A chip testing tool testing method, system and terminal

Abstract

The present invention relates to a test method, system and terminal of a chip test tool, and relates to the field of tooling, which includes obtaining internal image information of the test tooling; determining the notch feature, notch feature size and notch feature position according to the internal image information and the notch feature library; based on the notch feature size falling into the installation size range, controlling the preset clamping device according to the notch feature position to place the standard chip into the test slot, and controlling the upper cover to press the standard chip according to the initial downward force to obtain the signal test result; when the signal test result is consistent with the preset reference output, the test is completed; when the signal test result is inconsistent with the reference output, an unqualified prompt is issued. The chip test tooling is tested using the above method to ensure that the chip test tooling function is complete to improve the accuracy of the chip test.

Description

Technical Field

[0001] The present invention relates to the field of tooling, and in particular to a testing method, system and terminal for chip testing tooling. Background Art

[0002] During the production and preparation of chips, due to the compact internal structure and small size of the chip, especially if the integrated circuit has a poor contact problem, it will cause the chip's function to be unstable or even unable to function. Therefore, the chip needs to be tested before it leaves the factory. In the process of chip testing, chip testing tooling is usually required.

[0003] In the prior art, a chip testing tool usually includes a fixture body and an upper cover, and the upper cover is rotatably mounted on the top of the fixture body. The fixture body is used to place the chip, and it has a slot for the chip to be placed. The upper cover is used to press the chip into the slot. In the prior art, the chip testing tool needs to be repeatedly used for chip testing after it is produced, so whether the chip testing tool itself meets the requirements is also a necessary condition for determining the accuracy of the final test of the chip to be tested. The chip testing tool may have errors when the production is completed, and the test function may be damaged during use, resulting in errors. In order to ensure the qualification of the chip testing tool, it needs to be tested. Summary of the invention

[0004] In order to ensure that chip testing tooling meets requirements and improve the final test accuracy of the chip to be tested, the present invention provides a testing method, system and terminal for a chip testing tooling.

[0005] In a first aspect, the present application provides a chip testing tool testing method, which adopts the following technical solution:

[0006] A chip testing tool testing method, used for testing the chip testing tool, comprising:

[0007] Obtaining internal image information of the test fixture after the preset upper cover is opened;

[0008] Determining the slot features of the preset test slot according to the internal image information and the preset slot feature library;

[0009] Determine the slot feature size and slot feature position according to the internal image information, the slot feature and the preset reference point;

[0010] Since the characteristic dimension of the slot exceeds the preset installation dimension range, it is defined as dimension failure, the test is completed and a failure prompt is issued;

[0011] Based on the notch feature size falling within the installation size range, a preset clamping device is controlled according to the notch feature position to place a preset standard chip into the test slot, and the upper cover is controlled to press the standard chip according to a preset initial downward pressure to obtain a signal test result;

[0012] When the signal test result is consistent with the preset reference output, the test is completed;

[0013] When the signal test result is inconsistent with the reference output, a failure prompt is issued, and the test fixture is inspected using a preset error cause detection method.

[0014] By adopting the above technical solution, the characteristic dimensions of the notch of the test fixture are first measured, and the standard chip is tested while ensuring that the test fixture can be placed in a standard manner. It is more convenient to judge whether the test fixture is qualified based on the final signal test results.

[0015] Optionally, the error cause detection method includes:

[0016] Determine the slot start position of the test slot according to the internal image information and the slot features;

[0017] Control the preset pressing sheet to move to the starting position of the notch and press down to obtain the abutment pressure when the pressing sheet contacts the probe;

[0018] When the abutment pressure is not 0, the pressing distance of the tablet is determined;

[0019] Determine the allowable pressing distance of the upper cover according to the pressing distance and the preset test slot depth;

[0020] Match the maximum preload pressure according to the allowable downward pressure distance;

[0021] Control the pressure of the upper cover on the standard chip to increase from the initial pressure to the maximum preload pressure at a preset growth rate, and judge in real time whether the signal test result is consistent with the benchmark output;

[0022] Based on the inconsistency between the signal test result and the reference output, it is defined as other probe faults, and other fault prompts are output;

[0023] Based on the signal test result being consistent with the reference output, it is defined as probe height misalignment, and the detection is completed and a probe error prompt is output.

[0024] By adopting the above technical solution, when the test result of the test tooling is unqualified, the chip is moved downward by changing the pressure of the upper cover on the chip, so that it can be determined whether the probe height is uneven so that the probe and the chip's test point cannot be completely abutted when the chip is placed in the test slot.

[0025] Optional adjustment methods for uneven probe heights include:

[0026] According to the characteristic position of the slot, the clamping device is controlled to place the preset standard chip into the test slot and press it down, and the contact signal between the standard chip and the probe is obtained;

[0027] When the abutment signal appears, the clamping device is controlled to fix the standard chip;

[0028] The probe is adjusted at the preset probe position according to the allowable downward pressing distance, and whether the abutment signals before and after the adjustment are consistent;

[0029] When the abutment signals before and after adjustment are inconsistent, continue to adjust the next probe until the last probe is adjusted, and then determine whether the abutment signal is consistent with the reference output;

[0030] If the contact signal is consistent with the reference output, the adjustment is complete.

[0031] By adopting the above technical solution, by abutting the standard chip against the top of the probe with the longest length extending into the test slot, and adjusting other probes based on this probe, all probes can abut against the standard chip, which is more convenient.

[0032] Optionally, other faults of the probe include probe deformation, and methods for detecting the probe deformation include:

[0033] Acquiring probe image information at a preset probe position;

[0034] Determine whether the probe is deformed according to the probe image information and the preset standard probe;

[0035] If the probe is deformed, determine whether the probe is bent based on the probe image information and the preset straight probe;

[0036] Based on the probe bending, it is defined as the probe bending deformation, the detection is completed, the probe bending prompt is output, and the probe is processed with the preset probe bending processing method;

[0037] Based on the fact that the probe is not bent, a preset coating device is controlled to coat the top of the probe with a fluorescent agent at the probe position, and a fluorescence distribution image is acquired vertically downward;

[0038] comparing the fluorescence distribution image with a preset probe distribution image to determine tilted and non-overlapping offset probe features and offset positions;

[0039] determining an offset distance according to the offset position and the probe position;

[0040] Based on the fact that the offset distance exceeds the preset measurement range, it is defined as probe tilt deformation, the detection is completed, the probe tilt prompt is output, and the probe is processed using the probe tilt deformation processing method.

