Apparatus and method for determining three-dimensional image of object

Abstract

The present disclosure proposes an apparatus for determining a three-dimensional image of an object. The apparatus includes: one or more first light sources that irradiate one or more first pattern light to the object; a second light source that sequentially irradiates one or more second pattern lights having one phase range; a beam splitter and one or more lenses that change the optical path of the one or more second pattern light; an image sensor that captures one or more first reflected light and one or more second reflected light; and a processor that specifies the first three-dimensional image of the object on the basis of the one or more first reflected light and the one or more second reflected light.

Description

Technical Field

[0001] The present disclosure relates to techniques for determining a three-dimensional image of an object. Background Art

[0002] For the process of mounting components (e.g., dies) on a substrate, various checks can be performed on whether the process is suitable for execution. For example, when the component is not configured in a suitable position on the substrate, it will cause defects on the substrate after the process, so it is necessary to grasp the three-dimensional image of the component on the substrate. In the present disclosure, the component can refer to a component or even a chipset used as a constituent element in all electronic devices such as circuits and semiconductor devices. For example, the component can refer to a coil, a capacitor, an impedance, a transistor, a diode, an LED, etc. In the present disclosure, the component is not limited to the above examples.

[0003] In determining the three-dimensional image of a component (i.e., an object), in particular, the angle of the upper surface of the component relative to the substrate (i.e., a reference plane) can be checked. This angle can be used to check whether there is a tilt between the component and the substrate. This is because when the bottom of the component is arranged or mounted in a manner close to the substrate, or when the component is arranged or mounted in a tilted state relative to the substrate depending on the coating state of the solder or solder balls coated on the substrate, it may cause a defect in the substrate.

[0004] In determining the three-dimensional image of a component, in order to check the tilt of the upper surface of the component, a method can be used in which the component is illuminated and the position of the image formed by the reflected light is used to check the tilt. However, this method has the following disadvantages. That is, when the component is a mirror surface, even if the component is tilted at a small angle, the reflection angle changes greatly. Therefore, a large amount of space is required to detect the imaging position of the reflected light, and the miniaturization of the inspection equipment becomes difficult. In addition, in order to check the tilt of the upper surface of the component, a method can be used in which a structured light is irradiated to the component to form diffraction stripes caused by the structured light in the air above the component, and the tilt is checked by the phase change of the diffraction stripes. However, this method has the disadvantage of generating a large amount of noise due to the diffraction stripes being imaged in the air. Summary of the invention

[0005] Technical issues

[0006] The present disclosure provides techniques for determining a three-dimensional image of an object.

[0007] Solutions to the problem

[0008] One aspect of the present disclosure may provide a device for determining a three-dimensional image of an object. The device according to one aspect of the present disclosure may be a device for determining a first three-dimensional image of an object located on a reference plane. The device may include: one or more first light sources, the one or more first light sources irradiate one or more first pattern lights to the object; a second light source, the second light source sequentially irradiates one or more second pattern lights with a phase range; a beam splitter and one or more lenses, the beam splitter and one or more lenses change the optical path of the one or more second pattern lights so that the light corresponding to each phase of the phase range is dispersed to reach a portion of the upper surface of the object; an image sensor, the image sensor captures one or more first reflected lights generated by the one or more first pattern lights reflected by the object and one or more second reflected lights generated by the one or more second pattern lights reflected by the portion of the area; and a processor, the processor is electrically connected to the one or more first light sources, the second light source and the image sensor; the processor can determine the first three-dimensional image of the object based on the one or more first reflected lights and the one or more second reflected lights.

[0009] In one embodiment, the processor can determine the second three-dimensional image of the object based on the phase changes of the one or more first reflected lights caused by the one or more first pattern lights, derive the phase values ​​of the one or more second reflected lights from the light quantity values ​​of the one or more second reflected lights, determine the angle of the upper surface relative to the reference plane based on the phase values, and determine the first three-dimensional image of the object by correcting the upper surface of the object represented by the second three-dimensional image based on the angle of the upper surface.

[0010] In one embodiment, the device according to the present disclosure may also include: a memory, which stores association information indicating the relationship between the angle of the upper surface relative to the reference plane and the phase values ​​of each of the one or more second reflected lights; the processor may determine the angle of the upper surface relative to the reference plane based on the phase value and the association information.

[0011] In one embodiment, the device according to the present disclosure may also include: one or more third light sources, the one or more third light sources are directed toward the object body, and irradiate illumination light according to one or more wavelengths with respect to the reference plane at one or more angles respectively; the image sensor can capture one or more third reflected lights generated by the illumination light according to one or more wavelengths respectively reflected by the object body, and the processor can determine the second three-dimensional image of the object body based on the phase changes of the one or more first reflected lights caused by the one or more first pattern lights and the light amount changes of the one or more third reflected lights caused by the illumination light according to one or more wavelengths.

[0012] In one embodiment, the second light source may also irradiate monochromatic light, the beam splitter and the one or more lenses may change the optical path of the monochromatic light so that the monochromatic light reaches the upper surface, the image sensor may capture fourth reflected light generated by the monochromatic light reflected by the upper surface, and the processor may determine the second three-dimensional image of the object based on phase changes of the one or more first reflected lights caused by the one or more first pattern lights and light amount changes of the fourth reflected light caused by the monochromatic light.

[0013] In one embodiment, the processor can derive the reflectivity of the upper surface based on the change in the amount of light of the monochromatic light caused by the fourth reflected light. When the reflectivity of the upper surface is above a predetermined benchmark reflectivity, the second light source can be controlled in a manner of sequentially irradiating one or more second pattern lights.

[0014] In one embodiment, each of the one or more first pattern lights may be a pattern light generated by phase shifting a pattern light having a pattern in a first direction or a second direction perpendicular to the first direction by an integer multiple of a preset phase interval.

[0015] In one embodiment, each of the one or more second pattern lights may be a pattern light generated by phase shifting a pattern light having a pattern in a first direction or a second direction perpendicular to the first direction by an integer multiple of a preset phase interval.

[0016] In one embodiment, the image sensor may be arranged to face the object and be vertically above a region on the reference plane where the object is located.

[0017] In one embodiment, each of the one or more first light sources may be arranged to irradiate the one or more first pattern lights respectively along different optical axes above the reference plane toward the object.

[0018] In one embodiment, each of the more than one third light sources may include a plurality of illumination light sources, and the plurality of illumination light sources are arranged above the reference plane and installed spaced apart from each other on a circumference parallel to the reference plane.

[0019] In one embodiment, the device according to the present disclosure may also include: a first aperture, which allows the one or more second pattern lights illuminated by the second light source to pass to the beam splitter; and a second aperture, which allows the one or more second reflected lights traveling from the partial area to pass to the image sensor; the light quantity value of each of the one or more second reflected lights can be determined based on the light quantity of light that passes through the first aperture and is reflected by the partial area and passes through the second aperture.

[0020] One aspect of the present disclosure may provide a method for determining a three-dimensional image of an object. The method according to one aspect of the present disclosure may be a method for determining a first three-dimensional image of an object located on a reference surface. The method according to one aspect of the present disclosure may include: a step of irradiating one or more first pattern lights to the object with one or more first light sources; a step of an image sensor capturing one or more first reflected lights generated by the reflection of the one or more first pattern lights by the object; a step of a second light source sequentially irradiating one or more second pattern lights having a phase range; a step of a beam splitter and one or more lenses changing the optical path of the one or more second pattern lights so that the light corresponding to each phase of the phase range is dispersed to a portion of the upper surface of the object; a step of the image sensor capturing one or more second reflected lights generated by the reflection of the one or more second pattern lights by the portion of the object; and a step of a processor determining the first three-dimensional image of the object based on the one or more first reflected lights and the one or more second reflected lights.

[0021] In one embodiment, the step of determining the first three-dimensional image may include: a step in which the processor determines the second three-dimensional image of the object based on phase changes of the one or more first reflected lights caused by the one or more first pattern lights; a step in which the processor derives the phase values ​​of the one or more second reflected lights from the light intensity values ​​of the one or more second reflected lights; a step in which the processor determines the angle of the upper surface relative to the reference plane based on the phase values; and a step in which the processor determines the first three-dimensional image of the object by correcting the upper surface of the object represented by the second three-dimensional image based on the angle of the upper surface.

[0022] In one embodiment, the method according to the present disclosure may also include: a step in which the second light source irradiates monochromatic light; a step in which the beam splitter and the one or more lenses change the optical path of the monochromatic light so that the monochromatic light reaches the upper surface; and a step in which the image sensor captures fourth reflected light generated by the monochromatic light reflected by the upper surface; the step in which the second three-dimensional image is determined may include: a step in which the processor determines the second three-dimensional image of the object based on phase changes of the one or more first reflected lights caused by the one or more first pattern lights and light amount changes of the fourth reflected light caused by the monochromatic light. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a diagram showing an apparatus 100 according to one embodiment of the present disclosure.

[0024] Figure 2 is a diagram showing the operation process of the device 100 according to one embodiment of the present disclosure.

[0025] Figure 3 is a diagram showing a block diagram of an apparatus 100 according to one embodiment of the present disclosure.

[0026] Figure 4 FIG. 4 is a diagram illustrating a process of irradiating a subject with patterned light according to an embodiment of the present disclosure.

[0027] Figure 5 is a diagram illustrating a process in which reflected light passes through an aperture according to an embodiment of the present disclosure.

[0028] Figure 6 is a diagram illustrating a process in which reflected light passes through an aperture according to an embodiment of the present disclosure.

[0029] Figure 7 is a diagram showing how pattern light emitted from a pattern light source appears in an aperture according to an embodiment of the present disclosure.

[0030] Figure 8 is a diagram showing association information according to one embodiment of the present disclosure.

[0031] Fig. 9 is a diagram showing the direction of a pattern of pattern light according to one embodiment of the present disclosure.

