Display panel, manufacturing method thereof and display device

Abstract

The invention discloses a display panel, a manufacturing method thereof and a display device, and belongs to the technical field of display. The display panel comprises a driving backboard, and a light-emitting device, a packaging layer, an organic flat layer and a touch layer which are stacked on one side of the driving backboard. One side of the driving backboard is provided with an annular first retaining wall, the organic flat layer is located in an area defined by the first retaining wall, and the organic flat layer is located between the packaging layer and the touch control layer. The evaporation process and the packaging process may form particles with relatively large volumes on the film layer of the display panel, the particles can jack up the packaging layer, the organic flat layer formed after the packaging layer has relatively strong fluidity before curing, and the thickness of the film layer is relatively large, so that the packaging layer can be well flattened. Thus, when the touch layer is formed subsequently, it can be guaranteed that the touch wires in the touch layer are not prone to being broken, and then it can be guaranteed that the touch effect on the display panel is good.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) is a current-type organic light-emitting device. With the development of the display technology field, more and more OLED display panels have touch functions, and users can interact with OLED display panels through touch.

[0003] At present, an OLED display panel with a touch function may include: a driving backplane, a plurality of light-emitting devices located on one side of the driving backplane, an encapsulation layer for encapsulating the plurality of light-emitting devices, and a touch layer located on the side of the encapsulation layer away from the driving backplane and a protective layer covering the touch layer. The touch layer may include a first touch electrode layer, a touch insulating layer, and a second touch electrode layer stacked in a direction away from the driving backplane, and the first touch electrode layer and the second touch electrode layer include a plurality of touch wirings, and the touch wirings may enable the OLED display panel to have a touch function.

[0004] However, when forming a light-emitting device through an evaporation process and encapsulating the light-emitting device, the evaporation process and the encapsulation process may form large particles on the panel. These particles may lift up the encapsulation layer, causing the touch lines in the subsequently formed touch layer to be easily disconnected, thereby resulting in poor touch effect on the display panel. Summary of the invention

[0005] The present application provides a display panel and a manufacturing method thereof, and a display device, which can solve the problem that the touch wiring is easily disconnected due to particles, thereby causing poor touch effect on the display panel. The technical solution is as follows:

[0006] In one aspect, a display panel is provided, comprising: a driving backplane, a light-emitting device, an encapsulation layer, an organic flat layer and a touch layer;

[0007] One side of the driving back plate is provided with a first annular retaining wall;

[0008] There are multiple light-emitting devices, and the multiple light-emitting devices are all located on the same side of the driving backplane, and the multiple light-emitting devices are all distributed in the area surrounded by the first retaining wall;

[0009] The encapsulation layer is located on a side of the plurality of light-emitting devices away from the driving backplane;

[0010] The organic flat layer is located on a side of the encapsulation layer away from the driving backplane, and the organic flat layer is located in an area surrounded by the first retaining wall;

[0011] The touch control layer is located on a side of the organic planar layer away from the driving backplane.

[0012] Optionally, the touch layer includes: a first touch electrode layer, a touch insulating layer, and a second touch electrode layer stacked in a direction away from the driving backplane, and a side of the first touch electrode layer close to the driving backplane is in contact with a side of the organic planar layer away from the driving backplane.

[0013] Optionally, the organic planar layer is an organic film layer formed in the area surrounded by the first retaining wall by using an inkjet printing process.

[0014] Optionally, in a direction perpendicular to the driving backplane, the thickness of the organic planar layer ranges from 13 micrometers to 17 micrometers.

[0015] Optionally, the encapsulation layer includes: a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked in a direction away from the driving backplane;

[0016] The driving backplane further has a second blocking wall, the second blocking wall is located in the area surrounded by the first blocking wall, and the organic encapsulation layer is located in the area surrounded by the second blocking wall.

[0017] Optionally, in a direction perpendicular to the driving back plate, the first retaining wall is higher than the second retaining wall.

[0018] Optionally, the driving backplane includes: a substrate, and a plurality of organic insulating layers stacked and distributed on one side of the substrate;

[0019] Wherein, at least one organic insulating layer among the plurality of organic insulating layers comprises the first barrier wall.

[0020] Optionally, the display panel further includes: a protection layer, wherein the protection layer is located on a side of the touch layer away from the driving backplane.

[0021] In another aspect, a method for manufacturing a display panel is provided, the method comprising:

[0022] A plurality of light-emitting devices are formed on one side of the driving backplane, wherein one side of the driving backplane has a first annular retaining wall, and the plurality of light-emitting devices are located in an area surrounded by the first retaining wall;

[0023] forming an encapsulation layer on a side of the plurality of light-emitting devices away from the driving backplane;

[0024] forming an organic flat layer on a side of the encapsulation layer away from the driving backplane, and the organic flat layer is located in the area surrounded by the first retaining wall;

[0025] A touch control layer is formed on a side of the organic planar layer away from the driving backplane.

[0026] In yet another aspect, a display device is provided, comprising any one of the display panels described above.

