Chip mounter high-speed pressure control method, device and system

Abstract

The invention is suitable for the technical field of mounting, and provides a chip mounter high-speed pressure control method, device and system. The chip mounter high-speed pressure control method comprises the following steps: controlling a driving module to drive an adsorption part to move at a first preset speed; after it is detected that the distance between the adsorption part and the mounting surface reaches the preset distance, the driving module is controlled to drive the adsorption part to move at a second preset speed; when a displacement signal sent by the displacement sensor is received, the driving module is controlled to drive the displacement sensor to move at a third preset speed; and detecting the pressure on the mounting surface according to the pressure detection strategy, and closing the driving module when the pressure reaches the target pressure. According to the embodiment of the invention, accurate control from a small pressure range to a large pressure range can be realized, and the driving module can be controlled to move at a relatively high speed before the contact between the adsorption part and the mounting surface is determined, so that the mounting efficiency is improved.

Description

Technical Field

[0001] The present application belongs to the field of mounting technology, and in particular, relates to a high-speed pressure control method, device and system for a mounting machine. Background Art

[0002] In the field of automated placement technology, especially in the high-speed and high-precision placement of precision components, how to effectively control the placement pressure has become a key issue. Traditional placement methods often rely on preset speed or time parameters to control the placement process. This method is incapable of dealing with uneven placement surfaces or scenarios that require precise control of placement pressure.

[0003] Specifically, the traditional placement process is usually divided into multiple stages, including high-speed approach to the target placement surface, low-speed search for contact points, and adjustment of pressure based on changes in motor current after contact. However, this method has obvious limitations. First, the process of searching for contact points at low speed is very time-consuming, which seriously reduces production efficiency. Second, due to the existence of mechanical motion resistance, motor torque fluctuations under high-speed motion may lead to misjudgment, mistaking motion resistance for contact pressure, thus affecting the stability of placement quality. Summary of the invention

[0004] The embodiments of the present application provide a high-speed pressure control method, device and system for a placement machine, which can solve the problems of low placement efficiency and unstable placement quality in the related art.

[0005] In the first aspect, the embodiment of the present application provides a high-speed pressure control method for a placement machine, which is applied to a high-speed pressure control system of a placement machine. The high-speed pressure control system of the placement machine includes a driving module, a connecting member, an adsorbing member, and a displacement sensor. One end of the connecting member is fixedly connected to the driving module, and the other end of the connecting member is slidably connected to the adsorbing member. The relative position of the displacement sensor and the connecting member is fixed. The method includes:

[0006] Controlling the driving module to drive the adsorption component to move at a first preset speed;

[0007] After detecting that the distance between the adsorption member and the mounting surface reaches a preset distance, the driving module is controlled to drive the adsorption member to move at a second preset speed, where the second preset speed is less than the first preset speed;

[0008] When receiving a displacement signal sent by the displacement sensor, the control driving module drives the displacement sensor to move at a third preset speed, the third preset speed is less than the second preset speed, and the displacement signal is used to indicate that a relative displacement has occurred between the adsorption component and the displacement sensor;

[0009] The pressure on the mounting surface is detected according to the pressure detection strategy, and the driving module is turned off when the pressure reaches the target pressure.

[0010] In the second aspect, an embodiment of the present application provides a high-speed pressure control system for a placement machine, including a control module, a drive module, a connector, an adsorption member and a displacement sensor, one end of the connector is fixedly connected to the drive module, the other end of the connector is slidably connected to the adsorption member, the relative position of the displacement sensor and the connector is fixed, and the control module is used to execute the steps of the above-mentioned high-speed pressure control method for the placement machine.

[0011] In a second aspect, an embodiment of the present application provides a high-speed pressure control device for a placement machine, which is applied to the high-speed pressure control system of the placement machine, and includes:

[0012] A first control module, used for controlling the driving module to drive the adsorption member to move at a first preset speed;

[0013] A second control module is used to control the driving module to drive the adsorption member to move at a second preset speed after detecting that the distance between the adsorption member and the mounting surface reaches a preset distance, and the second preset speed is smaller than the first preset speed;

[0014] A third control module is used to control the driving module to drive the displacement sensor to move at a third preset speed when receiving a displacement signal sent by the displacement sensor. The third preset speed is less than the second preset speed. The displacement signal is used to indicate that a relative displacement has occurred between the adsorption component and the displacement sensor.