[0032] Fig.10 is a diagram illustrating an inspection process of the apparatus 100 using illumination light according to one embodiment of the present disclosure.

[0033] Fig.11 FIG. 4 is a diagram illustrating a process in which a pattern light source additionally irradiates white light according to an embodiment of the present disclosure.

[0034] Fig.12 is a diagram showing an apparatus 1210 according to one embodiment of the present disclosure.

[0035] Fig.13 is a diagram of a block diagram of an apparatus 1210 according to one embodiment of the present disclosure.

[0036] Fig.14 17 is a diagram showing an embodiment of a method 1700 for determining a three-dimensional image of an object that may be performed by the apparatus 100 according to the present disclosure.

[0037] Fig.15 is a diagram illustrating one embodiment of a method 1800 for determining an angle of an upper surface of an object body, which may be performed by the apparatus 1210 according to the present disclosure. DETAILED DESCRIPTION

[0038] The various embodiments described herein are provided for the purpose of clearly illustrating the technical concept of the present disclosure, and are not intended to be limited to specific implementation forms. The technical concept of the present disclosure includes various modifications, equivalents, alternatives, and embodiments of selectively combining all or part of the embodiments of the various embodiments described herein. In addition, the scope of rights of the technical concept of the present disclosure is not limited to the various embodiments or specific descriptions thereof suggested below.

[0039] Including technical or scientific terms, as long as not otherwise defined, the terms used herein may have the meaning generally understood by one of ordinary skill in the art to which the present disclosure belongs.

[0040] As used herein, expressions such as "include", "may include", "have", "may have", "have", "may have", etc., mean that the features that become the object (e.g., function, operation or component, etc.) exist, and do not exclude the existence of other additional features. That is, such expressions should be understood as open-ended terms that include the possibility of including other embodiments.

[0041] The singular expression used herein may include the plural meaning unless otherwise indicated in the context, and the same applies to the singular expression described in the claims.

[0042] As used in this article, expressions such as "first", "second", or "first", "second", etc., as long as no different meaning is indicated in the context, are used to distinguish one object from another in referring to multiple objects of the same kind, and do not limit the order or importance between the objects.

[0043] As used herein, the expressions “A, B, and C,” “A, B or C,” “A, B and / or C,” or “at least one of A, B, and C,” “at least one of A, B, or C,” “at least one of A, B, and / or C,” “at least one selected from A, B, and C,” “at least one selected from A, B, or C,” “at least one selected from A, B, or C,” and the like may refer to each of the listed items or all possible combinations of the listed items. For example, “at least one selected from A and B” may refer to all of (1) A, (2) at least one of A, (3) B, (4) at least one of B, (5) at least one of A and at least one of B, (6) at least one of A and B, (7) at least one of B and A, and (8) A and B.

[0044] The expression "unit" used in this article can be a general concept including software or hardware components such as FPGA (field-programmable gate array), ASIC (application specific integrated circuit) and optical components. However, "unit" is not limited to hardware and software. "Unit" can be constructed in a way of being stored in an addressable storage medium or in a way of running one or more processors. In one embodiment, "unit" can include components such as software components, object-pointing software components, class components and task components, processors, functions, attributes, programs, subroutines, fragments of program code, drivers, firmware, microcode, loops, data, databases, data structures, worksheets, arrays and variables.

[0045] The expression "based on to" used in this article is used to record one or more factors that affect the determination, judgment, behavior or action described in the sentence or article containing the expression, and the expression does not exclude additional factors that affect the relevant determination, judgment, behavior or action.

[0046] As used in this document, the expression that a certain component (e.g., the first component) is “connected to” or “linked to” another component (e.g., the second component) may mean that the certain component is directly connected or linked to the other component, or may mean that the certain component is connected or linked with another new component (e.g., the third component) as a medium.

[0047] The expression "configured to" used herein may have the meanings of "set in a manner of ...", "having the ability of ...", "changed in a manner of ...", "formed in a manner of ...", "capable of ...", etc., depending on the context. The expression is not limited to the meaning of "specially designed in hardware". For example, a processor configured to perform a specific action may refer to a generic-purpose processor that can perform its specific action by running software.

[0048] In order to illustrate various embodiments of the present disclosure, a rectangular coordinate system having mutually orthogonal X-axis, Y-axis and Z-axis may be defined. The expressions such as "X-axis direction", "Y-axis direction", "Z-axis direction" of the rectangular coordinate system used herein may refer to the directions on both sides of the extension of each axis of the rectangular coordinate system, unless otherwise specifically defined in the corresponding description. In addition, the + sign attached to the front of each axis direction may refer to the positive direction of any one of the two sides of the extension of the axis direction, and the - sign attached to the front of each axis direction may refer to the negative direction of the remaining one of the two sides of the extension of the axis direction.

[0049] As used herein, directional indicators such as “above” and “upper” mean the opposite direction of directional indicators such as “below” and “lower” based on the two Z-axis directions in the drawings unless otherwise specifically defined in the corresponding description.

[0050] In the present disclosure, a substrate is a board or even a container for mounting semiconductor chips, crystal grains and other components, and can perform the function of connecting electrical signals between components. The substrate can be used for integrated circuit manufacturing, etc., and can be made of materials such as silicon. For example, the substrate can be a printed circuit board (PCB), which can be called a wafer, etc. according to the embodiment.

[0051] The following describes various embodiments of the present disclosure with reference to the accompanying drawings. In the accompanying drawings and the descriptions of the accompanying drawings, the same or substantially equivalent components may be given the same reference numerals. In addition, in the description of the following various embodiments, repeated descriptions of the same or corresponding components may be omitted, but this does not mean that the relevant components are not included in the embodiment.

[0052] Figure 1is a diagram showing an apparatus 100 according to an embodiment of the present disclosure. The technology for determining the three-dimensional image of an object according to the present disclosure can be embodied in apparatuses according to various embodiments. The apparatus 100 of the present disclosure can determine the three-dimensional image of an object (e.g., a component) by using a variety of inspection methods. In the present disclosure, the so-called image of an object can be a concept that includes the three-dimensional shape of the object and the color, texture, etc. on the surface of the object. In one embodiment, the apparatus 100 can perform inspections using patterned light and / or inspections using coaxial deflectometry. In one embodiment, the apparatus 100 can also perform inspections using illumination light.

[0053] In this embodiment, the device 100 may include a pattern light irradiation unit 110, a DFM (Deflectometry) unit 120, a measuring unit 130 and / or an illumination light irradiation unit 140. In one embodiment, the illumination light irradiation unit 140 may also be omitted. The pattern light irradiation unit 110 may irradiate pattern light toward an object in order to perform an inspection using pattern light. The DFM unit 120 may irradiate pattern light toward an object in order to perform an inspection using coaxial deflectometry. The measuring unit 130 may capture reflected light reflected from an object by the pattern light irradiation unit 110 and the DFM unit 120 to determine a three-dimensional image of the object. The illumination light irradiation unit 140 may irradiate illumination light toward an object in order to perform an inspection using illumination light. The illumination light may be reflected from the object and captured by the measuring unit 130 to determine a three-dimensional image of the object. The specific actions and inspection methods of each unit will be described later.

[0054] Figure 2 1 is a diagram showing the operation process of the apparatus 100 according to one embodiment of the present disclosure. The apparatus 100 according to the illustrated embodiment can perform an inspection method using patterned light and / or an inspection method using coaxial deflectometry. The apparatus 100 can determine a three-dimensional image of an object based on the inspection result. The determined three-dimensional image can be used to determine the suitability of the executed process. The process of the apparatus 100 performing inspection using illumination light will be described later through additional embodiments.

[0055] In the present embodiment, one or more pattern light sources 210 may irradiate one or more pattern lights 212 toward an object located on the reference plane R. One or more pattern light sources 210 may belong to the pattern light irradiation unit 110. One or more pattern light sources 210 may be configured in a manner of irradiating one or more pattern lights 212 toward an object along different optical axes above the reference plane R. In one embodiment, one or more pattern light sources 210 may be configured to be spaced apart from each other on a virtual circle located above the reference plane R. One or more pattern lights 212 may be reflected from an object, respectively. The phase of the pattern light 212 before and after reflection may vary according to the shape of the object. That is, the reflected light 214 generated by the reflection of the pattern light 212 by the object may have a phase different from the phase of the corresponding pattern light 212.

[0056] The image sensor 220 can capture one or more reflected lights 214 generated by reflecting one or more pattern lights 212. The image sensor 220 can belong to the measuring unit 130. In one embodiment, the image sensor 220 can be arranged vertically above the area on the reference plane R where the object is located and facing the object.

[0057] The apparatus 100 can obtain information about the phase of each of the one or more reflected lights 214 and the phase of each of the one or more pattern lights 212. The apparatus 100 can determine the primary three-dimensional image of the object based on the phase change of each of the one or more reflected lights 214 caused by the one or more pattern lights 212.

[0058] On the other hand, the pattern light source 230 installed independently of the one or more pattern light sources 210 can sequentially irradiate one or more pattern lights 232. The pattern light source 230 can belong to the DFM unit 120. The one or more pattern lights 232 can respectively have the same phase range (e.g., 0 to 7×π / 4). In one embodiment, the one or more pattern lights 232 can each be generated by phase shifting a pattern light within the aforementioned phase range by an integer multiple of a preset phase interval (e.g., π / 2).

