Electronic paper assembly laminator
By integrating AG, OCA, and LB bonding mechanisms and combining them with multi-process detection, the electronic paper processing has been automated, solving the problem of low automation in existing equipment and improving production efficiency and bonding quality.
Patent Information
- Application Number
- CN202411716407.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-27
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2044-11-27
AI Technical Summary
Existing electronic paper processing equipment has a low degree of automation, requiring manual intervention in multiple process steps, which affects production efficiency.
Design an electronic paper assembly and lamination machine that integrates AG lamination mechanism, OCA lamination mechanism and LB lamination mechanism, and combines multi-piece detection, error-proof detection, image positioning and AOI detection to realize the automated integration of multiple process flows.
This technology automates multiple processes in the electronic paper manufacturing process, improving production efficiency, reducing manual intervention, and enhancing bonding quality and precision.
Smart Images

Figure CN119472094B_ABST
Abstract
Description
[0001] The present application relates to the technical field of automation equipment, in particular to an electronic paper assembly laminating machine.
[0002] The prior art electronic paper processing equipment can only perform automatic operation on one or two process links of the electronic paper processing procedure, and needs manual intervention, which is not conducive to efficient production.
[0003] In order to overcome the above problems, the present application provides an electronic paper assembly laminating machine which can effectively solve the above problems.
[0004] The present application provides an electronic paper assembly laminating machine, which includes an AG laminating mechanism, an OCA laminating mechanism, an LB laminating mechanism and a BT laminating mechanism, the AG laminating mechanism, the OCA laminating mechanism, the LB laminating mechanism and the BT laminating mechanism are sequentially arranged, the AG laminating mechanism is used for laminating AG on one side of LGP, the OCA laminating mechanism is used for laminating OCA on the other side of LGP, the LB laminating mechanism is used for laminating LB, and the BT laminating mechanism is used for laminating BT.
[0005] Preferably, the AG laminating mechanism includes an LGP feeding bin, the LGP feeding bin stores LGP, an LGP suction assembly is arranged above the LGP feeding bin, the LGP suction assembly is used for sucking LGP from the LGP feeding bin and shaking, a multiple piece detection assembly is arranged on the side of the LGP suction assembly, the multiple piece detection assembly is used for detecting whether the LGP sucked by the LGP suction assembly has multiple pieces, and a foolproof detection assembly is arranged below the middle of the LGP suction assembly and the multiple piece detection assembly, the foolproof detection assembly is used for detecting whether the LGP is placed reversely.
[0006] Preferably, one side of the multiple piece detection assembly is provided with a correction platform, the LGP that passes the foolproof detection is placed on the correction platform for position correction, one side of the correction platform is provided with a cleaning roller, one side of the correction platform is provided with a carrying arm above, and the carrying arm is used for sucking the corrected LGP and moving above the cleaning roller to clean the lower surface of the LGP.
[0007] Preferably, a side below the carrying arm is provided with an upper and lower feeding platform, and the LGP with a clean lower surface is placed on the upper and lower feeding platform; a side above the upper and lower feeding platform is provided with two LGP upper laminating arms, each of which is arranged on a moving module and can move independently, and the LGP upper laminating arms are used to suck the LGP from the upper and lower feeding platform; a side of the LGP upper laminating arm is provided with an LGP lower film tearing assembly, and the LGP lower film tearing assembly is used to tear the film from the LGP.
[0008] Preferably, a Plasma cleaning assembly and an air knife assembly are arranged between the two LGP upper laminating arms, and the Plasma cleaning assembly and the air knife assembly are used to clean the lower surface of the LGP; two image positioning assemblies are arranged between the two LGP upper laminating arms, and the two image positioning assemblies are arranged on a linear module, and the two image positioning assemblies are used to take a photo of the lower surface of the LGP for image positioning.
[0009] Preferably, the AG laminating mechanism comprises an AG feeding bin, and the AG feeding bin stores AG film materials; an AG suction assembly is arranged above the AG feeding bin, and the AG suction assembly is used to suck the AG from the AG feeding bin and shake it; a correction platform is arranged on one side of the AG feeding bin, and a multi-piece detection assembly is arranged on one side of the correction platform; the AG suction assembly sucks the AG and carries it to the multi-piece detection assembly for detection, and the AG that is not stacked is placed on the correction platform for correction; a carrying arm is arranged above the correction platform, the carrying arm sucks the corrected AG from the correction platform and moves to a cleaning assembly for lower surface cleaning; a tear-off carrier film assembly is arranged on one side of the carrying arm, and the tear-off carrier film assembly is used to tear off the lower carrier film of the AG.
