Electronic equipment, display panel and light curing method

Abstract

The invention discloses electronic equipment, a display panel and a light curing method, the display panel comprises an array substrate, and the array substrate comprises a transparent substrate; the circuit layer is positioned on the surface of one side of the transparent substrate; a plurality of light-emitting elements fixed on the circuit layer, wherein the light-emitting elements are electrically connected with the pixel circuits in the circuit layer; the black adhesive layer comprises a first part of adhesive layer located between the light-emitting elements and a second part of adhesive layer located between the bottoms of the light-emitting elements and the circuit layer; the circuit layer is provided with a preset light passing path, and the light passing path can enable light rays of the cured black adhesive layer to irradiate to the second part adhesive layer from the transparent substrate. UV light irradiation can be performed from one side facing the transparent substrate based on the light transmission path, so that light curing can be performed on the second part of the adhesive layer based on the light transmission path, and effective light curing can be performed on the black adhesive layer between the bottom of the light-emitting element and the array substrate. The influence on the stability and the reliability of the display panel due to the fact that part of the black adhesive layer cannot be effectively cured is avoided.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and more specifically, to an electronic device, a display panel, and a photocuring method. Background Art

[0002] For a display panel that uses light-emitting elements welded and fixed on an array substrate as a display panel for image display, a black glue layer needs to be provided on the array substrate to prevent light crosstalk between different light-emitting elements. In the prior art, the black glue layer between the bottom of the light-emitting element and the array substrate cannot be effectively cured, which affects the reliability and stability of the display panel. Summary of the invention

[0003] In view of this, the present application provides an electronic device, a display panel and a light curing method, and the scheme is as follows:

[0004] A first aspect of the present application provides a display panel, comprising:

[0005] The array substrate comprises: a transparent substrate; a circuit layer located on one surface of the transparent substrate; a plurality of light-emitting elements fixed on the circuit layer, the light-emitting elements being electrically connected to the pixel circuits in the circuit layer;

[0006] A black glue layer, the black glue layer comprising a first glue layer located between the light emitting elements and a second glue layer located between the bottom of the light emitting elements and the circuit layer;

[0007] The circuit layer has a preset light path, and the light path enables the light for curing the black glue layer to irradiate from the transparent substrate to the second part of the glue layer.

[0008] A second aspect of the present application provides an electronic device including the above-mentioned display panel.

[0009] A third aspect of the present application provides a light curing method for the above-mentioned display panel, comprising:

[0010] Expose UV light from one side of the light emitting element to photo-cure at least a first portion of the black glue layer;

[0011] UV light is irradiated from the side of the transparent substrate facing away from the circuit layer, based on the light path, so as to photo-cure at least the second part of the black glue layer.

[0012] From the above description, it can be known that for the electronic device, display panel and photocuring method provided by the technical solution of the present application, since a light path is set in the circuit layer, the light path can make the light for curing the black glue layer irradiate from the transparent substrate to the second part of the glue layer, so that the display panel can be irradiated with UV light from the side facing the transparent substrate, so as to photo-cure the second part of the glue layer based on the light path, so as to effectively photo-cure the black glue layer located between the bottom of the light-emitting element and the array substrate, thereby avoiding the inability to effectively cure this part of the black glue layer and affecting the stability and reliability of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0014] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which this application can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by this application, should still fall within the scope of the technical contents disclosed in this application.

[0015] Figure 1 A schematic diagram of the principle of photocuring of a conventional display panel;

[0016] Figure 2 This is the transmittance curve of Micro LED chip to light of different wavelengths;

[0017] Figure 3 A schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0018] Figure 4 A schematic diagram of the principle of setting a light path provided in an embodiment of the present application;

[0019] Figure 5 A schematic diagram of another light path configuration principle provided in an embodiment of the present application;

[0020] Figure 6 for Figure 5 The shown is a partial enlarged schematic diagram of the display panel before the black glue layer is applied;

[0021] Figure 7 for Figure 5The shown is a partial enlarged schematic diagram of the display panel before the black glue layer is applied;

[0022] Figure 8 for Figure 5 The shown is a partial enlarged schematic diagram of the display panel before the black glue layer is applied;

[0023] Fig. 9 for Figure 5 The shown is a partial enlarged schematic diagram of the display panel before the black glue layer is applied;

[0024] Fig.10 for Figure 5 The shown is a partial enlarged schematic diagram of the display panel before the black glue layer is applied;

[0025] Fig.11 for Figure 5 The shown is a partial enlarged schematic diagram of the display panel before the black glue layer is applied;

[0026] Fig.12 is a top view of the Nth metal layer in the array substrate;

[0027] Fig.13 is a top view of the N-1th metal layer in the array substrate;

[0028] Fig.14 A schematic diagram of the structure of a pixel circuit provided in an embodiment of the present application;

[0029] Fig.15 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0030] Fig.16 A schematic flow chart of a display panel photocuring method provided in an embodiment of the present application.

[0031] Reference numerals:

[0032] 10-array substrate; 11-transparent substrate; 12-circuit layer; 121-metal layer; 13-light-emitting element; 131-first electrode; 132-second electrode; 14-black glue layer; 141-first part of glue layer; 142-second part of glue layer; 15-light path; 16-light-transmitting window; 161-first light-transmitting window; 162-second light-transmitting window; 163-third light-transmitting window; 164-fourth light-transmitting window; 171-first pad; 171a-first area; 171b-second area; 171c-third area; 172-second pad; 172 a-fourth region; 172b-fifth region; 172c-sixth region; 18-insulating layer; 181-first insulating layer; 19-light-transmitting protruding structure; 21-light-transmitting cover layer; 22-surface microstructure; 231-first light-transmitting opening; 232-second light-transmitting opening; 31-first subcircuit; 32-second subcircuit; 33-first power signal line; 34-display panel; X-first direction; Y-second direction; Z-third direction; M1-first metal layer; M2-second metal layer; M3-third metal layer; M4-fourth metal layer; M N - Nth metal layer; M N-1 -N-1th metal layer. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the embodiments in the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0034] refer to Figure 1 , Figure 1 This is a schematic diagram of the principle of photocuring of a conventional display panel. The array substrate 10 includes a transparent substrate 11 and a circuit layer 12 located on the transparent substrate 11. A plurality of light-emitting elements 13 are fixedly connected to the surface of the circuit layer 12. A black glue layer 14 needs to be provided on the surface of the array substrate 10 to prevent light crosstalk from different light-emitting elements 13. The bottom of the light-emitting element 13 has a first electrode 131 and a second electrode 132. The light-emitting element 13 is electrically connected to the pixel circuit in the circuit layer 12 through the first electrode 131 and the second electrode 132.