[0059] One or more pattern lights 232 may travel to the beam splitter 240 via the lens 250 and / or other optical elements (e.g., mirrors). In one embodiment, the pattern lights 232 may travel to the beam splitter 240 via the aperture 252. The beam splitter 240 may reflect one or more pattern lights 232 and direct the pattern lights 232 toward the object. At this time, the beam splitter 240 and one or more lenses 250 may change the optical path of one or more pattern lights 232 so that the light corresponding to each phase in the aforementioned phase range is dispersed to reach a portion of the area A on the upper surface of the object. That is, the optical path of the light corresponding to each phase of the pattern light 232 may be changed (adjusted) so that the light corresponding to one phase (e.g., 3×π / 4) in the aforementioned phase range (e.g., 0 to 7×π / 4) of the pattern light 232 reaches each point on the surface corresponding to the aforementioned portion of the area A. The beam splitter 240 and one or more lenses 250 may be arranged on the optical path of the pattern light 232 so as to achieve the above optical path change. The beam splitter 240 and one or more lenses 250 may belong to the DFM section 120 .

[0060] The one or more pattern lights 232 whose optical paths have been changed (adjusted) can each reach the object. The entire portion of the area A on the upper surface of the object is irradiated according to the light dispersion of each phase, so that light with an average amount of light equivalent to the pattern light 232 can reach each point in the portion of the area A. The one or more pattern lights 232 that reach the portion of the area A can be reflected from the portion of the area A respectively. The light reflected by the pattern light 232 (hereinafter referred to as the reflected light 234) can pass through the lens 250 and the beam splitter 240 in sequence. In one embodiment, the reflected light 234 can pass through the aperture 262 and reach the image sensor 220 through the lens 260 that is additionally configured as needed. The image sensor 220 can capture the one or more reflected lights 234 that arrive.

[0061] If a portion of the area A on the upper surface of the object is tilted relative to the reference plane R, only a portion of the light reflected from the portion of the area A can be input to the image sensor 220 through the aperture 262. That is, the aperture 252 allows the pattern light 232 to pass through the beam splitter 240, and the aperture 262 allows the reflected light 234 traveling from the portion of the area A to pass through the image sensor. Therefore, the light amount value of the reflected light 234 captured by the image sensor 220 can be determined according to the light amount of the light that passes through the aperture 252 and is reflected by the portion of the area A and passes through the aperture 262 again. At this time, the light captured by the image sensor 220 can be light corresponding to a portion of the phase range (for example, 3×π / 4 to 5×π / 4) of the aforementioned phase range (for example, 0 to 7×π / 4) of the pattern light 232 that was initially irradiated. That is, the amount of light captured by the image sensor 220 through the aperture 262 can change according to the degree of tilt of the upper surface of the object or even the portion of the area A relative to the reference plane R. If this principle is used, the degree of inclination of the reflective surface can be derived based on the amount of light captured by the reflected light, and this can be referred to as deflectometry in the present disclosure. In particular, as shown in the illustrated embodiment, for a case where the pattern light 232 incident on the object and the reflected light 234 reflected from the object travel along substantially the same optical axis, deflectometry can be referred to as coaxial deflectometry. The specific principle of deflectometry will be described later.

[0062] According to the deflectometry, the device 100 can determine the angle of the upper surface of the object relative to the reference surface R based on the light quantity values ​​of each of more than one reflected light 234. The device 100 can use the determined angle of the upper surface to correct the previously determined primary three-dimensional image to determine the secondary three-dimensional image. That is, the device 100 can use the information about the angle of the upper surface measured according to the deflectometry to correct the upper surface represented by the primary three-dimensional image and derive a new improved three-dimensional image, that is, the secondary three-dimensional image. In one embodiment, the correction can be performed by replacing (overriding) the angle of the upper surface represented by the primary three-dimensional image with the angle of the upper surface derived according to the deflectometry. In one embodiment, the correction can also be performed by determining the average value of the angle of the upper surface represented by the primary three-dimensional image and the angle of the upper surface derived according to the deflectometry as the angle of the upper surface represented by the secondary three-dimensional image. The secondary three-dimensional image is the final three-dimensional image of the object, which can be used to judge the suitability for processes such as mounting.

[0063] Figure 3is a diagram showing a block diagram of a device 100 according to an embodiment of the present disclosure. In the present embodiment, the device 100 may include one or more pattern light sources 210, an image sensor 220, a pattern light source 230, a beam splitter 240, one or more lenses 250, one or more processors 310 and / or one or more memories 320. In one embodiment, at least one of these components of the device 100 may be omitted, or other components may be added to the device 100. In one embodiment, a part of the components may be additionally or alternatively combined, or embodied as a single or multiple individuals. In the present disclosure, one or more processors may be expressed as processors. The expression of the word processor may refer to a collection of one or more processors as long as the context does not explicitly express otherwise. In the present disclosure, one or more memories may be expressed as memories. The expression of the word memory may refer to a collection of one or more memories as long as the context does not explicitly express otherwise. In one embodiment, at least some of the components inside and outside the device 100 can be interconnected through a bus, GPIO (general purpose input / output), SPI (serial peripheral interface) or MIPI (mobile industry processor interface) to send and receive data and / or signals.

[0064] As mentioned above, one or more pattern light sources 210 can respectively irradiate one or more pattern lights 212. The pattern light source 210 can generate the pattern light 212 in various ways. For example, the pattern of the pattern light 212 can be formed according to a digital method or an analog method. In the digital method, there can be a liquid crystal transmission method using LCD (Liquid Crystal Display), a liquid crystal reflection method using LcoS (Liquid Crystal on Silicon), and a mirror reflection method using DMD (Digital Micromirror Device) or DLP (Digital Light Processing). In the analog method, there can be a method of forming a pattern using a periodic pattern, a gradient pattern, a lattice pattern, and the like. As mentioned above, one or more pattern light sources 210 can be respectively configured in a manner of irradiating the pattern light 212 along different optical axes above the reference plane R. In one embodiment, four pattern light sources 210 can be configured at intervals of about 90 degrees on a virtual circle (4-way). In one embodiment, eight pattern light sources 210 may be arranged at intervals of about 45 degrees on a virtual circle (8-way). In one embodiment, the pattern light sources 210 may respectively irradiate one or more pattern lights 212 phase-shifted by four buckets (proper noun of the 4-bucket algorithm) in sequence. In one embodiment, the one or more pattern lights 212 may be generated by phase-shifting one pattern light by an integer multiple of a predetermined phase interval (e.g., π / 2). For example, if eight pattern light sources 210 are used and the pattern lights 212 phase-shifted by four buckets are irradiated in sequence, a total of 32 (8×4) pattern lights 212 may be irradiated onto the object. Therefore, a total of 32 images may be captured, and the information on the 32 phase changes may be used to determine a 1-time three-dimensional image of the object.

[0065] As described above, the image sensor 220 can capture one or more reflected light 214 and one or more reflected light 234. For example, the image sensor 220 can be implemented as a CCD (Charge Coupled Device) or a CMOS (Complimentary Metal Oxide Semiconductor) sensor.

[0066] The pattern light source 230, like the pattern light source 210, can generate and irradiate the pattern light 232 in various ways. In one embodiment, the pattern light source 230 can sequentially irradiate more than one pattern light 232 phase-shifted by 4 buckets. In one embodiment, if the pattern light formed in one direction (hereinafter referred to as the w-axis direction) uses the pattern light 232 phase-shifted by 4 buckets and the pattern light formed in a direction perpendicular to the w-axis direction (hereinafter referred to as the v-axis direction) uses the pattern light 232 phase-shifted by 4 buckets, a total of 8 (4+4) pattern lights 232 can be sequentially irradiated. Therefore, a total of 8 images can be captured, which can be used to determine the angle of the upper surface of the object.

[0067] The beam splitter 240, one or more lenses 250 and / or other aforementioned optical elements may be variously embodied by optical elements in a manner known in the technical field of the present disclosure. In one embodiment, the beam splitter 240 and / or one or more lenses 250 may be configured in a manner capable of performing the aforementioned optical path change of the patterned light 232 for the deflectometry method. Alternatively, in one embodiment, the processor 310 may also adjust its position, configuration and related parameters so that the beam splitter 240 and / or one or more lenses 250 may perform the optical path change. In one embodiment, the device 100 may also include the aforementioned aperture 252 and aperture 262.

[0068] The processor 310 can drive software (e.g., commands, programs, etc.) to control at least one component of the device 100 connected to the processor 310. In addition, the processor 310 can perform various operations related to the present disclosure, such as calculations, processing, data generation, and processing. In addition, the processor 310 can load data from the memory 320, or store it in the memory 320. In one embodiment, the processor 310 can determine the primary three-dimensional image of the object based on the phase change of each of the more than one reflected light 214 by the more than one pattern light 212. In addition, the processor 310 can determine the angle of the upper surface of the object relative to the reference plane R based on the light intensity value of each of the more than one reflected light 234 according to the deflectometry method. The processor 310 can use the determined angle of the upper surface to correct the primary three-dimensional image and determine the secondary (final) three-dimensional image.

[0069] The memory 320 can store various data. The data stored in the memory 320 is data obtained, processed or used by at least one component of the device 100, and may include software (e.g., commands, programs, etc.). The memory 320 may include volatile and / or non-volatile memory. In the present disclosure, commands and even programs are software stored in the memory 320, and may include an operating system for controlling the resources of the device 100, an application program, and / or middleware that provides various functions to the application program so that the application program can utilize the resources of the device 100. In one embodiment, the memory 320 may store commands that, when executed with the aid of the processor 310, cause the processor 310 to perform operations.

[0070] In one embodiment, the device 100 may further include a communication interface (not shown in the figure). The communication interface may perform wireless or wired communication between the device 100 and a server or between the device 100 and other devices. For example, the communication interface can perform wireless communications based on eMBB (enhanced Mobile Broadband), URLLC (Ultra Reliable Low-Latency Communications), MMTC (Massive Machine Type Communications), LTE (Long-Term Evolution), LTE-A (LTE Advance), NR (New Radio), UMTS (Universal Mobile Telecommunications System), GSM (Global System for Mobile communications), CDMA (Code Division Multiple Access), WCDMA (Wideband CDMA), WiBro (Wireless Broadband), WiFi (Wireless Fidelity), Bluetooth, NFC (Near Field Communication), GPS (Global Positioning System) or GNSS (Global Navigation Satellite System). For example, the communication interface can perform wired communication according to USB (universal serial bus), HDMI (high definition multimedia interface), RS-232 (recommended standard 232) or POTS (plain old telephone service). In one embodiment, the processor 310 can control the communication interface to obtain information required to embody the technology according to the present disclosure from the server. The information obtained from the server can be stored in the memory 320. In one embodiment, the information obtained from the server can include information about the substrate or even the object, information about the reference surface R, and related information to be described later.

