Enhanced imaging analysis for three-dimensional scanning acquisition and fiber / wire separation
By using vertical acquisition orientation dual volume alignment and data merging technology in 3D X-ray image acquisition, the problems of insufficient image quality and difficulty in separation are solved, high-quality three-dimensional image analysis and fiber/conductor separation are achieved, and analysis is improved accuracy and efficiency.
Patent Information
- Application Number
- CN202411081159.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-08-10
- Filing Date
- 2024-08-08
- Publication Date
- 2025-02-18
AI Technical Summary
The prior art has insufficient image quality, high noise, and lack of effective separation and analysis methods in three-dimensional X-ray image acquisition and fiber/wire separation, especially in high-density parts analysis in complex three-dimensional structures.
Determine the surface by importing two volumes and reference points with vertical acquisition orientations, selecting marks, positioning alignment volumes based on marks, measuring and normalizing the distance between marks, merging data sets, sampling data, determining wire orientation and winding directions , draw the conductor position and determine the separation structure.
The quality and signal-to-noise ratio of three-dimensional images are improved, and the precise identification and separation of optical fibers and wires in complex three-dimensional structures is achieved, providing a more reliable and fast analysis method, reducing operational complexity and cost.
Smart Images

Figure CN119470496A_ABST
Abstract
Description
[0001] CROSS-REFERENCE TO RELATED APPLICATIONS
[0002] This application claims priority to U.S. non-provisional patent application No. 18 / 447,601, filed on August 10, 2023, the entire contents of which are incorporated herein by reference. Technical Field
[0003] Aspects of the present disclosure relate to analysis of three-dimensional images. More specifically, aspects of the present disclosure provide enhanced imaging analysis for three-dimensional scanning acquisition and fiber / wire separation. Background Art
[0004] 3D image acquisition, separation and analysis of optical fibers and / or wires in multiple electronic components are essential to ensure their reliability and related failure analysis. Identifying faults and risks in electronic components with complex 3D structures and high density, such as transformers, is a challenging task. Acquisition of 3D X-ray images with high signal-to-noise ratio and their subsequent analysis, including fiber identification or separation, is essential to allow these fault and risk analyses.
[0005] Failure analysis allows for the precise identification of defects, artifacts and process indicators, such as shorts, solder balls and other metal residues, and magnet wire overlap. The results of the failure analysis are then used to implement preventive or corrective actions, either at the component design specification level or during manufacturing and assembly.
[0006] Conventional analysis methods often do not have adequate image quality for such images; furthermore, there is noise inherent in the images and no methods or algorithms for separating and analyzing wires and / or fibers in components within complex three-dimensional structures.
[0007] Although the use of 3D X-ray images is becoming standard practice in the electronics industry, the methods used have a number of disadvantages. For example, data acquisition still has limitations, which are related to the slight signal-to-noise ratio of certain heavy components and image post-processing methods, especially in components with complex 3D structures.
[0008] Currently, there is no reliable and repeatable method for improved 3D X-ray image acquisition for high density and highly complex parts. For 3D parts, there are only empirical and imprecise methods for image post-processing for fiber and / or wire separation.
[0009] It would be desirable to provide an apparatus and method that is easier to operate than conventional apparatuses and methods and that provides for analysis of complex three-dimensional components.
[0010] There is a further need to provide an apparatus and method that does not have the above-mentioned disadvantages of using empirical methods that are not accurate for the very detailed parts used in the industry.
[0011] There is also a need to provide a method for analyzing three-dimensional structures that is cost-effective and that is accurate and rapid. Summary of the invention
[0012] Therefore, to understand in detail the manner of the above-mentioned features of the present disclosure, a more specific description of the present disclosure briefly summarized below can be obtained with reference to the embodiments, some of which are illustrated in the accompanying drawings. It should be noted that the accompanying drawings only show typical embodiments of the present disclosure and should not be considered as limiting the scope thereof, as the present disclosure may allow for other equally effective embodiments without specific description. Therefore, the following overview only provides a few aspects of the description and should not be used to limit the described embodiments to a single concept.
