Powder treatment agent, two-component heat conductive gel, and preparation method and application thereof

Abstract

The application discloses a powder treatment agent, a two-component heat-conducting gel and a preparation method and application thereof. The powder treatment agent is prepared through a silicon-hydrogen addition reaction of D4H cyclotetrasiloxane with vinyl silane, olefin and phenyl vinyl silicone oil in sequence; the structural formula of the vinyl silane is Vi-Si-(OR1)3, OR1 is methoxy, ethoxy, formyloxy or acetyloxy; the structural formula of the olefin is 20 >= q >= 8; and Vi is a vinyl group. The powder treatment agent has excellent temperature resistance due to the introduction of polysiloxane polymer and a phenyl group, does not degrade and volatilize under long-time high-temperature aging, ensures that the hardness and thermal resistance do not obviously increase, and has excellent thermal stability. When the powder treatment agent is used in the heat-conducting gel, the thermal stability of the heat-conducting gel is effectively improved, and the service life and cycle of electronic components are improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of high polymer materials, and more particularly, the present application relates to a powder treatment agent, a two-component heat-conducting gel prepared by using the powder treatment agent, and a preparation method and application thereof. BACKGROUND

[0002] In recent years, the automobile and electronic communication industries have developed rapidly, such as new energy vehicles, 5G communication, smart phones and notebook computers, and the heat dissipation problem has gradually attracted widespread attention. Silicone heat-conducting gels, heat-conducting pads and heat-conducting silicone grease have also been widely used. Among them, silicone heat-conducting gels can be divided into single-component and two-component. The single-component is similar to heat-conducting mud and heat-conducting silicone grease, which is a kind of amorphous material. The two-component heat-conducting gel is a mixture of two components after cross-linking and curing, which is similar to a heat-conducting pad after curing. The two-component heat-conducting gel has simple construction process and can meet various complex construction conditions.

[0003] The main function of the heat-conducting gel is heat dissipation. In a long-term high-temperature use environment, the thermal resistance and hardness will increase significantly, which will greatly affect the service life of electronic components. CN 116285366A discloses a two-component heat-conducting gel, which is prepared by mixing hydrogen-containing organopolysiloxane and tackifier to improve the interfacial compatibility between the filler and the silicone and effectively improve the adhesion between the heat-conducting gel and the interface. However, the hardness and thermal resistance of the heat-conducting gel under high-temperature aging are not tested. CN 118271851A discloses a two-component high-heat-conducting gel and a preparation method thereof. The high-heat-conducting gel is obtained by mixing a long-chain silane coupling agent. However, the stability of the heat-conducting gel under long-term use is not studied. CN 113248928A discloses a vinyl silicone oil containing long-chain alkyl side chains. The heat-conducting gel prepared by using the silicone oil has high thermal conductivity and high extrusion property. Since the powder treatment agent used is conventional hexadecylmethoxysilane, the thermal resistance stability of the heat-conducting gel under high temperature is not studied.

[0004] The increase in hardness and thermal resistance of the two-component heat-conducting gel is mainly related to the powder treatment agent. In a long-term high-temperature use environment, ordinary long-chain alkyl treatment agents are prone to cracking, and the hardness and thermal resistance increase significantly. The increase in thermal resistance will directly affect the service life of electronic components.

[0005] Therefore, it is very meaningful to provide a two-component heat-conducting gel that can maintain long-term stability of hardness and thermal resistance in a high-temperature use environment. SUMMARY

[0006] Based on this, the purpose of the present application is to provide a powder treatment agent, a two-component heat-conducting gel and a preparation method and application thereof. The present application prepares a new type of powder treatment agent from the molecular chain structure. The hardness and thermal resistance of the two-component heat-conducting gel prepared by using the powder treatment agent do not obviously increase during long-term high-temperature use, effectively improving the thermal stability of the heat-conducting gel.

[0007] The specific technical solutions for achieving the above-mentioned purposes of the application include the following.