[0071] Figures 4 to 8 This is a diagram for explaining the principle of the aforementioned coaxial deflectometry method. Figure 4 2 is a diagram showing a process of irradiating a pattern light 232 on an object according to an embodiment of the present disclosure. As mentioned above, for each of the more than one pattern light 232, the optical path of each of the more than one pattern light 232 can be changed so that the light corresponding to each phase in the corresponding phase range (for example: 0 to 7×π / 4) can be dispersed to reach a portion of the area A on the upper surface of the object. The following description is based on one pattern light 232.

[0072] As mentioned above, the pattern light source 230 can irradiate pattern light 232 corresponding to a phase range. The diagram shows the optical paths 410, 420, and 430 of light corresponding to any three phases within the aforementioned phase range. Each light can be irradiated to a portion of area A on the upper surface of the object through one or more lenses 250, apertures 252, and / or beam splitters 240. As mentioned above, light corresponding to one phase can be dispersed and irradiated to the entire portion of area A. That is, light 410 corresponding to one phase can be irradiated in a manner that reaches each point of the surface corresponding to portion of area A. Light (420, 430, etc.) corresponding to different phases of the pattern light 232 can also be irradiated to the object in the same manner. Therefore, a point in a portion of area A on the object can be irradiated with light of a phase corresponding to the aforementioned phase range. For example, in the illustrated embodiment, all of the lights 410, 420, and 430 reach each point in a portion of area A on the object. Therefore, the entire partial region A of the object can be irradiated with light having the average light intensity of the pattern light 232 corresponding to the above-mentioned phase range as the light intensity.

[0073] The reflected light 234 generated by the pattern light 232 reflecting from a part of the area A can be input to the image sensor 220 through the aperture 262. As mentioned above, when the upper surface of the object is tilted relative to the reference plane R, only a part of the reflected light 234 can pass through the aperture 262. The part of the reflected light passing through the aperture 262 can be equivalent to a part of the phase range of the pattern light 232 irradiated from the pattern light source 230. The average light amount of light corresponding to this part of the phase range can be finally captured by the image sensor 220.

[0074] In the illustrated embodiment 440, the angle of the upper surface of the object with respect to the reference plane R can be 0 degrees. In this case, most of the light reflected from a point in a partial region A can be captured by the image sensor 220 through the aperture 262. That is, in the embodiment 440, light corresponding to the phase intervals indicated by A and A' can be reflected from the partial region A, pass through the aperture 262, and be input to the image sensor 220.

[0075] In the illustrated embodiment 450, the object may be tilted at an angle of 3 degrees relative to the reference plane R. At this time, only a portion of the light reflected from a point in a portion of the area A may pass through the aperture 262 and be captured by the image sensor 220. Specifically, if the phase range of the pattern light 232 passed by the aperture 252 is the interval represented by the straight line 451, the phase range of the reflected light 234 passed by the aperture 262 may correspond to the interval represented by the straight line 452. Therefore, the light having an optical path that passes through the aperture 252 and the aperture 262 in its entirety may be light corresponding to the phase intervals marked with A and A' in the illustration. At this time, the light amount of the reflected light 234 obtained by the image sensor 220 may be the average light amount of the light corresponding to the phase intervals marked with A and A'.

[0076] In the illustrated embodiment 460, the object may be tilted at an angle of 5 degrees relative to the reference plane R. In this case, most of the light reflected from a point in a portion of the area A will not pass through the aperture 262. Therefore, the image sensor 220 will not be able to capture the reflected light 234. The angles of the upper surface of the object in the aforementioned embodiments 440, 450, and 460 may be exemplary values ​​selected for the purpose of explanation.

[0077] That is, the amount of light input to the image sensor 220 through the aperture 252 and the aperture 262 may vary depending on the angle of the upper surface of the object. The apparatus 100 can determine (derive) the angle of the upper surface of the object using the varying amount of reflected light 234.

[0078] Figure 5 2 is a diagram showing a process of reflected light 234 passing through aperture 262 according to an embodiment of the present disclosure. The illustrated embodiment, as shown in the aforementioned embodiment 450, can display a situation where the top surface of the object is tilted at a predetermined angle relative to the reference plane R.

[0079] Similarly, pattern light 232 having a phase range can be irradiated from the pattern light source 230 and dispersedly irradiated on a portion of the upper surface area A of the object. Since the upper surface of the object is inclined, only a portion of the reflected light 234 can be input to the image sensor 220 through the aperture 262. Among the reflected light 410, 420, 430, etc. incident on the portion of the area A, only the reflected light whose optical path travels within the range indicated by the thick solid line can be input to the image sensor 220 through the aperture 262.

[0080] A portion of the reflected light input to the image sensor 220 may be light corresponding to a portion of the phase range of the pattern light 232 reflected from a portion of region A on the object. Finally, the amount of reflected light 234 obtained by the image sensor 220 may be an average amount of light corresponding to the portion of the phase range of the pattern light 232.

[0081] Figure 6 2 is a diagram showing a process of reflected light 234 passing through aperture 262 according to an embodiment of the present disclosure. In the illustrated embodiment, a portion A1 of a portion of region A on the upper surface of the object may not be tilted relative to the reference plane R, while the other portion A2 is tilted.

[0082] As shown in the aforementioned embodiment 440, the light reflected from the non-tilted location A1 can be input to the corresponding location of the image sensor 220 through the aperture 262 (thick solid line). The corresponding location of the image sensor 220 can receive the average light amount of the input light corresponding to the aforementioned phase range irradiated from the pattern light source 230. As shown in the aforementioned embodiment 450, only a part of the light reflected from the tilted location A2 can be input to the image sensor 220 through the aperture 262 (thick dotted line). The corresponding location of the image sensor 220 can receive the average light amount of the input light corresponding to only a part of the aforementioned phase range irradiated by the pattern light source 230. The average light amount value input at each location (pixel) of the image sensor 220 can be used to obtain the tilt value at each location of a portion of the area A on the object.

[0083] Figure 7 is a diagram showing the appearance of a pattern light 232 irradiated from a pattern light source 230 in an aperture 252 according to an embodiment of the present disclosure. A pattern of a pattern light 232 may have a period. When the phase equivalent to a period is referred to as 2π, the pattern of the pattern light gradually becomes brighter during the interval from 0 to π / 2, the pattern of the pattern light gradually becomes darker during the interval from π / 2 to 3×π / 2, and the pattern of the pattern light gradually becomes brighter again during the interval from 3×π / 2 to 2π. As described above, the pattern light source 230 may irradiate a pattern light 232 having a phase range. The phase range may be appropriately set as needed. In one embodiment, the phase range may be set in a manner that does not become a period or a multiple of a period of the pattern. That is, the phase range may be set to a range of phase ranges that are not equivalent to 0, 2π, 4π, ..., 2nπ. This is because, in a portion of area A, light equivalent to the average light amount of the pattern light 232 is irradiated, so when a pattern light of a range equivalent to one cycle or a multiple of one cycle is used, the light equivalent to each phase of the pattern light will completely cancel each other out. In addition, in one embodiment, the phase range can be set in a manner greater than a phase range equivalent to half a cycle of the pattern light and less than a phase range equivalent to one cycle of the pattern light. In addition, in one embodiment, the phase range can be set in a manner greater than a phase equivalent to the (N+1 / 2) cycle of the pattern light (N is a natural number) and less than a phase range equivalent to the (N+1) cycle of the pattern light. This phase range can be set when it is necessary to increase the total light amount of the pattern light itself in order to facilitate the measurement of the reflected light.

[0084] One or more pattern lights 232 may be generated by phase shifting a pattern light corresponding to the aforementioned phase range by an integer multiple of a preset phase interval (e.g., π / 2). In one embodiment, the aforementioned phase interval may be set to a value greater than 0 and less than π. One or more pattern lights 232 may be respectively referred to as the 0th bucket, the first bucket, the second bucket, and the third bucket, that is, they may be referred to as 4 buckets. The pattern lights 232 generated by phase shift may also have the aforementioned phase range α. That is, for example, the pattern lights 232 may have a phase range of α from 0, a phase range of π / 2+α from π / 2, a phase range of π+α from π, and a phase range of 3×π / 2+α from 3×π / 2. The pattern lights 232 of each bucket may be shown in the aperture 252 as the pattern 710 shown in the figure. In one embodiment, the area of ​​the pattern light passing through the aperture 252 may be a circle 720, so that in the quadrilateral pattern light in the pattern light source 230, light corresponding to the circular area may be irradiated to the object. In one embodiment, the device 100 may also determine the angle of the upper surface of the object using only one pattern light 232. However, by using multiple pattern lights to measure the angle of the upper surface of the object, various measurement errors such as errors caused by the material of the upper surface of the object can be reduced.

[0085] The total light quantity value of the pattern light 232 in the pattern light source 230 can be calculated as shown in the following mathematical formula.

[0086]

Mathematical formula 1

[0087]

[0088] I o It can be a constant that determines the amplitude of the sine wave pattern of the pattern light 232. o The total light intensity value I can be derived by integrating the pattern light 232 in the pattern light source 230 in the phase range (α to β). LCoS .

