Probe socket for testing memory chip and testing method thereof

Abstract

The invention relates to the technical field of probe sockets, in particular to a probe socket for testing a memory chip and a testing method thereof.The probe socket comprises an upper cover plate, a probe cover and a lower base, the upper cover plate is arranged above the lower base, the probe cover is arranged between the upper cover plate and the lower base, a containing groove used for containing a chip is formed in the upper portion of the upper cover plate, and the probe cover is arranged in the containing groove. The probe socket comprises a lower base and an upper cover plate, a placement groove is formed in the upper cover plate, first probe holes are formed in the bottom of the placement groove in a penetrating mode, a clamping mechanism used for clamping a chip is arranged on the upper cover plate, and the clamping mechanism is in transmission connection between the upper cover plate and the lower base. And the probe cover is driven to move downwards, so that the clamping mechanism clamps the to-be-tested chip in the placement groove, the probe on the probe plate is in contact with the to-be-tested chip, the other end of the probe is downwards inserted into the hole site of the test machine, and the chip can be ensured to be in a to-be-tested state and the chip detection is ensured to be stable and reliable by matching with the buckle structure.

Description

Technical Field

[0001] The present invention relates to the technical field of probe sockets, and in particular to a probe socket for testing a memory chip and a testing method thereof. Background Art

[0002] In electronic information engineering, memory chips are the top priority of electronic information work. With the gradual development of society, the chip signal transmission speed is getting faster and faster, the chip detection conditions are more diversified, and various high-tech electronic resources can be used. The development of new probe sockets for testing memory chips is also imminent. In the design of printed circuit board assembly, it is mainly based on the designed circuit drawings, through chemical etching, laser cutting and other methods, to make printed circuit boards with specific circuit layouts on copper or aluminum plates. The selection and layout of memory chips have an important impact on the performance, stability and reliability of the product. The traditional way of testing memory chips is difficult to protect the probe pins, and the device is easily damaged. At the same time, due to the lack of auxiliary telescopic structures, traditional products are prone to slippage, high cost, and low yield. Summary of the invention

[0003] The technical problem to be solved by the present invention is: in order to solve the problems that the traditional method of testing memory chips is difficult to protect the probe pins and the device is easily damaged. At the same time, due to the lack of an auxiliary telescopic structure, the traditional products are easy to slip, the cost is high, and the yield rate is low. A probe socket for testing memory chips and a testing method thereof are now provided.

[0004] The technical solution adopted by the present invention to solve its technical problem is: a probe socket for testing a storage chip, comprising an upper cover plate, a probe cover and a lower base, wherein the upper cover plate is arranged above the lower base, the probe cover is arranged between the upper cover plate and the lower base, a placement groove for placing a chip is arranged above the upper cover plate, a bottom array of the placement groove has a first probe hole arranged through, a clamping mechanism for clamping the chip is arranged on the upper cover plate, the clamping mechanism is transmission-connected between the upper cover plate and the lower base, a second probe hole is arranged through on the probe cover, and the first probe hole and the second probe hole are arranged through. The holes are arranged in a one-to-one correspondence, a probe is arranged in the second probe hole, a channel for the probe to pass through is arranged on the lower base, the channel extends from the upper surface of the lower base to the lower bottom surface, one end of the channel close to the second probe hole is arranged opposite to the second probe hole, the second probe hole is located between the first probe hole and the channel, a reset spring for resetting is arranged between the lower base and the probe cover, a buckle mechanism for limiting the displacement range of the probe cover is arranged between the lower base and the probe cover, and the buckle mechanism is used to keep the probe cover and the lower base in a pressed state and keep the probe in contact with the pin of the chip at all times; The snap mechanism includes a rocker arm hinged on the probe cover, a slide groove is provided on the lower base, a slider matching the slide groove is provided on the rocker arm, the slider is arranged in the slide groove, the slide groove has a snap-fit ​​section, a first guide section, a sliding section and a second guide section which are arranged in sequence and connected end to end to form a closed annular structure, the snap-fit ​​section is used to clamp the slider and prevent it from displacement, the first guide section is used to guide the slider in the snap-fit ​​section to the sliding section, the sliding section is used to guide the slider to the second guide section, the second guide section is used to guide the slider into the snap-fit ​​section, and a tension spring is provided between the lower base and the probe cover. Compared with the prior art, this solution presses the upper cover plate and drives the probe cover to move downward, so that the clamping mechanism clamps the chip to be tested in the placement slot, and the probe on the probe cover contacts the chip to be tested. At the same time, the other end of the probe is inserted downward into the hole of the test machine, and cooperates with the snap-fit ​​structure to ensure that the chip is in a state to be tested, and ensure that the chip detection is stable and reliable. At the same time, the socket can protect the probe pins from being exposed to the outside, and has good detection retention capabilities to meet the special conditions required for different chip detections, thereby improving the quality of the product. The added snap-fit ​​structure improves the adaptability of the device under different detection conditions and effectively solves the problem of easy slippage.

