Method and device for improving heat dissipation and cooling performance of encapsulated transformer or reactor

Abstract

The invention relates to the technical field of transformers or electric reactors, in particular to a method for improving heat dissipation and cooling performance of a potting type transformer or electric reactor, a plurality of device water-cooling plates are arranged close to a heat source in a shell, and the device water-cooling plates are lengthened to form lengthened sections extending to the outer side of the shell. The water cooling pipe is arranged on the lengthened section and located on the outer side of the shell, the device water cooling plate is tightly attached to the side face of a heat source in the shell or the upper end and the lower end of the heat source in the shell, and the bottom confluence plate assembly is arranged at the lower end of the shell. After the product body structure is completed, potting is carried out, and after potting is completed, a water cooling pipe is connected to the outer side of the shell. The invention further provides a device for improving the heat dissipation and cooling performance of the encapsulated transformer or the reactor, the product designed by the scheme is light in weight and small in size, and the requirements of high power density, miniaturization and light weight of the product can be met.

Description

Technical Field

[0001] The invention relates to the technical field of transformers or reactors, and specifically provides a method and a device for improving the heat dissipation and cooling performance of a potted transformer or reactor. Background Art

[0002] With the rapid development of power conversion technology, the power density of power conversion equipment is getting higher and higher, and the size is getting smaller and smaller. As the core electromagnetic components and main heat sources in the power conversion system, the heating problem of transformers and reactors is becoming more and more serious. Especially in high-frequency and high-voltage transformers, reactors, and transformer integrated reactor structures, the heat dissipation problem of transformers and reactors is becoming increasingly prominent. The heating parts of transformers or reactors are mainly coils and iron cores, so it is particularly important to solve the heat dissipation problem of coils and iron cores. In the prior art, the following patents involve heat dissipation cooling of transformers or reactors: 1. The utility model patent with patent number "202021241492.0" and patent name "transformer with dual cooling function" includes: iron core, primary winding, secondary winding, diode assembly and output end, water cooling circulation assembly, diode water cooling plate, cooling medium liquid, heat sink, and first fan. This solution uses dual cooling methods of air cooling and water cooling for cooling, which can ensure the safe use of the transformer under high frequency usage or high temperature environment.

[0003] 2. The invention patent application with the patent number "202111445114.3" and the patent name "A high-frequency, high-voltage, high-power rectifier transformer" includes a bearing box, a transformer body, a heat dissipation assembly, multiple sets of heat dissipation fins, a water cooling mechanism, an air cooling mechanism, a first cooling water pipe, a second cooling water pipe, etc. This solution can extract the internal heat of the transformer body through the heat dissipation fins to achieve preliminary heat dissipation, cool the heat dissipation fins and the transformer body through the cooling water pipe, and send air toward the heat dissipation fins through the air outlet pipe to speed up the air flow rate.

[0004] As can be seen from the above, Comparative Document 1 uses a combination of a water-cooled plate, a heat sink and a cooling fan to cool the high-frequency transformer, while Comparative Document 2 uses a water-cooled mechanism and an air-cooled mechanism to cool the transformer. The heat dissipation structures in Comparative Documents 1 and 2 can reduce the temperature rise of the transformer, but they are large in size, complex in structure, and have limited heat dissipation performance. At the same time, the solutions in Comparative Documents 1 and 2 cannot be matched and applied to transformers made by the currently widely used potting process. After searching, the following comparative document 3 in the prior art involves cooling and heat dissipation of potting process transformers: 3. The utility model patent with the patent number "202023025870.4" and the patent name "A fully encapsulated water-cooled transformer" includes a transformer body, a cooling pipe, a water inlet tank, a water outlet tank, a cover body, a water inlet joint, a water outlet joint, a cooling fin group, a heat sink, a fan box, and a cooling fan. The fully encapsulated water-cooled transformer is doubly cooled by water cooling and air cooling, which can improve the cooling efficiency and has lower energy consumption.

[0005] The solution in Comparative Document 3 is to dissipate heat and cool the transformer manufactured by the encapsulation process, and adopts a dual cooling method of water cooling and air cooling. However, no water cooling pipe is installed inside the transformer body. The water cooling structure is mainly concentrated on the outside of the transformer body, and the structure is relatively complex. The heat dissipation performance is limited, which makes it difficult to meet the cooling and heat dissipation requirements of transformers in the high-frequency and high-voltage rail transit fields and power grid fields. There is also the problem of difficulty in maintaining the water cooling pipes.