[0041] By adopting the above technical solution, images are used to identify whether the probe is bent or tilted. When it is judged to be tilted, fluorescent agent is applied on the top of the probe and the position distribution of the luminous points on the top of all the probes is obtained. The tilt of the probe is determined based on the position distribution of the luminous points. This can eliminate the influence of probes that have a certain tilt angle but are still qualified, and the result is more accurate.

[0042] Optionally, the probe bending situation needs to be processed, and the probe bending processing method includes:

[0043] Determine the probe root feature according to the probe image information, the probe position and the preset root clamping range;

[0044] Determine whether the probe root feature is inclined according to the probe root feature and the standard probe;

[0045] Based on the fact that the probe root feature is not tilted, a preset clamping half ring is matched according to a preset probe diameter;

[0046] Control the two clamping half rings to clamp at the root feature of the probe, and control the two clamping half rings to lift simultaneously with a preset lifting force to straighten the bent probe;

[0047] Based on the probe root feature inclination, the root inclination angle is determined according to the probe image information and the probe root feature;

[0048] Match the clamping force to the root inclination angle;

[0049] The two clamping half rings are controlled to clamp the probe root feature according to the clamping force to straighten the probe root feature, and then the two clamping half rings are controlled to lift simultaneously with the preset lifting force to straighten the bent probe.

[0050] Optionally, the probe tilt deformation needs to be processed, and the probe tilt deformation processing method includes:

[0051] determining the probe top position of the obliquely deformed probe according to the fluorescence distribution image;

[0052] According to the measuring range, a preset correction ring whose inner diameter is matched to the measuring range is provided;

[0053] Control the correction ring to fit into the top position of the probe and automatically drop to the bottom;

[0054] The correction ring is raised with a preset lifting force to straighten the tilted probe.

[0055] Optionally, other faults of the probe include signal interference. The processing methods of signal interference include:

[0056] Determine whether the probe is deformed according to the probe image information and the preset standard probe;

[0057] If the probe is not deformed, the preset signal interference device is controlled according to the preset release power to interfere the signal of the probe in the test slot, and the initial signal output information is recorded;

[0058] Controlling the signal interference device to increase the release power at a preset increasing rate, and recording the last signal output information again;

[0059] When the initial signal output information is inconsistent with the final signal output information, it is defined as probe signal interference, the detection is completed and the probe interference prompt is output;

[0060] Determining the difference signal and the difference probe position according to the initial signal output information and the final signal output information;

[0061] Obtaining the width of the annular area where the probe can be installed and grounded at different probe positions;

[0062] When the width of the annular area is greater than the preset ground pin installation width, the preset punching device is controlled to drill holes within the width of the annular area and install the ground pin according to the preset opening depth;

[0063] When the width of the annular area is not greater than the installation width of the grounding pin, the probe is grounded circumferentially by a preset conductive silver glue injection method.

[0064] By adopting the above technical solution, when there is signal interference, the probe position is circumferentially grounded by setting ground pins or opening annular grooves and injecting conductive silver glue at the probe position to shield the interference signal, making the test result more accurate.

[0065] Optionally, the conductive silver paste pouring method includes:

[0066] Determine the contour of the groove area according to the probe image information and the width of the annular area;

[0067] According to the preset opening depth, the punching device is controlled to punch along the contour of the groove area to form an annular groove, and the volume of the groove is determined according to the opening depth and the width of the annular area;

[0068] Determine the amount of conductive silver paste to be poured into the groove according to the volume of the groove;

[0069] The injection device is controlled to inject the conductive silver glue into the annular groove according to the filling amount, and the preset flattening device is controlled to flatten the annular groove with a preset extrusion force.

[0070] In a second aspect, the present application provides a chip testing tool testing system, which adopts the following technical solution:

[0071] A chip testing tool testing system, comprising:

[0072] An acquisition module, used to acquire internal image information, abutment pressure when the pressing sheet contacts the probe, abutment signals between the standard chip and the probe, probe image information, fluorescence distribution image, initial signal output information, and final signal output information;

[0073] A memory, used to store a program of a test method of any of the above chip test tools;

[0074] The program in the processor and the memory can be loaded and executed by the processor and realize a testing method of a chip testing tool.

[0075] In a third aspect, the present application provides a smart terminal, which adopts the following technical solution:

[0076] An intelligent terminal comprises a memory and a processor, wherein the memory stores a computer program which can be loaded by the processor and executes a test method of any of the above-mentioned chip test tools.

[0077] In summary, the present application includes at least one of the following beneficial technical effects:

[0078] It is convenient to measure the characteristic dimensions of the notch of the test fixture, test the standard chip while ensuring that the test fixture can be placed in a standard manner, and judge whether the test fixture is qualified based on the final signal test results;

[0079] When the test result of the test fixture is unqualified, the chip is moved downward by changing the pressure of the upper cover on the chip, so as to determine whether it is because the probe height is uneven that the probe and the test point of the chip cannot be completely abutted when the chip is placed in the test slot;

[0080] It is convenient to make the standard chip abut against the top of the probe with the longest length extending into the test slot, and adjust other probes based on this probe so that all probes can abut against the standard chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0081] Figure 1 is a schematic structural diagram of a chip testing tool according to an embodiment of the present invention;

[0082] Figure 2 It is a method flow chart of a testing method of a chip testing tool according to an embodiment of the present invention;

[0083] Figure 3 is a method flow chart of an error cause detection method according to an embodiment of the present invention;

[0084] Figure 4 is a method flow chart of a method for adjusting uneven probe heights according to an embodiment of the present invention;

[0085] Figure 5is a method flow chart of a method for detecting probe deformation according to an embodiment of the present invention;

[0086] Figure 6 is a method flow chart of a probe bending processing method according to an embodiment of the present invention;

[0087] The parts indicated by the numerical symbols in the above drawings are as follows: 1. fixture body; 2. upper cover; 3. test slot; 4. probe. DETAILED DESCRIPTION

[0088] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0089] The embodiment of the present invention provides a test method for a chip test jig. After the chip test jig is produced, errors may exist. When the chip to be tested is good, when there is a problem with the test jig, the chip to be tested may be mistakenly detected as a defective product. Therefore, this embodiment tests the test jig through the test method of the chip test jig to ensure that the test jig is complete and good.

