Substrate holder, plating apparatus, and method for positioning a substrate

Abstract

The present disclosure provides a substrate holder in which a center pin does not excessively press a substrate to a center side of a design position even when a first holder deviates from the design position relative to a second holder at the time of positioning the substrate. The substrate holder according to the present disclosure has a first holder and a second holder, the second holder has a positioning member for positioning a substrate at a prescribed position, and a stopper, the positioning member has a center pin that is movable between a first position and a second position, and is configured to contact a peripheral edge portion of the substrate and position the substrate at the prescribed position when the center pin moves from the second position to the first position, the first holder has a driving member configured to apply a force to the center pin toward the first position when the substrate is held by the first holder and the second holder, and the stopper is configured to contact the center pin and stop the center pin at the first position.

Description

Technical Field

[0001] This invention relates to a substrate holder, a plating apparatus, and a method for positioning a substrate. Background Technology

[0002] A plating apparatus is used to form a metal thin film on the surface of a substrate. In plating apparatuses, a substrate holder is sometimes used to hold substrates such as semiconductor wafers that can be easily loaded and unloaded. Then, in the plating apparatus, the substrate held by the substrate holder is immersed in a plating solution and a voltage is applied to the substrate, thereby plating the surface of the substrate.

[0003] Patent Document 1 describes an example of a substrate holder. As shown in Figure 15, Patent Document 1 discloses a substrate holder having a first holding member 31 and a second holding member 32 that clamps and holds a substrate Wf together with the first holding member 31. The second holding member 32 has a positioning member 70 for positioning the substrate Wf in a predetermined position. The first holding member 31 has a protrusion 90. Furthermore, when the substrate Wf is clamped and held by the first holding member 31 and the second holding member 32, the protrusion 90 contacts the positioning member 70, causing the positioning member 70 to move to a first position. As a result, the positioning member 70 contacts the substrate Wf and positions the substrate Wf.

[0004] Furthermore, as shown in FIG14, the second holding member 32 has a plurality of power supply contacts 50 for contacting the outer periphery of the substrate Wf and supplying power to the substrate Wf. Thus, the substrate holder of Patent Document 1 can supply power to the substrate Wf via the power supply contacts 50.

[0005] Patent Document 1: Japanese Patent Application Publication No. 2018-9215

[0006] As described above, in the substrate holder 30 of Patent Document 1, the first holding member 31 and the second holding member 32 hold the substrate Wf in a clamping manner. That is, the first holding member 31 and the second holding member 32 hold the substrate Wf in a mutually engaging manner. Typically, a gap is provided so that the two members do not interfere with each other in order to engage the two members. Therefore, the first holding member 31 can be offset from the designed position relative to the second holding member 32 by a certain amount of the gap.

[0007] Furthermore, as described above, in the substrate holder 30 of Patent Document 1, the protrusion 90 of the first holding member 31 contacts the positioning member 70 of the second holding member 32, thereby causing the positioning member 70 to move. Therefore, during substrate Wf positioning, if the first holding member 31 deviates from its designed position relative to the second holding member 32 due to the gap between the first holding member 31 and the second holding member 32, there is a risk that the protrusion 90 may excessively press the positioning member 70, causing the positioning member 70 to move closer to the center of the substrate Wf than its designed position. As a result, the positioning member 70 excessively presses the substrate Wf closer to the center than its designed position, and there is a risk that the position of the positioned substrate Wf relative to the second holding member 32 may change. In other words, there is a risk that the substrate Wf may deviate from its intended position relative to the second holding member 32.

[0008] Furthermore, in this case, there is a risk that the power supply contact 50 of the second holding member 32 may fail to make contact with the designated portion of the substrate Wf due to the deviation of the substrate Wf. As a result, there is a risk of malfunctions in the power supply to the substrate Wf.

[0009] For these reasons, there is a requirement for a substrate holder in which the positioning member 70 does not excessively press the substrate Wf to a position that is closer to the center than the designed position, even if the first holding member 31 deviates from the designed position relative to the second holding member 32 when positioning the substrate Wf. Summary of the Invention

[0010] Therefore, in view of the above-mentioned issues, one of the objectives of this disclosure is to provide a substrate holder, plating apparatus, and substrate positioning method that, when positioning a substrate, prevents the center pin (positioning member 70) from excessively pressing the substrate (substrate Wf) to the center side of the design position even when the first retainer (first retaining member 31) deviates from the design position relative to the second retainer (second retaining member 32).

[0011] One embodiment of the substrate holder includes: a first holding member and a second holding member that clamps and holds the substrate together with the first holding member. The second holding member includes: a positioning member for positioning the substrate at a predetermined position and a limiter. The positioning member has a central pin that can move between a first position and a second position, and is configured such that when the central pin moves from the second position to the first position, the central pin contacts the periphery of the substrate and positions the substrate at the predetermined position. The first holding member has a driving member that is configured to apply force to the central pin toward the first position when the substrate is held by the first holding member and the second holding member. The limiter is configured to contact the central pin and stop the central pin at the first position.

