Control Method for Chip Die Bonding, Chip Packaging Production Line, and Storage Medium

Abstract

The present application discloses a control method for chip die bonding, a chip packaging production line and a storage medium. The control method includes: placing a wafer cutting piece on a loading station and placing a metal plate on a die bonding station; controlling a first vision module to perform image recognition processing on the wafer cutting piece on the loading station and generating a first movement trajectory of the loading station; adjusting the position of the loading station according to the first movement trajectory so that the die to be bonded on the bottom film is in the loading position; adjusting the position of the die bonding station according to a second movement trajectory; controlling a suction module to move to the loading position and suck the die at the loading position, controlling a dispensing module to move to the die bonding position and perform dispensing on the lead frame at the die bonding position; controlling the dispensing module to move away from the die bonding position, controlling the suction module to move from the loading position to the die bonding position, and placing the sucked die on the lead frame. The present application can improve the product quality and production accuracy.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and particularly to a control method for chip die bonding, a chip packaging production line, and a storage medium. Background Art

[0002] In semiconductor manufacturing, chip packaging, as a key link in integrated circuit production, has a crucial impact on the performance, reliability, and cost of the final product. With the continuous progress of chip technology, especially the miniaturization of chip size, the improvement of integration, and the expansion of production scale, traditional chip packaging processes face many challenges.

[0003] In the traditional die bonding process, the alignment between the wafer dicing sheet (carrying a large number of tiny chips) and the metal plate (or lead frame) in the subsequent packaging process often relies on the preset parameters of the mechanical positioning system or manual intervention. This method is not only time-consuming but also prone to introducing errors. And if there should be a chip at a certain position in the wafer dicing sheet, but the defect in the previous process causes no chip at this position. When the machine transfers the chips to the lead frame, when the loading station moves along the preset path in each cycle, it may result in no chip in a certain lead frame, thus affecting the die bonding quality of the entire metal sheet. Summary of the Invention

[0004] This application aims to solve at least one of the technical problems existing in the prior art. For this purpose, this application provides a control method for chip die bonding, a chip packaging production line, and a storage medium, which can improve the product quality and production accuracy.

[0005] In a first aspect, this application provides a control method for chip die bonding, which is applied to the chip packaging production line. The chip packaging production line includes a die bonding device and a baking device. The die bonding device includes a loading station, a die bonding station, a first vision module, a dispensing module, and a pick-up module. The pick-up module can move between a preset loading position and a die bonding position. The baking device includes a heating unit and a blowing module;

[0006] The control method includes:

[0007] Obtain a wafer dicing sheet and a metal plate, place the wafer dicing sheet on the loading station, and place the metal plate on the die bonding station; wherein, the wafer dicing sheet includes a carrier film and chips evenly arranged on the carrier film, and the metal plate is provided with evenly arranged lead frames;

[0008] Control the first vision module to perform image recognition processing on the wafer dicing sheet on the loading station, and generate a first movement trajectory of the loading station;

[0009] Adjust the position of the loading station according to the first movement trajectory, so that the die to be pasted on the bottom film is in the loading position;

[0010] Obtain the second movement trajectory of the die bonding station, and adjust the position of the die bonding station according to the second movement trajectory, so that the lead frame to be pasted on the metal plate is in the die bonding position;

[0011] Control the suction module to move to the loading position, and suck the die at the loading position, and control the dispensing module to move to the die bonding position, and perform dispensing on the lead frame at the die bonding position;

[0012] Control the dispensing module to move away from the die bonding position, and control the suction module to move from the loading position to the die bonding position, and place the sucked die on the lead frame;

[0013] After all the lead frames on the metal plate are placed with dies, transfer the metal plate to the heating unit, and control the heating unit to heat and control the blowing module to blow an anti-oxidation mixed gas towards the heating unit, so as to form a plurality of components to be encapsulated on the metal plate.

[0014] The control method for die bonding of a chip according to an embodiment of the first aspect of the present application has at least the following beneficial effects: Obtain a wafer cut piece and a metal plate, and place them on the loading station and the die bonding station of the die bonding equipment respectively. Subsequently, control the first vision module to perform image recognition processing on the wafer cut piece at the loading station, and generate a first movement trajectory of the loading station. Through image recognition technology, precise capture of the positions of the die chips on the wafer cut piece is achieved, providing precise guidance for the subsequent movement of the loading station. After the pick-up module picks up a die chip from the loading position, the loading station can adjust the position of the loading station according to the first movement trajectory, and move the next die chip to the loading position. This not only improves the alignment accuracy but also reduces unnecessary movement distances and improves production efficiency. At the same time, the position of the die bonding station is also adjusted according to a pre-set second movement trajectory, so that the pick-up module can place a new die chip into an empty lead frame. During the glue dispensing process, while controlling the pick-up module to move to the loading position, the glue dispensing module is also controlled to move to the die bonding position. During the process that the pick-up module picks up a die chip from the loading position and moves from the loading position to the die bonding position, the glue dispensing module needs to complete glue dotting on the lead frame at the die bonding position during this process. Subsequently, control the glue dispensing module to move away from the die bonding position, and the pick-up module places the picked-up die chip on the lead frame. After each die bonding, the loading station moves according to the first movement trajectory, and the die bonding station moves according to the second trajectory, so as to ensure that the die chips and lead frames to be processed are located at the corresponding loading positions and die bonding positions respectively, avoiding problems such as empty bonding or misalignment. Repeat the above die bonding process. When all the lead frames of the metal plate are bonded with die chips, transfer the metal plate to the heating unit, control the heating unit to heat, and control the blowing module to blow out an anti-oxidation mixed gas. The heating promotes the curing of the glue, forming a stable connection between the die chips and the lead frames, and the blowing protection effectively prevents the oxidation reaction during the encapsulation process, protecting the performance and quality of the product. The present application optimizes the movement trajectory of the stations by introducing image recognition technology, ensuring that each lead frame can be combined with a die chip, realizing automated operation, and improving the quality of the product and the accuracy of production.

[0015] According to some embodiments of the first aspect of the present application, controlling the first vision module to perform image recognition processing on the wafer cut piece at the loading station and generating a first movement trajectory of the loading station includes:

[0016] Controlling the first vision module to obtain a target image of the wafer cut piece at the loading station;

[0017] Performing edge detection and threshold segmentation processing on the target image to obtain the positions of multiple die chips in the target image;

[0018] Generate a plurality of initial trajectories according to the grain positions and calculate the trajectory length corresponding to each of the initial trajectories; wherein, the initial trajectories traverse all the grain positions, and the initial trajectories are formed by routes in a plurality of first directions and second directions, and the first direction and the second direction are perpendicular to each other.

