Wafer loading equipment

Abstract

The present invention provides a wafer loading device in the field of wafer loading technology, which is used for wafer loading and includes a material picking mechanism, a pin mechanism located below the material picking mechanism, and a loading mechanism located between the material picking mechanism and the pin mechanism; the loading mechanism includes a platform for placing wafers, and a film expansion component for uniformly stretching the wafer film and a driving component for driving the platform and the film expansion mechanism to move horizontally, longitudinally, and vertically are provided below the platform. The film expansion component is driven by a first driving unit to move vertically, and the film expansion action is performed from the first layer of protrusions to the second layer of protrusions, so that the wafer film reaches the best expansion state; the conveying component can perform horizontal, longitudinal, vertical, and rotational movements to move the adsorbent above the pin, and the third conveying unit adopts a linear rotator to accurately control the pressure of the adsorbent to absorb the chip; the pin mechanism can be provided with a plurality of pins, and the chip lifting action is completed through two vertical movements.

Description

Technical Field

[0001] The present application relates to the technical field of wafer loading, and in particular to a wafer loading device. Background Art

[0002] The manufacturing process of semiconductor chips is complex, mainly consisting of wafer processing, oxidation, photolithography, etching, thin film deposition, interconnection, testing, and packaging. Among them, packaging refers to the use of a dicing process to divide the wafer from the front-end process into independent chips with electrical properties. In the process of product manufacturing, it is necessary to extract chips from the wafer film for production and manufacturing. Since there is still interaction force between each two adjacent chips on the wafer after cutting, when the chip is peeled off the wafer film, excessive suction will cause local deformation of the wafer film and affect the stability of the surrounding chips; if a pin is used to lift it up from the bottom, the lifting force will be too large and will directly damage the chip; if the bottom of the wafer film is opened by expanding the film, when the force is uneven, it is easy to have problems such as single suction or chip loss. Summary of the invention

[0003] The present invention provides a wafer loading device to solve the problems in the prior art that when a film expansion mechanism is expanding a film, the force on the chip is uneven, a single chip cannot be accurately sucked, and the lifting force of the ejector mechanism is difficult to control.

[0004] To solve the above problems, the technical solution adopted by the present invention is:

[0005] The present invention provides a wafer loading device, which is used for wafer loading, and comprises a material picking mechanism, a pin mechanism located below the material picking mechanism, and a loading mechanism located between the material picking mechanism and the pin mechanism; the loading mechanism comprises a platform for placing wafers, and a film expansion component for uniformly stretching the wafer film and a driving component for driving the platform and the film expansion mechanism to perform lateral, longitudinal and vertical movements are arranged below the platform.

[0006] As a further implementation of the above, the platform includes a tray for placing wafers, a first hollow area is provided in the middle of the tray, a pressure plate for fixing the wafer is provided above and parallel to the tray, the pressure plate is provided with a second hollow area, two rows of slide rail assemblies are provided between the tray and the pressure plate, a handle is also provided on the tray, a plurality of limiters are provided around the tray for placing the wafers, and a sensor is provided under the pressure plate. As a further implementation of the above, the film expansion assembly includes a film expansion base plate provided under the tray, a third hollow area is provided in the middle of the film expansion base plate, a first layer of protrusions is provided at the edge of the third hollow area or near the edge of the third hollow area, a second layer of protrusions is provided on the periphery of the first layer of protrusions, the outer edge diameter of the first layer of protrusions is smaller than the diameter of the first hollow area, and the outer edge diameter of the second layer of protrusions is larger than the diameter of the first hollow area; a sensor is also provided on the film expansion base plate.

[0007] As a further implementation of the above, the driving assembly includes a first driving unit, a second driving unit, and a third driving unit. The third driving unit includes a plurality of screw rods and transmission parts. The screw rods are connected to the four corners of the film expansion base plate. The screw rods and the transmission parts cooperate to drive the second-layer protrusion to move vertically, and the sensor senses the relative height between the second-layer protrusion and the pressure plate; the two sides of the film expansion base plate are connected to the second driving unit, and the second driving unit drives the platform and the film expansion assembly to move longitudinally; the second driving unit is connected to the third driving unit at the bottom, and the first driving unit drives the platform and the film expansion assembly to move laterally.