[0013] In one embodiment, a method for analyzing a three-dimensional scan is disclosed. The method may include importing two volumes and reference points with a perpendicular acquisition orientation, each of the two volumes and the reference points having a discrete data set. The method may include determining the surfaces of the two volumes. The method may also include selecting a marker on each of the two volumes. The method may include aligning the two volumes based on the positioning of the markers. The method may also include measuring the distance between the markers on each of the two volumes. The method may further include normalizing the measured distance between the markers. The method may also include updating the alignment of the two volumes based on the normalized measured distance between the markers, and updating the data set. The method may also include merging the data sets to obtain a single data set. The method may also include sampling the single data set. The method may also include determining the orientation and correlation information of the wire, and mapping the location of the wire. The method may also include determining the winding direction of the wire for the single data set. The method may also include determining the separation structure of the single set.
[0014] In another exemplary embodiment, an article of manufacture includes a non-volatile memory having a set of instructions combined thereon, the set of instructions being configured to be read by a computer. The set of instructions may include a method for analyzing a three-dimensional scan. The method with respect to the set of instructions may include importing two volumes and reference points having a perpendicular acquisition orientation, each of the two volumes and the reference points having a discrete data set. The method with respect to the set of instructions may include determining the surfaces of the two volumes. The method with respect to the set of instructions may include selecting a marker on each of the two volumes. The method with respect to the set of instructions may include aligning the two volumes based on the positioning of the markers. The method with respect to the set of instructions may include measuring the distance between the markers on each of the two volumes. The method with respect to the set of instructions may include normalizing the measured distance between the markers. The method with respect to the set of instructions may also include updating the alignment of the two volumes based on the normalized measured distance between the markers, and updating the data set. The method with respect to the set of instructions may further include merging the data sets to obtain a single data set. The method with respect to the set of instructions may further include sampling the single data set. The method with respect to the set of instructions may further include determining the orientation and correlation information of the wire, and plotting the location of the wire. The method with respect to the set of instructions may further include determining the winding direction of the wire of the single data set. The method regarding the set of instructions may further include determining a separate structure of the individual sets.
[0015] In another exemplary embodiment, a method may include performing two three-dimensional scans of an object, each scan being performed in a perpendicular acquisition orientation, and each scan having a discrete data set, the scans defining two volumes. The method may also include determining the surfaces of the two volumes. The method may also include selecting a marker on each of the two volumes. The method may also include aligning the two volumes based on the positioning of the markers. The method may also include measuring the distance between the markers on each of the two volumes. The method may also include normalizing the measured distance between the markers. The method may also include updating the alignment of the two volumes based on the normalized measured distance between the markers, and updating the data set. The method may also include merging the data sets to obtain a single data set. The method may also include sampling the single data set. The method may also include determining the orientation and correlation information of the wire, and mapping the location of the wire. The method may also include determining the winding direction of the wire for the single data set. The method may also include determining a separation structure for the single data set. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Therefore, to understand in detail the manner of the above-mentioned features of the present disclosure, a more specific description of the present disclosure, briefly summarized below, can be obtained by reference to the embodiments, some of which are illustrated in the accompanying drawings. It is noted, however, that the accompanying drawings illustrate only typical embodiments of the present disclosure and are therefore not to be considered limiting of its scope, as the present disclosure may admit to other equally effective embodiments.
[0017] Figure 1 Two separate acquisition volumes with different orientations are depicted.
[0018] Figure 2 Two separate acquisition volumes in aligned orientation are depicted.
[0019] Figure 3 yes Figure 2 3D rendering of the alignment orientation.
[0020] Figure 4 It is a depiction Figure 3 A merger of previously aligned datasets in .
[0021] Figure 5 It is depicted from Figure 4 The windings detected in the results.
[0022] Figure 6 It is a depiction Figure 4 Top and bottom views of the merged data set.
