Circuit board first inspection and reinspection integrated camera module
By designing an integrated camera module for first inspection and re-inspection of circuit boards, the problem of difficulty in comprehensively and accurately obtaining the inner line situation and detecting misjudgment or misjudgment in the existing technology is solved, and a single time has been achieved The first inspection and re-inspection were completed, which improved the inspection efficiency and avoided material damage.
Patent Information
- Application Number
- CN202411910063.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2025-02-18
AI Technical Summary
Existing circuit board detection technology is difficult to obtain the inner circuit situation comprehensively and accurately when detecting complex multi-layer circuit boards, and misjudgments may occur during the inspection process. Re-checking is required to ensure the accuracy of the detection results, resulting in efficiency. Low and inconvenient material transport.
Design an integrated camera module for first inspection and re-inspection of circuit board, including bracket, mount, first inspection camera, re-inspection camera, light-up mechanism and adjustment mechanism. The position of the mounting frame is adjusted by adjusting the mechanism to make the first inspection camera and The re-inspection camera is in the appropriate position to complete the first inspection and re-inspection of the material at one time.
The first inspection and re-inspection of the circuit board is achieved at one time, eliminating the process of material transfer, improving the efficiency of re-inspection, and avoiding bumps and damage caused by material handling.
Smart Images

Figure CN119470448A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of circuit board detection equipment, and in particular to a camera module integrated with initial inspection and re-inspection of circuit boards. Background Art
[0002] Printed Circuit Board (PCB) is a key basic component of various electronic devices, and its quality plays a decisive role in the overall performance and reliability of electronic devices. Therefore, strict quality inspection is essential in the production process of circuit boards. At present, there are many inspection technologies for circuit boards, including manual visual inspection, automatic optical inspection (AOI), automatic X-ray inspection (AXI), etc.
[0003] Automatic optical inspection (AOI) technology uses an optical imaging system to capture images of circuit boards, and then uses image processing algorithms to compare and analyze with preset standard images to determine whether the circuit boards have defects. AOI technology has overcome some of the shortcomings of manual visual inspection to a certain extent, has high detection accuracy and efficiency, and can detect a variety of appearance and some hidden defects. However, AOI equipment also has limitations in practical applications. For example, for some complex multi-layer circuit boards, since the inner layer circuits are covered by the outer layer, it is sometimes difficult to fully and accurately obtain the true situation of the inner layer circuits only through optical imaging; and during the detection process, misjudgments or missed judgments may occur due to factors such as lighting conditions, image acquisition angles, and algorithm adaptability. Further review is still required to ensure the accuracy of the test results. In view of the limitations of the above-mentioned detection technology, in the actual process of circuit board production, it is often necessary to re-inspect the circuit boards that have undergone initial inspection to further improve the accuracy of the test results and reduce the risk of defective products flowing out.
[0004] The re-inspection of circuit boards is generally carried out through re-inspection equipment, which requires the materials after the initial inspection to be transported to the re-inspection equipment, which is inefficient. When the materials are large, transportation is inconvenient, and there is a risk of the materials being bumped and dropped during transportation.
[0005] In view of this, there is an urgent need for an integrated camera module for initial inspection and re-inspection of circuit boards. Summary of the invention
[0006] In view of the problems existing in the prior art, the present invention solves the problems with the following technical structure.
[0007] To achieve the above object, the present invention adopts the following technical solution:
[0008] A circuit board first inspection and re-inspection integrated camera module, comprising: a bracket, on which a mounting frame, a first inspection camera, a re-inspection camera, a lighting mechanism and an adjustment mechanism are arranged;
[0009] The first inspection camera and the re-inspection camera are both arranged on a mounting frame;
[0010] The adjustment mechanism is used to adjust the position of the mounting frame to adjust the positions of the first inspection camera and the re-inspection camera;
[0011] The polishing mechanism is used for polishing the material.
[0012] Its further characteristic is that
[0013] The adjustment mechanism includes a height adjustment linear module and a level adjustment linear module. The height adjustment linear module is used to adjust the height of the mounting frame, and the level adjustment linear module is used to adjust the horizontal position of the mounting frame.
[0014] The height adjustment linear module comprises a first guide rail, a motor, a screw rod and a carrier plate, wherein the first guide rail is vertically arranged on the bracket, the carrier plate is slidably arranged on the first guide rail, the screw rod is rotatably arranged on the first guide rail, the axial direction of the screw rod is consistent with the extension direction of the first guide rail, the motor is used to drive the screw rod to rotate, and the carrier plate is sleeved on the screw rod and is threadedly connected with the screw rod;
[0015] The mounting plate is arranged on the carrier plate.