[0012] One embodiment of the plating apparatus is a plating apparatus comprising: a plating tank configured to contain plating liquid, the aforementioned substrate holder, and a lifting mechanism configured to raise and lower the substrate holder. The substrate holder is configured to hold the substrate with the plating surface facing downward. The second holder is a support mechanism configured to support the outer periphery of the plating surface of the substrate. The first holder is a back plate assembly disposed on the back side of the plating surface of the substrate and configured to clamp the substrate together with the support mechanism.

[0013] One embodiment of the substrate positioning method is a substrate positioning method using the substrate holder described above. The method includes the following steps: a step in which the first holder and the second holder clamp and hold the substrate; a step in which the driving member moves the center pin from the second position to the first position; a step in which the center pin positions the substrate at the predetermined position; and a step in which the limiter contacts the center pin and stops the center pin at the first position. Attached Figure Description

[0014] Figure 1 This is a perspective view showing the overall structure of the plating apparatus of this embodiment.

[0015] Figure 2 This is a top view showing the overall structure of the plating apparatus of this embodiment.

[0016] Figure 3 This is a longitudinal sectional view schematically illustrating the structure of the plating module in this embodiment.

[0017] Figure 4 This is a perspective view schematically illustrating the structure of the substrate holder in this embodiment.

[0018] Figure 5 This is a perspective view schematically shown by enlarging a portion of the substrate holder of this embodiment.

[0019] Figure 6 This is a top view of the support mechanism of the substrate holder in this embodiment.

[0020] Figure 7 This is a perspective view of the support mechanism of the substrate holder in this embodiment.

[0021] Figure 8 This is a perspective view of the positioning component in this embodiment.

[0022] Figure 9 This is a perspective view schematically shown by enlarging a portion of the substrate holder of this embodiment.

[0023] Figure 10 This is a schematic cross-sectional view showing an enlarged portion of the substrate holder of this embodiment.

[0024] Figure 11 This is a schematic cross-sectional view showing an enlarged portion of the substrate holder of this embodiment. Detailed Implementation

[0025] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings described below, the same or equivalent constituent elements are labeled with the same reference numerals and repeated descriptions are omitted.

[0026] <Overall Structure of the Plating Equipment>

[0027] Figure 1 This is a perspective view showing the overall structure of the plating apparatus of this embodiment. Figure 2 This is a top view showing the overall structure of the plating apparatus of this embodiment. (e.g.) Figure 1 , 2 As shown, the plating apparatus 1000 includes: a loading port 100, a handling robot 110, an alignment device 120, a pre-wetting module 200, a pre-immersion module 300, a plating module 400, a cleaning module 500, a rotary dryer 600, a handling device 700, and a control module 800.

[0028] Loading ports 100 are modules used to load substrates stored in FOUP boxes (not shown) into the plating apparatus 1000, or to remove substrates from the plating apparatus 1000 into the boxes. In this embodiment, four loading ports 100 are arranged side by side in the horizontal direction, but the number and arrangement of loading ports 100 are arbitrary. The handling robot 110 is a robot for handling substrates, configured to transfer substrates between the loading ports 100, the alignment device 120, the pre-wetting module 200, and the rotary dryer 600. When transferring substrates between the handling robot 110 and the handling device 700, the transfer of substrates can be performed via a temporary placement table (not shown).

[0029] Aligner 120 is a module used to align the orientation plane, notch, and other positions of the substrate with a predetermined direction. In this embodiment, two alignment devices 120 are arranged side by side in the horizontal direction, but the number and arrangement of alignment devices 120 are arbitrary. Pre-wetting module 200 uses a treatment liquid such as pure water or degassed water to wet the substrate surface to be plated before plating, thereby replacing the air inside the pattern formed on the substrate surface with the treatment liquid. Pre-wetting module 200 is configured to perform a pre-wetting process, which facilitates the supply of plating liquid to the inside of the pattern by replacing the treatment liquid inside the pattern with plating liquid during plating. In this embodiment, two pre-wetting modules 200 are arranged side by side in the vertical direction, but the number and arrangement of pre-wetting modules 200 are arbitrary.

[0030] The pre-impregnation module 300 is configured to perform a pre-impregnation process, which involves, for example, etching away high-resistivity oxide films such as those present on the surface of the seed layer formed on the substrate to be plated before plating with a treatment solution such as sulfuric acid or hydrochloric acid, and cleaning or activating the surface of the substrate to be plated. In this embodiment, two pre-impregnation modules 300 are arranged side by side in the vertical direction, but the number and arrangement of the pre-impregnation modules 300 are arbitrary. The plating module 400 performs the plating process on the substrate. In this embodiment, there are two sets of twelve plating modules 400, three arranged side by side in the vertical direction and four arranged side by side in the horizontal direction, for a total of twenty-four plating modules 400, but the number and arrangement of the plating modules 400 are arbitrary.

