Display panel, manufacturing method of display panel and electronic equipment

Abstract

The embodiment of the invention provides a display panel, a manufacturing method of the display panel and electronic equipment. The display panel comprises a driving back plate, a first electrode and a second electrode, the bonding layer is positioned on one side of the driving back plate; the planarization layer is positioned on one side, far away from the driving back plate, of the bonding layer; and the shading layer is positioned on one side, far away from the driving back plate, of the planarization layer. According to the display panel, the planarization layer is arranged on the bonding layer, and possible unevenness of the bonding layer is counteracted through the planarization layer, so that the flatness of the shading layer arranged on the planarization layer can be effectively improved, and the visual uniformity of the display panel in a screen-off state is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular, to a display panel, a method for manufacturing a display panel, and an electronic device. Background Art

[0002] With the development of display device manufacturing technology, Mini LED and Micro-LED are widely used due to their superior brightness, resolution, contrast, energy consumption, service life, response speed and thermal stability. However, Mini LED or Micro-LED display panels currently have certain defects, resulting in visible white spots, white spots or uneven particles in the non-luminous state, which affects the user experience. Summary of the invention

[0003] In order to overcome the above-mentioned deficiencies in the prior art, the object of the present application is to provide a display panel, the display panel comprising:

[0004] Driver backplane;

[0005] A bonding layer located on one side of the driving backplane;

[0006] A planarization layer located on a side of the bonding layer away from the driving backplane;

[0007] A light shielding layer is located on a side of the planarization layer away from the driving backplane.

[0008] In some possible implementations, the display panel further includes at least one light emitting unit electrically connected to the driving backplane via the bonding layer, and the planarization layer and the light shielding layer include an opening exposing the light emitting unit.

[0009] In some possible implementations, at least a portion of the light-emitting unit protrudes from the bonding layer;

[0010] In the thickness direction of the display panel, a distance from a side of the planarization layer away from the driving backplane to the driving backplane is smaller than a distance from a side of the light emitting unit away from the driving backplane to the driving backplane.

[0011] In some possible implementations, the distance from the side of the light shielding layer away from the driving backplane to the driving backplane is less than or equal to the distance from the side of the light emitting device away from the driving backplane to the driving backplane;

[0012] Preferably, in the thickness direction of the display panel, the distance from the side of the planarization layer away from the driving backplane to the side of the light emitting unit away from the driving backplane is 3 micrometers to 5 micrometers.

[0013] In some possible implementations, the material of the planarization layer includes organic glue.

[0014] Another object of the present application is to provide a method for manufacturing a display panel, the method comprising:

[0015] Providing a drive backplane;

[0016] forming a bonding layer on the driving backplane;

[0017] forming a planarization layer on a side of the bonding layer away from the driving backplane;

[0018] A light shielding layer is formed on a side of the planarization layer away from the driving backplane.

[0019] In some possible implementations, before the step of forming a planarization layer on a side of the bonding layer away from the driving backplane, the method further includes:

[0020] Bonding at least one light-emitting unit to the driving backplane through the bonding layer;

[0021] The step of forming a planarization layer on a side of the bonding layer away from the driving backplane comprises:

[0022] forming a planarization layer covering the bonding layer and exposing the light-emitting unit on a side of the bonding layer away from the driving backplane;

[0023] The step of forming a light shielding layer on a side of the planarization layer away from the driving backplane comprises:

[0024] A planarization layer covering the planarization layer and exposing the light emitting unit is formed on a side of the planarization layer away from the driving backplane.

[0025] In some possible implementations, at least a portion of the light emitting unit protrudes from the bonding layer; after the step of forming a planarization layer covering the bonding layer and exposing the light emitting unit on a side of the bonding layer away from the driving backplane, the method further includes:

[0026] The planarization layer is thinned so that the distance from the side of the planarization layer away from the driving backplane to the driving backplane is smaller than the distance from the side of the light emitting unit away from the driving backplane to the driving backplane.

[0027] Another object of the present application is to provide a method for manufacturing a display panel, the method comprising:

[0028] Providing a drive backplane;

[0029] forming a bonding layer on the driving backplane;

[0030] forming a planarization layer on a side of the bonding layer away from the driving backplane;

[0031] Thinning the planarization layer and the bonding layer as a whole, removing the planarization layer and at least a portion of the bonding layer;

[0032] A light shielding layer is formed on a side of the bonding layer away from the driving backplane.

[0033] Another object of the present application is to provide an electronic device, which includes the display panel provided in the present application or a display panel manufactured by the method for manufacturing the display panel provided in the present application.

