Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component including a body including a dielectric layer and an inner electrode alternately disposed with the dielectric layer in a first direction, and an outer electrode disposed on the body, and the main body has a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction. The inner electrode includes an extraction portion and is connected to the outer electrode through the extraction portion, the outer electrode includes first, second, third and fourth outer electrodes spaced apart from each other and a first connection electrode connecting the first and third outer electrodes, and the first connection electrode includes a conductive material.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0103998 filed on August 9, 2023, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to a multilayer electronic assembly. Background Art

[0003] Multilayer ceramic capacitors (MLCCs), which are multilayer electronic components, are chip capacitors that are mounted on printed circuit boards of various electronic products such as imaging devices (e.g., liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones, mobile phones, etc., and are used for charging or discharging.

[0004] Such multilayer ceramic capacitors are used as components in various electronic devices due to their small size, high capacitance, and ease of installation. As various electronic devices (such as computers and mobile devices) become smaller and have higher output, the demand for smaller and higher-capacitance multilayer ceramic capacitors is increasing.

[0005] On the other hand, MLCCs are also widely used for decoupling to remove noise from electrical signals within device groups due to their excellent high-frequency characteristics (low ESL).

[0006] Furthermore, to prevent noise in high-speed integrated circuits (ICs), land-side capacitors (LSCs) are used near the ICs. LSCs are known to require low thickness and high-frequency characteristics. To reduce equivalent series inductance (ESL), it is important to significantly reduce the amount of magnetic flux per unit current in the high-frequency region. To this end, various methods are being used to prevent this problem, such as controlling the formation and structure of inner and outer electrodes to significantly reduce current loops, or arranging the inner and outer electrodes to cancel out magnetic fields.

[0007] As mentioned above, LSCs are typically placed below the IC substrate, requiring a low thickness and low ESL characteristics. These LSCs are typically mounted on the bottom of the substrate, removing the solder balls. Low-inductance capacitors, such as low-inductance chip capacitors (LICCs), are primarily used, with demand for square form factors increasing. Summary of the Invention

[0008] An aspect of the present disclosure is to facilitate the measurement of capacitance of multilayer electronic components.

[0009] An aspect of the present disclosure is to improve the mechanical strength of multilayer electronic components.

[0010] An aspect of the present disclosure is to easily distinguish the appearance of a multi-layer electronic component.

[0011] An aspect of the present disclosure is to provide a multilayer electronic component having improved high frequency characteristics (low ESL).

[0012] According to one aspect of the present disclosure, a multilayer electronic component includes: a main body including dielectric layers and internal electrodes arranged alternately with the dielectric layers in a first direction, the main body having a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in the second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction; and external electrodes arranged on the main body. The internal electrodes include lead portions and are connected to the external electrodes via the lead portions. The external electrodes include a first external electrode, a second external electrode, a third external electrode, and a fourth external electrode spaced apart from each other, and a first connecting electrode connecting the first external electrode and the third external electrode, wherein the first connecting electrode comprises a conductive material.

[0013] According to another aspect of the present disclosure, a multilayer electronic component includes: a main body including dielectric layers and internal electrodes arranged alternately with the dielectric layers in a first direction, the main body having a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in the second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction; and external electrodes provided on the main body. The internal electrodes include lead portions and are connected to the external electrodes via the lead portions. The external electrodes may include a first external electrode, a second external electrode, a third external electrode, and a fourth external electrode spaced apart from each other, a first connecting electrode connecting the first external electrode and the third external electrode, and a second connecting electrode connecting the second external electrode and the fourth external electrode.

[0014] According to another aspect of the present disclosure, a multilayer electronic component includes: a main body including dielectric layers and internal electrodes arranged alternately with the dielectric layers in a first direction, the main body having a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposite to each other in a third direction; and external electrodes arranged on the main body. The internal electrodes include lead portions and are connected to the external electrodes via the lead portions. The external electrodes include a first external electrode, a second external electrode, a third external electrode, and a fourth external electrode spaced apart from each other, and a first connecting electrode connecting the first external electrode and the third external electrode, the first connecting electrode extending between the first and third external electrodes in a first diagonal direction relative to the third to sixth surfaces of the main body. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 schematically illustrates a perspective view of a multilayer electronic component according to an embodiment; Figure 2A 、 Figure 2B 、 Figure 2C and Figure 2D schematically illustrates a cross-sectional view of an inner electrode including a lead portion according to an embodiment; Figure 3A schematically shows a top view of a multilayer electronic component according to an embodiment, and Figure 3B schematically illustrates a bottom view of a multilayer electronic assembly according to an embodiment; Figure 4 schematically illustrates a perspective view of a multilayer electronic component according to another embodiment; Figure 5A schematically shows a top view of a multilayer electronic component according to another embodiment, and Figure 5B schematically illustrates a bottom view of a multilayer electronic component according to another embodiment; Figure 6A schematically shows a top view of a multilayer electronic component according to another embodiment, and Figure 6B schematically illustrates a bottom view of a multilayer electronic component according to another embodiment; 7A to 7D schematically illustrates a cross-sectional view of an inner electrode including a lead portion according to another embodiment; Figure 8A schematically shows a top view of a multilayer electronic component according to another embodiment, and Figure 8B schematically illustrates a bottom view of a multilayer electronic component according to another embodiment; Figure 9A 、 Figure 9B 、 Figure 9C and Figure 9D schematically illustrates a cross-sectional view of an inner electrode including a lead portion according to another embodiment; Figure 10A schematically shows a top view of a multilayer electronic component according to another embodiment, and Figure 10B schematically illustrates a bottom view of a multilayer electronic component according to another embodiment; and Figure 11A 、 Figure 11B 、 Figure 11C and Figure 11D A cross-sectional view schematically illustrates an inner electrode including a lead portion according to another embodiment. DETAILED DESCRIPTION

[0016] Hereinafter, embodiments of the present disclosure will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present disclosure may be modified in many different forms, and the scope of the present disclosure is not limited to the embodiments described below. In addition, the embodiments of the present disclosure are provided to more fully describe the present disclosure to those skilled in the art. Therefore, for clearer description, the shapes and sizes of the elements in the drawings may be exaggerated, and the elements represented by the same or similar reference numerals in the drawings are the same or similar elements.

[0017] In addition, in the drawings, parts not related to the description are omitted for clarity, and the dimensions (e.g., thickness) of each component shown in the drawings are arbitrarily shown for ease of description, and therefore the present disclosure is not necessarily limited to the dimensions (e.g., thickness) shown. Furthermore, components having the same functions within the scope of the same concept are described using the same reference numerals. Furthermore, throughout this specification, unless otherwise specified, when a component is referred to as "comprising," it may also include other components without excluding them.

[0018] In the drawings, a first direction may be defined as a stacking direction or a thickness direction, a second direction may be defined as a length direction, and a third direction may be defined as a width direction.