[0005] In order to realize the specific structure of the slide groove, some preferred embodiments are that the first guide section is a first inclined plane which is gradually inclined upward, the second guide section is a second inclined plane which is gradually inclined downward, the lower end of the first inclined plane is correspondingly connected to the lower end of the second inclined plane, and a clamping section is formed at the connection between the lower end of the first inclined plane and the lower end of the second inclined plane, one end of the sliding section is connected to the high end of the first inclined plane, and the other end of the sliding section is connected to the high end of the second inclined plane.

[0006] In order to realize the clamping mechanism, some preferred embodiments include a telescopic clamp, a first rack, a gear, a second rack and a first spring, wherein the telescopic clamp is relatively and slidably arranged on the upper cover plate, the telescopic clamp is located above the placement slot, the first rack is slidably arranged on the upper cover plate along the displacement direction of the upper cover plate, the gear is rotatably mounted on the upper cover plate, the gear is meshed with the first rack, the second rack is slidably mounted on the upper cover plate along the length direction of the placement slot, the second rack is meshed with the gear, the telescopic clamp is fixed on the second rack, one end of the first spring is arranged on the lower base, the other end of the first spring is arranged on the first rack, and the first spring is located between the first rack and the lower base. The clamping mechanism is linked with the lower base through the upper cover plate to control the displacement of the telescopic clamp and clamp the chip to be tested, so as to keep the chip stable and reliable during testing and prevent the chip from being displaced and causing test failure.

[0007] In order to achieve displacement of the first rack on the upper cover, in some preferred embodiments, a first slideway matching the first rack is provided on the upper cover, and the first rack is slidably arranged in the first slideway.

[0008] In some preferred embodiments, one end of the first spring is fixed to the lower base, and the other end of the first spring passes through the first slideway and is fixed to the bottom of the first rack. By compressing the first spring and providing power for the displacement of the first rack, the clamping mechanism is driven to move and clamp or release the chip to be tested.

[0009] In order to enable the telescopic clamp to slide on the upper cover, in some preferred embodiments, an upper slideway matching the telescopic clamp is provided on the upper cover, one end of the upper slideway is connected to the placement groove, and the telescopic clamp is slidably arranged in the upper slideway.

[0010] In order to ensure that the chip to be tested is clamped stably and reliably, in some preferred embodiments, the cross-sectional area of ​​the telescopic clamp gradually decreases from the other end of the upper slideway to one end thereof. The cross-sectional area of ​​the telescopic clamp gradually decreases, which ensures that the telescopic clamp slides stably and reliably on the upper cover plate on the one hand, and that the telescopic clamp clamps the chip to be tested stably and reliably on the other hand.

[0011] In some preferred embodiments, there are two groups of the clamping mechanisms, and the two groups of the clamping mechanisms are arranged oppositely on two sides of the placement slot.

[0012] In order to realize the limiting mechanism, in some preferred embodiments, the limiting mechanism includes a limiting block arranged on the probe cover, a limiting groove is arranged on the lower base along the displacement direction of the probe cover, and the limiting block is arranged in the limiting groove.

[0013] A testing method using a memory chip testing probe socket as described above comprises the following steps: S1. Place the chip to be tested in the placement groove of the upper cover plate, and then slowly press the upper cover plate downward, so that the slider at one end of the swing rod slides in the slide groove, and moves from the sliding section to the second guide section, and then passes through the second guide section into the clamping section to achieve position locking between the lower base and the probe cover. At the same time, the clamping mechanism clamps the chip to be tested; S2, one end of the probe on the probe cover moves vertically downward and gradually extends out of the lower base and inserts into the test machine hole. Each probe is opened and clamps the chip pin. At this time, the wafer under test detection work begins; S3, after the chip detection is completed, press the upper cover down again; S4, the slider on the swing rod moves from the clamping section to the first guide section, and then moves from the first guide section to the sliding section, and the upper cover plate and the probe cover rebound upward; S5, the clamping mechanism releases the chip to be tested and finally returns to the initial state.