[0023] Figure 7 are top and bottom views of a single acquisition data set of volume set 2.
[0024] Figure 8 is a merged top view showing twenty discrete identification wires.
[0025] Fig. 9 is a non-merged top view showing eleven discrete identification wires.
[0026] Fig.10 is a magnified top view of the result of merging the data.
[0027] Fig.11 is a magnified top view of the result of a single acquisition.
[0028] Fig.12 A method for analyzing a three-dimensional body according to an exemplary embodiment of the present disclosure.
[0029] To facilitate understanding, like reference numerals have been used, where possible, to designate like parts in the drawings ("Figures"). It is contemplated that components disclosed in one embodiment may be beneficially utilized in other embodiments without specific recitation. DETAILED DESCRIPTION
[0030] In the following, reference is made to embodiments of the present disclosure. However, it should be understood that the present disclosure is not limited to the specifically described embodiments. On the contrary, any combination of the following features and elements, whether or not related to different embodiments, is considered to be able to implement and practice the present disclosure. In addition, although the embodiments of the present disclosure can achieve advantages over other possible solutions and / or prior art, whether a specific advantage is achieved by a given embodiment does not limit the present disclosure. Therefore, the following aspects, features, embodiments and advantages are merely illustrative and are not considered to be elements or limitations of the claims unless expressly stated in the claims. Similarly, reference to the "present disclosure" should not be interpreted as a summary of the inventive subject matter disclosed herein, and should not be considered to be elements or limitations of the claims unless expressly stated in the claims.
[0031] Although the terms first, second, third, etc. can be used to describe various parts, components, regions, layers and / or parts here, these parts, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish a part, component, region, layer or part from another region, layer or part. Terms such as "first", "second" and other numerical terms, when used here, do not mean order or sequence unless the context clearly indicates. Therefore, without departing from the teaching of the exemplary embodiment, the first part, component, region, layer or part discussed here can be referred to as the second part, component, region, layer or part.
[0032] When a component or layer is referred to as being "on another component or layer," "engaged to," "connected to," or "coupled to" another component or layer, it may be directly on, engaged to, connected to, coupled to, or there may be intermediate components or layers. Conversely, when a component is referred to as being "directly on another component or layer," "directly engaged to," "directly connected to," or "directly coupled to" another component or layer, there may be no intermediate components or layers. Other words used to describe relationships between components should be interpreted in a similar manner. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed terms.
[0033] Some embodiments will now be described with reference to the accompanying drawings. To remain consistent, similar parts in each figure will reference similar numbers. In the following description, many details are set forth to provide an understanding of various embodiments and / or features. However, it will be appreciated by those skilled in the art that some embodiments can be implemented without these details, and many variations or modifications to the described embodiments are possible. As used herein, the terms "above" and "below", "up" and "below", "upper" and "lower", "upwards" and "downwards", and other similar terms representing relative positions above or below a given point are used in this specification to more clearly describe certain embodiments.
[0034] Embodiments of the present disclosure provide enhanced image analysis for three-dimensional scanning. This enhanced image analysis can provide researchers with data related to wire or fiber separation or defects based on three-dimensional scanning. Figure 1 and 2 The first step of the method involves importing two volumes and reference points with perpendicular acquisition orientation. Figure 1 In the present invention, a first volume is established by performing a three-dimensional scan of an object. In this case, the volume is a core winding. Such a core winding is present, for example, in an electronic component. In order for the winding to achieve its intended purpose, it is desirable that the winding comprises a single strand of conductive material tightly wound around a central core. For example, the single strand may be made of copper or a copper alloy material. In this embodiment, as shown in FIG. Figure 2 As presented, a second scan of the winding is also completed. In these two scans, the orientation between the two scans is perpendicular or 90 degrees offset. In embodiments of the present disclosure, orientation marks can be used on the winding scans. The scanned surface can be detailed enough to identify the surface or surface features of the winding. As shown, this can include being able to identify individual optical fibers or wire strands extending on the surface.