[0019] Figure 1 A perspective view schematically illustrates a multilayer electronic component according to an embodiment.

[0020] Figures 2A to 2D A cross-sectional view schematically illustrates an inner electrode including a lead portion according to an embodiment.

[0021] Figure 3A schematically shows a top view of a multilayer electronic component according to an embodiment, and Figure 3B A bottom view of a multilayer electronic component according to an embodiment is schematically shown.

[0022] Figure 4 A perspective view schematically shows a multilayer electronic component according to another embodiment.

[0023] Figure 5A schematically shows a top view of a multilayer electronic component according to another embodiment, and Figure 5B A bottom view of a multilayer electronic component according to another embodiment is schematically shown.

[0024] Figure 6A schematically shows a top view of a multilayer electronic component according to another embodiment, and Figure 6B A bottom view of a multilayer electronic component according to another embodiment is schematically shown.

[0025] 7A to 7D A cross-sectional view schematically illustrates an inner electrode including a lead portion according to another embodiment.

[0026] Figure 8A schematically shows a top view of a multilayer electronic component according to another embodiment, and Figure 8B A bottom view of a multilayer electronic component according to another embodiment is schematically shown.

[0027] 9A to 9D A cross-sectional view schematically illustrates an inner electrode including a lead portion according to another embodiment.

[0028] Figure 10A schematically shows a top view of a multilayer electronic component according to another embodiment, and Figure 10B A bottom view of a multilayer electronic component according to another embodiment is schematically shown.

[0029] 11A to 11D A cross-sectional view schematically illustrates an inner electrode including a lead portion according to another embodiment.

[0030] In the following, reference will be made to Figures 1 to 11D A multilayer electronic component according to an embodiment is described in detail. However, although a multilayer ceramic capacitor is described as an example of a multilayer electronic component, the present disclosure may be applied to various electronic products (such as inductors, piezoelectric elements, varistors, or thermistors) using a dielectric composition.

[0031] The multilayer electronic component 100 according to the embodiment may include: a body 110 including a dielectric layer 111 and internal electrodes 121, 122, 123, and 124 arranged alternately with the dielectric layer 111 in a first direction, and having a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and opposite to each other in the third direction; and external electrodes 131, 132, 133, 134, and 135 arranged on the body 110. The internal electrodes 121, 122, 123, and 124 are connected to the external electrodes 131, 132, 133, and 134 through lead portions 121a, 122b, 123c, and 124d, respectively. The external electrodes 131, 132, 133, 134, and 135 may include a first external electrode 131, a second external electrode 132, a third external electrode 133, and a fourth external electrode 134 that are spaced apart from each other, and a first connection electrode 135 connecting the first external electrode 131 and the third external electrode 133. The first connection electrode 135 may include a conductive material.

[0032] The body 110 may have dielectric layers 111 and internal electrodes 121 , 122 , 123 , and 124 that are alternately stacked.

[0033] In more detail, the body 110 may include a capacitor forming portion, which is disposed inside the body 110 and includes a first internal electrode 121, a second internal electrode 122, a third internal electrode 123, and a fourth internal electrode 124 stacked in a first direction with a dielectric layer 111 interposed therebetween to form a capacitor.

[0034] In this case, the first internal electrode 121, the second internal electrode 122, the third internal electrode 123, and the fourth internal electrode 124 may be defined as a pattern. Specifically, the first internal electrode 121, the second internal electrode 122, the third internal electrode 123, and the fourth internal electrode 124 may be sequentially arranged in the first direction, but are not particularly limited thereto, and may be randomly arranged in the first direction, but may form a periodically repeated pattern.

[0035] Although the specific shape of the body 110 is not particularly limited, the body 110 may have a shape such as Figure 1 The body 110 may have a hexahedral shape or a shape similar to the hexahedral shape shown. Although the body 110 does not have a perfectly straight hexahedral shape due to shrinkage of ceramic particles included in the body 110 during firing, the body 110 may generally have a hexahedral shape.

[0036] The main body 110 having a hexahedral shape may have a first surface 1 and a second surface 2 that are opposite to each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and are opposite to each other in a third direction.

[0037] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and adjacent dielectric layers 111 will be integrated such that it is difficult to identify the boundary between them without using a scanning electron microscope (SEM).

[0038] There is no limitation on the raw material for forming the dielectric layer 111 as long as sufficient capacitance can be obtained. Generally, perovskite (ABO3)-based materials can be used. For example, barium titanate-based materials, lead composite perovskite-based materials, strontium titanate-based materials, etc. can be used. The barium titanate-based material may include BaTiO3-based ceramic particles. As an example of the BaTiO3-based ceramic particles, BaTiO3 or (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti[[ID=2,3]] 1-y Zr y )O3 (0 < y < 1) may be included.

[0039] In addition, according to the use of the present disclosure, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to a powder such as barium titanate (BaTiO3) as the raw material for forming the dielectric layer 111.

[0040] The thickness of the dielectric layer 111 does not need to be particularly limited.

[0041] However, in order to more easily obtain a miniaturized and high-capacitance multilayer electronic component, the thickness of the dielectric layer 111 may be less than or equal to 0.6 μm. Specifically, the thickness of the dielectric layer 111 may be less than or equal to 0.4 μm.

[0042] In this case, the thickness of the dielectric layer 111 may represent the thickness of the dielectric layer 111 provided between adjacent inner electrodes among the first inner electrode 121, the second inner electrode 122, the third inner electrode 123, and the fourth inner electrode 124.

[0043] On the other hand, the thickness of the dielectric layer 111 may refer to the size of the dielectric layer 111 in the first direction. In addition, the thickness of the dielectric layer 111 may refer to the average thickness of the dielectric layer 111 and may refer to the average size of the dielectric layer 111 in the first direction.

[0044] The average size of dielectric layer 111 in the first direction can be measured using an image obtained by scanning a cross-section of body 110 in the first and second directions using a scanning electron microscope (SEM) at a magnification of 10,000. More specifically, the average size of one dielectric layer 111 in the first direction can be calculated by measuring the size of one dielectric layer 111 in the first direction at 30 equally spaced points in the second direction in the scanned image. The 30 equally spaced points can be specified within the capacitor forming portion. Furthermore, extending this average measurement to include 10 dielectric layers 111 allows for a more generalized average size of dielectric layer 111 in the first direction.

[0045] The internal electrodes 121 , 122 , 123 , and 124 and the dielectric layers 111 may be alternately stacked.

[0046] The internal electrodes 121, 122, 123, and 124 may include a first internal electrode 121, a second internal electrode 122, a third internal electrode 123, and a fourth internal electrode 124, and the first internal electrodes 121, the second internal electrodes 122, the third internal electrodes 123, and the fourth internal electrodes 124 may be alternately disposed opposite to each other with the dielectric layer 111 constituting the body 110 interposed therebetween. The first internal electrode 121, the second internal electrode 122, the third internal electrode 123, and the fourth internal electrode 124 may be electrically separated from each other by the dielectric layer 111 disposed therebetween in the first direction.