[0090] Reference Figure 1 The chip testing tooling includes a fixture body 1 and an upper cover 2. The fixture body 1 is used to place the chip to be tested, and the upper cover 2 is used to cooperate with the fixture body 1 to press the chip to be tested. When testing the chip to be tested, the chip to be tested is first placed in the fixture body 1, and then the upper cover 2 is covered to press the chip to be tested.

[0091] A test slot 3 is provided on the fixture body 1. The test slot 3 matches the shape of the chip to be tested and is used to place the chip to be tested. A probe 4 is detachably installed in the test slot 3. The probe 4 is used to abut against the test point of the chip to be tested to transmit a signal.

[0092] Reference Figure 2 A chip testing tool testing method comprises the following steps:

[0093] Step S100: obtaining internal image information of the test tool after the upper cover 2 is opened.

[0094] The internal image information is the internal image of the test fixture, including the test slot 3 in the test fixture and the image of the probe 4 in the test slot 3. The test fixture is located on the test bench, and a camera is arranged on the top of the test bench. The camera can vertically shoot the test fixture to obtain the internal image information.

[0095] Step S101: determining the slot feature of the test slot 3 according to the internal image information and a preset slot feature library.

[0096] The slot feature library is a database obtained by machine learning. The database contains images of various slots opened for different chip products, which will not be described here.

[0097] By comparing the internal image information with the notch feature library, the notch features can be identified from the internal image information.

[0098] Step S102: determining the slot feature size and slot feature position according to the internal image information, the slot feature and the preset reference point.

[0099] The reference point is a reference position point set by a technician, which is a point set on the test bench and whose position does not change. It is used to determine the ratio of the internal image information to the actual situation, and will not be described in detail here.

[0100] The slot characteristic size refers to parameters such as the length and width of the test slot 3. The length and width of the test slot 3 need to match the chip to be tested before it can be used to test the chip.

[0101] The slot characteristic position refers to the position of the test slot 3 on the test fixture.

[0102] The ratio of the internal image information to the actual situation can be determined through the internal image information and the reference points, and then the slot feature size and slot feature position can be determined based on the internal image information and the slot feature.

[0103] Step S1021: Based on the fact that the characteristic dimension of the slot exceeds the preset installation dimension range, it is defined as dimension failure, the test is completed and a failure prompt is issued.

[0104] The installation size range refers to the slot size that can accommodate the chip for testing. The installation size range matches the chip of each model and is a standard size, so it will not be described here.

[0105] When the slot feature size exceeds the installation size range, the slot feature size may be too large or too small. If it is too small, the chip to be tested cannot be placed in the test slot 3. If it is too large, the chip may shift in the test slot 3 after being placed in the test slot 3, resulting in errors in the test results. The above situations all indicate that the size of the test slot 3 of the test fixture is unqualified, and the test fixture is a defective product. At this time, the system will issue a prompt.

[0106] Step S1022: Based on the slot feature size falling within the installation size range, the preset clamping device is controlled according to the slot feature position to place the preset standard chip into the test slot 3, and the upper cover 2 is controlled to press the standard chip according to the preset initial downward pressure to obtain the signal test result.

[0107] The clamping device is used to clamp the chip to be tested and place the chip into the test slot 3.

[0108] The standard chip is a chip that has passed the test and can be used normally, and is used to calibrate the test tooling.

[0109] The initial downward pressure is the pressure of the pressing assembly on the chip when the upper cover 2 is closed. Under this pressure, all the test points of the chip can abut against the probes 4.

[0110] The signal test result is the signal output when the chip to be tested is tested. The signal test result can be measured by a signal test device such as an oscilloscope to determine whether the signal is normal.

[0111] Step S10221: When the signal test result is consistent with the preset reference output, the test is completed.

[0112] The reference output is a standard signal output when the chip to be tested and the test fixture are both normal. The reference output can be used as a criterion for judging whether the chip is normal, and will not be elaborated here.

[0113] If the signal test result is consistent with the reference output and the chip is normal, it means that the test fixture is normal.

[0114] Step S10222: When the signal test result is inconsistent with the reference output, a failure prompt is issued, and the test tooling is inspected using a preset error cause detection method.

[0115] If the two results are inconsistent, it means that there may be an error in the test tooling. In this case, the error cause detection method is used for detection. The error cause detection method is not described in detail here and will be described in detail in subsequent embodiments.

[0116] Reference Figure 3 , the error cause detection method includes the following steps:

[0117] Step S200: determining the slot start position of the test slot 3 according to the internal image information and the slot features;

[0118] The slot start position refers to the position of the slot of the test slot 3. The slot position in the internal image information can be determined by the internal image information and the slot feature, and then the actual slot start position can be determined according to the actual ratio.

[0119] Step S201: Control a preset pressing sheet to move to the starting position of the notch and press downward to obtain the abutting pressure when the pressing sheet contacts the probe 4 .

[0120] The flattening is used to replace the chip to press down the probe 4 to measure the length of the probe 4 extending into the test slot 3.

[0121] The abutting pressure refers to the pressure when the pressure rises and falls in the test slot 3 and abuts against the probe 4. A pressure sensor is provided on the pressing sheet, and when the pressing sheet and the probe 4 are not abutted, the abutting pressure is 0.

[0122] Step S202: when the abutting pressure is not 0, determining the pressing distance of the tablet.