[0019] Take the initial trajectory with the minimum trajectory length as the first movement trajectory of the loading station.

[0020] According to some embodiments of the first aspect of the present application, the generating a plurality of initial trajectories according to the grain positions and calculating the trajectory length corresponding to each of the initial trajectories includes:

[0021] Generate an initial trajectory according to the grain positions and calculate the corresponding trajectory length, and take the trajectory length as the current shortest length.

[0022] Continuously generate new initial trajectories and calculate the corresponding trajectory lengths in real time during the generation of the initial trajectories.

[0023] When the trajectory length during the generation of a new initial trajectory is greater than the current shortest length multiplied by a first magnification factor, stop generating the initial trajectory; wherein, the first magnification factor is greater than or equal to 1.

[0024] When a new initial trajectory is less than or equal to the current shortest length multiplied by the first magnification factor, retain and record the initial trajectory and the corresponding trajectory length.

[0025] According to some embodiments of the first aspect of the present application, the continuously generating new initial trajectories and calculating the corresponding trajectory lengths in real time during the generation of the initial trajectories includes:

[0026] Based on the initial trajectories that have been generated, generate an optimization strategy through a preset heuristic learning model.

[0027] According to the optimization strategy, continuously generate new initial trajectories and calculate the corresponding trajectory lengths in real time during the generation of the initial trajectories.

[0028] According to some embodiments of the first aspect of the present application, the die bonding device further includes a second vision module.

[0029] The controlling the dispensing module to move to the die bonding position and perform dispensing on the lead frame at the die bonding position includes:

[0030] Control the first vision module and the second vision module to perform image recognition on the wafer cutting pieces at the loading station and the metal plates at the die bonding station respectively, and determine the first size information of the die and the second size information of the lead frame;

[0031] Determine the dispensing parameters of the dispensing module according to the first size information and the second size information, and determine the expected morphological image of the glue drop;

[0032] Control the dispensing module to move to the die bonding position, and perform dispensing on the lead frame at the die bonding position according to the dispensing parameters;

[0033] Control the second vision module to perform image recognition processing on the glue drop on the lead frame to obtain the actual morphological image of the glue drop;

[0034] Adjust the dispensing parameters of the dispensing module according to the expected morphological image and the actual morphological image.

[0035] According to some embodiments of the first aspect of the present application, the adjusting the dispensing parameters of the dispensing module according to the expected morphological image and the actual morphological image includes:

[0036] Perform edge analysis on the expected morphological image and the actual morphological image to obtain an expected contour and an actual contour;

[0037] Perform similarity analysis on the corresponding contour points between the expected contour and the actual contour to obtain a contour similarity;

[0038] Count the number of pixel points of the expected morphological image and the actual morphological image to obtain an expected area and an actual area;

[0039] Calculate an area difference degree according to the expected area and the actual area;

[0040] Calculate a center offset according to the center point position of the expected morphological image and the center point position of the actual morphological image;

[0041] Input the contour similarity, the area difference degree and the center offset into a preset quality evaluation model to obtain a quality evaluation value;

[0042] Adjust the dispensing parameters of the dispensing module according to the quality evaluation value.

[0043] According to some embodiments of the first aspect of the present application, the controlling the heating unit to heat and controlling the blowing module to blow an anti-oxidation mixed gas towards the die bonding station includes:

[0044] Control the heating unit to preheat the metal plate at a first temperature within a first time period;

[0045] After completing the preheating stage, control the heating unit to heat the metal plate at a second temperature within a second time period; wherein, the second temperature is greater than the first temperature;

[0046] After completing the heating stage, control the heating unit to cool the metal plate at a third temperature within a third time period; wherein, the third temperature is less than the first temperature;

[0047] During the operation of the heating unit, control the blowing module to continuously blow an anti-oxidation mixed gas towards the heating unit at a first flow rate; wherein, the anti-oxidation mixed gas is a mixed gas of nitrogen and hydrogen.

[0048] According to some embodiments of the first aspect of the present application, the chip packaging production line further includes a die detection device, and the die detection device includes a positioning fixture, a pushing module, and an induction module;

[0049] After the step of forming a plurality of components to be packaged on the metal plate, the method further includes:

[0050] Place the metal plate containing a plurality of components to be packaged into the positioning fixture, and determine the components to be detected on several metal plates;

[0051] Control the pushing module to push the die of the component to be detected, and use the induction module to sense the thrust value applied by the pushing module to the die;

[0052] When the pushing module pushes the die off, record the current thrust value as the maximum force value;

[0053] When the maximum force values corresponding to all the components to be detected are greater than or equal to a preset bearing threshold, it is determined that the die bonding of the components on the corresponding metal plate is good;

[0054] When the maximum force value corresponding to one of the components to be detected is less than the bearing threshold, re-determine the new components to be detected, and control the pushing module and the induction module to detect the new components to be detected;

[0055] When the maximum force values corresponding to all the new components to be detected are greater than or equal to a preset bearing threshold, it is determined that the die bonding of the components on the corresponding metal plate is good; otherwise, when the maximum force value corresponding to one of the new components to be detected is less than the bearing threshold, mark the quality of the corresponding metal plate as to be determined.

[0056] In a second aspect, the present application further provides a chip packaging production line, including: at least one memory; at least one processor; at least one program; the program is stored in the memory, and the processor executes at least one of the programs to implement the control method for chip die bonding as described in any one of the embodiments of the first aspect.

[0057] In a third aspect, the present application further provides a computer-readable storage medium, which stores computer-executable signals for executing the control method for chip die bonding as described in any one of the embodiments of the first aspect.

[0058] Some additional aspects and advantages of the present application will be given in part in the following description, will become apparent in part from the following description, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] Some additional aspects and advantages of the present application will become apparent and be readily understood in conjunction with the following description of the embodiments with reference to the accompanying drawings, where:

[0060] Figure 1 is a flowchart of the control method for chip die bonding provided by some embodiments of the present application;

[0061] Figure 2 is Figure 1 a flowchart of step S120 in

[0062] Figure 3 is Figure 2 a flowchart of step S230 in

[0063] Figure 4 is Figure 3 a flowchart of step S320 in

[0064] Figure 5 is Figure 1 a flowchart of step S150 in

[0065] Figure 6 is Figure 5 a flowchart of step S550 in

[0066] Figure 7 is Figure 1 a flowchart of step S170 in

[0067] Figure 8 is Figure 1 a flowchart after step S170 in

[0068] Figure 9 is a schematic structural diagram of a die bonder provided by some embodiments of the present application;

[0069] Figure 10 The first initial path formed at the wafer cutting piece provided for some embodiments of the present application;

[0070] Figure 11 The second initial path formed at the wafer cutting piece provided for some embodiments of the present application;

[0071] Figure 12 The third initial path formed at the wafer cutting piece provided for some embodiments of the present application;

[0072] Figure 13 The fourth initial path formed at the wafer cutting piece provided for some embodiments of the present application.

