A method and system for detecting the integrity of a chip package

Abstract

The application provides a chip packaging integrity detection method and system. Infrared scanning information of a chip outer package and radiation imaging information of the chip outer package are acquired; an actual three-dimensional structure model of the chip outer package is constructed, and deviation structure information is acquired; a radiation difference image of each package surface is acquired; based on the deviation structure information and the radiation difference image of each package surface, deviation causes are analyzed, target packaging deviation information of the chip outer package is obtained, and a target packaging integrity detection result of the chip is acquired. The application solves the problem that, when the existing technology detects the integrity of the packaging through an appearance inspection instrument and a microscope, chip integrity information cannot be intelligently acquired, resulting in low detection accuracy of the packaging integrity of the chip. The application can intelligently and comprehensively identify the integrity information of the chip, and improves the accuracy of detecting the packaging integrity of the chip.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of Internet of Things chip, and particularly to a chip packaging integrity detection method and system. BACKGROUND

[0002] In the production process of integrated circuit chips, the chips need to be packaged, and the packaging integrity detection of the chips is a key step to ensure the performance and reliability of the chips, which involves multiple tests and checks to ensure that the chips can work stably and reliably under various environmental conditions.

[0003] At present, the existing packaging integrity detection method is to detect the packaging integrity of the chips one by one through large and precise detection equipment, more specifically, to detect the packaging integrity as a whole through an appearance inspection instrument and a microscope. However, when the appearance inspection instrument and the microscope are used to detect the packaging integrity as a whole, the chip integrity information cannot be intelligently obtained, resulting in low detection accuracy of the chip packaging integrity. SUMMARY

[0004] To solve the above problems, the present application provides a chip packaging integrity detection method and system, which realizes the intelligentization of chip packaging detection and improves the chip packaging detection precision.

[0005] To achieve the above purpose, the embodiment of the present application provides a chip packaging integrity detection method, which comprises:

[0006] Obtain infrared scanning information of the chip outer packaging and radiation imaging information of the chip outer packaging;

[0007] Based on the infrared scanning information of the chip outer packaging, an actual three-dimensional structure model of the chip outer packaging is constructed;

[0008] By mapping the actual three-dimensional structure model of the chip outer packaging to a preset target three-dimensional structure model, deviation structure information is obtained;

[0009] Based on the radiation imaging information of the chip outer packaging, each packaging surface of the chip outer packaging is split to obtain a radiation difference image of each packaging surface;

[0010] Based on the deviation structure information and the radiation difference image of each packaging surface, the deviation reason is analyzed to obtain target packaging deviation information of the chip outer packaging;

[0011] Based on the target packaging deviation information of the chip outer packaging, a target packaging integrity detection result of the chip is obtained.

[0012] The embodiment of the application provides a chip packaging integrity detection method, which obtains infrared scanning information of chip outer packaging and radiation imaging information of the chip outer packaging through infrared scanning and radiation imaging, can amplify the significant distinguishing features of small difference information, so that the method can improve the accuracy of identifying the packaging integrity information of the chip, splits the radiation imaging information into radiation images corresponding to multiple packaging surfaces, improves the identification comprehensiveness of the radiation imaging information, then constructs an actual three-dimensional structure model of the chip outer packaging and obtains a radiation difference image of each packaging surface, and then maps and analyzes the actual three-dimensional structure model of the chip outer packaging and a preset target three-dimensional structure model to obtain deviation structure information corresponding to the chip, the three-dimensional structure model constructed through the infrared scanning information can improve the accuracy of obtaining the deviation structure information, the deviation reason is analyzed by combining the deviation structure information corresponding to the chip and the radiation difference image of each packaging surface, target packaging deviation information of the chip outer packaging is obtained, and the target packaging integrity of the chip is detected; by combining the above infrared processing method and the radiation processing method, and based on the target packaging deviation information of the chip outer packaging, the target packaging integrity information of the chip is analyzed, the deformation, crack, scratch and packaging gap of the chip can be intelligently and comprehensively identified, so that the cost of detecting the packaging integrity of the chip is reduced, and the accuracy of detecting the packaging integrity of the chip is further intelligently improved.

[0013] Further, the infrared scanning information of the chip outer packaging and the radiation imaging information of the chip outer packaging are obtained, specifically as follows:

[0014] Based on infrared structure scanning technology, the chip outer packaging is scanned in all directions to obtain the infrared scanning information of the chip outer packaging;

[0015] Based on radiation marking technology, the radiation information of different packaging surfaces of the chip outer packaging is detected respectively to obtain the radiation imaging information of the chip outer packaging.

[0016] Further, the actual three-dimensional structure model of the chip outer packaging is constructed based on the infrared scanning information of the chip outer packaging, specifically as follows:

[0017] Based on the infrared scanning information of the chip outer packaging, three-dimensional structure data of the chip outer packaging is obtained;

[0018] The actual three-dimensional structure model of the chip outer packaging is obtained by simulating and constructing the three-dimensional structure data of the chip outer packaging.

[0019] Further, the deviation structure information is obtained by mapping the actual three-dimensional structure model of the chip outer packaging to a preset target three-dimensional structure model, specifically as follows:

[0020] Obtaining target three-dimensional position information of each reference point based on the preset target three-dimensional structure model;

[0021] Reading actual three-dimensional position information of each reference point by mapping the actual three-dimensional structure model of the off-chip package to the three-dimensional coordinate system;

[0022] Obtaining deviation structure information based on the target three-dimensional position information of each reference point and the actual three-dimensional position information of each reference point.