[0008] As a further implementation of the above, the material picking mechanism includes a bracket and a conveying assembly, the conveying assembly includes a first conveying part arranged on the bracket, a second conveying part connected to the output end of the first conveying part, and a third conveying part connected to the output end of the second conveying part; the output end of the third conveying part is provided with an adsorption part, which drives the adsorption part to move vertically downward at the grabbing position to grab and move upward and return after grabbing, and rotate while moving downward; the second conveying part drives the third conveying part to move longitudinally, and the first conveying part drives the second conveying part and the third conveying part to move horizontally.

[0009] As a further implementation of the above, the material taking mechanism further includes a static electricity removal unit; when taking the material, the static electricity removal unit eliminates the static electricity brought by the adsorption component.

[0010] As a further embodiment of the above, the static electricity removal unit includes a static electricity remover and a nozzle connected to the static electricity remover, wherein an outlet of the nozzle faces a gripping position of the wafer, and the nozzle can be bent.

[0011] As a further implementation of the above, the ejector mechanism includes an ejector assembly and a moving assembly; when the suction piece moves vertically downward to grab the grabbing position, the moving assembly synchronously drives the ejector assembly to move vertically upward to push the wafer chip at the grabbing position toward the direction of the suction piece.

[0012] As a further implementation of the above, in the process of pushing up the wafer chip, the moving assembly drives the ejector pin assembly to perform two vertical movements forward and backward.

[0013] As a further implementation of the above, the moving assembly includes a first moving part and a second moving part; the ejector assembly and the second moving part are fixed to the first moving part, and after the first moving part drives the second moving part and the ejector assembly to move vertically a set distance, the second moving part drives the ejector in the ejector assembly to move vertically a set distance again.

[0014] As a further implementation of the above, the ejector assembly further includes a mounting seat, and the ejector is movably arranged in the mounting seat; the second moving part vertically ejects the ejector in the mounting seat through its connecting rod.

[0015] As a further embodiment of the above, a plurality of ejector pins are provided, and a plurality of ejector pin mounting holes are provided on the mounting seat, and the ejector pins are received in the ejector pin mounting holes.

[0016] As a further implementation of the above, a positioning mechanism is provided above the bracket, and the positioning mechanism includes a shooting part and adjustable light sources provided on both sides of the shooting part, and the shooting part collects the image of the wafer.

[0017] As a further implementation of the above, the photographing part, the ejector pin and the adsorption member are located on the same vertical line.

[0018] As a further embodiment of the above, the transport component can transport two or more chips at the same time.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] The present invention provides a wafer loading device, which drives a film expansion component to move vertically through a first driving part, and performs a film expansion action from a first-layer protrusion to a second-layer protrusion, so that the wafer film reaches an optimal expansion state; the position of the wafer chip is determined by a positioning mechanism, and then the second driving part and the third driving part move, and the conveying component drives its adsorption component to move horizontally, longitudinally, vertically and rotationally, so as to move the adsorption component above the ejector pin. While the third conveying part drives the adsorption component to absorb the chip, the ejector pin of the ejector pin mechanism moves upward to push up the wafer chip at the pickup position, so as to accurately complete the chip grabbing, and the loading is carried out under the drive of the conveying component. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solution proposed in the present invention, it is described in detail below in combination with the embodiments and drawings. It should be understood that the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, these drawings can be changed under the concept of the present invention.