[0073] The attached drawing reference numerals are as follows:

[0074] Loading station 910; Die bonding station 920; First vision module 930; Glue dispensing module 940; Pick-up module 950; Second vision module 960; Bottom film 971; Die 972; Metal plate 980; Lead frame 981. Detailed implementation manners

[0075] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application.

[0076] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0077] In the description of the present application, if the first and second are described only for the purpose of distinguishing technical features, it should not be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence of the indicated technical features.

[0078] In the description of the present application, unless otherwise clearly defined, terms such as setting, installation, connection, etc. should be understood in a broad sense. Those skilled in the art can reasonably determine the specific meanings of the above terms in the present application in combination with the specific content of the technical solution.

[0079] In the semiconductor manufacturing industry, chip packaging, as a crucial link in the production of integrated circuits, has a vital impact on the performance, reliability, and cost of the final product. With the continuous progress of chip technology, especially the miniaturization of chip size, the improvement of integration, and the expansion of production scale, traditional chip packaging processes are facing numerous challenges.

[0080] In the traditional die bonding process, the alignment between the wafer dicing sheet (carrying a large number of tiny chips) and the metal plate (or lead frame) in the subsequent packaging process often relies on the preset parameters of the mechanical positioning system or manual intervention. This method is not only time-consuming but also prone to introducing errors. Moreover, if there should be a chip at a certain position on the wafer dicing sheet, but the defect in the previous process results in the absence of a chip at this position, when the machine transfers the chips to the lead frame, the feeding station moves along the preset path in each cycle, which may cause the absence of a chip in a certain lead frame, thus affecting the die bonding quality of the entire metal sheet.

[0081] Based on this, the application provides a control method for chip die bonding, a chip packaging production line, and a storage medium to solve the above-mentioned technical problems. The technical solutions proposed in this application will be described in detail one by one below.

[0082] In the first aspect, the application provides a control method for chip die bonding, which is applied to a chip packaging production line. The chip packaging production line includes a die bonding device and a baking device. The die bonding device includes a feeding station 910, a die bonding station 920, a first vision module 930, a dispensing module 940, and a chip picking module 950. The chip picking module 950 can move between a preset feeding position and a die bonding position. The baking device includes a heating unit and a blowing module. The control method may include but is not limited to the following steps:

[0083] Step S110: Obtain a wafer dicing sheet and a metal plate, place the wafer dicing sheet on the feeding station, and place the metal plate on the die bonding station; wherein, the wafer dicing sheet includes a carrier film and chips evenly arranged on the carrier film, and the metal plate is provided with evenly arranged lead frames;

[0084] Step S120: Control the first vision module to perform image recognition processing on the wafer dicing sheet on the feeding station and generate a first movement trajectory of the feeding station;

[0085] Step S130: Adjust the position of the feeding station according to the first movement trajectory so that the chips to be die bonded on the carrier film are at the feeding position;

[0086] Step S140: Obtain a second movement trajectory of the die bonding station and adjust the position of the die bonding station according to the second movement trajectory so that the lead frames to be die bonded on the metal plate are at the die bonding position;

[0087] Step S150: Control the material suction module to move to the loading position, suck the chips at the loading position, and control the dispensing module to move to the die bonding position and perform dispensing on the lead frame at the die bonding position;

[0088] Step S160: Control the dispensing module to move away from the die bonding position, and control the material suction module to move from the loading position to the die bonding position and place the sucked chips on the lead frame;

[0089] Step S170: After all the lead frames on the metal plate are placed with chips, transfer the metal plate to the heating unit, control the heating unit to heat, and control the blowing module to blow an anti-oxidation mixed gas towards the heating unit to form a plurality of components to be encapsulated on the metal plate.

[0090] In step S110, the wafer cutting sheet can be completed by the wafer cutting equipment in the chip packaging production line. In the step of cutting the wafer, it is necessary to grind and thin the wafer raw material as required. After thinning, a bottom film 971 is usually pasted on one side surface of the wafer. The bottom film 971 can be a blue film, a UV film or other types of protective films. The purpose of this is to protect the other side surface of the wafer (i.e., the side where the circuit pattern is located) from damage during the subsequent cutting process. The bottom film 971 not only provides physical protection but also helps to more easily separate and collect the chips 972 from the wafer after cutting. The cutting process usually uses a precision cutting knife, which cuts along the predetermined cutting lines on the wafer, and these cutting lines define the boundaries of each chip 972. Since the wafer is circular and the chips 972 are usually rectangular, some waste materials (referred to as "wafer scraps") will be generated during the cutting process. After cutting, the wafer is divided into many individual chips 972, and these chips 972 are still attached to the blue film. Next, a series of post-processing steps, such as cleaning, detection and classification, are usually carried out to ensure that the quality and performance of the chips 972 meet the requirements. Finally, the chips 972 will remain attached to the bottom film 971 until they are transferred to the next production stage.

[0091] In addition, the lead frame 981 on the metal plate 980 can be formed by stamping using a mold to shape the metal plate 980 into a lead frame 981 with specific shapes and dimensions. In addition to stamping, chemical etching is also a method for producing the lead frame 981, which forms specific patterns and structures on the surface of the metal plate 980 through chemical corrosion. This application does not limit this. In addition, after the lead frame 981 is formed, cleaning and surface treatment can also be carried out to remove oil stains, oxides and other impurities on the surface.