[0047] In this case, the body 110 may be formed by alternately stacking a first ceramic green sheet having a first internal electrode pattern printed thereon, a second ceramic green sheet having a second internal electrode pattern printed thereon, a third ceramic green sheet having a third internal electrode pattern printed thereon, and a fourth ceramic green sheet having a fourth internal electrode pattern printed thereon, and then firing them. In this case, the first internal electrode pattern, the second internal electrode pattern, the third internal electrode pattern, and the fourth internal electrode pattern may be formed by applying an internal electrode paste and may become the first internal electrode 121, the second internal electrode 122, the third internal electrode 123, and the fourth internal electrode 124, respectively, after firing.

[0048] The material forming the internal electrodes 121, 122, 123, and 124 is not particularly limited, and a material having excellent electrical conductivity may be used. For example, the internal electrodes 121, 122, 123, and 124 may include at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0049] In the case of the internal electrodes 121, 122, 123, and 124, the internal electrode patterns may be formed by printing a conductive paste for internal electrodes on a ceramic green sheet, the conductive paste including at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. The conductive paste for internal electrodes may be printed by screen printing or gravure printing, but is not limited thereto.

[0050] On the other hand, the thicknesses of the internal electrodes 121 , 122 , 123 , and 124 do not need to be particularly limited.

[0051] However, to more easily obtain miniaturized and high-capacitance multilayer electronic components, the thickness of the internal electrodes 121 , 122 , 123 , and 124 may be less than or equal to 0.6 μm, and in more detail, the thickness of the internal electrodes 121 , 122 , 123 , and 124 may be less than or equal to 0.4 μm.

[0052] In this case, the thickness of the internal electrodes 121, 122, 123, and 124 may refer to the size of the internal electrodes 121, 122, 123, and 124 in the first direction. In addition, the thickness of the internal electrodes 121, 122, 123, and 124 may refer to the average thickness of the internal electrodes 121, 122, 123, and 124, and may refer to the average size of the internal electrodes 121, 122, 123, and 124 in the first direction.

[0053] The average size of each of the internal electrodes 121, 122, 123, and 124 in the first direction can be measured using an image obtained by scanning a cross-section of the main body 110 in the first and second directions at a magnification of 10,000 using a scanning electron microscope (SEM). More specifically, the average size of one internal electrode (e.g., one of the internal electrodes 121, 122, 123, and 124) in the first direction can be calculated by measuring the size of the internal electrode in the first direction at 30 equally spaced points in the second direction in the scanned image. The 30 equally spaced points can be specified in the capacitor-forming portion. Furthermore, if this average value is measured for 10 internal electrodes, the average size of each of the internal electrodes 121, 122, 123, and 124 in the first direction can be more generalized.

[0054] The external electrodes 131 , 132 , 133 , 134 , 135 , and 136 may be disposed on the body 110 and connected to the internal electrodes 121 , 122 , 123 , and 124 .

[0055] The external electrodes 131 , 132 , 133 , 134 , 135 , and 136 may include a first external electrode 131 , a second external electrode 132 , a third external electrode 133 , and a fourth external electrode 134 , respectively disposed on the body 110 and spaced apart from each other.

[0056] In addition, the external electrodes 131, 132, 133, 134, 135, and 136 may include connection electrodes 135 and 136 connecting at least two of the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134. For example, the external electrodes 131, 132, 133, 134, 135, and 136 may include a first connection electrode 135 connecting the first external electrode 131 and the third external electrode 133, and a second connection electrode 136 connecting the second external electrode 132 and the fourth external electrode 134. When there are a plurality of connection electrodes, each connection electrode may be connected to a different external electrode, and a detailed description thereof will be provided later.

[0057] The external electrodes 131, 132, 133, 134, 135, and 136 may be formed using any material as long as they have conductivity, such as metal. Specific materials thereof may be determined in consideration of electrical characteristics, structural stability, etc., and the external electrodes may have a multi-layer structure.

[0058] For example, the external electrodes 131 , 132 , 133 , 134 , 135 , and 136 may include an electrode layer disposed on the body 110 and a plating layer disposed on the electrode layer.

[0059] For a more detailed example of the electrode layer, the electrode layer may be a fired electrode including a conductive metal and glass, or may be a resin-based electrode including a conductive metal and resin.

[0060] In addition, the electrode layer may be in the form of a fired electrode and a resin-based electrode sequentially formed on the body 110 .

[0061] In addition, the electrode layer may be formed by transferring a sheet containing a conductive metal onto the body 110 , or may be formed by transferring a sheet containing a conductive metal onto a fired electrode.

[0062] The conductive metal used in the electrode layer is not particularly limited, as long as it is a material that can be electrically connected to the internal electrodes 121, 122, 123, and 124 to form a capacitor. For example, it can include at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. The electrode layer can be formed by applying a conductive paste prepared by adding glass frit to conductive metal powder and then firing the paste.

[0063] The plating can improve the installation characteristics.

[0064] The type of the plating layer is not particularly limited. For example, the plating layer may include at least one of nickel (Ni), tin (Sn), palladium (Pd), and alloys thereof. In addition, the plating layer may be formed as a single layer or multiple layers.

[0065] For a more detailed example of the plating layer, the plating layer may be a Ni plating layer or a Sn plating layer, and may be a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layer, or may be a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed on the electrode layer. In addition, the plating layer may include multiple Ni plating layers and / or multiple Sn plating layers.

[0066] On the other hand, MLCCs are also widely used for decoupling to remove noise from electrical signals within device groups due to their excellent high-frequency characteristics (low ESL).

[0067] Furthermore, to address noise in high-speed integrated circuits (ICs), land-side capacitors (LSCs) are often used near the IC. LSCs are known to require low thickness and high-frequency characteristics. To reduce ESL, it is important to significantly reduce the amount of magnetic flux per unit current in the high-frequency region. To this end, various methods are used to prevent this problem, such as controlling the formation and structure of the inner and outer electrodes to significantly reduce current loops, or arranging the inner and outer electrodes to cancel out magnetic fields.

[0068] As mentioned above, LSCs are typically located below the IC substrate, requiring a low thickness and low ESL characteristics. In this case, LSCs are installed on the bottom of the substrate, where solder balls are removed. LSCs are primarily used, with demand for square form factor capacitors increasing.

[0069] Therefore, by designing a structure including inner electrodes having lead portions and connecting electrodes electrically connected between outer electrodes, it is possible to achieve a low ESL structure in the embodiment, which can facilitate capacitance measurement and improve the strength of the multilayer electronic component. In addition, since the appearance can be easily distinguished, it is easier to distinguish between the top and bottom during installation.

[0070] The external electrodes 131, 132, 133, 134, 135 and 136 include a first external electrode 131, a second external electrode 132, a third external electrode 133 and a fourth external electrode 134 that are spaced apart from each other, and may include connecting electrodes 135 and 136 connecting at least two of the first external electrode 131, the second external electrode 132, the third external electrode 133 and the fourth external electrode 134.