[0008] In a first aspect of the present application, a powder treatment agent is provided, which is prepared by sequentially subjecting D4H cyclotetrasiloxane to a silicon-hydrogen addition reaction with vinyl silane, olefin and phenyl vinyl silicone oil;

[0009] In the formula, Vi-Si-(OR1)3, OR1 is methoxy, ethoxy, formyloxy or acetyloxy; the structure of the olefin is 20≥q≥8, preferably 20≥q≥12, and more preferably 15≥q≥12; and Vi is a vinyl group.

[0010] In a second aspect of the present application, a powder treatment agent is provided, which has a structure as shown in formula (I):

[0011]

[0012] In the formula, two of A, B, C and D are the same substituent group having a structure of formula (II), and the other two are substituent groups having structures of formula (III) and formula (IV), respectively.

[0013]

[0014] In formula (II), 20≥q≥8; in formula (III), 20≥m≥5 and 20≥n≥5, and Vi is a vinyl group; and in formula (IV), OR1 is methoxy, ethoxy, formyloxy or acetyloxy.

[0015] In a third aspect of the present application, a preparation method of the above-mentioned powder treatment agent is provided, which comprises the following steps:

[0016] (1) vinyl silane is added dropwise into a reaction kettle containing D4H and platinum gold catalyst, and after the dropwise addition is completed, reflux reaction is carried out at 60 min to 100 min;

[0017] (2) olefin is then added dropwise, and after the dropwise addition is completed, the temperature is raised to 80℃ to 100℃ for reflux reaction at 60 min to 100 min;

[0018] (3) phenyl vinyl silicone oil is then added dropwise, and after the dropwise addition is completed, the temperature is raised to 80℃ to 100℃ for continued reflux reaction at 60 min to 100 min, and the platinum gold catalyst is removed, thereby obtaining the product.

[0019] In a fourth aspect, the present application provides a two-component heat-conducting gel prepared by using the powder treatment agent, which is prepared from a component A and a component B; the component A comprises the following raw materials by weight:

[0020]

[0021] The component B comprises the following raw materials by weight:

[0022]

[0023]

[0024] In a fifth aspect, the present application provides a preparation method of the two-component heat-conducting gel, which comprises the following steps:

[0025] (1) Put the vinyl silicone oil, platinum catalyst and powder treatment agent into a planetary mixer, mix uniformly, then put the heat-conducting powder into the planetary mixer in batches, stir until mixed uniformly after the heat-conducting powder is put in, then heat to 90-110°C and stir for 30-60 min, and cool, to obtain the component A;

[0026] (2) Put the vinyl silicone oil, hydrogen-containing silicone oil, inhibitor and powder treatment agent into a planetary mixer, mix uniformly, then put the heat-conducting powder into the planetary mixer in batches, stir until mixed uniformly after the heat-conducting powder is put in, then heat to 90-110°C and stir for 30-60 min, and cool, to obtain the component B.

[0027] In a sixth aspect, the present application provides an application of the two-component heat-conducting gel in preparing electronic components.

[0028] In the present application, the inventors prepare a new type of powder treatment agent from the molecular chain structure, on the one hand, introduce the polysiloxane polymer and phenyl group on the molecular chain segment of the powder treatment agent, so that the powder treatment agent has excellent temperature resistance, does not degrade and volatilize under long-term high-temperature aging, ensures that the hardness and thermal resistance do not obviously increase, and has excellent thermal stability, so that when it is used in the heat-conducting gel, the thermal stability of the heat-conducting gel is effectively improved, and the service life and cycle of the electronic components are improved; on the other hand, the powder treatment agent introduces two long-chain alkyl groups, which can more effectively infiltrate the heat-conducting powder when preparing the heat-conducting gel, thereby being beneficial to improving the extrusion property of the heat-conducting gel. Therefore, the powder treatment agent of the present application can effectively improve the thermal stability and application stability of the electronic components when it is used to prepare the heat-conducting gel. DETAILED DESCRIPTION

[0029] For the purpose of promoting an understanding of the principles of the application, the application will now be described more fully hereinafter. The application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. All publications, patent applications, patents, and other references mentioned herein are incorporated by reference in their entirety.