[0092] In steps S110 to S170, a wafer cutting piece and a metal plate 980 are obtained and placed on the loading station 910 and the die bonding station 920 of the die bonding equipment respectively. Subsequently, the first vision module 930 is controlled to perform image recognition processing on the wafer cutting piece on the loading station 910, and a first movement trajectory of the loading station 910 is generated based on the recognition result. Through image recognition technology, the precise capture of the positions of the die chips 972 on the wafer cutting piece is achieved, providing precise guidance for the subsequent movement of the loading station 910. After the pick-up module 950 picks up a die chip 972 from the loading position, the loading station 910 can adjust its position according to the first movement trajectory to move the next die chip 972 to the loading position. This not only improves the alignment accuracy but also reduces unnecessary movement distances and improves production efficiency. At the same time, the position of the die bonding station 920 is also adjusted according to a preset second movement trajectory, so that the pick-up module 950 can place a new die chip 972 into an empty lead frame 981. During the die bonding process, while controlling the pick-up module 950 to move to the loading position, the dispensing module 940 is also controlled to move to the die bonding position. During the process that the pick-up module 950 picks up a die chip 972 from the loading position and moves from the loading position to the die bonding position, the dispensing module 940 needs to complete dispensing on the lead frame 981 at the die bonding position during this process. Subsequently, the dispensing module 940 is controlled to move away from the die bonding position, and the pick-up module 950 places the picked-up die chip 972 on the lead frame 981. After each die bonding, the loading station 910 moves according to the first movement trajectory, and the die bonding station 920 moves according to the second trajectory to ensure that the die chips 972 to be processed and the lead frames 981 are both located at the corresponding loading positions and die bonding positions, avoiding problems such as empty bonding or misalignment. Repeat the above die bonding process. When all the lead frames 981 of the metal plate 980 are bonded with die chips 972, the metal plate 980 is transferred to the heating unit, and the heating unit is controlled to heat, and the air blowing module is controlled to blow out an anti-oxidation mixed gas. The heating promotes the curing of the glue, forming a stable connection between the die chips 972 and the lead frames 981, and the blowing protection effectively prevents the oxidation reaction during the encapsulation process, protecting the performance and quality of the product. This application optimizes the movement trajectories of the stations by introducing image recognition technology, ensuring that each lead frame 981 can be combined with a die chip 972, realizing automated operation, and improving the quality of the product and the precision of production.

[0093] Referring to Figure 2 , it can be understood that in step S120, it may include but is not limited to the following steps:

[0094] Step S210: Control the first vision module to target the image of the wafer cutting piece on the loading station;

[0095] Step S220: Perform edge detection and threshold segmentation on the target image to obtain the positions of multiple grains in the target image;

[0096] Step S230: Generate multiple initial trajectories based on the grain positions and calculate the trajectory length corresponding to each initial trajectory; wherein, the initial trajectories traverse all the grain positions, and the initial trajectories are formed by routes in multiple first directions and second directions, and the first direction and the second direction are perpendicular to each other;

[0097] Step S240: Use the initial trajectory with the minimum trajectory length as the first movement trajectory of the loading station.

[0098] In steps S210 to S240, first, control the first vision module 930 (such as a camera or an image sensor) to align with the wafer cutting piece on the loading station 910 for image capture. Perform image processing on the captured target image. Specifically, identify the edges of each grain 972 in the wafer cutting piece through edge detection to distinguish different grains 972, and through threshold segmentation processing, further separate the grains 972 in the image from the background or other non-grain 972 parts to ensure the accuracy of subsequent processing and identify the positions of all grains 972 in the target image. According to the determined grain 972 positions, the system starts to generate multiple possible initial trajectories, and these initial trajectories need to traverse all the grain 972 positions to ensure that each grain 972 on the wafer cutting piece can be processed. The initial trajectories are formed by alternately using routes in the first direction and the second direction (these two directions are perpendicular to each other), which can reduce the sharp turns of the robotic arm or operating tool during movement and improve efficiency. Among all the generated initial trajectories, select the one with the minimum trajectory length as the final first movement trajectory of the loading station 910, which can minimize the movement distance of the robotic arm or operating tool and improve processing efficiency.

[0099] Such as can be referred to Figures 10 to 13 , which is a partial enlarged view of the wafer cutting piece. For the convenience of description, only some grains 972 are listed in the figure, and the spacing between adjacent grains 972 is equal, and the surface of the grain 972 is square, and there are some missing grains 972 on the bottom film 971 in the figure. Some possible initial trajectories generated by the present application are listed in the figure. It can be seen from the figure that Figure 10 The total length of the initial trajectory of Figure 11 is 27, Figure 12 The total length of the initial trajectory of Figure 13 is 23, Figure 13 The total length of the initial trajectory corresponding to Figure 13 is 21. By comparison,

[0100] Reference Figure 3 , it can be understood that in step S230, it may include but is not limited to the following steps:

[0101] Step S310: Generate an initial trajectory according to the grain position and calculate the corresponding trajectory length, and use the trajectory length as the current shortest length;

[0102] Step S320: Continuously generate new initial trajectories and calculate the corresponding trajectory lengths in real time during the generation of the initial trajectories;

[0103] Step S330: When the trajectory length during the generation of a new initial trajectory is greater than the current shortest length multiplied by a first magnification factor, stop generating the initial trajectory; wherein, the first magnification factor is greater than or equal to 1;

[0104] Step S340: When the new initial trajectory is less than or equal to the current shortest length multiplied by the first magnification factor, retain and record the initial trajectory and the corresponding trajectory length.

[0105] In steps S310 to S340, according to the known position of the grain 972, the system first generates an initial trajectory. This initial trajectory can be any reasonable starting point and path, or the starting point position is fixed but the ending point position is not fixed, and calculate the total length of this trajectory, and set this length as the current shortest length. The system enters a loop and continuously generates new initial trajectories. During the generation process, the system will calculate the length of the current trajectory in real time. For each newly generated trajectory segment (before it is fully generated), the system will check whether the length that has been generated exceeds the current shortest length multiplied by the first magnification factor. If the length of the new trajectory during the generation process has exceeded the current shortest length multiplied by the first magnification factor, the system determines that this trajectory is unlikely to become the final shortest trajectory, so it will stop generating this trajectory to save computing resources. If the length of the new trajectory during the generation process is always less than or equal to the current shortest length multiplied by the first magnification factor, the system will continue to generate this trajectory until it is fully generated. At this time, the system will calculate the complete length of this trajectory and compare it with the current shortest length. If the length of the newly generated complete trajectory is less than the current shortest length, update the current shortest length to the length of this trajectory and retain this trajectory as the new candidate shortest trajectory. If the length of the newly generated trajectory is not less than the current shortest length but still within the range of the first magnification factor, although it will not become the current shortest trajectory, the system will still retain this trajectory and its length for possible subsequent comparison or analysis. When all possible initial trajectories are generated, evaluated, and selected or discarded according to the above rules, the loop ends. At this time, the current shortest length and the corresponding trajectory owned by the system are the first moving trajectory of the optimal loading station 910 sought.