[0015] The detection module is used to detect the pressure on the mounting surface according to the pressure detection strategy, and turn off the driving module when the pressure reaches the target pressure.

[0016] In a fourth aspect, an embodiment of the present application provides a terminal device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, and when the processor executes the computer program, the steps of the above-mentioned high-speed pressure control method of the placement machine are implemented.

[0017] In a fifth aspect, an embodiment of the present application provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, the steps of the above-mentioned high-speed pressure control method of the placement machine are implemented.

[0018] In a sixth aspect, an embodiment of the present application provides a computer program product, which, when executed on a terminal device, enables the terminal device to execute the above-mentioned high-speed pressure control method for a placement machine.

[0019] Compared with the prior art, the embodiments of the present application have the following beneficial effects: the embodiments of the present application introduce a displacement sensor to monitor the relative displacement between the adsorbent and the displacement sensor in real time as a contact signal, thereby determining the contact state between the adsorbent and the mounting surface, and using one or more pressure detection strategies to detect the pressure on the mounting surface, thereby achieving precise control from a small pressure to a large pressure range. In addition, before determining that the adsorbent is in contact with the mounting surface, the drive module can be controlled to move at a relatively high speed, thereby improving mounting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0021] Figure 1 It is a schematic diagram of the implementation flow of a high-speed pressure control method for a chip mounter provided in an embodiment of the present application;

[0022] Figure 2 is a schematic diagram of the speed and pressure of the adsorption member in an embodiment of the present application;

[0023] Figure 3 It is a schematic diagram of the speed and pressure of the adsorption member in the prior art;

[0024] Figure 4 This is one of the structural schematic diagrams of a high-speed pressure control system for a chip placement machine provided in an embodiment of the present application;

[0025] Figure 5 This is the second structural schematic diagram of a high-speed pressure control system for a chip placement machine provided in an embodiment of the present application;

[0026] Figure 6 It is a structural schematic diagram of a high-speed pressure control device for a chip placement machine provided in an embodiment of the present application;

[0027] Figure 7 It is a schematic diagram of the structure of the terminal device provided in an embodiment of the present application.

[0028] The reference numerals are as follows:

[0029] 1. Driving module; 2. Connecting part; 2 1. Main body; 2 2. Connecting rod; 2 3. Storage cavity; 3. Adsorption part; 4. Displacement sensor; 5. Elastic part; 6. Elastic part limiting structure; 7. Mounting surface. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work are protected by the present application.

[0031] It should be noted that the terms "include", "comprises" and "have" and any variations thereof in the specification and claims of the present application and the above-mentioned drawings are intended to cover non-exclusive inclusions. For example, a process, method, terminal, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products or devices. In the claims, specification and drawings of the present application, relational terms such as "first" and "second" are merely used to distinguish one entity / operation / object from another entity / operation / object, and do not necessarily require or imply any such real-time relationship or order between these entities / operations / objects.

[0032] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0033] In the field of automated placement technology, especially in the high-speed and high-precision placement of precision components, how to effectively control the placement pressure has become a key issue. Traditional placement methods often rely on preset speed or time parameters to control the placement process. This method is incapable of dealing with uneven placement surfaces or scenarios that require precise control of placement pressure.

[0034] Specifically, the traditional mounting process is usually divided into multiple stages, including approaching the target mounting surface at high speed7, searching for the contact point at low speed, and adjusting the pressure according to the change in motor current after contact. However, this method has obvious limitations. First, the process of searching for the contact point at low speed is very time-consuming, which seriously reduces production efficiency. Secondly, due to the existence of mechanical motion resistance, the motor torque fluctuation under high-speed motion may lead to misjudgment, mistaking the motion resistance for contact pressure, thereby affecting the stability of the mounting quality.

