Quartz wafer welding process control system

Abstract

The present invention discloses a quartz wafer welding process control system, which relates to the field of wafer welding measurement. The present invention includes a unit module accessing the machine data corresponding to the process of the quartz wafer welding process, recording the internal output data of the machine, calculating the corresponding output data of each group of equipment according to the operating state of a single group of equipment, and verifying the real-time data of the quartz wafer after being processed by the unit module; the data analysis module records and corrects the output data of each group of equipment calculated by the peripheral acquisition device through the internal output data of the machine, accesses the shutdown equipment serial number responded by the system, and combines the output data of each unit module and the change of work efficiency to output the total T / R data of the system. The present invention can effectively evaluate and optimize the efficiency of wafer production through calculations and strategies in the system.

Description

Technical Field

[0001] The invention relates to the field of wafer welding measurement, and in particular to a quartz wafer welding process control system. Background Art

[0002] The welding process of quartz crystal is a complex and delicate process involving multiple steps to ensure the performance and reliability of the crystal oscillator, including the combination of multiple process steps under both manual and mechanized operation modes;

[0003] Specifically corresponding to the machinery with different settings, the workshop replaces equipment or maintains equipment by full or half shutdown. However, after stopping the operation, the calculation of the total output and the pre-estimated productivity are inaccurate, which is not conducive to the workshop's production statistics. Due to the defective products generated in the process, it is difficult to calculate the output of good products. The manual counting method is accurate in calculating the product output, but the calculation of the corresponding wafer production time does not conform to the actual consumption time.

[0004] Therefore, there is an urgent need for an industrial intelligent management and control platform for measuring time and output of workshop operations. The management and control platform adapts to various changes in the workshop during the chip welding process to calculate production efficiency and guide production. Summary of the invention

[0005] The invention provides a quartz wafer welding process control system to solve the problems of the prior art.

[0006] In a first aspect, the present invention provides a quartz wafer welding process control system, the system includes a control model, the control model includes a unit module; the unit module is specifically: a sheet arrangement unit module, a cleaning unit module, a drying unit module, a coating unit module, a dispensing unit module, a curing unit module, a fine-tuning unit module, a verification unit module and a data analysis module;

[0007] The unit module is connected to the machine data of the corresponding process of the quartz wafer welding process and records the internal output data of the machine;

[0008] Each unit module includes at least one set of repeated equipment for process processing. The unit module collects the number of repeated equipment groups in the unit module according to the external acquisition device, calculates the output data corresponding to each set of equipment according to the operating status of a single set of equipment, and verifies the real-time data of the quartz wafer after processing by the unit module.

[0009] The data analysis module uses the internal output data of the machine to record and correct each set of equipment output data calculated by the external acquisition device;

[0010] The data analysis module accesses the system response to the serial number of the shutdown equipment, and combines the output data of each unit module and the change in work efficiency to output the total T / R data of the system.

[0011] Furthermore, the data analysis module loads the unit module simulation model corresponding to the process steps according to the number of process steps required for a batch of quartz wafer products, and the unit module simulation model is preloaded into the storage module of the data analysis module;

[0012] The unit module simulation model is a wafer processing mathematical function generated based on the unit module operation data corresponding to the process based on historical data.

[0013] Furthermore, the data analysis module loads the shutdown equipment serial number of the system response, adjusts the chip processing mathematical function parameters affected by the corresponding shutdown equipment serial number as correction parameters, and the data analysis module is used to load the corresponding correction parameters of each unit module according to the shutdown equipment serial number.

[0014] Furthermore, the data analysis module makes real-time adjustments to the parameters of the equipment components influencing the inside of the unit module according to the correction parameters of the unit module where the shutdown equipment serial number is located, and the data analysis module makes synchronous adjustments to the parameters of the simulation model of the unit module corresponding to the adjacent process of the process where the shutdown equipment serial number is located.