[0016] The lighting mechanism comprises a connecting frame and two strip-shaped light sources. The connecting frame is arranged on a bracket, and the two strip-shaped light sources are horizontally arranged on the connecting frame.
[0017] The two connecting frames are provided, and the two connecting frames are respectively provided at two ends of the strip light source.
[0018] The connecting frame is provided with two first strip holes extending in the horizontal direction, and both ends of the strip light source are provided with positioning bolts, and the positioning bolts are respectively passed through the corresponding first strip holes.
[0019] The connecting frame is provided with a second strip hole extending in the vertical direction, and the connecting frame is slidably arranged on the bracket through the second strip hole.
[0020] A second guide rail is vertically arranged on the mounting frame, and the re-inspection camera is slidably arranged on the second guide rail.
[0021] An annular light source is arranged at the bottom of the second guide rail, and the annular light source is arranged directly below the re-inspection camera.
[0022] Fixed frames are arranged on both sides of the second guide rail.
[0023] The above structure of the present invention can achieve the following beneficial effects:
[0024] When in use, the present application is placed directly above the material conveying platform, with the lenses of the first inspection camera and the re-inspection camera facing downward, and the position of the mounting frame is adjusted by the adjustment mechanism so that the first inspection camera and the re-inspection camera are in a suitable position. During inspection, the material passes through the bottom of the first inspection camera and the re-inspection camera in turn, and the material is illuminated by the lighting mechanism. The first inspection camera is used to capture the image of the circuit board, and then the image processing algorithm is used to compare and analyze the preset standard image to determine whether the circuit board has defects. Then the re-inspection camera is used to capture the image again, and manual inspection is performed to determine whether the circuit board has defects. In this way, the first inspection and re-inspection of the material are completed at one time, and there is no need for a separate re-inspection. This not only saves the process of material transfer, but also improves the efficiency of re-inspection, and avoids damage caused by bumps and damages due to material handling. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 This is a schematic diagram of the structure of this application;
[0026] Figure 2 This is a schematic diagram of the structure of some of the mechanisms in this application;
[0027] Figure 3 This is a schematic diagram of the structure of the bracket and the height-adjustable linear module in this application;
[0028] Figure 4 It is a structural schematic diagram of the lighting mechanism in this application;
[0029] Figure 5 This is a schematic diagram of the structure of the review camera in this application.
[0030] In the figure: 1. bracket; 2. mounting frame; 3. first inspection camera; 4. re-inspection camera; 5. lighting mechanism; 51. connecting frame; 52. light source; 53. first strip hole; 54. positioning bolt; 55. second strip hole; 6. height adjustment linear module; 61. first guide rail; 62. motor; 63. lead screw; 64. carrier plate; 7. horizontal adjustment linear module; 8. second guide rail; 81. fixing frame; 9. ring light source. DETAILED DESCRIPTION
[0031] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.
[0032] It should be noted that the terms "including" and "having" and any variations thereof in the specification and claims of the present invention and the above-mentioned drawings are intended to cover non-exclusive inclusions. For example, a process, method, apparatus, product or equipment comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or equipment.
[0033] The following is combined with Figure 1-Figure 5 This application is described in further detail.
[0034] refer to Figure 1-Figure 3 The circuit board first inspection and re-inspection integrated camera module shown in the figure comprises: a bracket 1, on which a mounting frame 2, a first inspection camera 3, a re-inspection camera 4, a lighting mechanism 5 and an adjustment mechanism are arranged; the first inspection camera 3 and the re-inspection camera 4 are both arranged on the mounting frame 2; in this way, when in use, the present application is placed directly above the material conveying platform, the lenses of the first inspection camera 3 and the re-inspection camera 4 face downward, and the position of the mounting frame 2 is adjusted by the adjustment mechanism so that the first inspection camera 3 and the re-inspection camera 4 are in a suitable position. During inspection, the material passes through the bottom of the first inspection camera 3 and the re-inspection camera 4 in turn, and the material is illuminated by the lighting mechanism 5. The image of the circuit board is collected by the first inspection camera 3, and then the image processing algorithm is used to compare and analyze with the preset standard image to determine whether the circuit board has defects, and then the image is collected again by the re-inspection camera 4 for manual inspection to determine whether the circuit board has defects, thereby completing the first inspection and re-inspection of the material at one time, without the need for separate re-inspection, which not only saves a material transfer process, but also improves the re-inspection efficiency, and also avoids the occurrence of bumps and damages due to material handling.