[0027] The beneficial effects of the technical solution provided by this application include at least:

[0028] The display panel includes an organic flat layer, which is located on the side of the encapsulation layer away from the driving backplane, and the touch layer is located on the side of the organic flat layer away from the driving backplane, that is, the organic flat layer is located between the encapsulation layer and the touch layer. In the process of using the evaporation process to make the organic light-emitting layer and the second electrode in the light-emitting device, and using the encapsulation process to form the encapsulation layer, the evaporation process and the encapsulation process may form large particles on the film layer of the display panel, and these particles will lift the encapsulation layer, resulting in a lower flatness on the side of the encapsulation layer away from the driving backplane. The organic flat layer formed after the encapsulation layer has strong fluidity before curing, and is easy to level on the film layer, and the film thickness of the organic flat layer is relatively large, so the encapsulation layer can be better flattened by the organic flat layer, so that the flatness of the side of the organic flat layer away from the driving backplane is higher. In this way, in the subsequent process of forming the touch layer on the organic flat layer with higher flatness, it can be ensured that the touch wiring in the touch layer is not easy to be disconnected, and then the touch effect of the display panel can be ensured to be better, and the reliability of the display panel is effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 It is a schematic diagram of a film layer structure of a display panel provided by the related technology;

[0031] Figure 2 It is a schematic diagram of the effect of uneven film layer of a display panel provided by the related technology;

[0032] Figure 3 is a top view of a display panel provided in an embodiment of the present application;

[0033] Figure 4 yes Figure 3The schematic diagram of the film structure of the display panel at AA' is shown;

[0034] Figure 5 yes Figure 3 A schematic diagram of the film layer structure of the display panel at BB' is shown;

[0035] Figure 6 yes Figure 3 The schematic diagram of the display panel showing the effect of achieving a flat film layer at AA';

[0036] Figure 7 is a schematic diagram of a film layer structure of another display panel provided in an embodiment of the present application;

[0037] Figure 8 is a top view of a touch layer of a display panel provided in an embodiment of the present application;

[0038] Fig. 9 is a schematic diagram of a film layer structure of another display panel provided in an embodiment of the present application;

[0039] Fig.10 is a schematic diagram of the formation effect of a first retaining wall of a display panel provided in an embodiment of the present application;

[0040] Fig.11 It is a schematic diagram of the formation effect of an organic flat layer of a display panel provided in an embodiment of the present application;

[0041] Fig.12 It is a schematic diagram of the formation effect of a touch layer of a display panel provided in an embodiment of the present application. DETAILED DESCRIPTION

[0042] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below with reference to the accompanying drawings.

[0043] Please refer to Figure 1 An OLED display panel provided by the related art may include: a driving backplane 01, and a plurality of light-emitting devices 02, an encapsulation layer 03, a touch buffer layer 04, a touch layer 05, a protective layer 06 and an organic flat layer 07 stacked and arranged on one side of the driving backplane 01. The touch layer 05 includes a plurality of touch wirings, and the touch wirings can enable the OLED display panel to have a touch function.

[0044] Multiple light-emitting devices 02 can be located on one side of the driving backplane 01, and each light-emitting device 02 can be used to emit light, so that the OLED display panel can display images. The encapsulation layer 03 can be located on the side of the multiple light-emitting devices 02 away from the driving backplane 01, and is used to encapsulate the multiple light-emitting devices 02 to prevent the invasion of water and oxygen in the external environment. The light-emitting layer in the multiple light-emitting devices 02 can be formed by an evaporation process, and the encapsulation layer 03 can be formed by an encapsulation process.

[0045] like Figure 2 As shown, during the production process of the display panel, there may be impurities in the equipment used in the evaporation process and the packaging process, as well as impurities from the external environment. These impurities may form larger particles 08 in the process of forming the light-emitting layer in the multiple light-emitting devices 02 and the packaging layer 03. These particles 08 will be distributed on the film layer of the display panel. Since the film thickness of the packaging layer 03 is relatively thin and the flatness effect is poor, the formed particles 08 may lift up the packaging layer 03, thereby causing the touch layer 05 formed subsequently to have a bulge in the film layer. In the touch layer 05, the touch wiring located in the bulge part of the film layer is very easy to disconnect, resulting in touch failure in the area of ​​the display panel connected to the touch wiring, which in turn leads to poor touch effect on the display panel.

[0046] The embodiment of the present application provides a display panel that can solve the problem that the touch wiring is easily disconnected due to particles, thereby causing poor touch effect on the display panel. Figure 3 , Figure 4 and Figure 5 , Figure 3 is a top view of a display panel provided in an embodiment of the present application, Figure 4 yes Figure 3 The schematic diagram of the film structure of the display panel at AA' is shown. Figure 5 yes Figure 3 The schematic diagram of the film structure of the display panel at BB' is shown. The display panel 000 may include: a driving backplane 100, a light emitting device 200, an encapsulation layer 300, an organic planar layer 400 and a touch layer 500.

[0047] One side of the driving back plate 100 may have a first retaining wall 101, and the first retaining wall 101 may be ring-shaped. Figure 3 As shown, the display panel 000 may have a display area 00a and a non-display area 00b surrounding the display area 00a. The first retaining wall 101 may be distributed in the non-display area 00b, and the display area 00a of the display panel 000 may be distributed in the area surrounded by the first retaining wall 101.