[0035] In the embodiment of the present application, the light-emitting element 13 may be an LED, including a conventional LED of larger size or a micro LED of smaller size, wherein the micro LED may be a MiniLED or a Micro LED. The chip size of a conventional LED is generally greater than 200 μm. The chip size range of a Mini LED is 50 μm to 200 μm. The chip size of a Micro LED is less than 100 μm, typically 1 μm to 10 μm. The embodiment of the present application does not limit the implementation method of the light-emitting element.

[0036] For a conventional display panel, the circuit layer 12 includes multiple metal layers for preparing pixel circuits. Since the metal layer cannot transmit the UV light used for photocuring, and the light-emitting element 13 has a certain transmittance for the UV light, when the black glue layer 14 is photocured, Figure 1 The UV light irradiation direction indicated by the middle arrow irradiates the black glue layer 14 from above the array substrate 10 to perform photocuring on the black glue layer 14 .

[0037] refer to Figure 2 , Figure 2 This is the transmittance curve of Micro LED chips for light of different wavelengths. Figure 2 The horizontal axis is the wavelength of light, and the vertical axis is the transmittance. The two curves above are the transmittance curves of two green light Micro LED chips using different green light-emitting materials, and the two curves below are the transmittance curves of two red light Micro LED chips using different red light-emitting materials.

[0038] based on Figure 2 As shown, the transmittance of red light Micro LED chip is 0, and the transmittance of green light Micro LED chip to UV light is generally less than 20%. Figure 2 The transmittance curve of the blue light Micro LED chip with blue light-emitting material is not shown in the figure, and the transmittance of the blue light Micro LED chip generally does not exceed 20%.

[0039] Since the transmittance of the LED's luminous material to UV light is low, the black glue layer under the LED cannot obtain sufficient energy, which will cause the black glue layer under the LED to fail to effectively cure.

[0040] In order to solve the above problems, an embodiment of the present application provides a display panel, including:

[0041] The array substrate comprises: a transparent substrate; a circuit layer located on one surface of the transparent substrate; a plurality of light-emitting elements fixed on the circuit layer, the light-emitting elements being electrically connected to the pixel circuits in the circuit layer;

[0042] A black glue layer, the black glue layer comprising a first glue layer located between the light emitting elements and a second glue layer located between the bottom of the light emitting elements and the circuit layer;

[0043] The circuit layer has a preset light path, and the light path enables the light for curing the black glue layer to irradiate from the transparent substrate to the second part of the glue layer.

[0044] In the embodiment of the present application, since a light path is provided in the circuit layer, the light path can allow the light for curing the black glue layer to irradiate from the transparent substrate to the second portion of the glue layer, so that the display panel can be irradiated with UV light from the side facing the transparent substrate, so as to photo-cure the second portion of the glue layer based on the light path, so as to effectively photo-cure the black glue layer located between the bottom of the light-emitting element and the array substrate, thereby avoiding the inability to effectively cure this portion of the black glue layer and affecting the stability and reliability of the display panel.

[0045] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0046] refer to Figure 3 , Figure 3 A schematic diagram of the structure of a display panel provided in an embodiment of the present application, wherein the display panel includes:

[0047] The array substrate 10 includes: a transparent substrate 11; a circuit layer 12 located on one side of the transparent substrate 11; a plurality of light emitting elements 13 fixed on the circuit layer 12, and the light emitting elements 13 and the pixel circuits in the circuit layer 12 ( Figure 3 (not shown) electrical connection;

[0048] A black glue layer 14, the black glue layer 14 includes a first portion of the glue layer 141 located between the light-emitting elements and a second portion of the glue layer 142 located between the bottom of the light-emitting element 13 and the circuit layer 12;

[0049] The circuit layer 12 has a preset light path 15 , and the light path 15 enables the light for curing the black glue layer 14 to be irradiated from the transparent substrate 11 to the second portion of the glue layer 142 .

[0050] Since a light path 15 is provided in the circuit layer 12, the light path 15 can allow the light for curing the black glue layer 14 to irradiate from the transparent substrate 11 to the second portion of the glue layer 142, so that the display panel can be irradiated with UV light from the side facing the transparent substrate 11, so as to photo-cure the second portion of the glue layer 142 based on the light path 15, so as to effectively photo-cure the black glue layer 14 located between the bottom of the light-emitting element 13 and the array substrate 10, thereby avoiding the failure of effective curing of the part of the black glue layer 14 to affect the stability and reliability of the display panel.

[0051] In the embodiment of the present application, the transparent substrate 11 may be a hard substrate, such as a glass substrate or a hard plastic plate, etc. The hard substrate may be used to prepare a rigid display panel.

[0052] In another embodiment, the transparent substrate 11 may also be a flexible substrate, such as a polyimide substrate or a flexible plastic board. The flexible substrate may be used to prepare a flexible display panel.

[0053] refer to Figure 4 , Figure 4 A schematic diagram of the principle of setting a light path provided in an embodiment of the present application, based on any of the above implementations, Figure 4 In the shown embodiment, the circuit layer 12 includes a plurality of metal layers 121 stacked in sequence; wherein, at least one metal layer 121 has a light-transmitting window 16 for forming a light-transmitting path 15; in a direction perpendicular to the plane of the transparent substrate 11 (the direction is parallel to the third direction Z), the light-transmitting window 16 in at least one metal layer 121 has an overlapping portion with the second partial adhesive layer 142.

[0054] There is an insulating layer 18 between adjacent metal layers 121 .

[0055] like Figure 4 As shown, a light-transmitting window 16 is provided in the metal layer 121 in the circuit layer 12, and the light-transmitting window 16 in at least one layer of the metal layer 121 has an overlapping portion with the second portion of the adhesive layer 142. When UV light irradiates the black adhesive layer 14 from one side of the transparent substrate 11, the UV light can irradiate the second portion of the adhesive layer 142 based on the light path 15 to achieve curing of the second portion of the adhesive layer 142.

[0056] refer to Figure 5 , Figure 5 A schematic diagram of the setting principle of another light-through path provided in an embodiment of the present application, based on the above-mentioned implementation mode, each metal layer 121 in the circuit layer 12 can be provided with a light-through window 16, and the light-through window 16 in each metal layer 121 is constructed as a light-through path 15.