[0106] Continue to refer to Figures 10 to 13, the first magnification factor is 1.4 in this embodiment. The first initial trajectory generated by the system is as shown in Figure 10 . The trajectory length of this initial trajectory is 27. Therefore, the current shortest length is updated to 27. Subsequently, the second initial trajectory generated by the system is as shown in Figure 11 . The trajectory length of this trajectory is 23, which is less than 27×1.4. Therefore, the second initial trajectory is taken, and the current shortest length is updated to 23. Then, the system generates the third initial trajectory as shown in Figure 12 . Since 1.4 times the current shortest length is approximately equal to 32, when the trajectory length of the third initial trajectory reaches 32, even if the trajectory does not traverse all the grains 972, the initial trajectory is no longer generated. The system then determines that this trajectory is unlikely to become the final shortest trajectory to save computing resources. Subsequently, the system generates the fourth initial trajectory as shown in Figure 13 . The trajectory length of this initial trajectory is 21. By comparing the first, second, and fourth initial trajectories, finally, the fourth generated initial trajectory is taken as the first movement trajectory of the optimal loading station 910. Of course, in actual applications, the number of initial trajectories is more, and due to the large number of grains 972, the initial trajectories are more complex.

[0107] Referring to Figure 4 , it can be understood that, however, in step S320, it may include but is not limited to the following steps:

[0108] Step S410: Based on the already generated initial trajectories, generate an optimization strategy through a preset heuristic learning model;

[0109] Step S420: According to the optimization strategy, continuously generate new initial trajectories and calculate the corresponding trajectory lengths in real time during the generation process of the initial trajectories.

[0110] In steps S410 to S420, the heuristic learning model can handle complex grain 972 distributions and irregular shapes. By continuously learning and adjusting the optimization strategy, compared with traditional exhaustive or random search methods, it can more efficiently find trajectories close to or optimal, significantly reducing the calculation time and resource consumption, thereby generating initial trajectories with strong adaptability and high flexibility.

[0111] Based on the extracted feature information, the heuristic learning model can construct heuristic rules. For example, if most of the segments in the reference path move along a straight line or an approximately straight line direction, then the system may tend to minimize sharp turns and winding paths in the new path as well. Or, if the reference path adopts a specific traversal strategy (such as inside-out, spiral traversal, etc.) in a specific area (such as the dense area of die 972), then the system may consider this strategy effective in this type of area and give it priority in the generation of the new path. During the next initial path generation, the system will use the above heuristic rules to guide the path generation. Specifically, the system may first randomly or according to a certain strategy select a starting point, and then gradually add path elements, attempting to follow the heuristic rules at each step to optimize the path. During this process, the system may continuously evaluate the quality of the current path, such as estimating the total length, evaluating the smoothness of the path, etc., and dynamically adjust the generation strategy according to the evaluation results. If it is found during the generation process that a certain direction or strategy leads to a significant decline in the path quality (such as a sharp increase in length, frequent sharp turns, etc.), then the system may promptly adjust the generation strategy to avoid falling into a local optimum. The effectiveness of the heuristic learning model depends to a large extent on the accuracy and effectiveness of the heuristic rules extracted from historical data. Therefore, in practical applications, it is necessary to continuously train and verify the model to optimize its performance.

[0112] Referring to Figure 9 , in the die bonding equipment of the present application, a second vision module is further included, and this second vision module is used to collect images of the die bonding station. Referring to Figure 5 , in the step of controlling the dispensing module to perform dispensing at the lead frame in step S150, it may include but is not limited to the following steps:

[0113] Step S510: Control the first vision module and the second vision module to respectively perform image recognition on the wafer cutting piece on the loading station and the metal plate on the die bonding station, and determine the first size information of the die and the second size information of the lead frame;

[0114] Step S520: Determine the dispensing parameters of the dispensing module according to the first size information and the second size information, and determine the expected morphological image of the glue droplet;

[0115] Step S530: Control the dispensing module to move to the die bonding position, and perform dispensing on the lead frame at the die bonding position according to the dispensing parameters;

[0116] Step S540: Control the second vision module to perform image recognition processing on the glue droplet on the lead frame to obtain the actual morphological image of the glue droplet;

[0117] Step S550: Adjust the dispensing parameters of the dispensing module according to the expected shape image and the actual shape image.

[0118] In steps S510 to S520, by using the first vision module 930 and the second vision module 960 to perform image recognition on the wafer cutting piece and the metal plate 980 respectively, the first dimension information of the die 972 and the second dimension information of the lead frame 981 can be accurately obtained. Based on the dispensing parameters determined by the first dimension information and the second dimension information, these dispensing parameters can include but are not limited to dispensing speed, dispensing volume, glue consistency, etc., which can ensure that each dispensing meets the design requirements, thereby improving the accuracy and consistency in the production process.

[0119] In steps S530 to S550, after the dispensing module 940 performs dispensing at the die bonding position, the second vision module 960 will immediately perform image recognition on the glue drop to obtain its actual shape image. By comparing the expected shape image and the actual shape image, the dispensing parameters can be discovered and adjusted in a timely manner to ensure that the shape of the glue drop meets the design requirements, thereby improving the overall quality of the product.

[0120] In steps S510 to S550, this technical feature allows for dynamically adjusting the dispensing parameters according to the different dimension information of the die 972 and the lead frame 981, making the production process more flexible, capable of adapting to a variety of different production requirements. At the same time, it also reduces the need for manual intervention, shortens the production cycle, and reduces the risk of human error, thereby improving the overall production efficiency.

[0121] Refer to Figure 6 , it can be understood that in step S550, it may include but is not limited to the following steps:

[0122] Step S610: Perform edge analysis on the expected shape image and the actual shape image to obtain the expected contour and the actual contour.

[0123] Step S620: Perform similarity analysis based on the corresponding contour points between the expected contour and the actual contour to obtain the contour similarity.

[0124] Step S630: Count the number of pixel points of the expected shape image and the actual shape image to obtain the expected area and the actual area.

[0125] Step S640: Calculate the area difference degree based on the expected area and the actual area.

[0126] Step S650: Calculate the center offset based on the center point positions of the expected shape image and the actual shape image.

[0127] Step S660: Input the contour similarity, area difference degree, and center offset into a preset quality assessment model to obtain a quality assessment value.

[0128] Step S670: Adjust the dispensing parameters of the dispensing module according to the quality assessment value.