[0014] The beneficial effects of the present invention are as follows: when a probe socket for testing a memory chip and a testing method thereof are used, the upper cover plate is pressed and the probe cover is driven to move downward, so that the upper cover plate, the probe cover and the lower base are relatively displaced and the transmission is triggered, so that the clamping mechanism clamps the chip to be tested in the placement slot, and the probe on the probe cover contacts the chip to be tested. At the same time, the other end of the probe is inserted downward into the hole of the test machine, and the buckle structure is used to ensure that the chip is in a state to be tested, and the chip detection is stable and reliable. At the same time, the socket can protect the probe pins from being exposed to the outside, and has a good detection retention capability to meet the special conditions required for different chip detections, thereby improving the quality of the product. The added buckle structure improves the adaptability of the device under different detection conditions, effectively solves the problem of easy slipping, reduces the cost of use, ensures the detection yield, and avoids the problem that the traditional method of testing memory chips is difficult to protect the probe pins and the device is easy to be damaged. At the same time, due to the lack of an auxiliary telescopic structure, traditional products are easy to slip, have high costs, and have low yields. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention is further described below in conjunction with the accompanying drawings and embodiments.

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a front view of the present invention; Figure 3 It is a left side view of the present invention; Figure 4 is a top view of the present invention; Figure 5 yes Figure 2 Middle AA section view; Figure 6 The schematic diagram of the buckle mechanism structure of the probe cover and the lower base in the present invention is Figure 1 ; Figure 7 The schematic diagram of the buckle mechanism structure of the probe cover and the lower base in the present invention is Figure 2 .

[0017] In the figure: 1, upper cover plate, 2, probe cover, 3, lower base, 4, placement groove, 5, first probe hole, 6, clamping mechanism, 7, second probe hole, 8, channel, 9, reset spring, 10, rocker arm, 11, slide groove, 12, slider, 13, clamping section, 14, first guide section, 15, sliding section, 16, second guide section, 17, tension spring, 18, telescopic clamp, 19, first rack, 20, gear, 21, second rack, 22, first spring, 23, first slide, 24, upper slide. DETAILED DESCRIPTION

[0018] The present invention is further described in detail below in conjunction with embodiments: The present invention is not limited to the following specific embodiments. A person skilled in the art can implement the present invention in various other specific embodiments according to the contents disclosed in the present invention, or any simple changes or modifications made to the design structure and ideas of the present invention fall within the protection scope of the present invention. It should be noted that the embodiments and features in the embodiments of the present invention can be combined with each other without conflict.