[0057] Assume that the circuit layer 12 has a plurality of metal layers 121 stacked in sequence. In the third direction Z, the plurality of metal layers 121 are sequentially a first metal layer M1 to an Nth metal layer M2. N , N is a positive integer greater than 1. The first metal layer M1 to the Nth metal layer M N Each of them has a light-transmitting window 16 . Figure 5Taking N=4 as an example for illustration, the fourth metal layer M4 has a first light-transmitting window 161, the third metal layer M3 has a second light-transmitting window 162, the second metal layer M2 has a third light-transmitting window 163, and the first metal layer M1 has a fourth light-transmitting window 164. In the embodiment of the present application, a light-transmitting path 15 can be formed based on the light-transmitting window 16 disposed in the metal layer 121. By adjusting the design position and parameters of the light-transmitting window 16 in the metal layer 121, the extension track and size of the light-transmitting path 15 in the circuit layer 12 can be adjusted, so that when the UV light irradiates the black glue layer 14 from the side of the transparent substrate 11, the curing effect of the UV light on the second part of the glue layer 142 is optimized.

[0058] As described above, the bottom of the light emitting element 13 is connected to the pixel circuit in the circuit layer 12 via the first electrode 131 and the second electrode 132. In the same light emitting element 13, the first electrode 131 and the second electrode 132 are arranged opposite to each other in the first direction X.

[0059] refer to Figure 6 , Figure 6 for Figure 5 The partial enlarged schematic diagram of the display panel before the black glue layer is applied is shown in FIG. Figure 5 and Figure 6 As shown, in this method, in the direction from the transparent substrate 11 to the light emitting element 13 (the direction is the third direction Z), the multi-layer metal layer 121 is sequentially a first metal layer M1 to an Nth metal layer M2. N , N is a positive integer greater than 1.

[0060] In various implementations of the embodiments of the present application, the circuit layer 12 is illustrated as an example in which four metal layers 121 are provided, i.e., N = 4. Obviously, in the embodiments of the present application, the number of metal layers 121 in the circuit layer 12 can be set as required, and is not limited to 4 layers, but can be any number of layers, i.e., N is not limited to being equal to 4, and can be any positive integer greater than 1.

[0061] Nth metal layer M N It includes a first pad 171 and a second pad 172, and a first light-transmitting window 161 is provided between the first pad 171 and the second pad 172. The bottom of the light-emitting element 13 has a first electrode 131 and a second electrode 132, the first electrode 131 is electrically connected and fixed to the first pad 171, and the second electrode 132 is electrically connected and fixed to the second pad 172; for the same light-emitting element 13, there is a first distance W11 between the first electrode 131 and the second electrode 132 opposite to each other in the first direction X, and the first direction X is parallel to the plane where the transparent substrate 11 is located; in the first direction X, the first pad 171 and the second pad 172 connecting the same light-emitting element 13 have a second distance W13; wherein W11>W13.

[0062] In the first direction X, there is a gap between the first electrode 131 and the second electrode 132 to form a first distance W11. Based on W11, a short circuit between the first electrode 131 and the second electrode 132 can be prevented. The value of W11 can be set according to the bottom size of the light-emitting element 13, and the embodiment of the present application does not limit the value of W11.

[0063] The first light-transmitting window 161 between the first pad 171 and the second pad 172 serves as the Nth metal layer M N Setting W11>W13 can prevent W13 from being too large, which may cause the first electrode 131 and the second electrode 132 to be unable to be effectively welded and fixed to the first pad 171 and the second pad 172, respectively, so as to ensure the reliability and stability of the electrical connection between the bottom electrode of the light-emitting element 13 and the corresponding pad.

[0064] When the black glue layer 14 is cured from one side of the transparent substrate 11 by UV light, in order to enable the UV light to irradiate the second portion of the glue layer 142 based on the light path 15, in the third direction Z, the first light-transmitting window 161 is set to at least partially overlap the gap between the first electrode 131 and the second electrode 132.

[0065] Optionally, in order to ensure a more uniform illumination effect on the second portion of the adhesive layer 142, the first light-transmitting window 161 is arranged to be vertically relative to the center of the gap between the first electrode 131 and the second electrode 132, that is, the perpendicular bisector of the first light-transmitting window 161 perpendicular to the first direction X coincides or approximately coincides with the perpendicular bisector of the first distance W11 perpendicular to the first direction X.

[0066] refer to Figure 7 , Figure 7 for Figure 5 The partial enlarged schematic diagram of the display panel before the black glue layer is applied is shown in FIG. Figure 5 and Figure 7 As shown, based on the above implementation, the N-1th metal layer M N-1 A second light-transmitting window 162 is provided. In a direction perpendicular to the plane where the transparent substrate 11 is located, the first light-transmitting window 161 and the second light-transmitting window 162 have an overlapping portion. Based on the overlapping portion of the first light-transmitting window 161 and the second light-transmitting window 162 in the third direction Z, the light path 15 is formed from the N-1th metal layer M N-1 Extend to the Nth metal layer M N When the UV light is irradiated from one side of the transparent substrate 11 , it can irradiate the second portion of the adhesive layer 142 from the overlapping portion of the first light-transmitting window 161 and the second light-transmitting window 162 , thereby achieving effective curing of the second portion of the adhesive layer 142 .

[0067] like Figure 7 As shown, in the first direction X, the size of the second light-transmitting window 162 is W14; in an implementation manner of the embodiment of the present application, W14≠W11 can be set.

[0068] In the embodiment of the present application, W14≠W11 is set, and the N-1th metal layer M can be set differently. N-1 and the Nth metal layer M N The size of the middle light-transmitting window 16 in the first direction X is, on the one hand, convenient for the N-1th metal layer M N-1 and the Nth metal layer M N In the circuit pattern layout, on the other hand, the light path 15 can be designed more flexibly to optimize the curing effect of the second portion of the glue layer 142 when the second portion of the glue layer 142 is cured based on the light path 15 .

[0069] Based on the above implementation, when W14≠W11, Figure 7 As shown, W14>W13 is set. As mentioned above, in order to ensure the connection effect between the bottom electrode of the light-emitting element 13 and the corresponding pad, it is necessary to set W11>W13, which causes a certain shielding of the light incident on the second part of the glue layer 142 from the light path 15. Setting W14>W13 can make the Nth metal layer M N The N-1 metal layer M below N-1 The second light-transmitting window 162 may have a larger size in the first direction X, so that more light is incident through the second light-transmitting window 162 , thereby increasing the proportion of obliquely incident light and ensuring the curing effect on the second portion of the adhesive layer 142 .

[0070] Based on the above implementation, in one implementation of the embodiment of the present application, W13>W14 can also be set. Since various signal lines connected to the pixel circuit need to be laid out in the circuit layer 12, corresponding to a given light-emitting element, the first distance W11 between the two electrodes at the bottom of the light-emitting element 13 is a fixed value. After the light-emitting element 13 sets the value of the adapted second distance W13 based on the first distance W11, if the N-1 metal layer M N-1 If the space in the middle is not enough to realize a larger size W14, W13>W14 can also be set to facilitate the N-1 metal layer M N-1 The layout of the signal lines.