[0006] In summary, how to design a heat dissipation cooling device with simple structure, small size, reasonable arrangement of cooling components, good heat dissipation performance, simple maintenance of water cooling pipes, and able to meet the heat dissipation requirements of encapsulated high-frequency and high-voltage transformers or reactors in the rail transit and power grid fields, so as to efficiently cool and dissipate the transformers and reactors in high-frequency, high-voltage and high-power conversion systems, is a problem that needs to be solved urgently. Summary of the invention

[0007] In order to solve the above problems, the present invention provides a method for improving the heat dissipation and cooling performance of a potted transformer or reactor, which can improve the performance of a potted water-cooled high-frequency transformer, and has obvious advantages in weight and volume, temperature rise performance, and good heat dissipation capacity, which can provide favorable conditions for subsequent product platform iteration and market development. The present invention also provides a device for improving the heat dissipation and cooling performance of a potted transformer or reactor.

[0008] The present invention provides a method for improving the heat dissipation and cooling performance of an encapsulated transformer or reactor, specifically, multiple device water-cooling plates are arranged close to the heat source inside a shell; when manufacturing the product, the device water-cooling plates are first placed at corresponding positions according to working conditions, and after the transformer body or the reactor body is manufactured, encapsulation is performed, and after encapsulation is completed, a water-cooling pipe is connected to the outside of the shell.

[0009] Furthermore, the device water cooling plate is lengthened so that the device water cooling plate forms an extended section extending to the outside of the shell, and the water cooling pipe is arranged on the extended section, and the water cooling pipe is located outside the shell.

[0010] Furthermore, the device water cooling plate is arranged close to the side surface or the upper and lower ends of the heat source inside the shell, and a bottom collecting plate assembly is arranged at the lower end of the shell to assemble into a potting cavity.

[0011] Furthermore, the device water cooling plate is placed horizontally, laterally or vertically, or a combination of horizontal, lateral and vertical placement.

[0012] Furthermore, the bottom collector plate assembly is configured as a collector water-cooling plate with an integral water-cooling plate structure, and the collector water-cooling plate is disposed close to the heat source.

[0013] Furthermore, the water inlet and the water outlet are arranged on the converging water cooling plate; the converging water cooling plate and the device water cooling plate are respectively provided with a bottom flow channel and an upper flow channel, and the upper flow channel in each device water cooling plate is connected with the bottom flow channel.

[0014] Furthermore, a plurality of transformer bodies are arranged in the shell, and partition plates are arranged between each transformer body; or a plurality of reactor bodies are arranged in the shell, and partition plates are arranged between each reactor body; or a transformer area and a reactor area are arranged in the shell, that is, the reactor body is integrated into the shell of the transformer body. When a plurality of transformer bodies and a plurality of reactor bodies are included, a partition plate is arranged between each transformer body in the transformer area, a partition plate is arranged between each reactor body in the reactor area, and a partition plate is arranged between the transformer area and the reactor area.

[0015] Furthermore, the partition plate is configured as a water-cooled plate or an insulating plate.

[0016] A device for improving the heat dissipation and cooling performance of an encapsulated transformer or reactor is manufactured using the above method, and includes a plurality of device water-cooling plates arranged close to a heat source in a shell, the device water-cooling plates extending to the outside of the shell and connected to a water-cooling pipe on the outside of the shell; a bottom busbar assembly is provided at the lower end of the shell, and the plurality of device water-cooling plates converge at the bottom busbar assembly.

[0017] Furthermore, the bottom convergent plate assembly is a convergent water-cooling plate with an integral water-cooling plate structure. The convergent water-cooling plate is arranged close to the bottom end of the heat source. The convergent water-cooling plate and the device water-cooling plate respectively include a bottom flow channel and an upper flow channel. Multiple upper flow channels are connected to the bottom flow channel and converge at the bottom flow channel.

[0018] Compared with the prior art, the present invention can achieve the following beneficial effects: 1. The transformer or reactor cooling and heat dissipation method of the present invention can improve the performance of water-cooled high-frequency transformers or reactors, making the products more competitive and meeting the requirements of high power density and miniaturization and lightweight in the rail transit industry and the power grid industry. The products are light in weight, small in size, simple in structure, and have obvious advantages in weight and volume.

[0019] 2. The transformer or reactor cooling and heat dissipation method of the present invention abandons the traditional method of heat dissipation only through the four sides of the box body, and closely fits the conventional water-cooled heat dissipation cold plate with the product heat source, which greatly improves the heat dissipation capacity and has obvious advantages in the temperature rise performance of the product.