[0034] Compared with the prior art, this application has the following beneficial effects:

[0035] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and an electronic device. By providing a planarization layer on a bonding layer, the planarization layer can be used to offset possible unevenness of the bonding layer, thereby effectively improving the flatness of a light-shielding layer provided on the planarization layer, thereby improving the visual uniformity of the display panel when the screen is off. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0037] Figure 1 It is a schematic diagram of a display panel in the prior art;

[0038] Figure 2 One of the schematic diagrams of a display panel provided in an embodiment of the present application;

[0039] Figure 3 A second schematic diagram of a display panel provided in an embodiment of the present application;

[0040] Figure 4 A third schematic diagram of a display panel provided in an embodiment of the present application;

[0041] Figure 5 A fourth schematic diagram of a display panel provided in an embodiment of the present application;

[0042] Figure 6 One of the flow charts of the method for manufacturing a display panel provided in an embodiment of the present application;

[0043] Figure 7 A fifth schematic diagram of a display panel provided in an embodiment of the present application;

[0044] Figure 8 A second schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0045] Fig. 9 This is a sixth schematic diagram of a display panel provided in an embodiment of the present application.

[0046] Icon: 100-driving backplane; 200-bonding layer; 300-light-emitting unit; 400-planarization layer; 500-light-shielding layer. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0048] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0049] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0050] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0051] See also Figure 1 In some Mini LED or Micro-LED display panels, a bonding layer 200' is provided on the driving backplane 100', and the light-emitting unit 300' is bonded to the driving backplane 100' through the bonding layer 200', thereby achieving electrical connection between the light-emitting unit 300' and the driving backplane 100'. After the light-emitting unit 300' is bonded, in order to improve the contrast of the display panel, a light-shielding layer 500' needs to be provided between the light-emitting units 300'.

[0052] However, there may be uneven areas on the surface of the driving backplane 100' or the bonding layer 200' may produce uneven areas during the pressure bonding process, and the material of the light-shielding layer 500' usually has insufficient fluidity, resulting in certain unevenness in the light-shielding layer 500', which in turn leads to visual adverse effects such as visible white spots, white spots or uneven particles in the non-luminous state, affecting the user experience.

[0053] In view of this, this embodiment provides a solution that can reduce the risk of the above-mentioned problem. The solution provided by this embodiment is described in detail below.

[0054] See also Figure 2 , Figure 2 This is a schematic diagram of a display panel provided in this embodiment. The display panel may include a driving backplane 100 , a bonding layer 200 , a planarization layer 400 and a light shielding layer 500 .

[0055] The driving backplane 100 may include a thin film transistor (TFT) array backplane, including a plurality of driving units distributed in an array, and the driving units are used to drive the light-emitting unit 300 to emit light. At least one or a pair of bonding electrodes may be provided on one side of the driving backplane 100, and the bonding electrodes are used to be electrically connected to the light-emitting unit 300.

[0056] The bonding layer 200 is located on one side of the driving backplane 100. For example, the bonding layer 200 is located on the side of the driving backplane 100 where the bonding electrodes are disposed. Optionally, in this embodiment, the bonding layer 200 may include an anisotropic conductive film (ACF).

[0057] The planarization layer 400 may be located on a side of the bonding layer 200 away from the driving backplane 100. In this embodiment, compared with the bonding layer 200, the planarization layer 400 may be made of a material with relatively high fluidity, and during the process of setting the planarization layer 400, the planarization layer 400 itself may flow flat to fill and offset the uneven areas on the bonding layer 200.

[0058] The light shielding layer 500 is located on a side of the planarization layer 400 away from the driving backplane 100. The light shielding layer 500 may be made of a light-proof or light-poorly transparent material, for example, the light shielding layer 500 may be formed by printing with black ink.

[0059] Based on the above design, in this embodiment, by setting the planarization layer 400 on the bonding layer 200, the planarization layer 400 can offset the possible unevenness of the bonding layer 200, and the flatness of the shading layer 500 set on the planarization layer 400 can be effectively improved, thereby improving the visual uniformity of the display panel in the screen-off state.

[0060] For some possible implementations, please refer again to Figure 2 The display panel further includes at least one light emitting unit 300 electrically connected to the driving backplane 100 through the bonding layer 200 , and the planarization layer 400 and the light shielding layer 500 include an opening exposing the light emitting unit 300 .

[0061] For example, in this embodiment, after forming the bonding layer 200, at least one of the light-emitting units 300 may be transferred onto the bonding layer 200, and then the light-emitting unit 300 may be bonded to the driving backplane 100 through the bonding layer 200 by pressure bonding. After the bonding of the light-emitting unit 300 is completed, a planarization layer 400 may be disposed on the bonding layer 200, so that the planarization layer 400 covers the bonding layer 200 and exposes the light-emitting unit 300. Then, a light-shielding layer 500 may be disposed on the planarization layer 400, so that the light-shielding layer 500 covers the planarization layer 400 and exposes the light-emitting unit 300.