[0048] Here, the number of the first retaining walls 101 may be one or more. In the case where the number of the first retaining walls 101 is more than one, the multiple first retaining walls 101 may be nested in sequence. For example, the number of the first retaining walls 101 is two, the first annular first retaining wall 101 surrounds the display area 00a, the second annular first retaining wall 101 may surround the first annular first retaining wall 101, and there may be a certain distance between the two first retaining walls 101.

[0049] The number of the light-emitting devices 200 may be multiple, and the multiple light-emitting devices 200 are all distributed on the same side of the driving backplane 100. Here, the multiple light-emitting devices 200 may be distributed in the display area 00a of the display panel 000, that is, the multiple light-emitting devices 200 may be distributed in the area surrounded by the first retaining wall 101. The light-emitting device 200 may include a first electrode 201, an organic light-emitting layer 202, and a second electrode 203 stacked in a direction away from the driving backplane 100, wherein the organic light-emitting layer 202 may be manufactured by an evaporation process. When corresponding voltages are applied to the first electrode 201 and the second electrode 203, respectively, the organic light-emitting layer 202 may emit light.

[0050] The encapsulation layer 300 is located on a side of the plurality of light emitting devices 200 away from the driving backplane 100 and is used to encapsulate the plurality of light emitting devices 200 to avoid the problem of failure of the organic light emitting layer 202 due to external water and oxygen entering the light emitting devices 200.

[0051] The organic planar layer 400 may be located on the side of the encapsulation layer 300 away from the driving backplane 100, and the organic planar layer 400 may be located in the area surrounded by the first retaining wall 101. Here, since the organic planar layer 400 has strong fluidity before being cured, the first retaining wall 101 may effectively prevent the organic planar layer 400 from flowing out during the formation of the organic planar layer 400.

[0052] The touch layer 500 may be located on a side of the organic planar layer 400 away from the driving backplane 100 . The touch layer 500 includes a plurality of touch wirings, and the display panel 000 may have a touch function through the touch wirings.

[0053] like Figure 6As shown, in the process of using the evaporation process to make the organic light-emitting layer 202 and the second electrode 203 in the light-emitting device 200, and using the encapsulation process to form the encapsulation layer 300, the evaporation process and the encapsulation process may form relatively large particles 700 on the film layer of the display panel 000, and these particles 700 may lift the encapsulation layer 300, resulting in a lower flatness on the side of the encapsulation layer 300 away from the driving backplane 100. However, since the organic flat layer 400 has strong fluidity before curing and is easy to level, and the film thickness of the organic flat layer 400 is relatively large, the encapsulation layer 300 can be well flattened by the organic flat layer 400, so that the flatness of the side of the organic flat layer 400 away from the driving backplane 100 is higher. In this way, in the subsequent process of forming the touch layer 500 on the organic flat layer 400 with higher flatness, it can be ensured that the touch wiring in the touch layer 500 is not easy to be disconnected, and then the touch effect of the display panel 000 can be ensured to be better, and the reliability of the display panel 000 is effectively improved.

[0054] In summary, an embodiment of the present application provides a display panel, which includes an organic flat layer, which is located on the side of the encapsulation layer away from the driving backplane, and the touch layer is located on the side of the organic flat layer away from the driving backplane, that is, the organic flat layer is located between the encapsulation layer and the touch layer. In the process of using the evaporation process to make the organic light-emitting layer and the second electrode in the light-emitting device, and using the encapsulation process to form the encapsulation layer, the evaporation process and the encapsulation process may form large particles on the film layer of the display panel. These particles will lift up the encapsulation layer, resulting in a lower flatness on the side of the encapsulation layer away from the driving backplane. The organic flat layer formed after the encapsulation layer has strong fluidity before curing, and is easy to level on the film layer, and the film thickness of the organic flat layer is relatively large. Therefore, the encapsulation layer can be better flattened by the organic flat layer, so that the flatness of the organic flat layer on the side away from the driving backplane is higher. In this way, in the subsequent process of forming a touch layer on the organic flat layer with higher flatness, it can be ensured that the touch wiring in the touch layer is not prone to disconnection, thereby ensuring a better touch effect on the display panel and effectively improving the reliability of the display panel.

[0055] For related technologies, please refer to Figure 1In order to improve the stability of the touch layer 05 in the display panel, it is necessary to set a touch buffer layer 04 between the encapsulation layer 03 and the touch layer 05, that is, the side of the touch buffer layer 04 close to the driving backplane 01 can be in contact with the side of the encapsulation layer 03 away from the driving backplane 01, and the side of the touch buffer layer 04 away from the driving backplane 01 can be in contact with the side of the touch layer 05 close to the driving backplane 01. Here, the touch buffer layer 04 has a high film bonding ability to ensure that the touch layer 05 set on the touch buffer layer 04 is not prone to film separation. And in order to improve the flatness of the light-emitting side of the display panel, it is necessary to form an organic flat layer 07 on the side of the protective layer 06 away from the driving backplane 01. Since the organic flat layer 07 has strong fluidity before curing and is easy to level, and the film thickness of the organic flat layer 07 is relatively large, the organic flat layer 07 can be used to better flatten the previously formed film layer. Therefore, the display panel in the current related art needs to include both the touch buffer layer 04 and the organic planar layer 07 , which includes a large number of film layers, resulting in a thicker display panel.