[0019] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and the like are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", and the like may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0020] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0021] Embodiment 1, as Figure 1-7As shown, a probe socket for testing a memory chip comprises an upper cover plate 1, a probe cover 2 and a lower base 3, wherein the lower base 3 has an octagonal cross section and is convex as a whole, the upper cover plate 1 is arranged above the lower base 3, the probe cover 2 is arranged between the upper cover plate 1 and the lower base 3, a placement groove 4 is arranged above the upper cover plate 1, the placement groove 4 is used to place a chip, and a first probe hole 5 is arranged through the bottom array of the placement groove 4, a clamping mechanism 6 is arranged on the upper cover plate 1, the clamping mechanism 6 is used to clamp the chip to be tested in the placement groove 4, the clamping mechanism 6 is transmission-connected between the upper cover plate 1 and the lower base 3, the probe cover 2 has a second probe hole 7 arranged through the array, and the first probe hole 5 and the second probe hole 7 are arranged in a one-to-one correspondence, a probe is arranged in the second probe hole 7, a channel 8 is arranged on the lower base 3, the channel 8 is used for the probe to pass through, the channel 8 extends from the upper surface of the lower base 3 to the lower bottom surface, the end of the channel 8 close to the second probe hole 7 is arranged opposite to the second probe hole 7, the second probe hole 7 is located between the first probe hole 5 and the channel 8, a reset spring 9 is arranged between the lower base 3 and the probe cover 2, the reset spring 9 is used for the lower base 3 and the probe cover 2 to reset, a buckle mechanism is arranged between the lower base 3 and the probe cover 2, the buckle mechanism is used to keep the probe cover 2 and the lower base 3 in a downwardly pressed state and keep the probe in contact with the pins of the chip at all times; The snap mechanism includes a rocker arm 10 hinged on the probe cover 2, a slide groove 11 is provided on the lower base 3, a slider 12 matching the slide groove 11 is provided on the rocker arm 10, the slider 12 is arranged in the slide groove 11, the slide groove 11 has a snap-fit ​​section 13, a first guide section 14, a sliding section 15 and a second guide section 16 which are arranged in sequence and connected end to end to form a closed annular structure, the snap-fit ​​section 13 is used to clamp the slider 12 and prevent it from displacement, the first guide section 14 is used to guide the slider 12 in the snap-fit ​​section 13 to the sliding section 15, the sliding section 15 is used to guide the slider 12 to the second guide section 16, and the second guide section 16 is used to guide the slider 12 into the snap-fit ​​section 13, a tension spring 17 is provided between the lower base 3 and the probe cover 2, the tension spring 17 is used to always keep the slider 12 in a snap-fit ​​state or a sliding state, that is, the slider 12 is always located in the snap-fit ​​section 13 or in the sliding section 15.

[0022] The first guide section 14 is a first inclined surface that is gradually inclined upward, and the second guide section 16 is a second inclined surface that is gradually inclined downward. The lower end of the first inclined surface is correspondingly connected to the lower end of the second inclined surface, and the connection between the lower end of the first inclined surface and the lower end of the second inclined surface forms a clamping section 13. One end of the sliding section 15 is connected to the high end of the first inclined surface, and the other end of the sliding section 15 is connected to the high end of the second inclined surface.

[0023] The clamping mechanism 6 includes a telescopic clamp 18, a first rack 19, a gear 20, a second rack 21 and a first spring 22. An upper slide 24 is provided on the upper cover 1. The upper slide 24 matches the telescopic clamp 18. One end of the upper slide 24 is connected to the placement groove 4. The telescopic clamp 18 is slidably arranged in the upper slide 24. The cross-sectional area of ​​the telescopic clamp 18 gradually decreases from the other end of the upper slide 24 to one end thereof. The clamping mechanism 6 has two groups. The two groups of clamping mechanisms 6 are relatively arranged on both sides of the placement groove 4, so that the telescopic clamp 18 is relatively and slidably arranged on the upper cover 1. The telescopic clamp 18 is located above the placement groove 4. A first slide 23 is provided on the upper cover 1. The first slide 2 3 matches the first rack 19, the first rack 19 is slidably arranged in the first slideway 23, and the first rack 19 is slidably arranged on the upper cover 1 along the displacement direction of the upper cover 1. The gear 20 is rotatably installed on the upper cover 1, the gear 20 is meshed with the first rack 19, the second rack 21 is slidably installed on the upper cover 1 along the length direction of the placement groove 4, the second rack 21 is meshed with the gear 20, the telescopic clamp 18 is fixed on the second rack 21, one end of the first spring 22 is fixed on the lower base 3, the other end of the first spring 22 passes through the first slideway 23 and is fixed to the bottom of the first rack 19, and the first spring 22 is located between the first rack 19 and the lower base 3.

[0024] The limiting mechanism comprises a limiting block arranged on the probe cover 2 , a limiting groove is arranged on the lower base 3 along the displacement direction of the probe cover 2 , and the limiting block is arranged in the limiting groove.