[0089] Figure 8 is a diagram showing association information according to an embodiment of the present disclosure. As described above, the apparatus 100 can determine the angle of the upper surface of the object relative to the reference plane R based on the light intensity values ​​of each of more than one reflected light 234. The apparatus 100 can derive the phase value of the reflected light 234 from the light intensity value of the reflected light 234, and compare the derived phase value with the association information to determine the angle of the upper surface of the object.

[0090] In this embodiment, the processor 310 can derive the phase value of the one or more reflected lights 234 from the light intensity value of the one or more reflected lights 234. When a pattern light 232 is reflected from a part of the area A of the object and captured by the image sensor 220, the light intensity value I of the reflected light n It can be expressed as shown in the following mathematical formula.

[0091]

Mathematical formula 2

[0092]

[0093] A and B can be respectively connected with the aforementioned I o and I o φ(x, y) may be a phase value of the reflected light reflected from a point (x, y) in a portion of region A. α(t) may represent the aforementioned phase shift amount of the pattern light 232. For example, the light amount value I of the reflected light generated by each of the plurality of pattern lights 232 (i.e., 4 buckets) generated by phase shifting at a phase interval of π / 2 and reflected from a portion of region A is 1 ,I 2 ,I 3 ,I 4 , can be expressed as shown in the following mathematical formula 3. Mathematical formula 3 can be rearranged by substituting each phase shift amount α(t) into mathematical formula 2.

[0094]

Mathematical formula 3

[0095]

[0096] As described above, the image sensor 220 can capture light having an average light amount corresponding to a portion of the phase range of the pattern light 232. The light corresponding to the portion may be different depending on the angle of the upper surface of the object and / or which bucket the pattern light 232 is irradiated from. That is, even if the object is tilted at the same angle, the composition of the light corresponding to the portion may be different depending on how much the pattern light 232 is phase shifted. The light amount of the reflected light for each bucket may be the above-mentioned I 1 ,I 2 ,I 3 ,I 4 .

[0097] The light intensity value I of each reflected light 1 ,I 2 ,I 3 ,I 4 are values ​​that can be measured by the image sensor 220. A, B, and φ can be measured using the aforementioned I 1 ,I 2 ,I 3 ,I4 Since there are three unknowns, at least three equations are required. Therefore, the measurement of three or more different pattern lights 232 should be performed at least three times. Therefore, if the above mathematical formula 3 is rearranged, the phase value φ of the reflected light can be derived using the following mathematical formula 4.

[0098]

Mathematical formula 4

[0099]

[0100] Through this process, more than one phase value of the reflected light 234 can be derived from the light quantity values ​​of more than one reflected light 234. The derivation process can be executed by the processor 310.

[0101] In one embodiment, the memory 320 of the device 100 may further store association information. The association information may indicate the relationship between the angle of the upper surface of the object body relative to the reference plane R and the phase value of the reflected light 234. The numerical values ​​displayed in the illustrated association information are exemplary values, and the values ​​of the association information may be changed according to the embodiment. The relationship between the phase value displayed in the association information and the tilt angle of the object body may be measured and calculated, and then databased and stored in the memory 220.

[0102] As shown in the figure, the associated information may include the tilt angle of the object, the light quantity value I of the reflected light of each bucket measured at the corresponding angle, and the 1 ,I 2 ,I 3 ,I 4 And information about the phase value of the reflected light derived from the measured light intensity value. For example, when the tilt angle of the object is 1 degree, the light intensity value I of the reflected light of each bucket is measured. 1 ,I 2 ,I 3 ,I 4 The values ​​of A and B in the above formula 3 may be 239.50, 145.67, 132.41, and 226.34, respectively. The phase value derived from the light quantity value may also be 37.02. In one embodiment, the associated information may also include the values ​​of A and B in the above formula 3.

[0103] The processor 310 can determine the angle of the upper surface of the object relative to the reference plane R based on the phase value of the reflected light 234 and the associated information. The processor 310 can correct the upper surface represented by the primary 3D image using the determined upper surface angle to determine a perfected secondary (final) 3D image.

[0104] Fig. 92 is a diagram showing the direction of the pattern of the pattern light 212, 232 according to an embodiment of the present disclosure. In one embodiment, the pattern light sources 210, 230 can generate pattern light 212, 232 having a pattern on a quadrilateral surface. When the axis corresponding to one side of the quadrilateral is called the w-axis, and the axis corresponding to the other side and perpendicular to the w-axis is called the v-axis, the pattern of the pattern light 212, 232 can be formed along the w-axis direction or the v-axis direction. In one embodiment, more than one pattern light 212, 232 can have a pattern in the w-axis direction or the v-axis direction perpendicular to the w-axis. In one embodiment, the pattern direction of the pattern light 212, 232 can be set differently according to the bucket. In one embodiment, multiple patterns formed in the directions of each axis are used, so that the error in determining the three-dimensional image of the object can be reduced.

[0105] Fig.10 1 is a diagram showing an inspection process using illumination light by the device 100 according to an embodiment of the present disclosure. Some of the components of the aforementioned device 100 are arbitrarily omitted. In one embodiment, the device 100 can also perform an inspection using illumination light. In addition to the inspection results using the aforementioned patterned light, the device 100 can also additionally reflect the inspection results using illumination light to determine a 1-time three-dimensional image of the object.

[0106] In this embodiment, the device 100 may further include one or more illumination light sources 1010. The illumination light source 1010 may belong to the illumination light irradiation unit 140. The illumination light sources 1010 may respectively irradiate illumination light 1020 toward the object body located on the reference plane R. In one embodiment, one illumination light source 1010 may be embodied in the form of a plurality of illumination light sources (e.g., LED illumination) arranged at predetermined intervals on a circumference and spaced apart from each other. The circumference may be arranged parallel to the reference plane R. In one embodiment, one illumination light source 1010 may also be embodied in the form of an illumination light source having a circular form. The illumination light sources 1010 may be respectively arranged above the reference plane R or even the object body. The illumination light sources 1010 may respectively be arranged in a manner of irradiating illumination light to the object body along an optical axis inclined at one or more angles (e.g., 17 degrees, 40 degrees, 58 degrees, 70 degrees, etc.) relative to the reference plane R. In one embodiment, a total of four illumination light sources 1010 may be used as shown in the figure. In the present disclosure, the illumination light may be light according to one or more wavelengths. In one embodiment, the illumination light may be red light, green light or blue light. The illumination light source 1010 may be embodied as an RGB light source, and may include a red light source, a green light source and / or a blue light source. In one embodiment, the illumination light source 1010 may illuminate at least two light sources at the same time, or may illuminate red, green and blue light at the same time so as to illuminate white light.

[0107] The illumination light 1020 may be reflected from the object. The image sensor 220 may capture the light reflected from the illumination light 1020 (hereinafter referred to as reflected light 1030). At this time, the amount of light captured by the image sensor 220 may vary depending on the angle at which the illumination light 1020 is irradiated to the object and the angle at which the reflected light 1030 is reflected from the object. The image of the object may be determined based on the light amount values ​​that change before and after the reflection.

[0108] That is, the processor 310 can obtain the light quantity change of each of the more than one reflected light 1030 from the illumination light 1020 according to the more than one wavelength. The processor 310 can determine the aforementioned first three-dimensional image of the object based on the corresponding light quantity change. In one embodiment, the processor 310 can also use all the inspection results using the pattern light and the inspection results using the illumination light to determine the first three-dimensional image of the object. At this time, the processor 310 can determine the first three-dimensional image of the object based on the phase change of each of the more than one reflected light 214 from the more than one pattern light 212 and the light quantity change of each of the more than one reflected light 1030 from the illumination light 1020 according to the more than one wavelength. Then, as mentioned above, the processor 310 corrects the corresponding first three-dimensional image using the determined angle of the upper surface, so that the second (final) three-dimensional image of the object can be determined. In one embodiment, if four illumination light sources 1010 are used, and each illumination light source 1010 sequentially irradiates red light, green light and blue light, a total of 12 (4x3) illumination lights can be irradiated to the object. Thus, a total of 12 reflected lights can be captured by the image sensor 220 and can be used to determine a 1st 3D image of the object.

[0109] Fig.11 1 is a diagram showing a process of additionally irradiating white light 1110 by a pattern light source 230 according to an embodiment of the present disclosure. Some of the components of the aforementioned device 100 are arbitrarily omitted. In one embodiment, the pattern light source 230 of the device 100 can also irradiate white light 1110, and the information of its reflected light 1120 can be used to determine a more accurate 1D image of the object.

[0110] In the present embodiment, the pattern light source 230 can irradiate at least one monochromatic light of red light, green light, blue light, or white light, for example, can irradiate white light 1120. By controlling the elements generating the pattern in the pattern light source 230, the pattern light source 230 can irradiate white illumination light without a pattern. The white light 1120 can travel along an optical path similar to the aforementioned pattern light 232. The beam splitter 240 and one or more lenses 250 can change the optical path of the white light 1110 so that the white light 1110 reaches the upper surface of the object. For example, the white light 1110 can travel to the beam splitter 240 via the lens 250, the aperture 252, and other optical elements. The beam splitter 240 can change the optical path of the white light 1110 so that the white light 1110 is directed toward the upper surface of the object.

[0111] The white light 1110 may be reflected from the upper surface of the object. The amount of the white light 1110 before and after the reflection may vary according to the image of the object. That is, the amount of the white light 1110 may be different from the amount of the reflected light 1120. The reflected light 1120 may travel toward the beam splitter 240, and the beam splitter 240 may allow the reflected light 1120 to pass to the image sensor 220. The image sensor 220 may capture the reflected light 1120.

