Double-half-wafer detection all-in-one machine for solar silicon wafer

Abstract

The invention discloses a double-half-wafer detection all-in-one machine for solar silicon wafers, which comprises a front-section conveying rail, an AOI detection mechanism and an IV detection mechanism, and is characterized in that the AOI detection mechanism is located between the front-section conveying rail and the IV detection mechanism; two sections of half-piece conveying rails are arranged on the front section of conveying rail; the AOI detection mechanism comprises a four-station rotary table, a back face AOI detection instrument assembly, a front face AOI detection instrument assembly and an AOI detection conveying rail. And the IV detection mechanism comprises a working platform, an index plate assembly and two groups of detection mechanisms. According to the double-half-wafer detection all-in-one machine for the solar silicon wafer, the double-half-wafer silicon wafer is conveyed at the same time, AOI detection and IV detection are carried out in sequence, automatic work is carried out, a probe is accurately made to be connected with grid lines on the double-half-wafer silicon wafer, the detection efficiency is improved, the productivity is improved along with increase, and the integrated multifunctional structure meets the requirements of production before and after.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer production, and in particular to a double-half-wafer detection integrated machine for solar silicon wafers. Background Art

[0002] After printing, crystalline silicon photovoltaic solar wafers need to undergo AOI and IV testing. The full name of AOI testing is automatic optical inspection, which is a device that detects common defects encountered in printing production based on optical principles; IV testing refers to the current-voltage characteristic curve (IV curve) test of photovoltaic modules. Only silicon wafers that have passed the test and are considered good will enter the next production process equipment. The existing double-half-cell silicon wafers require multiple devices to cooperate in the above-mentioned AOI and IV testing processes, which affects the front-to-back docking process of testing and processing, and the production capacity is relatively low. Summary of the invention

[0003] One object of the present invention is to provide an all-in-one machine for detecting double half-wafers of solar silicon wafers, which detects double half-wafers of silicon wafers, integrates AOI detection and IV detection, saves processes and steps, and improves detection capacity.

[0004] To achieve this object, the present invention adopts the following technical solutions:

[0005] A solar silicon wafer double half wafer inspection integrated machine, comprising a front section conveyor rail, an AOI inspection mechanism and an IV inspection mechanism, wherein the AOI inspection mechanism is located between the front section conveyor rail and the IV inspection mechanism;

[0006] The front conveyor rail is provided with two half-piece conveyor rails;

[0007] The AOI inspection mechanism includes a four-station turntable, a back AOI inspection instrument assembly, a front AOI inspection instrument assembly and an AOI inspection conveyor rail. The four-station turntable is located at the front end of the AOI inspection conveyor rail, the back AOI inspection instrument assembly is located below the front end of the four-station turntable, and the front AOI inspection is installed above the AOI inspection conveyor rail.

[0008] The IV detection mechanism includes a working platform, a dividing plate assembly and two groups of detection mechanisms, the dividing plate assembly is located in the middle of the working platform, the two groups of detection mechanisms are respectively located on both sides of the front workstation of the dividing plate assembly, the detection mechanism includes a UVW base, an upper probe rack and a lower probe rack, a UVW deviation correction and alignment assembly is installed at the lower end of the UVW base, the UVW deviation correction and alignment assembly includes two groups of X-axis modules and one group of Y-axis modules, the upper probe rack and the lower probe rack are respectively movable on the UVW base in the vertical direction, the lower probe rack is installed with a detection probe, and the two groups of detection mechanisms move independently of each other.

[0009] As a preferred technical solution, a temporary storage linear module is arranged on the front section conveying rail, a temporary storage frame is arranged at the driving end of the temporary storage linear module, and the temporary storage frame moves laterally on the side of the half-piece conveying rail.

[0010] As a preferred technical solution, a material feeding linear module is arranged on the front section conveying rail, and a material feeding longitudinal module is connected to the driving end of the material feeding linear module, and the material feeding longitudinal module moves laterally on the side of the half-piece conveying rail, and a material feeding frame is connected to the driving end of the material feeding longitudinal module, and the material feeding frame moves up and down along the vertical direction.

[0011] As a preferred technical solution, a splint positioning mechanism is arranged in the middle part of the half-piece conveyor rail, and the splint positioning mechanism includes a splint positioning motor, a splint positioning synchronous belt and a splint positioning support. A splint positioning wheel is connected to the driving end of the splint positioning motor, the splint positioning synchronous belt is transmission-connected to the splint positioning wheel, and the splint positioning support is fixed on the splint positioning synchronous belt.