[0062] For some possible implementations, see Figure 3 , at least a portion of the light emitting unit 300 protrudes from the bonding layer 200. In the thickness direction of the display panel, the distance H1 from the side of the planarization layer 400 away from the driving backplane 100 to the driving backplane 100 is smaller than the distance H2 from the side of the light emitting unit 300 away from the driving backplane 100 to the driving backplane 100. In this way, after the light shielding layer 500 is set, the light emitting effect of the light emitting unit 300 is not affected because the height of the light shielding layer 500 is higher than the height of the light emitting unit 300.

[0063] In this case, please refer to Figure 4 After the light shielding layer 400 is provided, the distance H3 from the side of the light shielding layer 400 away from the driving backplane 100 to the driving backplane 100 is less than or equal to the distance H2 from the side of the light emitting unit 300 away from the driving backplane 100 to the driving backplane 100. In this way, the light shielding layer 400 will not block the light emitting unit 300.

[0064] For further information, please refer to Figure 5In some possible implementations, in the thickness direction of the display panel, a distance H4 from a side of the planarization layer 400 away from the driving backplane 100 to a side of the light emitting unit 300 away from the driving backplane 100 is 3 microns to 5 microns.

[0065] In this case, the thickness H5 of the light shielding layer 400 may be less than or equal to the distance H4 from the side of the planarization layer 400 away from the driving backplane 100 to the side of the light emitting unit 300 away from the driving backplane 100 .

[0066] In some possible implementations, the material of the planarization layer 400 includes an organic glue. Thus, after the planarization layer 400 is provided, the planarization layer 400 may be thinned by ashing the organic material.

[0067] See also Figure 6 , Figure 6 The present embodiment also provides a schematic flow chart of a method for manufacturing a display panel. The method may include the following steps.

[0068] Step S110 , providing a driving backplane 100 .

[0069] Step S120 , forming a bonding layer 200 on the driving backplane 100 .

[0070] Step S130 , forming a planarization layer 400 on a side of the bonding layer 200 away from the driving backplane 100 .

[0071] In step S140 , a light shielding layer 500 is formed on a side of the planarization layer 400 away from the driving backplane 100 .

[0072] In this way, by setting the planarization layer 400 on the bonding layer 200 and offsetting the possible unevenness of the bonding layer 200 through the planarization layer 400, the flatness of the shading layer 500 set on the planarization layer 400 can be effectively improved, thereby improving the visual uniformity of the display panel in the screen-off state.

[0073] In some possible implementations, before step S130 , the method further bonds at least one light emitting unit 300 to the driving backplane 100 via the bonding layer 200 .

[0074] In step S130, a planarization layer 400 covering the bonding layer 200 and exposing the light emitting unit 300 may be formed on the side of the bonding layer 200 away from the driving backplane 100. For example, a patterned planarization layer 400 exposing the light emitting unit 300 may be formed on the bonding layer 200 by using a corresponding mask.

[0075] In step S140, a planarization layer 400 covering the planarization layer 400 and exposing the light emitting unit 300 may be formed on the side of the planarization layer 400 away from the driving backplane 100. For example, the light shielding layer 500 may be formed on the planarization layer 400 by ink printing using a corresponding mask.

[0076] In some possible implementations, at least a portion of the light emitting unit 300 protrudes from the bonding layer 200. Figure 7 After step S130, the planarization layer 400 may be thinned so that the distance from the side of the planarization layer 400 away from the driving backplane 100 to the driving backplane 100 is smaller than the distance from the side of the light emitting unit 300 away from the driving backplane 100 to the driving backplane 100.

[0077] For example, the material of the planarization layer 400 may include organic glue. After step S130 , the planarization layer 400 may be ashed to reduce the thickness of the planarization layer 400 .

[0078] After the planarization layer 400 is thinned, step S140 is performed to form a light shielding layer 500 on the side of the thinned planarization layer 400 away from the driving backplane 100. In this way, the height of the light shielding layer 500 can be prevented from being greater than the height of the light emitting unit 300.

[0079] Please refer to Figure 8 , Figure 8 A schematic flow chart of another method for manufacturing a display panel provided in this embodiment, the method may include the following steps.

[0080] Step S210: providing a driving backplane 100.

[0081] Step S220 , forming a bonding layer 200 on the driving backplane 100 .

[0082] Step S230 , forming a planarization layer 400 on a side of the bonding layer 200 away from the driving backplane 100 .

