A chip test after separation of components

Abstract

The present invention relates to a chip post-test separation component, comprising a circuit board, a first base, a chip placement base, a second base, a gold finger, and a gold finger holder, wherein the gold finger is fixedly clamped by the gold finger holder, the gold finger holder and the circuit board are fixedly installed together by screws or bolts, and one end of the gold finger contacts the circuit board, thereby realizing electrical connection between the gold finger and the circuit board; the first base and the circuit board are fixedly connected by screws or bolts, and the second base and the first base are fixedly installed together by screws or bolts; the chip placement base and the second base are fixedly connected, and at least a part of the chip placement base is higher than the circuit board, and the other end of the gold finger rests on the chip placement base; when a chip to be tested is placed on the chip placement base, the chip to be tested and the other end of the gold finger are connected, thereby realizing electrical connection between the chip to be tested and the circuit board.

Description

Technical Field

[0001] The present invention relates to the field of chip testing, and in particular to a chip testing and post-separation component. Background Art

[0002] Chips are a common electronic component. They consist of a chip body and multiple pins, which are located on the chip body and electrically connected to the chip body. Before leaving the factory, chips undergo testing, one of which is to check whether the circuits on the chip are conducting. In one prior art method, workers use a handheld test pen to test whether the circuits on the chip are conducting. However, this testing method is time-consuming and labor-intensive, inefficient, and has a high error rate. Later, a testing device was invented. The chip is placed on the test device, and the chip's pins connect to the gold fingers on the test device. The gold fingers, in turn, connect to the circuit board on the test device. The circuit board is then powered on, allowing the chip's circuits to be tested for continuity. However, after the chip is placed on the test device and tested, the worker manually or with a handheld tool removes the chip from the test device. This method is extremely labor-intensive, making it difficult to remove the chip from the test device. Even if the chip is removed with force, there is a high risk of scratching or damaging it. Summary of the Invention

[0003] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a chip separation component after testing.

[0004] In order to achieve the above-mentioned objectives, the present invention adopts the following technical solutions: a chip post-test separation component, comprising a circuit board, a first base, a chip placement base, a second base, a gold finger, and a gold finger holder, wherein the gold finger is fixedly clamped by the gold finger holder, the gold finger holder and the circuit board are fixedly installed together by screws or bolts, and one end of the gold finger contacts the circuit board, thereby realizing electrical connection between the gold finger and the circuit board; the first base and the circuit board are fixedly connected by screws or bolts, and the second base and the first base are fixedly installed together by screws or bolts; the chip placement base and the second base are fixedly connected, and at least a part of the height of the chip placement base is higher than the circuit board, and the other end of the gold finger is placed on the chip placement base; when the tested chip is placed on the chip placement base, the tested chip and the other end of the gold finger are connected, thereby realizing electrical connection between the tested chip and the circuit board.

[0005] Furthermore, it includes at least one telescopic rod, and the chip placement base is provided with a first through hole adapted to the telescopic rod, the first through hole passes through the chip placement base, the telescopic rod is inserted into the first through hole, and the telescopic rod moves up and down in the first through hole. When the tested chip is placed on the chip placement base, the telescopic rod moves upward, thereby lifting the tested chip upward, thereby separating the tested chip and the chip placement base.

[0006] Furthermore, it also includes at least one supporting column, which is fixedly connected to the chip placement base on the one hand and fixedly connected to the second base on the other hand, so that the chip placement base and the second base are fixedly connected and a preset distance is provided between the chip placement base and the second base.

[0007] Furthermore, it includes at least one pushing rod, and a second through hole adapted to the pushing rod is provided on the second base, and the second through hole passes through the second base, and the pushing rod extends into the second through hole. When the chip placing base and the second base are fixedly connected, the first through hole on the chip placing base and the second through hole on the second base are aligned, and the pushing rod pushes the telescopic rod when it moves upward, thereby causing the telescopic rod to move upward, thereby pushing the tested chip placed on the chip placing base upward.

[0008] Furthermore, it includes at least one through tube, which passes through from front to back and is adapted to the first through hole of the chip placement base and the second through hole of the second base. The through tube has a first end and a second end. The first end of the through tube is inserted into the first through hole of the chip placement base, so that the first end of the through tube is fixedly connected to the chip placement base; the second end of the through tube is inserted into the second through hole of the second base, so that the second end of the through tube is fixedly connected to the second base.

[0009] Furthermore, the push rod extends into the through tube from the second end of the through tube, and the push rod is movable in the through tube; when the push rod moves upward, it pushes the telescopic rod to move upward, so that the telescopic rod pushes the tested chip upward away from the chip placement base.