[0123] The pressing distance refers to the distance from the starting position of the slot to the top of the probe 4 with the longest insertion length. When the abutment pressure is not 0, it means that the tablet is just in contact with the probe 4. At this time, the descending distance of the tablet from the starting position of the slot is recorded, which is the pressing distance. There is a traction rope at the top of the tablet. By recording the elongation of the traction rope, the pressing distance of the tablet can be determined.

[0124] Step S203: determining the allowable pressing distance of the upper cover 2 according to the pressing distance and the preset test slot depth.

[0125] The depth of the test slot is a standard parameter of the test slot 3 of the test fixture and will not be described in detail here.

[0126] The allowable pressing distance refers to the distance that the upper cover 2 is allowed to press the chip to move downward. When the allowable pressing distance is exceeded, the chip abuts against the bottom of the test slot 3 and the probe 4 may be damaged.

[0127] The allowable pressing distance is based on the probe 4 with the longest insertion length. The insertion length of the probe 4 is the allowable pressing distance, and the allowable pressing distance is the difference between the test slot depth and the pressing distance.

[0128] Step S204: matching the maximum preload pressure according to the allowable downward pressing distance.

[0129] The maximum preload pressure is the maximum pressure applied by the upper cover 2 to the chip. Within this pressure range, the probe is not easily damaged. The maximum preload pressure is proportional to the allowable downward pressure distance, and the maximum preload pressure can be matched by the allowable downward pressure distance.

[0130] Step S205: Control the pressure of the upper cover 2 on the standard chip to increase from the initial downward pressure to the maximum pre-tightening pressure at a preset growth rate, and determine in real time whether the signal test result is consistent with the reference output.

[0131] The growth rate is the growth rate of the pressure applied by the upper cover 2. By continuously increasing the pressure applied by the upper cover 2 on the chip, the chip can press the probe 4 and move downward. If the reason is that the height of the probe 4 extending into the test slot 3 is inconsistent, when the chip moves downward, all the probes 4 can eventually abut against the test points of the chip, and the signal test results at this time can be consistent with the reference output. Therefore, under the continuous increase in pressure, it is synchronously determined whether the signal test results are consistent with the reference output to determine the cause of the error of the test fixture.

[0132] Step S2051: Based on the inconsistency between the signal test result and the reference output, it is defined as other fault of the probe 4, and other fault prompt is output.

[0133] If the signal test result is still inconsistent with the reference output after the initial downward pressure of the upper cover 2 is increased to the maximum pre-tightening pressure, it means that the cause of the problem in the test result is not the uneven height of the probe 4 inserted into the test slot 3, and a prompt of other faults is issued at this time.

[0134] Step S2052: Based on the signal test result being consistent with the reference output, it is defined as probe 4 height unevenness, and the detection is completed and a probe 4 error prompt is output.

[0135] If the signal test result and the reference output become consistent during the process of increasing the initial downward pressure of the upper cover 2 to the maximum preload pressure, it means that all probes 4 are now in contact with the test points of the chip to be tested, and there are probes 4 that have not been in contact with the test points before. Therefore, it can be determined that the cause of the problem in the test result of the test fixture is the uneven height of the probes 4. At this time, the system issues a prompt for the error of the probes 4. The system will also adjust the length of the probes 4 extending into the test slot 3 according to the adjustment method of the probes 4. The specific method will not be repeated here, but will be described in detail in the subsequent embodiments.

[0136] Reference Figure 4 The method for adjusting the uneven height of the probe 4 includes the following steps:

[0137] Step S300 : Controlling the clamping device to place a preset standard chip into the test slot 3 and press it down according to the characteristic position of the slot, and obtaining the contact signal between the standard chip and the probe 4 .

[0138] The abutment signal is a signal generated when the standard chip and the probe 4 abut. This signal is not necessarily a reference output. If the standard chip only abuts against a part of the probe 4, the abutment signal is inconsistent with the reference output. The abutment signal is used for comparison and reference when the probe 4 is adjusted. The abutment signal between the standard chip and the probe 4 is obtained by a signal acquisition device such as an oscilloscope.

[0139] The standard chip is placed in the test slot 3 , and when the standard chip abuts against the probe 4 and an abutment signal appears, the abutment signal is recorded.

[0140] Step S301: When a contact signal appears, the clamping device is controlled to fix the standard chip.

[0141] When the contact signal appears, it means that the standard chip is in contact with the end of the longest probe 4 extending into the test slot 3. At this time, the standard chip is fixed by the clamping device, and the other probes 4 are adjusted based on the longest probe 4 extending into the test slot 3.

[0142] Step S302: adjusting the probe 4 at the preset probe position according to the allowable downward pressing distance, and determining whether the contact signals before and after the adjustment are consistent.

[0143] The probe position is the installation position of the probe 4 set on the test fixture according to the chip, which is a standard position set manually and will not be described in detail here.

[0144] Adjust the probe 4 within the allowable downward pressure distance so that the end of the probe 4 can abut against the standard chip. Whether the probe 4 abuts against the standard chip is determined by whether the abutment signals before and after the adjustment are consistent. If the front and back signals are consistent, it means that the probe 4 has not been adjusted to the right position so that the signal has not changed. Only when the front and back signals are inconsistent, it means that the probe 4 has been adjusted.

[0145] Step S303: When the contact signals before and after the adjustment are inconsistent, continue to adjust the next probe 4 until the last probe 4 is adjusted, and then determine whether the contact signal is consistent with the reference output.

[0146] When adjusting each probe 4, it is necessary to determine the consistency of the signals before and after the adjustment. If the signals are inconsistent, the next probe 4 is adjusted. When adjusting the last probe 4, it is determined whether all probes 4 have been adjusted by judging whether the abutment signal is consistent with the reference output.

[0147] Step S304: If the contact signal is consistent with the reference output, the adjustment is completed.

[0148] If the contact signal is inconsistent with the reference output, it means that the probe 4 has not been adjusted and needs to be adjusted. When the contact signal is consistent with the reference output, it means that all probes 4 have been adjusted and all probes 4 have contacted the standard chip, so the contact signal is consistent with the reference output.