[0031] Unless otherwise indicated, all experiments were conducted in accordance with conventional experimental procedures, or as suggested by the manufacturer's instructions.

[0032] The powder treatment agent of the present application has four substituent groups on the molecular chain segment, which has the following performance advantages: 1. The main chain introduces a polysiloxane polymer, which has more excellent temperature resistance than ordinary long-chain silanes such as hexadecyloxy silane, and the molecular chain segment introduces a phenyl group, which can further improve the temperature resistance of the powder treatment agent. Under long-term high-temperature aging conditions, it does not degrade and volatilize, ensuring that the hardness and thermal resistance do not rise, and the stability is excellent; 2. Two of the substituents are long-chain alkyl groups, which can more effectively infiltrate the thermally conductive powder than ordinary long-chain alkyl coupling agents, improving the extrusion property; 3. The molecular chain segment contains a single vinyl group, and the group position is at the outermost end of the molecule, which is easy to react and avoids the problem of rising hardness caused by steric hindrance after curing, and can participate in the crosslinking reaction of the system, enhancing the bonding force between the silicone oil and the powder treatment agent; 4. The triacetoxy group in the molecule has high reactivity and can react with the hydroxyl groups on the surface of the thermally conductive powder to form a chemical bond, effectively modifying the thermally conductive powder.

[0033] In some embodiments of the present application, a powder treatment agent is disclosed, which is prepared by sequentially subjecting D4H cyclotetrasiloxane to a silicon-hydrogen addition reaction with vinyl silane, olefin, and phenyl vinyl silicone oil;

[0034] wherein the structure of the vinyl silane is Vi-Si-(OR1)3, and OR1 is methoxy, ethoxy, formyloxy, or acetoxy; the structure of the olefin is 20≥q≥8, preferably 20≥q≥12, more preferably 15≥q≥12; and Vi is a vinyl group.

[0035] In some embodiments, the vinyl silane is vinyltriacetoxysilane.

[0036] In some embodiments, the olefin is 1-hexadecene.

[0037] In some embodiments, the phenyl vinyl silicone oil has a structural formula of and has a viscosity of 100-2000 cp at 25°C.

[0038] In some embodiments, the molar ratio of D4H cyclotetrasiloxane, vinylsilane, olefin to the vinyl group in the phenyl vinyl silicone oil is 1:0.5-1.5:1.5-2.5:0.5-1.5, preferably 1:0.8-1.2:1.8-2.2:0.8-1.2, and more preferably 1:1:2:1.

[0039] In some embodiments, the phenyl vinyl silicone oil has a viscosity of 100-120 cp.

[0040] In some embodiments, the phenyl vinyl silicone oil has a vinyl content of 0.2-8 wt%, preferably 5-6 wt%.

[0041] In some embodiments, the phenyl vinyl silicone oil has a phenyl content of 25-35 wt%, preferably 29-31 wt%.

[0042] In other embodiments of the present application, a powder treatment agent having a structure as shown in formula (I) is disclosed:

[0043]

[0044] wherein two of A, B, C and D are the same substituent having a structure of formula (II), and the other two are substituents having structures shown in formula (III) and formula (IV) respectively.

[0045]

[0046] In formula (II), 20≥q≥8; in formula (III), 20≥m≥5 and 20≥n≥5, and Vi is vinyl; in formula (IV), OR1 is methoxy, ethoxy, formyloxy or acetyloxy.

[0047] In some embodiments, 20≥q≥12, and more preferably 15≥q≥12, and OR1 is formyloxy or acetyloxy.

[0048] In other embodiments of the present application, a preparation method of the powder treatment agent is disclosed, comprising the following steps:

[0049] (1) adding vinylsilane dropwise into a reaction kettle containing D4H and platinum-gold catalyst, and refluxing for 60-100 min after the dropping is completed;

[0050] (2), drop in olefins again, after droping, raise temperature to 80-100℃, reflux for 60-100min;

[0051] (3), drop in phenyl vinyl silicone oil again, after droping, continue reflux for 60-100min at 80-100℃, remove platinum gold catalyst, and get the product.