[0031] The cleaning module 500 is configured to clean the substrate to remove residual plating solution or the like after plating. In this embodiment, two cleaning modules 500 are arranged side-by-side in the vertical direction, but the number and arrangement of the cleaning modules 500 are arbitrary. The rotary dryer 600 is a module for rotating and drying the cleaned substrate at high speed. In this embodiment, two rotary dryers are arranged side-by-side in the vertical direction, but the number and arrangement of the rotary dryers are arbitrary. The conveying device 700 is a device for conveying the substrate between multiple modules within the plating apparatus 1000. The control module 800 is configured to control multiple modules of the plating apparatus 1000, and can be configured, for example, by a general-purpose computer or a dedicated computer equipped with an input / output interface for the operator.

[0032] An example of a series of plating processes based on the plating apparatus 1000 will be described. First, a substrate stored in a cassette is moved into the loading port 100. Next, a transport robot 110 removes the substrate from the cassette in the loading port 100 and transports the substrate to the aligner 120. The aligner 120 aligns the orientation plane, notches, and other positions of the substrate with a predetermined direction. The transport robot 110 then transfers the substrate, aligned by the aligner 120, to the pre-wetting module 200.

[0033] The pre-humidification module 200 performs a pre-humidification treatment on the substrate. The transport device 700 transports the pre-humidified substrate to the pre-impregnation module 300. The pre-impregnation module 300 performs a pre-impregnation treatment on the substrate. The transport device 700 transports the pre-impregnation treated substrate to the plating module 400. The plating module 400 performs a plating treatment on the substrate.

[0034] The transport device 700 transports the plated substrate to the cleaning module 500. The cleaning module 500 cleans the substrate. The transport device 700 then transports the cleaned substrate to the rotary dryer 600. The rotary dryer 600 dries the substrate. The transport robot 110 receives the substrate from the rotary dryer 600 and transports the dried substrate to a cassette in the loading port 100. Finally, the cassette containing the substrate is removed from the loading port 100.

[0035] <Structure of the plating module>

[0036] Next, the structure of the plating module 400 will be described. Since the twenty-four plating modules 400 in this embodiment have the same structure, only one plating module 400 will be described. Figure 3 This is a schematic longitudinal sectional view illustrating the structure of the plating module 400. (See attached image.) Figure 3 As shown, the plating module 400 includes a plating tank 410 for containing plating solution. The plating module 400 includes a diaphragm 420 that divides the interior of the plating tank 410 vertically. The interior of the plating tank 410 is divided into a cathode region 422 and an anode region 424 by the diaphragm 420. The cathode region 422 and the anode region 424 are respectively filled with plating solution. An anode 430 is provided on the bottom surface of the plating tank 410 in the anode region 424. An impedance element 450 is disposed opposite the diaphragm 420 in the cathode region 422. The impedance element 450 is a component for achieving uniform plating treatment on the plated surface (processed surface) Wf-a of the substrate Wf, and is composed of a plate-shaped component with many holes.

[0037] Additionally, the plating module 400 includes a substrate holder 440 for holding the substrate Wf with the plating surface Wf-a facing downwards. The plating module 400 also includes a lifting mechanism 442 for raising and lowering the substrate holder 440. The lifting mechanism 442 can be implemented, for example, by a known mechanism such as a motor. The plating module 400 is configured to use the lifting mechanism 442 to immerse the substrate Wf in the plating solution of the cathode region 422, and apply a voltage between the anode 430 and the substrate Wf, thereby performing a plating process on the plating surface Wf-a of the substrate Wf.

[0038] Additionally, the plating module 400 includes a rotation mechanism 446 for rotating the substrate holder 440 so that the substrate Wf rotates about an imaginary axis of rotation that extends vertically through the center of the plating surface Wf-a. The rotation mechanism 446 can be implemented, for example, by a known mechanism such as a motor.

[0039] <Structure of the substrate holder>

[0040] Next, details of the substrate holder 440 in this embodiment will be described. Figure 4 This is a perspective view schematically illustrating the structure of the substrate holder in this embodiment. Figure 5 This is a perspective view schematically shown by enlarging a portion of the substrate holder of this embodiment.

[0041] like Figure 4 and Figure 5 As shown, the substrate holder 440 includes: a support mechanism (second holder or first holder) 460 for supporting the outer periphery of the plated surface Wf-a of the substrate Wf; a back plate assembly (first holder or second holder) 470 for holding the substrate Wf; and a pivot 448 extending vertically upward from the back plate assembly 470.

[0042] The backplate assembly 470 includes a circular floating plate 472 for clamping the substrate Wf together with the support mechanism 460. The floating plate 472 is disposed on the back side of the plated surface Wf-a of the substrate Wf. In addition, the backplate assembly 470 includes: a floating mechanism 490 for applying force to the floating plate 472 in a direction away from the back side of the substrate Wf; and a pressing mechanism 480 for pressing the floating plate 472 against the force based on the floating mechanism 490 onto the back side of the substrate Wf.