[0035] like Figure 1-Figure 3As shown, the adjustment mechanism includes a height adjustment linear module 6 and a horizontal adjustment linear module 7. The height of the mounting frame 2 is adjusted by the height adjustment linear module 6, and the horizontal position of the mounting frame 2 is adjusted by the horizontal adjustment linear module 7 to adapt to the detection of products of different specifications. The height adjustment linear module 6 specifically includes a first guide rail 61, a motor 62, a screw rod 63 and a carrier plate 64. The first guide rail 61 is vertically arranged on the bracket 1, the carrier plate 64 is slidably arranged on the first guide rail 61, the screw rod 63 is rotatably arranged on the first guide rail 61, and the screw rod 63 is rotatably arranged on the first guide rail 61. 3 is consistent with the extension direction of the first guide rail 61, the motor 62 is used to drive the screw rod 63 to rotate, the carrier plate 64 is sleeved on the screw rod 63 and is threadedly connected to the screw rod 63; the mounting plate 2 is set on the carrier plate 64, so that the motor 62 drives the screw rod 63 to rotate, so that the carrier seat 64 moves along the axial direction of the screw rod 63, so as to adjust the height of the mounting frame 2, thereby achieving the purpose of adjusting the height of the first inspection camera 3 and the re-inspection camera 4; the structure of the horizontal adjustment linear module 7 is consistent with the structure of the height adjustment linear module 6, but the orientation is different, which will not be repeated.
[0036] like Figure 4 As shown, the lighting mechanism 5 specifically includes a connecting frame 51 and two strip light sources 52. The connecting frame 51 is arranged on the bracket 1, and the two strip light sources 52 are horizontally arranged on the connecting frame 51. Through the two horizontally arranged strip light sources 52, the material passing below is illuminated, so that the first inspection camera 3 can capture a clearer image.
[0037] Further optimization is that Figure 4 As shown, in order to improve the installation stability of the strip light source 52, two connecting frames 51 are provided, and the two connecting frames 51 are respectively provided at the two ends of the strip light source 52; and because of the different material sizes or detection requirements, in order to facilitate the adjustment of the positions and angles of the two strip light sources 52, two first strip holes 53 extending in the horizontal direction are provided on the connecting frame 51, and positioning bolts 54 are provided at both ends of the strip light source 52, and the positioning bolts 54 are respectively penetrated at the corresponding first strip holes 53. In this way, the positioning bolts 54 at both ends of the strip light source 52 are fixed in the corresponding first strip holes 53. 3 to adjust the horizontal position of the strip light source 52, and the strip light source 52 can also rotate with the positioning bolt 54 as the axis to adjust the lighting direction to meet different lighting requirements; and the connecting frame 51 is provided with a second strip hole 55 extending in the vertical direction, and the connecting frame 51 is slidably arranged on the bracket 1 through the second strip hole 55. When processing, the connecting member 51 can be fixed to the bracket 1 by passing the bolt through the second strip hole 55, and the bolt can be placed at different positions of the second strip hole 55 to achieve the synchronous adjustment of the heights of the two strip light sources 52.
[0038] like Figure 5As shown, in order to facilitate the individual adjustment of the re-inspection camera 4, a second guide rail 8 is vertically arranged on the mounting frame 2, and the re-inspection camera 4 is slidably arranged on the second guide rail 8, so that the height of the re-inspection camera 4 can be adjusted individually, so that the present application can adapt to more diverse detection requirements; at the same time, an annular light source 9 is arranged at the bottom of the second guide rail 8, and the annular light source 9 is arranged directly below the re-inspection camera 4 to illuminate the image acquisition of the re-inspection camera 4, and auxiliary equipment such as laser positioning lights, code readers, etc. can be arranged on the fixing frames 81 on both sides of the second guide rail 8 as needed.