[0052] In some embodiments, the method for preparing the powder treatment agent comprises the following steps:

[0053] (1), drop in vinyl triacetoxysilane in a reactor containing D4H and platinum gold catalyst, after droping, reflux for 60-100min;

[0054] (2), drop in 1-hexadecene again, after droping, raise temperature to 80-100℃, reflux for 60-100min;

[0055] (3), drop in 100 parts of phenyl vinyl silicone oil with viscosity of 100cp and vinyl content of 5wt%, after droping, continue reflux for 60-100min at 80-100℃, remove platinum gold catalyst, and get the product.

[0056] In some other embodiments of the present application, the application of the above-mentioned powder treatment agent in preparing two-component heat-conducting gel is disclosed.

[0057] In some other embodiments of the present application, a two-component heat-conducting gel is disclosed, which is prepared from component A and component B; the component A comprises the following raw materials in parts by weight:

[0058]

[0059] The component B comprises the following raw materials in parts by weight:

[0060]

[0061] In some embodiments, the viscosity of the end-vinyl silicone oil is 100-1000 cp, the vinyl content is 0.1-1 wt%, preferably, the viscosity of the end-vinyl silicone oil is 100-500 cp, the vinyl content is 0.1-0.6 wt%; and / or, the hydrogen content of the end-hydrogen-containing silicone oil is 0.01-0.5 wt%, the viscosity is 50-500 mPa·s, preferably, the hydrogen content of the end-hydrogen-containing silicone oil is 0.016-0.36 wt%, the viscosity is 50-100 mPa·s; and / or, the hydrogen content of the side-hydrogen-containing silicone oil is 0.05-1.0 wt%, the viscosity is 50-500 mPa·s, preferably, the hydrogen content of the end-hydrogen-containing silicone oil is 0.05-0.5 wt%, the viscosity is 50-100 mPa·s; and / or, the heat-conducting powder is alumina powder, the average particle size of the alumina powder is 2-70 um; preferably, the average particle size of the alumina powder is 2-50 um; and / or, the platinum catalyst is one or more of chloroplatinic acid, chloroplatinic acid-isopropyl alcohol complex, chloroplatinic acid-divinyltetramethyl disiloxane complex; and / or, the inhibitor is one or more of 1-ethynyl-1-cyclohexanol, tetramethyltetraethenylcyclosiloxane, 2-methyl-3-butynyl-2-alcohol, 3-methyl-1-ethynyl-3-alcohol, 3,5-dimethyl-1-hexynyl-3-alcohol, 3-methyl-1-dodecyn-3-alcohol.

[0062] In some embodiments of the present application, a preparation method of the two-component heat-conducting gel is also disclosed, which comprises the following steps:

[0063] (1) Put the vinyl silicone oil, platinum catalyst, and powder treatment agent into a planetary mixer, mix uniformly, then put the heat-conducting powder in batches, stir until mixed uniformly after the putting is completed, then heat to 90-110℃ and stir for 30-60 min, cool, and A component is obtained.

[0064] (2) Put the vinyl silicone oil, hydrogen-containing silicone oil, inhibitor, and powder treatment agent into a planetary mixer, stir uniformly, then put the heat-conducting powder in batches, stir until mixed uniformly after the putting is completed, then heat to 90-110℃ and stir for 30-60 min, cool, and B component is obtained.

[0065] In some embodiments of the present application, the application of the two-component heat-conducting gel in the preparation of electronic components is also disclosed.

[0066] The present application is described in detail below in combination with specific examples.