[0025] Embodiment 2 is a test method of the embodiment, specifically: a test method using a probe socket for testing a memory chip as described above, comprising the following steps:

[0026] S1. Place the chip to be tested in the placement groove 4 of the upper cover plate 1, then slowly press the upper cover plate 1 downward, and drive the slider 12 at one end of the swing rod 10 on the lower base 3 to slide in the slide groove 11 on the probe cover 2. The slider 12 moves from the sliding section 15 of the slide groove 11 to the second guide section 16, and then passes through the second guide section 16 to enter the clamping section 13, so as to achieve position locking between the lower base 3 and the probe cover 2, and under the action of the tension spring 17, the slider 12 is always kept in the clamping section 13. At the same time, the first spring 22 drives the first rack 19 to slide in the first slideway 23, and the first rack 19 drives the gear 20 to rotate, and the gear 20 drives the second rack 21 to slide on the upper cover plate 1, and the second rack 21 drives the corresponding telescopic clamp 18 to slide in the upper slideway 24, so as to achieve the telescopic clamps 18 on both sides clamping the chip to be tested; S2, the lower end of the probe on the probe cover 2 moves vertically downward and gradually extends out of the lower base 3 and is inserted into the test machine hole. The upper end of each probe is opened and clamps the chip pin. At this time, the wafer under test detection work begins; S3, after the chip detection is completed, the upper cover plate 1 is pressed downward again, and then the force applied to the upper cover plate 1 is gradually reduced; S4, the upper cover plate 1 is controlled to continue to move downward, and the probe cover 2 is driven to move. At the same time, the slider 12 on the swing rod 10 enters the first guide section 14 from the clamping section 13, and then enters the sliding section 15 from the first guide section 14. Then, under the action of the reset spring 9 and the first spring 22, the upper cover plate 1 and the probe cover 2 rebound upward; S5, the clamping mechanism 6 releases the chip to be tested and finally returns to the initial state.

[0027] When the above-mentioned probe socket for testing a memory chip and the testing method thereof are in use, the upper cover plate 1, the probe cover 2 and the lower base 3 are linked to each other and drive the clamping mechanism 6 to move, mainly relying on a series of movements generated by the movement of the upper cover plate 1. The displacement difference between the upper cover plate 1 and the lower base 3 is used to protect the fragile probe from being directly exposed to the air. The snap mechanism solves the problems of the device being easy to slip off and the low yield rate after the upper end cover is pressed down. The clamping force of the clamping mechanism 6 mainly relies on the force provided by the compression of the first spring 22 when pressed down. This force is fed back to the telescopic clamp 18 through the first rack 19, the gear 20 and the second rack 21 in turn.

[0028] The above-mentioned ideal embodiments of the present invention are for inspiration. Through the above-mentioned description, relevant staff can make various changes and modifications without departing from the technical idea of ​​the present invention. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A probe socket for testing a memory chip, characterized in that: The invention comprises an upper cover plate (1), a probe cover (2) and a lower base (3), wherein the upper cover plate (1) is arranged above the lower base (3), the probe cover (2) is arranged between the upper cover plate (1) and the lower base (3), a placement groove (4) for placing a chip is arranged above the upper cover plate (1), the bottom array of the placement groove (4) has a first probe hole (5) arranged through it, the upper cover plate (1) is provided with a clamping mechanism (6) for clamping the chip, the clamping mechanism (6) is transmission-connected between the upper cover plate (1) and the lower base (3), the upper array of the probe cover (2) has a second probe hole (7) arranged through it, the first probe hole (5) and the second probe hole (7) are arranged one-to-one, and the second probe hole (5) and the second probe hole (7) are arranged one-to-one. A probe is arranged in the hole (7); a channel (8) for the probe to pass through is arranged on the lower base (3); the channel (8) extends from the upper surface of the lower base (3) to the lower bottom surface; an end of the channel (8) close to the second probe hole (7) is arranged opposite to the second probe hole (7); the second probe hole (7) is located between the first probe hole (5) and the channel (8); a reset spring (9) for resetting is arranged between the lower base (3) and the probe cover (2); a buckle mechanism for limiting the displacement range of the probe cover (2) is arranged between the lower base (3) and the probe cover (2); the buckle mechanism is used to keep the probe cover (2) and the lower base (3) in a pressed state and to keep the probe in contact with the pin of the chip at all times; The snap mechanism comprises a swing rod (10) hinged on the probe cover (2); a slide groove (11) is arranged on the lower base (3); a slider (12) matching the slide groove (11) is arranged on the swing rod (10); the slider (12) is arranged in the slide groove (11); the slide groove (11) comprises a clamping section (13), a first guide section (14), a sliding section (15) and a second guide section (16) which are arranged in sequence and connected end to end to form a closed annular structure; the clamping section (13) is used to clamp the slider (12) and prevent it from displacement; the first guide section (14) is used to guide the slider (12) in the clamping section (13) to the sliding section (15); the sliding section (15) is used to guide the slider (12) to the second guide section (16); the second guide section (16) is used to guide the slider (12) into the clamping section (13); and a tension spring (17) is arranged between the lower base (3) and the probe cover (2).