[0071] If W13>W14, in the embodiment of the present application, W13>W14≥0.8·W13 is preferably set. When W13>W14, setting W14≥0.8·W13 can avoid W14 being too small and causing too little light to irradiate the second part of the adhesive layer 142141, thereby affecting the curing effect of the second part of the adhesive layer 142.

[0072] In other implementations, W14 may be set equal to W11.

[0073] In the embodiment of the present application, the relative sizes of the light-transmitting windows of each metal layer 121 can be set according to the wiring space in the array substrate 10, and the sizes of the light-transmitting windows 16 in different metal layers 121 in the first direction X include but are not limited to the methods described in the embodiment of the present application.

[0074] refer to Figure 8 , Figure 8 for Figure 5 The partial enlarged schematic diagram of the display panel before the black glue layer is applied is shown in FIG. Figure 5 , Figure 6 and Figure 8 As shown, based on the above implementation, the Nth metal layer M N With the N-1th metal layer M N-1 There is a first insulating layer 181 therebetween; at least one light-transmitting protruding structure 19 is disposed on the surface of the first insulating layer 181 located between the first pad 171 and the second pad 172 .

[0075] Combination Figure 5 , Figure 6 and Figure 8 As shown, since W11>W13, in the third direction Z, the first pad 171 and the second pad 172 will have an overlapping portion with the first distance W11, and the overlapping portion will block the second adhesive layer 142, thereby affecting the light curing effect of the second adhesive layer 142.

[0076] When light is photocured from one side of the transparent substrate 11, the light-transmitting protrusion structure 19 can adjust the transmission direction of the light when passing through the first light-transmitting window 161 and expand the light irradiation area to avoid affecting the photocuring effect of the second part of the glue layer 142 due to the shielding of the second part of the glue layer 142 by the solder pad.

[0077] exist Figure 8 In the illustrated method, a transparent protruding structure 19 is provided on the surface of the first insulating layer 181 between the first pad 171 and the second pad 172 as an example for illustration. In the embodiment of the present application, one or more transparent protruding structures 19 can be provided according to the size of the transparent protruding structure 19 and the size of the second distance W13, and is not limited to Figure 8 The method of setting a light-transmitting protruding structure 19 is shown.

[0078] Based on the above implementation, in the embodiment of the present application, the first insulating layer 181 can be set to have a first refractive index n1, and the light-transmitting protruding structure 19 can be set to have a second refractive index n2; wherein n1≠n2. In this implementation, the refractive index difference design of the first insulating layer 181 and the light-transmitting protruding structure 19 can be used to optimize the transmission path of the light after passing through the first light-transmitting window 161, so as to better cure the second part of the adhesive layer 142.

[0079] It is easy to know that in the embodiment of the present application, the three-dimensional graphic structure and size of the light-transmitting protruding structure 19 can also be optimized to optimize the transmission path of light after passing through the first light-transmitting window 161, so as to better solidify the second part of the adhesive layer 142. The light-transmitting protruding structure 19 can be any structure of a partial sphere, a partial elliptical sphere, a prism, a cone, and an irregular three-dimensional protrusion. The embodiment of the present application does not limit the three-dimensional geometric shape of the light-transmitting protruding structure 19.

[0080] refer to Fig. 9 , Fig. 9 for Figure 5 The partial enlarged schematic diagram of the display panel before the black glue layer is applied is shown in FIG. Figure 5 , Figure 6 and Fig. 9 As shown, based on the above implementation, the Nth metal layer M N With the N-1th metal layer M N-1 There is a first insulating layer 181 between them; the first insulating layer 181 has a first refractive index n1; for the Nth metal layer M N At least the side wall of the first pad 171 facing the first light-transmitting window 161 and at least the side wall of the second pad 172 facing the first light-transmitting window 161 are covered with a light-transmitting cover layer 21; the light-transmitting cover layer 21 has a third refractive index n3; wherein n1≠n3.

[0081] As mentioned above, since the solder pad blocks the second adhesive layer 142, the light curing effect of the second adhesive layer 142 will be affected. Fig. 9 In the illustrated embodiment, by providing a light-transmitting cover layer 21 having a different refractive index from the first insulating layer 181, based on the difference in refractive index between the two, the range of light irradiating the second portion of the adhesive layer 142 can be optimized. When light is photocured from one side of the transparent substrate 11, part of the light can be transmitted through the light-transmitting cover layer 21 and then irradiated to the second portion of the adhesive layer 142. By optimizing the difference in refractive index between the first insulating layer 181 and the light-transmitting cover layer 21, the light can more fully irradiate the second portion of the adhesive layer 142, so as to avoid affecting the light curing effect of the second portion of the adhesive layer 142 due to the shielding of the second portion of the adhesive layer 142 by the pad.

[0082] refer to Fig.10 , Fig.10for Figure 5 The partial enlarged schematic diagram of the display panel before the black glue layer is applied is shown in FIG. Figure 5 , Figure 6 and Fig.10 As shown, based on the above embodiment, the bottom of the light emitting element 13 has a surface microstructure 22 at least in the area between the first electrode 131 and the second electrode 132 .

[0083] As mentioned above, since the solder pad blocks the second adhesive layer 142, the light curing effect of the second adhesive layer 142 will be affected. Fig.10 In the illustrated embodiment, by providing the surface microstructure 22 at the bottom of the light emitting element 13, the incident light can be diffusely reflected, and the range of the light irradiating the second part of the adhesive layer 142 can be optimized. When the light is photocured from one side of the transparent substrate 11, the light irradiates the surface microstructure 22, and the light transmission direction can be changed after the diffuse reflection of the surface microstructure 22, so that the diffusely reflected light can irradiate the second part of the adhesive layer 142 blocked by the pad, so as to avoid affecting the photocuring effect of the second part of the adhesive layer 142 due to the blocking of the second part of the adhesive layer 142 by the pad.

[0084] The surface microstructure 22 may be a plurality of micro protrusions formed on the bottom of the light emitting element 13, or a roughened bottom surface of the light emitting element 13. Optionally, the micro protrusions may be a light-transmitting adhesive layer with reflective particles mixed therein.

[0085] refer to Fig.11 , Fig.11 for Figure 5 The partial enlarged schematic diagram of the display panel before the black glue layer is applied is shown in FIG. Figure 5 , Figure 6 and Fig.11 As shown, based on the above embodiment, the size of the top of the light-emitting element 13 in the first direction X is W10; W10>W11; the first pad 171 includes a first area 171a, a second area 171b and a third area 171c arranged in sequence along the first direction X, and the first electrode 131 is welded and fixed to the first pad based on the second area; wherein at least one of the first area 171a and the third area 171c is provided with a first light-transmitting opening 231.