[0129] In steps S610 to S620, by performing edge analysis on the expected shape image and the actual shape image, the expected contour and the actual contour are obtained, and similarity analysis is carried out to accurately capture the subtle differences in the shape of the glue drop and ensure the contour accuracy of dispensing. In steps S630 to S640, the number of pixel points in the expected shape image and the actual shape image is counted, the area difference degree is calculated, and the accuracy of the glue drop size is further quantified. In step S650, the difference in the center point positions of the expected shape image and the actual shape image, that is, the center offset, is calculated so that the system can timely detect and correct the deviation of the dispensing position.

[0130] In steps S660 to S670, the contour similarity, area difference degree, and center offset are input into a preset quality assessment model to obtain a quality assessment value. In the quality assessment model, a first weight, a second weight, and a third weight can be respectively set for the contour similarity, area difference degree, and center offset. The quality assessment value can be the sum of the product of the contour similarity and the first weight, the product of the area difference degree and the second weight, and the product of the center offset and the third weight. For different chip ic packages, the values of the first weight, second weight, and third weight can be adjusted adaptively. The dispensing parameters are dynamically adjusted according to the quality assessment value to meet the diverse production requirements, ensuring the stability and consistency of the dispensing quality, thereby improving the product qualification rate.

[0131] Refer to Figure 7 , it can be understood that in step S170, it may include but is not limited to the following steps:

[0132] Step S710: Control the heating unit to preheat the metal plate at a first temperature within a first time period;

[0133] Step S720: After completing the preheating stage, control the heating unit to heat the metal plate at a second temperature within a second time period; wherein, the second temperature is greater than the first temperature;

[0134] Step S730: After completing the heating stage, control the heating unit to cool the metal plate at a third temperature within a third time period; wherein, the third temperature is less than the first temperature;

[0135] Step S740: During the operation of the heating unit, control the blowing module to continuously blow out the anti-oxidation mixed gas towards the heating unit at a first flow rate; wherein, the anti-oxidation mixed gas is a mixed gas of nitrogen and hydrogen.

[0136] In steps S710 to S730, by precisely controlling the temperature change of the heating unit, the processes of preheating, heating, and cooling are realized. At the same time, different temperatures and times are set respectively, making the entire process flow more refined and controllable, which is conducive to the good bonding between the chip and the metal plate 980, reducing problems such as thermal stress or cracks caused by uneven temperature changes, thereby improving the yield and reliability of the product.

[0137] In step S740, during the heating process, the surfaces of the metal plate 980 and the die 972 are prone to react with oxygen in the air in a high-temperature environment, resulting in oxidation and affecting the die bonding effect. Controlling the blowing module to continuously blow out the mixed gas of nitrogen and hydrogen can effectively isolate the oxygen in the air, reduce the oxidation risk, and protect the surface quality of the metal plate 980 and the die 972.

[0138] The above control strategy can be adjusted according to different materials and sizes of chip ic packages, improving the compatibility and flexibility of the equipment, which is conducive to meeting the needs of different customers.

[0139] In the chip packaging production line, there is also a die detection device, which includes a positioning fixture, a pusher module, and an induction module. Refer to Figure 8 , it can be understood that after step S170, it may further include but is not limited to the following steps:

[0140] Step S810: Place the metal plate containing multiple parts to be packaged into the positioning fixture, and determine the parts to be detected on several metal plates;

[0141] Step S820: Control the pusher module to push the die of the part to be detected, and use the induction module to sense the thrust value applied by the pusher module to the die;

[0142] Step S830: When the pusher module pushes the die down, record the current thrust value as the maximum force value;

[0143] Step S840: When the maximum force values corresponding to all parts to be detected are greater than or equal to the preset bearing threshold, it is determined that the die bonding of the parts to be packaged on the corresponding metal plate is good;

[0144] Step S850: When the maximum force value corresponding to one of the parts to be detected is less than the bearing threshold, re-determine the new parts to be detected, and control the pusher module and the induction module to detect the new parts to be detected;

[0145] Step S860: When the maximum force values corresponding to all newly to-be-detected packages to be encapsulated are greater than or equal to the preset bearing threshold, it is determined that the die bonding of the packages on the corresponding metal plate is good. Conversely, when the maximum force value corresponding to one of the newly to-be-detected packages to be encapsulated is less than the bearing threshold, the quality of the corresponding metal plate is marked as pending.

[0146] In steps S810 to S830, the bonding strength between the die 972 and the metal plate 980 is directly tested by means of physical destruction. The physical destruction in this application is carried out by sampling, which can quickly detect the quality of key samples in a batch of packages to be encapsulated, so as to quickly judge the quality status of the whole batch of products, shorten the production cycle and improve production efficiency.

[0147] In steps S840 to S850, which is the preliminary detection stage, the metal plate 980 containing multiple packages to be encapsulated is placed in a positioning jig, and several packages to be detected are selected as initial samples. The pushing module is controlled to apply a thrust to the die 972 of these initial samples, and the induction module is used to record the maximum force value when each die 972 is pushed off. These maximum force values are compared with the preset bearing threshold. If the maximum force values of all initial samples are greater than or equal to the bearing threshold, it is directly determined that the die bonding of the packages on the metal plate 980 is good and no further detection is required. If the maximum force value of one or more initial samples is less than the bearing threshold, the re-inspection process is entered.

[0148] In step S860, which is the re-inspection stage, newly to-be-detected packages to be encapsulated are re-determined as re-inspection samples. These samples may be those that have not been detected before, or are re-selected based on a certain strategy (such as random selection, specific position selection, etc.). The operations in the preliminary detection stage are repeated for the re-inspection samples, that is, the pushing module is controlled to apply a thrust and the maximum force value is recorded, and the maximum force values of these re-inspection samples are compared with the bearing threshold again. If the maximum force values of all re-inspection samples are greater than or equal to the bearing threshold, it is determined that the die bonding of the packages on the metal plate 980 is good. If the maximum force value of one or more re-inspection samples is still less than the bearing threshold, the quality of the metal plate 980 is marked as pending, and more detailed inspection or treatment may be required.

[0149] Through steps S810 to S860, when unqualified samples are found in the preliminary detection, the problem can be further confirmed through the re-inspection mechanism. The combination of the preliminary detection and the re-inspection in the two stages increases the comprehensiveness and accuracy of the detection, reduces the risk of misjudgment or missed judgment, ensures the quality and reliability of the products leaving the factory, and thus improves customer satisfaction.

[0150] In a second aspect, the present application also provides a chip packaging production line, including: at least one memory, at least one processor, and at least one program. The program is stored in the memory, and the processor executes one or more programs to implement the above-mentioned control method for chip die bonding.