[0023] Further, the obtaining of the deviation structure information based on the target three-dimensional position information of each reference point and the actual three-dimensional position information of each reference point specifically includes:

[0024] Aligning the actual three-dimensional position information of each reference point with the target three-dimensional position information of each reference point to construct a coincident three-dimensional structure model;

[0025] Obtaining three-dimensional structure deviation values between each position point by calculating deviation values of each position point in the actual three-dimensional model and each position point in the target three-dimensional model;

[0026] Clustering position points corresponding to three-dimensional structure deviation values that meet preset clustering conditions based on a preset clustering algorithm to obtain a plurality of abnormal position point groups;

[0027] Obtaining three-dimensional structure deviation values corresponding to each abnormal position point based on the plurality of abnormal position point groups to obtain the deviation structure information.

[0028] Further, the splitting of each packaging surface of the off-chip package based on the radiation imaging information of the off-chip package to obtain a radiation difference image of each packaging surface specifically includes:

[0029] Splitting to obtain a radiation image of a packaging surface of the off-chip package corresponding to each collection angle based on collection angles of each radiation image in the radiation imaging information of the off-chip package;

[0030] Obtaining sub-radiation images of each image feature content based on the radiation image of the packaging surface of the off-chip package corresponding to each collection angle by extracting image feature contents in the radiation image and image ranges corresponding to the image feature contents;

[0031] Obtaining radiation intensity distribution information of each image feature content and calculating average radiation intensity of each image feature content based on the sub-radiation images of each image feature content;

[0032] Calculating radiation deviation values between radiation intensities of each radiation position point of the image feature content and the average radiation intensity based on the average radiation intensity of each image feature content to obtain sub-radiation difference images of a plurality of image feature contents.

[0033] Screening all sub-radiation difference images meeting the preset radiation deviation threshold, and obtaining the radiation difference image of each packaging surface.

[0034] The embodiment of the application provides a chip packaging integrity detection method, which determines the radiation difference image in the radiation image by extracting each image feature content and calculating the average radiation intensity, thereby improving the accuracy of the determined radiation difference image in the radiation image.

[0035] Further, based on the deviation structure information and the radiation difference image of each packaging surface, the deviation causes are analyzed to obtain target packaging deviation information of the chip outer packaging, specifically:

[0036] Based on the structure deviation trend range corresponding to the preset structure deviation cause and the outer packaging range corresponding to each packaging area of the chip outer packaging, the deviation of each abnormal position point group is analyzed to obtain the structure deviation distribution information of the corresponding abnormal position point group;

[0037] Based on the structure deviation distribution information of the corresponding abnormal position point group, the target structure deviation trend range corresponding to each abnormal position point group is obtained, and the structure deviation cause of each abnormal position point group is obtained;

[0038] Based on the radiation difference image of each packaging surface, the abnormal image range corresponding to each sub-radiation difference image and the packaging surface corresponding to the radiation difference image are obtained, and the target outer packaging range of the chip outer packaging is obtained;

[0039] Based on the target outer packaging range of the chip outer packaging, the difference causes of each sub-radiation difference image in the abnormal image range are matched and analyzed to obtain the radiation difference cause of the radiation difference image;

[0040] Based on the structure deviation cause of each abnormal position point group and the radiation difference cause of the radiation difference image, the target packaging deviation information of the chip outer packaging is obtained.

[0041] The embodiment of the application provides a chip packaging integrity detection method, which determines the packaging deviation type corresponding to each sub-packaging deviation information and the target outer packaging range, thereby determining the target packaging integrity information, reduces the cost of detecting the chip packaging integrity, improves the accuracy of detecting the chip packaging integrity, and improves the detection efficiency of the chip packaging integrity through the full-process intelligent recognition and analysis mode.

[0042] Further, based on the structure deviation cause of each abnormal position point group and the radiation difference cause of the radiation difference image, the target packaging deviation information of the chip outer packaging is obtained, specifically:

[0043] acquire first deviation structure information and a first sub-radiation difference image of the same packaging range and second deviation structure information and a second sub-radiation difference image of different packaging ranges based on the structural deviation reasons of the respective groups of abnormal position points and the radiation difference reasons of the radiation difference images;

[0044] acquire first sub-packaging deviation information corresponding to the same outer packaging range by matching target abnormal reasons of the same outer packaging range based on the first deviation structure information and the first sub-radiation difference image of the same packaging range;

[0045] respectively analyze the structural deviation reasons corresponding to the second deviation structure information and the radiation difference reasons of the second sub-radiation difference image based on the second deviation structure information and the second sub-radiation difference image of different packaging ranges, and acquire second sub-packaging deviation information corresponding to different outer packaging ranges; wherein the second sub-packaging deviation information corresponding to the different outer packaging ranges includes sub-packaging deviation information corresponding to each of the second deviation structure information and sub-packaging deviation information of each of the second sub-radiation difference images;

[0046] obtain target packaging deviation information of the outer packaging of the chip based on the first sub-packaging deviation information corresponding to the same outer packaging range and the second sub-packaging deviation information corresponding to the different outer packaging ranges.

[0047] The embodiment of the present application proposes a packaging completeness detection method of a chip, different abnormal ranges, abnormal reasons and abnormal degrees of the abnormal reasons are determined, thereby obtaining sub-packaging deviation information, and the comprehensiveness of identifying target packaging deviation information of the outer packaging of the chip is improved.

[0048] Further, the target packaging deviation information of the outer packaging of the chip is used to obtain target packaging completeness detection results of the chip, specifically:

[0049] the target packaging deviation information of the outer packaging of the chip is used to obtain packaging deviation types corresponding to each target packaging deviation information based on abnormal reasons corresponding to the target packaging deviation information of the outer packaging of the chip;

[0050] the packaging deviation types corresponding to each target packaging deviation information are detected based on a completeness evaluation strategy of a preset packaging deviation type, and target packaging completeness detection results of the chip are obtained.

[0051] The embodiment of the present application also provides a packaging completeness detection system of a chip, which comprises an information acquisition module, an actual model construction module, a deviation structure information acquisition module, a radiation difference image acquisition module, a packaging deviation information acquisition module and a deviation detection module.