[0056] In the embodiment of the present application, Figure 7 As shown, the touch layer 500 may include: a first touch electrode layer 501, a touch insulating layer 502, and a second touch electrode layer 503 stacked in a direction away from the driving backplane 100. Among them, the side of the first touch electrode layer 501 close to the driving backplane 100 may contact the side of the organic flat layer 400 away from the driving backplane 100. At the same time, the side of the organic flat layer 400 close to the driving backplane 100 may contact the side of the encapsulation layer 300 away from the driving backplane 100. That is, the organic flat layer 400 of the display panel 000 provided in the embodiment of the present application may be located between the encapsulation layer 300 and the touch layer 500, without forming a touch buffer layer in the related art. The organic flat layer 400 has strong fluidity before curing, and the film thickness is relatively large, so the encapsulation layer 300 can be well flattened, so that the flatness of the side of the organic flat layer 400 away from the driving backplane 100 is higher. In this way, in the subsequent process of forming the touch layer 500 on the organic flat layer 400 with higher flatness, it can also be ensured that the formed film layer is relatively flat and the film layers are tightly bonded, so there is no need to form a touch buffer layer. Therefore, the film thickness of the display panel 000 can be reduced, and at the same time the process can be simplified to reduce production costs.

[0057] In the examples of this application, please refer to Figure 8One of the first touch electrode layer 501 and the second touch electrode layer 503 of the touch layer 500 may include: a plurality of first touch units 5041 and a plurality of second touch units 5042 arranged in the same layer, and a connecting electrode 5043 for connecting two adjacently distributed first touch units 5041; the other of the first touch electrode layer 501 and the second touch electrode layer 503 may include: a bridging electrode 5044 for connecting two adjacently distributed second touch units 5042.

[0058] Among them, one of the first touch control unit 5041 and the second touch control unit 5042 may be a touch control driving electrode, and the other may be a touch control sensing electrode. Through the cooperation of the touch control driving electrode and the touch control sensing electrode, the display panel 000 may have a touch control function.

[0059] It should be noted that the connecting electrode 5043 and the bridging electrode 5044 can be cross-set and insulated by the touch insulating layer 502; the touch insulating layer 502 has a plurality of vias, and the bridging electrode 5044 can electrically connect two adjacent second touch units 5042 through the vias.

[0060] It should also be noted that the first touch unit 5041 and the second touch unit 5042 are both grid-shaped electrodes with multiple grid holes. Multiple light-emitting devices 200 correspond to multiple grid holes one by one, and the orthographic projection of each light-emitting device 200 on the driving backplane 100 can be located within the orthographic projection area of ​​the corresponding grid hole on the driving backplane 100, thereby ensuring that the light emitted by the light-emitting device 200 will not be blocked by the boundary of the grid hole, thereby ensuring that the display panel 000 can display normally.

[0061] Since the first touch control unit 5041 and the second touch control unit 5042 are both grid-shaped electrodes, the touch control wiring in the touch control layer 500 may include: the first touch control unit 5041 and the second touch control unit 5042 extending and distributed in a grid shape, as well as the connecting electrode 5043 and the jumper electrode 5044. In the case where the flatness of the side of the organic flat layer 400 away from the driving backplane 100 is high, the first touch control unit 5041 and the second touch control unit 5042 extending and distributed in a grid shape, as well as the connecting electrode 5043 and the jumper electrode 5044 are not prone to disconnection.

[0062] In the embodiment of the present application, a relatively large area of ​​organic flat layer 400 needs to be formed before forming the touch layer 500. The organic flat layer 400 is an organic film layer and has strong fluidity, so it can be formed in the area surrounded by the first retaining wall 101. During the formation process, the first retaining wall 101 can block the outflow of the organic flat layer 400. The embodiment of the present application adopts an inkjet printing process to form the organic flat layer 400. The inkjet printing process is suitable for large-area processing, and can make the organic flat layer 400 achieve a better flat effect. At the same time, the cost of the inkjet printing process is low, which can effectively reduce the production cost of the display panel 000.

[0063] like Figure 6 As shown, since the volume of the particles 700 formed on the film layer by the evaporation process and the packaging process is relatively large, the organic flat layer 400 needs to have a relatively large film thickness to achieve the flattening of the film layer, thereby avoiding the film protrusion caused by the particles 700 from affecting the touch layer 500 formed subsequently. However, the film thickness of the organic flat layer 400 should not be too large. Excessive film thickness will lead to a relatively large film thickness of the entire display panel 000, which cannot meet the demand for thinness of the display panel 000. In the direction perpendicular to the driving backplane 100, the film thickness of the organic flat layer 400 is preferably 13 microns to 17 microns. For example, in the direction perpendicular to the driving backplane 100, the film thickness of the organic flat layer 400 can be 15 microns. Therefore, when the organic flat layer 400 is formed by the inkjet printing process, it is necessary to accurately control the deposition amount of the functional ink, so that the organic flat layer 400 can achieve a better flat effect without causing the film of the entire display panel 000 to be too thick.

