Processing device for wafer cutting and operation method thereof

Abstract

The invention discloses a processing device for wafer cutting, and belongs to the technical field of chip cutting processing, the processing device comprises a machine tool and a chip, a processing area is arranged in the machine tool, the chip is installed in the processing area, a groove is formed in the chip, the center line of the groove coincides with a cutting line on the chip, a clamping module is installed in the chip, and the clamping module is connected with the chip. The clamping module comprises two auxiliary blocks, the two auxiliary blocks are oppositely installed in the groove, one side of each auxiliary block is a step face, a cutting channel is reserved between the two auxiliary blocks, the cutting module comprises a left tool rest disc and a right tool rest disc, the left tool rest disc and the right tool rest disc are clamped and fixed to a tool rest shaft, and one end of the tool rest shaft is connected with a driving motor. The driving motor is installed on the machine tool, arc-shaped grooves are evenly formed in the left tool rest disc in the circumferential direction, the tools are installed in the arc-shaped grooves, cutting of chips is facilitated, stress borne by the chips during cutting is balanced, and discharging of silicon powder is facilitated.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip cutting and processing, and in particular relates to a processing device for wafer cutting and an operating method thereof. Background Art

[0002] Wafer cutting or dicing is an important part of the semiconductor manufacturing process. Its purpose is to divide the wafers that have been processed through multiple processes into multiple independent grains. These grains usually contain complete circuit functions and are the core components used to manufacture electronic products. Wafer cutting is a very important part of the semiconductor industry production process. A wafer must go through three changes to become a real semiconductor chip: first, the block-shaped ingot is cut into wafers; in the second process, transistors are engraved on the front of the wafer through the previous process; finally, packaging is performed, that is, through the cutting process, the wafer becomes a complete semiconductor chip. It can be seen that the packaging process belongs to the back-end process. In this process, the wafer will be cut into several hexahedral single chips. This process of obtaining independent chips is called "singling", and the process of sawing the wafer board into independent rectangular blocks is called "wafer cutting". The grinding wheel cutting method is a more common wafer cutting method. Recently, with the reduction of chip design complexity and size, the requirements for the accuracy and efficiency of wafer cutting technology are getting higher and higher.

[0003] In the commonly used wafer cutting process, the wafer surface is composed of cutting paths for chips and separated chips, and the blade cuts in the cutting paths to separate the chip grains. In the existing cutting process, the cutting paths between chips are flush with the chip surface during the cutting process, which makes the chip extremely susceptible to stress concentration during cutting, thereby causing front chipping, notches, cracks and other failure problems, resulting in damage to the function of some chips. In addition, due to the chipping caused during cutting, cutting debris splashes everywhere and scratches the gold bumps of the chip. At the same time, silicon powder generated during cutting flies everywhere, which easily causes chip contamination and is not easy to discharge. Summary of the invention

[0004] In view of the above problems in the prior art, an object of the present invention is to provide a processing device for wafer cutting, in order to facilitate chip cutting, balance the stress on the chip during cutting, and facilitate the discharge of silicon powder.

[0005] The present invention provides the following technical solutions:

[0006] A processing device for wafer cutting comprises a machine tool and a chip, wherein a processing area is provided in the machine tool, and a chip is installed in the processing area. A groove is provided in the chip, and the center line of the groove coincides with the cutting line on the chip. A clamping module is installed in the chip, and the clamping module comprises two auxiliary blocks, which are relatively installed in the groove, one side of the auxiliary block is a step surface, and the other side of the auxiliary block is tightly fitted with the side wall of the groove, a cutting path is left between the two auxiliary blocks, and the distance of the cutting path is greater than the thickness of the tool.

[0007] As a further technical solution, two side surfaces of the auxiliary block adjacent to the cutting path are provided with a first step surface and a second step surface in sequence from bottom to top.