[0151] In the die bonding equipment in this production line, by obtaining a wafer cutting piece and a metal plate and placing them on the loading station and the die bonding station of the die bonding equipment respectively. Subsequently, control the first vision module to perform image recognition processing on the wafer cutting piece at the loading station, and generate the first movement trajectory of the loading station based on the recognition result. Through image recognition technology, precise capture of the positions of the chips on the wafer cutting piece is achieved, providing precise guidance for the subsequent movement of the loading station. After the pick-up module picks up a chip from the loading position, the loading station can adjust its position according to the first movement trajectory to move the next chip to the loading position. This not only improves the alignment accuracy but also reduces unnecessary movement distances, thereby improving production efficiency. At the same time, the position of the die bonding station is also adjusted according to a pre-set second movement trajectory, enabling the pick-up module to place a new chip into an empty lead frame. During the glue dispensing process, while controlling the pick-up module to move to the loading position, the glue dispensing module is also controlled to move to the die bonding position. When the pick-up module picks up a chip from the loading position and moves from the loading position to the die bonding position, the glue dispensing module needs to complete dispensing glue on the lead frame at the die bonding position during this process. Subsequently, control the glue dispensing module to move away from the die bonding position, and the pick-up module places the picked-up chip on the lead frame. After each die bonding, the loading station moves according to the first movement trajectory, and the die bonding station moves according to the second trajectory to ensure that the chips to be processed and the lead frames are located at the corresponding loading positions and die bonding positions, avoiding problems such as empty bonding or misalignment. Repeat the above die bonding process. When all the lead frames on the metal plate are bonded with chips, the heating unit is controlled to heat, and the blowing module is controlled to blow out an anti-oxidation mixed gas. The heating promotes the curing of the glue, forming a stable connection between the chips and the lead frames, and the blowing protection effectively prevents oxidation reactions during the packaging process, protecting the performance and quality of the product. The present application optimizes the movement trajectories of the stations by introducing image recognition technology, ensuring that each lead frame can be combined with a chip, realizing automated operation, and improving the quality of the product and the precision of production.

[0152] As a non-transitory computer-readable storage medium, the memory can be used to store non-transitory software programs, non-transitory computer-executable programs, and signals, such as the program instructions / signals corresponding to the processing module in the embodiments of the present application. The processor executes various functional applications and data processing by running the non-transitory software programs, instructions, and signals stored in the memory, that is, to implement the control method for chip die bonding in the above method embodiments.

[0153] The memory may include a program storage area and a data storage area. Among them, the program storage area can store the operating system and application programs required for at least one function; the data storage area can store relevant data such as the control method for die bonding of the above chip. In addition, the memory may include a high-speed random access memory and may also include a non-transitory memory, such as at least one disk storage device, a flash memory device, or other non-transitory solid-state storage devices. In some embodiments, the memory optionally includes a memory remotely provided with respect to the processor, and these remote memories can be connected to the processing module through a network. Examples of the above network include but are not limited to the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0154] One or more signals are stored in the memory and, when executed by one or more processors, execute the control method for die bonding of the chip in any of the above method embodiments.

[0155] In a third aspect, an embodiment of the present application provides a computer-readable storage medium. The computer-readable storage medium stores a computer program, and when the computer program is executed by one or more processors, the one or more processors can be caused to execute the control method for die bonding of the chip in the above method embodiments.

[0156] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or may be distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0157] Through the description of the above embodiments, those of ordinary skill in the art can understand that all or some of the steps and systems disclosed above can be implemented as software, firmware, hardware, and their appropriate combinations. Some physical components or all physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or can be implemented as hardware, or can be implemented as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include a computer storage medium (or non-transitory medium) and a communication medium (or transitory medium). As is well known to those of ordinary skill in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information, such as computer-readable signals, data structures, program modules, or other data. The computer storage medium includes, but is not limited to, RAM, ROM, EEPROM, flash memory, or other memory technologies, CD-ROM, digital versatile disk (DVD), or other optical disk storage, magnetic cassette, tape, magnetic disk storage, or other magnetic storage devices, or any other medium that can be used to store the desired information and can be accessed by a computer. In addition, as is well known to those of ordinary skill in the art, the communication medium generally includes computer-readable signals, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transmission mechanism, and can include any information delivery medium.

[0158] It should be understood that in this application, "at least one (item)" means one or more, and "a plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships can exist. For example, "A and / or B" can mean: only A exists, only B exists, and both A and B exist at the same time. Among them, A and B can be singular or plural. The character " / " generally means that the associated objects before and after are in an "or" relationship. "At least one (one) of the following" or its similar expression refers to any combination of these items, including any combination of single item (one) or plural items (ones). For example, at least one (one) of a, b, or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0159] In several embodiments provided by the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of the above-mentioned units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed couplings or direct couplings or communication connections to each other can be through some interfaces. The indirect couplings or communication connections of devices or units can be in electrical, mechanical or other forms.

[0160] The units described above as separate components may or may not be physically separated. The components shown as units may or may not be physical units, that is, they can be located in one place, or they can be distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0161] In addition, in each embodiment of the present application, the functional units can be integrated in a processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit. The above-mentioned integrated units can be implemented in the form of hardware or in the form of software functional units.

[0162] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, or all or part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes multiple instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods in each embodiment of the present application. And the aforementioned storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical discs that can store programs.

[0163] The above has described the embodiments of the present application in detail with reference to the drawings. However, the present application is not limited to the above embodiments. Within the scope of knowledge possessed by those of ordinary skill in the art to which it pertains, various changes can be made without departing from the gist of the present application.

Claims

1. A chip bonding control method, characterized in that: Applied to a chip packaging production line, the chip packaging production line includes a die bonding device and a baking device, the die bonding device includes a loading station, a die attaching station, a first visual module, a glue dripping module and a material suction module, the material suction module can move between a preset loading position and a die attaching position, and the baking device includes a heating unit and a blowing module; The control method comprises: Obtain a wafer cut sheet and a metal plate, and place the wafer cut sheet on the loading station, and place the metal plate on the die attaching station; wherein the wafer cut sheet includes a base film and grains evenly arranged on the base film, and the metal plate is provided with an evenly arranged lead frame; Controlling the first visual module to perform image recognition processing on the wafer cutting piece on the loading station, and generating a first moving trajectory of the loading station; According to the first moving track, adjusting the position of the loading station so that the die to be attached on the bottom film is located at the loading position; Acquire a second movement trajectory of the die attach station, and adjust the position of the die attach station according to the second movement trajectory, so that the lead frame to be attached on the metal plate is located at the die attach position; Control the material suction module to move to the loading position and suck the die at the loading position, and control the glue dispensing module to move to the die attaching position and dispense glue on the lead frame at the die attaching position; Control the glue dripping module to move away from the die attaching position, and control the material suction module to move from the material loading position to the die attaching position, and place the sucked die on the lead frame; After all the lead frames on the metal plate are placed with the grains, the metal plate is transferred to the heating unit, and the heating unit is controlled to heat and the blowing module is controlled to blow an anti-oxidation mixed gas toward the heating unit to form a plurality of parts to be packaged on the metal plate.