[0067] Preparation of powder treatment agent in Example 1

[0068] The preparation method of the powder treatment agent of the present embodiment includes the following steps:

[0069] (1) First, add D4H and 5 ppm (in terms of Pt content) Karstedt catalyst into a reaction kettle equipped with a stirrer, a reflux condenser, a dropping funnel, and a thermometer, and stir uniformly;

[0070] (2) Then, slowly drop vinyltriacetoxysilane into the reaction kettle, and continue refluxing for 60 min after the dropping is completed; the molar ratio of the vinyltriacetoxysilane to D4H is 1:1;

[0071] (3) Slowly drop 1-hexadecene into the above mixture, and raise the temperature to 80°C for refluxing for 60 min after the dropping is completed; the molar ratio of the 1-hexadecene to D4H is 2:1;

[0072] (4) Then, slowly drop 100 parts of phenyl vinyl silicone oil with a viscosity of 100 cp (at 25°C), a vinyl content of 5 wt%, and a phenyl content of 30 wt% into the reaction kettle, and continue refluxing at 80°C for 100 min after the dropping is completed, and remove the platinum catalyst by adsorption with activated carbon, to obtain the product; the molar ratio of the vinyl in the phenyl vinyl silicone oil to D4H is 1:1.

[0073] The powder treatment agent is obtained by the silicon-hydrogen addition reaction of the four silicon-hydrogen groups in D4H with vinyltriacetoxysilane, 1-hexadecene, and the vinyl in phenyl vinyl silicone oil, respectively, and the specific product structure will be affected by the raw material ratio and the reaction site (in the present embodiment, the molar ratio of the silicon-hydrogen in D4H to vinyltriacetoxysilane, 1-hexadecene, and the vinyl in phenyl vinyl silicone oil is 4:1:2:1), and the reaction principle is as follows:

[0074]

[0075] wherein OR1 is acetoxy, Vi is vinyl, and Ph is phenyl.

[0076] Example 2: Two-component heat-conducting gel and preparation method thereof

[0077] The present embodiment provides a two-component heat-conducting gel prepared using the powder treatment agent of Example 1, which is prepared from an A component and a B component;

[0078] The A component includes the following raw materials in parts by weight:

[0079]

[0080] The B component includes the following raw materials in parts by weight:

[0081]

[0082] The preparation method of the two-component heat conductive gel of the present embodiment comprises the following steps:

[0083] (1) Put the vinyl silicone oil, platinum catalyst and powder treatment agent into a planetary mixer, stir for 5 min to mix evenly, then put in the heat conductive powder in batches, stir for 30 min after the completion of the addition until mixed evenly, then heat up to about 100°C and stir for 45 min, and cool down to obtain the A component;

[0084] (2) Put the vinyl silicone oil, hydrogen-containing silicone oil, hydrogen-containing silicone oil, inhibitor and powder treatment agent into a planetary mixer, stir for 5 min to mix, then put in the heat conductive powder in batches, stir for 30 min after the completion of the addition until mixed evenly, then heat up to about 100°C and stir for 45 min, and cool down to obtain the B component.

[0085] Example 3 Two-component heat conductive gel and its preparation method

[0086] The present embodiment provides a two-component heat conductive gel prepared using the powder treatment agent of Example 1, which is prepared from the A component and the B component;

[0087] The A component comprises the following raw materials by weight:

[0088]

[0089] The B component comprises the following raw materials by weight:

[0090]

[0091] The preparation method of the two-component heat conductive gel of the present embodiment is the same as that of Example 2.

[0092] Example 4 Two-component heat conductive gel and its preparation method

[0093] The present embodiment provides a two-component heat conductive gel prepared using the powder treatment agent of Example 1, which is prepared from the A component and the B component;

[0094] The A component comprises the following raw materials by weight:

[0095]

[0096] The B component comprises the following raw materials by weight:

[0097]

[0098] The preparation method of the two-component heat conductive gel of the present embodiment is the same as that of Example 2.

[0099] Example 5 Two-component heat conductive gel and its preparation method

[0100] The two-component heat conductive gel of the present example was prepared using the powder treatment agent of Example 1, and was prepared from an A component and a B component.

[0101] The A component included the following raw materials in parts by weight:

[0102]

[0103] The B component included the following raw materials in parts by weight:

[0104]

[0105]

[0106] The two-component heat conductive gel of the present example was prepared using the powder treatment agent of Example 1, and was prepared from an A component and a B component.