[0008] As a further technical solution, slideways are provided on both end surfaces of the auxiliary block, and longitudinal extension plates are slidably connected to the two end surfaces of the auxiliary block. Both ends of the inner side surfaces of the longitudinal extension plates are slidably connected to the slideways, and load-bearing plates are clamped between the longitudinal extension plates, and the center line of the load-bearing plates coincides with the cutting line on the chip.

[0009] As a further technical solution, a track is symmetrically installed on the top of the auxiliary block, a slider is slidably connected to the track, and transverse extension plates are fixedly installed on two longitudinally distributed sliders, and extension blocks are symmetrically installed on the transverse extension plates. A cavity is provided in the auxiliary block, the extension block is located in the cavity, and the extension block and the cavity are slidably connected.

[0010] As a further technical solution, a cutting module is installed on the machine tool, and the cutting module is located above the clamping module. A control module, an operation module and a warning module are also installed on the machine tool.

[0011] As a further technical solution, the cutting module includes a left tool holder disc and a right tool holder disc, which are clamped and fixed on the tool holder shaft. A drive motor is connected to one end of the tool holder shaft, and the drive motor is installed on the machine tool. Arc grooves are evenly opened in the circumferential direction in the left tool holder disc, and the tool is installed in the arc groove.

[0012] As a further technical solution, a left mounting seat is rotatably installed on the left tool holder disc, a rotating shaft passes through the circular arc groove, the left mounting seat is fixedly sleeved in the rotating shaft, a tool shaft is welded in the left mounting seat, and the tool is sleeved on the tool shaft, and a right mounting seat is rotatably installed in the right tool holder disc, the right mounting seat is sleeved on the rotating shaft and clamped with the left mounting seat.

[0013] As a further technical solution, structures for limiting the position of the tool are installed on the left mounting seat and the right mounting seat, a left clamping piece is installed on the left mounting seat, and a right clamping piece is installed on the right mounting seat. The two ends of the left clamping piece and the right clamping piece are respectively fixed to the left tool holder disc and the right tool holder disc by fasteners. Threaded holes are provided on the left tool holder disc along track two and on the right tool holder disc along track five. A protrusion is provided on the right clamping piece, and a rubber pad is bonded to the protrusion. The left clamping piece and the right clamping piece have the same structure, and the rubber pad fits tightly against the tool.

[0014] As a further technical solution, a main water spray pipe is installed between the left mounting seat and the right mounting seat, and the water spray port of the main water spray pipe is located just in front of and above the cutting point of the tool, and the angle between the water spray direction of the main water spray pipe and the moving direction of the tool is greater than 90 degrees. The main water spray pipe is provided with an upper mounting portion and a lower mounting portion, and the left tool holder disc is provided with track one, track two, track three and track four, and the two ends of the upper mounting portion slide on track three and track four on the left tool holder disc respectively, and one end of the lower mounting portion slides along track one on the left tool holder disc, and auxiliary water spray pipes are respectively installed on the left mounting seat and the right mounting seat, and the water spray ports of the auxiliary water spray pipes are located on both sides of the tool, and the liquid in the auxiliary water spray pipe moves along the spray trajectory and lands at the action point, and the action point of the auxiliary water spray pipe is located on both sides of the tool, and the action point of the auxiliary water spray pipe is located behind the cutting point of the tool.

[0015] An operating method of a processing device for wafer cutting,

[0016] Operation method of small diameter chip cutting:

[0017] Step 1: Before cutting, one side of the auxiliary block is installed close to the side wall of the groove. After the auxiliary block is installed, ensure that the tool acts on the chip and the bottom of the tool is located in the cutting path;

[0018] Step 2: Install the tool, clamp the right tool holder disc on the left tool holder disc, and make the rubber pads on the left tool holder disc and the right tool holder disc fit the tool tightly;

[0019] Step 3: Adjust the angle of the tool. The working motor drives the tool shaft to rotate. The tool rotates along with the tool shaft. The positions of the left clamping member and the right clamping member are fixed according to the position of the tool.