[0039] Working principle of the present invention: when in use, the present invention is placed directly above the material conveying platform, with the lenses of the first inspection camera 3 and the re-inspection camera 4 facing downward, and the position of the mounting frame 2 is adjusted by the adjustment mechanism so that the first inspection camera 3 and the re-inspection camera 4 are in a suitable position. During inspection, the material passes through the bottom of the first inspection camera 3 and the re-inspection camera 4 in turn, and the material is illuminated by the lighting mechanism 5. The first inspection camera 3 is used to capture the image of the circuit board, and then the image processing algorithm is used to compare and analyze with the preset standard image to determine whether the circuit board has defects. Then, the re-inspection camera 4 is used to capture the image again, and manual inspection is performed to determine whether the circuit board has defects, thereby completing the first inspection and re-inspection of the material at one time, without the need for separate re-inspection, which not only saves a material transfer process, but also improves the re-inspection efficiency and avoids the occurrence of bumps and damages due to material handling.
[0040] The above are only preferred embodiments of the present application, and the present invention is not limited to the above embodiments. It is understood that other improvements and changes directly derived or associated by those skilled in the art without departing from the spirit and concept of the present invention should be considered to be included in the protection scope of the present invention.
Claims
1. A camera module integrated with the first inspection and re-inspection of a circuit board, characterized in that: include: A bracket (1), wherein the bracket (1) is provided with a mounting frame (2), a first inspection camera (3), a re-inspection camera (4), a lighting mechanism (5) and an adjustment mechanism; The first inspection camera (3) and the re-inspection camera (4) are both arranged on the mounting frame (2); The adjustment mechanism is used to adjust the position of the mounting frame (2) so as to adjust the positions of the first inspection camera (3) and the re-inspection camera (4); The polishing mechanism (5) is used to polish the material.
2. The integrated camera module for initial inspection and re-inspection of a circuit board according to claim 1, characterized in that: The adjustment mechanism comprises a height adjustment linear module (6) and a level adjustment linear module (7), wherein the height adjustment linear module (6) is used to adjust the height of the mounting frame (2), and the level adjustment linear module (7) is used to adjust the horizontal position of the mounting frame (2).
3. The integrated camera module for initial inspection and re-inspection of a circuit board according to claim 2, characterized in that: The height adjustment linear module (6) comprises a first guide rail (61), a motor (62), a screw rod (63) and a carrier plate (64), wherein the first guide rail (61) is vertically arranged on the bracket (1), the carrier plate (64) is slidably arranged on the first guide rail (61), the screw rod (63) is rotatably arranged on the first guide rail (61), the axial direction of the screw rod (63) is consistent with the extension direction of the first guide rail (61), the motor (62) is used to drive the screw rod (63) to rotate, and the carrier plate (64) is sleeved on the screw rod (63) and is threadedly connected to the screw rod (63); The mounting plate (2) is arranged on a carrier plate (64).
4. The integrated camera module for initial inspection and re-inspection of a circuit board according to claim 3, characterized in that: The lighting mechanism (5) comprises a connecting frame (51) and two strip-shaped light sources (52); the connecting frame (51) is arranged on the bracket (1); and the two strip-shaped light sources (52) are horizontally arranged on the connecting frame (51).
5. The integrated camera module for initial inspection and re-inspection of a circuit board according to claim 4, characterized in that: Two connecting frames (51) are provided, and the two connecting frames (51) are respectively provided at two ends of the strip-shaped light source (52).
6. The integrated camera module for initial inspection and re-inspection of a circuit board according to claim 5, characterized in that: The connecting frame (51) is provided with two first strip-shaped holes (53) extending in the horizontal direction, and positioning bolts (54) are provided at both ends of the strip-shaped light source (52), and the positioning bolts (54) are respectively penetrated through the corresponding first strip-shaped holes (53).
7. The integrated camera module for initial inspection and re-inspection of a circuit board according to claim 4, characterized in that: The connecting frame (51) is provided with a second strip-shaped hole (55) extending in the vertical direction, and the connecting frame (51) is slidably arranged on the bracket (1) through the second strip-shaped hole (55).
8. The integrated camera module for initial inspection and re-inspection of a circuit board according to claim 1, characterized in that: A second guide rail (8) is vertically arranged on the mounting frame (2), and the re-inspection camera (4) is slidably arranged on the second guide rail (8).
9. The integrated camera module for initial inspection and re-inspection of a circuit board according to claim 8, characterized in that: An annular light source (9) is arranged at the bottom of the second guide rail (8), and the annular light source (9) is arranged directly below the re-inspection camera (4).
10. The integrated camera module for initial inspection and re-inspection of a circuit board according to claim 8, characterized in that: Fixed frames (81) are provided on both sides of the second guide rail (8).