[0086] Since W10>W11, the bottom size of the light-emitting element 13 is relatively small, and the light-emitting element 13 has an inclined side wall. When the light irradiates the black glue layer 14 along the opposite direction of the third direction Z, not only the second portion of the glue layer 142 will be blocked by the light-emitting element 13, but its inclined side wall will also block a partial area of ​​the first portion of the glue layer 141.

[0087] If a first light-transmitting opening 231 is set in the first area 171a, when light is cured along the third direction Z, the black glue layer 14 blocked by the side wall and / or bottom of the light-emitting element 13 above the first light-transmitting opening 231 in the first area 171a can be more fully cured, thereby improving the curing effect of the black glue layer 14.

[0088] If a first light-transmitting opening 231 is provided in the third region 171c, when light is cured along the third direction Z, the black glue layer 14 blocked by the side wall and / or bottom of the light-emitting element 13 above the first light-transmitting opening 231 in the third region 171c can be more fully cured, thereby improving the curing effect of the black glue layer 14.

[0089] Based on the above implementation, it is also possible to Fig.11 As shown, the second pad 172 includes a fourth region 172a, a fifth region 172b and a sixth region 172c arranged in sequence along the first direction X, and the second electrode 132 is welded and fixed to the second pad 172 based on the fifth region 172b; wherein, at least one of the fourth region 172a and the sixth region 172c is provided with a second light-transmitting opening 232.

[0090] If a second light-transmitting opening 232 is set in the fourth area 172a, when light is cured along the third direction Z, the black glue layer 14 blocked by the side wall and / or bottom of the light-emitting element 13 above the second light-transmitting opening 232 in the fourth area 172a can be more fully cured, thereby improving the curing effect of the black glue layer 14.

[0091] If a second light-transmitting opening 232 is set in the sixth area 172c, when light is cured along the third direction Z, the black glue layer 14 blocked by the side wall and / or bottom of the light-emitting element 13 above the second light-transmitting opening 232 in the sixth area 172c can be more fully cured, thereby improving the curing effect of the black glue layer 14.

[0092] In the embodiment of the present application, a light-transmitting opening may be provided in at least one of the first region 171a, the third region 171c, the fourth region 172a, and the sixth region 172c. Fig.11 The first region 171a, the third region 171c, the fourth region 172a and the sixth region 172c are all provided with light-transmitting openings.

[0093] refer to Fig.12 and Fig.13 , Fig.12 is a top view of the Nth metal layer in the array substrate, Fig.13 It is a top view of the N-1th metal layer in the array substrate. Fig.12 and Fig.13 In the figure, N=4 is also used as an example for illustration.

[0094] Nth metal layer M N There are a plurality of square frame hollow areas in the middle to form a plurality of separated second pads 172. The other Nth metal layer M outside the second pads 172 N The first solder pad 171 is used as an integral part of all the light emitting elements 13. One long side of the hollow area of ​​the square frame is used as the first light-transmitting window 161.

[0095] Combined with 12, Fig.13 As shown in the drawings of the above embodiment, in the second direction Y, the size of the second light-transmitting window 162 is W24; the second direction Y is parallel to the plane where the transparent substrate 11 is located, and is perpendicular to the first direction X; there is a gap between the first electrode 131 and the second electrode 132, and the size of the gap in the second direction Y is W21; wherein W24>W21.

[0096] Setting W24>W21 can make the size of the second light-transmitting window 162 in the second direction Y larger than the size of the gap between the two electrodes at the bottom of the light-emitting element 13 in the second direction Y, and can make the overlapping area between the second light-transmitting window 162 and the first light-transmitting window 161 in the third direction Z completely expose the gap between the two electrodes at the bottom of the light-emitting element 13. When the black glue layer 14 is cured along the third direction Z, the second portion of the glue layer 142 can be more fully irradiated to achieve sufficient curing of the second portion of the glue layer 142.

[0097] Furthermore, W24 may be set larger than the dimension W20 of the top surface of the light emitting element 13 in the second direction Y, so that the black glue layer below the two opposite side walls in the second direction Y of the light emitting element 13 can be fully cured.

[0098] The three first light-transmitting windows 161 arranged continuously in the first direction X can be used to respectively weld and fix the red light-emitting element R, the green light-emitting element G and the blue light-emitting element B.

[0099] In the embodiment of the present application, the length of the first light-transmitting window 161 in the second direction Y is at least greater than W20, so that at least one light-emitting element 13 can be welded above the first light-transmitting window 161. If there is a faulty light-emitting element 13 that cannot emit light in the display panel, the faulty light-emitting element 13 can be dug out and then a light-emitting element 13 of the same color can be welded and fixed in the original position.

[0100] In other implementations, it is also possible to Fig.12As shown, the length of the first light-transmitting window 161 in the second direction Y is set to be greater than 2 times W20, so that a redundant welding position can be formed above the first light-transmitting window 161. If a faulty light-emitting element 13 that cannot emit light normally occurs, another light-emitting element 13 with the same light-emitting color can be directly welded above the first light-transmitting window 161 corresponding to the faulty light-emitting element 13, and there is no need to dig out the faulty light-emitting element 13.

[0101] In the embodiment of the present application, the N-1th metal layer M N-1 A second light-transmitting window 162 is provided; in a direction perpendicular to the plane where the transparent substrate 11 is located, the N-1th metal layer M N-1 At least partially overlaps with the light emitting element 13; in the first direction X, the two opposite sides of the first light-transmitting window 161 are located between the two opposite sides of the second light-transmitting window 162. Fig.12 As shown, two opposite sides of the first light-transmitting window 161 in the first direction X are located between two opposite sides of the second light-transmitting window 162 in the first direction X. Thus, in the first direction X, the second light-transmitting window 162 can completely expose the first light-transmitting window 161 to achieve full curing of the second portion of the adhesive layer 142 .

[0102] In one implementation of the present application, in a direction perpendicular to the plane of the transparent substrate 11, the number of metal layers 121 in the region where the circuit layer 12 is opposite to the first portion of the adhesive layer 141 is m1, and the number of metal layers 121 in the region where the circuit layer 12 is opposite to the second portion of the adhesive layer 142 is m2; m1 and m2 are both natural numbers, m1>m2≥0. Figure 5 Taking the shown method as an example, if the circuit layer 2 has the first metal layer M1 to the fourth metal layer M4, in the third direction Z, the first metal layer M1 to the fourth metal layer M4 all have a portion opposite to the first partial glue layer 141, that is, m1=4, and only the first metal layer M1 has a portion opposite to the second partial glue layer 142, that is, m2=1.