[0010] Furthermore, a groove is provided on the chip placing base, and the groove is recessed inward from the outer surface of the chip placing base to a preset depth. The groove has a bottom wall, the first through hole passes through the bottom wall, and the first through hole and the groove are connected. The tested chip is placed in the groove, and the tested chip is supported by the bottom wall.

[0011] Furthermore, the support column has a first plug-in end and a second plug-in end, a first mounting hole is provided on the chip placement base, and a second mounting hole is provided on the second base. The first plug-in end of the support column and the first mounting hole of the chip placement base are fixedly installed together by means of an axial hole fitting connection, and the second plug-in end of the support column and the second mounting hole of the second base are fixedly installed together by means of an axial hole fitting connection.

[0012] Furthermore, it includes at least one positioning rod, and a positioning hole adapted to the positioning rod is provided on the first base, and the positioning hole passes through the first base. The positioning rod is fixedly installed on the second base. When the first base and the second base are fixedly installed together, the positioning rod is inserted into the positioning hole, thereby realizing precise installation of the first base and the second base.

[0013] Furthermore, it also includes a positioning rod base, one end of which is fixedly mounted on the second base, and one end of the positioning rod is fixedly plugged into the other end of the positioning rod base, so that the positioning rod is fixedly mounted on the second base.

[0014] The beneficial effects of the present application are as follows: the chip separation component provided in the present application has a simple structure and is easy to assemble. Since a telescopic rod and a pushing rod are provided, after the tested chip completes the test, the pushing rod pushes the telescopic rod to move upward, and the telescopic rod lifts up the tested chip while moving upward, thereby realizing the separation of the tested chip and the chip placement base, reducing the risk of scratching or damaging the tested chip in the prior art, and improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a structural diagram of a chip post-test separation component provided by the present invention.

[0016] Figure 2 for Figure 1 A partially enlarged view of the separated components after a chip test is shown.

[0017] Figure 3 This is a structural diagram of a chip after testing and separation of components with the circuit board removed provided by the present invention.

[0018] Figure 4 This is a structural schematic diagram of a chip post-test separation assembly provided by the present invention after the circuit board and the first base are removed.

[0019] Figure 5 This is another structural schematic diagram of a chip post-test separation assembly provided by the present invention after the circuit board and the first base are removed.

[0020] Figure 6 This is another structural schematic diagram of a chip post-test separation assembly provided by the present invention after the circuit board and the first base are removed. DETAILED DESCRIPTION

[0021] The present application is further described in detail below by means of specific embodiments in conjunction with the accompanying drawings. Similar elements in different embodiments are numbered with associated similar elements. In the following embodiments, many detailed descriptions are provided to enable the present application to be better understood. However, those skilled in the art will readily appreciate that some of the features may be omitted in different circumstances, or may be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification. This is to avoid the core portion of the present application being overwhelmed by excessive descriptions. For those skilled in the art, it is not necessary to describe these related operations in detail. They can fully understand the related operations based on the description in the specification and the general technical knowledge in the art.

[0022] In addition, the features, operations, or characteristics described in the specification may be combined in any appropriate manner to form various implementations, and the operational steps involved in each embodiment may be interchanged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the specification and drawings are only for the purpose of clearly describing a particular embodiment and do not imply a required composition and / or sequence.

[0023] The serial numbers assigned to components herein, such as "first," "second," etc., are used solely to distinguish the objects being described and do not convey any sequential or technical meaning. References to "connection" and "coupling" herein, unless otherwise specified, include both direct and indirect connections (couplings).

[0024] Please refer to Figure 1-6The present application provides a chip post-test separation assembly (hereinafter referred to as a "test assembly"), which includes a circuit board 1, a first base 2, a chip placement base 3, a second base 4, a gold finger 5, and a gold finger holder 6, wherein the gold finger 5 is fixedly clamped by the gold finger holder 6, the gold finger holder 6 and the circuit board 1 are fixedly installed together by screws or bolts, and one end of the gold finger 5 contacts the circuit board 1, thereby realizing electrical connection between the gold finger 5 and the circuit board 1; the first base 2 and the circuit board 1 are fixedly connected by screws or bolts, and the second base 4 and the first base 2 are fixedly installed together by screws or bolts; the chip placement base 3 and the second base 4 are fixedly connected, and at least a portion of the chip placement base 3 is higher than the circuit board 1, and the other end of the gold finger 5 rests on the chip placement base 3; when a chip under test 7 is placed on the chip placement base 3, the chip under test 7 is connected to the other end of the gold finger 5, thereby realizing electrical connection between the chip under test 7 and the circuit board 1.