[0012] As a preferred technical solution, an air blowing and cooling pipe is provided at the front end of the half-piece conveyor rail, and an ion anti-static air knife is provided at the rear end of the half-piece conveyor rail.

[0013] As a preferred technical solution, an AOI rotating shaft is arranged above the four-station turntable, and four AOI adsorption modules are arranged on the periphery of the four-station turntable.

[0014] As a preferred technical solution, two front half-piece tracks and two rear half-piece tracks are respectively arranged on both sides of the dividing plate assembly, and the front half-piece tracks and the rear half-piece tracks are driven by track motors to drive track belts to transport silicon wafers.

[0015] As a preferred technical solution, a first walking arm and a second walking arm are installed on both sides of the front half track and both sides of the rear half track, and a walking linear module is provided on the first walking arm and the second walking arm. A moving plate is connected to the driving end of the walking linear module, and a negative pressure adsorption plate is fixed on the inner end of the moving plate.

[0016] As a preferred technical solution, the X-axis module and the Y-axis module both include a motor mounting seat, a module motor, an adjustment screw and an adjustment slide, the module motor is fixed on the motor mounting seat, the driving end of the module motor is transmission-connected to the adjustment screw, the adjustment screw is threadedly connected to the adjustment nut of the adjustment slide, the adjustment slide slides along the length direction of the adjustment screw, and the adjustment slide has a connecting bearing, the connecting bearing slides on the adjustment slide, the moving direction of the connecting bearing is perpendicular to the moving direction of the adjustment slide, the edge of the UVW base is locked in the connecting bearing, and the two groups of X-axis modules plus one group of Y-axis modules jointly control the T-axis steering of the UVW base on one side.

[0017] As a preferred technical solution, the UVW base is equipped with an upper linear module and a lower linear module, the upper linear module controls the vertical movement of the upper probe frame, and the lower linear module controls the vertical movement of the lower probe frame.

[0018] The beneficial effects of the present invention are: providing an all-in-one machine for detecting double half-wafers of solar silicon wafers, which simultaneously transports double half-wafers of silicon wafers, undergoes AOI detection and IV detection in succession, and works automatically, accurately connecting the probe to the gate line on the double half-wafers of silicon wafers, thereby improving detection efficiency and increasing production capacity, and the integrated multifunctional structure meets the needs of front-end and back-end production. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention is further described in detail below based on the accompanying drawings and embodiments.

[0020] Figure 1 It is a schematic diagram of the overall structure of a double half-wafer detection integrated machine for solar silicon wafers according to an embodiment;

[0021] Figure 2 It is a schematic structural diagram of the front section conveyor rail described in the embodiment;

[0022] Figure 3 This is a schematic diagram of the structure of the air blowing cooling pipe described in the embodiment;

[0023] Figure 4 It is a structural schematic diagram of the clamping plate positioning mechanism described in the embodiment;

[0024] Figure 5 This is a schematic diagram of the structure of the ion static removal air knife described in the embodiment;

[0025] Figure 6 It is a structural schematic diagram of the AOI detection mechanism described in the embodiment;

[0026] Figure 7It is a structural schematic diagram of the IV detection mechanism described in the embodiment;

[0027] Figure 8 It is a structural schematic diagram of the X-axis module (or Y-axis module) described in the embodiment;

[0028] Fig. 9 It is a schematic structural diagram of the upper probe rack (or lower probe rack) described in the embodiment.

[0029] Figures 1 to 9 middle:

[0030] 1. Front conveyor rail; 101. Half-sheet conveyor rail; 102. Temporary storage frame; 103. Refilling rack; 104. Clamp positioning mechanism; 105. Clamp positioning motor; 106. Clamp positioning support; 107. Air blowing and cooling pipe; 108. Ion anti-static air knife;

[0031] 2. AOI inspection mechanism; 201. Four-station turntable; 202. Back AOI inspection instrument assembly; 203. Front AOI inspection instrument assembly; 204. AOI inspection conveyor rail; 205. AOI rotating shaft; 206. AOI adsorption module;