[0020] Step 4: The tool moves to cut the chip. The control module sends work instructions to the drive component of the tool. At the same time, the main water spray pipe and the auxiliary water spray pipe work together. The water sprayed from the main water spray pipe and the auxiliary water spray pipe respectively impacts the cutting point of the tool and both sides of the tool until the tool cutting action stops.

[0021] Operation method of large diameter chip cutting:

[0022] Step 1: Adjust the effective length of the clamping module according to the diameter of the chip, pull the extension block out of the cavity, that is, pull the horizontal extension plate outward, slide the longitudinal extension plate on the extension block, and install one side of the auxiliary block close to the side wall of the groove. After the auxiliary block is installed, ensure that the tool acts on the chip and the bottom of the tool is located in the cutting path;

[0023] Step 2: Install the tool, clamp the right tool holder disc on the left tool holder disc, and make the rubber pads on the left tool holder disc and the right tool holder disc fit the tool tightly;

[0024] Step 3: Adjust the angle of the tool. The working motor drives the tool shaft to rotate. The tool rotates along with the tool shaft. The positions of the left clamping member and the right clamping member are fixed according to the position of the tool.

[0025] Step 4: The tool moves to cut the chip. The control module sends work instructions to the drive component of the tool. At the same time, the main water spray pipe and the auxiliary water spray pipe work together. The water sprayed from the main water spray pipe and the auxiliary water spray pipe respectively impacts the cutting point of the tool and both sides of the tool until the tool cutting action stops.

[0026] The beneficial effects of the present invention are:

[0027] 1. The chip is designed with grooves, which are the cutting areas of the chip. The cutting path height is reduced to avoid chip surface defects caused by cutting and chip tearing, and chip surface gaps caused by cutting. Protective walls are added on both sides of the cutting path to reduce the impact of debris generated by cutting and reduce the flying of debris to scratch the gold bumps.

[0028] 2. A left clamping piece and a right clamping piece are installed on both sides of the tool. The left clamping piece and the right clamping piece are provided with raised parts, and rubber pads are bonded to the raised parts. The rubber pads fit the tool closely through their elasticity to complete the positioning of tools of different thicknesses.

[0029] 3. After lowering the cutting path height, it is beneficial to collect silicon powder in the cutting path. A main water spray pipe and an auxiliary water spray pipe are installed at the tool. The main water spray pipe and the auxiliary water spray pipe work together. When the tool moves, the water sprayed from the main water spray pipe and the auxiliary water spray pipe respectively impacts the cutting point of the tool and both sides of the tool, thereby quickly and timely removing the silicon powder around the tool 8. The water pressure is conducive to the removal of silicon powder in the cutting path, avoiding the chip surface from being contaminated by silicon powder. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0031] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0032] Figure 2 It is a schematic diagram of the axonometric structure of the chip of the present invention;

[0033] Figure 3 The present invention Figure 2 A magnified view of part A in FIG.

[0034] Figure 4 It is a schematic diagram of the top view of the clamping module of the present invention;

[0035] Figure 5 The present invention Figure 4 AA surface section view in;

[0036] Figure 6 It is a schematic diagram of the structure of the left tool holder disc of the present invention;

[0037] Figure 7 It is a schematic diagram of the structure of the right tool holder disc of the present invention;

[0038] Figure 8 For the present invention Figure 7 A schematic diagram of the enlarged structure of part B in FIG.

[0039] Fig. 9 It is a schematic cross-sectional structural diagram of the left mounting seat of the present invention;

[0040] Fig.10 It is a schematic diagram of the installation structure of the left installation seat and the right installation seat of the present invention.