[0107] Example 6 Two-component heat conductive gel and method for preparing the same

[0108] The two-component heat conductive gel of the present example was prepared using the powder treatment agent of Example 1, and was prepared from an A component and a B component.

[0109] The A component included the following raw materials in parts by weight:

[0110]

[0111] The B component included the following raw materials in parts by weight:

[0112]

[0113] The two-component heat conductive gel of the present example was prepared using the powder treatment agent of Example 1, and was prepared from an A component and a B component.

[0114] Comparative Example 1

[0115] The two-component heat conductive gel of the present example was prepared using the powder treatment agent of Example 1, and was prepared from an A component and a B component.

[0116] The A component included the following raw materials in parts by weight:

[0117]

[0118] The B component included the following raw materials in parts by weight:

[0119]

[0120] The two-component heat conductive gel of the present example was prepared using the powder treatment agent of Example 1, and was prepared from an A component and a B component.

[0121] Comparative Example 2

[0122] The two-component heat conductive gel provided by the present comparative example is prepared from the A component and the B component;

[0123] The A component comprises the following raw materials by weight:

[0124]

[0125] The B component comprises the following raw materials by weight:

[0126]

[0127]

[0128] The two-component heat conductive gel of the present comparative example is prepared according to the method of Example 2.

[0129] Comparative Example 3

[0130] The two-component heat conductive gel provided by the present comparative example is prepared from the A component and the B component;

[0131] The A component comprises the following raw materials by weight:

[0132]

[0133] The B component comprises the following raw materials by weight:

[0134]

[0135] The two-component heat conductive gel of the present comparative example is prepared according to the method of Example 2.

[0136] The heat conductive gel materials of Examples 2-6 and Comparative Examples 1-3 are baked at 120°C for 60 min to prepare samples, which are respectively tested:

[0137] 1. Thermal resistance: determined according to ASTM D 5470-01 Standard Test Method for Characterizing Thermal Conductivity Properties of Thin Thermally Conductive Solid Electrical Insulation Materials, unit: ℃*in 2 / W.

[0138] 2. Heat aging resistance: the heat aging condition is 150°C / 1000h, and the hardness before and after aging is determined. The hardness is determined by referring to ASTM D2240 Standard Test Method for Rubber Property-Durometer Hardness, and using a Shore 00 hardness tester.

[0139] 3. Extrusion test: A and B were respectively filled into 400 mL 1:1 two-component glue cylinder, the mixing tube was Shenzhen Pusen round port 13-18 ladder-shaped mixing tube, the test air pressure was 0.6 MPa, and the time was 60 s.

[0140] The test results are shown in Table 1.

[0141] Table 1

[0142]

[0143] As can be seen from Table 1, the thermal conductive gel prepared by using the self-made powder treatment agent in Examples 2-6 has a hardness increase of no more than 10 Shore 00 and a thermal resistance increase of no more than 10% after high-temperature baking at 150 ℃ for 500 h and 1000 h. The powder treatment agent used in Comparative Examples 1-3 is a conventional long-chain coupling agent hexadecyl trimethoxyl, and the hardness of the thermal conductive gel prepared by using the powder treatment agent increases very obviously, and the hardness basically increases by about 35 HA after 150 ℃ / 1000 h, and the thermal resistance increases by more than 40% after 150 ℃ / 1000 h. This is because the self-made powder treatment agent of the application is a polysiloxane polymer, and its temperature resistance is more excellent than that of ordinary long-chain silane such as hexadecyloxysilane, and the polymer chain segment has a phenyl group, which can further improve the temperature resistance of the powder treatment agent, and the hardness and thermal resistance of the thermal conductive gel do not increase obviously during long-term high-temperature aging.