[0020] 3. Since the joints and water pipes in the transformer or reactor made by the potting process are integrally potted in the colloid, it is not convenient to maintain and observe the water seepage. If there is a water leak, the product will be scrapped as a whole, resulting in a large loss. The cooling and heat dissipation method of the transformer or reactor in the present invention lengthens the water cooling plate so that the water joint is externally placed, and the product is connected to the water pipe on the outside. On the one hand, it fully utilizes the advantage of the water cooling plate being close to the internal heat source to improve the heat conduction density, while avoiding the hidden dangers of the built-in joints and water pipes, reducing the volume of the potting box, and making it easier to observe and maintain. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 The overall structure of the heat dissipation and cooling structure provided by the embodiment of the present invention is schematically shown in FIG. Figure 1 ; Figure 2 The overall structure of the heat dissipation and cooling structure provided by the embodiment of the present invention is schematically shown in FIG. Figure 2 (protective frame not shown); Figure 3 The overall structure of the heat dissipation and cooling structure provided by the embodiment of the present invention is schematically shown in FIG. Figure 3 (protective frame and housing not shown); Figure 4 yes Figure 3 Schematic top view of .

[0022] The accompanying drawings include: shell 1, device water-cooling plate 2, extension section 3, water-cooling pipe 4, converging water-cooling plate 5, iron core 6, winding 7, water inlet 8, water outlet 9, bottom flow channel 10, protective frame 11, transformer body 12, reactor body 13, partition plate 14, transformer area 15, reactor area 16. DETAILED DESCRIPTION

[0023] In the following, reference will be made to the Figure 1-4 Embodiments of the present invention are described. In the following description, the same modules are represented by the same reference numerals. In the case of the same reference numerals, their names and functions are also the same. Therefore, the detailed description thereof will not be repeated.

[0024] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the following Figure 1-4 It should be understood that the specific embodiments described herein are only used to explain the present invention and do not constitute a limitation of the present invention.

[0025] A method and device for improving the heat dissipation and cooling performance of a potted transformer or reactor, such as Figure 3As shown, a plurality of device water-cooling plates 2 are arranged close to the heat source inside the shell 1. The heat source includes an iron core 6, a winding 7, etc. The device water-cooling plates 2 are arranged close to the side or the upper and lower ends of the heat source. The device water-cooling plates 2 can be arranged between the iron core 6 and the winding 7, between each layer of the winding 7, between multiple transformer bodies 12 or multiple reactor bodies 13, and between the transformer body 12 and the reactor body 13, which can reduce the temperature rise to the greatest extent and improve the heat dissipation and cooling performance. Specifically, a mounting position 1 for the device water-cooling plate 2 can be designed between the iron core 6 and the winding 7, and the device water-cooling plate 2 is set in the mounting position 1, with one side of the device water-cooling plate 2 close to the iron core 6 and the other side close to the winding 7. A mounting position 2 for the device water-cooling plate 2 can also be designed between each layer of windings 7, and the device water-cooling plate 2 can be set in the mounting position 2, with both sides of the device water-cooling plate 2 close to the winding 7. If there are multiple windings 7, more device water-cooling plates 7 can be added according to actual needs. In this embodiment, a device water-cooling plate 2 is set between the iron core 6 and the winding 7. Technical personnel in this field can also set the device water-cooling plate 2 between several layers of windings according to actual conditions.

[0026] When manufacturing the product, first place the device water-cooling plate 2 at the corresponding position according to the working conditions, specifically, it can be placed at the corresponding position of the iron core 6 or the winding 7, and after the transformer body 12 or the reactor body 13 is manufactured, it is potted. After potting is completed, the water-cooling pipe 4 is connected to the outside of the shell 1. Specifically, the device water-cooling plate 2 is lengthened so that the device water-cooling plate 2 forms an extended section 3 extending to the outside of the shell 1, and the water-cooling pipe 4 is arranged on the extended section 3. The water-cooling pipe 4 is located on the outside of the shell 1. The water-cooling pipe 4 is a metal pipe or a plastic pipe. A connecting through hole is opened on the shell 1, and the device water-cooling plate 2 is penetrated in the connecting through hole. The device water-cooling plate 2 passes through the shell 1 from the connecting through hole and extends to the outside of the shell 1 to form the extended section 3. A protective frame 11 is arranged on the outside of the water-cooling pipe 4. The protective frame 11 is located on the outside of the shell 1 as a whole, and the water-cooling pipe 4 and the device water-cooling plate 2 are protected by the protective frame 11.