[0022] Figure 1 An assembly stereogram of an embodiment of a wafer loading device provided by the present invention;

[0023] Figure 2 An assembly stereogram of an embodiment of a feeding mechanism provided by the present invention;

[0024] Figure 3 An assembly stereogram of an embodiment of a material taking mechanism provided by the present invention;

[0025] Figure 4 An assembly stereogram of an embodiment of the alignment mechanism provided by the present invention;

[0026] Figure 5 An assembly stereogram of an embodiment of the ejector mechanism provided by the present invention;

[0027] Figure 6 A partially assembled stereogram of an embodiment of a membrane expansion assembly provided by the present invention;

[0028] Figure 7 A partially assembled perspective view of an embodiment of a platform provided by the present invention.

[0029] 1. Feeding mechanism; 11. Platform; 111. Support plate; 1111. Handle; 1112. Stopper; 1113. First hollow area; 1114. Magnet; 112. Press plate; 1121. Induction element; 1122. Second hollow area; 113. Slide rail assembly; 12. Film expansion assembly; 121. Film expansion bottom plate; 1211. Third hollow area; 1212. First layer raised portion; 1213. Second layer raised portion; 1214. Sensor; 13. Driving assembly; 131. First driving portion; 132. Second Driving unit; 133, third driving unit; 2, material picking mechanism; 21, bracket; 22, first conveying unit; 23, second conveying unit; 24, third conveying unit; 241, material picking shaft; 242, adsorbent; 25, static elimination unit; 251, static elimination device; 252, nozzle; 3, positioning mechanism; 31, shooting unit; 32, light source; 4, ejector mechanism; 41, first moving unit; 42, second moving unit; 421, connecting rod; 422, moving part; 43, ejector assembly; 431, mounting seat; 432, ejector.

[0030] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments. DETAILED DESCRIPTION

[0031] like Figure 1 As shown, a wafer loading device provided by the present invention includes a movable loading mechanism 1, a pin mechanism 4 is fixed below the loading mechanism 1, a picking mechanism 2 is provided above the loading mechanism 1, and a positioning mechanism 3 is fixed on the picking mechanism 2. The loading mechanism 1 can quickly complete wafer loading and wafer film expansion, which is convenient for the picking mechanism 2 to absorb the chip on the wafer, and the positioning mechanism 3 takes pictures and corrects so that each chip to be absorbed is on the same vertical line with the pin 432.

[0032] In this embodiment, combined with Figure 2 , Figure 6 as well as Figure 7As shown, the platform 11 includes a support plate 111 for placing wafers, a first hollow area 1113 is provided in the middle of the support plate 111, a pressure plate 112 for fixing the wafer is provided above and parallel to the support plate 111, and the pressure plate 112 is provided with a second hollow area 1122, two rows of slide rail assemblies 113 are provided between the support plate 111 and the pressure plate 112, and a handle 1111 is also provided on the support plate 111, a plurality of limit members 1112 are provided around the support plate 111 for placing the wafers, and a sensing member 1121 is provided under the pressure plate 112; the slide rail assembly 113 includes an upper slide rail member provided under the pressure plate 112 and a lower slide rail member provided above the support plate 111, and the upper slide rail member and the lower slide rail member are slidably matched so that the support plate 111 can slide flexibly relative to the pressure plate 112. When loading the wafer, hold the handle 1111 to pull out the support plate 111, fully expose the first hollow area 1113 to the outside, and place the wafer in the first hollow area 1113. At this time, multiple limiting members 1112 just surround the outer ring of the wafer to complete the wafer limiting. Further, push the support plate 111 with the wafer back through the handle 1111, and the sensing member 1121 under the pressure plate 112 senses the wafer, and the system determines that the wafer is loaded in place. In addition, a plurality of magnetic seats are provided on the pressure plate 112, and a plurality of magnets 1114 are provided on the support plate 111. The magnets 1114 and the magnetic seats are arranged on the rear side of the support plate 111 and the pressure plate 112. When the support plate 111 is pushed back a certain distance, the magnets 1114 and the magnetic seats attract each other to assist in completing the reset action of the support plate 111. The wafer loading is convenient, the structure is simple, and the wafer limiting is effectively completed.