[0064] Please refer to Figures 4 to 7 The encapsulation layer 300 of the display panel 000 may include: a first inorganic encapsulation layer 301, an organic encapsulation layer 302, and a second inorganic encapsulation layer 303 stacked in a direction away from the driving backplane 100. The encapsulation layer 300 is used to encapsulate the light-emitting device 200. The first inorganic encapsulation layer 301 and the second inorganic encapsulation layer 303 can prevent the water and oxygen in the external environment from entering the light-emitting device 200, causing the organic light-emitting layer 202 to fail. The organic encapsulation layer 302 is an organic film layer with fluidity, and has a certain flattening effect on the previously formed film layer. At the same time, the organic encapsulation layer 302 also has a certain buffering effect on the stress generated during the bending or folding of the display panel 000.

[0065] The organic encapsulation layer 302 has fluidity. In order to prevent the organic encapsulation layer 302 from flowing out during the encapsulation process, Figure 5As shown, the driving backplane 100 provided in the embodiment of the present application may have a second retaining wall 102, the second retaining wall 102 may be ring-shaped, and the organic encapsulation layer 302 may be located in the area surrounded by the second retaining wall 102, so that during the encapsulation process, the second retaining wall 102 can block the outflow of the organic encapsulation layer 302 to ensure the reliability of the encapsulation.

[0066] The second retaining wall 102 may be located in the area surrounded by the first retaining wall 101. The number of the second retaining walls 102 may be multiple, and in the case where the number of the second retaining walls 102 is multiple, the multiple second retaining walls 102 may be nested in sequence. Exemplarily, the number of the second retaining walls 102 may be two, namely, the first second retaining wall 1021 and the second second retaining wall 1022. The first second retaining wall 1021 and the second second retaining wall 1022 may be distributed in the area surrounded by the first retaining wall 101, wherein, compared with the second second retaining wall 1022, the first second retaining wall 1021 is closer to the first retaining wall 101, and there may be a certain distance between the first second retaining wall 1021 and the first retaining wall 101. The second second retaining wall 1022 may be located in the area surrounded by the first second retaining wall 1021, and there may be a certain distance between the second second retaining wall 1022 and the first second retaining wall 1021.

[0067] In the case where the driving backplane 100 has the first second barrier wall 1021 and the second second barrier wall 1022, the organic encapsulation layer 302 can be located in the area enclosed by the second barrier wall 102 which is further away from the first barrier wall 101, that is, the organic encapsulation layer 302 can be located in the area enclosed by the second second barrier wall 1022. During the encapsulation process, the second second barrier wall 1022 and the first second barrier wall 1021 can block the outflow of the organic encapsulation layer 302. At least part of the first inorganic encapsulation layer 301 and at least part of the second inorganic encapsulation layer 303 can be located outside the area enclosed by the first second barrier wall 1021, so as to better block the intrusion of water and oxygen in the external environment.

[0068] In the embodiment of the present application, the organic planar layer 400 is formed after the encapsulation layer 300, that is, compared with the organic encapsulation layer 302 in the encapsulation layer 300, the organic planar layer 400 is further away from the driving backplane 100, that is, in the direction perpendicular to the driving backplane 100, the film height of the organic planar layer 400 is greater than the film height of the organic encapsulation layer 302. It should be noted that the film height of the organic planar layer 400 refers to: in the direction perpendicular to the driving backplane 100, the distance between the side of the organic planar layer 400 away from the driving backplane 100 and the driving backplane 100; the film height of the organic encapsulation layer 302 refers to: in the direction perpendicular to the driving backplane 100, the distance between the side of the organic encapsulation layer 302 away from the driving backplane 100 and the driving backplane 100.

[0069] Since the first retaining wall 101 is used to block the outflow of the organic planar layer 400, and the second retaining wall 102 is used to block the outflow of the organic encapsulation layer 302 in the encapsulation layer 300, in the direction perpendicular to the driving backplane 100, the film height of the organic planar layer 400 is greater than the film height of the organic encapsulation layer 302. Figure 5 As shown, in the direction perpendicular to the driving backplane 100, the height H1 of the first retaining wall 101 is greater than the height H2 of the second retaining wall 102, and the height H1 of the first retaining wall 101 is at least the same as the film height of the organic flat layer 400, and the height H2 of the second retaining wall 102 is at least the same as the film height of the organic encapsulation layer 302. In this way, during the manufacturing process of the display panel 000, the first retaining wall 101 and the second retaining wall 102 can better block the outflow of the organic film layer to ensure the reliability of the product.

[0070] Please refer to Fig. 9 The driving backplane 100 may include: a substrate 103, and a plurality of organic insulating layers stacked and arranged on one side of the substrate 103. The plurality of organic insulating layers may include a second flat layer 109, a first flat layer 110, and a pixel definition layer 111, that is, the second flat layer 109, the first flat layer 110, and the pixel definition layer 111 may all be organic film layers.

[0071] For example, the driving backplane 100 may further include: a buffer layer 104 , a gate insulating layer 105 , a thin film transistor 106 , an interlayer dielectric layer 107 , and a conductive layer 108 , which are stacked on the substrate 103 in a direction vertically and away from the substrate 103 .