[0032] 3. IV detection mechanism; 301. Working platform; 302. Indexing plate assembly; 303. Detection mechanism; 304. UVW base; 305. Upper probe rack; 306. Lower probe rack; 307. X-axis module; 308. Front half track; 309. Rear half track; 310. First walking arm; 311. Second walking arm; 312. Moving plate; 313. Motor mounting seat; 314. Module motor; 315. Adjusting screw rod; 316. Adjusting slide; 317. Connecting bearing; 318. Upper linear module; 319. Lower linear module. DETAILED DESCRIPTION

[0033] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0034] like Figures 1 to 9 As shown, in this embodiment, a double half-wafer inspection integrated machine for solar silicon wafers includes a front-end conveyor rail 1, an AOI inspection mechanism 2 and an IV inspection mechanism 3, and the AOI inspection mechanism 2 is located between the front-end conveyor rail 1 and the IV inspection mechanism 3.

[0035] Specifically, two sections of half-sheet conveyor rails 101 are arranged on the front conveyor rail 1; the AOI inspection mechanism 2 includes a four-station turntable 201, a back AOI inspection instrument assembly 202, a front AOI inspection instrument assembly 203 and an AOI inspection conveyor rail 204, the four-station turntable 201 is located at the front end of the AOI inspection conveyor rail 204, the back AOI inspection instrument assembly 202 is located below the front end of the four-station turntable 201, and the front AOI inspection is installed above the AOI inspection conveyor rail 204; the IV inspection mechanism 3 includes a working platform 301, a dividing plate assembly 302 and two groups of inspection mechanisms 303, The scale plate assembly 302 is located in the middle of the working platform 301, and the two groups of detection mechanisms 303 are respectively located on both sides of the front workstation of the scale plate assembly 302. The detection mechanism 303 includes a UVW base 304, an upper probe frame 305 and a lower probe frame 306. The lower end of the UVW base 304 is equipped with a UVW correction and alignment assembly. The UVW correction and alignment assembly includes two groups of X-axis modules 307 and one group of Y-axis modules. The upper probe frame 305 and the lower probe frame 306 are respectively movable on the UVW base 304 along the vertical direction. The lower probe frame 306 is equipped with a detection probe, and the two groups of detection mechanisms 303 move independently of each other.

[0036] After the printed double half-wafer comes out of the sintering furnace, it enters two sections of half-wafer conveyor rails 101 respectively. At the end of the half-wafer conveyor rails 101, the AOI inspection mechanism 2 simultaneously grabs the double half-wafer to the back AOI inspection instrument component 202 through the four-station turntable 201 for back-side inspection, and then turns to the AOI inspection conveyor rail 204. The AOI inspection conveyor rail 204 transports the double half-wafer to the front AOI inspection instrument component 203 for front-side inspection. Then the dividing plate assembly 302 on the IV inspection mechanism 3 controls the double half-wafer to arrive at the inspection mechanism 303. Under the joint action of two groups of X-axis modules 307 and one group of Y-axis modules, the lower probe frame 306 and the upper probe frame 305 on the UVW base 304 are controlled to align with the position of the half-wafer for IV inspection.

[0037] A temporary storage linear module is arranged on the front conveying rail 1, and a temporary storage frame 102 is arranged at the driving end of the temporary storage linear module. The temporary storage frame 102 moves laterally on the side of the half-piece conveying rail 101. The temporary storage frame 102 moves laterally on the side of the front conveying rail 1. When the temporary storage linear module on one side is fully loaded, the other side is placed, and the fully loaded side can be manually unloaded.

[0038] A feeding linear module is arranged on the front conveying rail 1, and a feeding longitudinal module is connected to the driving end of the feeding linear module. The feeding longitudinal module moves laterally on the side of the half-wafer conveying rail 101, and a feeding rack 103 is connected to the driving end of the feeding longitudinal module. The feeding rack 103 moves up and down along the vertical direction. After the feeding linear module approaches the front conveying rail 1, the upper and lower horizontal modules above the front conveying rail 1 control the upper and lower adsorption modules to suck up the half-wafer on the feeding rack 103 and place it in the front conveying rail 1. In order to ensure the height of the topmost silicon wafer, each time a half-wafer is taken out, the feeding longitudinal module controls the feeding rack 103 to raise one silicon wafer position until all the silicon wafers on the feeding rack 103 are taken away, and the feeding linear module leaves the front conveying rail 1 laterally, and after filling the silicon wafers, it repeatedly approaches the front conveying rail 1 for feeding.

