Four-station whole solar silicon wafer printing machine

Abstract

The invention discloses a four-station whole solar silicon wafer printing machine. The solar silicon wafer printing machine comprises a base, and a plate feeding guide rail, a detection camera assembly, a turntable assembly, a lifting module, a UVW deviation rectifying and aligning mechanism and a plate discharging guide rail which are mounted on the base, the UVW deviation rectifying and aligning mechanism comprises two Y-axis modules, an X-axis module, a printing platform, a steel mesh frame and a printing scraper kit, the two Y-axis modules and the X-axis module are installed at the lower end of the printing platform, the driving ends of the Y-axis modules and the driving ends of the X-axis modules are connected to the steel mesh frame, and the printing scraper kit moves on the printing platform in the left-right direction. According to the four-station full-wafer solar silicon wafer printing machine, the two Y-axis modules and the X-axis module are matched with the detection camera assembly to achieve rotation movement with any point on the plane as the center and translation (X, Y and theta three-axis movement) in any direction, alignment of a steel mesh and a silicon wafer is met, and printing in the left-right direction is different from existing front-back printing.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer production, and in particular to a four-station whole-wafer solar silicon wafer printing machine. Background Art

[0002] Photovoltaic solar silicon wafers are the core part of the solar power generation system and also the most valuable part of the solar power generation system. The role of the silicon wafer is to convert solar energy into electrical energy, which is stored in batteries or directly loaded for work. In current printing machines, the X-axis (controls left and right), Y-axis (controls front and back) and T-axis (controls rotation) are usually required to match the steel mesh with the silicon wafer. Too many structures are used, resulting in poor precision. In addition, the forward and backward movement of the scraper is controlled by a motor and a screw rod, which is inefficient and affects the process. Summary of the invention

[0003] One purpose of the present invention is to provide a four-station full-piece solar silicon wafer printing machine, which reduces the structure of the T-axis and adopts the movement of two groups of Y-axis modules and one group of X-axis modules to be responsible for the rotation on the T-axis, thereby saving structure and improving efficiency. At the same time, the lifting part adopts a new lifting structure to replace the mechanism composed of splines, ball screws, synchronous wheels, synchronous belts and servo motors.

[0004] To achieve this object, the present invention adopts the following technical solutions:

[0005] A four-station whole-piece solar silicon wafer printer comprises a base and a board feed guide rail, a detection camera assembly, a turntable assembly, a lifting module, a UVW correction and alignment mechanism, and a board discharge guide rail installed on the base; the board feed guide rail and the board discharge guide rail are respectively located on both sides of the base, the turntable assembly is in the middle of the base, the detection camera assembly is above the turntable assembly, two lifting modules are respectively located on both sides of the rear of the turntable assembly, and the lifting module is connected to the bottom of the UVW correction and alignment mechanism; the UVW correction and alignment mechanism comprises two groups of Y-axis modules, one group of X-axis modules, a printing platform, a steel mesh frame and a printing scraper kit, the two groups of Y-axis modules and one group of X-axis modules are both installed at the lower end of the printing platform, the driving end of the Y-axis module and the driving end of the X-axis module are both connected to the steel mesh frame, a transverse scraper module is installed on the printing platform, the driving end of the transverse scraper module is connected to the printing scraper kit, and the printing scraper kit moves on the printing platform along the left and right directions.

[0006] As a preferred technical solution, the X-axis module and the Y-axis module adopt the same module mechanism, and the module mechanism includes a module base plate, a module motor, an adjustment screw and an adjustment slide. The driving end of the module motor is transmission-connected to the adjustment screw, and the adjustment screw is threadedly connected to the adjustment nut under the adjustment slide. The adjustment slide slides along the length direction of the adjustment screw, and a connecting bearing is provided on the adjustment slide. The connecting bearing slides on the adjustment slide, and the moving direction of the connecting bearing is perpendicular to the moving direction of the adjustment slide, and the edge of the steel mesh frame is locked in the connecting bearing.

[0007] As a preferred technical solution, a snapping motor is installed on the plate feed guide rail, the driving end key of the snapping motor is connected to a snapping synchronous wheel, the snapping synchronous wheel is transmission-connected to a snapping synchronous belt, a snapping plate is fixed on the snapping synchronous belt, and the snapping plate is rotatably connected to the snapping wheel.