[0052] The information acquisition module is used to acquire infrared scanning information of the outer packaging of the chip and radiation imaging information of the outer packaging of the chip.

[0053] The actual model construction module is configured to construct an actual three-dimensional structure model of the off-chip package based on the infrared scanning information of the off-chip package.

[0054] The deviation structure information acquisition module is configured to acquire deviation structure information by mapping the actual three-dimensional structure model of the off-chip package to a preset target three-dimensional structure model.

[0055] The radiation difference image acquisition module is configured to split each package surface of the off-chip package based on the radiation imaging information of the off-chip package, and acquire a radiation difference image of each package surface.

[0056] The packaging deviation information acquisition module is configured to analyze the deviation reason based on the deviation structure information and the radiation difference image of each package surface, and obtain target packaging deviation information of the off-chip package.

[0057] The deviation detection module is configured to acquire a target packaging integrity detection result of the chip based on the target packaging deviation information of the off-chip package.

[0058] The packaging integrity detection system of the chip is provided in the embodiment of the present application, the infrared scanning information of the off-chip package and the radiation imaging information of the off-chip package are acquired by the information acquisition module in an infrared scanning and radiation imaging manner, the significant distinguishing features of small difference information can be amplified, so that the accuracy of identifying the packaging integrity information of the chip can be improved, the radiation imaging information is split into radiation images corresponding to multiple package surfaces, the identification comprehensiveness of the radiation imaging information is improved, then the actual three-dimensional structure model of the off-chip package is constructed by the actual model construction module and the radiation difference image of each package surface is acquired by the radiation difference image acquisition module, the deviation structure information corresponding to the chip is obtained by the deviation structure information acquisition module through mapping analysis of the actual three-dimensional structure model of the off-chip package and the preset target three-dimensional structure model, the accuracy of acquiring the deviation structure information can be improved by constructing the three-dimensional structure model based on the infrared scanning information, the deviation reason is analyzed by the packaging deviation information acquisition module based on the deviation structure information corresponding to the chip and the radiation difference image of each package surface, the target packaging deviation information of the off-chip package is obtained, and the target packaging integrity of the chip is detected by the deviation detection module, the target packaging integrity information of the chip is analyzed based on the target packaging deviation information of the off-chip package by combining the above infrared processing manner and radiation processing manner, the deformation, crack, scratch and packaging gap of the chip can be intelligently and comprehensively identified, the cost of detecting the packaging integrity of the chip is reduced, and the accuracy of detecting the packaging integrity of the chip is further intelligently improved. BRIEF DESCRIPTION OF DRAWINGS

[0059] Figure 1A flowchart illustrating the steps of a chip packaging integrity detection method according to a certain embodiment of the present invention;

[0060] Figure 2 A schematic diagram of the module structure of a chip packaging integrity detection system provided in a certain embodiment of the present invention;

[0061] Figure 3 This is a schematic diagram of the module structure of a chip packaging integrity detection terminal provided in a certain embodiment of the present invention. Detailed Implementation

[0062] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0063] This invention provides a method for detecting the package integrity of a chip, applicable to IoT chip and integrated circuit chip packaging inspection environments. The method can be applied to terminals, servers, and systems including both terminals and servers, and is implemented through interaction between the terminal and server. The terminal can be, but is not limited to, various personal computers, laptops, smartphones, and tablets. See details... Figure 3 , Figure 3 This is a schematic diagram of a module structure for a chip packaging integrity detection terminal according to a certain embodiment of the present invention. In this embodiment, the following will be used: Figure 3 The chip packaging integrity testing terminal shown illustrates the content of this invention. The chip packaging integrity testing terminal includes: an infrared scanning device 301, a radiation detection device 302, a terminal 303, an infrared information processing device 304, a radiation information processing device 305, and an integrity testing device 306, which will not be described in detail below.

[0064] Example 1

[0065] See Figure 1 , Figure 1 This is a flowchart illustrating the steps of a chip packaging integrity detection method according to a certain embodiment of the present invention. Figure 1 As shown in the figure, this embodiment of the invention proposes a method for detecting the package integrity of a chip, including steps 101 to 106, the specific steps of which are as follows:

[0066] Step 101: Obtain infrared scanning information and radiation imaging information of the chip outer packaging;

[0067] As an example of the embodiment, based on the infrared structure scanning technology, the chip outer packaging is scanned in all directions to obtain infrared scanning information of the chip outer packaging; based on the radiation marking technology, the radiation information of different packaging surfaces of the chip outer packaging is detected respectively to obtain radiation imaging information of the chip outer packaging. In a specific implementation manner, the infrared scanning device 301 scans the chip outer packaging in all directions to obtain infrared scanning information of the chip outer packaging, and then transmits the infrared scanning information to the terminal 303 to obtain the infrared scanning information of the chip outer packaging. Then, the chip outer packaging is marked by the radiation marking manner, and the radiation marking processing is performed on the chip outer packaging. Then, the radiation detection device 302 detects the radiation information of different packaging surfaces of the chip outer packaging respectively, and transmits the radiation information of different packaging surfaces of the chip outer packaging to the terminal 303 to obtain the radiation imaging information of the chip outer packaging. The infrared scanning device is a scanning device based on the infrared structure scanning technology, the radiation marking manner is an element marking manner of marking each packaging surface of the chip by a radioactive element, and the radioactive element can be a low radioactive element which is radioactive and harmless to the human body. For example, a tritium element, a radioactive element contained in yttrium iron garnet, etc.

[0068] Step 102, based on the infrared scanning information of the chip outer packaging, an actual three-dimensional structure model of the chip outer packaging is constructed;

[0069] As an example of the embodiment, based on the infrared scanning information of the chip outer packaging, three-dimensional structure data of the chip outer packaging is obtained; by simulating and constructing the three-dimensional structure data of the chip outer packaging, an actual three-dimensional structure model of the chip outer packaging is obtained. In a specific implementation manner, the terminal 303 generates an actual three-dimensional structure model of the chip outer packaging by three-dimensional structure data of the chip outer packaging in the infrared scanning information; wherein, the actual three-dimensional structure model can be constructed by a finite element simulation model.