[0035] After determining the surfaces of the two scans, Figure 1 and Figure 2 As shown, fiducial markers are selected on both volumes, represented as geometrical elements, to be used as reference points for the alignment process. To achieve this, an alignment method based on these selected markers is applied, enabling an accurate and automatic association of the captured 3D scan data.
[0036] In an embodiment, the distances between the markers of the two volumes are normalized and the alignment is updated to achieve an accurate and proper overlap of the two volumes. Figure 3 shown.
[0037] Next, the method consists in merging the datasets from the two previously aligned volumes, allowing for complete analysis and visualization. Figure 4, the merging of the aligned datasets has already taken place. The reference dataset and the aligned dataset are merged into a unified dataset, which is produced by the fusion of the two volumes. The result is then resampled to adjust the resolution and obtain an accurate representation of the complex part with a higher signal-to-noise ratio over the entire part structure.
[0038] Extract the orientation and correlation information of the wires and use it to draw the wires of the component, such as Figure 5 Transformer winding shown. To achieve this, the analysis is based on the calculation of relevant measurements and orientation values of the wires / fibers, taking into account specific parameters such as the radius of the cylinder.
[0039] Next, the winding inspection is done with the merged data. With this step, the quality of the 3D image is improved by selecting two perpendicular scanning axes and by reconstructing a final image with an improved signal-to-noise ratio. It allows better separation of the fibers and / or wires present on the component, even for dense components, complex structure components and wires / fibers consisting of the same material as other component structures (e.g. lead frames).
[0040] In embodiments, the separation structure is used as an indicator of the presence of a fault and may also give the structure and parameters of a single wire / fiber for mechanical or thermal simulation purposes and structural analysis (weight, size, density, wire gauge and length).
[0041] Analysis of the different structures resulting from the alignment and merging process of two differently oriented scans provides a more reliable and efficient process for analyzing transformers and other highly complex or dense components, contributing to their overall mean time between failure and efficiency. It should be understood that although described in relation to X-ray scanning, other types of scans, such as computed tomography (CT), may also be used. As will be further understood, because the data set from the scans may be large, such data sets may be stored on a cloud-based computer system.
[0042] In an embodiment, the value of this method lies in the quality of the 3D image results, the increased signal-to-noise ratio, and the accuracy of fiber / wire identification compared to conventional analysis. The results obtained show that the merged data facilitates comprehensive and detailed visualization of the component, especially in terms of wire and discontinuity detection. The unmerged data shows a greatly reduced level of detail. This method is particularly useful when considering limited X-ray source power.
[0043] To demonstrate the high quality of the data achieved by merging the data, the detection of wires in the same part was applied to a single volume using the same parameters as previously selected without performing a merge. Thus, in the figures provided, the reader can identify the difference between the merged and non-merged data.
[0044] The results of this comparison are shown in the accompanying figures. Figure 6 , showing a first result of merging data of the first volume and the second volume. Figure 6 The leftmost part shows a top view, and the rightmost part shows a bottom view. Figure 7 , the leftmost part shows the top view, and the rightmost part shows the bottom view. Figure 7 Compared with the results provided in Figure 6 The merged data in shows better clarity and more identification of damaged wires.
[0045] For further enhancement, a top comparison of the dataset is provided for inspection. Figure 8 , 20 discontinuous wires are shown for the merged set, while Fig. 9 In this example, only 11 discontinuous wires are shown. Using this method, nine additional discontinuous wires are identified in this example. For easier identification, Fig.10 Shows Figure 8 A magnified view of the top shows the discontinuous wires, while Fig.11 Shows Fig. 9 Zoomed in view from the top, showing fewer defects. In embodiments, highlighted details of a cracked or damaged structure may be visually depicted for user inspection. As will be appreciated, a separate warning system may be incorporated into the analysis protocol so that if the visual analysis determines that the structure is not defective, the user may quickly move to another analysis, thereby limiting expensive inspection time. In embodiments, artificial intelligence may also be used to inspect the data to completely eliminate user interaction or data inspection. Such artificial intelligence may be created so that different layers of nodal analysis may provide learning capabilities to the program.