[0041] The markings in the figure are: 1, machine tool; 2, operation module; 3, warning module; 4, cutting module; 401, arc groove; 402, rotating axis; 403, left tool holder plate; 404, main water spray pipe; 405, track one; 406, track two; 407, track three; 408, track four; 409, right tool holder plate; 410, tool holder shaft; 411, track five; 412, right clamping member; 413, rubber pad; 414, raised part; 415, upper mounting part; 416, lower mounting part; 417, water spray port; 418, spray track ; 419, point of action; 420, left clamping member; 421, fastener; 422, tool axis; 423, left mounting seat; 424, right mounting seat; 425, auxiliary water spray pipe; 5, clamping module; 501, longitudinal extension plate; 502, transverse extension plate; 503, load-bearing plate; 504, cutting path; 505, auxiliary block; 506, slideway; 507, cavity; 508, slider; 509, second step surface; 510, first step surface; 511, track; 6, control module; 7, chip; 701, groove; 8, tool. DETAILED DESCRIPTION

[0042] Embodiment 1

[0043] like Figure 2 to Figure 4As shown, the present invention provides a processing device for wafer cutting, including a machine tool 1 and a chip 7. A processing area is provided in the machine tool 1, and the chip 7 is installed in the processing area. The chip 7 is installed by a suction cup adsorption clamping method. The suction cup adsorption technology is a prior art and will not be described here. A groove 701 is opened in the chip 7, and the center line of the groove 701 coincides with the cutting line on the chip 7.

[0044] The chip 7 is designed with a groove 701, which is the cutting area of ​​the chip 7. The tool 8 cuts the chip 7 along the groove 701. First, by lowering the height of the cutting area of ​​the chip, it avoids chip surface defects caused by cutting and chip tearing, and avoids chip surface gaps caused by cutting. Secondly, after lowering the height of the cutting path, it is conducive to the collection of silicon powder in the cutting path, and the water pressure is conducive to the discharge of silicon powder in the cutting path, avoiding the chip surface from being contaminated by silicon powder; finally, the two side walls of the lowered cutting area form a protective wall to reduce the impact of debris generated by cutting, and reduce the flying of debris to scratch the gold bumps.

[0045] A clamping module 5 is installed in the chip 7, which further protects the groove 701 of the chip 7. The clamping module 5 includes two auxiliary blocks 505. The two auxiliary blocks 505 are relatively installed in the groove 701. The auxiliary blocks 505 are installed in an embedded manner. When in use, one side of the auxiliary block 505 is lowered close to the side wall of the groove 701. Therefore, the clamping module 5 is specially designed for use according to the size of the groove 701 of the chip 7.

[0046] One side of the auxiliary block 505 is a step surface, and the other side of the auxiliary block 505 is tightly fitted with the side wall of the groove 701. A cutting path 504 is left between the two auxiliary blocks 505. The distance of the cutting path 504 is greater than the thickness of the tool 8. The purpose of reserving the cutting path 504 is to facilitate the passage of the tool 8 so that the tool 8 can act on the chip 7.

[0047] Since one side of the auxiliary block 505 is a step surface, specifically, the two side surfaces of the auxiliary block 505 adjacent to the cutting path 504 are sequentially provided with a first step surface 510 and a second step surface 509 from bottom to top. By reasonably dividing the area above the cutting path 504, silicon powder can be effectively avoided from being blocked in the cutting path 504. Moreover, since the first step surface 510 and the second step surface 509 are provided, it can also protect the chip and be suitable for tools of different thicknesses. Furthermore, when the thickness of the tool 8 is relatively thick, the tool 8 can be first applied to the first step surface 510. Since the maximum length of the auxiliary block 505 is greater than the length of the chip, the force of the tool 8 is applied to the first step surface 510 and the chip 7, and the force of the tool 8 applied to the chip 7 is partially dispersed through the first step surface 510.

[0048] During operation, before cutting, one side of the auxiliary block 505 is first pressed against the bottom of the groove 701, and the tool 8 acts on the chip 7. The bottom of the tool 8 is located in the cutting path 504, and the silicon powder is accumulated on the first step surface 510 and the second step surface 509 by the force of the tool 8.