[0027] When the water-cooling pipe 4 is placed on the inner side of the shell 1, water leakage often occurs in the actual application process, and the staff cannot find it or it is difficult to repair it even if it is found, which often leads to the entire product being scrapped. In order to avoid this problem, the water-cooling pipe 4 is arranged on the outer side of the shell 1. When the water-cooling pipe 1 leaks, it can be discovered and repaired in time. Only the water-cooling pipe 4 needs to be replaced or repaired, which can reduce costs and improve efficiency.

[0028] Especially for potting products, when the water-cooling tube 4 is installed on the inner side of the shell 1, the production steps are to arrange the water-cooling tube 4 properly and inspect it before potting. There are many processes after the water-cooling tube 4 is inspected, and the risk of damage to the water-cooling tube 4 is difficult to be discovered during these processes. However, in this embodiment, the water-cooling tube 4 is externally arranged, that is, the water-cooling tube 4 is installed on the outside of the shell 1 after potting, which can effectively avoid the occurrence of the above-mentioned problem.

[0029] The device water-cooling plate 2 is placed horizontally, laterally or vertically, or a combination of horizontal, lateral and vertical placement at the heat source. This method can be used to dissipate heat and cool the scene in which the shell 1 includes one, two or more transformer bodies 12, the scene in which the shell 1 includes one, two or more reactor bodies 13, and the scene in which the shell 1 includes a transformer body 12 and a reactor body 13 integrated. Specifically, a plurality of transformer bodies 12 are arranged in the shell 1, and a partition plate 14 is arranged between each transformer body 12, or a plurality of reactor bodies 13 are arranged in the shell 1, and a partition plate 14 is arranged between each reactor body 13, or a transformer area 15 and a reactor area 16 are arranged in the shell 1, that is, the reactor body 13 is integrated into the shell 1 of the transformer body 12. When a plurality of transformer bodies 12 and a plurality of reactor bodies 13 are included, a partition plate 14 is arranged between each transformer body 12 in the transformer area 15, a partition plate 14 is arranged between each reactor body 13 in the reactor area 16, and a partition plate 14 is arranged between the transformer area 15 and the reactor area 16. The partition plate 14 adopts a water-cooled plate form or an insulating plate form. In this embodiment, the partition plate 14 is preferably arranged as a water-cooled plate, which can reduce the temperature rise to a greater extent.

[0030] In this embodiment, heat dissipation and cooling of a scene in which a transformer body 12 and a reactor body 13 are integrated in a housing 1 is used as an example to explain that a plurality of transformer bodies 12 are provided in the housing 1, and a partition plate 14 is provided between each transformer body 12. A reactor body 13 is provided in the housing 1, and the housing is divided into a transformer area 15 and a reactor area 16. The transformer body 12 is placed in the transformer area 15, and the reactor body 13 is placed in the reactor area 16. Figure 4 As shown, a partition plate 14 is also provided between the transformer area 15 and the reactor area 16, and the partition plate 14 is also a water-cooled plate structure to improve the heat dissipation performance. At the same time, those skilled in the art can also set the partition plate 14 to a non-water-cooled plate form according to actual heat dissipation requirements.

[0031] A bottom busbar assembly is provided at the lower end of the shell 1. The shell 1 and the busbar assembly can be connected by assembly or welding to form a potting cavity. The bottom busbar assembly can select a water-cooled plate structure to facilitate further cooling of the bottom of the heat source, and can also be used for water channel convergence. At the same time, the bottom busbar assembly can also select other structural parts, and then fix the busbar and the water nozzle to form a bottom busbar assembly together. In this embodiment, the bottom busbar assembly is configured as a convergence water-cooling plate 5 of an integral water-cooling plate structure. The convergence water-cooling plate 5 is arranged close to the bottom end of the heat source, and a bottom flow channel 10 and an upper flow channel are respectively arranged in the convergence water-cooling plate 5 and the device water-cooling plate 2. A plurality of upper flow channels are connected to the bottom flow channel 10 and converge at the bottom flow channel 10. The water-cooling pipes 4 on each transformer body 12 in the transformer area 15 are as shown in FIG. Figure 2As shown in the figure, they are connected in series and connected with the bottom flow channel in the converging water cooling plate 5. The water cooling pipe 4 on the reactor body 13 in the reactor area 16 is connected as shown in the figure. Figure 2 As shown at B in the middle, they are connected in series and are connected to the bottom flow channel in the converging water cooling plate 5.

[0032] The upper flow channel of the transformer body 12 in the transformer area 15 is connected to the water-cooling pipe 4 at the transformer area 15, and the upper flow channel of the reactor body 13 in the reactor area 16 is connected to the water-cooling pipe 4 at the reactor area 16. The bottom flow channel 10 is a series flow channel structure or a parallel flow channel structure. In this embodiment, the bottom flow channel 10 is preferably set as a series flow channel structure, and the water inlet 8 and the water outlet 9 are set on the converging water cooling plate 5. The water inlet 8 and the water outlet 9 are preferably set on the same side of the converging water cooling plate 5.