[0103] By setting the size of the light-transmitting window 16 in each metal layer 121 in the first direction X, the values ​​of m1 and m2 can be adjusted.

[0104] Setting m1>m2≥0 can ensure that there is a smaller amount of metal shielding under the second adhesive layer 142 , so as to improve the light curing effect of the second adhesive layer 142 when the light cures the black adhesive layer 14 along the third direction Z.

[0105] In one implementation of the present application, the Nth metal layer M N You can Fig.12 As shown, a plurality of separated second pads 172 are formed based on a plurality of hollowed-out areas of the square frame, and the Nth metal layer M of the remaining integrated structureN The first pad 171 may be used as a common connection for all the light emitting elements 13 . In this way, the impedance of the first pad 171 connected to the first electrode 131 can be reduced, thereby reducing power consumption.

[0106] In other embodiments, the Nth metal layer M N It may also include a plurality of separated first pads 171 and a plurality of separated second pads 172 and a second power signal line for providing a second power signal VEE to the first pads 171. This method can reduce the Nth metal layer M N The area occupancy can reduce the shielding of the black glue layer 14. When the light is cured along the third direction Z, it can not only irradiate the first part of the glue layer 141, but also irradiate the second part of the glue layer 142, which can improve the curing effect of the black glue layer 14.

[0107] In one implementation of the present application, the N-1th metal layer M N-1 You can Fig.13 As shown, the N-1 metal layer M N-1 There are a plurality of rectangular hollow areas as the second light-transmitting windows 162, and the second light-transmitting windows 162 are arranged one by one corresponding to the light-emitting elements 13. N-1 In this embodiment, the second light-transmitting window 162 can be a rectangle or other opening shapes.

[0108] Optionally, the N-1th metal layer M N-1 It can be used to connect the first power signal PAM-_VDD to the pixel circuit. Fig.13 The N-1th metal layer M of the graphical structure shown N-1 The circuit impedance can be reduced, the voltage drop of the first power signal PAM_VDD can be reduced, and the power consumption can be reduced.

[0109] In other methods, the N-1th metal layer M N-1 It may also include a plurality of first power signal lines, the first power signal lines being used to connect the first power signal PAM_VDD to the pixel circuit. In this manner, the gaps between adjacent first power signal lines serve as the second light-transmitting windows 162. This manner can reduce the N-1 metal layer M N-1 The area occupancy can reduce the shielding of the black glue layer 14. When the light is cured along the third direction Z, it can not only irradiate the first part of the glue layer 141, but also irradiate the second part of the glue layer 142, which can improve the curing effect of the black glue layer 14.

[0110] Each light emitting element 13 can be connected to a corresponding pixel circuit. The structure of the pixel circuit can be as follows: Fig.14 shown.

[0111] refer to Fig.14 , Fig.14 Schematic diagram of a pixel circuit provided in an embodiment of the present application, wherein the pixel circuit includes a first subcircuit 31 and a second subcircuit 32, wherein the first subcircuit 31 is connected to the light-emitting element 13, and the second subcircuit 32 is connected to the first subcircuit 31; the first subcircuit 31 is used to control the amplitude of the driving current provided by the light-emitting element 13, and the second subcircuit 32 is used to control the pulse width of the driving current provided to the light-emitting element 13; the first power signal line 33 provides a first power signal PAM_VDD to the first subcircuit 31; the N-1 metal layer M N-1 The first power signal line 33 is included, and the N-1th metal layer M N-1 A third light-transmitting window is formed based on the gaps between adjacent first power signal lines.

[0112] If the first power signal PAM_VDD is provided through the first power signal line 33, the N-1th metal layer M N-1 The first power signal lines 33 having a plurality of cross-shaped grid structures are used to connect the first power signal PAM_VDD to each pixel circuit in the display panel. N-1 The area of ​​the N-1 metal layer M N-1 By shielding the black glue layer 14 , when light is cured along the third direction Z, not only the first portion of the glue layer 141 but also the second portion of the glue layer 142 can be irradiated, thereby improving the curing effect of the black glue layer 14 .

[0113] As described above, the pixel circuit can also be provided with an N-1th metal layer M having an integrated structure with a hollow area. N-1 A first power signal PAM_VDD is provided to reduce impedance.

[0114] like Fig.14 As shown, the first sub-circuit 31 includes:

[0115] A first driving transistor T11, wherein the gate of the first driving transistor T11 is connected to the first node N1, the first electrode is connected to the third node N3, and the second electrode is connected to the second node N2; in the embodiment of the present application, one of the first electrode and the second electrode of each transistor is a source, and the other is a drain;

[0116] A first reset transistor T13, wherein a gate of the first reset transistor T13 is connected to the first scan signal PAM_S1, a first electrode is connected to the first reset signal PAM_REF1, and a second electrode is connected to the first node N1;

[0117] A first data transistor T12, wherein a gate of the first data transistor T12 is connected to the second scan signal PAM_S2, a first electrode is connected to the second node N2, and a second electrode is connected to the first data signal PAM_DATA;

[0118] A first threshold compensation transistor T14, wherein a gate of the first threshold compensation transistor T14 is connected to the third scanning signal PAM_S3, a first electrode is connected to the first node N1, and a second electrode is connected to the third node N3;

[0119] The first power supply is written into the transistor T15, the gate of the first power supply is input with the first light emission control signal PAM_EM, the first electrode is connected to the second node N2, and the second electrode is connected to the first power supply signal PAM_VDD;

[0120] A first light emitting control transistor T16, a gate of the first light emitting control transistor T16 receives the first light emitting control signal PAM_EM, a first electrode of the first light emitting control transistor T16 is connected to a fourth node N4, and the fourth node N4 is used to connect the second electrode 132 of the light emitting element 13; and a first electrode 131 of the light emitting element 13 receives the second power supply signal VEE;

[0121] A second reset transistor T17, wherein a gate of the second reset transistor T17 is connected to the third scan signal PAM_S4, a first electrode is connected to the second reset signal PAM_REF2, and a second electrode is connected to the fourth node N4;

[0122] A first control transistor T18, wherein the gate of the first control transistor T18 is connected to the second sub-circuit 32, the first electrode of the first control transistor T18 is connected to the second electrode of the first light-emitting control transistor T16, and the second electrode of the first control transistor T18 is connected to the third node N3;

[0123] The first capacitor C1 has one plate connected to the first node N1 and another plate connected to the first power signal PAM_VDD.

[0124] The first power signal PAM_VDD is a DC high level, and the second power signal VEE is a DC low level.