[0072] The thin film transistor 106 may include a gate electrode 1061, a source electrode 1062, a drain electrode 1063, and an active layer pattern 1064. One of the source electrode 1062 and the drain electrode 1063 may be electrically connected to the data line, and the other of the source electrode 1062 and the drain electrode 1063 may be electrically connected to the conductive layer 108. The conductive layer 108 may be electrically connected to the first electrode 201 in the light emitting device 200, so that the source electrode 1062 or the drain electrode 1063 may be electrically connected to the first electrode 201. In the embodiment of the present application, the drain electrode 1063 may be electrically connected to the data line, and the source electrode 1062 may be electrically connected to the conductive layer 108.

[0073] The second flat layer 109 is formed after the thin film transistor 106 and the interlayer dielectric layer 107, and can flatten the film layer. The first flat layer 110 is located on the side of the second flat layer 109 away from the substrate 103, and can further flatten the film layer, providing a relatively flat film surface for the subsequent formation of the light-emitting device 200. The pixel definition layer 111 can be located on the side of the first flat layer 110 away from the substrate 103, and the pixel definition layer 111 has a plurality of pixel openings, and a plurality of light-emitting devices 200 can be located in the plurality of pixel openings.

[0074] Optionally, the material of the pixel definition layer 111 may include: at least one selected from polymers based on polymethyl methacrylate and polystyrene, polymers based on phenol groups and derivatives, acrylic-based polymers, paraxylene-based polymers, aromatic ether-based polymers, amide-based polymers, fluoride-based polymers, paraxylene-based polymers and polymers of vinyl alcohol.

[0075] The driving backplane 100 may have a first retaining wall 101, and the first retaining wall 101 may be annular and distributed around the driving backplane 100. The first retaining wall 101 may be at least one organic insulating layer among a plurality of organic insulating layers, that is, at least one of the second flat layer 109, the first flat layer 110, and the pixel definition layer 111 may be used to form the first retaining wall 101. The driving backplane 100 may also have a second retaining wall 102, and the second retaining wall 102 may be located in the area surrounded by the first retaining wall 101. The second retaining wall 102 may also be at least one organic insulating layer among a plurality of organic insulating layers, that is, at least one of the second flat layer 109, the first flat layer 110, and the pixel definition layer 111 may be used to form the second retaining wall 102.

[0076] Please refer to Figure 4 , Figure 6 , Figure 7 and Fig. 9 The display panel 000 may further include a protection layer 600 . The protection layer 600 may be located on a side of the touch layer 500 away from the driving backplane 100 , so as to protect the touch layer 500 .

[0077] Please refer to Figure 7 and Fig. 9The touch layer 500 may include a first touch electrode layer 501, a second touch electrode layer 503, and a touch insulating layer 502 located therebetween. The side of the protective layer 600 close to the driving backplane 100 may contact the side of the second touch electrode layer 503 away from the driving backplane 100, so that the protective layer 600 can protect the touch layer 500 and prevent the first touch electrode layer 501 and the second touch electrode layer 503 from being exposed to the outside and oxidized by air. At the same time, the protective layer 600 is an organic film layer with a certain fluidity, but the fluidity is poor. Therefore, the protective layer 600 can also achieve the flattening of the film layer, and there is no need to set a retaining wall to block the outflow of the protective layer 600.

[0078] Since the organic planar layer 400 is located between the encapsulation layer 300 and the touch layer 500, the organic planar layer 400 can well planarize the previously formed film layers such as the encapsulation layer 300, and then the touch layer 500 and the protective layer 600 are formed, and the protective layer 600 can play a certain flattening role. Therefore, the entire film layer of the display panel 000 can achieve a good flattening effect, so that the problem of film layer depression causing the appearance brightness difference will not be formed.

[0079] In summary, an embodiment of the present application provides a display panel, which includes an organic flat layer, which is located on the side of the encapsulation layer away from the driving backplane, and the touch layer is located on the side of the organic flat layer away from the driving backplane, that is, the organic flat layer is located between the encapsulation layer and the touch layer. In the process of using the evaporation process to make the organic light-emitting layer and the second electrode in the light-emitting device, and using the encapsulation process to form the encapsulation layer, the evaporation process and the encapsulation process may form large particles on the film layer of the display panel. These particles will lift up the encapsulation layer, resulting in a lower flatness on the side of the encapsulation layer away from the driving backplane. The organic flat layer formed after the encapsulation layer has strong fluidity before curing, and is easy to level on the film layer, and the film thickness of the organic flat layer is relatively large. Therefore, the encapsulation layer can be better flattened by the organic flat layer, so that the flatness of the organic flat layer on the side away from the driving backplane is higher. In this way, in the subsequent process of forming a touch layer on the organic flat layer with higher flatness, it can be ensured that the touch wiring in the touch layer is not prone to disconnection, thereby ensuring a better touch effect on the display panel and effectively improving the reliability of the display panel.

[0080] The embodiment of the present application also provides a method for manufacturing a display panel, which is used to manufacture display panel 000. The method for manufacturing a display panel may include: forming a plurality of light-emitting devices on one side of a driving backplane, wherein one side of the driving backplane has a first annular retaining wall, and the plurality of light-emitting devices are located in the area surrounded by the first retaining wall; forming an encapsulation layer on the side of the plurality of light-emitting devices away from the driving backplane; forming an organic flat layer on the side of the encapsulation layer away from the driving backplane, and the organic flat layer is located in the area surrounded by the first retaining wall; forming a touch layer on the side of the organic flat layer away from the driving backplane. The following embodiments will describe in detail the various steps in the method for manufacturing a display panel:

[0081] Step S101: providing a driving back plate having a first annular retaining wall.