[0035] In view of this, the embodiment of the present application introduces a displacement sensor 4 to monitor the relative displacement between the adsorbent 3 and the displacement sensor 4 in real time as a contact signal, thereby determining the contact state between the adsorbent 3 and the mounting surface 7, and adopting one or more pressure detection strategies to detect the pressure on the mounting surface 7, thereby achieving precise control from a small pressure to a large pressure range. In addition, before determining that the adsorbent 3 is in contact with the mounting surface 7, the drive module 1 can be controlled to move at a relatively high speed, thereby improving the mounting efficiency.

[0036] In order to illustrate the technical solution of the present application, a specific embodiment is provided below for illustration.

[0037] Figure 1 The schematic diagram of the implementation flow of a high-speed pressure control method for a chip mounter provided in an embodiment of the present application is shown. The method can be applied to a control module of the high-speed pressure control method for a chip mounter, and the control module can specifically be a single-chip microcomputer, an MCU, etc. The high-speed pressure control system for a chip mounter may include a driving module 1, a connecting member 2, an adsorbing member 3, and a displacement sensor 4. One end of the connecting member 2 is fixedly connected to the driving module 1, and the other end of the connecting member 2 is slidably connected to the adsorbing member 3. The relative position of the displacement sensor 4 and the connecting member 2 is fixed.

[0038] The driving module 1 may include a linear motor and a connecting rod 22, which are used to drive the connecting part 2 and the adsorbent 3 to move up and down. One end of the connecting part 2 may be fixedly connected to the connecting rod 22 of the driving module 1, so that the driving module 1 can drive the connecting part 2 to move up and down, and the other end of the connecting part 2 may be slidably connected to the adsorbent 3. The adsorbent 3 is the part that is in direct contact with the product to be mounted, for example, it may be a suction nozzle, which is used to adsorb and mount the product. The displacement sensor 4 is fixed on the connecting part 2, and the setting position of the displacement sensor 4 may correspond to the position of the adsorbent 3 in the uncompressed state. When the adsorbent 3 contacts the mounting surface 7 and the driving module 1 continues to drive the connecting part 2 to move downward, the adsorbent 3 will slide between the connecting part 2, and at this time, the displacement sensor 4 can be used to detect the relative displacement between itself and the adsorbent 3.

[0039] refer to Figure 4 and Figure 5 The specific use process of the high-speed pressure control system of the chip mounter in the embodiment of the present application is as follows:

[0040] When it is necessary to mount material on the mounting surface 7, the material is firstly adsorbed by the adsorbent 3, and the adsorbent 3 is moved above the mounting surface 7. Then the driving module 1 drives the connecting part 2 and the adsorbent 3 to move downward. When the adsorbent 3 contacts the mounting surface 7 through the material, the adsorbent 3 is blocked by the mounting surface 7 and stops moving. At this time, the adsorbent 3 will apply pressure to the mounting surface 7 (the pressure is small at this time, and the pressure still needs to be applied). Next, the driving module 1 continues to drive the connecting part 2 to move downward. At this time, the adsorbent 3 applies greater pressure to the mounting surface 7 until the target pressure is reached and the mounting is completed. At this time, the driving module 1 is turned off. In the process of applying greater pressure to the mounting surface 7, the adsorbent 3 will not move. Since the connecting part 2 is slidably connected to the adsorbent 3, the connecting part 2 will slide relative to the adsorbent 3 at this time, and the displacement sensor 4 fixed on the connecting part 2 will also move relative to the adsorbent 3. At this time, the displacement sensor 4 can record the relevant displacement information and send it to the control module.

[0041] refer to Figure 1 and Figure 2 , Figure 2 Schematic diagram of the speed and pressure of the adsorption member 3 in the embodiment of the present application. Specifically, the high-speed pressure control method of the placement machine may include the following steps S101 to S104.

[0042] Step S101 , controlling the driving module 1 to drive the adsorption component 3 to move at a first preset speed.

[0043] The first preset speed may be the maximum operating speed of the placement machine.