[0149] Reference Figure 5 In step S2051, the probe 4 has other faults, including deformation of the probe 4, and the deformation of the probe 4 includes bending of the probe 4 and tilting of the probe 4. At this time, the end of the deformed probe 4 cannot contact the test point of the chip, so an accurate output signal cannot be obtained. The detection method of the deformation of the probe 4 includes the following steps:

[0150] Step S400: Acquire probe image information at a preset probe position.

[0151] The probe image information refers to an image of the probe 4 captured at the probe position, and the probe image information is captured by a camera.

[0152] Step S401: determining whether the probe 4 is deformed according to the probe image information and a preset standard probe.

[0153] The standard probe refers to an image database containing the probe 4 that is not deformed when installed in the test slot 3, which is a database obtained by machine learning and will not be described in detail here.

[0154] Compare the probe image information with the intact standard probe. If the shape of the probe 4 in the probe image information is inconsistent with the standard probe, it means that the probe 4 has not been deformed, and there are other faults that cause problems in the signal test results. If the two are consistent, it means that the probe 4 has been deformed.

[0155] Step S402: If the probe 4 is deformed, determine whether the probe 4 is bent according to the probe image information and a preset straight probe.

[0156] The straight probe refers to a database containing probes 4 in a straight shape, which is a database obtained by machine learning and will not be described in detail here.

[0157] After the deformation of the probe 4 is determined, the specific deformation type of the probe 4 needs to be determined, including bending and tilting. By comparing the probe image information with the straight probe, if the two images are consistent, it means that the probe 4 is not bent, but may be tilted, otherwise it means that the probe 4 is bent.

[0158] Step S4021: Based on the bending of the probe 4, it is defined as the bending deformation of the probe 4, the detection is completed, a bending prompt of the probe 4 is output, and the probe 4 is processed with a preset probe 4 bending processing method.

[0159] When the probe 4 is detected to be bent, the system issues a probe 4 bending prompt. At this time, the bent probe 4 needs to be straightened using a probe 4 bending processing method. The probe 4 bending processing method is not described here in detail and will be described in detail in subsequent embodiments.

[0160] Step S4022: Based on the fact that the probe 4 is not bent, a preset coating device is controlled to coat the top of the probe 4 at the probe position with a fluorescent agent, and a fluorescence distribution image is acquired vertically downward.

[0161] The coating device is used to coat the fluorescent agent on the end of the probe 4 .

[0162] The fluorescence distribution image refers to the image of the distribution of the ends of all the probes 4 coated with the fluorescent agent in the test slot 3. The probes 4 coated with the fluorescent agent can emit light after absorbing light, and the ends of the emitting probes 4 are photographed vertically downward by the camera to form a fluorescence distribution image. The ends of the probes 4 in the fluorescence distribution image all exist in the form of luminous points.

[0163] Step S40221: Compare the fluorescence distribution image and the preset probe distribution image to determine the tilted and non-overlapping offset probe features and offset positions.

[0164] The probe distribution image refers to the distribution image of the ends of the probes 4 in the well-tested test fixture. The image is also obtained by photographing the ends of the probes 4 coated with fluorescent agent. The probe distribution image is a standard reference image and will not be described in detail here.

[0165] The fluorescence distribution image and the probe distribution image are compared. If the probe 4 is tilted, the luminous point will have a position deviation. The luminous point with position deviation is extracted from the fluorescence distribution image to determine the offset probe feature and offset position. The offset probe feature is the probe feature that produces the tilt. The offset position refers to the position of the luminous point with position deviation.

[0166] Step S40222: Determine the offset distance according to the offset position and the probe position.

[0167] The offset distance refers to the distance between the light point where the offset occurs and the probe position under normal circumstances. The offset distance can be determined based on the offset position and the probe position.

[0168] Step S40223: Based on the offset distance exceeding the preset measurement range, it is defined as a tilt deformation of the probe 4, the detection is completed, a tilt prompt of the probe 4 is output, and the probe 4 is processed using a probe tilt deformation processing method.

[0169] The test point of the chip is disc-shaped and has a certain range, which is the measurement range. If the contact point between the probe 4 and the test point is within the measurement range, the measurement can be effectively performed. In this case, even if the probe 4 is tilted to a certain extent, no error will occur.

[0170] The offset distance is compared with the measurement range. If the offset distance does not exceed the measurement range, the probe 4 can be defined as not deformed. If the offset distance does not exceed the measurement range, the probe 4 is defined as tilted and deformed, and the system issues a probe 4 tilt prompt.

[0171] The tilted probe 4 can be corrected to meet the requirements through a probe tilt deformation processing method. The probe tilt deformation processing method is not described in detail here and will be described in detail in subsequent embodiments.

[0172] Reference Figure 6 The method for processing the bending of the probe 4 in step S4021 includes the following steps:

[0173] Step S500: determining the probe root feature according to the probe image information, the probe position and the preset root clamping range.

[0174] In this embodiment, the probe 4 is straightened by clamping a straightening device at the root of the probe 4 and vertically moving the straightening device.

[0175] The root clamping range is the length range of the probe 4 that can be clamped by the straightening device, which is determined by the technician according to the thickness of the straightening device.

[0176] The probe root feature refers to the root position of the connection between the probe 4 and the bottom surface of the test slot 3 .

[0177] The curved probe features can be determined through the probe image information and the probe position. After the curved probe features are determined, the probe root features can be determined according to the root clamping range.

[0178] Step S501: determining whether the probe root feature is inclined according to the probe root feature and the standard probe.

[0179] The root of the standard probe is vertical and straight. The root feature of the probe is compared with the standard probe. If the root feature of the probe is consistent with the standard probe, it means that the root feature of the probe of the bent probe 4 is not tilted. If the root feature of the probe is inconsistent with the standard probe, it means that the root feature of the probe of the bent probe 4 is tilted. According to different situations of whether the root feature of the probe is tilted, the system takes different measures to straighten it.