[0015] Furthermore, the data analysis module calls the real-time recording of the internal output data of the machine to calculate the cycle time of the corresponding process, calls the downtime equipment serial number to analyze the change in unit working time of the corresponding unit module, and analyzes the change in production capacity of the process where the downtime equipment serial number is located based on the called data.

[0016] Furthermore, the data analysis module accumulates the placement time after processing of different unit module processes for capacity calculation.

[0017] Furthermore, the data analysis module is used to calculate the fluctuation of waiting time per unit working time and cycle time in production capacity due to the real-time changing number of manual workers scanned into the machine room and the data content of historical manual participation in the process.

[0018] Furthermore, the data analysis module analyzes the OEE data of the corresponding process based on the simulation models of different unit modules, and outputs the production capacity margin and adjustment strategy of the equipment corresponding to the different processes.

[0019] Furthermore, after receiving the downtime equipment serial number responded by the system, the data analysis module counts the changes in the data parameters before and after the unit module, analyzes the key parameters affected by the downtime equipment, and uses the average value of the key parameters in the historical machine internal output data to calculate the percentage of parameter change on the production cycle time of the quartz wafer in all processes;

[0020] First, calculate the percentage increase or decrease of the key parameters compared to the key parameters produced inside the machine, and then calculate the percentage change in the production cycle time after the system responds to the serial number of the stopped equipment;

[0021] When the serial number of the stopped equipment is expressed as the equipment corresponding to a single process, the impact rate of the shutdown of the equipment in a single process on the production cycle time of the total process of the current production line is calculated. The impact rate is determined by the ratio of the increase or decrease percentage of the key parameters to the change percentage of the production cycle time;

[0022] When the downtime equipment serial number is represented by equipment corresponding to multiple processes, call the single process impact rate of the associated multiple processes, calculate the impact of the combined process on the production cycle time, and determine the parameters of the impact by calculating the percentage change of the production cycle time. According to the impact parameters, the proportion of the impact rate of different processes is allocated;

[0023] The impact rate of the output downtime equipment serial number on the production cycle time provides a data reference for evaluating the capacity data and generates a corresponding adjustment strategy. The adjustment strategy is to prioritize the update / maintenance sequence for the corresponding process equipment with a high proportion of the corresponding influencing parameters, among which the downtime equipment is the equipment that needs to be updated and repaired.

[0024] Furthermore, the data analysis module takes into account the evaluation time for executing the update / repair sequence, and calculates the dynamic data of the production capacity after the equipment with priority execution sequence is put into production.

[0025] The present invention can effectively evaluate and optimize the efficiency of wafer production through calculations and strategies in the system. These indicators not only help manufacturers predict production results, but also guide them to optimize in design, production process control, quality control, etc., to improve overall production efficiency and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings described herein are used to provide a further understanding of the embodiments of the present invention, constitute a part of the present invention, and do not constitute a limitation of the embodiments of the present invention. In the drawings:

[0027] Figure 1 A schematic diagram of a quartz wafer welding process control system provided by an exemplary embodiment of the present invention. DETAILED DESCRIPTION

[0028] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Instead, they are merely examples of devices and methods consistent with some aspects of the present invention as detailed in the appended claims.

[0029] In the present invention, the production time calculation for evaluating the quartz wafer processing output adopts the following parameters:

[0030] T / R (Turn Ratio): T / R is one of the important indicators to measure production line efficiency, process design rationality and production progress. It refers to the turnover rate of work-in-progress, that is, the number of process steps (Stages) that each wafer goes through on average every day. The calculation formula is: T / R = total wafer movement (Stage number) / production days. Among them, the total wafer movement refers to the sum of all process steps completed by the wafer in the manufacturing process within a period of time, and the production days are the total production days during the measurement period;

[0031] Cycle Time: Cycle time refers to the total time from when raw materials (such as silicon wafers) enter the production line to when the final product (such as a finished wafer or chip) is output from the production line. It can be roughly calculated using the following formula: Cycle Time = Work In Process (WIP) / Throughput (TH)

[0032] Capacity calculation: The capacity calculation formula is: Capacity = Unit working time ÷ Cycle time. The unit working time here refers to the attendance time minus the waiting time caused by related activities.