[0044] In the implementation of the present application, the control module can use the maximum acceleration and maximum speed to drive the suction member 3 (such as a suction nozzle) to quickly approach the product to be mounted, so as to reduce the overall mounting time. Figure 2 The part in the first stage where the speed increases and the maximum speed remains unchanged. |

[0045] Step S102: after detecting that the distance between the suction member 3 and the mounting surface 7 reaches a preset distance, controlling the driving module 1 to drive the suction member 3 to move at a second preset speed.

[0046] The second preset speed is lower than the first preset speed.

[0047] In the embodiment of the present application, when the control module detects that the adsorption member 3 approaches a preset distance (e.g., 3 mm) from the mounting surface 7, the control module can reduce the speed to a second preset speed (e.g., 50% of the maximum speed) to prepare for accurate search of the contact point to avoid the influence of motor torque fluctuations at high speed on the judgment. Figure 2 The first stage is the part where the speed decreases and the second stage is the part where the maximum speed remains unchanged.

[0048] It is important to understand that reference Figure 3 , Figure 3 The figure shows the speed and pressure diagram of the suction member 3 in the prior art. In the prior art, the second stage search speed is usually less than 30% of the maximum speed, so the search process time is very long, which greatly affects the production efficiency of the machine. If the search speed is increased, it is easy to cause the motor torque to fluctuate, so that the movement resistance when the motor rotates is easily misjudged as contact pressure. Therefore, it is difficult for the prior art to achieve very accurate low contact pressure control at a higher operating speed.

[0049] The embodiment of the present application can accurately determine whether the adsorption component 3 is in contact with the mounting surface 7, so it is not easy to make a misjudgment due to a higher operating speed. Therefore, compared with the prior art, the second stage of the embodiment of the present application has a higher operating speed, thereby improving the mounting efficiency.

[0050] Step S103, when receiving the displacement signal sent by the displacement sensor 4, controlling the driving module 1 to drive the displacement sensor 4 to move at a third preset speed.

[0051] The third preset speed is smaller than the second preset speed, and the displacement signal is used to indicate that a relative displacement has occurred between the adsorption component 3 and the displacement sensor 4 .

[0052] In the embodiment of the present application, when the displacement sensor 4 detects the relative displacement between the adsorbent 3 and the connecting rod 22, it can be considered that the adsorbent 3 has contacted the mounting surface 7, and it can send a corresponding displacement signal to the control module. After receiving the displacement signal, the control module can control the driving module 1 to immediately decelerate to a third preset speed (such as 10% of the maximum speed).

[0053] Step S104 , detecting the pressure on the mounting surface 7 according to the pressure detection strategy, and turning off the driving module 1 when the pressure reaches the target pressure.

[0054] In the embodiment of the present application, the control module may use one or more pressure detection strategies to calculate the pressure on the mounting surface 7. If the calculated pressure reaches the target pressure, the control module may turn off the driving module 1 to drive the adsorbent 3 to stop applying pressure to the mounting surface 7.

[0055] The beneficial effects of the embodiment of the present application compared with the prior art are as follows: the embodiment of the present application introduces a displacement sensor 4 to monitor the relative displacement between the adsorbent 3 and the displacement sensor 4 in real time as a contact signal, thereby determining the contact state between the adsorbent 3 and the mounting surface 7, and adopting one or more pressure detection strategies to detect the pressure on the mounting surface 7, thereby achieving precise control from a small pressure to a large pressure range. In addition, before determining that the adsorbent 3 is in contact with the mounting surface 7, the drive module 1 can be controlled to move at a relatively high speed, thereby improving the mounting efficiency.

[0056] In some embodiments of the present application, the high-speed pressure control system of the placement machine may further include an elastic member 5, the elastic member 5 is sleeved on the connecting member 2, and the two ends of the elastic member 5 are respectively abutted against the adsorption member 3 and the connecting member 2, and the pressure detection strategy detection includes a first pressure detection strategy, and the pressure on the mounting surface 7 is detected according to the pressure detection strategy, which may include:

[0057] When the displacement value corresponding to the displacement signal is received, the first pressure detection strategy is used to calculate the pressure exerted on the mounting surface 7 .

[0058] Specifically, in some specific implementations of the present application, the calculation formula corresponding to the first pressure detection strategy is:

[0059] F = -kx;

[0060] Wherein, F is the pressure, k is the stiffness coefficient of the elastic member 5, and x is the displacement value.