[0112] The processor 310 can determine the image of the object based on the light quantity value that changes before and after reflection. That is, the processor 310 can obtain the light quantity change of the reflected light 1120 from the white light 1110, and determine the primary three-dimensional image of the object based on the corresponding light quantity change. In one embodiment, the processor 310 can also use all the inspection results using pattern light and the inspection results using white light to determine the primary three-dimensional image of the object. At this time, the processor 310 can determine the primary three-dimensional image of the object based on the phase change of each of more than one reflected light 214 from more than one pattern light 212 and the light quantity change of the reflected light 1120 from the white light 1110. Then, as mentioned above, the processor 310 can correct the corresponding primary three-dimensional image using the determined angle of the upper surface, thereby determining the secondary (final) three-dimensional image of the object.

[0113] In one embodiment, the device 100 may perform an inspection using the coaxial deflectometry method to determine a secondary three-dimensional image only when a pre-set benchmark is met, otherwise, only a single three-dimensional image may be determined. This is to perform an additional inspection of the upper surface of the object only when it is determined to be necessary, thereby shortening the time required for the inspection process. In one embodiment, the device 100 may perform an additional inspection using the coaxial deflectometry method for the object when the reflectivity of the upper surface of the object is above a pre-set benchmark reflectivity. When the upper surface of the object is a mirror surface or is mirror-finished after a rearrangement process, it is difficult to accurately measure the shape of the upper surface of the object by only relying on an inspection using illumination light or even pattern light. Therefore, when it is determined that the upper surface of the object is a mirror surface (i.e., when the reflectivity is above a pre-set benchmark reflectivity), the device 100 may perform an additional inspection using the coaxial deflectometry method.

[0114] Specifically, the processor 310 may obtain light quantity information of the white light 1110 from the pattern light source 230, and obtain light quantity information of the reflected light 1120 from the image sensor 220. The processor 310 may derive the reflectivity of the upper surface of the object based on the light quantity change of the reflected light 1120 from the white light 1110. When the derived reflectivity of the upper surface is above a preset reference reflectivity, the processor 310 may control the pattern light source 230 so as to sequentially irradiate the aforementioned one or more pattern lights 232. In one embodiment, the information on the preset reference reflectivity may be stored in the memory 320.

[0115] In one embodiment, the apparatus 100 may first perform inspection using patterned light and then perform inspection using deflectometry. That is, the patterned light 212 may be irradiated first, its reflected light 214 may be captured, and then the patterned light 232 may be irradiated, and its reflected light 234 may be captured. In one embodiment, inspection using illumination light may be performed before inspection using deflectometry.

[0116] As an embodiment, the device 100 may use pattern light to photograph the reference plane R, the object, or the reference plane R and the object to determine a three-dimensional image, and then use deflectometry to derive the angle of the upper surface of the object.

[0117] That is, when the upper surface of the object is a mirror surface, although the reference plane R can be confirmed using pattern light, it may be difficult to restore the accurate three-dimensional image of the object. Therefore, the upper surface information of the object and the three-dimensional image information of the object can be accurately derived compared to the reference plane R based on the angle information of the upper surface of the object derived using the deflection measurement method.

[0118] Fig.12is a diagram showing a device 1210 according to an embodiment of the present disclosure. Device 1210 is a device corresponding to the aforementioned DFM unit 120, and can determine the angle of the upper surface of an object body located on the reference plane R. At least one component in device 1210 can be embodied as a detachable device and combined with device 1220. When device 1210 is not combined, a coaxial 2D light source can be attached to the corresponding position where it was combined. The coaxial 2D light source can irradiate at least one monochromatic light selected from red (Red) light, green (Green) light, blue (Blue) light and white light (white). The coaxial 2D light source can be embodied by optical elements such as LEDs. By irradiating 2D monochromatic illumination through such a detachable device 1210 or a coaxial 2D light source, a more accurate three-dimensional image restoration can be performed according to the object body.

[0119] The device 1220 may be a device including the aforementioned pattern light irradiation unit 110, the measuring unit 130 and / or the illumination light irradiation unit 140. The device 1220 may determine the aforementioned first three-dimensional image of the object on the reference plane R. If the device 1210 is combined with the device 1220, it may have a structure similar to that of the aforementioned device 100. The combined device 1210 and the device 1220 may determine the aforementioned second (final) three-dimensional image of the object in the same manner as the device 100. That is, the device 1220 may perform inspection using pattern light and / or inspection using illumination light to determine the first three-dimensional image of the object, and the device 1210 may determine the angle of the upper surface of the object. The angle of the upper surface may be used to correct the first three-dimensional image of the object to determine the second three-dimensional image. According to an embodiment, the correction and second three-dimensional image determination process may be performed by the device 1210 or the device 1220.

[0120] Specifically, the pattern light source 1230 of the device 1210 can sequentially irradiate one or more pattern lights 1232. The pattern light source 1230 and the pattern light 1232 can correspond to the aforementioned pattern light source 230 and the pattern light 232, respectively. Like the pattern light 232, the pattern light 1232 can have the same phase range. In addition, the pattern light 1232 can be generated by phase shifting the pattern light having a pattern in the w-axis direction or the v-axis direction by an integer multiple of a preset phase interval.

[0121] The beam splitter 1240 and one or more lenses 1250 can change the optical path of one or more pattern lights 1232. The beam splitter 1240 and one or more lenses 1250 can correspond to the aforementioned beam splitter 240 and one or more lenses 250, respectively. Like the aforementioned beam splitter 240 and one or more lenses 250, the beam splitter 1240 and one or more lenses 1250 can change the optical path of one or more pattern lights 1232 so that the light corresponding to each phase of the aforementioned phase range is dispersed to reach a portion of the area A on the upper surface of the object. In one embodiment, the corresponding optical path change can also use other necessary optical elements (e.g., reflectors). In one embodiment, the pattern light 1232 can pass through an aperture 1252 before being input into the beam splitter 1240.

[0122] One or more pattern lights 1232 may be reflected from a portion of the object area A. The reflected light of the pattern light 1232 (hereinafter referred to as reflected light 1234) may be input to the image sensor of the device 1220 via the beam splitter 1240, the aperture 1262, other lenses 1260, etc. The image sensor may correspond to the aforementioned image sensor 220.

[0123] The device 1210 may obtain information 1270 about the one or more reflected lights 1234 from the device 1220. The device 1210 may determine the angle of the upper surface of the object body relative to the reference surface R based on the information 1270. The process of determining the angle of the upper surface may be the same as the process described in the aforementioned device 100. In one embodiment, the information 1270 may include information indicating the light quantity value of each of the one or more reflected lights 1234.

[0124] As mentioned above, the device 1220 is a device including the aforementioned pattern light irradiation unit 110, the measuring unit 130 and / or the illumination light irradiation unit 140, and can perform inspections using pattern light and / or illumination light. Specifically, the device 1220 may include one or more pattern light sources (corresponding to the pattern light source 210), an image sensor (corresponding to the image sensor 220) and / or a processor (corresponding to the processor 310). The pattern light source can irradiate one or more pattern lights (corresponding to the pattern light 212) to the object. The image sensor can capture the reflected light (corresponding to the reflected light 214) of the pattern light (corresponding to the pattern light 212). In addition, the image sensor can also capture the reflected light (corresponding to the reflected light 234) of the pattern light 1232. The processor can determine the 1-dimensional image of the object based on the captured reflected light, and transmit information indicating the determined 1-dimensional image to the device 1210.

[0125] Fig.131 is a diagram showing a block diagram of a device 1210 according to an embodiment of the present disclosure. In one embodiment, the device 1210 may include a pattern light source 1230, a beam splitter 1240, one or more lenses 1250, a communication interface 1330, one or more processors 1310 and / or one or more memories 1320. In one embodiment, at least one of these components of the device 1210 may be omitted, or other components may be added to the device 1210. In one embodiment, a portion of the components may be additionally or alternatively combined, or may be embodied as a single or multiple individuals. In one embodiment, at least a portion of the components inside and outside the inspection device 1210 may be interconnected through a bus, GPIO (general purpose input / output), SPI (serial peripheral interface) or MIPI (mobile industry processor interface), etc., to send and receive data and / or signals.

[0126] The pattern light source 1230 , the beam splitter 1240 , and the one or more lenses 1250 may correspond to the aforementioned pattern light source 230 , the beam splitter 240 , and the one or more lenses 250 , and may perform the same or similar operations in order to perform inspection according to the deflectometry method.

[0127] The communication interface 1330 may be implemented in a manner similar to the communication interface of the aforementioned device 100. The communication interface 1330 may be controlled by the processor 1310 to communicate with the device 1220. For example, the communication interface 1330 may obtain information 1270 about one or more reflected lights 1234 from the device 120.

[0128] The processor 1310 may be implemented in a manner similar to the processor 310 of the aforementioned apparatus 100 . The processor 1310 may control the communication interface 1330 , obtain information 1270 about one or more reflected lights 1234 , and determine the angle of the upper surface of the object relative to the reference plane R based on the corresponding information 1270 .

[0129] In one embodiment, the processor 1310 of the device 1210 may derive one or more phase values ​​of the reflected light 1234 from the light quantity values ​​of the reflected light 1234. The processor 1310 may determine the angle of the upper surface of the object body relative to the reference plane R based on the derived phase values. This process may correspond to the process in which the processor 310 derives the phase value from the light quantity value of the reflected light 234 and determines the angle of the upper surface from the phase value. In one embodiment, the memory 1320 may store the associated information like the memory 320, and the processor 1310 may determine the angle of the upper surface based on the phase value of the reflected light 1234 and the associated information.

[0130] In one embodiment, the device 1210 may transmit information indicating the angle of the derived upper surface to the device 1220, so that the device 1220 determines the secondary three-dimensional image. Specifically, the processor 1310 controls the communication interface 1330 to transmit the information indicating the angle of the derived upper surface to the device 1220. As described above, the device 1220 may determine the primary three-dimensional image of the object by inspection using patterned light and / or illumination light. The corresponding information indicating the angle of the upper surface may be used for the device 1220 to correct (amend) the upper surface of the object represented by the primary three-dimensional image to determine the secondary three-dimensional image.