[0071] At this time, the connection electrodes 135 and 136 may include a conductive material and, as described above, may be formed using any material as long as it has conductivity, such as metal, etc. Specific materials thereof may be determined in consideration of electrical characteristics, structural stability, etc., and the connection electrodes may have a multi-layer structure.

[0072] The conductive material included in the connection electrodes 135 and 136 does not need to be the same as the conductive material included in the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134, and may be formed of or include a different conductive material. In this case, all the conductive materials included in the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134 are different from all the conductive materials included in the connection electrodes 135 and 136, or part of the conductive material included in the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134 is different from part of the conductive material included in the connection electrodes 135 and 136, while the other conductive materials included in the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134 are the same as the other conductive materials included in the connection electrodes 135 and 136.

[0073] For example, when the first to fourth external electrodes 131 to 132 include copper (Cu), the connection electrodes 135 and 136 may include copper (Cu) and nickel (Ni), or may include nickel (Ni) without copper (Cu).

[0074] In more detail, the connection electrodes 135 and 136 may include a first connection electrode 135 disposed on the second surface 2 of the body and connected to the first external electrode 131 and the third external electrode 133; and a second connection electrode 136 disposed on the first surface 1 of the body and connected to the second external electrode 132 and the fourth external electrode 134. For example, depending on the structure of the multilayer electronic component 100, the connection electrodes may include one of the first connection electrode 135 and the second connection electrode 136, or may include both the first connection electrode 135 and the second connection electrode 136.

[0075] Different voltages may be applied to the first connection electrode 135 and the second connection electrode 136 , and by applying the different voltages, measurement of capacitance may be more facilitated.

[0076] For example, in the case where the first inner electrode 121, the second inner electrode 122, the third inner electrode 123 and the fourth inner electrode 124 respectively include the first lead portion 121a, the second lead portion 122b, the third lead portion 123c and the fourth lead portion 124d and are respectively connected to the first outer electrode 131, the second outer electrode 132, the third outer electrode 133 and the fourth outer electrode 134, when two of the first outer electrode 131, the second outer electrode 132, the third outer electrode 133 and the fourth outer electrode 134 are connected to the first connection electrode 135, and when the remaining two outer electrodes not connected to the first connection electrode 135 are connected to the second connection electrode 136, the measurement of capacitance can be facilitated by applying different voltages to the first connection electrode 135 and the second connection electrode 136. In this case, applying different voltages to the first connecting electrode 135 and the second connecting electrode 136 not only means applying a DC voltage to the first connecting electrode 135 and the second connecting electrode 136, but also includes the following situation: applying a voltage to the first connecting electrode 135 and the second connecting electrode 136 so that the two external electrodes connected to the first connecting electrode 135 are applied with the same voltage and the two external electrodes connected to the second connecting electrode 136 are applied with the same voltage.

[0077] In detail, the first connection electrode 135 may be structurally and electrically connected to the first external electrode 131 and the third external electrode 133, and may have substantially the same width. In addition, it may be desirable to have a straight structure, but is not particularly limited thereto, and any structure that can achieve electrical connection, such as a curved shape or a stepped shape, may be applied.

[0078] In this case, when the shortest distances from the first connection electrode 135 to the second and fourth external electrodes 132 and 134 are defined as Td1 and Td2, respectively, and the width of the first connection electrode 135 is defined as Td3, 90 μm ≤ Td1, 90 μm ≤ Td2, and 0 μm <Td3。

[0079] In this case, when the first connection electrode 135 has substantially the same width, the average value of the widths measured at five equally spaced points in the first connection electrode 135 can be defined as the width or the average width of the first connection electrode 135. On the other hand, when the first connection electrode 135 does not have substantially the same width or when it is difficult to measure, the larger value of the dimension of the first connection electrode 135 in the linear direction parallel to the shortest distance from the first connection electrode 135 to the second outer electrode 132 and the dimension in the linear direction parallel to the shortest distance from the first connection electrode 135 to the fourth outer electrode 134 can be defined as the width of the first connection electrode 135.

[0080] On the other hand, when 90 μm ≤ Td1, 90 μm ≤ Td2, and 0 μm < Td3 are satisfied, since the electrical connectivity between the first outer electrode 131 and the third outer electrode 133 is not deteriorated, the capacitance can be easily measured, and the mechanical strength can be improved to prevent defects in the multilayer electronic component 100. In addition, short circuits can be prevented.

[0081] On the other hand, in the case where Td1 < 90 μm or Td2 < 90 μm, the spacing distance between the first connection electrode 135 and the second outer electrode 132 or the spacing distance between the first connection electrode 135 and the fourth outer electrode 134 is relatively short, so there is a risk of electrical connection or short circuit. The upper limit values of Td1 and Td2 are not particularly limited and can be determined by the size of the multilayer electronic component and / or Td3.

[0082] The lower limit value of Td3 is not particularly limited. For example, it can be greater than 0 μm as long as it is sufficient to electrically connect the first outer electrode 131 and the third outer electrode 133. On the other hand, the upper limit value of Td3 is also not particularly limited and can be determined by the size of the multilayer electronic component, Td1, and / or Td2.

[0083] The second connection electrode 136 can be structurally and electrically connected to the second outer electrode 132 and the fourth outer electrode 134 and can have substantially the same width. In addition, specifically, the second connection electrode 136 can have a straight structure, but it is not particularly limited thereto, and any structure that can achieve electrical connection, such as a bent shape or a stepped shape, can be applied.

[0084] In this case, when the shortest distances from the second connection electrode 136 to the first outer electrode 131 and the third outer electrode 133 are defined as Bd1 and Bd2, respectively, and the width of the second connection electrode 136 is defined as Bd3, 90 μm ≤ Bd1, 90 μm ≤ Bd2, and 0 μm < Bd3 can be satisfied.

[0085] In this case, when the second connection electrode 136 has substantially the same width, the average value of the widths measured at five equally spaced points in the second connection electrode 136 can be defined as the width or average width of the second connection electrode 136. On the other hand, if the second connection electrode 136 does not have substantially the same width or is difficult to measure, the larger value of the dimension in the linear direction parallel to the shortest distance from the second connection electrode 136 to the first outer electrode 131 and the dimension in the linear direction parallel to the shortest distance from the second connection electrode 136 to the third outer electrode 133 can be defined as the width of the second connection electrode 136.

[0086] On the other hand, when 90 μm ≤ Bd1, 90 μm ≤ Bd2, and 0 μm < Bd3 are satisfied, since the electrical connectivity between the second outer electrode 132 and the fourth outer electrode 134 is not deteriorated, the capacitance can be easily measured, and the mechanical strength can be improved to prevent defects in the multilayer electronic component 100. In addition, short circuits can be prevented.