[0061] In the embodiment of the present application, after the displacement sensor 4 detects that the adsorbent 3 and the displacement sensor 4 have undergone relative displacement, the displacement sensor 4 can record the corresponding displacement value and send it to the control module. It can be understood that since the elastic member 5 is sleeved on the connecting rod 22, and the two ends of the elastic member 5 are respectively in contact with the adsorbent 3 and the connecting member 2, the displacement value between the adsorbent 3 and the displacement sensor 4 is the same as the compression value or tension value of the elastic member 5. After the control module receives the relative displacement value, Hooke's law can be used to calculate the elastic force exerted by the adsorbent 3 on the elastic member 5, and the elastic force is the same as the pressure exerted by the adsorbent 3 on the mounting surface 7. Therefore, the control module can calculate the pressure exerted on the mounting surface 7 based on this. In order to determine whether the pressure reaches the target pressure, if not, the drive module 1 continues to be controlled to indirectly apply pressure to the mounting surface 7. If it is reached, the drive module 1 is turned off.

[0062] In some specific implementations of the present application, the pressure detection strategy may further include a second pressure detection strategy. Detecting the pressure on the mounting surface 7 according to the pressure detection strategy may include:

[0063] When the displacement value is equal to the preset value, the second pressure detection strategy is used to calculate the pressure on the mounting surface 7.

[0064] It is understandable that different pressures may need to be applied to different products to be mounted, and the maximum compression amount (i.e., the preset value) of the elastic member 5 is fixed. In some scenarios, when the elastic member 5 reaches the maximum compression amount, but the pressure indirectly applied to the mounting surface 7 is not enough to reach the target pressure, the corresponding pressure cannot be calculated by the compression amount of the elastic member 5.

[0065] Based on this, in an embodiment of the present application, when the compression amount (displacement value) of the elastic member 5 is equal to the preset value (maximum compression amount), the control module can adopt a second pressure detection strategy to calculate the pressure exerted on the mounting surface 7, so as to continue to accurately calculate the pressure exerted on the mounting surface 7 in this scenario.

[0066] In some more specific implementations of the present application, the above-mentioned use of the second pressure detection strategy to calculate the pressure exerted on the mounting surface 7 may specifically include the following steps:

[0067] Obtain the current value of the driving module 1;

[0068] The pressure applied to the mounting surface 7 is calculated based on the current value.

[0069] In an embodiment of the present application, when the adsorption member 3 contacts the mounting surface 7, the current output of the motor in the driving module 1 will slowly increase. When it increases to a certain value, it can be considered that the pressure applied by the adsorption member 3 to the mounting surface 7 has reached the target pressure, and the driving module 1 can be closed at this time.

[0070] It should be understood that judging whether the pressure applied by the adsorption part 3 to the mounting surface 7 reaches the target pressure through the current of the motor is suitable for scenarios with a larger target pressure. When the target pressure is smaller, the judgment result is often inaccurate. Calculating the corresponding pressure through the compression amount of the elastic part 5 is more suitable for use scenarios with a smaller target pressure, and the pressure calculated in this way is accurate. Therefore, the implementation method of the present application can adopt the first pressure detection strategy to calculate the pressure when the target pressure is low, and can also adopt the second pressure detection strategy to calculate the pressure when the target pressure is high, so that precise control from micro pressure to large pressure range can be achieved. However, the related technology often only uses a method similar to the second pressure detection strategy to calculate the pressure, and the calculation result is inaccurate, and precise control in micro pressure scenarios cannot be achieved.

[0071] like Figure 4As shown, an embodiment of the present application also provides a high-speed pressure control system for a placement machine. The above-mentioned high-speed pressure control system for the placement machine may include a control module, a driving module 1, a connecting part 2, an adsorbent 3 and a displacement sensor 4. One end of the connecting part 2 is fixedly connected to the driving module 1, and the other end of the connecting part 2 is slidably connected to the adsorbent 3. The relative position of the displacement sensor 4 and the connecting part 2 is fixed. The control module can be used to execute the steps of the high-speed pressure control method for the placement machine in the above-mentioned embodiment.