[0043] The pressing mechanism 480 includes a circular plate-shaped back plate 474 disposed above the float 472, and a flow path 476 formed inside the back plate 474. The flow path 476 includes a first flow path 476-1 extending radially from the center of the back plate 474 toward its outer periphery, and a second flow path 476-2 extending vertically from the first flow path 476-1 toward the lower surface of the back plate 474. The pressing mechanism 480 includes a diaphragm 484 disposed in the second flow path 476-2. The diaphragm 484 is a thin film-shaped component. The outer periphery of the diaphragm 484 is fixed to the lower surface of the back plate 474 by a fixing member 483. The pressing mechanism 480 includes a rod 482 disposed between the diaphragm 484 and the float 472 as a pressing member. The lower surface of rod 482 is fixed to float plate 472 by bolt 481, and the upper surface of rod 482 is in contact with the lower surface of diaphragm 484. A cover 485 covers the upper part of rod 482, clamping the diaphragm 484. The central portion of diaphragm 484 is clamped by cover 485 and rod 482. Multiple diaphragms 484, rods 482, and covers 485 are arranged along the circumferential direction of backplate assembly 470. Furthermore, in this embodiment, an example is shown where rod 482, a component different from float plate 472, is fixed to the upper surface of float plate 472, but this is not a limitation; for example, a protrusion may be formed along the circumferential direction on the upper surface of float plate 472. In this case, the protrusion becomes a pressing member with the same function as rod 482.

[0044] The pressing mechanism 480 includes a fluid source 488 for supplying fluid to the diaphragm 484. The fluid can be a gas such as air or a liquid such as water. A flow path 449 extending vertically is formed on the rotating shaft 448, and the fluid source 488 is connected to the upper end of the flow path 449. The lower end of the flow path 449 is connected to a first flow path 476-1 formed on the back plate 474. The first flow path 476-1 extends radially from the center of the back plate 474 and communicates with the upper surface of the cover 485 via a second flow path 476-2. The fluid source 488 supplies fluid to the diaphragm 484 via the flow paths 449 and 476. In this way, the cover 485 and the rod 482 are pressed downward, thereby pressing the float 472 downward.

[0045] The support mechanism 460 includes an annular support member 462 for supporting the outer periphery of the plated surface Wf-a of the substrate Wf. The support member 462 has a flange 462a protruding from the outer periphery of the lower surface of the backplate assembly 470. An annular sealing member 464 is disposed above the flange 462a. The sealing member 464 is an elastic member. The support member 462 supports the outer periphery of the plated surface Wf-a of the substrate Wf via the sealing member 464. The substrate Wf is clamped by the sealing member 464 and the float plate 472, thereby sealing the support member 462 and the substrate Wf. The sealing member 464 is elastic, and therefore its thickness α changes as it is crushed in response to the pressing force of the pressing mechanism 480 on the substrate Wf.

[0046] The support mechanism 460 includes an annular clamp 466 held in place by the support member 462. The clamp 466 allows the backplate assembly 470 to move up and down relative to the support mechanism 460 when the substrate Wf is placed / removed from the substrate holder 440. Furthermore, the clamp 466 restricts the upward movement of the backplate 474 (away from the back surface of the substrate Wf) when fluid is supplied from the fluid source 488 to the diaphragm 484. This point will be explained below.

[0047] The backplate assembly 470 includes a sliding ring 478 annularly disposed on the outer periphery of the upper surface of the backplate 474. The sliding ring 478 is movable independently of the backplate 474 in the circumferential direction. The backplate assembly 470 includes a sliding plate 479 protruding from the sliding ring 478 toward the clamp 466.

[0048] On the other hand, the clamp 466 has a key-shaped notch 466d formed on the surface opposite to the sliding ring 478. The key-shaped notch 466d has: a first groove 466a, extending vertically so that the sliding plate 479 can be raised and lowered; and a second groove 466b, communicating with the first groove 466a and extending along the circumferential direction of the clamp 466. An abutment surface 466c is formed on the upper surface of the second groove 466b, which abuts against the upper surface of the sliding plate 479, which moves with the upward movement of the back plate 474, when fluid is supplied from the fluid source 488 to the diaphragm 484. Multiple sliding plates 479 and notches 466d are provided along the circumferential direction of the substrate holder 440.

[0049] When the substrate Wf is placed onto the substrate holder 440, the backplate assembly 470 is positioned above the support mechanism 460. When the substrate Wf is placed on the support mechanism 460 in this state, the circumferential position of the sliding plate 479 is aligned with the first groove 466a, thereby allowing the backplate assembly 470 to descend relative to the support mechanism 460. After the backplate assembly 470 is descended, the sliding ring 478 is rotated circumferentially, thereby engaging the sliding plate 479 into the second groove 466b. As a result, the sliding plate 479 becomes opposed to the abutment surface 466c, thus restricting the upward movement of the backplate assembly 470.

[0050] The floating mechanism 490 includes an axis 492 extending upward from the float 472 through a through hole 474a in the back plate 474. The lower end of the axis 492 is fixed to the float 472. The floating mechanism 490 includes a flange 495 mounted on the axis 492, which is located above the back plate 474. The flange 495 is mounted on the upper end of the axis 492 by bolts 493. The floating mechanism 490 includes a guide 494 disposed in the through hole 474a. The guide 494 has a hole slightly larger than the outer diameter of the axis 492 and is mounted on the upper end of the through hole 474a. The guide 494 is configured to guide the movement of the axis 492 in the lifting direction. By providing the guide 494, radial positional offset between the float 472 and the back plate 474 can be suppressed.