[0087] On the other hand, in the case where Bd1 < 90 μm or Bd2 < 90 μm, the spacing distance between the second connection electrode 136 and the first outer electrode 131 or the spacing distance between the second connection electrode 136 and the third outer electrode 133 is relatively short, so there is a risk of electrical connection or short circuit. The upper limit values of Bd1 and Bd2 are not particularly limited and can be determined by the size of the multilayer electronic component and / or Bd3.

[0088] The lower limit value of Bd3 is not particularly limited. For example, it can be greater than 0 μm as long as it is sufficient to electrically connect the second outer electrode 132 and the fourth outer electrode 134. On the other hand, the upper limit value of Bd3 is also not particularly limited and can be determined by the size of the multilayer electronic component, Bd1, and / or Bd2.

[0089] On the other hand, for example, when the first connection electrode 135 and the second connection electrode 136 have a straight structure, for example, when projected from the first direction, the first connection electrode 135 and the second connection electrode 136 can intersect diagonally.

[0090] The first outer electrode 131, the second outer electrode 132, the third outer electrode 133, and the fourth outer electrode 134 can be provided on the main body 110 and spaced apart from each other.

[0091] More specifically, the first outer electrode 131 is provided on at least one of the third surface 3 and the fifth surface 5, the second outer electrode 132 is provided on at least one of the fourth surface 4 and the fifth surface 5, the third outer electrode 133 is provided on at least one of the fourth surface 4 and the sixth surface 6, and the fourth outer electrode 134 can be provided on at least one of the third surface 3 and the sixth surface 6.

[0092] On the other hand, the internal electrode according to the embodiment may include a first internal electrode 121, a second internal electrode 122, a third internal electrode 123 and a fourth internal electrode 124, and may be connected to a first external electrode 131, a second external electrode 132, a third external electrode 133 and a fourth external electrode 134 through a first lead-out portion 121a, a second lead-out portion 122b, a third lead-out portion 123c and a fourth lead-out portion 124d, respectively.

[0093] In more detail, the first inner electrode 121 may be connected to the first outer electrode 131 via a first lead portion 121 a , the second inner electrode 122 may be connected to the second outer electrode 132 via a second lead portion 122 b , the third inner electrode 123 may be connected to the third outer electrode 133 via a third lead portion 123 c , and the fourth inner electrode 124 may be connected to the fourth outer electrode 134 via a fourth lead portion 124 d .

[0094] In detail, the first inner electrode 121 may be connected to the first outer electrode 131 without being connected to the second outer electrode 132, the third outer electrode 133 and the fourth outer electrode 134, the second inner electrode 122 may be connected to the second outer electrode 132 without being connected to the first outer electrode 131, the third outer electrode 133 and the fourth outer electrode 134, the third inner electrode 123 may be connected to the third outer electrode 133 without being connected to the first outer electrode 131, the second outer electrode 132 and the fourth outer electrode 134, and the fourth inner electrode 124 may be connected to the fourth outer electrode 134 without being connected to the first outer electrode 131, the second outer electrode 132 and the third outer electrode 133.

[0095] Since the first internal electrode 121, the second internal electrode 122, the third internal electrode 123 and the fourth internal electrode 124 are connected to the first external electrode 131, the second external electrode 132, the third external electrode 133 and the fourth external electrode 134 through the first lead portion 121a, the second lead portion 122b, the third lead portion 123c and the fourth lead portion 124d respectively, low ESL characteristics can be achieved in a high frequency range.

[0096] In the present disclosure, the internal electrodes 121 , 122 , 123 , and 124 may be composed of lead-out portions 121 a , 122 b , 123 c , and 124 d and a main portion (not specified) other than the lead-out portions 121 a , 122 b , 123 c , and 124 d .

[0097] In more detail, the first lead portion 121a, the second lead portion 122b, the third lead portion 123c, and the fourth lead portion 124d may be regions where the first internal electrode 121, the second internal electrode 122, the third internal electrode 123, and the fourth internal electrode 124 do not overlap with each other in the first direction. The first lead portion 121a, the second lead portion 122b, the third lead portion 123c, and the fourth lead portion 124d do not overlap with each other in the first direction, and thus may not form a capacitor.

[0098] In addition, the main portion may be a region where the first internal electrode 121, the second internal electrode 122, the third internal electrode 123 and the fourth internal electrode 124 overlap with each other in the first direction, and a capacitor may be formed when the main portion is overlapped in the first direction, and the region may be referred to as a capacitor forming portion.

[0099] In more detail, the main portion may include a first main portion, a second main portion, a third main portion and a fourth main portion, the first main portion being the region of the first inner electrode 121 excluding the first lead portion 121a, the second main portion being the region of the second inner electrode 122 excluding the second lead portion 122b, the third main portion being the region of the third inner electrode 123 excluding the third lead portion 123c, and the fourth main portion being the region of the fourth inner electrode 124 excluding the fourth lead portion 124d.

[0100] In detail, the internal electrode may include a lead portion as a region where capacitance is not formed and a main portion as a region where capacitance is formed.

[0101] On the other hand, the shape of the lead portion may vary. For example, the first lead portion may contact a portion of at least one of the third surface 3 and the fifth surface 5, the second lead portion may contact a portion of at least one of the fourth surface 4 and the fifth surface 5, the third lead portion may contact a portion of at least one of the fourth surface 4 and the sixth surface 6, and the fourth lead portion may contact a portion of at least one of the third surface 3 and the sixth surface 6.

[0102] For example, it may be sufficient that the first lead portion contacts a portion of at least one of the third surface 3 and the fifth surface 5. For example, this may include a case where the first lead portion does not contact both the third surface 3 and the fifth surface 5 at the same time, and a case where the first lead portion contacts both the third surface 3 and the fifth surface 5 at the same time. This description may also apply to the second to fourth lead portions.

[0103] For another example, see Figure 7B and Figure 7D , the second internal electrode 322 may further include a second additional lead-out portion 322 d connected to the fourth external electrode 334 , and the fourth internal electrode 324 may further include a fourth additional lead-out portion 324 b connected to the second external electrode 332 .

[0104] For example, the second inner electrode 322 may be connected to the second outer electrode 332 via the second lead portion 322b and may be connected to the fourth outer electrode 334 via the second additional lead portion 322d, and the fourth inner electrode 324 may be connected to the fourth outer electrode 334 via the fourth lead portion 324d and may be connected to the second outer electrode 332 via the fourth additional lead portion 324b.

[0105] For details, refer to 7A to 7D , the first inner electrode 321 is connected to the first outer electrode 331 , the second inner electrode 322 and the fourth inner electrode 324 may be simultaneously connected to the second outer electrode 332 and the fourth outer electrode 334 , and the third inner electrode 323 may be connected to the third outer electrode 333 .

[0106] For example, when the second internal electrode 322 and the fourth internal electrode 324 are simultaneously connected to the second external electrode 332 and the fourth external electrode 334, the respective lead portions included in the second internal electrode 322 and the fourth internal electrode 324 may overlap each other in the first direction. In this case, the shape of the second internal electrode and the shape of the fourth internal electrode may be substantially the same, but are not particularly limited thereto.