[0144] In terms of extrusion, the extrusion of the thermal conductive gel of Examples 2-6 is obviously better than that of the thermal conductive gel of Comparative Examples 1-3, because the powder treatment agent of the application has long-chain alkyl groups introduced, and multiple long-chain alkyl groups can enhance the wettability to the powder surface, which is better than that of ordinary single long-chain alkyl silane, so that the extrusion can be effectively improved. Under the condition of the same amount of thermal conductive powder, the extrusion will be improved with the increase of the amount of the powder treatment agent (the extrusion of Example 5 is higher than that of Example 2, and the extrusion of Example 6 is higher than that of Example 3).

[0145] The technical features of the above-described embodiments can be combined arbitrarily, and in order to make the description simple, all possible combinations of the technical features in the above-described embodiments are not described, however, as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.

[0146] The above embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the patent. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, several modifications and improvements can be made, which are within the scope of protection of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A powder treatment agent, characterized in that, It is prepared by reacting D4H cyclotetrasiloxane with vinylalkoxysilane, olefin, and phenyl vinyl silicone oil in sequence via hydrosilylation reaction; The structural formula of the vinylalkoxysilane is as follows: OR1 is a methoxy, ethoxy, formyloxy, or acetoxy group; the structural formula of the olefin is... , 20≥q≥8; Vi is vinyl; It is prepared through the following steps: (1) Add vinylalkoxysilane dropwise into a reaction vessel containing D4H and platinum catalyst, and reflux for 60 min to 100 min. (2) Add the olefin dropwise, heat to 80℃~100℃ and reflux for 60 min~100 min; (3) Add phenyl vinyl silicone oil dropwise, reflux at 80℃~100℃ for 60 min~100 min to remove the platinum catalyst, and the product is obtained. The molar ratio of the D4H cyclotetrasiloxane, vinylalkoxysilane, olefin, and vinyl in the phenyl vinyl silicone oil is 1:0.5~1.5:1.5~2.5:0.5~1.

5.

2. The powder treatment agent according to claim 1, characterized in that, The q in the olefin is 20 ≥ q ≥ 12.

3. The powder treatment agent according to claim 2, characterized in that, The q in the olefin is 15 ≥ q ≥ 12.

4. The powder treatment agent according to claim 1, characterized in that, The vinylalkoxysilane is a vinyltriacetoxysilane; and / or, The olefin is a 1-hexadecene; And / or, The structural formula of the phenyl vinyl silicone oil is: , 20≥m≥5, 20≥n≥5, its viscosity at 25℃ is 100 cp~2000 cp; and / or, The molar ratio of the D4H cyclotetrasiloxane, vinylalkoxysilane, olefin, and vinyl group in the phenyl vinyl silicone oil is 1:0.8~1.2:1.8~2.2:0.8~1.

2.

5. The powder treatment agent according to claim 4, characterized in that, The molar ratio of the D4H cyclotetrasiloxane, vinylalkoxysilane, olefin, and vinyl group in the phenyl vinyl silicone oil is 1:1:2:

1.

6. The powder treatment agent according to claim 4, characterized in that, The viscosity of the phenyl vinyl silicone oil is 100 cp to 120 cp; And / or, the vinyl content of the phenyl vinyl silicone oil is 0.2 wt% to 8 wt%; And / or, the phenyl content of the phenyl vinyl silicone oil is 25 wt% to 35 wt%.

7. The powder treatment agent according to claim 6, characterized in that, The vinyl content of the phenyl vinyl silicone oil is 5 wt% to 6 wt%; the phenyl content of the phenyl vinyl silicone oil is 29 wt% to 31 wt%.

8. A powder treatment agent, characterized in that, It has the structure shown in equation (Ⅰ): (Ⅰ) Among them, two of A, B, C, and D are the same substituents, which have the structure of formula (II), and the other two are substituents with the structures shown in formula (III) and formula (IV), respectively; (Ⅱ) (Ⅲ) (Ⅳ) In formula (II), 20 ≥ q ≥ 8; in formula (III), 20 ≥ m ≥ 5, 20 ≥ n ≥ 5, and Vi is vinyl; in formula (IV), OR1 is methoxy, ethoxy, formyloxy, or acetoxy.

9. The powder treatment agent according to claim 8, characterized in that, 20≥q≥12。 10. The powder treatment agent according to claim 9, characterized in that, 15≥q≥12, OR1 is formyloxy or acetoxy.