[0051] The floating mechanism 490 includes a compression spring 496 mounted on the upper surface of the guide 494 and the lower surface of the flange 495. The compression spring 496 may also be disposed between the upper surface of the back plate 474 and the lower surface of the flange 495. The compression spring 496 exerts a force that lifts the flange 495 upwards, thus applying force to the floating plate 472 via the axis 492 in a direction away from the back surface of the substrate Wf.

[0052] When fluid is supplied from fluid source 488, pressing mechanism 480 presses substrate Wf against sealing member 464 with a force stronger than that applied by floating mechanism 490. Pressing mechanism 480 can change the holding position of substrate Wf according to the pressure of fluid supplied from fluid source 488.

[0053] If the pressure of the fluid supplied from the fluid source 488 increases, the collapse of the sealing member 464 increases, and therefore the thickness of the sealing member 464 decreases proportionally to the increase in the pressure of the fluid supplied from the fluid source 488. The decrease in the thickness of the sealing member 464 refers to the downward movement of the holding position of the substrate Wf, thus meaning a shorter distance between the anode 430 and the substrate Wf. In other words, by adjusting the flow rate of the fluid supplied from the fluid source 488, the distance between the anode 430 and the substrate Wf can be adjusted. Therefore, according to this embodiment, by adjusting the distance between the anode 430 and the substrate Wf according to the type of substrate Wf, the uniformity of the coating thickness on the plated surface Wf-a can be improved. Furthermore, as... Figure 5 As shown, the substrate holder 440 has a peeling mechanism 471, which is configured to apply a force to the back side of the plated surface Wf-a of the substrate Wf to peel the substrate Wf from the back plate assembly 470.

[0054] Figure 6 This is a top view of the support mechanism 460 of the substrate holder 440 in this embodiment. Figure 7 This is a perspective view of the support mechanism 460 of the substrate holder 440 in this embodiment. Figure 6 and Figure 7 As shown, the support mechanism 460 has multiple electrical contacts 902 and positioning components 920.

[0055] Electrical contact 902 is configured to contact the outer periphery of substrate Wf and supply power to substrate Wf when substrate holder 440 holds substrate Wf (see reference). Figure 9 Multiple electrical contacts 902 are mounted on almost the entire circumference of the support mechanism 460 (see reference). Figure 6 The electrical contact 902 is preferably formed of a spring material such as stainless steel. As an example, the electrical contact 902 is configured to elastically contact the outer periphery of the substrate Wf when the substrate Wf is held by the substrate holder 440. Specifically, the electrical contact 902 contacts the outer periphery of the substrate Wf while bending when the substrate Wf is held by the substrate holder 440. Thus, the electrical contact 902 can apply a force caused by elasticity to the outer periphery of the substrate Wf and can reliably contact the substrate Wf. Furthermore, as an example, the electrical contact 902 contacts the substrate Wf over 95% of its circumferential direction.

[0056] The positioning member 920 is configured to position the substrate Wf at a predetermined position. In this embodiment, four positioning members 920 are arranged side by side at equal intervals on the circumference of the support mechanism 460 (see reference). Figure 6However, in other embodiments of this disclosure, the number and arrangement of the positioning components 920 are arbitrary. In particular, it is preferable that three or four or more positioning components 920 are arranged at equal intervals on the circumference of the support mechanism 460. Details of the positioning components 920 will be described below. Furthermore, in this document, "positioning" means moving a component that is not in a predetermined position closer to a predetermined position.

[0057] Figure 8 This is a perspective view of the positioning component 920 in this embodiment. Figure 9 This is a perspective view schematically shown by enlarging a portion of the substrate holder 440 of this embodiment. Figure 10 This is an enlarged and schematic cross-sectional view of a portion of the substrate holder 440 of this embodiment when the center pin 930 is in the second position. Figure 11 This is an enlarged and schematic cross-sectional view of a portion of the substrate holder 440 of this embodiment when the center pin 930 is in the first position.

[0058] Reference Figure 8 The positioning component 920 includes: a center pin 930, a bearing 940, a resilient component 950, and two fastening components 922. For example... Figure 9 As shown, the positioning component 920 is fixed to the support component 462 of the support mechanism 460 by two fastening components 922.

[0059] As an example, center pin 930 is a rigid body and is formed of PEEK material. Figure 10 As shown, the center pin 930 includes: a base 931 extending in a front-rear direction, a claw portion 932 extending downward from the front of the base 931, and an extension portion 933 extending upward from the rear of the base 931. Furthermore, as... Figure 9 As shown, the center pin 930 has a rotation axis 934 extending horizontally from the base 931. Furthermore, the bearing 940 is configured to rotatably support the rotation axis 934. Thus, the center pin 930 can rotate about the rotation axis 934. Moreover, the center pin 930 is configured to move between a first position and a second position by rotation. In other words, the positioning member 920 has a center pin 930 that can move between the first position and the second position.