[0010] Preferably, an AG image pre-positioning assembly is arranged below a side of the tear-off carrier film assembly, and the AG with the torn-off lower carrier film is carried by the carrying arm to above the AG image pre-positioning assembly for photo image positioning; an AG lower laminating platform is arranged on one side of the AG image pre-positioning assembly, and an AG laminating roller is arranged at one end of the AG lower laminating platform, and the AG image pre-positioning assembly is used to ensure that one edge of the AG is parallel to the AG laminating roller.
[0011] Preferably, a rotating shaft is arranged at one end of the AG lower laminating platform, an inclined air cylinder is connected below the AG lower laminating platform, the inclined air cylinder is used to pull the AG lower laminating platform downward, so that the AG lower laminating platform is inclined at an angle around the rotating shaft, and a lifting assembly is connected to the AG laminating roller, after the AG lower laminating platform is inclined at an angle around the rotating shaft, the AG laminating roller is lifted to lift one edge of the AG, and the relative movement of the AG and the LGP is completed to roll and laminate.
[0012] Preferably, the LB bonding mechanism includes an LB loading bin containing LBs; an LB suction arm is positioned above the LB loading bin, and the LB suction arm is equipped with an LB suction and positioning camera component. The LB suction and positioning camera component first takes a picture of the LB in the LB loading bin for positioning, and then the LB suction arm picks up the LB; an LB pre-alignment image component is positioned below the moving path of the LB suction arm. After the LB suction arm picks up the LB, it passes above the LB pre-alignment image component, where the LB pre-alignment image component pre-aligns the LB; an LB lower bonding platform is positioned to the side and below the LB suction arm, and the pre-aligned LB is placed on the LB lower bonding platform. An LB secondary alignment image component is positioned above the moving path of the LB lower bonding platform. This is used for secondary alignment of the LB; the LB bonding mechanism includes an upper LB bonding arm, which is used to pick up the product that has been bonded from the OCA bonding mechanism; a product alignment imaging component is provided below the moving path of the upper LB bonding arm, which is used to align the product picked up by the upper LB bonding arm before bonding; the LB and product that have completed the pre-bonding alignment move to corresponding upper and lower positions for bonding, and the bonded product remains on the lower LB bonding platform; a post-bonding transport arm is provided above one side of the lower LB bonding platform, and a re-rolling roller is provided below one side of the post-bonding transport arm. The post-bonding transport arm picks up the bonded product from the lower LB bonding platform and moves it above the re-rolling roller, and the re-rolling roller moves to re-roll the bonded LB.
[0013] Preferably, the BT bonding mechanism includes a BT roll feeding assembly, one end of which is provided with a ceramic platform; a BT suction arm is provided above the ceramic platform, and a BT alignment imaging assembly is provided below one side of the BT suction arm; the BT suction arm picks up the BT from the ceramic platform and moves it above the BT alignment imaging assembly for alignment; the BT bonding mechanism includes a four-station turntable and a loading / unloading transport arm, which picks up the LB-bonded product and transports it to the four-station turntable; an LB bonding precision assembly is provided above the four-station turntable. The AOI inspection component includes a four-station turntable that rotates clockwise to move the product below the LB bonding accuracy AOI inspection component for accuracy inspection. Above the four-station turntable is a BT bonding lower alignment image component. The four-station turntable rotates clockwise to move the product below the BT bonding lower alignment image component for bonding lower alignment. After alignment, the product and BT are moved to their corresponding upper and lower positions for bonding. Above the four-station turntable is a BT re-rolling component. After BT bonding, the four-station turntable rotates clockwise to move the product below the BT re-rolling component for BT bonding re-rolling.
[0014] Compared with existing technologies, the electronic paper assembly and bonding machine of the present invention integrates multiple processes of electronic paper manufacturing through a clever combination method, making full use of the spatial layout to complete electronic paper assembly; the layout can efficiently match the action rhythm to complete the bonding process; it integrates various bonding and AOI detection, fully realizing the needs of automated production, with a high degree of automation, saving labor, and facilitating modern and efficient production. [Attached Image Description]
[0015] Figure 1 This is a top view of the overall structure of the electronic paper assembly and bonding machine of the present invention;
[0016] Figure 2 for Figure 1 Enlarged view of point A in the middle;
[0017] Figure 3 for Figure 1 Enlarged view at point B in the middle;
[0018] Figure 4 This is a perspective view of the electronic paper assembly and bonding machine of the present invention;
[0019] Figure 5 for Figure 4 Enlarged view at point C;
[0020] Figure 6 This is a first perspective view of the LGP suction assembly of the electronic paper assembly and bonding machine of the present invention;
[0021] Figure 7 This is a second perspective view of the LGP suction assembly of the electronic paper assembly and bonding machine of the present invention;
[0022] Figure 8 for Figure 6 Enlarged view at point D;
[0023] Figure 9 for Figure 7 Enlarged view at point E in the middle;
[0024] Figure 10 This is a schematic diagram showing the distribution of the first, second, third, and fourth cylinders of the LGP suction assembly of the electronic paper assembly and laminating machine of the present invention.