[0008] As a preferred technical solution, the turntable assembly includes a circular turntable, an electrical integrated slip ring and a turntable motor. Four groups of workstations are installed around the circular turntable, and each group of the workstations is provided with a whole-piece printing position. The driving end of the turntable motor is vertically connected to the electrical integrated slip ring, and the middle part of the circular turntable is connected to the electrical integrated slip ring. The lower end of the circular turntable is rotatably connected to a paper roll transport component, and the paper roll transport component includes a unwinding shaft and a winding shaft. A paper roll is transmission-connected between the unwinding shaft and the winding shaft. The paper roll passes through the whole-piece printing position and carries the silicon wafer, thereby transporting the silicon wafer. The paper roll is air permeable, and the paper roll transport component transports the silicon wafer to the workstation of the circular turntable and to the whole-piece printing position.

[0009] As a preferred technical solution, the positions between the four groups of workstations of the circular turntable form a fan-shaped area, which stores the discharger elements and control components together with the middle position of the circular turntable, and then is covered with a protective cover. Each of the whole-piece printing positions is provided with a breathable negative pressure plate, and a plurality of air holes are arranged on the breathable negative pressure plate. The air holes adsorb and fix the silicon wafer on the whole-piece printing position through the roll of paper.

[0010] As a preferred technical solution, the detection camera assembly includes an in-board vision module and an out-board vision module, the in-board vision module is provided with an in-board camera and four mark point cameras, the upper end of the mark point camera is adjusted along the front-to-back direction on the in-board vision module, the out-board vision module is provided with an out-board camera, the upper end of the out-board camera is adjusted along the front-to-back direction on the out-board vision module.

[0011] As a preferred technical solution, the lower end of the printing scraper kit is connected to a slurry scraper, and the upper end of the printing scraper kit is equipped with a scraper motor. The scraper motor controls the slurry scraper to move in the vertical direction through a ball screw and a ball nut. The lower end of the printing scraper kit is also connected to an ink return knife, and the upper end of the printing scraper kit is also equipped with an ink return motor. The ink return motor also controls the ink return knife seat with the ink return knife to move in the vertical direction through a ball screw and a ball nut. The two ends of the ink return knife are respectively locked on the two ends of the ink return knife seat.

[0012] As a preferred technical solution, the lifting module includes a side bracket, a lifting servo motor is installed on the upper end of the side bracket, a lifting ball screw is connected to the driving end of the lifting servo motor, lifting plates are connected on both sides of the printing module, a lifting ball nut is fixed to the outer side of the lifting plate, the lifting ball screw is threadedly connected to the lifting ball nut, the lifting plate slides on the side bracket along the vertical direction, a lifting guide rail is installed on the side bracket, a lifting slider is fixed to the outer side of the lifting plate, and the lifting slider slides on the lifting guide rail.

[0013] As a preferred technical solution, a fragment lifting cylinder is installed on the plate outlet guide rail, and the driving end of the fragment lifting cylinder is upwardly connected to a fragment lifting plate, and both sides of the fragment lifting plate are located on the outside of the plate outlet guide rail. A detection bracket is installed at the rear end of the plate outlet guide rail, and a sensor is installed on the top of the detection bracket. The sensor is located above the plate outlet guide rail, and the sensor is used to sense whether there is a fragment blockage in the rear drying furnace or sintering furnace.

[0014] The beneficial effects of the present invention are as follows: a four-station whole-piece solar silicon wafer printer is provided. The four-station whole-piece solar silicon wafer printer can realize rotational movement and translation in any direction (X, Y, θ three-axis movement) centered on any point on the plane through the movement of two groups of Y-axis modules and one group of X-axis modules, in conjunction with a detection camera assembly, to meet the alignment between the steel mesh and the silicon wafer, and the printing in the left and right directions is different from the existing front and back printing. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention is further described in detail below based on the accompanying drawings and embodiments.