[0072] In some specific embodiments of the present application, the high-speed pressure control system of the placement machine further includes an elastic member 5, which is sleeved on the connecting member 2, and two ends of the elastic member 5 are respectively in contact with the adsorption member 3 and the connecting member 2.

[0073] In some specific embodiments of the present application, the connecting member 2 includes a main body 21, a connecting rod 22 and a storage cavity 23, one end of the connecting rod 22 is fixedly connected to the adsorption member 3, the other end of the connecting rod 22 is arranged in the storage cavity 23, the connecting rod 22 slides up and down along the storage cavity 23, the elastic member 5 is sleeved on the connecting rod 22, the displacement sensor 4 is fixed on the main body 21, and the high-speed pressure control system of the placement machine also includes an elastic member limiting structure 6, which is used to limit the compression of the elastic member 5.

[0074] In the embodiment of the present application, when the adsorbent 3 is stationary and the connecting member 2 is moving, the connecting rod 22 slides in the storage cavity 23, and at this time, a relative displacement occurs between the displacement sensor 4 fixed on the main body 21 and the adsorbent 3. The elastic member limiting structure 6 is provided to limit the compression amount of the elastic member 5 to protect the elastic member 5.

[0075] In some specific embodiments of the present application, the displacement sensor 4 is an optical tracking sensor.

[0076] Figure 6 The schematic diagram of the structure of a high-speed pressure control device for a chip mounter provided in an embodiment of the present application is shown. The high-speed pressure control device 6 for a chip mounter can be configured on a high-speed pressure control system of the chip mounter. Specifically, the high-speed pressure control device 6 for a chip mounter can include:

[0077] The first control module 601 is used to control the driving module 1 to drive the adsorption component 3 to move at a first preset speed;

[0078] The second control module 60 2 is used to control the driving module 1 to drive the adsorbing member 3 to move at a second preset speed after detecting that the distance between the adsorbing member 3 and the mounting surface 7 reaches a preset distance, and the second preset speed is smaller than the first preset speed;

[0079] The third control module 603 is used to control the driving module 1 to drive the displacement sensor 4 to move at a third preset speed when receiving the displacement signal sent by the displacement sensor 4. The third preset speed is less than the second preset speed. The displacement signal is used to indicate that the adsorption component 3 and the displacement sensor 4 have undergone relative displacement.

[0080] The detection module 604 is used to detect the pressure on the mounting surface 7 according to the pressure detection strategy, and turn off the driving module 1 when the pressure reaches the target pressure.

[0081] The beneficial effects of the embodiment of the present application compared with the prior art are as follows: the embodiment of the present application introduces a displacement sensor 4 to monitor the relative displacement between the adsorbent 3 and the displacement sensor 4 in real time as a contact signal, thereby determining the contact state between the adsorbent 3 and the mounting surface 7, and adopting one or more pressure detection strategies to detect the pressure on the mounting surface 7, thereby achieving precise control from a small pressure to a large pressure range. In addition, before determining that the adsorbent 3 is in contact with the mounting surface 7, the drive module 1 can be controlled to move at a relatively high speed, thereby improving the mounting efficiency.

[0082] In some embodiments of the present application, the high-speed pressure control system of the placement machine also includes an elastic member 5, which is mounted on the connecting member 2, and the two ends of the elastic member 5 are respectively abutted against the adsorption member 3 and the connecting member 2, and the pressure detection strategy detection includes a first pressure detection strategy, and the detection module 60 4 is also used for: when the displacement value corresponding to the displacement signal is received, the first pressure detection strategy is used to calculate the pressure applied to the mounting surface 7.

[0083] In some implementations of the present application, the calculation formula corresponding to the first pressure detection strategy is:

[0084] F = -kx;

[0085] Wherein, F is the pressure, k is the stiffness coefficient of the elastic member 5, and x is the displacement value.

[0086] In some embodiments of the present application, the pressure detection strategy also includes a second pressure detection strategy, and the detection module 604 is further used to: when the displacement value is equal to a preset value, use the second pressure detection strategy to calculate the pressure exerted on the mounting surface 7.