[0049] Embodiment 2

[0050] Based on the above-mentioned embodiment 1, the design of the clamping module 5 in the embodiment 1 needs to be specially designed according to the size of the groove 701 of the chip 7. Therefore, the application scenario of the clamping module 5 is limited. In order to expand the application scope of the clamping module 5, as shown in FIG. Figure 2 to Figure 5 As shown, slideways 506 are provided at both end surfaces of the auxiliary block 505, and the longitudinal extension plates 501 are slidably connected to the both end surfaces of the auxiliary block 505. The two ends of the inner side surface of the longitudinal extension plate 501 are slidably connected to the slideways 506. The design of the longitudinal extension plate 510 limits the positions of the two auxiliary blocks 505 to prevent the auxiliary blocks 505 from moving in the groove 701, and the longitudinal extension plate 510 and the auxiliary block 505 are detachably connected.

[0051] Similarly, a load-bearing plate 503 is clamped between the longitudinal extension plates 501, and the center line of the load-bearing plate 503 coincides with the cutting line on the chip 7. By setting the load-bearing plate 503, the stress on the chip 7 is dispersed, further preventing the bottom end surface of the chip 7 from being affected by the cutting action.

[0052] A track 511 is symmetrically installed on the top of the auxiliary block 505, and a slider 508 is slidably connected to the track 511. A transverse extension plate 502 is fixedly installed on two longitudinally distributed sliders 508, and an extension block is symmetrically installed on the transverse extension plate 502. The structure of the extension block is the same as that of the auxiliary block 505 in Example 1. A cavity 507 is provided in the auxiliary block 505, and the extension block is located in the cavity 507, and the extension block and the cavity 507 are slidably connected. By setting the extension block to extend the effective length of the auxiliary block 505, it is suitable for cutting chips of different diameters. When the chip is of small diameter, the extension block is retracted into the cavity 507.

[0053] During operation, the effective length of the clamping module 5 is adjusted according to the diameter of the chip 7. When cutting a small-diameter chip, the extension block is located in the cavity 507. When cutting a large-diameter chip, the extension block is pulled out of the cavity 507 (just pull the transverse extension plate 502 outward), and the longitudinal extension plate 501 is slidably installed on the extension block, thereby limiting the distance between the two extension blocks (i.e., the two auxiliary blocks 505). Part of the silicon powder is accumulated on the first step surface 510 and the second step surface 509 under the action of the tool 8, and the other part of the silicon powder automatically falls on the load-bearing plate 503 as the chip 7 is cut.

[0054] Embodiment 3

[0055] Based on the above embodiment 2, in order to further install the tool, as shown in FIG. Figure 1 As shown, a cutting module 4 is installed on the machine tool 1, and the cutting module 4 is located above the clamping module 5. A control module 6, an operation module 2 and a warning module 3 are also installed on the machine tool 1. The operator sends instructions to the control module 6 through the operation module 2, and the control module 6 sends work instructions to the power components on the machine tool 1. The cutting module 4 cuts the chip. Furthermore, the warning module 3 is set to facilitate intuitive grasp of the working status of the machine tool 1.

[0056] like Figure 6 to Figure 10 As shown, the cutting module 4 includes a left tool holder disc 403 and a right tool holder disc 409, and the left tool holder disc 403 and the right tool holder disc 409 are clamped and fixed on the tool holder shaft 410. One end of the tool holder shaft 410 is connected to a driving motor, and the driving motor is installed on the machine tool 1. When the driving motor drives the tool holder shaft 410 to rotate, the left tool holder disc 403 and the right tool holder disc 409 rotate together with the tool holder shaft 410. The left tool holder disc 403 is evenly provided with arc grooves 401 in a circumferential direction, and the tool 8 is installed in the arc groove 401, that is, a plurality of tools are installed in the left tool holder disc 403 and the right tool holder disc 409, so that the cutting module 4 can be applied to cutting scenarios of various chips.