[0131] In one embodiment, the device 1210 may also obtain information indicating the primary three-dimensional image of the object from the device 1220, and use the information to directly determine the secondary three-dimensional image. Specifically, the processor 1310 may control the communication interface 1330 to obtain information about the primary three-dimensional image of the object determined by the device 1220. The processor 1310 may correct (correct) the upper surface of the object represented by the primary three-dimensional image based on the angle of the determined upper surface to determine the secondary three-dimensional image.

[0132] In one embodiment, the pattern light source 1230 may also irradiate white light, and the beam splitter 1240 and one or more lenses 1250 may change the optical path of the white light so that the white light reaches the upper surface of the object. This may correspond to the situation where the pattern light source 230 of the aforementioned device 100 irradiates white light 1110. As mentioned above, the white light may be reflected from the upper surface of the object. The device 1220 may capture the reflected light, and determine the 1D image of the object based on the change in the amount of light of the reflected light from the white light.

[0133] In one embodiment, the processor 1310 may control the communication interface 1330 to obtain information indicating the reflectivity of the upper surface of the object from the device 1220. When the reflectivity of the upper surface is above a preset reference reflectivity, the processor 1310 may control the pattern light source 1230 to sequentially irradiate more than one pattern light 1232. This may correspond to the situation in which the processor 310 of the aforementioned device 100 controls the pattern light source 230 based on the reference reflectivity.

[0134] Figures 14 to 15 It is a diagram showing an embodiment of a method that can be respectively executed by the devices 100 and 1210 according to the present disclosure. The method according to the present disclosure can be a method embodied in a computer. In the illustrated flowchart, each step of the method or algorithm of the present disclosure is described in sequence, but in addition to executing each step in sequence, it can also be executed in an order that can be arbitrarily combined according to the present disclosure. The description of this flowchart does not exclude the situation where changes or revisions are applied to the method or algorithm, and does not mean that any step is necessary or preferred. In one embodiment, at least a part of the steps can be executed in parallel, repeatedly or heuristically. In one embodiment, at least a part of the steps can be omitted, or other steps can be added.

[0135] Fig.14 1 is a diagram showing an embodiment of a method 1700 for determining a three-dimensional image of an object that can be performed by the device 100 according to the present disclosure. The device 100 according to the present disclosure can perform the method 1700 in determining a first three-dimensional image (e.g., a second three-dimensional image) of an object located on a reference surface. The method 1700 according to an embodiment of the present disclosure may include: a step S1710 of irradiating one or more first pattern lights to the object; a step S1720 of capturing one or more first reflected lights; a step S1730 of sequentially irradiating one or more second pattern lights having a phase range; a step S1740 of changing the optical path of the second pattern lights so that the lights corresponding to each phase of the phase range are dispersed to reach a portion of the area; a step S1750 of capturing one or more second reflected lights; and / or a step S1760 of determining the first three-dimensional image of the object based on one or more first reflected lights and one or more second reflected lights.

[0136] In step S1710, one or more first light sources (e.g., pattern light sources 210) of the device 100 may irradiate one or more first pattern lights (e.g., pattern lights 212) toward the object. In step S1720, the image sensor 220 may capture one or more first reflected lights (e.g., reflected lights 214) generated by the one or more first pattern lights (e.g., pattern lights 212) being reflected by the object.

[0137] In step S1730, the second light source (e.g., pattern light source 230) may sequentially irradiate one or more second pattern lights (e.g., pattern light 232) having a phase range. In step S1740, the beam splitter 240 and one or more lenses 250 may change the optical path of one or more second pattern lights (e.g., pattern light 232) so that the light corresponding to each phase in the phase range is dispersed to reach a portion of area A on the upper surface of the object. In step S1750, the image sensor 220 may capture one or more second reflected lights (e.g., reflected light 234) generated by reflecting one or more second pattern lights (e.g., pattern light 232) from a portion of area A.

[0138] In step S1760 , the processor 310 may determine a first 3D image (eg, a second 3D image) of the object based on one or more first reflected lights (eg, reflected light 214 ) and one or more second reflected lights (eg, reflected light 234 ).

[0139] In one embodiment, the step S1760 of determining the first three-dimensional image (e.g., the second three-dimensional image) may include: the processor 310 determines the second three-dimensional image (e.g., the first three-dimensional image) of the object based on the phase change of the first pattern light (e.g., the pattern light 212) of the first reflected light (e.g., the reflected light 214). In addition, the step S1760 may include: the processor 310 derives the phase value of the first one or more reflected lights (e.g., the reflected light 234) from the light quantity value of the first one or more reflected lights (e.g., the reflected light 234). In addition, the step S1760 may include: the processor 310 determines the angle of the upper surface relative to the reference plane R based on the phase value. In addition, the step S1760 may include: the processor 310 corrects the upper surface of the object represented by the second three-dimensional image (e.g., the first three-dimensional image) based on the angle of the upper surface to determine the first three-dimensional image (e.g., the second three-dimensional image) of the object.

[0140] In one embodiment, the step of determining the angle of the upper surface may include a step in which the processor 310 determines the angle of the upper surface relative to the reference plane R based on the corresponding phase value and the associated information.

[0141] In one embodiment, the device 100 may further include one or more third light sources (e.g., illumination light sources 1010). In addition, the step of determining the second three-dimensional image (e.g., primary three-dimensional image) of the object may include: the processor 310 determines the second three-dimensional image (e.g., primary three-dimensional image) of the object based on the phase changes of one or more first reflected lights (e.g., reflected light 214) by one or more first pattern lights (e.g., pattern lights 212) and the light quantity changes of one or more third reflected lights (e.g., reflected light 1030) by illumination light 1020 according to one or more wavelengths.

[0142] In one embodiment, method 1700 may also include: a step of irradiating white light 1110 with a second light source (e.g., pattern light source 230); a step of changing the optical path of white light 1110 with a beam splitter 240 and one or more lenses 250 so that white light 1110 reaches the upper surface; and / or a step of capturing fourth reflected light (e.g., reflected light 1120) generated by reflection of white light 1110 from the upper surface with an image sensor 220.

[0143] In one embodiment, the step of determining a second three-dimensional image (e.g., a first three-dimensional image) may include: the processor 310 determines the second three-dimensional image (e.g., a first three-dimensional image) of the object based on phase changes of one or more first reflected lights (e.g., reflected light 214) caused by one or more first pattern lights (e.g., pattern light 212) and light amount changes of the fourth reflected light (e.g., reflected light 1120) caused by white light 1110.

[0144] In one embodiment, method 1700 may also include: the processor 310 derives the reflectivity of the upper surface based on the change in the amount of light of the white light 1110 of the fourth reflected light (e.g., reflected light 1120); and / or when the reflectivity of the upper surface is above a predetermined baseline reflectivity, controls the second light source (e.g., pattern light source 230) to sequentially irradiate one or more second pattern lights (e.g., pattern light 232).

[0145] Fig.15 1 is a diagram showing an embodiment of a method 1800 for determining an angle of an upper surface of an object that can be performed by a device 1210 according to the present disclosure. The method 1800 according to an embodiment of the present disclosure may include: a step S1810 of sequentially irradiating one or more first pattern lights; a step S1820 of changing the optical path of the first pattern lights so that the lights corresponding to each phase of the phase range are dispersed to reach a part of the area; a step S1830 of obtaining first information about one or more first reflected lights from a first device; and / or a step S1840 of determining an angle of an upper surface relative to a reference surface based on the first information.

[0146] In step S1810, the first light source (e.g., pattern light source 1230) may sequentially irradiate one or more first pattern lights (e.g., pattern light 1232) having a phase range. In step S1820, a beam splitter (e.g., beam splitter 1240) and one or more lenses (e.g., lens 1250) may change the optical path of one or more first pattern lights (e.g., pattern light 1232) so that the light corresponding to each phase in the phase range is dispersed to reach a portion of region A on the upper surface.

[0147] In step S1830, the first processor (e.g., processor 1310) can obtain first information (e.g., information 1270) from a first device (e.g., device 1220) regarding one or more first reflected lights (e.g., reflected light 1234) generated by reflecting one or more first pattern lights (e.g., pattern light 1232) from a portion of area A.

[0148] In step S1840 , the first processor (eg, processor 1310 ) may determine an angle of the upper surface relative to the reference plane R based on the first information (eg, information 1270 ).

[0149] In one embodiment, the step of determining the angle of the upper surface may include: a step in which a first processor (e.g., processor 1310) derives phase values ​​of one or more first reflected lights (e.g., reflected light 1234) from respective light intensity values ​​of one or more first reflected lights (e.g., reflected light 1234); and / or a step in which the angle of the upper surface relative to a reference surface R is determined based on the derived phase values.

[0150] In one embodiment, the method 1800 may further include the step of transmitting, by the first processor (e.g., the processor 1310), second information indicating the angle of the upper surface to the first device (e.g., the device 1220). The second information may be used by the first device (e.g., the device 1220) to correct the upper surface of the object represented by the first three-dimensional image (e.g., the primary three-dimensional image) to determine a second three-dimensional image (e.g., the secondary three-dimensional image) of the object.

[0151] In one embodiment, method 1800 may also include: a step in which a first processor (e.g., processor 1310) obtains third information indicating a first three-dimensional image (e.g., a primary three-dimensional image) of an object body from a first device (e.g., device 1220); and / or a step in which a second three-dimensional image (e.g., a secondary three-dimensional image) of the object body is determined by correcting the upper surface of the object body represented by the first three-dimensional image (e.g., a primary three-dimensional image) based on the angle of the upper surface.

[0152] In one embodiment, method 1800 may also include: a step in which the first light source (e.g., pattern light source 1230) also irradiates white light; and / or a step in which a beam splitter (e.g., beam splitter 1240) and one or more lenses (e.g., lens 1250) change the optical path of the white light so that the white light reaches the upper surface.