[0180] Step S5021: Based on the fact that the probe root feature is not tilted, a preset clamping half ring is matched according to a preset probe diameter.

[0181] In this embodiment, the straightening device is two clamping half rings, and the clamping half rings are semicircular, and the combination of the two can form a complete circular ring.

[0182] Whether the clamping half ring can be used to straighten the probe 4 depends on the inner diameter of the combined ring. The inner diameter of the ring matches the probe diameter, so the required clamping half ring is matched according to the probe diameter.

[0183] Step S50211: Control the two clamping half rings to clamp at the root feature of the probe, and control the two clamping half rings to lift simultaneously with a preset lifting force to straighten the bent probe 4.

[0184] For a probe 4 that is not tilted, the two clamping half rings are clamped to the probe root feature from both sides of the probe 4. At this time, since the probe root feature is not tilted, the clamping half rings do not need to be aligned with the probe root feature. After the clamping half rings are clamped on the probe 4, the two clamping half rings are lifted synchronously by the lifting device. At this time, the clamping half rings can drive the probe 4 to straighten. The lifting force is the force set by the technician to lift the clamping half ring. When the clamping half ring is lifted with the lifting force, the probe 4 can be straightened. No further details are given here.

[0185] Step S5022: Based on the probe root feature inclination, determine the root inclination angle according to the probe image information and the probe root feature.

[0186] For probe 4 with an inclined probe root feature, since the overall width of the probe root feature is larger than the probe diameter, force needs to be applied when clamping the probe root feature through the clamping half ring. The applied force is related to the inclination of the probe root feature. The root inclination angle refers to the inclination angle of the probe root feature. The root inclination angle can be determined based on the probe image information and the probe root feature.

[0187] Step S50221: Match the corresponding clamping force according to the root inclination angle.

[0188] The clamping force is the force applied by the clamping half ring to clamp the probe root feature. The clamping force is proportional to the root inclination angle. The greater the root inclination angle, the greater the clamping force.

[0189] Step S50222: Control the two clamping half rings to clamp the probe root feature according to the clamping force to straighten the probe root feature, and then control the two clamping half rings to lift simultaneously with a preset lifting force to straighten the bent probe 4.

[0190] When the clamping half ring clamps the probe root feature, the clamping half ring applies a clamping force. At this time, the clamping half ring can first straighten the probe root feature, and then, consistent with step S50211, the two clamping half rings are synchronously lifted by the lifting device to straighten the probe 4.

[0191] The probe tilt deformation processing method in step S40223 includes the following steps:

[0192] Step S600: determining the top position of the probe 4 of the tilted and deformed probe 4 according to the fluorescence distribution image.

[0193] The top position of the probe 4 refers to the highest tip position of the probe feature. Since the top position of the probe 4 is coated with a fluorescent agent and can emit light, the top position of the probe 4 that produces the tilted deformation can be determined through the fluorescence distribution image.

[0194] Step S601: matching a preset correction ring whose inner diameter is the measurement range according to the measurement range.

[0195] In this embodiment, the straightening device is a straightening ring, the center of which is provided with an adjustment hole, which is a conical hole that decreases from bottom to top. The inclined probe 4 can be straightened by sleeve-mounting the straightening ring on the probe 4 and vertically lifting the straightening ring.

[0196] The inner diameter of the conical hole at the center of the correction ring is determined by the measuring range. It is only necessary to reduce the offset distance of the probe 4 to within the measuring range to determine that the probe 4 is not tilted. Therefore, the correction ring used to correct the probe 4 is first determined by the measuring range.

[0197] Step S602: Control the correction ring to be inserted into the top position of the probe 4 and automatically fall to the bottom.

[0198] After the correction ring is determined, the correction ring is inserted into the probe 4 from the top position of the probe 4 through the clamping device. At this time, the correction ring can freely fall along the probe 4 to the bottom surface of the test slot 3.

[0199] Step S603: Control the correction ring to lift with a preset lifting force to straighten the tilted probe 4.

[0200] When the correction ring is located at the bottom of the probe 4 , the correction ring is lifted vertically by the clamping device, and the correction ring can straighten the probe 4 .

[0201] Probe 4 has other faults, including signal interference. When an interference signal interferes with the probe position, the final test result will be erroneous. The signal interference processing method includes the following steps:

[0202] Step S700: determining whether the probe 4 is deformed according to the probe image information and a preset standard probe.

[0203] The probe image information is compared with a good standard probe. If the shape of the probe 4 in the probe image information is inconsistent with the standard probe, it means that the probe 4 has not been deformed. At this time, there is no problem with the shape of the probe 4, but there may be an interference signal interfering with the probe 4.

[0204] Step S701: If the probe 4 is not deformed, a preset signal interference device is controlled to interfere with the signal of the probe 4 in the test slot 3 according to a preset release power, and the initial signal output information is recorded.

[0205] The signal jammer is used to release the jamming signal. The preset release power is the parameter value of the signal jammer set by the technician, which will not be described in detail here.

[0206] The test fixture is interfered with by a signal interference device, and the initial signal output information is recorded under interference. The initial signal output information is the output signal of the test fixture recorded when the signal interference device is released at a preset release power.

[0207] Step S702: Control the signal interference device to increase the release power at a preset increase rate, and record the last signal output information again.

[0208] The preset increase rate is the increase speed of the released power of the signal jammer set by the technicians, which will not be elaborated here.

[0209] While increasing the release power of the signal jammer, the last signal output information is recorded again.

[0210] Step S703: When the initial signal output information is inconsistent with the final signal output information, it is defined as probe 4 signal interference, and the detection is completed and a probe 4 interference prompt is output.

[0211] When the initial signal output information is inconsistent with the final signal output information, it means that the change in the released power will affect the test output result of the test fixture, so the interference signal will affect probe 4, and the system will issue a probe 4 interference prompt.

[0212] Step S704: Determine the difference signal and the difference probe position according to the initial signal output information and the final signal output information.