[0025] Figure 11 This is a first perspective view of the NG material ejection production line of the electronic paper assembly and lamination machine of the present invention;
[0026] Figure 12 This is a second perspective view of the NG material ejection production line of the electronic paper assembly and lamination machine of the present invention;
[0027] Figure 13 for Figure 11 Enlarged view of point F in the middle.
Detailed Implementation Methods
[0028] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the invention.
[0029] It should be noted that in the embodiments of the present invention, all directional indications (such as up, down, left, right, front, back, etc.) are limited to relative positions on the specified view, rather than absolute positions.
[0030] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0031] Please see Figures 1 to 13 The electronic paper assembly and laminating machine of the present invention includes an AG laminating mechanism 100, an OCA laminating mechanism 200, an LB laminating mechanism 300, and a BT laminating mechanism 400. The AG laminating mechanism 100, the OCA laminating mechanism 200, the LB laminating mechanism 300, and the BT laminating mechanism 400 are arranged sequentially. The AG laminating mechanism 100 is used to laminate AG on one side of the LGP, the OCA laminating mechanism 200 is used to laminate OCA on the other side of the LGP, the LB laminating mechanism 300 is used to laminate LB on the LGP, and the BT laminating mechanism 400 is used to laminate BT on the LGP.
[0032] LGP is the light guide plate in electronic paper technology, AG is the light-transmitting film material, OCA is the OCA adhesive, LB is the LED light strip, and BT is the light-shielding adhesive.
[0033] The AG bonding mechanism 100 includes an LGP feeding bin 101, which stores LGP. An LGP suction component 102 is provided above the LGP feeding bin 101. The LGP suction component 102 is used to suction LGP from the LGP feeding bin 101 and shake it to prevent stacking.
[0034] The LGP suction assembly 102 is provided with multiple detection assemblies 104 on its side. The multiple detection assemblies 104 are used to detect whether there are multiple LGPs sucked up by the LGP suction assembly 102, so as to further ensure that there is no stacking of LGPs.
[0035] A foolproof detection component 103 is disposed below and between the LGP suction component 102 and the multi-piece detection component 104. The foolproof detection component 103 is used to detect whether the LGP is placed upside down. The LGP has characters on it, and the side with the detected characters is the correct placement side.
[0036] A throwing box is provided on one side of the LGP suction component 102. If the defective products are detected by the foolproof detection component 103, they are placed into the throwing box, while the qualified products are subjected to multi-piece detection.
[0037] A calibration platform 105 is provided on one side of the multi-piece detection assembly 104. The LGP that has passed the foolproof test is placed on the calibration platform 105 for position calibration.
[0038] A cleaning roller is provided on one side of the calibration platform 105, and a transport arm 106 is provided above one side of the calibration platform 105. The transport arm 106 is used to pick up the calibrated LGP and move it above the cleaning roller to clean the lower surface of the LGP.
[0039] A loading and unloading platform is provided on the lower side of the handling arm 106. The loading and unloading platform is mounted on the moving module and is movable. The LGP with its lower surface cleaned is placed on the loading and unloading platform.
[0040] Two LGP mounting arms 107 are installed above the loading and unloading platform. Each LGP mounting arm 107 is mounted on a moving module and can move independently. The LGP mounting arm 107 is used to pick up LGPs from the loading and unloading platform. Setting up two LGP mounting arms 107 can adapt to the overall cycle time of the equipment; whichever arm is idle will pick up materials from the loading and unloading platform.
[0041] An LGP peel-off film assembly 108 is provided on one side of the LGP upper bonding arm 107. The LGP peel-off film assembly 108 is used to remove the easy-tear sticker from the LGP and peel off the film.
[0042] A Plasma cleaning assembly 109 and an air knife assembly 110 are disposed between the two LGP upper fitting arms 107. The Plasma cleaning assembly 109 and the air knife assembly 110 are used to clean the lower surface of the LGP.
[0043] Two image positioning components 111 are disposed between the two LGP upper fitting arms 107. The two image positioning components 111 are disposed on the linear module and are used to take pictures of the lower surface of the LGP for image positioning.
[0044] The AG bonding mechanism 100 includes an AG feeding bin 112, which stores AG film material.
[0045] An AG suction component 113 is provided above the AG feeding bin 112. The AG suction component 113 is used to suck up AG from the AG feeding bin 112 and shake it to prevent stacking.