[0046] Using merged data in the analysis of complex and densely packed components improves the accuracy and reliability of the analyzed data (as demonstrated here with winding wire inspection). The merged dataset captures details from multiple orientations, enabling precise identification of the component's structure and potential faults, such as wire continuity, potential shorts, and critical features. In contrast, relying on a single orientation dataset may result in limited and incomplete information.
[0047] refer to Fig.12, a method 1200 for three-dimensional scanning acquisition and fiber / wire separation using enhanced image analysis is provided. At 1202, the method includes importing two volumes and reference points with a vertical acquisition orientation, each of the two volumes and reference points having a discrete data set. As can be appreciated, the method can also involve actually scanning the object from two different viewpoints and saving the data sets from the two different viewpoints to a computer or non-volatile memory. At 1204, the method includes determining the surfaces of the two volumes. At 1206, the method includes selecting a marker on each of the two volumes. At 1208, the method includes aligning the two volumes based on the positioning of the markers. At 1210, the method includes measuring the distance between the markers on each of the two volumes. At 1212, the method includes normalizing the measured distance between the markers. At 1214, the method also includes updating the alignment of the two volumes based on the normalized measured distance between the markers, and updating the data set. At 1216, the method also includes merging the data sets to obtain a single data set. At 1218, the method also includes sampling the single data set. At 1220, the method also includes determining orientation and correlation information for the wires and plotting the locations of the wires. At 1222, the method also includes determining winding directions for the wires for a single data set. At 1224, the method also includes determining a separation structure for a single set. As described above, the method steps can be performed on a computer, and the output can be provided visually or through a printed analysis. In addition, aspects of the present disclosure can also include saving data from the data set to a non-volatile memory device. Such a non-volatile memory device can transmit the data for computer analysis on other computers / workstations / computing devices.
[0048] Example embodiments of the claims are presented. The embodiments should not be considered limiting. In one embodiment, a method for analyzing a three-dimensional scan is disclosed. The method may include importing two volumes and reference points with a perpendicular acquisition orientation, each of the two volumes and the reference points having a discrete data set. The method may include determining the surfaces of the two volumes. The method may also include selecting a marker on each of the two volumes. The method may include aligning the two volumes based on the positioning of the markers. The method may also include measuring the distance between the markers on each of the two volumes. The method may further include normalizing the measured distance between the markers. The method may also include updating the alignment of the two volumes based on the normalized measured distance between the markers, and updating the data set. The method may also include merging the data sets to obtain a single data set. The method may also include sampling the single data set. The method may also include determining the orientation and correlation information of the wire, and mapping the location of the wire. The method may also include determining the winding direction of the wire for the single data set. The method may also include determining a separation structure for the single set.
[0049] In another exemplary embodiment, the method may be performed wherein the markings are geometric elements.
[0050] In another exemplary embodiment, the method may be performed wherein the selection of the marking is a reference point for alignment.
[0051] In another exemplary embodiment, the method may be performed wherein updating the alignment of the two volumes enables a superposition of the two volumes.
[0052] In another exemplary embodiment, the method may be performed wherein sampling adjusts the resolution of the single data set.
[0053] In another exemplary embodiment, the method may be performed wherein the sampling results in a signal-to-noise ratio that is higher than the original signal-to-noise ratio of the discrete data set.
[0054] In another exemplary embodiment, the method may be performed wherein determining the orientation and correlation information of the guide wire and drawing the position of the guide wire is based on calculation of the correlation measurement value and the orientation value.
[0055] In another exemplary embodiment, the method may be performed wherein the calculation of the correlation measure and the orientation value takes into account the cylinder radius of the single data set.