[0213] The signal test result of the test fixture is composed of multiple signals and is related to the probe characteristics. Each probe 4 can test a signal on the standard chip. By comparing the initial signal output information with the final signal output information, the signal that changes in the signal test result is the difference signal, and the difference probe position can be determined based on the difference signal. The difference signal is the signal affected by the interference signal in the signal test result. The difference probe position is the position of the probe 4 in the test fixture that is affected by the interference signal.

[0214] Step S705: Obtain the width of the annular area where the probe 4 can be installed and grounded in the circumferential direction at the different probe positions.

[0215] The problem of probe 4 being affected by interference signals can be solved by grounding the probe 4 circumferentially. The width of the annular area is the width of the area for grounding, and the width of the annular area can be measured by a rangefinder at different probe positions circumferentially. The free positions at different probe positions circumferentially can all be used as the width of the annular area for grounding.

[0216] Step S7051: When the width of the annular area is greater than the preset ground pin installation width, the preset punching device is controlled to drill holes within the width of the annular area according to the preset opening depth and install the ground pin.

[0217] The ground pin installation width refers to the installation width required to solve the interference signal problem by installing a ground pin. The ground pin installation width is determined according to the ground pin specifications and is a standard value, so it will not be elaborated here.

[0218] If the width of the annular area is larger than the installation width of the ground pin, the interference signal can be shielded by installing the ground pin.

[0219] The opening depth is a reference value set by the technicians. The ground pin needs to be inserted into the hole of the opening depth to achieve grounding. I will not go into details here.

[0220] After determining the width of the annular area where the ground pin can be installed, a hole is punched circumferentially at the probe position using a punching device. The depth of the hole is the opening depth. After the hole is drilled, the ground pin is inserted into the hole to achieve shielding.

[0221] Step S7052: When the width of the annular area is not greater than the installation width of the ground pin, the probe 4 is grounded in the circumferential direction by a preset conductive silver glue injection method.

[0222] If the width of the annular area that can be used circumferentially at the probe position is not greater than the installation width of the ground pin, the interference signal cannot be shielded by installing the ground pin. At this time, the probe 4 is grounded circumferentially by injecting conductive silver glue. The conductive silver glue injection method will not be described here and will be introduced in detail in subsequent embodiments.

[0223] The conductive silver paste pouring method in step S7052 includes the following steps:

[0224] Step S800: determining the contour of the groove area according to the probe image information and the width of the annular area.

[0225] The groove area contour refers to the area contour that needs to be opened in the circumferential direction of the probe 4 to form an annular groove. The width of the groove area contour is determined according to the annular area width, so the groove area contour can be determined in the circumferential direction of the probe 4 according to the probe image information and the annular area width.

[0226] Step S801: Controlling the punching device to punch along the contour of the grooving area according to a preset opening depth to form an annular groove, and determining the volume of the groove according to the opening depth and the width of the annular area.

[0227] The annular groove is formed by intensively punching holes along the contour of the groove area. The groove volume refers to the inner cavity volume of the annular groove.

[0228] Step S802: Determine the filling amount of the conductive silver paste to be poured into the groove according to the volume of the groove.

[0229] The filling amount refers to the amount of conductive silver paste that can be filled into the annular groove when the conductive silver paste is filled into the annular groove. The filling amount of the conductive silver paste corresponds to the inner volume of the annular groove, that is, the filling amount of the conductive silver paste is equal to the inner volume of the annular groove.

[0230] Step S803: controlling the injection device to inject the conductive silver paste into the annular groove according to the filling amount, and controlling the preset flattening device to flatten the annular groove with a preset extrusion force.

[0231] After determining the filling amount of the conductive silver glue, the specified amount of conductive silver glue is injected into the annular groove by the injection device, and then the annular groove is flattened by the flattening device so that the conductive silver glue is not easy to protrude from the annular groove. The extrusion pressure is the force set by the flattening device when the annular groove is flattened, which will not be described in detail here.

[0232] Based on the same inventive concept, an embodiment of the present invention further provides a chip testing tool testing system, including:

[0233] The acquisition module is used to acquire internal image information, abutment pressure when the pressing sheet contacts the probe 4, abutment signal between the standard chip and the probe 4, probe image information, fluorescence distribution image, initial signal output information and final signal output information.

[0234] A memory is used to store a program of a test method of a chip test tool.

[0235] The program in the processor and the memory can be loaded and executed by the processor and realize a testing method of a chip testing tool.

[0236] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional modules is used as an example. In actual applications, the above-mentioned functions can be assigned to different functional modules as needed, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. The specific working process of the system, device and unit described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0237] Based on the same inventive concept, an embodiment of the present invention provides an intelligent terminal, including a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and execute a test method of a chip test tool.

[0238] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A chip testing tool testing method, characterized in that: include: Obtaining internal image information of the test fixture after the preset upper cover (2) is opened; Determining the slot features of a preset test slot (3) according to the internal image information and a preset slot feature library; Determine the slot feature size and slot feature position according to the internal image information, the slot feature and the preset reference point; Since the characteristic dimension of the slot exceeds the preset installation dimension range, it is defined as dimension failure, the test is completed and a failure prompt is issued; Based on the characteristic size of the notch falling within the installation size range, a preset clamping device is controlled according to the characteristic position of the notch to place a preset standard chip into the test slot (3), and the upper cover (2) is controlled according to the preset initial downward pressure to press the standard chip, thereby obtaining a signal test result; When the signal test result is consistent with the preset reference output, the test is completed; When the signal test result is inconsistent with the reference output, a failure prompt is issued, and the test fixture is inspected using a preset error cause detection method.

2. The chip testing tool testing method according to claim 1, characterized in that: Methods for detecting the causes of errors include: Determining a slot start position of the test slot (3) according to the internal image information and the slot features; Controlling a preset pressing sheet to move to a starting position of the notch and pressing downward, and obtaining abutment pressure when the pressing sheet contacts the probe (4); When the abutment pressure is not 0, the pressing distance of the tablet is determined; Determining the allowable downward pressing distance of the upper cover (2) according to the downward pressing distance and the preset test slot depth; Match the maximum preload pressure according to the allowable downward pressure distance; Controlling the pressure of the upper cover (2) on the standard chip to increase from the initial downward pressure to the maximum preload pressure at a preset growth rate, and judging in real time whether the signal test result is consistent with the reference output; Based on the inconsistency between the signal test result and the reference output, it is defined as probe (4) other fault, and outputs other fault prompt; Based on the signal test result being consistent with the reference output, it is defined as the probe (4) height being uneven, the detection is completed and a probe (4) error prompt is output.