[0025] In one embodiment of the present application, the test assembly also includes at least one telescopic rod 11, and a first through hole 31 adapted to the telescopic rod 11 is provided on the chip placement base 3, and the first through hole 31 passes through the chip placement base 3, and the telescopic rod 11 is inserted into the first through hole 31, and the telescopic rod 11 moves up and down in the first through hole 31. When the tested chip 7 is placed on the chip placement base 3, the telescopic rod 11 moves upward, thereby lifting the tested chip 7 upward, thereby separating the tested chip 7 from the chip placement base 3.

[0026] In one embodiment of the present application, the test assembly further includes at least one support column 8, which is fixedly connected to the chip placement base 3 on the one hand, and is fixedly connected to the second base 4 on the other hand, so that the chip placement base 3 and the second base 4 are fixedly connected, and a preset distance is provided between the chip placement base 3 and the second base 4.

[0027] In one embodiment of the present application, the test assembly also includes at least one pushing rod 10, and a second through hole 40 adapted to the pushing rod 10 is provided on the second base 4, and the second through hole 40 passes through the second base 4, and the pushing rod 10 extends into the second through hole 40. When the chip placing base 3 and the second base 4 are fixedly connected, the first through hole 31 on the chip placing base 3 and the second through hole 40 on the second base 4 are aligned, and when the pushing rod 10 moves upward, it pushes the telescopic rod 11, thereby causing the telescopic rod 11 to move upward, thereby pushing the tested chip 7 placed on the chip placing base 3 upward.

[0028] In one embodiment of the present application, the test assembly also includes at least one through tube 9, which passes through from front to back, and is adapted to the first through hole 31 of the chip placement base 3 and the second through hole 40 of the second base 4. The through tube 9 has a first end 91 and a second end 92. The first end 91 of the through tube 9 is inserted into the first through hole 31 of the chip placement base 3, so that the first end 91 of the through tube 9 is fixedly connected to the chip placement base 3; the second end 92 of the through tube 9 is inserted into the second through hole 40 of the second base 4, so that the second end 92 of the through tube 9 is fixedly connected to the second base 4.

[0029] In one embodiment of the present application, the pushing rod 10 extends from the second end 92 of the through tube 9 into the through tube 9, and the pushing rod 10 is movable in the through tube 9; when the pushing rod 10 moves upward, it pushes the telescopic rod 11 to move upward, so that the telescopic rod 11 pushes the tested chip 7 upward away from the chip placement base 3.

[0030] In one embodiment of the present application, a groove 30 is provided on the chip placement base 3, and the groove 30 is recessed inward from the outer surface of the chip placement base 3 to a preset depth. The groove 30 has a bottom wall 32, and the first through hole 31 passes through the bottom wall 32, and the first through hole 31 is connected to the groove 30. The tested chip 7 is placed in the groove 30, and the tested chip 7 is supported by the bottom wall 32.

[0031] In one embodiment of the present application, the support column 8 has a first plug-in end 81 and a second plug-in end 82, a first mounting hole (not shown) is provided on the chip placement base 3, and a second mounting hole (not shown) is provided on the second base 4. The first plug-in end 81 of the support column 8 and the first mounting hole of the chip placement base 3 are fixedly installed together by means of an axial hole fitting connection, and the second plug-in end 82 of the support column 8 and the second mounting hole of the second base 4 are fixedly installed together by means of an axial hole fitting connection.

[0032] In one embodiment of the present application, the test assembly also includes at least one positioning rod 12, and a positioning hole 20 adapted to the positioning rod 12 is provided on the first base 2, and the positioning hole 20 passes through the first base 2, and the positioning rod 12 is fixedly installed on the second base 4. When the first base 2 and the second base 4 are fixedly installed together, the positioning rod 12 is inserted into the positioning hole 20, thereby realizing the precise installation of the first base 2 and the second base 4.

[0033] In one embodiment of the present application, the test assembly also includes a positioning rod base 13, one end of the positioning rod base 13 is fixedly mounted on the second base 4, and one end of the positioning rod 12 is fixedly plugged into the other end of the positioning rod base 13, so that the positioning rod 12 is fixedly mounted on the second base 4.