[0060] A contact surface 935 for contacting the peripheral portion of the substrate Wf is formed in the claw portion 932 (see reference). Figure 10 Therefore, when the center pin 930 moves between the first position and the second position, the contact surface 935 contacts and presses against the substrate Wf. That is, the center pin 930 contacts and presses against the periphery of the substrate Wf, thereby positioning the positioning member 920 in a predetermined position.

[0061] Reference Figure 11 The backplate assembly 470 includes a drive member 990. Additionally, the center pin 930 has a pressed surface 938 located above the extension 933. As an example, the drive member 990 is a plunger with an elastic body (spring) and is fixed to the backplate 474. In other words, the drive member 990 has a spring 991. The drive member 990 is configured to press the pressed surface 938 and apply force to the center pin 930 towards a first position when the substrate Wf is held by the backplate assembly 470 and the support mechanism 460. Thus, when holding the substrate Wf, the center pin 930 moves from a second position toward the first position.

[0062] Furthermore, as an example, the pressed surface 938 is parallel to the plated surface Wf-a of the substrate Wf (see reference). Figure 11 Furthermore, the driving member 990 is configured to press the pressed surface 938 in a pressing direction perpendicular to the plating surface Wf-a of the substrate Wf. That is, the pressed surface 938 is orthogonal to the pressing direction of the driving member 990. Therefore, the driving member 990 can apply a force to the pressed surface 938 in only a direction approximately orthogonal to the pressed surface 938. Thus, when the driving member 990 applies force to the pressed surface 938, the driving member 990 is less likely to slide on the pressed surface 938.

[0063] When the driving member 990 slides on the pressed surface 938, the driving member 990 and the pressed surface 938 rub against each other, and there is a risk of wear on both the driving member 990 and the pressed surface 938. Furthermore, if the driving member 990 or the pressed surface 938 wears, the driving member 990 may be unable to move the center pin 930 to the first position. Also, due to the friction between the driving member 990 and the pressed surface 938, there is a risk of generating small particles. However, in this embodiment, as described above, when the driving member 990 applies force to the pressed surface 938, the driving member 990 is less likely to slide on the pressed surface 938. As a result, wear between the driving member 990 and the pressed surface 938 is suppressed. Furthermore, the generation of small particles caused by the friction between the driving member 990 and the pressed surface 938 is also suppressed.

[0064] Additionally, refer to Figure 10 The elastic member 950 passes through the limiter 980 and is located inside the hole 936 in the base 931 and the hole 463 in the support member 462. As an example, the elastic member 950 is a coil spring. The elastic member 950 is configured to apply force upward to the bottom surface 937 of the base 931. That is, the elastic member 950 applies force to the center pin 930 towards the second position. Thus, when the drive member 990 does not move the center pin 930 to the first position, the center pin 930 automatically moves to the second position via the elastic member 950.

[0065] like Figure 10 As shown, the support mechanism 460 also includes a limiter 980. The limiter 980 is located below the base 931 of the center pin 930 and has an abutment surface 982. Moreover, when the center pin 930 is in the first position, the abutment surface 982 is configured to contact the lower surface 939 of the center pin 930. That is, the limiter 980 is configured to contact the center pin 930 and stop the center pin 930 in the first position.

[0066] <Method for holding substrate Wf in substrate holder 440>

[0067] Next, an example of a method for holding the substrate Wf in the substrate holder 440 will be described. First, the substrate Wf is placed on the sealing member 264 (see...). Figure 10 Next, in order for the substrate holder 440 to clamp the substrate Wf, the backplate assembly 470 descends from above the support member 462 toward the support member 462. Next, the drive member 990 presses against the pressed surface 938, applying force to the center pin 930 toward the first position (see reference). Figure 11 As a result, the center pin 930 moves from the second position toward the first position. Consequently, the center pin 930 contacts and presses against the periphery of the substrate Wf. As a result, the substrate Wf moves toward the desired positioning position. Thus, positioning based on the center pin 930 is performed. Furthermore, positioning based on the center pin 930 is generally completed before the center pin 930 contacts the limiter 980. In other words, the positioning of the substrate Wf is completed when the center pin 930 is between the first and second positions. However, the positioning of the substrate Wf can also be completed when the center pin 930 contacts the limiter 980 and stops at the first position.

[0068] Next, the backplate assembly 470 descends to the designated position and stops. Next, the sliding ring 478 rotates, and the sliding plate 479 of the sliding ring 478 engages with the second groove 466b (see reference). Figure 4 This restricts the upward movement of the backplate assembly 470. Next, the fluid source 488 supplies fluid to the diaphragm 484 via flow paths 449 and 476. As a result, the float 472 moves downward, and the substrate Wf is clamped and fixed by the float 472 and the sealing member 464. That is, the substrate Wf is clamped and held by the support mechanism 460 and the backplate assembly 470. Thus, the substrate holder 440 holds the substrate Wf.

[0069] As described above, in the substrate holder 440, when the support mechanism 460 and the backplate assembly 470 clamp and hold the substrate Wf, the positioning member 920 is able to position the substrate Wf at a predetermined position.