[0016] Figure 1 This is a first structural schematic diagram of a four-station full-sheet solar silicon wafer printing machine according to an embodiment;

[0017] Figure 2 It is a second structural schematic diagram of a four-station full-sheet solar silicon wafer printing machine described in an embodiment;

[0018] Figure 3It is a structural schematic diagram of the plate entry guide rail described in the embodiment;

[0019] Figure 4 It is a structural schematic diagram of the detection camera assembly described in the embodiment;

[0020] Figure 5 It is a first structural schematic diagram of the turntable assembly according to the embodiment;

[0021] Figure 6 is a second structural schematic diagram of the turntable assembly according to the embodiment;

[0022] Figure 7 is a schematic structural diagram of a turntable motor according to an embodiment;

[0023] Figure 8 It is a combined structural diagram of the UVW deviation correction and alignment mechanism and the lifting module described in the embodiment;

[0024] Fig. 9 It is a structural schematic diagram of the UVW deviation correction and alignment mechanism described in the embodiment;

[0025] Fig.10 An exploded view of the X-axis module described in the embodiment;

[0026] Fig.11 It is a structural schematic diagram of the lifting module described in the embodiment;

[0027] Fig.12 It is a structural schematic diagram of the printing scraper kit described in the embodiment;

[0028] Fig.13 An exploded view of the printing scraper kit according to the embodiment;

[0029] Fig.14 It is a schematic structural diagram of the plate outlet guide rail described in the embodiment.

[0030] Figures 1 to 14 middle:

[0031] 1. Board inlet guide rail; 2. Detection camera assembly; 3. Turntable assembly; 4. Lifting module; 5. UVW deviation correction and alignment mechanism; 6. Board outlet guide rail; 7. Base;

[0032] 101, snap-on motor; 102, snap-on plate; 103, snap-on wheel;

[0033] 201, board-in visual module; 202, board-out visual module; 203, mark point camera; 204, board-out camera;

[0034] 301, circular turntable; 302, electrical integrated slip ring; 303, turntable motor; 304, whole sheet printing position; 305, unwinding shaft; 306, rewinding shaft; 307, protective cover; 308, air permeable negative pressure plate;

[0035] 401, side bracket; 402, lifting servo motor; 403, lifting ball screw; 404, lifting plate; 405, lifting guide rail;

[0036] 501, Y-axis module; 502, X-axis module; 503, printing platform; 504, steel mesh frame; 505, printing scraper kit; 506, horizontal scraper module; 507, module bottom plate; 508, module motor; 509, adjustment screw rod; 510, adjustment slide; 511, connecting bearing; 512, slurry scraper; 513, scraper motor; 514, ink return knife; 515, ink return motor; 516, ink return knife seat;

[0037] 601, fragment lifting cylinder; 602, fragment lifting plate; 603, detection bracket; 604, sensor. DETAILED DESCRIPTION

[0038] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0039] like Figures 1 to 14 As shown, in this embodiment, a four-station full-piece solar silicon wafer printing machine includes a base 7 and a board feed guide 1, a detection camera assembly 2, a turntable assembly 3, a lifting module 4, a UVW correction and alignment mechanism 5, and a board output guide 6 installed on the base 7; the board feed guide 1 and the board output guide 6 are respectively located on both sides of the base 7, the turntable assembly 3 is in the middle of the base 7, the detection camera assembly 2 is above the turntable assembly 3, and the two lifting modules 4 are respectively located on both sides of the rear of the turntable assembly 3, and the lifting module 4 is connected to the bottom of the UVW correction and alignment mechanism 5.

[0040] The front end places the silicon wafer on the board feed guide rail 1, and the board feed guide rail 1 moves the silicon wafer into the turntable assembly 3. The detection camera assembly 2 performs visual alignment, and the turntable assembly 3 rotates the silicon wafer to the back side. The two groups of Y-axis modules 501 and one group of X-axis modules 502 on the UVW correction and alignment mechanism 5 control the alignment in the X-axis direction, the Y-axis direction and the T-axis direction, so that the UVW correction and alignment mechanism 5 with the steel mesh is aligned with the position of the silicon wafer, and the lifting module 4 controls the steel mesh to move down to the silicon wafer, scrapes the slurry onto the silicon wafer, and then lifts the UVW correction and alignment mechanism 5. The turntable assembly 3 transfers the silicon wafer to the board outlet guide rail 6 for output.