[0046] A calibration platform 105 is provided on one side of the AG feeding hopper 112, and multiple detection components 104 are provided on one side of the calibration platform 105. The AG suction component 113 picks up AG and transports it to the multiple detection components 104 for detection. If the AG is not stacked, it is placed on the calibration platform 105 for calibration. The AG feeding process is similar to the LGP feeding process.
[0047] A transfer arm 106 is provided above the calibration platform 105. The transfer arm 106 picks up the calibrated AG from the calibration platform 105 and moves it to the cleaning component for cleaning the lower surface.
[0048] A carrier film removal assembly 114 is provided on one side of the handling arm 106, which is used to remove the lower carrier film of the AG.
[0049] An AG image pre-positioning component 115 is provided on the lower side of the peeling carrier film assembly 114. After the AG is peeled off, it is carried by the transport arm 106 to the AG image pre-positioning component 115 for image positioning and to further ensure the bonding accuracy.
[0050] The AG image pre-positioning component 115 is provided with an AG lower bonding platform 116 on one side, and an AG bonding roller 118 is provided at one end of the AG lower bonding platform 116. The AG image pre-positioning component 115 is used to ensure that one side of the AG is parallel to the AG bonding roller 118, so as to avoid air bubbles during bonding and improve bonding quality.
[0051] The AG lower bonding platform 116 is equipped with an AG upper cleaning roller and an AG protective film removal assembly on its moving path. The AG upper cleaning roller is used to clean the upper surface of the AG, and the AG protective film removal assembly is used to remove the protective film from the upper surface of the AG.
[0052] An AG bonding image alignment component 117 is provided on the moving line of the AG bonding platform 116. The AG bonding image alignment component 117 is used to take pictures of the AG before bonding for alignment.
[0053] Once the AG and LGP are properly aligned, move them to their corresponding upper and lower positions for bonding.
[0054] One end of the AG lower bonding platform 116 is equipped with a rotating shaft 119. A tilting cylinder is connected to the lower part of the AG lower bonding platform 116. The tilting cylinder is used to pull the AG lower bonding platform 116 downward, so that the AG lower bonding platform 116 tilts at an angle around the rotating shaft 119. The AG bonding roller 118 is connected to a lifting component. After the AG lower bonding platform 116 tilts at an angle around the rotating shaft 119, the AG bonding roller 118 rises, lifting one side of the AG. The AG and LGP move relative to each other to complete the rolling bonding, which helps to reduce bonding air bubbles and improve bonding quality. After the AG and LGP are bonded, they remain on the bonding arm 107 on the LGP and are transferred to the loading and unloading platform.
[0055] An AOI detection component 120 for AG and LGP bonding accuracy is installed above one end of the loading and unloading platform to detect the bonding accuracy of AG and LGP.
[0056] A flipping component 121 is provided on one side of the AG and LGP bonding accuracy AOI detection component 120. The flipping component 121 is used to pick up the LGP that has completed AG bonding from the loading and unloading platform and flip it to the OCA bonding mechanism 200.
[0057] The OCA bonding mechanism 200 includes an OCA feeding hopper 201, which stores OCA adhesive. The composition of the OCA bonding mechanism 200 is similar to that of the AG bonding mechanism 100, and the OCA feeding process is similar to the AG feeding process; therefore, it will not be described in detail here. The OCA bonding mechanism 200 does not require Plasma cleaning, thus saving time; therefore, only one LGP bonding arm is needed to meet the equipment cycle time.
[0058] The OCA bonding mechanism 200 includes an AOI detection component 202 for detecting the bonding accuracy of OCA and LGP.
[0059] The OCA bonding mechanism 200 includes a flipping arm, which is located at the end of the OCA bonding mechanism 200 and can be used in scenarios where flipping is required.
[0060] The side of the flipping arm is provided with an NG throwing production line 204 for buffering NG products for AOI precision detection.
[0061] The LB bonding mechanism 300 includes an LB feeding bin 301, which stores LBs.
[0062] An LB suction arm 302 is provided above the LB loading bin 301. The LB suction arm 302 is equipped with an LB suction photography and positioning component 303. The LB suction photography and positioning component 303 first takes a picture of the LB in the LB loading bin 301 and positions it, and then the LB suction arm 302 picks up the LB.
[0063] Below the moving path of the LB suction arm 302 is an LB pre-alignment image component 304. After the LB suction arm 302 picks up the LB, it passes above the LB pre-alignment image component 304, and the LB pre-alignment image component 304 pre-aligns the LB.