[0070] Furthermore, in the substrate holder 440, during the positioning of the substrate Wf, the center pin 930 moves from the second position to the first position. At this time, due to the limiter 980, the center pin 930 reliably stops at the first position. Since the limiter 980 is provided on the support mechanism 460, the first position where the center pin 930 stops does not change relative to the support mechanism 460. Therefore, in the substrate holder 440, during the positioning of the substrate Wf, even if the float 472 deviates from its designed position relative to the support mechanism 460, the center pin 930 will not excessively press the substrate Wf to the center side beyond its designed position. In other words, the substrate holder 440 can prevent the substrate Wf from deviating from its intended position relative to the support mechanism 460 due to excessive pressing of the substrate Wf by the center pin 930.

[0071] Furthermore, as described above, the support mechanism 460 has a plurality of electrical contacts 902. Therefore, there is no deviation in the contact position of the electrical contacts 902 due to the center pin 930 excessively pressing the substrate Wf to the center side beyond the designed position. In other words, the substrate holder 440 can prevent deviation in the contact position of the electrical contacts 902 due to excessive pressing of the substrate Wf by the center pin 930.

[0072] Furthermore, as described above, the drive component 990 includes a spring 991. Therefore, after the center pin 930 moves to the first position, the spring 991 is compressed, and the drive component 990 will not press the center pin 930 further. As a result, there is no possibility of applying excessive force to the drive component 990, the center pin 930, and the limiter 980, thus preventing damage to these components. Moreover, when the substrate Wf is large, the spring 991 of the drive component 990 acts as a buffer, preventing the substrate Wf from breaking due to excessive force applied to it. In other words, the substrate holder 440 can prevent damage to the substrate Wf.

[0073] [Postscript]

[0074] Some or all of the above-described embodiments may also be described as in the following notes, but are not limited to the following notes.

[0075] (Postscript 1)

[0076] The substrate holder described in Appendix 1 includes: a first holding member and a second holding member that clamps and holds the substrate together with the first holding member. The second holding member includes: a positioning member for positioning the substrate at a predetermined position and a limiter. The positioning member has a central pin that can move between a first position and a second position, and is configured such that when the central pin moves from the second position to the first position, the central pin contacts the periphery of the substrate and positions the substrate at the predetermined position. The first holding member has a driving member that is configured to apply force to the central pin toward the first position when the substrate is held by the first holding member and the second holding member. The limiter is configured to contact the central pin and stop the central pin at the first position.

[0077] In the substrate holder described in Appendix 1, the center pin reliably stops at the first position due to the limiter. Since the limiter is provided on the second retainer, the first position where the center pin stops does not change relative to the second retainer. That is, in this substrate holder, when the substrate is positioned, even if the first retainer deviates from the designed position relative to the second retainer, the center pin will not excessively press the substrate to the center side beyond the designed position.

[0078] (Postscript 2)

[0079] The substrate holding structure described in Appendix 2 is such that, based on the substrate holding frame described in Appendix 1, the second holding member further has an electrical contact that contacts the substrate and is used to supply power to the substrate.

[0080] The substrate holder described in Note 2 can prevent the contact position of the electrical contacts from deviating due to the center pin pressing the substrate too far to the center side of the design position.

[0081] (Note 3)

[0082] The substrate holding structure described in Appendix 3 is based on the substrate holding frame described in Appendix 1 or 2, wherein the positioning member has an elastic member for applying force to the center pin toward the second position.

[0083] In the substrate holder described in Appendix 3, when the drive component does not move the center pin to the first position, the center pin automatically moves to the second position via the elastic component.

[0084] (Postscript 4)

[0085] The substrate holding structure described in Appendix 4 is based on the substrate holding structure described in any one of Appendices 1 to 3, wherein the drive member is equipped with a spring-loaded or elastic plunger for applying force to the center pin toward the first position.

[0086] In the substrate holder described in Appendix 4, during substrate positioning, a spring-loaded or elastic plunger moves the center pin from the second position to the first position.

[0087] (Note 5)

[0088] The substrate holding structure described in Appendix 5 is based on the substrate holder described in any one of Appendices 1 to 4, wherein the central pin has a pressed surface, and the driving member is configured to press the pressed surface in a pressing direction perpendicular to the processed surface of the substrate when the substrate is held by the first holding member and the second holding member, wherein the pressed surface is orthogonal to the pressing direction.

[0089] In the substrate holder described in Appendix 5, the driving member applies a force to the pressed surface in a direction orthogonal to the pressed surface. Therefore, when the driving member applies force to the pressed surface, it is less likely to slide on the pressed surface. As a result, wear on the driving member or the pressed surface can be suppressed. Furthermore, the generation of tiny particles caused by friction between the driving member and the pressed surface can also be suppressed.

[0090] (Note 6)

[0091] The substrate holding structure described in Appendix 6 is based on the substrate holding structure described in any one of Appendices 1 to 5, wherein the central pin has a rotation axis, the positioning member has a bearing supporting the rotation axis, and the central pin rotates about the rotation axis, thereby moving between the first position and the second position.