11. A method for preparing the powder treatment agent according to any one of claims 1 to 10, characterized in that, Includes the following steps: (1) Add vinylalkoxysilane dropwise into a reaction vessel containing D4H and platinum catalyst, and reflux for 60 min to 100 min. (2) Add the olefin dropwise, heat to 80℃~100℃ and reflux for 60 min~100 min; (3) Add phenyl vinyl silicone oil dropwise, reflux at 80℃~100℃ for 60 min~100 min to remove the platinum catalyst, and the product is obtained.

12. A two-component thermally conductive gel, characterized in that, It is prepared from component A and component B; component A comprises the following raw materials in parts by weight: 100 parts of vinyl-terminated silicone oil 5 to 15 parts of the powder treatment agent according to any one of claims 1 to 10 1000-2000 parts of thermally conductive powder Platinum catalyst 5 ppm~15 ppm Component B comprises the following raw materials in parts by weight: 60 parts of vinyl-terminated silicone oil 5 to 15 parts of the powder treatment agent according to any one of claims 1 to 10 10 to 30 parts of hydrogen-containing silicone oil 10 to 30 parts of hydrogen-containing silicone oil Inhibitor 0.01 to 0.2 parts 1000-2000 parts of thermally conductive powder.

13. The two-component thermally conductive gel according to claim 12, characterized in that, The vinyl-terminated silicone oil has a viscosity of 100 cp to 1000 cp and a vinyl content of 0.1 wt% to 1 wt%; and / or, the hydrogen-terminated silicone oil has a hydrogen content of 0.01 wt% to 0.5 wt% and a viscosity of 50 mPa·s to 500 mPa·s; and / or, The hydrogen-containing silicone oil has a hydrogen content of 0.05 wt% to 1.0 wt% and a viscosity of 50 mPa·s to 500 mPa·s; and / or, The thermally conductive powder is alumina powder, and the average particle size of the alumina powder is 2 μm to 70 μm; and / or, The platinum catalyst is one or more of chloroplatinic acid, chloroplatinic acid-isopropanol complex, and chloroplatinic acid-divinyltetramethyldisiloxane complex; and / or, The inhibitor is one or more of 1-ethynyl-1-cyclohexanol, tetramethyltetravinylcyclotetrasiloxane, 2-methyl-3-butynyl-2-ol, 3-methyl-1-ethynyl-3-ol, 3,5-dimethyl-1-hexynyl-3-ol, and 3-methyl-1-dodecynyl-3-ol.

14. The two-component thermally conductive gel according to claim 13, characterized in that, The vinyl-terminated silicone oil has a viscosity of 100 cp to 500 cp and a vinyl content of 0.1 wt% to 0.6 wt%. The hydrogen content of the hydrogen-containing silicone oil is 0.016 wt%~0.36 wt%, and the viscosity is 50 mPa·s~100 mPa·s; The hydrogen content of the hydrogen-containing silicone oil is 0.05 wt%~0.5 wt%, and the viscosity is 50 mPa·s~100 mPa·s; The alumina powder has an average particle size of 2 μm to 50 μm.

15. A method for preparing the two-component thermally conductive gel according to any one of claims 12 to 14, characterized in that, Includes the following steps: (1) Put vinyl silicone oil, platinum catalyst and powder treatment agent into planetary mixer and mix evenly. Then add heat-conducting powder in batches. After adding all the powder, stir until evenly mixed. Then heat to 90℃~110℃ and stir for 30 min~60 min. Cool to obtain component A. (2) Put vinyl silicone oil, hydrogen-containing silicone oil, inhibitor and powder treatment agent into a planetary mixer and stir evenly. Then add thermally conductive powder in batches. After adding all the powder, stir until evenly mixed. Then heat to 90℃~110℃ and stir for 30 min~60 min. Cool to obtain component B.

16. The use of the two-component thermally conductive gel according to any one of claims 12 to 14 in the fabrication of electronic components.

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