[0057] The left mounting seat 423 is rotatably installed on the left tool holder disc 403, and the rotating shaft 402 passes through the arc groove 401. The left mounting seat 423 is fixedly sleeved in the rotating shaft 402. A tool shaft 422 is welded in the left mounting seat 423, and the tool 8 is sleeved on the tool shaft 422. The tool 8 rotates with the rotation of the tool shaft 422. At the same time, the tool 8 and the tool shaft 422 are detachably connected to facilitate the sliding of the tool. A right mounting seat 424 is rotatably installed in the right tool holder disc 409, and the right mounting seat 424 is sleeved on the rotating shaft 402 and is clamped with the left mounting seat 423. The tool is further fixed and installed by the left mounting seat 423 and the right mounting seat 424, and the angle of the tool 8 itself can also be rotated. A working motor of the tool is connected to one end of the tool shaft 422. When the working motor drives the tool shaft 422 to swing, the tool 8 swings with the tool shaft 422, and the swing range of the tool 8 is within the left mounting seat 423 and the right mounting seat 424.

[0058] Furthermore, structures for limiting the position of the tool 8 are installed on the left mounting seat 423 and the right mounting seat 424. Since the thickness of the tool 8 is different, the left mounting seat 423 and the right mounting seat 424 are provided with self-adjustable limiting structures.

[0059] Specifically, a left clamping piece 420 is installed on the left mounting seat 423, and a right clamping piece 412 is installed on the right mounting seat 424. The two ends of the left clamping piece 420 and the right clamping piece 412 are respectively fixed to the left tool holder disc 403 and the right tool holder disc 409 by fasteners 421. Threaded holes are provided along the left tool holder disc 403 and the right tool holder disc 409 along the track 411. The positions of the threaded holes are arranged at intervals. A protrusion 414 is provided on the right clamping piece 412, and a rubber pad 413 is bonded to the protrusion 414. The left clamping piece 420 and the right clamping piece 412 have the same structure. The rubber pad 413 fits tightly against the tool 8. The rubber pad 413 fits tightly against the tool 8 through its own elasticity, thereby completing the positioning of tools of different thicknesses.

[0060] Embodiment 4

[0061] Based on the above-mentioned second embodiment, in order to avoid the accumulation of silicon powder, this embodiment combines a water spray structure to efficiently remove the silicon powder in the groove 701. Figure 6 to Figure 10 As shown, a main water spray pipe 404 is installed between the left mounting seat 423 and the right mounting seat 424, and the water spray port of the main water spray pipe 404 is located just above and in front of the cutting point of the tool 8. The angle between the water spray direction of the main water spray pipe 404 and the moving direction of the tool 8 is greater than 90 degrees. The water spray of the main water spray pipe 404 moves along with the movement of the tool 8, and the water spraying point of the main water spray pipe 404 coincides with the cutting point of the tool 8. Firstly, the silicon powder cut by the tool 8 can be quickly flushed to avoid the silicon powder sticking to the tool 8. Secondly, it can ensure that the tool 8 always maintains the best cutting state, improve the cutting efficiency, and indirectly avoid damage to the chip.

[0062] In order to facilitate the fixation of the main water spray pipe 404, an upper mounting portion 415 and a lower mounting portion 416 are provided on the main water spray pipe 404, and a track one 405, a track two 406, a track three 407 and a track four 408 are provided on the left tool holder disc 403. The two ends of the upper mounting portion 415 slide on the track three 407 and the track four 408 on the left tool holder disc 403 respectively, and one end of the lower mounting portion 416 slides on the left tool holder disc 403 along the track one 405, so that the water spray pipe 404 can rotate with the rotation of the angle of the tool 8, and the upper mounting portion 415 and the lower mounting portion 416 can be fixed in a variety of positions.