[0070] Step 103, by mapping the actual three-dimensional structure model of the chip outer packaging to a preset target three-dimensional structure model, deviation structure information is obtained;

[0071] As an example of the embodiment, based on the preset target three-dimensional structure model, the target three-dimensional position information of the three-dimensional coordinate system and each reference point is obtained; the actual three-dimensional position information of each reference point is read by mapping the actual three-dimensional structure model of the chip outer package to the three-dimensional coordinate system; and the deviation structure information is obtained based on the target three-dimensional position information of each reference point and the actual three-dimensional position information of each reference point. Specifically, the actual three-dimensional position information of each reference point is aligned with the target three-dimensional position information of each reference point to construct a coincident three-dimensional structure model; the three-dimensional structure deviation values between each position point are obtained by calculating the deviation values of each position point in the actual three-dimensional model and each position point in the target three-dimensional model; based on a preset clustering algorithm, the position points corresponding to the three-dimensional structure deviation values meeting the preset clustering condition are clustered to obtain a plurality of abnormal position point groups; and based on the plurality of abnormal position point groups, the three-dimensional structure deviation values corresponding to each abnormal position point are obtained to obtain the deviation structure information. In a specific implementation manner, the terminal 303 collects the target three-dimensional structure model of the chip outer package, and maps the actual three-dimensional structure model to the target three-dimensional structure model to obtain the deviation structure information in the actual three-dimensional structure model. The target three-dimensional structure model is a sample packaging structure model with a packaging completeness of 100%. Then, the terminal 303 sends the infrared scanning information to the infrared information processing device 304, maps the two three-dimensional structure models to the same coordinate system by coordinate system mapping, and thus identifies the deviation structure information in the actual three-dimensional structure model. The deviation structure information is deviation information corresponding to the structural abnormality reasons in the packaging process, such as deviation information corresponding to reasons such as structural depression, deformation, and scratches.

[0072] As another example of the embodiment, the actual three-dimensional structure model is mapped to the target three-dimensional structure model to obtain the deviation structure information in the actual three-dimensional structure model, including: identifying the three-dimensional coordinate system of the target three-dimensional structure model and the target three-dimensional position information of each reference point of the target three-dimensional structure model in the three-dimensional coordinate system, and aligning or overlapping the actual three-dimensional position information of each reference point in the actual three-dimensional structure model with the target three-dimensional position information of each reference point to obtain a coincident three-dimensional structure model; in the coincident three-dimensional structure model, identifying the three-dimensional structure deviation values between each position point in the actual three-dimensional structure model and each position point in the target three-dimensional structure model, and clustering the abnormal position points corresponding to each three-dimensional structure deviation value greater than a preset deviation threshold to obtain a plurality of abnormal position point groups; and taking the three-dimensional structure deviation values corresponding to each abnormal position point in each abnormal position point group as each deviation structure information in the actual three-dimensional structure model.

[0073] In step 104, based on the radiation imaging information of the chip outer package, each packaging surface of the chip outer package is split to obtain a radiation difference image of each packaging surface;

[0074] As an example of the present embodiment, based on the collection angle of each radiation image in the radiation imaging information of the out-of-chip package, the radiation image of each collection angle corresponding to the package surface of the out-of-chip package is split; based on the radiation image of each collection angle corresponding to the package surface of the out-of-chip package, the sub-radiation image of each image feature content is obtained by extracting the image feature content in the radiation image and the image range corresponding to the image feature content; based on the sub-radiation image of each image feature content, the radiation intensity distribution information of each image feature content is obtained and the average radiation intensity of each image feature content is calculated; based on the average radiation intensity of each image feature content, the radiation deviation value between the radiation intensity of each radiation position point of the image feature content and the average radiation intensity is calculated, and the sub-radiation difference image of several image feature contents is obtained; the sub-radiation difference image of all image feature contents satisfying the preset radiation deviation threshold is screened, and the radiation difference image of each package surface is obtained. In a specific implementation manner, the terminal 303 sends the radiation imaging information to the radiation information processing device 305, the radiation information processing device 305 splits according to each package surface of the out-of-chip package to obtain the radiation image corresponding to each package surface, and identifies the radiation difference image in each radiation image. Wherein, the radiation difference image is the deviation information corresponding to the packaging abnormality reason in the packaging process, for example, the deviation information corresponding to the reasons such as packaging misplacement and incomplete packaging. Wherein, when the packaging abnormality reason is crack, the packaging reason contains both the radiation difference image and the deviation structure information.

[0075] As another example of the present embodiment, identifying the radiation difference image in each radiation image includes: for each radiation image, extracting the image feature content of the radiation image and the image range corresponding to each image feature content; based on the sub-radiation image of each image feature content, identifying the radiation intensity distribution information of each image feature content, and for each image feature content, based on the radiation intensity distribution information of the image feature content, calculating the average radiation intensity of the image feature content and the radiation deviation value between the radiation intensity of each radiation position point of the image feature content and the average radiation intensity; screening the abnormal image range of the image feature content of all radiation position points corresponding to the radiation deviation value below the radiation deviation threshold as the sub-radiation difference image of the image feature content, and taking all sub-radiation difference images of the image feature content as the radiation difference image in the radiation image. The radiation information processing device 305 extracts the image feature content of the radiation image and the image range corresponding to each image feature content for each radiation image. Wherein, the way of extracting the image feature content is to extract the image feature content based on the reinforced convolutional neural network corresponding to the image feature recognition algorithm; wherein, the radiation deviation threshold is the radiation deviation threshold preset in the terminal 303.

[0076] In step 105, based on the deviation structure information and the radiation difference image of each package surface, the deviation causes are analyzed to obtain target packaging deviation information of the chip outer package.