[0041] The UVW deflection correction and alignment mechanism 5 is a high-precision mobile structure specially designed for high-precision alignment equipment. It is also commonly referred to as an XXY platform. As a three-axis parallel motion mechanism, it can realize rotational motion centered on any point on the plane and translation in any direction (X, Y, and θ three-axis motion in the plane) by controlling the parallel motion of three linear moving structures. The UVW deflection correction and alignment mechanism 5 cooperates with the following visual module to realize high-precision alignment function and can be applied in the printing industry.

[0042] More specifically, the implementation process of the UVW correction and alignment mechanism 5 includes determining the transformation matrix from the camera coordinate system to the UVW platform coordinate system through a visual calibration method, and the coordinate value of the marker template based on the origin coordinate system on the UVW correction and alignment mechanism 5, and obtaining the x, y, and θ offsets between the marker template position and the marker to be corrected (based on the origin coordinate system of the UVW correction and alignment mechanism 5) through a visual module, and then entering the initial coordinates of the three axes according to the formula, setting the rotation center to (0, 0), and entering the θ offset to obtain new coordinate values ​​of the UVW three axes, the new coordinates of the object to be corrected, and the corresponding feed amounts of the three motors. This series of operations decomposes the motion process into translation and rotation parts, and calculates the motor feed amounts respectively, thereby achieving precise automatic positioning, and the alignment accuracy can reach the micron level.

[0043] The specific structure is as follows:

[0044] The UVW deviation correction and alignment mechanism 5 includes two groups of Y-axis modules 501, one group of X-axis modules 502, a printing platform 503, a steel mesh frame 504 and a printing scraper kit 505. The two groups of Y-axis modules 501 and one group of X-axis modules 502 are installed at the lower end of the printing platform 503. The driving end of the Y-axis module 501 and the driving end of the X-axis module 502 are both connected to the steel mesh frame 504. A transverse scraper module 506 is installed on the printing platform 503. The driving end of the transverse scraper module 506 is connected to the printing scraper kit 505. The printing scraper kit 505 moves on the printing platform 503 along the left and right directions.

[0045] The X-axis module 502 and the Y-axis module 501 use the same module mechanism, which includes a module base plate 507, a module motor 508, an adjustment screw 509 and an adjustment slide 510. The driving end of the module motor 508 is connected to the adjustment screw 509 by transmission. The adjustment screw 509 is threadedly connected to the adjustment nut under the adjustment slide 510. The adjustment slide 510 slides along the length direction of the adjustment screw 509, and a connecting bearing 511 is provided on the adjustment slide 510. The connecting bearing 511 slides on the adjustment slide 510, and the moving direction of the connecting bearing 511 is perpendicular to the moving direction of the adjustment slide 510. The edge of the steel mesh frame 504 is locked in the connecting bearing 511, and two groups of Y-axis modules 501 plus a group of X-axis modules 502 jointly control the T-axis steering of a steel mesh frame 504, and an auxiliary bearing is arranged on the steel mesh frame 504, and an auxiliary X-axis slide rail is arranged on the UVW deviation correction and alignment mechanism 5, an auxiliary X-axis slider is slid on the auxiliary X-axis slide rail, an auxiliary Y-axis slider is fixed on the auxiliary X-axis slider, the auxiliary Y-axis slider is slidably connected with the auxiliary Y-axis slide rail, and the auxiliary bearing is installed on the auxiliary Y-axis slide rail, and the T-axis of the steel mesh frame 504 is adjusted in cooperation with the two groups of X-axis modules 502 plus the Y-axis module 501.

[0046] A snapping motor 101 is installed on the board feed guide 1, and the driving end key of the snapping motor 101 is connected with a snapping synchronous wheel, and the snapping synchronous wheel is connected with a snapping synchronous belt. A snapping plate 102 is fixed on the snapping synchronous belt, and the snapping plate 102 is rotatably connected with a snapping wheel 103. When the silicon wafer transported from the front is uneven, the snapping motor 101 controls the rotation of the snapping synchronous wheel and links the snapping synchronous belt transmission to make the snapping plates 102 on both sides of the board feed guide 1 move closer to the middle, and flatten the silicon wafer in the middle position of the board feed guide 1, and the snapping wheel 103 reduces the hard collision between the snapping plate 102 and the side of the silicon wafer.