[0092] (Note 7)

[0093] The substrate holding structure described in Appendix 7 is such that, based on the substrate holding frame described in any one of Appendices 1 to 6, the second holding member has four of the aforementioned positioning members.

[0094] In the substrate holder described in Appendix 7, four positioning components are capable of positioning the substrate.

[0095] (Postscript 8)

[0096] The plating apparatus described in Appendix 8 is a plating apparatus comprising: a plating tank configured to contain plating liquid, a substrate holder as described in any one of Appendices 1 to 7, and a lifting mechanism configured to raise and lower the substrate holder. The substrate holder is configured to hold the substrate with the plating surface facing downward. The second holder is a support mechanism configured to support the outer periphery of the plating surface of the substrate. The first holder is a backplate assembly disposed on the back side of the plating surface of the substrate and configured to clamp the substrate together with the support mechanism.

[0097] The plating apparatus described in Appendix 8 has the same effect as the substrate holder in Appendix 1. That is, in the plating apparatus of Appendix 8, when the substrate is positioned, even if the first holder deviates from the designed position relative to the second holder, the center pin will not press the substrate excessively to the center side beyond the designed position.

[0098] (Note 9)

[0099] The substrate positioning method described in Appendix 9 is a substrate positioning method using the substrate holder described in any one of Appendices 1 to 7. The method includes the following steps: a step in which the first holder and the second holder clamp and hold the substrate; a step in which the driving member moves the center pin from the second position to the first position; a step in which the center pin positions the substrate at the predetermined position; and a step in which the limiter contacts the center pin and stops the center pin at the first position.

[0100] The substrate positioning method in Appendix 9 has the same effect as the substrate holder in Appendix 1. That is, in the substrate positioning method in Appendix 9, when positioning the substrate, even if the first holder deviates from the designed position relative to the second holder, the center pin will not press the substrate excessively to the center side beyond the designed position.

[0101] Explanation of reference numerals in the attached figures

[0102] 264...Sealing component; 400...Plating module; 410...Plating tank; 440...Substrate holder; 442...Lifting mechanism; 460...Support mechanism; 462...Support component; 470...Backplate assembly; 472...Floating plate; 474...Backplate; 902...Electrical contact; 920...Positioning component; 930...Center pin; 934...Rotating shaft; 935...Contact surface; 938...Pressed surface; 940...Bearing; 950...Elastic component; 980...Limiter; 982...Abutment surface; 990...Drive component; 1000...Plating device; Wf...Substrate.

Claims

1. A substrate holder, wherein, have: First retainer, and The second retainer, together with the first retainer, clamps and holds the substrate. The second retainer has: A positioning component for positioning the substrate at a predetermined position, and Limit switch, The positioning component has a central pin that can move between a first position and a second position, and is configured such that when the central pin moves from the second position to the first position, the central pin contacts the periphery of the substrate and positions the substrate at the predetermined position. The first retainer has a driving member configured to apply force to the center pin toward the first position when the substrate is held by the first retainer and the second retainer. The limiter is configured to contact the center pin and stop the center pin at the first position. The drive component includes a spring-loaded or elastic plunger for applying force to the center pin toward the first position. The center pin has a pressing surface. The driving component is configured to move the center pin from the second position toward the first position by pressing the pressed surface in a pressing direction perpendicular to the plated surface of the substrate.

2. The substrate holder according to claim 1, wherein, The second retainer also has an electrical contact for contacting the substrate to supply power to the substrate.

3. The substrate holder according to claim 1 or 2, wherein, The positioning component has an elastic element for applying force to the center pin toward the second position.

4. The substrate holder according to claim 1 or 2, wherein, The driving member is configured to press the pressed surface in the pressing direction when the substrate is held by the first holding member and the second holding member. The pressed surface is orthogonal to the pressing direction.

5. The substrate holder according to claim 1 or 2, wherein, The central pin has a rotation axis. The positioning component has a bearing that supports the rotating shaft. The center pin rotates about the rotation axis, thereby moving between the first position and the second position.

6. The substrate holder according to claim 1 or 2, wherein, The second retainer has four of the aforementioned positioning components.

7. A plating apparatus, wherein, The plating apparatus includes: A plating tank that contains plating solution The substrate holder as described in claim 1 or 2, and The mechanism is configured to raise and lower the substrate holder. The substrate holding structure serves to hold the substrate with the plated surface facing downwards. The second retainer is a support mechanism configured to support the outer periphery of the plated surface of the substrate. The first retainer is a backplate assembly disposed on the back side of the plated surface of the substrate and configured to clamp the substrate together with the support mechanism.

8. A method for positioning a substrate, comprising a substrate positioning method using a substrate holder as described in claim 1 or 2, wherein, The method comprises the following steps: The process of clamping and holding the substrate between the first retainer and the second retainer; The process by which the driving component moves the center pin from the second position to the first position; The process of positioning the substrate at the specified position using the center pin; as well as The process of the limiter contacting the center pin to stop the center pin at the first position.

Images