[0064] The LB suction arm 302 is provided with an LB lower bonding platform 305 on its side and below. The LB, which has been pre-aligned, is placed on the LB lower bonding platform 305. The LB secondary alignment image component is provided above the moving line of the LB lower bonding platform 305 to perform secondary alignment of the LB and ensure bonding accuracy.
[0065] The LB bonding mechanism 300 includes an LB upper bonding arm 306, which is used to pick up the product that has been bonded from the OCA bonding mechanism 200.
[0066] A product alignment imaging component 307 is provided below the moving line of the LB upper bonding arm 306. The product alignment imaging component 307 is used to align the product picked up by the LB upper bonding arm 306 before bonding.
[0067] Before bonding, the LB and product, which were aligned before bonding, are moved to their corresponding upper and lower positions for bonding. The bonded product remains on the bonding platform 305 under the LB.
[0068] A post-bonding transport arm 308 is provided above one side of the LB lower bonding platform 305, and a re-rolling roller 309 is provided below one side of the post-bonding transport arm 308. The post-bonding transport arm 308 picks up the bonded product from the LB lower bonding platform 305 and moves it above the re-rolling roller 309. The re-rolling roller 309 moves to re-roll the bonded LB to improve the bonding quality and make the bonding more stable.
[0069] A transfer platform 310 is provided below one side of the bonding and handling arm 308, and the re-rolled products are transferred to the transfer platform 310.
[0070] The BT bonding mechanism 400 includes a BT roll feeding assembly 401, one end of which is provided with a ceramic platform to prevent sticking during BT material unloading.
[0071] A BT suction arm 402 is provided above the ceramic platform, and a BT alignment image component 403 is provided below one side of the BT suction arm 402. The BT suction arm 402 picks up BTs from the ceramic platform and moves them above the BT alignment image component 403 for alignment.
[0072] The BT bonding mechanism 400 includes a four-station turntable 405 and a loading / unloading transport arm 404. The loading / unloading transport arm 404 picks up the LB-bonded product from the transfer platform 310 and transports it to the four-station turntable 405.
[0073] An LB bonding accuracy AOI detection component 406 is provided above the four-station turntable 405. The four-station turntable 405 rotates clockwise to move the product to the underside of the LB bonding accuracy AOI detection component 406 for accuracy detection.
[0074] A BT bonding lower alignment image component 407 is provided above the four-station turntable 405. The four-station turntable 405 rotates clockwise to move the product to the underside of the BT bonding lower alignment image component 407 for bonding and lower alignment.
[0075] After the product and BT are aligned, they are moved to the corresponding upper and lower positions and then bonded together.
[0076] A BT re-rolling assembly 408 is provided above the four-station turntable 405. After BT bonding, the four-station turntable 405 rotates clockwise to move the product under the BT re-rolling assembly 408 for BT bonding re-rolling, so as to improve the bonding quality and make the bonding more stable.
[0077] The BT bonding mechanism 400 includes a Y-axis platform 410, and the loading and unloading conveying arm 404 picks up the product after BT rerolling and transports it to the Y-axis platform 410.
[0078] A BT bonding accuracy detection component 411 is provided above the moving path of the Y-axis platform 410 for detecting BT bonding accuracy.
[0079] A BT film-removing assembly 412 is provided above the moving line of the Y-axis platform 410. The BT film-removing assembly 412 includes a film-removing clip for tearing off the BT protective film.
[0080] A BT bonding finished product flipping component 413 is provided above the moving path of the Y-axis platform 410 for use in scenarios where flipping is required for unloading.
[0081] An NG (Not From Good) discharge line 204 is provided on one side of the Y-axis platform 410 to buffer NG products for AOI (Automated Inspection) precision detection.
[0082] A finished product unloading assembly 500 is provided on one side of the BT bonding mechanism 400 for unloading finished products.
[0083] The LGP suction assembly 102 is used for feeding the membrane material and includes a support frame 10. The support frame 10 is provided with a horizontal material feeding X-axis 20. A vertical material feeding Z-axis 30 is connected to the material feeding X-axis 20. A lifting frame 40 is connected to the material feeding Z-axis 30. The lifting frame 40 can move up and down along the material feeding Z-axis 30.
[0084] A horizontal mounting plate 50 is connected to the lifting frame 40. A cylinder assembly 60 is connected to the mounting plate 50. A suction cup 70 is connected to the cylinder assembly 60. The suction cup 70 is used to adsorb the film material. The suction cup 70 and the cylinder shaft of the cylinder assembly 60 form a vibrating suction rod.