[0063] In order to clean the silicon powder on both sides of the tool 8 in time, auxiliary water spray pipes 425 are respectively installed on the left mounting seat 423 and the right mounting seat 424. The water spray ports 417 of the auxiliary water spray pipes 425 are located on both sides of the tool 8. The liquid in the auxiliary water spray pipes 425 moves along the spray trajectory 418 and lands at the action point 419. The action point 419 of the auxiliary water spray pipes 425 is located on both sides of the tool 8, and the action point 419 of the auxiliary water spray pipes 425 is located behind the cutting point of the tool 8. The spray trajectory 418 of the auxiliary water spray pipe 425 and the water spray direction of the main water spray pipe 404 are consistent with the moving direction of the tool 8, which can effectively prevent silicon powder from accumulating in the cutting path.

[0064] During operation, while the tool 8 is cutting the chip, the main water spray pipe 404 and the auxiliary water spray pipe 425 work together. When the tool 8 moves, the silicon powder on the chip will move with the tool. At this time, the water sprayed from the main water spray pipe 404 and the auxiliary water spray pipe 425 respectively impacts the cutting point of the tool 8 and the two sides of the tool 8, thereby quickly and timely removing the silicon powder around the tool 8 to avoid the accumulation of silicon powder.

[0065] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A processing device for wafer cutting, comprising a machine tool and a chip, wherein a processing area is provided in the machine tool, and the chip is installed in the processing area, characterized in that: A groove is opened in the chip, and the center line of the groove coincides with the cutting line on the chip. A clamping module is installed in the chip, and the clamping module includes two auxiliary blocks. The two auxiliary blocks are relatively installed in the groove, one side of the auxiliary block is a step surface, and the other side of the auxiliary block is tightly fitted with the side wall of the groove. A cutting path is left between the two auxiliary blocks, and the distance of the cutting path is greater than the thickness of the tool.

2. The processing device for wafer cutting according to claim 1, characterized in that: The two side surfaces of the auxiliary block adjacent to the cutting path are sequentially provided with a first step surface and a second step surface from bottom to top.

3. The processing device for wafer cutting according to claim 2, characterized in that: Slideways are provided at both end surfaces of the auxiliary block, and longitudinal extension plates are slidably connected to the two end surfaces of the auxiliary block. Both ends of the inner side surfaces of the longitudinal extension plates are slidably connected to the slideways, and load-bearing plates are clamped between the longitudinal extension plates. The center line of the load-bearing plates coincides with the cutting line on the chip.

4. The processing device for wafer cutting according to claim 3, characterized in that: A track is symmetrically installed on the top of the auxiliary block, a slider is slidably connected to the track, and transverse extension plates are fixedly installed on two longitudinally distributed sliders, and extension blocks are symmetrically installed on the transverse extension plates. A cavity is provided in the auxiliary block, and the extension block is located in the cavity, and the extension block and the cavity are slidably connected.

5. The processing device for wafer cutting according to claim 1, characterized in that: The machine tool is equipped with a cutting module, and the cutting module is located above the clamping module. The machine tool is also equipped with a control module, an operation module and a warning module.

6. The processing device for wafer cutting according to claim 5, characterized in that: The cutting module includes a left tool holder disc and a right tool holder disc, which are clamped and fixed on the tool holder shaft. A drive motor is connected to one end of the tool holder shaft, and the drive motor is installed on the machine tool. Arc grooves are evenly opened in the circumferential direction in the left tool holder disc, and the tool is installed in the arc groove.

7. The processing device for wafer cutting according to claim 6, characterized in that: A left mounting seat is rotatably mounted on the left tool holder disc, a rotating shaft passes through the circular arc groove, the left mounting seat is fixedly sleeved in the rotating shaft, a tool shaft is welded in the left mounting seat, and the tool is sleeved on the tool shaft, and a right mounting seat is rotatably mounted in the right tool holder disc, the right mounting seat is sleeved on the rotating shaft and clamped with the left mounting seat.