[0034] The tower-specific chip post-test separation component provided in the present application has a simple structure and is easy to assemble. Since a telescopic rod and a push rod are provided, after the tested chip completes the test, the push rod pushes the telescopic rod to move upward, and the telescopic rod lifts the tested chip while moving upward, thereby realizing the separation of the tested chip and the chip placement base, reducing the risk of scratching or damage to the tested chip in the prior art, and improving work efficiency.

[0035] The above embodiments are intended only to illustrate the technical concepts and features of the present invention. Their purpose is to enable those skilled in the art to understand the contents of the present invention and implement them accordingly. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications made in accordance with the spirit of the present invention are intended to be covered by the scope of protection of the present invention.

Claims

1. A chip test and separation component, characterized in that: The present invention comprises a circuit board, a first base, a chip placement base, a second base, a gold finger, and a gold finger holder, wherein the gold finger is fixedly clamped by the gold finger holder, the gold finger holder and the circuit board are fixedly installed together by screws or bolts, and one end of the gold finger contacts the circuit board, thereby realizing electrical connection between the gold finger and the circuit board; the first base and the circuit board are fixedly connected by screws or bolts, and the second base and the first base are fixedly installed together by screws or bolts; the chip placement base and the second base are fixedly connected, and at least a part of the chip placement base is higher than the circuit board, and the other end of the gold finger rests on the chip placement base; when the tested chip is placed on the chip placement base, the tested chip and the other end of the gold finger are connected, thereby realizing electrical connection between the tested chip and the circuit board; The chip post-test separation assembly further comprises at least one telescopic rod, at least one supporting column, at least one pushing rod and at least one through-tube; The chip placement base is provided with a first through hole adapted to the telescopic rod, the first through hole passing through the chip placement base, the telescopic rod is inserted into the first through hole, and the telescopic rod moves up and down in the first through hole. When the chip under test is placed on the chip placement base, the telescopic rod moves upward, thereby lifting the chip under test upward, thereby separating the chip under test from the chip placement base; The support column is fixedly connected to the chip placement base on one hand, and is fixedly connected to the second base on the other hand, so that the chip placement base and the second base are fixedly connected and a preset distance is maintained between the chip placement base and the second base; The second base is provided with a second through hole adapted to the push rod, the second through hole passes through the second base, the push rod extends into the second through hole, and when the chip placement base and the second base are fixedly connected, the first through hole on the chip placement base and the second through hole on the second base are aligned, and when the push rod moves upward, it pushes the telescopic rod, thereby causing the telescopic rod to move upward, thereby pushing the tested chip placed on the chip placement base upward; The through tube passes through front to back, and is adapted to the first through hole of the chip placement base and the second through hole of the second base. The through tube has a first end and a second end. The first end of the through tube is inserted into the first through hole of the chip placement base, so that the first end of the through tube is fixedly connected to the chip placement base; the second end of the through tube is inserted into the second through hole of the second base, so that the second end of the through tube is fixedly connected to the second base.

2. The chip separation component after testing according to claim 1, characterized in that: The push rod extends into the through tube from the second end of the through tube and is movable in the through tube; when the push rod moves upward, it pushes the telescopic rod to move upward, so that the telescopic rod pushes the tested chip upward to leave the chip placement base.

3. The chip post-test separation assembly according to claim 2, characterized in that: A groove is provided on the chip placement base, and the groove is recessed inward from the outer surface of the chip placement base to a preset depth. The groove has a bottom wall, and the first through hole passes through the bottom wall, and the first through hole is connected to the groove. The tested chip is placed in the groove, and the tested chip is supported by the bottom wall.

4. The chip separation component after testing according to claim 3, characterized in that: The support column has a first plug-in end and a second plug-in end. The chip placement base is provided with a first mounting hole, and the second base is provided with a second mounting hole. The first plug-in end of the support column and the first mounting hole of the chip placement base are fixedly installed together by means of an axial hole fitting connection. The second plug-in end of the support column and the second mounting hole of the second base are fixedly installed together by means of an axial hole fitting connection.

5. The chip separation component after testing according to claim 4, characterized in that: It also includes at least one positioning rod, and a positioning hole adapted to the positioning rod is provided on the first base, the positioning hole passes through the first base, and the positioning rod is fixedly installed on the second base. When the first base and the second base are fixedly installed together, the positioning rod is inserted into the positioning hole, thereby realizing precise installation of the first base and the second base.

6. The chip separation component after testing according to claim 5, characterized in that: It also includes a positioning rod base, one end of which is fixedly mounted on the second base, and one end of the positioning rod is fixedly plugged into the other end of the positioning rod base, so that the positioning rod is fixedly mounted on the second base.

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