[0056] In another exemplary embodiment, the method may be performed wherein determining the winding direction of the wire for the single data set includes selecting two perpendicular scanning axes and reconstructing a final image.
[0057] In another exemplary embodiment, the method may be performed wherein determining the disjoint structure of the single set is an indication of the presence of a conductor fault.
[0058] In another exemplary embodiment, the method may further include displaying an image of the single data set illustrating the separated structures.
[0059] In another exemplary embodiment, an article of manufacture includes a non-volatile memory containing a set of instructions configured to be readable by a computer. The set of instructions may include a method for analyzing a three-dimensional scan. The method with respect to the set of instructions may include importing two volumes and reference points with a perpendicular acquisition orientation, each of the two volumes and the reference points having a discrete data set. The method with respect to the set of instructions may include determining the surfaces of the two volumes. The method with respect to the set of instructions may include selecting a marker on each of the two volumes. The method with respect to the set of instructions may include aligning the two volumes based on the positioning of the markers. The method with respect to the set of instructions may include measuring the distance between the markers on each of the two volumes. The method with respect to the set of instructions may include normalizing the measured distance between the markers. The method with respect to the set of instructions may also include updating the alignment of the two volumes based on the normalized measured distance between the markers, and updating the data set. The method with respect to the set of instructions may further include merging the data sets to obtain a single data set. The method with respect to the set of instructions may further include sampling the single data set. The method with respect to the set of instructions may further include determining the orientation and correlation information of the wire, and plotting the location of the wire. The method with respect to the set of instructions may further include determining the winding direction of the wire of the single data set. The method regarding the set of instructions may further include determining a separate structure for the single set.
[0060] In another exemplary embodiment, a method may include performing two three-dimensional scans of an object, each scan performed in a perpendicular acquisition orientation, each scan having a discrete data set, the scans defining two volumes. The method may also include determining the surfaces of the two volumes. The method may also include selecting a marker on each of the two volumes. The method may also include aligning the two volumes based on the positioning of the markers. The method may also include measuring the distance between the markers on each of the two volumes. The method may also include normalizing the measured distance between the markers. The method may also include updating the alignment of the two volumes based on the normalized measured distance between the markers, and updating the data set. The method may also include merging the data sets to obtain a single data set. The method may also include sampling the single data set. The method may also include determining the orientation and correlation information of the wire, and mapping the location of the wire. The method may also include determining the winding direction of the wire for the single data set. The method may also include determining a separation structure for the single data set.
[0061] In another exemplary embodiment, the method may be performed wherein the object is a winding of an electrical component.
[0062] In another exemplary embodiment, the method may further include saving a single data set associated with the scan of the object in a non-volatile memory.
[0063] In another exemplary embodiment, the method may further include displaying an image of the single data set illustrating the separated structures.
[0064] In another exemplary embodiment, the method may be performed wherein updating the alignment of the two volumes enables a superposition of the two volumes.
[0065] In another exemplary embodiment, the method may be performed wherein sampling adjusts the resolution of the single data set.
[0066] In another exemplary embodiment, the method may be performed wherein determining the winding direction of the wire for the single data set includes selecting two perpendicular scanning axes and reconstructing a final image.
[0067] In another exemplary embodiment, the method may be performed wherein determining the disjoint structure of the single set is an indication of the presence of a conductor fault.
[0068] The foregoing description of the embodiments is provided for the purpose of illustration and description. It is not intended to be exhaustive or to limit the present disclosure. Individual components or features of a particular embodiment are generally not limited to that particular embodiment, but where applicable, they are interchangeable and can be used in selected embodiments even if not specifically shown or described. They can also be varied in many ways. Such variations should not be considered as departing from the present disclosure, and all such modifications are intended to be included within the scope of the present disclosure.
[0069] Although embodiments have been described herein, those skilled in the art having benefit of this disclosure will appreciate that other embodiments may be conceived without departing from the scope of this disclosure. Therefore, the scope of this claim or any subsequent claims should not be unduly limited by the description of the embodiments described herein.