[0107] Return to reference Figures 1 to 3B , when the first to fourth internal electrodes are sequentially arranged, the first internal electrode, the second internal electrode, the third internal electrode, and the fourth internal electrode may be sequentially arranged in the first direction.

[0108] Therefore, the first external electrode 131, the second external electrode 132, the third external electrode 133 and the fourth external electrode 134 may respectively contact the first lead portion 121a, the second lead portion 122b, the third lead portion 123c and the fourth lead portion 124d, and may be set to cover the first lead portion 121a, the second lead portion 122b, the third lead portion 123c and the fourth lead portion 124d, respectively.

[0109] In this case, “disposed to cover” means that the external electrodes 131 , 132 , 133 and 134 are disposed so that the first lead portion 121 a , the second lead portion 122 b , the third lead portion 123 c and the fourth lead portion 124 d contacting at least one surface of the body 110 are not exposed to the outside.

[0110] In more detail, the first external electrode 131 contacts the first lead portion 121a and is configured to cover the first lead portion 121a, the second external electrode 132 contacts the second lead portion 122b and is configured to cover the second lead portion 122b, the third external electrode 133 contacts the third lead portion 123c and is configured to cover the third lead portion 123c, and the fourth external electrode 134 contacts the fourth lead portion 124d and can be configured to cover the fourth lead portion 124d.

[0111] It is sufficient that the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134 are provided on at least one of the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 of the body. However, in order to facilitate mounting on a board, excellent moisture-resistant reliability, and improved mechanical strength, in detail, the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134 may be provided to extend over a portion of the first surface 1 and a portion of the second surface 2 of the body 110.

[0112] The size of the multilayer electronic component 100 does not need to be particularly limited.

[0113] However, in order to simultaneously obtain the effects of reducing low ESL in the high frequency range, improved moisture resistance reliability, improved mechanical strength and convenience of capacitance measurement, the effects according to the present disclosure may be more significant in a multilayer electronic component 100 having the following form-factor shape: having an ultra-small size and in which the length (dimension in the second direction) and the width (dimension in the third direction) of the multilayer electronic component 100 are basically the same, such as 0606 (length × width: 0.6 mm × 0.6 mm) size or smaller.

[0114] In this case, "the length and width are substantially the same" does not mean they are exactly the same, but rather includes an acceptable error range. Specifically, it may mean that the length and width differ by 10% or less, and more specifically, the length and width differ by 5% or less. When the length and width are substantially the same, the current loop can be improved, and a multilayer electronic component 100 with low ESL can be more easily obtained.

[0115] Hereinafter, the present disclosure will be described in more detail through examples, but these are intended to help detailed understanding of the present disclosure, and the scope of the present disclosure is not limited by the examples.

[0116] First embodiment In reference Figures 1 to 3BIn describing the multilayer electronic component 100 as the first embodiment, the first internal electrode 121 can be connected to the first external electrode 131 via a first lead portion 121a arranged to contact a portion of the third surface 3 and a portion of the fifth surface 5. The first external electrode 131 is arranged to cover the first lead portion 121a over a portion of the third surface 3 and a portion of the fifth surface 5. The second internal electrode 122 can be connected to the second external electrode 132 via a second lead portion 122b arranged to contact a portion of the fourth surface 4 and a portion of the fifth surface 5. The second external electrode 132 is arranged to cover the second lead portion 122b over a portion of the fourth surface 4 and a portion of the fifth surface 5. The third internal electrode 123 can be connected to the third external electrode 133 via a third lead portion 123c arranged to contact a portion of the fourth surface 4 and a portion of the sixth surface 6. The third external electrode 133 is arranged to cover the third lead portion 123c over a portion of the fourth surface 4 and a portion of the sixth surface 6. The fourth inner electrode 124 may be connected to the fourth outer electrode 134 via a fourth lead portion 124 d disposed in contact with a portion of the third surface 3 and a portion of the sixth surface 6, and the fourth outer electrode 134 is disposed so as to cover the fourth lead portion 124 d on a portion of the third surface 3 and a portion of the sixth surface 6. Thus, the first inner electrode 121, the second inner electrode 122, the third inner electrode 123, and the fourth inner electrode 124 may be connected to the first outer electrode 131, the second outer electrode 132, the third outer electrode 133, and the fourth outer electrode 134, respectively.

[0117] At this time, the first external electrode 131 and the third external electrode 133 are connected via the first connection electrode 135 provided on the second surface 2, and the second external electrode 132 and the fourth external electrode 134 are connected via the second connection electrode 136 provided on the first surface 1. Therefore, the first external electrode 131, the third external electrode 133, and the first connection electrode 135 are connected, and the second external electrode 132, the fourth external electrode 134, and the second connection electrode 136 are connected, so that capacitance can be measured by applying different voltages to each of them.

[0118] For example, the capacitance of the multilayer electronic component 100 may be measured by applying a first voltage to the first external electrode 131 and a second voltage to the second external electrode 132 .

[0119] Without the first connection electrode 135 and the second connection electrode 136, there are many cases where different voltages are applied to any two of the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134, respectively, and thus the measured value of the capacitance may vary or be inaccurate. However, according to an embodiment of the present disclosure, there is an advantage that capacitance can be conveniently measured by applying voltages to two locations.

[0120] In one embodiment, the first connection electrode 135 may extend between the first external electrode 131 and the third external electrode 133 in a first diagonal direction relative to the third surface 3 to the sixth surface 6 of the body 110. The second connection electrode 136 may extend between the second external electrode 132 and the fourth external electrode 134 in a second diagonal direction relative to the third surface 3 to the sixth surface 6 of the body 110. In this way, the first connection electrode 135 and the second connection electrode 136 may intersect each other when projected from the first direction.

[0121] Second embodiment In reference Figures 4 to 5B In describing the multilayer electronic component 200 as the second embodiment, some of the configurations of the multilayer electronic component 200 may be the same as or similar to the configurations of the multilayer electronic component 100 of the first embodiment. For example, the configurations of the body 210 and the connecting electrodes 235 and 236 in the multilayer electronic component 200 may be the same as the configurations of the body 110 and the connecting electrodes 135 and 136 in the multilayer electronic component 100. However, the shapes of the first external electrode 231, the second external electrode 232, the third external electrode 233, and the fourth external electrode 234 may be different from the shapes of the first external electrode 131, the second external electrode 132, the third external electrode 133, and the fourth external electrode 134 of the first embodiment. Specifically, based on a top view or a bottom view, the shapes of the external electrodes 131, 132, 133, and 134 may be formed as quadrilaterals, and the shapes of the external electrodes 231, 232, 233, and 234 may be formed as triangles. However, the shapes of the external electrodes 231, 232, 233, and 234 may be appropriately designed and changed without departing from the scope of the present disclosure.