[0033] Calculation of die number per wafer (DPW): The formula for calculating the number of chips that can be produced per wafer is: DFW = d× π × (4 / √(π × S) - 1 / √(2 × S)), where DFW represents the number of chips that can be produced per wafer, d represents the diameter of the wafer, and S represents the area of ​​the chip.

[0034] The wafer production efficiency is calculated based on multi-parameter production time, and the method and strategy are as follows:

[0035] Time-based production efficiency calculation: A commonly used production efficiency calculation formula is: Production efficiency = (actual output × standard working hours) / (actual manpower × standard working hours - production blocking hours + overtime hours). This formula involves the actual number of products completed (actual output), the standard working hours (standard working hours) that should be consumed for a single product calculated according to product process requirements or industry standards, the actual number of people involved in production activities (actual manpower), usually refers to the basic working hours of 8 hours per day (standard working hours), invalid working hours (production blocking hours) caused by non-production reasons (such as shutdowns, equipment failures, material shortages, etc.), and extended working hours (overtime hours) to complete production tasks.

[0036] Production efficiency calculation based on labor time utilization: Another formula is: Production efficiency = standard total labor time ÷ actual total labor time × 100%. This formula involves the ideal total labor time required to produce all products (standard total labor time) and the actual total labor time invested (actual total labor time).

[0037] Chip yield calculator: A chip yield calculator is an important tool in semiconductor manufacturing that estimates the yield or efficiency of producing functional chips on a wafer. The chip yield calculator can help semiconductor engineers and manufacturers predict production results and optimize processes to minimize defects.

[0038] OEE (Overall Equipment Effectiveness): In semiconductor manufacturing, OEE is an important performance indicator used to measure the utilization and production efficiency of production equipment. The calculation formula of OEE is: OEE = Availability × Performance × Quality.

[0039] The present invention is based on the real-time changes in production capacity when each group of precision equipment is performing a short work stop, such as maintenance or equipment replacement or equipment downtime, involving the order of changes in the production line. For the production process of precision instruments, the replacement and maintenance order of some equipment on the production line will be included in the important data that affects the fluctuation of production capacity. In order to speed up production, existing factories often adopt the method of shutting down or semi-shutting down the entire production line to execute machine updates and replacements, which is not conducive to improving production intelligence and efficiency.

[0040] Therefore, the present invention considers that when a single-numbered device stops, the serial number is accessed, and the output data analyzed by the peripheral acquisition device is corrected by reading data from the inside of the machine. The peripheral acquisition device can be a multifunctional acquisition device such as an infrared laser sensor, a counter, and an image sensor. The corrected data can be used to provide data reference for the shutdown of multiple processes when a single process device stops. When the serial number of the stopped device is represented as a single process corresponding device, the impact rate of the shutdown of the single process device on the production cycle time of the total process of the current production line is calculated. The impact rate is calculated by the increase or decrease percentage of the key parameters and the change percentage of the production cycle time. The ratio is determined by the ratio; specifically: each unit module includes at least one group of repeated equipment for process processing, the unit module collects the number of repeated groups of equipment in the unit module according to the external acquisition device, calculates the output data corresponding to each group of equipment according to the operating status of the single group of equipment, and verifies the real-time data of the quartz wafer after being processed by the unit module; among them, the dispensing unit module and the coating unit module are generally equipped with two groups of repeated equipment for synchronous execution, and the dispensing unit module is equipped with N groups of synchronous execution processes, N is greater than or equal to 3, and the specific production line settings are intelligently read by the data analysis module or the data parameters can be manually filled in;

[0041] The quartz wafer welding process control system provided by the present invention is intended to solve the above technical problems in the prior art.

[0042] The technical solution of the present invention and how the technical solution of the present invention solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present invention will be described below in conjunction with the accompanying drawings.