[0077] As an example of the embodiment, based on a preset structure deviation trend range corresponding to a plurality of structure deviation reasons and an outer packaging range corresponding to each packaging area of the chip outer packaging, deviation analysis is performed on each abnormal position point group to obtain structure deviation distribution information of the corresponding abnormal position point group; based on the structure deviation distribution information of the corresponding abnormal position point group, a target structure deviation trend range corresponding to each abnormal position point group, structure deviation reasons of each abnormal position point group are obtained; based on an abnormal image range corresponding to each sub-radiation difference image in the radiation difference image of each packaging surface and a packaging surface corresponding to the radiation difference image, a target outer packaging range of the chip outer packaging is obtained; based on the target outer packaging range of the chip outer packaging, a difference reason of each sub-radiation difference image in the abnormal image range is matched and analyzed to obtain a radiation difference reason of the radiation difference image; based on the structure deviation reasons of each abnormal position point group and the radiation difference reasons of the radiation difference image, target packaging deviation information of the chip outer packaging is obtained. Specifically, based on the structure deviation reasons of each abnormal position point group and the radiation difference reasons of the radiation difference image, first deviation structure information and a first sub-radiation difference image of the same packaging range and second deviation structure information and a second sub-radiation difference image of different packaging ranges are obtained; based on the first deviation structure information and the first sub-radiation difference image of the same packaging range, by matching a target abnormal reason of the same outer packaging range, first sub-packaging deviation information corresponding to the same outer packaging range is obtained; based on the second deviation structure information and the second sub-radiation difference image of different packaging ranges, structure deviation reasons corresponding to the second deviation structure information and radiation difference reasons of the second sub-radiation difference image are analyzed respectively to obtain second sub-packaging deviation information corresponding to different outer packaging ranges; wherein the second sub-packaging deviation information corresponding to the different outer packaging ranges includes sub-packaging deviation information corresponding to each of the second deviation structure information and sub-packaging deviation information of each of the second sub-radiation difference image; based on the first sub-packaging deviation information corresponding to the same outer packaging range and the second sub-packaging deviation information corresponding to the different outer packaging ranges, target packaging deviation information of the chip outer packaging is obtained.In a specific implementation, the structural deviation trend range corresponding to each structural deviation cause and the outer packaging range corresponding to each packaging area of the outer packaging are obtained, and for each abnormal position point group, the structural deviation distribution information of the abnormal position point group is identified based on the three-dimensional structural deviation value corresponding to each abnormal position point in the abnormal position point group and the position information of each abnormal position point in the abnormal position point group; the target structural deviation trend range of the abnormal position point group is identified based on the structural deviation distribution information of the abnormal position point group, and the structural deviation cause of the abnormal position point group is determined based on the structural deviation trend range to which the target structural deviation trend range belongs; for each radiation difference image, the target outer packaging range of each abnormal image range in the radiation difference image is identified based on the abnormal image range corresponding to each sub-radiation difference image in the radiation difference image and the packaging surface corresponding to the radiation difference image, and the target packaging area corresponding to each abnormal image range is identified based on the target outer packaging range corresponding to each abnormal image range and the outer packaging range corresponding to each packaging area of the outer packaging; the radiation difference cause of each sub-radiation difference image corresponding to each abnormal image range is determined based on the target packaging area corresponding to each abnormal image range and the radiation difference cause corresponding to the target packaging area, and the radiation difference cause of all sub-radiation difference images is taken as the radiation difference cause of the radiation difference image. The packaging area includes a soldering area, a splicing area, a shell area, a baseboard area, etc. Each area corresponds to a radiation difference principle, for example, the radiation difference principle of the soldering area is soldering looseness, the radiation difference principle of the splicing area is splicing abnormality, the radiation difference principle of the shell area is structural abnormality, and the radiation difference principle of the baseboard area is base looseness, etc.

[0078] As another example of the embodiment, based on the first outer packaging range to which all abnormal position points in each deviation structure information belong and the target outer packaging range corresponding to each sub-radiation difference image in each radiation difference image, the first deviation structure information and the first sub-radiation difference image of the same outer packaging range and the second deviation structure information and the second sub-radiation difference image of different outer packaging ranges are identified; based on the structure deviation reason corresponding to each first deviation structure information and the radiation difference reason corresponding to each first sub-radiation difference image, the target abnormal reason of each same outer packaging range is determined, and the range information corresponding to each same outer packaging range and the target abnormal reason of each same outer packaging range are taken as the sub-packaging deviation information corresponding to each same outer packaging range; the structure deviation reason corresponding to each second deviation structure information and the first outer packaging range corresponding to each second deviation structure information are taken as the sub-packaging deviation information corresponding to each second deviation structure information, and the radiation difference reason of each second sub-radiation difference image and the target outer packaging range corresponding to each second sub-radiation difference image are taken as the sub-packaging deviation information of each second sub-radiation difference image; the sub-packaging deviation information corresponding to each same outer packaging range, the sub-packaging deviation information corresponding to each second deviation structure information, and the sub-packaging deviation information of each second sub-radiation difference image are taken as the target packaging deviation information of the chip outer packaging. Wherein, the target abnormal reason is a crack, and the target abnormal reason includes the depth of the crack and the range of the crack. Then, the radiation information processing device 305 takes the range information corresponding to each same outer packaging range and the target abnormal reason of each same outer packaging range as the sub-packaging deviation information corresponding to each same outer packaging range. The structure deviation reason also includes: the deviation degree of the structure deviation reason, and the deviation degree of the structure deviation reason is the structure deviation distribution information. The radiation deviation reason includes: the radiation difference range of the radiation difference reason, and the radiation difference range of the radiation difference reason is the abnormal image range of the second sub-radiation difference image.

[0079] In step 106, based on the target packaging deviation information of the chip outer packaging, the target packaging integrity detection result of the chip is obtained.