[0033] Although the embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and cannot be understood as limiting the present invention. Those skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

[0034] The above specific implementations of the present invention do not constitute a limitation on the protection scope of the present invention. Any other corresponding changes and modifications made based on the technical concept of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A method for improving the heat dissipation and cooling performance of a potted transformer or reactor, characterized in that: A plurality of device water cooling plates (2) are arranged close to the heat source inside the shell (1); when manufacturing the product, the device water cooling plates (2) are first placed at corresponding positions according to working conditions and the device water cooling plates (2) are extended to the outside of the shell (1); potting is performed after the transformer body (12) or the reactor body (13) is manufactured, and after potting is completed, a water cooling pipe (4) is connected to the outside of the shell (1).

2. The method for improving the heat dissipation and cooling performance of a potted transformer or reactor according to claim 1, characterized in that: The device water cooling plate (2) is lengthened so that the device water cooling plate (2) forms an extended section (3) extending to the outside of the shell (1), and the water cooling pipe (4) is arranged on the extended section (3), and the water cooling pipe (4) is located outside the shell (1).

3. The method for improving the heat dissipation and cooling performance of a potted transformer or reactor according to claim 2, characterized in that: The device water cooling plate (2) is arranged close to the side surface or the upper and lower ends of the heat source inside the shell (1), and a bottom collector plate assembly is arranged at the lower end of the shell (1) to assemble a potting cavity.

4. The method for improving the heat dissipation and cooling performance of a potted transformer or reactor according to claim 3, characterized in that: The device water cooling plate (2) is placed horizontally, sideways or vertically, or is placed in a combination of horizontal placement, sideways placement and vertical placement.

5. The method for improving the heat dissipation and cooling performance of a potted transformer or reactor according to claim 4, characterized in that: The bottom converging plate assembly is arranged to be a converging water cooling plate (5) of an integral water cooling plate structure, and the converging water cooling plate (5) is arranged close to a heat source.

6. The method for improving the heat dissipation and cooling performance of a potted transformer or reactor according to claim 5, characterized in that: The water inlet (8) and the water outlet (9) are arranged on the converging water cooling plate (5); a bottom flow channel (10) and an upper flow channel are arranged in the converging water cooling plate (5) and the device water cooling plate (2), respectively, and the upper flow channels in each device water cooling plate (2) are connected to the bottom flow channel (10).

7. The method for improving the heat dissipation and cooling performance of a potted transformer or reactor according to claim 6, characterized in that: A plurality of transformer bodies (12) are arranged in a housing (1), and a partition plate (14) is arranged between each transformer body (12); or a plurality of reactor bodies (13) are arranged in the housing (1), and a partition plate (14) is arranged between each reactor body (13); or a transformer area (15) and a reactor area (16) are arranged in the housing (1), that is, the reactor body (13) is integrated into the housing (1) of the transformer body (12); when the plurality of transformer bodies (12) and the plurality of reactor bodies (13) are included, a partition plate (14) is arranged between each transformer body (12) in the transformer area (15), a partition plate (14) is arranged between each reactor body (13) in the reactor area (16), and a partition plate (14) is arranged between the transformer area (15) and the reactor area (16).

8. The method for improving the heat dissipation and cooling performance of a potted transformer or reactor according to claim 7, characterized in that: The partition plate (14) is configured as a water-cooled plate or an insulating plate.

9. A device for improving the heat dissipation and cooling performance of a potted transformer or reactor, manufactured by the method of claims 1-8, characterized in that: It comprises a plurality of device water cooling plates (2) arranged close to a heat source in a shell (1), the device water cooling plates (2) extending to the outside of the shell (1) and connected to a water cooling pipe (4) on the outside of the shell (1); a bottom collector plate assembly is provided at the lower end of the shell (1), and the plurality of device water cooling plates (2) converge at the bottom collector plate assembly.

10. The device for improving the heat dissipation and cooling performance of a potted transformer or reactor according to claim 9, characterized in that: The bottom conduit assembly is a conduit water cooling plate (5) of an integral water cooling plate structure. The conduit water cooling plate (5) is arranged close to the bottom end of the heat source. The conduit water cooling plate (5) and the device water cooling plate (2) respectively include a bottom flow channel (10) and an upper flow channel. The plurality of upper flow channels are all connected to the bottom flow channel (10) and converge at the bottom flow channel (10).

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