[0043] The present invention provides exemplary embodiment 1, as Figure 1 As shown, when executing multi-process shutdown, the system includes a control model, which includes unit modules; the unit modules are specifically: a film arrangement unit module, a cleaning unit module, a drying unit module, a coating unit module, a dispensing unit module, a curing unit module, a fine-tuning unit module, a verification unit module and a data analysis module; each module is respectively provided with a simulation model, and the unit module simulation model is connected to the machine data of the corresponding process of the quartz wafer welding process, and records the internal output data of the machine; after receiving the shutdown equipment serial number responded by the system, the data analysis module loads the shutdown equipment serial number responded by the system The equipment serial number is used to adjust the wafer processing mathematical function parameters affected by the corresponding shutdown equipment serial number as correction parameters. The data analysis module is used to load the corresponding correction parameters of each unit module according to the shutdown equipment serial number; the data analysis module adjusts the equipment component parameters affected inside the unit module in real time according to the correction parameters of the unit module where the shutdown equipment serial number is located, and the data analysis module synchronously adjusts the parameters of the simulation model of the corresponding unit module according to the adjacent process of the process where the shutdown equipment serial number is located; the data analysis module calls the real-time recording of the internal output data of the machine to calculate the cycle of the corresponding process The system uses the downtime equipment serial number to analyze the change in the unit working time of the corresponding unit module, and analyzes the capacity change of the process where the downtime equipment serial number is located based on the calling data; after receiving the downtime equipment serial number responded by the system, the data analysis module counts the changes in the data parameters before and after the unit module, analyzes the key parameters affected by the downtime equipment, and uses the average value of the key parameters in the historical machine internal output data to calculate the percentage of parameter change on the production cycle time of the quartz wafer in all processes; first calculate the increase or decrease percentage of the key parameters compared with the key parameters output inside the machine, and then calculate the percentage change of the production cycle time after the system responds to the downtime equipment serial number; call the single process impact rate of multiple associated processes, calculate the impact of the combined process on the production cycle time, and determine the parameters of the impact by calculating the percentage change of the production cycle time, and allocate the proportion of the impact rate to different processes based on the impact parameters; output the impact rate of the downtime equipment serial number on the production cycle time to provide data reference for evaluating the capacity data and generate the corresponding adjustment strategy, and the adjustment strategy is to execute the priority update / repair sequence for the corresponding process equipment with a high proportion of the corresponding impact parameters.

[0044] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical modules, that is, they may be located in one place or distributed on multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0045] In addition, each functional module in each embodiment of the present invention may be integrated into one processing module, or each module may exist physically separately, or two or more modules may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of hardware plus software functional modules.

[0046] Those skilled in the art will appreciate that the embodiments of the present invention may be provided as methods or systems. Therefore, the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects.

[0047] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0048] The above are only embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

[0049] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. The present invention is intended to cover any variations, uses or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art that are not disclosed by the present invention. The description and examples are to be considered exemplary only, and the true scope and spirit of the present invention is indicated by the claims above.

[0050] It should be understood that the present invention is not limited to the exact construction that has been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. Quartz wafer welding process control system, characterized in that: The system includes a control model, which includes unit modules; the unit modules are specifically: a film arrangement unit module, a cleaning unit module, a drying unit module, a coating unit module, a dispensing unit module, a curing unit module, a fine-tuning unit module, a calibration unit module and a data analysis module; The unit module is connected to the machine data of the corresponding process of the quartz wafer welding process and records the internal output data of the machine; Each unit module includes at least one set of repeated equipment for process processing. The unit module collects the number of repeated equipment groups in the unit module according to the external acquisition device, calculates the output data corresponding to each set of equipment according to the operating status of a single set of equipment, and verifies the real-time data of the quartz wafer after processing by the unit module. The data analysis module uses the machine's internal output data records to correct each set of device output data calculated by the external acquisition device; The data analysis module accesses the system response to the serial number of the shutdown equipment, and combines the output data of each unit module and the change in work efficiency to output the total T / R data of the system.