[0080] As an example of the embodiment, based on the abnormal reason corresponding to the target packaging deviation information of the off-chip packaging, the packaging deviation type corresponding to each target packaging deviation information is obtained; in a specific implementation manner, the completeness detection device 306 obtains the completeness evaluation strategy of different packaging deviation types, and based on the abnormal reason corresponding to each sub-packaging deviation information of the target packaging deviation information, identifies the packaging deviation type corresponding to each sub-packaging deviation information; based on the packaging deviation type corresponding to each sub-packaging deviation information and the target off-chip packaging range corresponding to each sub-packaging deviation information, the completeness of each sub-packaging deviation information is evaluated through the completeness evaluation strategy of each packaging deviation type, and the packaging completeness information of all sub-packaging deviation information is taken as the target packaging completeness information of the chip.

[0081] Based on the completeness evaluation strategy of the preset packaging deviation type, the completeness of the packaging deviation type corresponding to each target packaging deviation information is detected, and the target packaging completeness detection result of the chip is obtained.

[0082] The embodiment of the present application provides a kind of chip's package integrity detection method, the infrared scanning information of chip outer packaging and the radiation imaging information of chip outer packaging are acquired by the way of infrared scanning and radiation imaging, can amplify the significant distinguishing feature of small difference information, so that the way can improve the precision of identifying the package integrity information of chip, radiation imaging information is also split into the radiation image corresponding to multiple packaging faces, improve the identification comprehensiveness of radiation imaging information, then the actual three-dimensional structure model of chip outer packaging and the radiation difference image of each packaging face are respectively constructed, the deviation structure information corresponding to chip is obtained by mapping analysis of the actual three-dimensional structure model of chip outer packaging and preset target three-dimensional structure model, the precision of deviation structure information acquisition can be improved by constructing three-dimensional structure model by infrared scanning information, in combination with the deviation structure information corresponding to chip and the radiation difference image of each packaging face, the target packaging deviation information of chip outer packaging is obtained by analyzing the deviation reason, and the target package integrity of chip is detected;Through the combination of the above infrared processing mode and radiation processing mode, based on the target packaging deviation information of the chip outer packaging, the target package integrity information of the chip can be analyzed, which can intelligently and comprehensively identify the deformation, crack, scratch and packaging gap of the chip, not only reduce the cost of detecting the package integrity of chip, further intelligently improve the precision of detecting the package integrity of chip;By extracting each image feature content and calculating the average radiation intensity, the radiation difference image in the radiation image is determined, which improves the precision of determining the radiation difference image in the radiation image;By identifying the packaging deviation type corresponding to each sub-packaging deviation information and target outer packaging range, the target package integrity information is determined, which reduces the cost of detecting the package integrity of chip, intelligently improves the precision of detecting the package integrity of chip, and improves the detection efficiency of the package integrity of chip by the way of full-process intelligent identification and analysis;By determining different abnormal range, abnormal reason and abnormal degree of the abnormal reason, each sub-packaging deviation information is obtained, which improves the comprehensiveness of identifying the target packaging deviation information of chip outer packaging.

[0083] Embodiment 2

[0084] Referring to Figure 2 , Figure 2 A module structure schematic diagram of a chip package integrity detection system provided by an embodiment of the present application is shown. Figure 2 As shown in the figure, the present application provides a kind of chip's package integrity detection system, comprising:

[0085] Information acquisition module 201, actual model construction module 202, deviation structure information acquisition module 203, radiation difference image acquisition module 204, packaging deviation information acquisition module 205, deviation detection module 206.

[0086] The information obtaining module 201 is configured to obtain infrared scanning information of the off-chip packaging and radiation imaging information of the off-chip packaging.

[0087] The actual model constructing module 202 is configured to construct an actual three-dimensional structure model of the off-chip packaging based on the infrared scanning information of the off-chip packaging.

[0088] The deviation structure information obtaining module 203 is configured to obtain deviation structure information by mapping the actual three-dimensional structure model of the off-chip packaging to a preset target three-dimensional structure model.

[0089] The radiation difference image obtaining module 204 is configured to split each packaging surface of the off-chip packaging based on the radiation imaging information of the off-chip packaging, and obtain a radiation difference image of each packaging surface.

[0090] The packaging deviation information obtaining module 205 is configured to analyze a deviation reason based on the deviation structure information and the radiation difference image of each packaging surface, and obtain target packaging deviation information of the off-chip packaging.

[0091] The deviation detecting module 206 is configured to obtain a target packaging integrity detection result of a chip based on the target packaging deviation information of the off-chip packaging.

[0092] The embodiment of the present application provides a kind of chip package integrity detection system, by information acquisition module, the way of infrared scanning and radiation imaging is used to obtain the infrared scanning information of chip outer packaging and the radiation imaging information of chip outer packaging, can amplify the significant distinguishing feature of small difference information, so that the way can improve the precision of identifying the package integrity information of chip, also split the radiation image corresponding to the radiation imaging information of each packaging face, improve the identification comprehensiveness of radiation imaging information, then by actual model construction module and radiation difference image acquisition module, the actual three-dimensional structure model of chip outer packaging is constructed and the radiation difference image of each packaging face is acquired, then by deviation structure information acquisition module, the actual three-dimensional structure model of chip outer packaging is mapped and analyzed with preset target three-dimensional structure model, and the deviation structure information corresponding to chip is obtained, the precision of deviation structure information acquisition can be improved by constructing three-dimensional structure model of infrared scanning information, combined with the deviation structure information corresponding to chip and the radiation difference image of each packaging face, the deviation reason is analyzed by package deviation information acquisition module, and the target package deviation information of chip outer packaging is obtained and the target package integrity of chip is detected by deviation detection module;By the combination of the above infrared processing mode and radiation processing mode, based on the target package deviation information of the chip outer packaging, the target package integrity information of the chip is analyzed, which can intelligently and comprehensively identify the deformation, crack, scratch and packaging gap of chip, not only reduce the cost of detecting chip package integrity, further intelligently improve the precision of detecting chip package integrity.