[0039] A splint positioning mechanism 104 is provided in the middle of the half-sheet conveyor rail 101, and the splint positioning mechanism 104 includes a splint positioning motor 105, a splint positioning synchronous belt and a splint positioning support 106. A splint positioning wheel is connected to the driving end of the splint positioning motor 105, and the splint positioning synchronous belt is transmission-connected to the splint positioning wheel. The splint positioning support 106 is fixed on the splint positioning synchronous belt. The splint positioning motor 105 controls the rotation of the splint positioning wheel to drive the movement of the splint positioning synchronous belt, thereby making the splint positioning support 106 move closer to the middle of the half-sheet conveyor rail 101 to correct the position of the half-sheet silicon wafer.

[0040] An air blowing cooling pipe 107 is provided at the front end of the half-sheet conveyor rail 101, and an ion anti-static wind knife 108 is provided at the rear end of the half-sheet conveyor rail 101. The air blowing cooling pipe 107 performs cooling treatment, and the ion anti-static wind knife 108 is responsible for removing static electricity.

[0041] An AOI rotating shaft 205 is disposed above the four-station turntable 201 , and four AOI adsorption modules 206 are disposed on the periphery of the four-station turntable 201 . The rotation of the AOI rotating shaft 205 drives the four AOI adsorption modules 206 to transfer the half-sheet counterclockwise.

[0042] Two front half-piece tracks 308 and two rear half-piece tracks 309 are respectively arranged on both sides of the indexing disk assembly 302. The front half-piece tracks 308 and the rear half-piece tracks 309 are both driven by track motors to drive track belts to transport silicon wafers. Both sides of the front half-piece tracks 308 and both sides of the rear half-piece tracks 309 are installed with first walking arms 310 and second walking arms 311. Walking linear modules are arranged on the first walking arms 310 and the second walking arms 311. A moving plate 312 is connected to the driving end of the walking linear module. A negative pressure adsorption plate is fixed to the inner end of the moving plate 312. The two front half-piece tracks 308 are responsible for transferring the double half-pieces to the indexing disk assembly 302. The first walking arm 310 and the second walking arm 311 control the up and down movement of the double half-pieces on the indexing disk assembly 302. The negative pressure adsorption plate sucks up the half-pieces. The two rear half-piece tracks 309 are responsible for discharging the double half-pieces from the indexing disk assembly 302.

[0043] The X-axis module 307 and the Y-axis module both include a motor mounting seat 313, a module motor 314, an adjustment screw 315 and an adjustment slide 316. The module motor 314 is fixed on the motor mounting seat 313. The driving end of the module motor 314 is connected to the adjustment screw 315 in a transmission manner. The adjustment screw 315 is threadedly connected to the adjustment nut of the adjustment slide 316. The adjustment slide 316 slides along the length direction of the adjustment screw 315. The adjustment slide 316 has a connecting bearing 317, which slides on the adjusting screw 315. On the adjustment slide 316, the moving direction of the connecting bearing 317 is perpendicular to the moving direction of the adjustment slide 316, and the edge of the UVW base 304 is locked in the connecting bearing 317. Two groups of X-axis modules 307 plus a group of Y-axis modules jointly control the T-axis steering of the UVW base 304 on one side. In the UVW alignment, the two groups of X-axis modules 307 and a group of Y-axis in the above structure realize the X-axis translation, Y-axis translation and T-axis rotation of the upper probe frame 305 and the lower probe frame 306 to meet the alignment requirements.

[0044] The UVW base 304 is equipped with an upper linear module 318 and a lower linear module 319. The upper linear module 318 controls the vertical movement of the upper probe frame 305, and the lower linear module 319 controls the vertical movement of the lower probe frame 306. The upper linear module 318 enables the upper probe frame 305 to move downward and press on the upper surface of the half silicon wafer, while the lower linear module 319 enables the lower probe frame 306 to push upward and contact the gate line on the half silicon wafer, so that a loop is formed for IV detection.

[0045] It should be stated that the above-mentioned specific implementation methods are only preferred embodiments of the present invention and the technical principles used. Within the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by technicians familiar with this technical field should be included in the protection scope of the present invention.