[0083] Step S240 , thinning the planarization layer 400 and the bonding layer 200 as a whole, and removing the planarization layer 400 and at least a portion of the bonding layer 200 .

[0084] Step S250 , forming a light shielding layer 500 on a side of the bonding layer 200 away from the driving backplane 100 .

[0085] For example, see Fig. 9After the planarization layer 400 with a relatively high surface flatness is formed in step S230, the planarization layer 400 and the bonding layer 200 can be thinned as a whole in step S240. Since the planarization layer 400 is located above the bonding layer 200, the planarization layer 400 will be gradually removed first during the gradual thinning process, and then part of the bonding layer 200 will be removed. In addition, the surface of the planarization layer 400 is relatively flat before thinning. After uniform thinning, the side of the bonding layer 200 that is retained away from the driving backplane 100 is also relatively flat. In this way, the light shielding layer 500 is formed on the relatively flat bonding layer 200 to improve the flatness of the light shielding layer 500, thereby improving the visual uniformity of the display panel in the off state.

[0086] This embodiment also provides an electronic device, which may include the display panel provided in this embodiment or the display panel manufactured by the method. The electronic device may include a display, a spliced ​​display screen, a mobile phone, a tablet computer, a laptop computer, a television, or other device with a display function.

[0087] In summary, the embodiments of the present application provide a display panel, a method for manufacturing a display panel, and an electronic device. By setting a planarization layer on the bonding layer and using the planarization layer to offset possible unevenness in the bonding layer, the flatness of the shading layer set on the planarization layer can be effectively improved, thereby improving the visual uniformity of the display panel when the screen is off.

[0088] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0089] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: The display panel comprises: Driver backplane; A bonding layer located on one side of the driving backplane; A planarization layer located on a side of the bonding layer away from the driving backplane; A light shielding layer is located on a side of the planarization layer away from the driving backplane.

2. The display panel according to claim 1, characterized in that: The display panel further includes at least one light emitting unit electrically connected to the driving backplane through the bonding layer, and the planarization layer and the light shielding layer include an opening exposing the light emitting unit.

3. The display panel according to claim 2, characterized in that: At least a portion of the light emitting unit protrudes from the bonding layer; In the thickness direction of the display panel, the distance from the side of the planarization layer away from the driving backplane to the driving backplane is smaller than the distance from the side of the light emitting unit away from the driving backplane to the driving backplane; Preferably, in the thickness direction of the display panel, the distance from the side of the planarization layer away from the driving backplane to the side of the light emitting unit away from the driving backplane is 3 micrometers to 5 micrometers.

4. The display panel according to claim 3, characterized in that: The distance from the side of the light shielding layer away from the driving backplane to the driving backplane is less than or equal to the distance from the side of the light emitting unit away from the driving backplane to the driving backplane.

5. The display panel according to claim 1, characterized in that: The material of the planarization layer includes organic glue.

6. A method for manufacturing a display panel, characterized in that: The method comprises: Providing a drive backplane; forming a bonding layer on the driving backplane; forming a planarization layer on a side of the bonding layer away from the driving backplane; A light shielding layer is formed on a side of the planarization layer away from the driving backplane.

7. The method according to claim 6, characterized in that Before the step of forming a planarization layer on a side of the bonding layer away from the driving backplane, the method further comprises: Bonding at least one light-emitting unit to the driving backplane through the bonding layer; The step of forming a planarization layer on a side of the bonding layer away from the driving backplane comprises: forming a planarization layer covering the bonding layer and exposing the light-emitting unit on a side of the bonding layer away from the driving backplane; The step of forming a light shielding layer on a side of the planarization layer away from the driving backplane comprises: A planarization layer covering the planarization layer and exposing the light emitting unit is formed on a side of the planarization layer away from the driving backplane.

8. The method according to claim 7, characterized in that At least a portion of the light emitting unit protrudes from the bonding layer; after the step of forming a planarization layer covering the bonding layer and exposing the light emitting unit on a side of the bonding layer away from the driving backplane, the method further comprises: The planarization layer is thinned so that the distance from the side of the planarization layer away from the driving backplane to the driving backplane is smaller than the distance from the side of the light emitting unit away from the driving backplane to the driving backplane.

9. A method for manufacturing a display panel, characterized in that: The method comprises: Providing a drive backplane; forming a bonding layer on the driving backplane; forming a planarization layer on a side of the bonding layer away from the driving backplane; Thinning the planarization layer and the bonding layer as a whole, removing the planarization layer and at least a portion of the bonding layer; A light shielding layer is formed on a side of the bonding layer away from the driving backplane.

10. An electronic device, characterized in that: The electronic device comprises the display panel according to any one of claims 1 to 5 or the display panel manufactured by the method according to any one of claims 6 to 9.

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