2. The quartz wafer welding process control system according to claim 1, characterized in that: The data analysis module loads the unit module simulation model corresponding to the process step according to the number of process steps required for a batch of quartz wafer products, and the unit module simulation model is preloaded into the storage module of the data analysis module; The unit module simulation model is a wafer processing mathematical function generated based on the unit module operation data corresponding to the process based on historical data.

3. The quartz wafer welding process control system according to claim 2, characterized in that: The data analysis module loads the shutdown equipment serial number of the system response, adjusts the wafer processing mathematical function parameters affected by the corresponding shutdown equipment serial number as correction parameters, and the data analysis module is used to load the corresponding correction parameters of each unit module according to the shutdown equipment serial number.

4. The quartz wafer welding process control system according to claim 3, characterized in that: The data analysis module adjusts the parameters of the equipment components affecting the unit module in real time according to the correction parameters of the unit module where the shutdown equipment serial number is located, and the data analysis module synchronously adjusts the parameters of the unit module simulation model corresponding to the adjacent process of the process where the shutdown equipment serial number is located.

5. The quartz wafer welding process control system according to claim 4, characterized in that: The data analysis module calls the real-time recording of the internal output data of the machine to calculate the cycle time of the corresponding process, calls the downtime equipment serial number to analyze the change in unit working time of the corresponding unit module, and analyzes the change in production capacity of the process where the downtime equipment serial number is located based on the called data.

6. The quartz wafer welding process control system according to claim 5, characterized in that: The data analysis module accumulates the placement time after processing of different unit modules for production capacity calculation.

7. The quartz wafer welding process control system according to claim 6, characterized in that: The data analysis module is used to calculate the fluctuation of waiting time per unit working time and cycle time in production capacity due to the real-time change of the number of manual workers scanned into the machine room and the data content of the historical manual participation process.

8. The quartz wafer welding process control system according to claim 7, characterized in that: The data analysis module analyzes the OEE data of the corresponding process based on the simulation models of different unit modules, and outputs the production capacity margin and adjustment strategy of the equipment corresponding to the different processes.

9. The quartz wafer welding process control system according to claim 8, characterized in that: After receiving the downtime equipment serial number responded by the system, the data analysis module counts the changes in the data parameters before and after the unit module, analyzes the key parameters affected by the downtime equipment, and uses the average value of the key parameters in the historical machine internal output data to calculate the percentage of parameter change on the production cycle time of the quartz wafer in all processes; First, calculate the percentage increase or decrease of the key parameters compared to the key parameters produced inside the machine, and then calculate the percentage change in the production cycle time after the system responds to the serial number of the stopped equipment; When the serial number of the stopped equipment is expressed as the equipment corresponding to a single process, the impact rate of the shutdown of the equipment in a single process on the production cycle time of the total process of the current production line is calculated. The impact rate is determined by the ratio of the increase or decrease percentage of the key parameters to the change percentage of the production cycle time; When the downtime equipment serial number is represented by equipment corresponding to multiple processes, call the single process impact rate of the associated multiple processes, calculate the impact of the combined process on the production cycle time, and determine the parameters of the impact by calculating the percentage change of the production cycle time. According to the impact parameters, the proportion of the impact rate of different processes is allocated; The impact rate of the output downtime equipment serial number on the production cycle time provides a data reference for evaluating the capacity data and generates a corresponding adjustment strategy. The adjustment strategy is to prioritize the update or maintenance sequence of the corresponding process equipment with a high proportion of the corresponding influencing parameters, among which the downtime equipment is the equipment that needs to be updated or repaired.

10. The quartz wafer welding process control system according to claim 9, characterized in that: The data analysis module takes into account the evaluation time for executing the update or maintenance sequence, and calculates the dynamic data of the production capacity after the equipment with priority execution sequence is put into production.

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