[0087] In some implementations of the present application, the detection module 604 is further used to: obtain the current value of the driving module 1; and calculate the pressure exerted on the mounting surface 7 according to the current value.

[0088] like Figure 7, which is a schematic diagram of a terminal device provided in an embodiment of the present application. The terminal device 7 may include: a processor 70 1, a memory 70 2, and a computer program 70 3 stored in the memory 70 2 and executable on the processor 70 1, such as a high-speed pressure control program for a placement machine. When the processor 70 1 executes the computer program 70 3, the steps in the above-mentioned embodiments of the high-speed pressure control method for a placement machine are implemented, such as Figure 1 Alternatively, when the processor 70 1 executes the computer program 70 3 , the functions of each module / unit in the above-mentioned device embodiments are implemented, for example Figure 6 The first control module 601 , the second control module 602 , the third control module 603 , and the detection module 604 are shown.

[0089] The computer program may be divided into one or more modules / units, one or more modules / units are stored in the memory 70 2, and executed by the processor 70 1 to complete the present application. One or more modules / units may be a series of computer program instruction segments capable of completing specific functions, and the instruction segments are used to describe the execution process of the computer program in the terminal device.

[0090] The terminal device may include, but is not limited to, a processor 70 1 and a memory 70 2. Those skilled in the art will appreciate that Figure 7 It is only an example of a terminal device and does not constitute a limitation of the terminal device. It may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, the terminal device may also include input and output devices, network access devices, buses, etc.

[0091] The processor 701 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc.

[0092] The memory 702 may be an internal storage unit of the terminal device, such as a hard disk or memory of the terminal device. The memory 702 may also be an external storage device of the terminal device, such as a plug-in hard disk, a smart memory card (Smart Media Card, SM C), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped on the terminal device. Further, the memory 702 may also include both an internal storage unit of the terminal device and an external storage device. The memory 702 is used to store computer programs and other programs and data required by the terminal device. The memory 702 may also be used to temporarily store data that has been output or is to be output.

[0093] It should be noted that, for the convenience and brevity of description, the structure of the above-mentioned terminal device can also refer to the specific description of the structure in the method embodiment, which will not be repeated here.

[0094] The technicians in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In practical applications, the above-mentioned function allocation can be completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, which will not be repeated here.

[0095] The embodiment of the present application also provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, the steps in the above-mentioned high-speed pressure control method of the placement machine can be implemented.

[0096] An embodiment of the present application provides a computer program product. When the computer program product is run on a mobile terminal, the steps in the above-mentioned high-speed pressure control method for a placement machine can be implemented when the mobile terminal executes the computer program product.

[0097] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0098] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0099] In the embodiments provided in the present application, it should be understood that the disclosed devices / terminal equipment and methods can be implemented in other ways. For example, the device / terminal equipment embodiments described above are only schematic. For example, the division of the modules or units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0100] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0101] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0102] If the integrated module / unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the processes in the above-mentioned embodiment method, and can also be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium, and the computer program can implement the steps of the above-mentioned various method embodiments when executed by the processor. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form. The computer-readable medium may include: any entity or device capable of carrying the computer program code, recording medium, U disk, mobile hard disk, disk, optical disk, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal and software distribution medium. It should be noted that the content contained in the computer-readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer-readable media do not include electric carrier signals and telecommunication signals.

[0103] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A high-speed pressure control method for a chip mounter, characterized in that: The high-speed pressure control method of the placement machine is applied to the high-speed pressure control system of the placement machine, and the high-speed pressure control system of the placement machine includes a driving module, a connecting member, an adsorbing member and a displacement sensor, one end of the connecting member is fixedly connected to the driving module, and the other end of the connecting member is slidably connected to the adsorbing member, and the relative position of the displacement sensor and the connecting member is fixed. The method includes: Controlling the driving module to drive the adsorption component to move at a first preset speed; After detecting that the distance between the adsorption member and the mounting surface reaches a preset distance, controlling the driving module to drive the adsorption member to move at a second preset speed, where the second preset speed is less than the first preset speed; When receiving a displacement signal sent by the displacement sensor, controlling the driving module to drive the displacement sensor to move at a third preset speed, wherein the third preset speed is less than the second preset speed, and the displacement signal is used to indicate that a relative displacement has occurred between the adsorption component and the displacement sensor; The pressure on the mounting surface is detected according to a pressure detection strategy, and the driving module is turned off when the pressure reaches a target pressure.