[0085] The cylinder assembly 60 includes a first cylinder 61, a second cylinder 62, a third cylinder 63, and a fourth cylinder 64. The first cylinder 61, the second cylinder 62, the third cylinder 63, and the fourth cylinder 64 are located at the same height and are all vertically arranged. The first cylinder 61 and the second cylinder 62 are located in the same row, and the third cylinder 63 and the fourth cylinder 64 are located in the same row. The cylinder axis connection line a of the first cylinder 61 and the second cylinder 62 intersects the cylinder axis connection line b of the third cylinder 63 and the fourth cylinder 64.
[0086] The first cylinder 61 and the fourth cylinder 64 are connected to the first solenoid valve, and the second cylinder 62 and the third cylinder 63 are connected to the second solenoid valve. The first cylinder 61 and the fourth cylinder 64 form the first cylinder group, and the second cylinder 62 and the third cylinder 63 form the second cylinder group. The cylinder shafts of the first cylinder group and the second cylinder group move in opposite directions.
[0087] The cylinder shafts of the first cylinder 61, the second cylinder 62, the third cylinder 63 and the fourth cylinder 64 are all connected to suction cups 70. In the initial state of the cylinder, the bottom of the suction cups 70 is located on the same plane.
[0088] The LGP suction assembly of the present invention uses the cylinder shafts of the first cylinder group and the second cylinder group to move in opposite directions. After adsorbing the membrane material, it will generate a shaking effect on the membrane material, causing the stacked membrane material to detach, ensuring that only one layer of membrane material is adsorbed at a time. This helps to ensure the normal operation of subsequent processing and maintain a high overall production efficiency.
[0089] A film pressing cylinder 80 is also connected to the mounting plate 50. The film pressing cylinder 80 is connected to a film pressing plate 90. The film pressing cylinder 80 drives the film pressing plate 90 to rise and fall, so as to flatten the film.
[0090] The lifting frame 40 includes a first connecting plate 41, which is connected to the material picking Z-axis 30. A second connecting plate 42 is vertically connected to the bottom of the first connecting plate 41, and a third connecting plate 43 is vertically connected to both sides of the second connecting plate 42. The mounting plate 50 is fixedly connected to the third connecting plate 43.
[0091] Linear bearings 92 are provided at the four corners of the mounting plate 50. Guide rods 91 are threaded through the linear bearings 92. The ends of the guide rods 91 are connected to the membrane pressing plate 90, which facilitates the stable lifting and lowering of the membrane pressing plate 90.
[0092] The mounting plate 50 has a flat mounting groove 51. The first cylinder 61 and the second cylinder 62 are both mounted on the flat mounting groove 51, and their mounting positions can be adjusted within the flat mounting groove 51 to accommodate the adsorption of membrane materials of different sizes.
[0093] The mounting plate 50 has two inclined mounting slots 52. The third cylinder 63 and the fourth cylinder 64 are respectively mounted on one of the inclined mounting slots 52, and the mounting positions can be adjusted within the inclined mounting slots 52 to accommodate the adsorption of membrane materials of different sizes.
[0094] The material handling X-axis 20 includes a servo motor and a moving module, and the material handling Z-axis 30 includes a servo motor and a moving module.
[0095] The LGP suction assembly 102 of the present invention uses the cylinder shafts of the first cylinder group and the second cylinder group to move in opposite directions. After adsorbing the membrane material, it will generate a shaking effect on the membrane material, causing the stacked membrane material to detach, ensuring that only one layer of membrane material is adsorbed at a time, which is conducive to ensuring the normal operation of subsequent processing and maintaining a high overall production efficiency.
[0096] The NG material handling production line 204 includes an isolated material handling port 210, which protrudes from the equipment housing for safe material handling by personnel.
[0097] A safety isolation cover 230 is provided at the isolation material inlet 210. The safety isolation cover 230 isolates the isolation material inlet 210 from the internal structure of the equipment to ensure that the internal structure of the equipment will not be touched when the material is being picked up, thus ensuring the safety of the material picking.
[0098] The bottom of the safety isolation cover 230 has a product channel 232, which connects the isolation material inlet 210 to the inside of the equipment. The size of the product channel 232 matches the size of the product and is only for the product to pass through and flow to the isolation material inlet 210.
[0099] The safety isolation cover 230 has an inclined surface 231 on its inner side. The inclined surface 231 helps to reduce the space occupied inside the equipment and prevents interference with the internal structure of the equipment.
[0100] The NG material throwing production line 204 also includes a conveyor belt 250, and the safety isolation cover 230 is disposed above one end of the conveyor belt 250.
[0101] The front end of the conveyor belt 250 is connected to a front support plate 272, and the rear end of the conveyor belt 250 is connected to a rear support plate 273. A row of front baffles 270 is provided on the front support plate 272, and a row of rear baffles 271 is provided on the rear support plate 273. Both the front baffles 270 and the rear baffles 271 are used to prevent products from falling off the conveyor belt 250.