[0093] The above only is the preferred embodiment of the present application, it should be pointed out that, for the ordinary skilled in the art, without departing from the technical principles of the present application, a number of improvements and modifications can be made, these improvements and modifications should also be considered as the protection scope of the present application.

[0094] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the specific features, structures, materials or characteristics described can be combined in any suitable way in any one or more embodiments or examples. In addition, the skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of different embodiments or examples without contradiction.

[0095] Moreover, the terms "first", "second", "third", etc. are used herein for descriptive purposes only and cannot be construed as indicating or implying relative importance or a quantity of indicated technical features. Thus, features defined with "first", "second" or "third" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality" is two or more, unless otherwise explicitly specifically defined.

Claims

1. A method of detecting the integrity of a package of a chip, characterized by, The method comprises the following steps: acquiring infrared scanning information of an off-chip package and radiation imaging information of the off-chip package; constructing an actual three-dimensional structure model of the off-chip package based on the infrared scanning information of the off-chip package; obtaining deviation structure information by mapping the actual three-dimensional structure model of the off-chip package to a preset target three-dimensional structure model; based on the radiation imaging information of the off-chip package, splitting each package surface of the off-chip package to obtain a radiation difference image of each package surface, specifically: based on the collection angle of each radiation image in the radiation imaging information of the off-chip package, the radiation image of the package surface corresponding to each collection angle is obtained by splitting; based on the radiation image of the package surface corresponding to each collection angle, the image feature content and the image range corresponding to the image feature content in the radiation image are extracted to obtain a sub-radiation image of each image feature content; based on the sub-radiation image of each image feature content, the radiation intensity distribution information of each image feature content is obtained and the average radiation intensity of each image feature content is calculated; based on the average radiation intensity of each image feature content, the radiation deviation value between the radiation intensity of each radiation position point of the image feature content and the average radiation intensity is calculated to obtain a sub-radiation difference image of several image feature contents; screening the sub-radiation difference image of all image feature contents that meet the preset radiation deviation threshold to obtain the radiation difference image of each package surface; based on the deviation structure information and the radiation difference image of each package surface, analyzing the deviation reason to obtain target packaging deviation information of the off-chip package, specifically: based on the structure deviation trend range corresponding to the preset several structure deviation reasons and the off-chip package range corresponding to each package area of the off-chip package, performing deviation analysis on each abnormal position point group to obtain structure deviation distribution information of the corresponding abnormal position point group; based on the structure deviation distribution information of the corresponding abnormal position point group, the target structure deviation trend range corresponding to each abnormal position point group, obtaining the structure deviation reason of each abnormal position point group; based on the abnormal image range corresponding to each sub-radiation difference image in the radiation difference image of each package surface and the package surface corresponding to the radiation difference image, obtaining the target off-chip package range of the off-chip package; based on the target off-chip package range of the off-chip package, matching and analyzing the difference reason of each sub-radiation difference image in the abnormal image range to obtain the radiation difference reason of the radiation difference image; based on the structure deviation reason of each abnormal position point group and the radiation difference reason of the radiation difference image, obtaining the target packaging deviation information of the off-chip package; The radiation difference reasons of the structure deviation reasons and the radiation difference images of each abnormal position point group are obtained, and target packaging deviation information of the chip outer package is obtained, specifically: based on the structure deviation reasons and the radiation difference reasons of the radiation difference images of each abnormal position point group, first deviation structure information and a first sub-radiation difference image of the same packaging range and second deviation structure information and a second sub-radiation difference image of different packaging ranges are obtained; based on the first deviation structure information and the first sub-radiation difference image of the same packaging range, target abnormal reasons of the same outer packaging range are matched to obtain first sub-packaging deviation information corresponding to the same outer packaging range; based on the second deviation structure information and the second sub-radiation difference image of different packaging ranges, the structure deviation reasons corresponding to the second deviation structure information and the radiation difference reasons of the second sub-radiation difference image are analyzed respectively to obtain second sub-packaging deviation information corresponding to different outer packaging ranges; wherein the second sub-packaging deviation information corresponding to the different outer packaging ranges includes sub-packaging deviation information corresponding to each of the second deviation structure information and sub-packaging deviation information of each of the second sub-radiation difference image; based on the first sub-packaging deviation information corresponding to the same outer packaging range and the second sub-packaging deviation information corresponding to the different outer packaging ranges, target packaging deviation information of the chip outer package is obtained; Based on the target packaging deviation information of the chip outer package, a target packaging integrity detection result of the chip is obtained.

2. The method of claim 1, wherein the step of detecting the package integrity of the chip is performed by using a laser beam. The infrared scanning information of the chip outer package and the radiation imaging information of the chip outer package are obtained, specifically: Based on infrared structure scanning technology, the chip outer package is scanned in all directions to obtain infrared scanning information of the chip outer package; Based on radiation marking technology, the radiation information of different packaging surfaces of the chip outer package is detected respectively to obtain radiation imaging information of the chip outer package.

3. The method of claim 1, wherein the step of detecting the package integrity of the chip is performed by using a laser beam. Based on the infrared scanning information of the chip outer package, an actual three-dimensional structure model of the chip outer package is constructed, specifically: Based on the infrared scanning information of the chip outer package, three-dimensional structure data of the chip outer package is obtained; By simulating and constructing the three-dimensional structure data of the chip outer package, an actual three-dimensional structure model of the chip outer package is obtained.