Claims

1. A solar silicon wafer double half wafer detection integrated machine, characterized in that: It includes a front conveyor rail, an AOI detection mechanism and an IV detection mechanism, wherein the AOI detection mechanism is located between the front conveyor rail and the IV detection mechanism; The front conveyor rail is provided with two half-piece conveyor rails; The AOI inspection mechanism includes a four-station turntable, a back AOI inspection instrument assembly, a front AOI inspection instrument assembly and an AOI inspection conveyor rail. The four-station turntable is located at the front end of the AOI inspection conveyor rail, the back AOI inspection instrument assembly is located below the front end of the four-station turntable, and the front AOI inspection is installed above the AOI inspection conveyor rail. The IV detection mechanism includes a working platform, a dividing plate assembly and two groups of detection mechanisms, the dividing plate assembly is located in the middle of the working platform, the two groups of detection mechanisms are respectively located on both sides of the front workstation of the dividing plate assembly, the detection mechanism includes a UVW base, an upper probe rack and a lower probe rack, a UVW deviation correction and alignment assembly is installed at the lower end of the UVW base, the UVW deviation correction and alignment assembly includes two groups of X-axis modules and one group of Y-axis modules, the upper probe rack and the lower probe rack are respectively movable on the UVW base in the vertical direction, the lower probe rack is installed with a detection probe, and the two groups of detection mechanisms move independently of each other.

2. The solar silicon wafer double half wafer detection integrated machine according to claim 1, characterized in that: A temporary storage linear module is arranged on the front section conveying rail, a temporary storage frame is arranged at the driving end of the temporary storage linear module, and the temporary storage frame moves laterally on the side of the half-sheet conveying rail.

3. The solar silicon wafer double half wafer detection integrated machine according to claim 1, characterized in that: A material feeding linear module is arranged on the front section conveying rail, a material feeding longitudinal module is connected to the driving end of the material feeding linear module, the material feeding longitudinal module moves laterally on the side of the half-piece conveying rail, a material feeding frame is connected to the driving end of the material feeding longitudinal module, and the material feeding frame moves up and down along the vertical direction.

4. The solar silicon wafer double half wafer detection integrated machine according to claim 1, characterized in that: A splint positioning mechanism is arranged in the middle of the half-piece conveyor rail, and the splint positioning mechanism includes a splint positioning motor, a splint positioning synchronous belt and a splint positioning support. A splint positioning wheel is connected to the driving end of the splint positioning motor, the splint positioning synchronous belt is transmission-connected to the splint positioning wheel, and the splint positioning support is fixed on the splint positioning synchronous belt.

5. The solar silicon wafer double half wafer detection integrated machine according to claim 1, characterized in that: The front end of the half-piece conveying rail is provided with an air blowing and cooling pipe, and the rear end of the half-piece conveying rail is provided with an ion static removal air knife.

6. The solar silicon wafer double half wafer detection integrated machine according to claim 1, characterized in that: An AOI rotating shaft is arranged above the four-station turntable, and four AOI adsorption modules are arranged on the periphery of the four-station turntable.

7. The solar silicon wafer double half wafer detection integrated machine according to claim 1, characterized in that: Two front half-sheet tracks and two rear half-sheet tracks are respectively arranged on both sides of the indexing plate assembly. The front half-sheet tracks and the rear half-sheet tracks are driven by track motors to drive track belts to transport silicon wafers.

8. The solar silicon wafer double half wafer detection integrated machine according to claim 7, characterized in that: The first walking arm and the second walking arm are installed on both sides of the front half track and the back half track, and the first walking arm and the second walking arm are provided with a walking linear module, and a moving plate is connected to the driving end of the walking linear module, and a negative pressure adsorption plate is fixed on the inner end of the moving plate.

9. The solar silicon wafer double half wafer detection integrated machine according to claim 1, characterized in that: The X-axis module and the Y-axis module both include a motor mounting seat, a module motor, an adjustment screw and an adjustment slide. The module motor is fixed on the motor mounting seat. The driving end of the module motor is transmission-connected to the adjustment screw. The adjustment screw is threadedly connected to the adjustment nut of the adjustment slide. The adjustment slide slides along the length direction of the adjustment screw. The adjustment slide is provided with a connecting bearing. The connecting bearing slides on the adjustment slide. The moving direction of the connecting bearing is perpendicular to the moving direction of the adjustment slide. The edge of the UVW base is locked in the connecting bearing. The two groups of X-axis modules plus one group of Y-axis modules jointly control the T-axis steering of the UVW base on one side.

10. The solar silicon wafer double half wafer detection integrated machine according to claim 1, characterized in that: The UVW base is equipped with an upper linear module and a lower linear module. The upper linear module controls the vertical movement of the upper probe frame, and the lower linear module controls the vertical movement of the lower probe frame.

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