[0102] A detection gap 252 is provided between the front support plate 272 and the transmission belt 250, and between the rear support plate 273 and the transmission belt 250. A detection optical fiber is provided below the detection gap 252. The detection optical fiber is used to sense whether a product flows to the positions of the front stop 270 and the rear stop 271.
[0103] The bottom of the transmission belt 250 is connected to a sensing bracket 253. The sensing bracket 253 is provided with an optical fiber mounting hole. The optical fiber mounting hole is located directly below the detection gap 252. The detection optical fiber is fixed to the optical fiber mounting hole and is set upward.
[0104] The conveyor belt 250 is provided with a number of product buffer positions 251, which are located inside the safety isolation cover 230 and are used to buffer products.
[0105] A manual removal button 220 is provided on the front side of the safety isolation cover 230. The manual removal button 220 protrudes from the equipment shell and is connected to the controller of the equipment 100 via the conveyor belt 250. When the manual removal button 220 is pressed, the product flows from the product channel 232 to the isolation material removal port 210, where the staff can remove it.
[0106] The transmission belt 250 includes a drive motor 260 and a belt speed regulator 240. The drive motor 260 is used to provide power to the transmission belt 250, and the belt speed regulator 240 is used to adjust the transmission speed.
[0107] The drive motor 260 is a reversible speed-regulating motor.
[0108] During operation, the product is thrown by the robotic arm onto the product buffer position 251 closest to the safety isolation cover 230. The conveyor belt 250 transports the product towards the rear stop 271 until the product is detected by the detection fiber optic cable at one end of the rear stop 271. The equipment alarms to indicate that the buffer is full, requiring manual unloading. The operator presses the manual removal button 220, and the conveyor belt 250 transports the product in the opposite direction to the isolation unloading port 210. After the detection fiber optic cable on the side of the front stop 270 detects the product, the operator removes it.
[0109] The NG material handling production line 204 of the present invention can effectively avoid the safety risks of manual material handling by setting a safety isolation cover 230 at the isolation material handling port 210, reduce safety hazards, and facilitate safe production.
[0110] Compared with existing technologies, the electronic paper assembly and bonding machine of the present invention integrates multiple processes of electronic paper manufacturing through a clever combination method, making full use of the spatial layout to complete electronic paper assembly; the layout can efficiently match the action rhythm to complete the bonding process; it integrates various bonding and AOI detection, fully realizing the needs of automated production, with a high degree of automation, saving labor, and facilitating modern and efficient production.
[0111] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any modifications, equivalent substitutions and improvements made within the concept of the present invention should be included within the patent protection scope of the present invention.
Claims
1. An electronic paper assembly and lamination machine, characterized in that, It includes an AG bonding mechanism, an OCA bonding mechanism, an LB bonding mechanism, and a BT bonding mechanism, which are arranged sequentially. The AG bonding mechanism is used to bond AG on one side of the LGP, the OCA bonding mechanism is used to bond OCA on the other side of the LGP, the LB bonding mechanism is used to bond LB, and the BT bonding mechanism is used to bond BT. The AG bonding mechanism includes an LGP feeding hopper containing LGP. An LGP suction component is positioned above the LGP feeding hopper, used to suction LGP from the hopper and shake it. Multiple-piece detection components are positioned to the side of the LGP suction component to detect whether multiple LGP pieces are present in the LGP suction component. A foolproof detection component is positioned below and between the LGP suction component and the multiple-piece detection component to detect whether the LGP is placed upside down. The AG bonding mechanism includes an AG feeding bin, which stores AG film material. An AG suction assembly is installed above the AG feeding hopper, which is used to pick up AGs from the AG feeding hopper and shake them. A calibration platform is installed on one side of the AG feeding hopper, and multiple detection components are installed on one side of the calibration platform. The AG suction assembly picks up AGs and transports them to the multiple detection components for detection. If the AGs are not stacked, they are placed on the calibration platform for calibration. A transport arm is installed above the calibration platform. The transport arm picks up the calibrated AGs from the calibration platform and moves them to a cleaning component for cleaning the lower surface. A carrier film removal assembly is installed on one side of the transport arm, which is used to remove the lower carrier film of the AGs. The LB bonding mechanism includes an LB loading bin containing LBs; an LB suction arm is positioned above the LB loading bin, and the LB suction arm is equipped with an LB suction and positioning camera component. The LB suction and positioning camera component first takes a picture of the LB in the LB loading bin for positioning, and then the LB suction arm picks up the LB; an LB pre-alignment image component is positioned below the moving path of the LB suction arm. After the LB suction arm picks up the LB, it passes above the LB pre-alignment image