[0153] In one embodiment, method 1800 may also include: a step in which the first processor (e.g., processor 1310) controls the communication interface 1330 to obtain fourth information indicating the reflectivity of the upper surface from the first device (e.g., device 1220); and / or when the reflectivity of the upper surface is above a predetermined baseline reflectivity, a step in which the first light source (e.g., pattern light source 1230) is controlled to sequentially irradiate more than one first pattern light (e.g., pattern light 1232).

[0154] According to various embodiments of the present disclosure, the amount of light reflected from an object (e.g., a component) is used to effectively measure the inclination of the upper surface of the object, thereby improving the determination of the three-dimensional image of the object. The three-dimensional image of the object can be used to check whether the entire substrate mounting process is performed appropriately.

[0155] According to various embodiments of the present disclosure, the tilt of the object is not inspected based on the imaging position of the reflected light from the object, and thus miniaturization of the inspection device becomes easy.

[0156] According to various embodiments of the present disclosure, the tilt of the object is not checked based on the diffraction fringes formed in the air above the object, and thus a strong inspection of noise can be performed.

[0157] Various embodiments of the present disclosure may be embodied by software recorded on a machine-readable recording medium. The software may be software for embodying the aforementioned various embodiments of the present disclosure. The software may be inferred from various embodiments of the present disclosure by a programmer in the technical field to which the present disclosure belongs. For example, the software may be a machine-readable command (e.g., code or code fragment) or program. A machine is a device that can operate according to a command called out from a recording medium, such as a computer. In one embodiment, the machine may be the device 100, 1210 according to an embodiment of the present disclosure. In one embodiment, the processor of the machine may execute the called out command so that the constituent elements of the machine perform a function equivalent to the command. In one embodiment, the processor may be one or more processors according to an embodiment of the present disclosure. The recording medium may mean all kinds of recording media (recording medium) storing data that are read by a machine. The recording medium may include, for example, a ROM (read-only memory), a RAM (random access memory), a CD-ROM (read-only optical disk drive), a magnetic tape, a floppy disk, an optical data storage device, etc. In one embodiment, the recording medium may be one or more memories. In one embodiment, the recording medium may also be embodied in a form distributed in a computer system connected via a network. The software may be distributed, stored, and executed in a computer system, etc. The recording medium may be a non-transitory recording medium. A non-transitory recording medium refers to a tangible medium that actually exists regardless of semi-permanent or temporary storage of data, and does not include a signal that is transmitted transiently.

[0158] The technical concept of the present disclosure is described above based on various embodiments, but the technical concept of the present disclosure includes various substitutions, deformations and changes that can be realized within the scope understandable to those skilled in the art of the present disclosure. In addition, such substitutions, deformations and changes should be understood to be included in the attached claims.

Claims

1. A device for determining a first three-dimensional image of an object located on a reference surface, comprising: One or more first light sources, the one or more first light sources irradiating one or more first pattern lights toward the object; a second light source, the second light source sequentially irradiating one or more second pattern lights having a phase range for a light amount phase; a first aperture that allows the one or more second pattern lights irradiated by the second light source to pass to a beam splitter; The beam splitter and the one or more lenses change the optical path of the one or more second pattern lights passing through the first aperture so that the lights corresponding to the phases in the phase range are dispersed to reach a part of the upper surface of the object; a second aperture, the second aperture allowing one or more second reflected lights generated by the one or more second pattern lights being reflected by the part of the area to pass to the image sensor; The image sensor captures one or more first reflected lights generated by the one or more first pattern lights being reflected by the object and the one or more second reflected lights passing through the second aperture; and a processor, the processor being electrically connected to the one or more first light sources, the second light source, and the image sensor; The processor determines the first three-dimensional image of the object based on the one or more first reflected lights and the one or more second reflected lights.

2. The device according to claim 1, wherein: the processor, determining a second three-dimensional image of the object based on phase changes of the one or more first reflected lights caused by the one or more first pattern lights, determining an angle of the upper surface with respect to the reference plane based on light intensity values ​​of each of the one or more second reflected lights, The first three-dimensional image of the object is determined by correcting the upper surface of the object represented by the second three-dimensional image based on the angle of the upper surface.

3. The device according to claim 2, wherein: The system further includes a memory storing association information indicating a relationship between an angle of the upper surface relative to the reference surface and light quantity values ​​of each of the one or more second reflected lights, The processor determines an angle of the upper surface with respect to the reference plane based on light intensity values ​​of each of the one or more second reflected lights and the associated information.

4. The device according to claim 2, wherein: The system further comprises: one or more third light sources, the one or more third light sources are directed toward the object and irradiate illumination light with one or more wavelengths at one or more angles to the reference surface. The image sensor captures one or more third reflected lights generated by the illumination lights of the one or more wavelengths being reflected by the object. The processor determines the second three-dimensional image of the object based on phase changes of the one or more first reflected lights caused by the one or more first pattern lights and light amount changes of the one or more third reflected lights caused by the illumination light according to the one or more wavelengths.

5. The device according to claim 2, wherein: The second light source also emits monochromatic light, The beam splitter and the one or more lenses change the optical path of the monochromatic light so that the monochromatic light reaches the upper surface. The image sensor captures fourth reflected light generated by the monochromatic light being reflected by the upper surface, The processor determines the second three-dimensional image of the object based on each phase change of the one or more first reflected lights caused by the one or more first pattern lights and a light amount change of the fourth reflected light caused by the monochromatic light.

6. The device according to claim 1, wherein: the processor, determining a second three-dimensional image of the object based on phase changes of the one or more first reflected lights caused by the one or more first pattern lights, Determine whether the upper surface of the object is a mirror surface, When it is determined that the upper surface of the object is not a mirror surface, determining the second three-dimensional image as the first three-dimensional image of the object, When it is determined that the upper surface of the object is a mirror surface, determining an angle of the upper surface with respect to the reference plane based on light intensity values ​​of each of the one or more second reflected lights, The first three-dimensional image of the object is determined by correcting the upper surface of the object represented by the second three-dimensional image based on the angle of the upper surface.

7. The device according to claim 1, wherein: Each of the one or more first pattern lights is a pattern light generated by phase shifting a pattern light having a pattern in a first direction or a second direction perpendicular to the first direction by an integer multiple of a preset phase interval.

8. The device according to claim 1, wherein: Each of the one or more second pattern lights is a pattern light generated by phase shifting a pattern light having a pattern in a first direction or a second direction perpendicular to the first direction by an integer multiple of a preset phase interval.

9. The device according to claim 1, wherein: The image sensor is arranged vertically above a region on the reference plane where the object is located, and facing the object.

10. The device according to claim 1, wherein: The one or more first light sources are arranged so as to irradiate the one or more first pattern lights toward the object along different optical axes above the reference plane.

11. The device according to claim 4, wherein: Each of the one or more third light sources includes a plurality of illumination light sources, and the plurality of illumination light sources are arranged above the reference plane and installed spaced apart from each other on a circumference parallel to the reference plane.

12. The device according to claim 2, wherein: The light intensity value of each of the one or more second reflected lights is determined according to the light intensity of the light that passes through the first aperture, is reflected by the partial area, and passes through the second aperture.

13. A method for determining a first three-dimensional image of an object located on a reference surface, comprising: The step of irradiating the object with at least one first light source with at least one first pattern light; The image sensor captures one or more first reflected lights generated by the one or more first pattern lights being reflected by the object; The second light source sequentially irradiates one or more second pattern lights having a phase range for a light amount phase; A step of allowing the one or more second pattern lights irradiated by the second light source to pass to a beam splitter through a first aperture; The beam splitter and the one or more lenses change the optical paths of the one or more second pattern lights passing through the first aperture so that the lights corresponding to the phases in the phase range are dispersed and reach a partial area of ​​the upper surface of the object; A step of allowing the second aperture to allow one or more second reflected lights generated by the one or more second pattern lights being reflected by the part of the area to pass to the image sensor; The image sensor captures the one or more second reflected lights passing through the second aperture; and The processor determines the first three-dimensional image of the object based on the one or more first reflected lights and the one or more second reflected lights.

14. The method according to claim 13, wherein: The step of determining the first three-dimensional image comprises: The processor determines a second three-dimensional image of the object based on phase changes of the one or more first reflected lights caused by the one or more first pattern lights; The processor determines an angle of the upper surface relative to the reference surface based on light intensity values ​​of each of the one or more second reflected lights; and The processor corrects the upper surface of the object represented by the second three-dimensional image based on the angle of the upper surface to determine the first three-dimensional image of the object.

15. The method according to claim 14, wherein: Also includes: The second light source irradiates monochromatic light; The beam splitter and the one or more lenses change the optical path of the monochromatic light so that the monochromatic light reaches the upper surface; and The image sensor captures fourth reflected light generated by the monochromatic light being reflected by the upper surface; The step of determining the second three-dimensional image includes: the processor determines the second three-dimensional image of the object based on the phase changes of the one or more first reflected lights caused by the one or more first pattern lights and the light amount changes of the fourth reflected light caused by the monochromatic light.

16. The method according to claim 13, wherein: The step of determining the first three-dimensional image comprises: A step of determining a second three-dimensional image of the object based on phase changes of the one or more first reflected lights caused by the one or more first pattern lights; A step of determining whether the upper surface of the object is a mirror surface; When it is determined that the upper surface of the object is not a mirror surface, a step of determining the second three-dimensional image as the first three-dimensional image of the object; When it is determined that the upper surface of the object is a mirror surface, A step of determining an angle of the upper surface with respect to the reference plane based on light intensity values ​​of each of the one or more second reflected lights; and A step of correcting the upper surface of the object represented by the second three-dimensional image based on the angle of the upper surface to determine the first three-dimensional image of the object.

Images