[0082] In the examples of this application, please refer to Figure 5 The driving back plate 100 may have an annular first retaining wall 101, and the first retaining wall 101 may be distributed around the driving back plate 100. Please refer to Fig. 9 The driving backplane 100 may include a substrate 103 and a plurality of organic insulating layers stacked on one side of the substrate 103. The second flat layer 109, the first flat layer 110 and the pixel definition layer 111 may all be organic insulating layers, and the first retaining wall 101 may be at least one of the plurality of organic insulating layers. Fig.10 The driving backplane 100 may also have a second retaining wall 102, and the second retaining wall 102 may also be at least one organic insulating layer among the multiple organic insulating layers. The second retaining wall 102 may be located in the area surrounded by the first retaining wall 101, and in the direction perpendicular to the driving backplane 100, the first retaining wall 101 is higher than the second retaining wall 102.

[0083] Step S102: forming a plurality of light-emitting devices on one side of the driving backplane.

[0084] In the examples of this application, refer to Fig. 9 , multiple light-emitting devices 200 are located on the same side of the driving backplane 100, and multiple light-emitting devices 200 are located in the area surrounded by the first barrier wall 101. The pixel definition layer 111 has multiple pixel openings, and multiple light-emitting devices 200 can be located in multiple pixel openings. The light-emitting device 200 may include a first electrode 201, an organic light-emitting layer 202, and a second electrode 203 stacked in a direction away from the driving backplane 100.

[0085] For example, forming a plurality of light emitting devices 200 on one side of the driving backplane 100 may include the following process:

[0086] First, a first electrode 201 is formed on one side of the driving backplane 100. A first conductive film is formed on the driving backplane 100, and a patterning process is performed on the first conductive film to form the first electrode 201. The patterning process may include: photoresist coating, exposure, development, etching, and photoresist stripping.

[0087] Next, a pixel definition layer 111 is formed on one side of the driving backplane 100. A pixel definition film is formed on the driving backplane 100 formed with the first electrode 201, and a patterning process is performed on the pixel definition film to form the pixel definition layer 111. The patterning process may include: photoresist coating, exposure, development, etching, and photoresist stripping.

[0088] Then, an organic light emitting layer 202 is formed on the first electrode 201. On the driving backplane 100 formed with the first electrode 201 and the pixel definition layer 111, the organic light emitting layer 202 is formed by an evaporation process.

[0089] Finally, the second electrode 203 is formed on the organic light emitting layer 202. The second electrode 203 is formed on the substrate 100 on which the organic light emitting layer 202 is formed by an evaporation process.

[0090] Step S103: forming a packaging layer on a side of the plurality of light-emitting devices away from the driving backplane.

[0091] In the examples of this application, refer to Fig. 9 The encapsulation layer 300 may include: a first inorganic encapsulation layer 301, an organic encapsulation layer 302, and a second inorganic encapsulation layer 303 stacked in a direction away from the driving backplane 100. The organic encapsulation layer 302 is located in the area surrounded by the second retaining wall 102, which can prevent the organic encapsulation layer 302 from flowing out. The encapsulation layer 300 is formed as follows:

[0092] First, a first inorganic encapsulation layer 301 is formed by an encapsulation process on the side of the second electrode 203 away from the driving backplane 100. Then, an organic encapsulation layer 302 is formed by an inkjet printing process on the side of the first inorganic encapsulation layer 301 away from the driving backplane 100. Finally, a second inorganic encapsulation layer 303 is formed by an encapsulation process on the side of the organic encapsulation layer 302 away from the driving backplane 100.

[0093] Step S104 , forming an organic planar layer on a side of the encapsulation layer away from the driving backplane.

[0094] In the embodiment of the present application, the organic planar layer 400 is located in the area surrounded by the first retaining wall 101. The organic planar layer 400 is an organic film layer with strong fluidity, so the first retaining wall 101 can block the outflow of the organic planar layer 400. In order to achieve a better planarization effect, the film thickness of the organic planar layer 400 is preferably 13 microns to 17 microns.

[0095] For the formation effect diagram of the organic planar layer 400, please refer to Fig.11 The formation process of the organic planar layer 400 is as follows: on the side of the second inorganic encapsulation layer 303 away from the driving backplane 100 , the organic planar layer 400 is formed in the area surrounded by the first barrier wall 101 by an inkjet printing process.

[0096] Step S105 , forming a touch layer on a side of the organic planar layer away from the driving backplane.

[0097] Please refer to Figure 7 and Fig. 9 The touch layer 500 may include: a first touch electrode layer 501, a touch insulating layer 502, and a second touch electrode layer 503 stacked in a direction away from the driving backplane 100. The first touch electrode layer 501 is close to the driving backplane 100 and is in contact with the side of the organic flat layer 400 away from the driving backplane 100. The touch layer 500 includes a plurality of touch lines, and some of the touch lines may be distributed in a grid shape. The formation effect diagram of the touch layer 500 is shown in FIG. Fig.12 As shown, the formation process of the touch layer 500 is as follows:

[0098] First, a first touch electrode layer 501 is formed on the side of the organic planar layer 400 away from the driving backplane 100. Then, a touch insulating layer 502 is covered on the side of the first touch electrode layer 501 away from the driving backplane 100. Finally, a second touch electrode layer 503 is formed on the side of the touch insulating layer 502 away from the driving backplane 100.