[0125] like Fig.14 As shown, the second sub-circuit 32 includes:

[0126] a second driving transistor T21, wherein a gate of the second driving transistor T21 is connected to the fifth node N5, a first electrode is connected to the seventh node N7, and a second electrode is connected to the sixth node N6;

[0127] A third reset transistor T23, where a gate of the third reset transistor T23 is connected to the first control signal PWM_S1, a first electrode is connected to the third reset signal PWM_REF1, and a second electrode is connected to the fifth node N5;

[0128] A second data transistor T22, where a gate of the second data transistor T22 is connected to the second control signal PWM_S2, a first electrode is connected to the sixth node N6, and a second electrode is connected to the second data signal PWM_DATA;

[0129] A second threshold compensation transistor T24, a gate of the second threshold compensation transistor T24 is connected to the third control signal PWM_S3, a first electrode is connected to the fifth node N5, and a second electrode is connected to the seventh node N7;

[0130] The second power supply is written into the transistor T25, the gate of the second power supply is connected to the second light emitting control signal PWM_EM, the first electrode is connected to the sixth node N6, and the second electrode is connected to the third power supply signal PWM_VDD; the third power supply signal PWM_VDD can be a DC high level;

[0131] The second light emitting control transistor T26 has a gate connected to the second light emitting control signal PWM_EM, a first electrode connected to the eighth node N8, and a second electrode connected to the seventh node N7.

[0132] A second capacitor C2, one plate of the second capacitor C2 is connected to a fifth node N5, and the other plate of the second capacitor C2 is connected to a tenth node N10, and the tenth node N10 is connected to the sweep signal SWEEP;

[0133] A second control transistor T28, where a gate of the second control transistor T28 is connected to the second control signal PWM_S2, a first electrode is connected to the ground signal SWEEP_GND, and a second electrode is connected to the tenth node N10;

[0134] A third control transistor T29, wherein the gate of the third control transistor T29 is connected to the fourth control signal SET, the first electrode is connected to the ninth node N9, the second electrode is connected to the eighth node N8, and a third capacitor C3 is connected between the eighth node N8 and the ninth node N9; the ninth node N9 is connected to the fifth control signal VSET;

[0135] The second sub-circuit 32 is connected to the first sub-circuit 31 via the eighth node N8. Fig.14 As shown, the eighth node 8 is connected to the gate of the first control transistor T18.

[0136] In the embodiment of the present application, the implementation of the first sub-circuit 31 and the second sub-circuit 32 is not limited to Fig.14 shown.

[0137] In other embodiments, the second sub-circuit 32 may be without the third capacitor C3 and the third control transistor T29, and may be directly connected to the first sub-circuit 31 through a capacitor at the eighth node N8.

[0138] In other embodiments, the first sub-circuit 31 and the second sub-circuit 32 may also be provided with bias transistors connected to the first electrodes of the respective data transistors.

[0139] Based on the display panel provided in the above embodiment, another embodiment of the present application further provides an electronic device, which can be Fig.15 shown.

[0140] refer to Fig.15 , Fig.15 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. The electronic device shown includes a display panel 34 provided in any implementation manner of the above embodiments.

[0141] Among them, electronic devices include but are not limited to electronic devices with display functions such as mobile phones, tablet computers, laptops, and smart wearable devices.

[0142] The electronic device provided in the embodiment of the present application adopts the display panel 34 provided in any of the above embodiments, which can improve the photocuring effect of the black glue layer 14 in the display panel 34, so as to improve the reliability and stability of the display panel.

[0143] Based on the above embodiments, another embodiment of the present application further provides a light curing method for a display panel. The light curing method can be as follows: Fig.16 As shown, the black glue layer 14 in the display panel provided in any of the above embodiments is light cured.

[0144] refer to Fig.16 , Fig.16 A schematic flow chart of a display panel photocuring method provided in an embodiment of the present application includes:

[0145] Step S11 : irradiating UV light from one side of the light emitting element 13 to photo-cure at least the first part of the glue layer 141 of the black glue layer 14 .

[0146] In step S11, light is irradiated from the top of the light emitting element 13 in the opposite direction of the third direction Z to light-cure the black glue layer 14. The light-cure process can mainly light-cure the second part of the glue layer 142.

[0147] Step S12 : irradiating with UV light from the side of the transparent substrate 11 away from the circuit layer 12 , based on the light path 15 , so as to photo-cure at least the second portion of the glue layer 142 of the black glue layer 14 .

[0148] In step S12, light is irradiated from the bottom of the light emitting element 13 along the third direction Z to light-cure the black glue layer 14. During the light-cure process, since the light emitting element 13 is not blocked, the transmittance of the UV light can reach more than 70% based on the light path 15.

[0149] In the embodiment of the present application, the light path 15 designed for the display panel provided in the above embodiment can enable the display panel to perform light curing on at least the second portion of the adhesive layer 142 based on the third direction Z, thereby improving the curing effect of the second portion of the adhesive layer 142.

[0150] In step S12, the method of irradiating the transparent substrate with UV light from the side away from the circuit layer may include: irradiating the transparent substrate 11 with UV light in a dotted area, wherein the irradiated area of ​​the UV light is the area opposite to the light emitting element 13. Since the first part of the adhesive layer 141 can be sufficiently photocured in step S11, the second part of the adhesive layer 142 can be photocured in step S12 by localized illumination corresponding to the light emitting element 13 one by one, and if a large area of ​​illumination is not required, the light energy loss can be reduced.

[0151] In other embodiments, the method of irradiating the transparent substrate 11 with UV light from the side facing away from the circuit layer may include: irradiating the transparent substrate 11 with planar UV light, and the irradiated area of ​​the UV light includes the area opposite to the light emitting element 13 and the area opposite to the gap between the light emitting elements 13. This method can utilize the light-transmitting area of ​​the metal layer 121 opposite to the first part of the adhesive layer 141 to further perform light irradiation curing on the first part of the adhesive layer 141.

[0152] Among them, the order of step S11 and step S12 can be adjusted. Step S11 can be executed first, and then step S12, or step S12 can be executed first, and then step S11. The embodiment of the present application does not limit this.

[0153] In the specification of this application, each embodiment is described in a progressive, parallel, or progressive and parallel manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. The implementation methods provided in the embodiments of this application can be combined with each other if there is no contradiction.

[0154] It should be noted that in the description of the present application, it should be understood that the description of the drawings and embodiments is illustrative rather than restrictive. The same reference numerals throughout the embodiments of the specification identify the same structure. In addition, for the sake of understanding and ease of description, the drawings may exaggerate the thickness of some layers, films, panels, regions, etc. It is also understood that when an element such as a layer, film, region, or substrate is referred to as "on" another element, the element may be directly on the other element or there may be an intermediate element. In addition, "on" refers to positioning an element on or below another element, but does not essentially refer to positioning on the upper side of another element according to the direction of gravity.