8. The processing device for wafer cutting according to claim 6 or 7, characterized in that: The left mounting seat and the right mounting seat are installed with structures for limiting the position of the tool, the left mounting seat is installed with a left clamping piece, and the right mounting seat is installed with a right clamping piece, the two ends of the left clamping piece and the right clamping piece are respectively fixed to the left tool holder disc and the right tool holder disc by fasteners, the left tool holder disc is provided with threaded holes along track two, and the right tool holder disc is provided with threaded holes along track five, the right clamping piece is provided with a protrusion, and a rubber pad is bonded to the protrusion, the left clamping piece and the right clamping piece have the same structure, and the rubber pad fits tightly to the tool.

9. The processing device for wafer cutting according to claim 7, characterized in that: A main water spray pipe is installed between the left mounting seat and the right mounting seat, and the water spray port of the main water spray pipe is located just above and in front of the cutting point of the tool, and the angle between the water spray direction of the main water spray pipe and the moving direction of the tool is greater than 90 degrees. The main water spray pipe is provided with an upper mounting portion and a lower mounting portion, and the left tool holder disc is provided with track one, track two, track three and track four, and two ends of the upper mounting portion slide on track three and track four on the left tool holder disc respectively, and one end of the lower mounting portion slides along track one on the left tool holder disc, and auxiliary water spray pipes are respectively installed on the left mounting seat and the right mounting seat, and the water spray ports of the auxiliary water spray pipes are located on both sides of the tool, and the liquid in the auxiliary water spray pipe moves along the spray trajectory and lands at the action point, and the action point of the auxiliary water spray pipe is located on both sides of the tool, and the action point of the auxiliary water spray pipe is located behind the cutting point of the tool.

10. An operating method using the processing device for wafer cutting according to any one of claims 1 to 9, characterized in that: Operation method of small diameter chip cutting: S1, before cutting, one side of the auxiliary block is installed close to the side wall of the groove. After the auxiliary block is installed, ensure that the tool acts on the chip and the bottom of the tool is located in the cutting path; S2, install the tool, clamp the right tool holder disc on the left tool holder disc, and make the rubber pads on the left tool holder disc and the right tool holder disc fit the tool tightly; S3, adjusting the angle of the tool, the working motor drives the tool shaft to rotate, the tool rotates along with the tool shaft, and the positions of the left clamping member and the right clamping member are fixed according to the position of the tool; S4, the tool moves to cut the chip, and a working instruction is sent to the driving component of the tool through the control module. At the same time, the main water spray pipe and the auxiliary water spray pipe work together, and the water sprayed from the main water spray pipe and the auxiliary water spray pipe respectively impacts the cutting point of the tool and both sides of the tool until the cutting action of the tool stops; Operation method of large diameter chip cutting: S1, adjust the effective length of the clamping module according to the diameter of the chip, pull the extension block out of the cavity, that is, pull the horizontal extension plate outward, slide the longitudinal extension plate on the extension block, and install one side of the auxiliary block close to the side wall of the groove. After the auxiliary block is installed, ensure that the tool acts on the chip and the bottom of the tool is located in the cutting path; S2, install the tool, clamp the right tool holder disc on the left tool holder disc, and make the rubber pads on the left tool holder disc and the right tool holder disc fit the tool tightly; S3, adjusting the angle of the tool, the working motor drives the tool shaft to rotate, the tool rotates along with the tool shaft, and the positions of the left clamping member and the right clamping member are fixed according to the position of the tool; S4, the tool moves to cut the chip, and a work instruction is sent to the driving component of the tool through the control module. At the same time, the main water spray pipe and the auxiliary water spray pipe work together. The water sprayed from the main water spray pipe and the auxiliary water spray pipe respectively impacts the cutting point of the tool and both sides of the tool until the cutting action of the tool stops.

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