2. The high-speed pressure control method for a chip mounter according to claim 1, characterized in that: The high-speed pressure control system of the placement machine also includes an elastic member, the elastic member is sleeved on the connecting member, and the two ends of the elastic member are respectively in contact with the adsorption member and the connecting member, the pressure detection strategy detection includes a first pressure detection strategy, and the pressure on the placement surface is detected according to the pressure detection strategy, including: When the displacement value corresponding to the displacement signal is received, the first pressure detection strategy is used to calculate the pressure applied to the mounting surface.

3. The high-speed pressure control method for a chip mounter according to claim 2, characterized in that: The calculation formula corresponding to the first pressure detection strategy is: F = -kx; Wherein, F is the pressure, k is the stiffness coefficient of the elastic member, and x is the displacement value.

4. The high-speed pressure control method for a chip mounter according to claim 2, characterized in that: The pressure detection strategy also includes a second pressure detection strategy, and the pressure applied to the mounting surface is detected according to the pressure detection strategy, including: When the displacement value is equal to a preset value, the second pressure detection strategy is used to calculate the pressure applied to the mounting surface.

5. The high-speed pressure control method for a chip mounter according to claim 4, characterized in that: The step of calculating the pressure exerted on the mounting surface by using the second pressure detection strategy includes: Acquiring a current value of the driving module; The pressure applied to the mounting surface is calculated based on the current value.

6. A high-speed pressure control system for a chip mounter, characterized in that: The high-speed pressure control system of the placement machine includes a control module, a driving module, a connecting part, an adsorption part and a displacement sensor. One end of the connecting part is fixedly connected to the driving module, and the other end of the connecting part is slidably connected to the adsorption part. The relative position of the displacement sensor and the connecting part is fixed. The control module is used to execute the steps of the high-speed pressure control method of the placement machine as described in any one of claims 1 to 5.

7. The high-speed pressure control system for a chip mounter as claimed in claim 6, characterized in that: The high-speed pressure control system of the placement machine also includes an elastic member, which is sleeved on the connecting member, and two ends of the elastic member are respectively in contact with the adsorption member and the connecting member.

8. The high-speed pressure control system for a chip mounter as claimed in claim 7, characterized in that: The connecting member includes a main body, a connecting rod and a storage cavity, one end of the connecting rod is fixedly connected to the adsorption member, the other end of the connecting rod is arranged in the storage cavity, the connecting rod slides up and down along the storage cavity, the elastic member is sleeved on the connecting rod, the displacement sensor is fixed on the main body, and the high-speed pressure control system of the placement machine also includes an elastic member limiting structure, and the elastic member limiting structure is used to limit the compression of the elastic member.

9. The high-speed pressure control system for a chip mounter according to any one of claims 6 to 8, characterized in that: The displacement sensor is an optical tracking sensor.

10. A high-speed pressure control device for a chip mounter, characterized in that: The high-speed pressure control device for a chip mounter is applied to the high-speed pressure control system for a chip mounter according to any one of claims 6 to 9, and the device comprises: A first control module, used for controlling the driving module to drive the adsorption component to move at a first preset speed; A second control module is used to control the driving module to drive the adsorption member to move at a second preset speed after detecting that the distance between the adsorption member and the mounting surface reaches a preset distance, and the second preset speed is smaller than the first preset speed; a third control module, configured to control the driving module to drive the displacement sensor to move at a third preset speed when receiving a displacement signal sent by the displacement sensor, wherein the third preset speed is less than the second preset speed, and the displacement signal is used to indicate that a relative displacement has occurred between the adsorption component and the displacement sensor; The detection module is used to detect the pressure on the mounting surface according to the pressure detection strategy, and to close the driving module when the pressure reaches the target pressure.

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