[0099] Step S106 , forming a protection layer on a side of the touch layer away from the driving back plate.

[0100] A protective layer 600 is formed on the side of the second touch electrode layer 503 away from the driving backplane 100. The side of the protective layer 600 close to the driving backplane 100 is in contact with the side of the second touch electrode layer 503 away from the driving backplane 100, which can prevent the first touch electrode layer 501 and the second touch electrode layer 503 from being exposed to the outside and oxidized by air. At the same time, the protective layer 600 can also play a certain flattening role.

[0101] In summary, the embodiment of the present application provides a method for manufacturing a display panel, wherein an organic flat layer is formed on the side of the encapsulation layer away from the driving backplane, and a touch layer is formed on the side of the organic flat layer away from the driving backplane, that is, the organic flat layer is formed between the encapsulation layer and the touch layer. In the process of using the evaporation process to make the organic light-emitting layer and the second electrode in the light-emitting device, and using the encapsulation process to form the encapsulation layer, the evaporation process and the encapsulation process may form large particles on the film layer of the display panel, and these particles will lift the encapsulation layer, resulting in a lower flatness on the side of the encapsulation layer away from the driving backplane. The organic flat layer formed after the encapsulation layer has strong fluidity before curing, and is easy to level on the film layer, and the film thickness of the organic flat layer is relatively large, so the encapsulation layer can be better flattened by the organic flat layer, so that the flatness of the side of the organic flat layer away from the driving backplane is higher. In this way, in the subsequent process of forming the touch layer on the organic flat layer with higher flatness, it can be ensured that the touch wiring in the touch layer is not easy to be disconnected, and then the touch effect of the display panel can be ensured to be better, and the reliability of the display panel is effectively improved.

[0102] The embodiment of the present application also provides a display device, which can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, etc. The display device can include any of the above display panels 000, and the display panel 000 can be electrically connected to a power supply component to form a display device with a touch function.

[0103] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0104] In the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0105] The above description is only an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: include: Driving backplane, light-emitting device, encapsulation layer, organic flat layer and touch layer; One side of the driving back plate is provided with a first annular retaining wall; There are multiple light-emitting devices, and the multiple light-emitting devices are all located on the same side of the driving backplane, and the multiple light-emitting devices are all distributed in the area surrounded by the first retaining wall; The encapsulation layer is located on a side of the plurality of light-emitting devices away from the driving backplane; The organic flat layer is located on a side of the encapsulation layer away from the driving backplane, and the organic flat layer is located in an area surrounded by the first barrier wall; The touch control layer is located on a side of the organic planar layer away from the driving backplane.

2. The display panel according to claim 1, characterized in that: The touch layer includes: a first touch electrode layer, a touch insulating layer, and a second touch electrode layer stacked in a direction away from the driving backplane, and a side of the first touch electrode layer close to the driving backplane contacts a side of the organic planar layer away from the driving backplane.

3. The display panel according to claim 1, characterized in that: The organic planar layer is an organic film layer formed in the area surrounded by the first retaining wall by using an inkjet printing process.

4. The display panel according to claim 3, characterized in that: In a direction perpendicular to the driving backplane, the thickness of the organic planar layer ranges from 13 micrometers to 17 micrometers.

5. The display panel according to any one of claims 1 to 4, characterized in that: The encapsulation layer comprises: a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked in a direction away from the driving backplane; The driving backplane further has a second blocking wall, the second blocking wall is located in the area surrounded by the first blocking wall, and the organic encapsulation layer is located in the area surrounded by the second blocking wall.

6. The display panel according to claim 5, characterized in that: In a direction perpendicular to the driving back plate, the first blocking wall is higher than the second blocking wall.

7. The display panel according to any one of claims 1 to 4, characterized in that: The driving backplane comprises: a substrate, and a plurality of organic insulating layers stacked and distributed on one side of the substrate; Wherein, at least one organic insulating layer among the plurality of organic insulating layers comprises the first barrier wall.

8. The display panel according to any one of claims 1 to 4, characterized in that: The display panel further includes: a protection layer, wherein the protection layer is located on a side of the touch control layer away from the driving backplane.

9. A method for manufacturing a display panel, characterized in that: The method comprises: A plurality of light-emitting devices are formed on one side of the driving backplane, wherein one side of the driving backplane has a first annular retaining wall, and the plurality of light-emitting devices are located in an area surrounded by the first retaining wall; forming an encapsulation layer on a side of the plurality of light-emitting devices away from the driving backplane; forming an organic flat layer on a side of the encapsulation layer away from the driving backplane, and the organic flat layer is located in the area surrounded by the first retaining wall; A touch control layer is formed on a side of the organic planar layer away from the driving backplane.

10. A display device, characterized in that: A display panel comprising any one of claims 1 to 8.

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