Claims
1. A method for analyzing a three-dimensional scan, comprising: importing two volumes and reference points having a perpendicular acquisition orientation, each of the two volumes and the reference points having a discrete data set; Determine the surfaces of two volumes; A selection of markers is performed on each of the two volumes; aligning the two volumes based on the positioning of the markers; measuring the distance between the marks on each of the two volumes; Normalize the measured distances between markers; updating the alignment of the two volumes based on the normalized measured distance between the markers, and updating the dataset; Merge datasets to obtain a single dataset; Sampling a single dataset; Determine the orientation and correlation information of the wires and plot the locations of the wires; Determines the winding direction of the wire for a single data set; and A separation structure is determined for the single set. The method according to claim 1 , wherein the marking is a geometric element. The method of claim 1 , wherein the selection of the mark is a reference point for alignment. The method of claim 1 , wherein updating the alignment of the two volumes enables superposition of the two volumes. The method of claim 1 , wherein sampling adjusts the resolution of a single data set. The method of claim 5 , wherein sampling results in a signal-to-noise ratio that is higher than the original signal-to-noise ratio of the discrete data set. 7 . The method of claim 1 , wherein determining orientation and correlation information of the wire and drawing the position of the wire is based on calculation of correlation measurements and orientation values.
8. The method of claim 7, wherein the calculation of the correlation measurement and orientation values takes into account the radius of the cylinder of the single data set.
9. The method of claim 1, wherein determining the winding direction of the wire for a single data set comprises selecting two perpendicular scanning axes and reconstructing a final image.
10. The method of claim 1, wherein determining the disjoint structure of the single set is an indication of the presence of a conductor fault.
11. The method according to claim 1, further comprising: Shows an image of a single data set illustrating the separated structure.
12. An article of manufacture comprising a non-volatile memory, a set of instructions coupled to the non-volatile memory configured to be read by a computer, the set of instructions comprising a method for analyzing a three-dimensional scan, the method comprising: importing two volumes and reference points having a perpendicular acquisition orientation, each of the two volumes and the reference points having a discrete data set; Determine the surfaces of two volumes; A selection of markers is performed on each of the two volumes; aligning the two volumes based on the positioning of the markers; measuring the distance between the marks on each of the two volumes; Normalize the measured distances between markers; updating the alignment of the two volumes based on the normalized measured distance between the markers, and updating the dataset; Merge datasets to obtain a single dataset; Sampling a single dataset; Determine the orientation and correlation information of the wires and plot the locations of the wires; Determines the winding direction of the wire for a single data set; and Determine the separation structure of this single set.
13. A method comprising: performing two three-dimensional scans of the object, each scan being in a perpendicular acquisition orientation and each scan having a discrete data set, the scans defining two volumes; Determine the surfaces of two volumes; A selection of markers is performed on each of the two volumes; aligning the two volumes based on the positioning of the markers; measuring the distance between the marks on each of the two volumes; Normalize the measured distances between markers; updating the alignment of the two volumes based on the normalized measured distance between the markers, and updating the dataset; Merge datasets to obtain a single dataset; Sampling a single dataset; Determine the orientation and correlation information of the wires and plot the locations of the wires; Determines the winding direction of the wire for a single data set; and Determine the separation structure to use for a single data set.
14. The method of claim 13, wherein the object is a winding for an electrical component.
15. The method according to claim 13, further comprising: A single data set associated with the scan of the object is saved in non-volatile memory.
16. The method according to claim 13, further comprising: Shows an image of a single data set illustrating the separated structure. The method of claim 13 , wherein updating the alignment of the two volumes enables superposition of the two volumes.
18. The method of claim 13, wherein sampling adjusts the resolution of the single data set.
19. The method of claim 13, wherein determining the winding direction of the wire for a single data set comprises selecting two perpendicular scanning axes and reconstructing a final image.
20. The method of claim 13, wherein determining the disjoint structure of the single set is an indication of the presence of a conductor fault.