[0155] The terms "upper", "lower", "top", "bottom", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. When a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0156] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that an article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such article or device. In the absence of further restrictions, the elements defined by the sentence "comprising a ..." do not exclude the existence of other identical elements in the article or device including the above elements.

[0157] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display panel, characterized in that: include: An array substrate, the array substrate comprising: a transparent substrate; a circuit layer located on one surface of the transparent substrate; a plurality of light-emitting elements fixed on the circuit layer, the light-emitting elements being electrically connected to pixel circuits in the circuit layer; A black glue layer, the black glue layer comprising a first portion of the glue layer located between the light-emitting elements and a second portion of the glue layer located between the bottom of the light-emitting element and the circuit layer; The circuit layer has a preset light path, and the light path enables the light for curing the black glue layer to be irradiated from the transparent substrate to the second portion of the glue layer.

2. The display panel according to claim 1, characterized in that: The circuit layer includes multiple metal layers stacked in sequence; Among them, at least one of the metal layers has a light-transmitting window for forming the light-through path; in a direction perpendicular to the plane where the transparent substrate is located, the light-transmitting window in at least one of the metal layers has an overlapping portion with the second portion of the adhesive layer.

3. The display panel according to claim 2, characterized in that: The metal layers all have the light-transmitting window, and the light-transmitting window in each of the metal layers is constructed as the light-through path.

4. The display panel according to claim 2, characterized in that: In the direction from the transparent substrate to the light-emitting element, the plurality of metal layers are sequentially from the first metal layer to the Nth metal layer, where N is a positive integer greater than 1; The Nth metal layer includes a first pad and a second pad, and a first light-transmitting window is provided between the first pad and the second pad; the bottom of the light-emitting element includes a first electrode and a second electrode, the first electrode is electrically connected and fixed to the first pad, and the second electrode is electrically connected and fixed to the second pad; For the same light-emitting element, there is a first distance W11 between the first electrode and the second electrode opposite to each other in the first direction, and the first direction is parallel to the plane where the transparent substrate is located; in the first direction, there is a second distance W13 between the first pad and the second pad connecting the same light-emitting element; wherein W11>W13.

5. The display panel according to claim 4, characterized in that: The N-1th metal layer is provided with a second light-transmitting window, and in a direction perpendicular to the plane where the transparent substrate is located, the first light-transmitting window and the second light-transmitting window have an overlapping portion.

6. The display panel according to claim 5, characterized in that: In the first direction, the size of the second light-transmitting window is W14, wherein W14≠W13.

7. The display panel according to claim 6, characterized in that: W14>W13.

8. The display panel according to claim 6, characterized in that: W13>W14≥0.8·W13.

9. The display panel according to claim 4, characterized in that: A first insulating layer is provided between the Nth metal layer and the N-1th metal layer; and at least one light-transmitting protruding structure is provided on the surface of the first insulating layer in a region between the first pad and the second pad.

10. The display panel according to claim 9, characterized in that: The first insulating layer has a first refractive index n1, and the light-transmitting protruding structure has a second refractive index n2; wherein n1≠n2.

11. The display panel according to claim 4, characterized in that: A first insulating layer is provided between the Nth metal layer and the N-1th metal layer; the first insulating layer has a first refractive index n1; For the Nth metal layer, at least a side wall of the first pad facing the first light-transmitting window and at least a side wall of the second pad facing the first light-transmitting window are covered with a light-transmitting covering layer; The light-transmitting cover layer has a third refractive index n3, wherein n1≠n3.

12. The display panel according to claim 4, characterized in that: The bottom of the light emitting element has a surface microstructure at least in a region between the first electrode and the second electrode.

13. The display panel according to claim 4, characterized in that: The size of the top of the light emitting element in the first direction is W10; W10>W11; The first pad includes a first area, a second area and a third area arranged in sequence along the first direction, and the first electrode is welded and fixed to the first pad based on the second area; wherein at least one of the first area and the third area is provided with a first light-transmitting opening.

14. The display panel according to claim 4, characterized in that: The size of the top of the light emitting element in the first direction is W10; W10>W11; The second pad includes a fourth region, a fifth region and a sixth region sequentially arranged along the first direction, and the second electrode is welded and fixed to the second pad based on the fifth region; wherein at least one of the fourth region and the sixth region is provided with a second light-transmitting opening.

15. The display panel according to claim 5, characterized in that: In the second direction, the size of the second light-transmitting window is W24; the second direction is parallel to the plane where the transparent substrate is located, and perpendicular to the first direction; There is a gap between the first electrode and the second electrode, and the size of the gap in the second direction is W21; Among them, W24>W21.

16. The display panel according to claim 4, characterized in that: The N-1th metal layer is provided with a second light-transmitting window; in a direction perpendicular to the plane where the transparent substrate is located, the N-1th metal layer at least partially overlaps with the light-emitting element; In the first direction, two opposite sides of the first light-transmitting window are located between two opposite sides of the second light-transmitting window.

17. The display panel according to claim 2, characterized in that: In the direction perpendicular to the plane of the transparent substrate, the number of metal layers in the area where the circuit layer is opposite to the first part of the adhesive layer is m1, and the number of metal layers in the area where the circuit layer is opposite to the second part of the adhesive layer is m2; m1 and m2 are both natural numbers, m1>m2≥0.

18. The display panel according to claim 4, characterized in that: The pixel circuit includes a first subcircuit and a second subcircuit, the first subcircuit is connected to the light-emitting element, and the second subcircuit is connected to the first subcircuit; the first subcircuit is used to control the amplitude of the driving current provided by the light-emitting element, and the second subcircuit is used to control the pulse width of the driving current provided to the light-emitting element; the first power signal line provides a first power signal to the first subcircuit; The N-1th metal layer includes the first power signal line, and the N-1th metal layer forms a third light-transmitting window based on the gaps between adjacent first power signal lines.

19. An electronic device, characterized in that: Comprising a display panel as described in any one of claims 1-18.

20. A method for photocuring a display panel according to any one of claims 1 to 18, characterized in that: include: Irradiating with UV light from one side of the light emitting element to photo-cure at least a first portion of the black glue layer; UV light is irradiated from a side of the transparent substrate away from the circuit layer, based on the light path, so as to photo-cure at least a second portion of the black glue layer.

21. The photocuring method according to claim 20, characterized in that: The method of irradiating the transparent substrate with UV light from a side away from the circuit layer comprises: irradiating the transparent substrate with UV light in a dotted area, wherein the UV light irradiation area is opposite to the light emitting element; Alternatively, the transparent substrate is irradiated with planar UV light, and the irradiation area of ​​the UV light includes an area opposite to the light emitting elements and an area opposite to the gaps between the light emitting elements.

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