[0047] The turntable assembly 3 includes a circular turntable 301, an electrical integrated slip ring 302 and a turntable motor 303. Four groups of workstations are installed around the circular turntable 301, and each group of workstations is provided with a whole-piece printing position 304. The driving end of the turntable motor 303 is vertically connected to the electrical integrated slip ring 302, and the middle part of the circular turntable 301 is connected to the electrical integrated slip ring 302. The lower end of the circular turntable 301 is rotatably connected to a roll paper transport component, and the roll paper transport component includes a unwinding shaft 305 and a winding shaft 306. A roll paper is transmission-connected between the unwinding shaft 305 and the winding shaft 306. The roll paper passes through the whole-piece printing position 304 and carries the silicon wafer, thereby transporting the silicon wafer. The roll paper is air permeable, and the roll paper transport component transports the silicon wafer to the workstation of the circular turntable 301 and to the whole-piece printing position 304.

[0048] The positions between the four groups of workstations of the circular turntable 301 form a fan-shaped area, which stores the discharger elements and control components together with the middle position of the circular turntable 301, and then is covered with a protective cover 307. Each full-sheet printing position 304 is provided with a breathable negative pressure plate 308, and the breathable negative pressure plate 308 is provided with a plurality of breathable holes. The breathable holes pass through the roll paper to adsorb and fix the silicon wafer on the full-sheet printing position 304.

[0049] The silicon wafer on the infeed guide rail 1 is placed at the whole-piece printing position 304, and the turntable motor 303 provides power to control the electrical integrated slip ring 302 to link the circular turntable 301 to rotate in the horizontal direction, driving the silicon wafer to move to the bottom of the steel mesh frame 504. At the same time, the printed silicon wafer is moved from the bottom of the steel mesh frame 504 to the front of the outfeed guide rail 6, and the winding shaft 306 and the unwinding shaft 305 rotate synchronously to wipe the whole-piece printing position 304 with the clean roll of paper.

[0050] The detection camera assembly 2 includes a board-input vision module 201 and a board-output vision module 202. The board-input vision module 201 is provided with a board-input camera and four mark point cameras 203. The four mark point cameras 203 are located around the board-input vision module 201, and one board-input camera is located in the middle of the board-input vision module 201. The board-input camera is used to detect whether there are fragments, and the mark point camera 203 is used to detect the current position of the silicon wafer. The upper end of the mark point camera 203 is adjusted along the front-to-back direction on the board-input vision module 201, and the board-output vision module 202 is provided with an board-output camera 204. The upper end of the board-output camera 204 is adjusted along the front-to-back direction on the board-output vision module 202.

[0051] The silicon wafer conveyed from the board feeding guide 1 is brought to the whole-piece printing position 304 under the action of the rolling paper, and the upper board feeding vision module 201 photographs and locates the silicon wafer. According to the position of the silicon wafer, the steel mesh on the UVW correction and alignment mechanism 5 is independently adjusted in the XYT direction to meet the position requirements of the silicon wafer. When the board is out, the board out vision module 202 photographs the printing of the silicon wafer again. After completion, the paper roll assists in driving the silicon wafer to leave the whole-piece printing position 304 and enter the board out guide 6.

[0052] The lifting module 4 includes a side bracket 401, a lifting servo motor 402 is installed on the upper end of the side bracket 401, and the driving end of the lifting servo motor 402 is connected to a lifting ball screw 403, and both sides of the printing module are connected to lifting plates 404, and a lifting ball nut is fixed to the outer side of the lifting plate 404, and the lifting ball screw 403 is threadedly connected to the lifting ball nut, and the lifting plate 404 slides on the side bracket 401 along the vertical direction, and a lifting guide rail 405 is installed on the side bracket 401, and a lifting slider is fixed to the outer side of the lifting plate 404, and the lifting slider slides on the lifting guide rail 405.