4. The method of claim 1, wherein the step of detecting the package integrity of the chip is performed by using a laser beam. By mapping the actual three-dimensional structure model of the chip outer package to a preset target three-dimensional structure model, deviation structure information is obtained, specifically: Based on the preset target three-dimensional structure model, a three-dimensional coordinate system and target three-dimensional position information of each reference point are obtained; By mapping the actual three-dimensional structure model of the chip outer package to the three-dimensional coordinate system, actual three-dimensional position information of each reference point is read; Based on the target three-dimensional position information of each reference point and the actual three-dimensional position information of each reference point, deviation structure information is obtained.

5. The method of claim 4, wherein the step of detecting the package integrity of the chip is performed by using a laser beam. Based on the target three-dimensional position information of each reference point and the actual three-dimensional position information of each reference point, deviation structure information is obtained, specifically: The actual three-dimensional position information of each reference point is aligned with the target three-dimensional position information of each reference point to construct a coincident three-dimensional structure model; The three-dimensional structure deviation values between the position points are obtained by calculating deviation values of each position point in the actual three-dimensional model and each position point in the target three-dimensional model; Based on a preset clustering algorithm, the position points corresponding to the three-dimensional structure deviation values meeting the preset clustering condition are clustered to obtain a plurality of abnormal position point groups; Based on the plurality of abnormal position point groups, the three-dimensional structure deviation values corresponding to each abnormal position point are obtained to obtain the deviation structure information.

6. The method of claim 1-5, wherein Based on the target packaging deviation information of the chip outer package, a target packaging completeness detection result of the chip is obtained, specifically: Based on the abnormal reasons corresponding to the target packaging deviation information of the chip outer package, the packaging deviation types corresponding to each target packaging deviation information are obtained; Based on the completeness evaluation strategy of the preset packaging deviation type, the completeness of the packaging deviation types corresponding to each target packaging deviation information is detected to obtain the target packaging completeness detection result of the chip.

7. A detection system for a package completeness detection method based on the chip of any one of claims 1-6, characterized in that, It comprises: An information acquisition module, an actual model construction module, a deviation structure information acquisition module, a radiation difference image acquisition module, a packaging deviation information acquisition module, and a deviation detection module; The information acquisition module is used to acquire infrared scanning information of the chip outer package and radiation imaging information of the chip outer package; The actual model construction module is used to construct an actual three-dimensional structure model of the chip outer package based on the infrared scanning information of the chip outer package; The deviation structure information acquisition module is used to acquire deviation structure information by mapping the actual three-dimensional structure model of the chip outer package to a preset target three-dimensional structure model; The radiation difference image acquisition module is used to split each packaging surface of the chip outer package based on the radiation imaging information of the chip outer package to acquire a radiation difference image of each packaging surface, specifically: based on the collection viewing angles of each radiation image in the radiation imaging information of the chip outer package, the radiation image of the packaging surface corresponding to each collection viewing angle of the chip outer package is split; based on the radiation image of the packaging surface corresponding to each collection viewing angle of the chip outer package, the image feature content in the radiation image and the image range corresponding to the image feature content are extracted to obtain a sub-radiation image of each image feature content; based on the sub-radiation images of each image feature content, the radiation intensity distribution information of each image feature content is acquired and the average radiation intensity of each image feature content is calculated; based on the average radiation intensity of each image feature content, the radiation deviation value between the radiation intensity of each radiation position point of the image feature content and the average radiation intensity is calculated to obtain a plurality of sub-radiation difference images of the image feature content; all sub-radiation difference images of the image feature content meeting the preset radiation deviation threshold are screened to obtain the radiation difference image of each packaging surface; The packaging deviation information acquisition module is configured to analyze the deviation causes based on the deviation structure information and the radiation difference image of each packaging surface, and obtain target packaging deviation information of the off-chip packaging. Specifically, the packaging deviation information acquisition module is configured to: based on a preset structure deviation trend range corresponding to a plurality of structure deviation causes and an off-chip packaging range corresponding to each packaging region of the off-chip packaging, perform deviation analysis on each abnormal position point group to obtain structure deviation distribution information of the corresponding abnormal position point group; based on the structure deviation distribution information of the corresponding abnormal position point group and a target structure deviation trend range corresponding to each abnormal position point group, obtain a structure deviation cause of each abnormal position point group; based on an abnormal image range corresponding to each sub-radiation difference image in the radiation difference image and a packaging surface corresponding to the radiation difference image, obtain a target off-chip packaging range of the off-chip packaging; based on the target off-chip packaging range of the off-chip packaging, match and analyze a difference cause of each sub-radiation difference image in the abnormal image range to obtain a radiation difference cause of the radiation difference image; and based on the structure deviation cause of each abnormal position point group and the radiation difference cause of the radiation difference image, obtain the target packaging deviation information of the off-chip packaging. The packaging deviation information acquisition module is configured to analyze the deviation causes based on the deviation structure information and the radiation difference image of each packaging surface, and obtain target packaging deviation information of the off-chip packaging. Specifically, the packaging deviation information acquisition module is configured to: based on a preset structure deviation trend range corresponding to a plurality of structure deviation causes and an off-chip packaging range corresponding to each packaging region of the off-chip packaging, perform deviation analysis on each abnormal position point group to obtain structure deviation distribution information of the corresponding abnormal position point group; based on the structure deviation distribution information of the corresponding abnormal position point group and a target structure deviation trend range corresponding to each abnormal position point group, obtain a structure deviation cause of each abnormal position point group; based on an abnormal image range corresponding to each sub-radiation difference image in the radiation difference image and a packaging surface corresponding to the radiation difference image, obtain a target off-chip packaging range of the off-chip packaging; based on the target off-chip packaging range of the off-chip packaging, match and analyze a difference cause of each sub-radiation difference image in the abnormal image range to obtain a radiation difference cause of the radiation difference image; and based on the structure deviation cause of each abnormal position point group and the radiation difference cause of the radiation difference image, obtain the target packaging deviation information of the off-chip packaging. The deviation detection module is configured to obtain a target packaging integrity detection result of the chip based on the target packaging deviation information of the off-chip packaging.

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