2. The chip bonding control method according to claim 1, characterized in that: The controlling the first visual module to perform image recognition processing on the wafer cutting piece on the loading station and generate a first moving trajectory of the loading station includes: Controlling the first visual module to image the target image of the wafer cutting piece on the loading station; Perform edge detection and threshold segmentation processing on the target image to obtain multiple grain positions in the target image; According to the grain position, a plurality of initial trajectories are generated and a trajectory length corresponding to each of the initial trajectories is calculated; wherein the initial trajectory traverses all the grain positions, and the initial trajectory is formed by a plurality of routes in a first direction and a second direction, and the first direction and the second direction are perpendicular to each other; The initial trajectory with the shortest trajectory length is used as the first moving trajectory of the loading station.

3. The chip bonding control method according to claim 2, characterized in that: The step of generating a plurality of initial trajectories according to the grain position and calculating the trajectory length corresponding to each of the initial trajectories comprises: According to the position of the grain, an initial track is generated and the corresponding track length is calculated, and the track length is used as the current shortest length; Continuously generating a new initial trajectory, and calculating the corresponding trajectory length in real time during the generation of the initial trajectory; When the trajectory length of the new initial trajectory during the generation process is greater than the current shortest length of the first magnification, stop generating the initial trajectory; wherein the first magnification is greater than or equal to 1; When the new initial trajectory is less than or equal to the current shortest length of the first magnification, the initial trajectory and the corresponding trajectory length are retained and recorded.

4. The chip bonding control method according to claim 3, characterized in that: The continuously generating the new initial trajectory and calculating the corresponding trajectory length in real time during the generation of the initial trajectory includes: Based on the generated initial trajectory, an optimization strategy is generated through a preset heuristic learning model; According to the optimization strategy, a new initial trajectory is continuously generated, and the corresponding trajectory length is calculated in real time during the generation process of the initial trajectory.

5. The chip bonding control method according to claim 1, characterized in that: The die bonding device further includes a second visual module; The step of controlling the glue dispensing module to move to a die attaching position and dispensing glue on the lead frame at the die attaching position includes: Controlling the first visual module and the second visual module to perform image recognition on the wafer cutting sheet on the loading station and the metal plate on the wafer attaching station, respectively, to determine the first size information of the grain and the second size information of the lead frame; Determining glue drop parameters of the glue drop module and determining an expected morphological image of the glue drop according to the first size information and the second size information; Controlling the glue-dropping module to move to a die attaching position, and dispensing glue on the lead frame at the die attaching position according to the glue-dropping parameters; Controlling the second visual module to perform image recognition processing on the glue drop on the lead frame to obtain an actual morphological image of the glue drop; According to the expected morphology image and the actual morphology image, glue dropping parameters of the glue dropping module are adjusted.

6. The chip bonding control method according to claim 5, characterized in that: The step of adjusting the glue dropping parameters of the glue dropping module according to the expected morphology image and the actual morphology image includes: Performing edge analysis on the expected morphological image and the actual morphological image to obtain an expected contour and an actual contour; Performing similarity analysis based on corresponding contour points between the expected contour and the actual contour to obtain contour similarity; Counting the number of pixels of the expected morphological image and the actual morphological image to obtain an expected area and an actual area; Calculate the area difference according to the expected area and the actual area; Calculating a center offset according to the center point position of the expected morphological image and the center point position of the actual morphological image; Inputting the contour similarity, the area difference and the center offset into a preset quality assessment model to obtain a quality assessment value; According to the quality evaluation value, the glue dropping parameters of the glue dropping module are adjusted.

7. The chip bonding control method according to claim 1, characterized in that: The controlling the heating unit to heat and controlling the blowing module to blow the anti-oxidation mixed gas toward the heating unit includes: Controlling the heating unit to preheat the metal plate at a first temperature within a first time period; After the preheating stage is completed, controlling the heating unit to heat the metal plate at a second temperature within a second time period; wherein the second temperature is greater than the first temperature; After the heating stage is completed, controlling the heating unit to cool the metal plate at a third temperature within a third time period; wherein the third temperature is lower than the first temperature; During the operation of the heating unit, the blowing module is controlled to continuously blow out the anti-oxidation mixed gas to the heating unit at a first flow rate; wherein the anti-oxidation mixed gas is a mixed gas of nitrogen and hydrogen.

8. The chip bonding control method according to claim 1, characterized in that: The chip packaging production line also includes a grain detection device, which includes a positioning fixture, a pushing module and a sensing module; After the step of forming a plurality of parts to be packaged on the metal plate, the method further includes: Placing the metal plate containing a plurality of parts to be packaged into a positioning fixture, and determining a number of parts to be packaged to be inspected on the metal plate; Controlling the pushing module to push the die of the packaged component to be inspected, and using the sensing module to sense the thrust value applied by the pushing module to the die; When the pushing module pushes the grain down, the current pushing force value is recorded as the maximum force value; When the maximum force values ​​corresponding to all the components to be packaged to be detected are greater than or equal to the preset tolerance threshold, it is determined that the die bonding of the components to be packaged on the corresponding metal plate is good; When the maximum force value corresponding to one of the parts to be packaged to be detected is less than the bearing threshold, a new part to be packaged to be detected is re-determined, and the pushing module and the sensing module are controlled to detect the new part to be packaged to be detected; When the maximum force values ​​corresponding to all new parts to be tested to be packaged are greater than or equal to the preset bearing threshold, it is determined that the corresponding parts to be packaged on the metal plate are well bonded. Conversely, when the maximum force value corresponding to one of the new parts to be tested to be packaged is less than the bearing threshold, the quality of the corresponding metal plate is marked as to be determined.

9. A chip packaging production line, characterized in that: include: at least one memory; at least one processor; at least one program; The programs are stored in the memory, and the processor executes at least one of the programs to implement the chip bonding control method according to any one of claims 1 to 8.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer-executable signal, and the computer-executable signal is used to execute the chip bonding control method according to any one of claims 1 to 8.

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