[0122] Third embodiment In reference 6A to 7DIn describing the multilayer electronic component 300 as the third embodiment, some of the configurations of the multilayer electronic component 300 may be the same as or similar to the configurations of the multilayer electronic component 100 of the first embodiment. For example, the configuration of the dielectric layer 311 in the multilayer electronic component 300 may be the same as the configuration of the dielectric layer 111 in the multilayer electronic component 100. The first internal electrode 321 may be connected to the first external electrode 331 via a first lead portion 321a disposed in contact with a portion of the third surface 3 and a portion of the fifth surface 5. The first external electrode 331 is disposed so as to cover the first lead portion 321a over a portion of the third surface 3 and a portion of the fifth surface 5. The second internal electrode 322 may be connected to the second external electrode 332 via a second lead portion 322b disposed in contact with a portion of the fourth surface 4 and a portion of the fifth surface 5. The second external electrode 332 is disposed so as to cover the second lead portion 322b over a portion of the fourth surface 4 and a portion of the fifth surface 5. In addition, the second inner electrode 322 can be connected to the fourth outer electrode 334 via a second additional lead portion 322d provided in contact with a portion of the third surface 3 and a portion of the sixth surface 6, and the fourth outer electrode 334 is provided to cover the second additional lead portion 322d on a portion of the third surface 3 and a portion of the sixth surface 6. Therefore, the second inner electrode 322 can be simultaneously connected to the second outer electrode 332 and the fourth outer electrode 334. The third inner electrode 323 can be connected to the third outer electrode 333 via a third lead portion 323c provided in contact with a portion of the fourth surface 4 and a portion of the sixth surface 6, and the third outer electrode 333 is provided to cover the third lead portion 323c on a portion of the fourth surface 4 and a portion of the sixth surface 6.

[0123] The fourth internal electrode 324 may have the same shape as the second internal electrode 322. Therefore, when the first to fourth internal electrodes are sequentially arranged, the internal electrodes may be stacked and arranged in the first direction in the order of the first internal electrode 321, the second internal electrode 322, the third internal electrode 323, the fourth internal electrode 324, the third internal electrode 323, the second internal electrode 322, the first internal electrode 321, and so on.

[0124] At this time, since the second internal electrode 322 is connected to the second external electrode 332 and the fourth external electrode 334, capacitance can be easily measured even if only the first connection electrode 335 is provided on the second surface 2 of the body 310 and connected to the first external electrode 331 and the third external electrode 333. For example, since the second connection electrode is not provided on the first surface 1 of the body 310, the second connection electrode is not connected to the second external electrode 332 and the fourth external electrode 334. For example, even if different voltages are applied to the first external electrode 331 and the second external electrode 332, the capacitance of the multilayer electronic component 300 can be measured.

[0125] Fourth embodiment In reference 8A to 9D In describing the multilayer electronic component 400 as a fourth embodiment, the configuration of the dielectric layer 411 in the multilayer electronic component 400 can be the same as the configuration of the dielectric layer 111 in the multilayer electronic component 100. However, in the multilayer electronic component 400, the first internal electrode 421 can be connected to the first external electrode 431 via a first lead portion 421a in contact with a portion of the third surface 3, with the first external electrode 431 being arranged to cover the first lead portion 421a on a portion of the third surface 3. The second internal electrode 422 can be connected to the second external electrode 432 via a second lead portion 422b in contact with a portion of the fifth surface 5, with the second external electrode 432 being arranged to cover the second lead portion 422b on a portion of the fifth surface 5. The third internal electrode 423 can be connected to the third external electrode 433 via a third lead portion 423c in contact with a portion of the fourth surface 4, with the third external electrode 433 being arranged to cover the third lead portion 423c on a portion of the fourth surface 4. The fourth internal electrode 424 may be connected to the fourth external electrode 434 through a fourth lead portion 424 d contacting a portion of the sixth surface 6 , and the fourth external electrode 434 is disposed to cover the fourth lead portion 424 d on a portion of the sixth surface 6 .

[0126] In this case, the first external electrode 431 and the third external electrode 433 are connected by the first connection electrode 435 provided on the second surface 2, and the second external electrode 432 and the fourth external electrode 434 are connected by the second connection electrode 436 provided on the first surface 1. Therefore, the first external electrode 431, the third external electrode 433, and the first connection electrode 435 are connected, and the second external electrode 432, the fourth external electrode 434, and the second connection electrode 436 are connected. Therefore, the capacitance can be measured by applying different voltages to each.

[0127] Fifth embodiment In reference 10A to 11DIn describing the multilayer electronic component 500 as the fifth embodiment, the configuration of the dielectric layer 511 in the multilayer electronic component 500 can be the same as the configuration of the dielectric layer 111 in the multilayer electronic component 100. However, in the multilayer electronic component 500, the first internal electrode 521 can be connected to the first external electrode 531 via a first lead portion 521a in contact with a portion of the fifth surface 5, with the first external electrode 531 being arranged to cover the first lead portion 521a on a portion of the fifth surface 5. The second internal electrode 522 can be connected to the second external electrode 532 via a second lead portion 522b in contact with a portion of the fifth surface 5, with the second external electrode 532 being arranged to cover the second lead portion 522b on a portion of the fifth surface 5. The third internal electrode 523 can be connected to the third external electrode 533 via a third lead portion 523c in contact with a portion of the sixth surface 6, with the third external electrode 533 being arranged to cover the third lead portion 523c on a portion of the sixth surface 6. The fourth internal electrode 524 may be connected to the fourth external electrode 534 through a fourth lead portion 524 d contacting a portion of the sixth surface 6 , and the fourth external electrode 534 is disposed to cover the fourth lead portion 524 d on a portion of the sixth surface 6 .

[0128] In this case, the first external electrode 531 and the third external electrode 533 may be connected via the first connection electrode 535 provided on the second surface 2, and the second external electrode 532 and the fourth external electrode 534 may be connected via the second connection electrode 536 provided on the first surface 1. Therefore, the first external electrode 531, the third external electrode 533, and the first connection electrode 535 are connected, and the second external electrode 532, the fourth external electrode 534, and the second connection electrode 536 are connected. Therefore, capacitance can be measured by applying different voltages to each other.

[0129] As described above, according to the embodiments, the measurement of capacitance of a multilayer electronic component can be facilitated.

[0130] Can improve the mechanical strength of multi-layer electronic components.

[0131] The appearance of multi-layer electronic components can be easily distinguished.

[0132] A multilayer electronic component with improved high-frequency characteristics (low ESL) can be provided.

[0133] Although the embodiments of the present disclosure have been described in detail above, the present disclosure is not limited by the above embodiments and drawings, but is limited by the appended claims. Therefore, within the scope of the technical spirit of the present disclosure described in the claims, those skilled in the art will be able to make various substitutions, modifications, and changes, which also fall within the scope of the present disclosure.

