process to ensure the conductivity of the newly drilled hole. 4. Electroplating copper, that is, electroplating copper to ensure the conductivity and welding reliability of the outer layer circuit. 5. Outer layer AOI, that is, automatic optical inspection of the outer layer circuit to check the integrity and quality of the circuit to ensure that it meets the design standards. 6. Solder mask, apply solder mask ink again to protect the outer layer circuit and prevent short circuits during welding. 7. Remove the anti-etching ink, remove unnecessary anti-etching ink (mainly the anti-etching ink coating covering the pad 12), and ensure the clarity of the circuit and the welding performance. 8. Text printing, that is, print the necessary logos, text or numbers on the module mainboard 110 to provide component locations and other information. 9. Appearance processing, that is, according to the design requirements, perform shape cutting and trimming on the module mainboard 110 to ensure that it meets the size requirements. 10. Electrical testing, that is, perform electrical testing on the module mainboard 110 to check the electrical performance of each circuit to ensure that there are no short circuits, open circuits and other problems. 11. FQC (final quality inspection), that is, perform a final quality inspection on the module mainboard 110 to ensure that all process steps are qualified and meet customer requirements.

[0074] In some examples, the specific process of executing the above method step S120 is as follows: after each lamp bead is placed in the corresponding installation slot, the pin of each lamp bead is welded and connected to the corresponding pad by reflow soldering to obtain a module light board. In this way, through the setting of the above method steps, since the pad 12 adopts an embedded design, after the lamp bead 120 is placed in the corresponding installation slot 11, the lamp bead 120 will not cause abnormal patch such as falling due to the movement of the module light board 100. At the same time, through the reflow soldering method, during the soldering process, the molten tin layer has a tin climbing function, and the lamp bead 120 can be reset to the corresponding pad 12, thereby effectively preventing abnormalities such as uneven tin amount and printing deviation caused by solder paste printing.

[0075] In one embodiment, Figure 2 As shown, an embodiment of the present application further provides a display module, which may specifically include a module light board 100, and the module light board 100 is manufactured by the manufacturing method of the module light board in the above embodiment.

[0076] It is understandable that the display module of the embodiment of the present application can be used for independent display or can be specifically applied to a display screen, so that a number of display modules are arranged in a certain manner to form a corresponding display screen. The display module of the embodiment of the present application can adopt a bottom shell structure design or a bottom shell-free structure design. When it adopts a bottom shell structure design, in addition to the module light board 100, it also includes a module bottom shell, and the module bottom shell is installed on the side surface of the module light board 100 away from the lamp beads 120.

[0077] In this way, since the display module in the embodiment of the present application has a module light board manufactured using the method steps in the above method embodiment, it has the same functions and technical effects as the above method embodiment, and will not be repeated here.

[0078] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application is described in detail with reference to the above embodiments, a person skilled in the art should understand that the technical solutions described in the above embodiments can still be modified, or some of the technical features can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A method for manufacturing a module light panel, characterized in that: The following steps are involved: A module mainboard is provided, wherein a plurality of mounting grooves are concavely arranged on a surface of one side of the module mainboard, and a solder pad is arranged on the bottom wall of each mounting groove; A plurality of lamp beads are provided, and the plurality of lamp beads are arranged correspondingly to the plurality of mounting slots. Each lamp bead is placed in a corresponding mounting slot and connected to the corresponding soldering pad by welding to obtain a module lamp panel.

2. The method according to claim 1, characterized in that: The method for manufacturing the module mainboard comprises the following steps: Providing an inner core board, and performing a first preset surface treatment on the inner core board to form a plurality of welding pads on a first side surface of the inner core board; A first insulating dielectric plate is provided, and a preset opening process is performed on the first insulating dielectric plate to form a plurality of first pad avoidance holes on the first insulating dielectric plate, wherein the plurality of first pad avoidance holes are arranged in a one-to-one correspondence with the plurality of pads; Providing a first surface core board, a second insulating medium board and a second surface core board, and sequentially pressing the first surface core board, the first insulating medium board, the inner core board, the second insulating medium board and the second surface core board together so that each of the pads is located in the corresponding pad avoidance hole, so as to obtain a prototype of a module mainboard; The module mainboard prototype is subjected to a second preset surface treatment to obtain the module mainboard.

3. The method according to claim 2, characterized in that: The step of performing a first preset surface treatment on the inner core plate to form a plurality of welding pads on the first side surface of the inner core plate comprises: Performing a plating-resist dry film treatment on the first side surface of the inner core board, so that a plurality of pad areas are formed on the first side surface of the inner core board; Performing a selective silver immersion treatment on the first side surface of the inner core board, so that a silver layer having a first preset thickness is deposited on the surface of each of the pad regions; The first side surface of the inner core board is selectively tinned and stripped in sequence, so that the surface of each silver layer is electroplated to form a tin layer with a second preset thickness, and thus each pad area forms a corresponding pad.

4. The method according to claim 3, characterized in that: The step of applying a resist dry film to the first side surface of the inner core board so as to form a plurality of pad areas on the first side surface of the inner core board comprises: After the front side of the anti-plating dry film is attached to the first surface of the inner core board by heat pressing, the anti-plating dry film is sequentially exposed and developed to form a plurality of pad areas on the first side surface of the inner core board.

5. The manufacturing method according to claim 3, characterized in that: The first preset thickness is 0.3um to 0.5um; and / or, The second preset thickness is 35um-40um.

6. The method according to claim 2, characterized in that: After the first preset surface treatment is performed on the inner core plate, and before the first surface core plate, the first insulating medium plate, the inner core plate and the second surface core plate are pressed together in sequence, the following steps are also included: Performing a preset circuit pattern photolithography process on the first surface of the inner core board to photolithographically form a built-in signal connection circuit on the first surface of the inner core board; The first surface of the inner core board is treated with an anti-etching ink to form an anti-etching ink coating with a third preset thickness on the surface of each of the pads.

7. The manufacturing method according to claim 6, characterized in that: The third preset thickness is 0.1 mm to 0.2 mm smaller than the thickness of the first insulating dielectric plate.

8. The method according to claim 2, characterized in that: The step of performing a second preset surface treatment on the module mainboard prototype to obtain the module mainboard comprises: The module mainboard prototype is subjected to the second preset surface treatment including at least outer layer circuit lithography treatment, so that the first surface core board forms at least a plurality of second solder pad avoidance holes to obtain the module mainboard, and the plurality of second solder pad avoidance holes are arranged one-to-one with the plurality of the solder pads.

9. The manufacturing method according to claim 3, characterized in that: The step of placing each of the lamp beads in the corresponding mounting slot and welding them to the corresponding pads to obtain a module lamp board includes: After each of the lamp beads is placed in the corresponding installation slot, the pins of each of the lamp beads are welded and connected to the corresponding pads by reflow soldering to obtain a module lamp board.

10. A display module, characterized in that: It comprises a module light board, and the module light board is manufactured by the manufacturing method according to any one of claims 1-9.

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