component, which pre-aligns the LB; an LB lower bonding platform is positioned to the side and below the LB suction arm, and the pre-aligned LB is placed on the LB lower bonding platform. An LB secondary alignment image component is positioned above the moving path of the LB lower bonding platform. The LB is used for secondary alignment; the LB bonding mechanism includes an upper LB bonding arm, which is used to pick up the product that has been bonded from the OCA bonding mechanism; a product alignment imaging component is provided below the moving path of the upper LB bonding arm, which is used to align the product picked up by the upper LB bonding arm before bonding; the LB and product that have completed the pre-bonding alignment move to the corresponding upper and lower positions for bonding, and the bonded product remains on the lower LB bonding platform; a post-bonding transport arm is provided above one side of the lower LB bonding platform, and a re-rolling roller is provided below one side of the post-bonding transport arm. The post-bonding transport arm picks up the bonded product from the lower LB bonding platform and moves it above the re-rolling roller, and the re-rolling roller moves to re-roll the bonded LB; The BT bonding mechanism includes a BT roll feeding assembly, one end of which is equipped with a ceramic platform. A BT suction arm is positioned above the ceramic platform, and a BT alignment imaging assembly is located below one side of the BT suction arm. The BT suction arm picks up the BT from the ceramic platform and moves it above the BT alignment imaging assembly for alignment. The BT bonding mechanism also includes a four-station turntable and a loading / unloading transport arm. The loading / unloading transport arm picks up the LB-bonded products and transports them to the four-station turntable. An LB bonding accuracy A is positioned above the four-station turntable. The OI (Optical Inspection) component includes a four-station turntable that rotates clockwise to move the product below the LB (Body-Laying) bonding accuracy AOI component for precision inspection. Above the four-station turntable is a BT (Body-Laying) lower alignment image component. The four-station turntable rotates clockwise to move the product below the BT lower alignment image component for bonding alignment. After alignment, the product and BT are moved to their corresponding upper and lower positions for bonding. Above the four-station turntable is a BT re-rolling component. After BT bonding, the four-station turntable rotates clockwise to move the product below the BT re-rolling component for BT bonding re-rolling.
2. The electronic paper assembly and bonding machine as described in claim 1, characterized in that, A calibration platform is provided on one side of the multi-piece detection assembly. The LGP that passes the mistaken-proof test is placed on the calibration platform for position calibration. A cleaning roller is provided on one side of the calibration platform, and a transport arm is provided above one side of the calibration platform. The transport arm is used to pick up the calibrated LGP and move it above the cleaning roller to clean the lower surface of the LGP.
3. The electronic paper assembly and bonding machine as described in claim 2, characterized in that, A loading and unloading platform is provided on the lower side of the handling arm, on which the LGP with a cleaned lower surface is placed. Two LGP bonding arms are provided above the loading and unloading platform. Each LGP bonding arm is set on a moving module and can move independently. The LGP bonding arms are used to pick up LGP from the loading and unloading platform. An LGP peel-off film assembly is provided on one side of the LGP bonding arm. The LGP peel-off film assembly is used to peel off the film from the LGP using the easy-tear label.
4. The electronic paper assembly and bonding machine as described in claim 3, characterized in that, A Plasma cleaning component and an air knife component are disposed between the two LGP upper fitting arms. The Plasma cleaning component and the air knife component are used to clean the lower surface of the LGP. Two image positioning components are disposed between the two LGP upper fitting arms. The two image positioning components are disposed on the linear module. The two image positioning components are used to take pictures of the lower surface of the LGP for image positioning.
5. The electronic paper assembly and bonding machine as described in claim 1, characterized in that, An AG image pre-positioning component is provided on the lower side of the component that peels off the carrier film. After the AG is peeled off, it is carried by the transport arm to the AG image pre-positioning component for image positioning. An AG lower bonding platform is provided on one side of the AG image pre-positioning component. An AG bonding roller is provided at one end of the AG lower bonding platform. The AG image pre-positioning component is used to ensure that one side of the AG is parallel to the AG bonding roller.
6. The electronic paper assembly and bonding machine as described in claim 5, characterized in that, A rotating shaft is provided at one end of the AG lower bonding platform, and a tilting cylinder is connected to the bottom of the AG lower bonding platform. The tilting cylinder is used to pull the AG lower bonding platform down, so that the AG lower bonding platform tilts at an angle around the rotating shaft. The AG bonding roller is connected to a lifting component. After the AG lower bonding platform tilts at an angle around the rotating shaft, the AG bonding roller rises, lifting one side of the AG. The AG and LGP move relative to each other to complete the rolling bonding.
Citation Information
Patent Citations
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