[0053] When controlling the lifting of the UVW deviation correcting and alignment mechanism 5, the lifting servo motor 402 controls the lifting ball screw 403 to rotate, and the lifting plate 404 with the lifting ball nut drives the UVW deviation correcting and alignment mechanism 5 to move along the direction of the lifting guide rail 405, so the accuracy is improved and the moving speed is also faster.

[0054] The lower end of the printing scraper kit 505 is connected to a slurry scraper 512, and the upper end of the printing scraper kit 505 is installed with a scraper motor 513. The scraper motor 513 controls the slurry scraper 512 to move in the vertical direction through a ball screw and a ball nut. The lower end of the printing scraper kit 505 is also connected to an ink return knife 514, and the upper end of the printing scraper kit 505 is also installed with an ink return motor 515. The ink return motor 515 also controls the ink return knife seat 516 with the ink return knife 514 to move in the vertical direction through a ball screw and a ball nut. The two ends of the ink return knife 514 are respectively locked on the two ends of the ink return knife seat 516.

[0055] When scraping the slurry, the scraper motor 513 controls the slurry scraper 512 to move down to the steel mesh, and the transverse scraper module 506 moves back and forth, linking the printing scraper kit 505 to move, so that the slurry scraper 512 scrapes the slurry from the steel mesh to the silicon wafer when moving back and forth.

[0056] A fragment lifting cylinder 601 is installed on the plate outlet guide rail 6, and the driving end of the fragment lifting cylinder 601 is upwardly connected to a fragment lifting plate 602, and both sides of the fragment lifting plate 602 are located on the outside of the plate outlet guide rail 6. A detection bracket 603 is installed at the rear end of the plate outlet guide rail 6, and a sensor 604 is installed on the top of the detection bracket 603. The sensor 604 is located above the plate outlet guide rail 6, and the sensor 604 is used to sense whether there is a fragment blockage in the rear drying furnace or sintering furnace.

[0057] When the silicon wafer needs to be transferred or tested on the plate-out guide rail 6, the chip-out lifting plate 602 can be lifted by the chip-out lifting cylinder 601, and the silicon wafer can be operated independently. The sensor 604 at the end of the plate-out guide rail 6 is used to sense the presence of the silicon wafer in preparation for subsequent docking.

[0058] It should be stated that the above-mentioned specific implementation methods are only preferred embodiments of the present invention and the technical principles used. Within the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by technicians familiar with this technical field should be included in the protection scope of the present invention.

Claims

1. A four-station full-sheet solar silicon wafer printer, characterized in that: It includes a base and a plate-feeding guide rail, a detection camera assembly, a turntable assembly, a lifting module, a UVW deflection correction and alignment mechanism, and a plate-discharging guide rail installed on the base; the plate-feeding guide rail and the plate-discharging guide rail are respectively located on both sides of the base, the turntable assembly is in the middle of the base, the detection camera assembly is above the turntable assembly, the two lifting modules are respectively located on both sides of the rear of the turntable assembly, and the lifting module is connected to the bottom of the UVW deflection correction and alignment mechanism; the UVW deflection correction and alignment mechanism includes two groups of Y-axis modules, one group of X-axis modules, a printing platform, a steel mesh frame and a printing scraper kit, the two groups of Y-axis modules and one group of X-axis modules are both installed at the lower end of the printing platform, the driving end of the Y-axis module and the driving end of the X-axis module are both connected to the steel mesh frame, a transverse scraper module is installed on the printing platform, the driving end of the transverse scraper module is connected to the printing scraper kit, and the printing scraper kit moves on the printing platform along the left and right directions.

2. A four-station full-sheet solar silicon wafer printer according to claim 1, characterized in that: The X-axis module and the Y-axis module adopt the same module mechanism, which includes a module base plate, a module motor, an adjustment screw and an adjustment slide. The driving end of the module motor is transmission-connected to the adjustment screw, and the adjustment screw is threadedly connected to the adjustment nut under the adjustment slide. The adjustment slide slides along the length direction of the adjustment screw, and a connecting bearing is provided on the adjustment slide. The connecting bearing slides on the adjustment slide, and the moving direction of the connecting bearing is perpendicular to the moving direction of the adjustment slide, and the edge of the steel mesh frame is locked in the connecting bearing.