2. A memory chip test probe socket according to claim 1, characterized in that: The first guide section (14) is a first inclined surface that is gradually inclined upward, the second guide section (16) is a second inclined surface that is gradually inclined downward, the lower end of the first inclined surface is correspondingly connected to the lower end of the second inclined surface, and the connection between the lower end of the first inclined surface and the lower end of the second inclined surface forms a clamping section (13), one end of the sliding section (15) is connected to the high end of the first inclined surface, and the other end of the sliding section (15) is connected to the high end of the second inclined surface.

3. The memory chip test probe socket according to claim 1, characterized in that: The clamping mechanism (6) comprises a telescopic clamp (18), a first rack (19), a gear (20), a second rack (21) and a first spring (22); the telescopic clamp (18) is relatively and slidably arranged on the upper cover plate (1); the telescopic clamp (18) is located above the placement groove (4); the first rack (19) is slidably arranged on the upper cover plate (1) along the displacement direction of the upper cover plate (1); the gear (20) is rotatably mounted on the upper cover plate (1); the gear (20) and the first gear (21) are rotatably mounted on the upper cover plate (1); The second rack (21) is slidably mounted on the upper cover plate (1) along the length direction of the placement groove (4), the second rack (21) is meshed with the gear (20), the telescopic clamp (18) is fixed on the second rack (21), one end of the first spring (22) is arranged on the lower base (3), the other end of the first spring (22) is arranged on the first rack (19), and the first spring (22) is located between the first rack (19) and the lower base (3).

4. A memory chip test probe socket according to claim 3, characterized in that: The upper cover plate (1) is provided with a first slideway (23) matching the first rack (19), and the first rack (19) is slidably arranged in the first slideway (23).

5. The memory chip test probe socket according to claim 4, characterized in that: One end of the first spring (22) is fixed on the lower base (3), and the other end of the first spring (22) passes through the first slideway (23) and is fixed to the bottom of the first rack (19).

6. The memory chip test probe socket according to claim 3, characterized in that: An upper slideway (24) matching the telescopic clamp (18) is provided on the upper cover plate (1), one end of the upper slideway (24) is connected to the placement groove (4), and the telescopic clamp (18) is slidably disposed in the upper slideway (24).

7. The memory chip test probe socket according to claim 6, characterized in that: The cross-sectional area of ​​the telescopic clamp (18) gradually decreases along the other end of the upper slideway (24) toward one end thereof.

8. A memory chip test probe socket according to any one of claims 1 to 7, characterized in that: There are two groups of the clamping mechanisms (6), and the two groups of the clamping mechanisms (6) are arranged oppositely on two sides of the placement groove (4).

9. The memory chip test probe socket according to claim 1, characterized in that: The limiting mechanism comprises a limiting block arranged on the probe cover (2); a limiting groove is arranged on the lower base (3) along the displacement direction of the probe cover (2); and the limiting block is arranged in the limiting groove.

10. A testing method using a memory chip testing probe socket as claimed in any one of claims 1 to 9, characterized in that: The steps include: S1, placing the chip to be tested in the placement groove (4) of the upper cover (1), and then slowly pressing the upper cover (1) downward, the slider (12) at one end of the swing rod (10) slides in the slide groove (11), and moves from the sliding section (15) to the second guide section (16), and then passes through the second guide section (16) into the clamping section (13), so as to achieve position locking between the lower base (3) and the probe cover (2), and at the same time, the clamping mechanism (6) clamps the chip to be tested; S2, one end of the probe on the probe cover (2) moves vertically downward and gradually extends out of the lower base (3) and is inserted into the hole of the test machine. Each probe is opened and clamps the chip pin, and the wafer under test detection work starts at this time; S3, after the chip detection is completed, press the upper cover plate (1) downward again; S4, the sliding block (12) on the swing rod (10) enters the first guide section (14) from the clamping section (13), and then enters the sliding section (15) from the first guide section (14), and the upper cover plate (1) and the probe cover (2) rebound upward; S5, the clamping mechanism (6) releases the chip to be tested and finally returns to the initial state.

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