[0134] The term "embodiment" used in this specification does not necessarily mean the same embodiment, but is provided to emphasize and describe different unique features. However, the embodiments presented above do not exclude implementation in combination with features of another embodiment. For example, even if a matter described in one detailed embodiment is not described in another embodiment, unless there is a contradictory or contrary description of the matter in the other embodiment, the matter can be understood as a description related to the other embodiment.

[0135] The terms used in this specification are only used to describe the embodiments and are not intended to limit the present disclosure. In this case, unless the context clearly indicates otherwise, a singular expression also includes a plural expression.

[0136] While example embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a body including a dielectric layer and inner electrodes alternately arranged with the dielectric layer in a first direction, and the body having a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction; as well as an outer electrode, on said body, wherein the inner electrode comprises a lead portion and is connected to the outer electrode via the lead portion, The external electrodes include first, second, third, and fourth external electrodes that are spaced apart from each other, and include a first connection electrode that connects the first and third external electrodes, and The first connection electrode includes a conductive material.

2. The multilayer electronic component according to claim 1, wherein The external electrode further includes a second connecting electrode connecting the second external electrode and the fourth external electrode, and The second connection electrode includes a conductive material.

3. The multilayer electronic component according to claim 1, wherein: When the shortest distances from the first connection electrode to the second external electrode and the fourth external electrode are defined as Td1 and Td2, respectively, and the width of the first connection electrode is defined as Td3, 90 μm ≤ Td1, 90 μm ≤ Td2, and 0 μm are satisfied. <Td3。 4. The multilayer electronic component according to claim 2, wherein: When the shortest distances from the second connection electrode to the first external electrode and the third external electrode are defined as Bd1 and Bd2, respectively, and the width of the second connection electrode is defined as Bd3, 90 μm ≤ Bd1, 90 μm ≤ Bd2, and 0 μm are satisfied. <Bd3。 5. The multilayer electronic component according to claim 1, wherein The first external electrode is arranged on at least one of the third surface and the fifth surface, the second external electrode is arranged on at least one of the fourth surface and the fifth surface, the third external electrode is arranged on at least one of the fourth surface and the sixth surface, and the fourth external electrode is arranged on at least one of the third surface and the sixth surface.

6. The multilayer electronic component according to claim 1, wherein The first connecting electrode is disposed on the second surface.

7. The multilayer electronic component according to claim 2, wherein: The first connection electrode is disposed on the second surface, and the second connection electrode is disposed on the first surface.

8. The multilayer electronic component according to claim 1, wherein The internal electrode includes a first internal electrode, a second internal electrode, a third internal electrode and a fourth internal electrode, the first internal electrode includes a first lead-out portion and is connected to the first external electrode through the first lead-out portion, the second internal electrode includes a second lead-out portion and is connected to the second external electrode through the second lead-out portion, the third internal electrode includes a third lead-out portion and is connected to the third external electrode through the third lead-out portion, and the fourth internal electrode includes a fourth lead-out portion and is connected to the fourth external electrode through the fourth lead-out portion.

9. The multilayer electronic component according to claim 8, wherein: The second inner electrode further includes a second additional lead-out portion connected to the fourth outer electrode, and The fourth internal electrode further includes a fourth additional lead-out portion connected to the second external electrode.

10. The multilayer electronic component according to claim 1, wherein The difference between the dimension of the multi-layer electronic component in the second direction and the dimension of the multi-layer electronic component in the third direction is 10% or less.

11. A multi-layer electronic component, comprising: a main body including dielectric layers and internal electrodes alternately arranged with the dielectric layers in a first direction, and the main body having a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction; and external electrodes provided on the main body, wherein the internal electrodes include lead-out portions and are connected to the external electrodes through the lead-out portions, the external electrodes include a first external electrode, a second external electrode, a third external electrode and a fourth external electrode spaced apart from each other, a first connection electrode connecting the first external electrode and the third external electrode, and a second connection electrode connecting the second external electrode and the fourth external electrode.

12. The multilayer electronic component according to claim 11, wherein When the shortest distances from the first connection electrode to the second external electrode and the fourth external electrode are defined as Td1 and Td2 respectively, and the width of the first connection electrode is defined as Td3, 90 μm ≤ Td1, 90 μm ≤ Td2 and 0 μm < Td3 are satisfied, and when the shortest distances from the second connection electrode to the first external electrode and the third external electrode are defined as Bd1 and Bd2 respectively, and the width of the second connection electrode is defined as Bd3, 90 μm ≤ Bd1, 90 μm ≤ Bd2 and 0 μm < Bd3 are satisfied.

13. The multilayer electronic component according to claim 11, wherein The internal electrodes include a first internal electrode, a second internal electrode, a third internal electrode and a fourth internal electrode. The first internal electrode includes a first lead-out portion and is connected to the first external electrode through the first lead-out portion. The second internal electrode includes a second lead-out portion and is connected to the second external electrode through the second lead-out portion. The third internal electrode includes a third lead-out portion and is connected to the third external electrode through the third lead-out portion. The fourth internal electrode includes a fourth lead-out portion and is connected to the fourth external electrode through the fourth lead-out portion.

14. The multilayer electronic component according to claim 11, wherein The first external electrode is provided on at least one of the third surface and the fifth surface. The second external electrode is provided on at least one of the fourth surface and the fifth surface. The third external electrode is provided on at least one of the fourth surface and the sixth surface. And the fourth external electrode is provided on at least one of the third surface and the sixth surface.

15. The multilayer electronic component according to claim 11, wherein The first connection electrode is provided on the second surface, and the second connection electrode is provided on the first surface.

16. The multilayer electronic component according to claim 11, wherein The difference between the dimension of the multi-layer electronic component in the second direction and the dimension of the multi-layer electronic component in the third direction is 10% or less.

17. A multi-layer electronic component, comprising: a body including a dielectric layer and inner electrodes alternately arranged with the dielectric layer in a first direction, and the body having a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction; as well as an outer electrode, disposed on the body, wherein the inner electrode comprises a lead portion and is connected to the outer electrode via the lead portion, The external electrodes include first, second, third, and fourth external electrodes that are spaced apart from each other, and include a first connection electrode that connects the first and third external electrodes, and The first connection electrode extends between the first and third external electrodes in a first diagonal direction with respect to the third, fourth, fifth, and sixth surfaces of the body.

18. The multilayer electronic component according to claim 17, wherein: The external electrode further includes a second connecting electrode connecting the second external electrode and the fourth external electrode, and The second connection electrode extends between the second and fourth external electrodes in a second diagonal direction with respect to the third, fourth, fifth, and sixth surfaces of the body.

19. The multilayer electronic component according to claim 18, wherein: The first connection electrode and the second connection electrode intersect each other when projected from the first direction.

20. The multilayer electronic assembly of claim 17, wherein: When viewed from the first direction, each of the first, second, third, and fourth external electrodes has a quadrilateral or a triangle shape.

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