3. A four-station full-sheet solar silicon wafer printer according to claim 1, characterized in that: A snapping motor is installed on the plate feeding guide rail, a driving end key of the snapping motor is connected to a snapping synchronous wheel, the snapping synchronous wheel is transmission-connected to a snapping synchronous belt, a snapping plate is fixed on the snapping synchronous belt, and the snapping plate is rotatably connected to the snapping wheel.

4. A four-station full-sheet solar silicon wafer printer according to claim 1, characterized in that: The turntable assembly includes a circular turntable, an electrical integrated slip ring and a turntable motor. Four groups of workstations are installed around the circular turntable, and each group of the workstations is provided with a whole-piece printing position. The driving end of the turntable motor is vertically connected to the electrical integrated slip ring, and the middle part of the circular turntable is connected to the electrical integrated slip ring. The lower end of the circular turntable is rotatably connected to a paper roll transport component, and the paper roll transport component includes a unwinding shaft and a winding shaft. A paper roll is transmission-connected between the unwinding shaft and the winding shaft. The paper roll passes through the whole-piece printing position and carries silicon wafers, thereby transporting silicon wafers. The paper roll is air permeable, and the paper roll transport component transports the silicon wafers to the workstations of the circular turntable and to the whole-piece printing position.

5. A four-station full-sheet solar silicon wafer printer according to claim 4, characterized in that: The positions between the four groups of workstations of the circular turntable form a fan-shaped area, which stores the discharger elements and control components together with the middle position of the circular turntable, and then is covered with a protective cover. Each of the whole-piece printing positions is provided with a breathable negative pressure plate, and a plurality of breathable holes are arranged on the breathable negative pressure plate. The breathable holes pass through the roll paper to adsorb and fix the silicon wafer on the whole-piece printing position.

6. A four-station full-sheet solar silicon wafer printer according to claim 1, characterized in that: The inspection camera assembly includes an in-board vision module and an out-board vision module, wherein an in-board camera and four mark point cameras are arranged on the in-board vision module, and the upper end of the mark point camera is adjusted on the in-board vision module along the front-to-back direction, and an out-board camera is arranged on the out-board vision module, and the upper end of the out-board camera is adjusted on the out-board vision module along the front-to-back direction.

7. The four-station full-sheet solar silicon wafer printer according to claim 1, characterized in that: The lower end of the printing scraper kit is connected to a slurry scraper, and the upper end of the printing scraper kit is equipped with a scraper motor. The scraper motor controls the slurry scraper to move in the vertical direction through a ball screw and a ball nut. The lower end of the printing scraper kit is also connected to an ink return knife, and the upper end of the printing scraper kit is also equipped with an ink return motor. The ink return motor also controls the ink return knife seat with the ink return knife to move in the vertical direction through a ball screw and a ball nut. The two ends of the ink return knife are respectively locked on the two ends of the ink return knife seat.

8. The four-station full-sheet solar silicon wafer printer according to claim 1, characterized in that: The lifting module includes a side bracket, a lifting servo motor is installed on the upper end of the side bracket, a lifting ball screw is connected to the driving end of the lifting servo motor, lifting plates are connected on both sides of the UVW deviation correction and alignment mechanism, a lifting ball nut is fixed to the outer side of the lifting plate, the lifting ball screw is threadedly connected to the lifting ball nut, the lifting plate slides on the side bracket along the vertical direction, a lifting guide rail is installed on the side bracket, a lifting slider is fixed to the outer side of the lifting plate, and the lifting slider slides on the lifting guide rail.

9. The four-station full-sheet solar silicon wafer printer according to claim 1, characterized in that: A fragment lifting cylinder is installed on the plate outlet guide rail, and the driving end of the fragment lifting cylinder is upwardly connected to a fragment lifting plate, and both sides of the fragment lifting plate are located on the outside of the plate outlet guide rail. A detection bracket is installed at the rear end of the plate outlet guide rail, and a sensor is installed on the top of the detection bracket. The sensor is located above the plate outlet guide rail, and the sensor is used to sense whether there is a fragment blockage in the rear drying furnace or sintering furnace.

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