3. The chip testing tool testing method according to claim 2, characterized in that: Methods for adjusting the uneven height of the probe (4) include: Controlling the clamping device according to the characteristic position of the slot to place a preset standard chip into the test slot (3) and press it downward, thereby obtaining a contact signal between the standard chip and the probe (4); When the abutment signal appears, the clamping device is controlled to fix the standard chip; Adjusting the probe (4) at a preset probe position according to the allowable downward pressure distance, and determining whether the abutment signals before and after the adjustment are consistent; When the abutment signals before and after the adjustment are inconsistent, continue to adjust the next probe (4) until the last probe (4) is adjusted, and then determine whether the abutment signal is consistent with the reference output; If the contact signal is consistent with the reference output, the adjustment is complete.

4. The chip testing tool testing method according to claim 2, characterized in that: Other faults of the probe (4) include deformation of the probe (4). Methods for detecting deformation of the probe include: Acquiring probe image information at a preset probe position; Determining whether the probe (4) is deformed according to the probe image information and a preset standard probe; If the probe (4) is deformed, determining whether the probe (4) is bent based on the probe image information and a preset straight probe; Based on the bending of the probe (4), the bending deformation of the probe (4) is defined, the detection is completed, a bending prompt of the probe (4) is output, and the probe (4) is processed using a preset probe bending processing method; Based on the fact that the probe (4) is not bent, controlling a preset coating device to coat the top of the probe (4) at the probe position, and acquiring a fluorescence distribution image vertically downward; comparing the fluorescence distribution image with a preset probe distribution image to determine tilted and non-overlapping offset probe features and offset positions; determining an offset distance according to the offset position and the probe position; Based on the offset distance exceeding the preset measurement range, it is defined as a tilt deformation of the probe (4), the detection is completed, a tilt prompt of the probe (4) is output, and the probe (4) is processed using a probe tilt deformation processing method.

5. The chip testing tool testing method according to claim 4, characterized in that: The bending of the probe (4) needs to be handled. The method for handling the bending of the probe includes: Determine the probe root feature according to the probe image information, the probe position and the preset root clamping range; Determine whether the probe root feature is inclined according to the probe root feature and the standard probe; Based on the fact that the probe root feature is not tilted, a preset clamping half ring is matched according to a preset probe diameter; Controlling the two clamping half rings to clamp at the root feature of the probe, and controlling the two clamping half rings to lift simultaneously with a preset lifting force to straighten the bent probe (4); Based on the probe root feature inclination, the root inclination angle is determined according to the probe image information and the probe root feature; Match the clamping force to the root inclination angle; The two clamping half rings are controlled to clamp the probe root feature according to the clamping force to straighten the probe root feature, and then the two clamping half rings are controlled to lift simultaneously with a preset lifting force to straighten the bent probe (4).

6. The chip testing tool testing method according to claim 4, characterized in that: It is necessary to process the tilt deformation of the probe (4), and the method for processing the tilt deformation of the probe includes: Determine the top position of the probe (4) of the tilted deformed probe (4) according to the fluorescence distribution image; According to the measuring range, a preset correction ring whose inner diameter is matched to the measuring range is provided; Control the correction ring to be inserted into the top position of the probe (4) and automatically fall to the bottom; The correction ring is lifted with a preset lifting force to straighten the tilted probe (4).

7. The chip testing tool testing method according to claim 4, characterized in that: Other faults of the probe (4) include signal interference. The methods for dealing with signal interference include: Determining whether the probe (4) is deformed according to the probe image information and a preset standard probe; If the probe (4) is not deformed, controlling a preset signal interference device to interfere with the signal of the probe (4) in the test slot (3) according to a preset release power, and recording initial signal output information; Controlling the signal interference device to increase the release power at a preset increasing rate, and recording the last signal output information again; When the initial signal output information is inconsistent with the final signal output information, it is defined as probe (4) signal interference, the detection is completed and the probe (4) interference prompt is output; Determining the difference signal and the difference probe position according to the initial signal output information and the final signal output information; Obtaining the width of the annular area where the probe (4) can be installed and grounded in the circumferential direction at different probe positions; When the width of the annular area is greater than the preset ground pin installation width, the preset punching device is controlled to drill holes within the width of the annular area and install the ground pin according to the preset opening depth; When the width of the annular area is not greater than the installation width of the grounding pin, the probe (4) is grounded in the circumferential direction using a preset conductive silver glue injection method.

8. The chip testing tool testing method according to claim 7, characterized in that: Conductive silver glue pouring methods include: Determine the contour of the groove area according to the probe image information and the width of the annular area; According to the preset opening depth, the punching device is controlled to punch along the contour of the groove area to form an annular groove, and the volume of the groove is determined according to the opening depth and the width of the annular area; Determine the amount of conductive silver paste to be poured into the groove according to the volume of the groove; The injection device is controlled to inject the conductive silver glue into the annular groove according to the filling amount, and the preset flattening device is controlled to flatten the annular groove with a preset extrusion force.

9. A chip testing tool testing system, characterized in that: include: An acquisition module, used to acquire internal image information, abutment pressure when the pressing sheet contacts the probe (4), abutment signals between the standard chip and the probe (4), probe image information, fluorescence distribution image, initial signal output information, and final signal output information; A memory, used to store a program of a test method of a chip test tool according to any one of claims 1 to 8; The program in the processor and the memory can be loaded and executed by the processor and realize a testing method of a chip testing tool.

10. An intelligent terminal, characterized in that: The device comprises a memory and a processor, wherein the memory stores a computer program which can be loaded by the processor and executes a testing method of a chip testing tool as claimed in any one of claims 1 to 8.

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