[0033] In this embodiment, combined with Figure 6 , Figure 7 As shown, the film expansion assembly 12 includes a film expansion base plate 121 disposed below the support plate 111, a third hollow area 1211 is provided in the middle of the film expansion base plate 121, and a first-layer protrusion 1212 is provided at the edge of the third hollow area 1211 or near the edge of the third hollow area 1211, and a second-layer protrusion 1213 is provided on the periphery of the first-layer protrusion 1212, and the upper end surface of the second-layer protrusion 1213 is lower than the upper end surface of the first-layer protrusion 1212, and the first-layer protrusion 1213 is provided on the periphery of the first-layer protrusion 1212. The outer edge diameter of the raised portion 1212 is smaller than the inner diameter of the first hollow area 1113, and the outer edge diameter of the second-layer raised portion 1213 is larger than the diameter of the first hollow area 1113. The first-layer raised portion 1212, the second-layer raised portion 1213, and the film expansion base plate 121 are integrated into a processing design, and the accuracy is higher when the film expansion movement is performed; a sensor 1214 is also provided on the film expansion base plate 121, and the extreme position of the film expansion is limited by the sensor 1214 to further prevent.

[0034] Furthermore, the drive assembly 13 includes a first drive part 131, a second drive part 132, and a third drive part 133. The third drive part 133 includes a plurality of screw-nut pairs and transmission parts. The nuts of the screw-nut pairs are fixed at the four corners of the film expansion base plate 121. The top of each screw passes through the nut and is rotatably connected to the four corners of the pressure plate 112. The transmission part is located below the film expansion base plate 121, and includes a synchronous belt and a synchronous pulley. Each synchronous pulley is fixedly connected to the lower end of the screw. The synchronous belt is wrapped around each synchronous pulley and ensures sufficient wrap angle to achieve reliable transmission. Of course, it also includes a servo motor, which drives the active pulley to rotate through the servo motor, and then drives each synchronous pulley and the screw to rotate through the synchronous belt transmission. When the screw rotates, it will drive the nut and the film expansion base plate 121 to move in the vertical direction, so as to achieve the rise and fall of the film expansion base plate 121, and then make the first-layer protrusion 1212 and the second-layer protrusion 1213 move vertically, and the first-layer protrusion 1212 rises vertically and contacts the bottom surface of the wafer to perform the film expansion action. Of course, the relative height of the second-layer protrusion 1213 and the pressure plate 112 is detected by the sensor 1214. When the rising height of the second-layer protrusion 1213 exceeds the set value, the sensor 1214 senses and sends an audible and visual alarm. In addition, both sides of the film expansion base plate 121 are connected to the output ends of the second driving unit 132, and then the second driving unit 132 drives the platform 11 and the film expansion assembly 12 to move longitudinally; the lower part of the second driving unit 132 is connected to the first driving unit 131, and the first driving unit 131 drives the platform 11 and the film expansion assembly 12 to move horizontally. When the film expansion movement is performed, the third driving unit 133 drives the film expansion base plate 121 to rise vertically, and the first layer of protrusions 1212 directly contacts the bottom surface of the wafer. Because the second layer of protrusions 1213 are provided, the first layer of protrusions 1212 are prevented from excessively expanding the wafer film, and the third driving unit 133 cooperates with the transmission part through the screw rod, with accurate positioning, sensitive movement, and smooth sliding. When the first layer of protrusions 1212 contacts the bottom surface of the wafer, the movement is gentle, and the wafer film will not be excessively expanded, resulting in the inability to pick up the chip.

[0035] In this embodiment, combined with Figure 3As shown, the material picking mechanism 2 includes a bracket 21 and a conveying assembly, the conveying assembly includes a first conveying part 22 arranged on the bracket 21, a second conveying part 23 connected to the output end of the first conveying part 22, and a third conveying part 24 connected to the output end of the second conveying part 23; the third conveying part 24 includes a plurality of linear rotary actuators arranged side by side, the linear rotator has a retractable material picking shaft 241, an adsorption part 242 is fixedly provided at the bottom of a material picking shaft 241, the linear rotator drives the adsorption part 242 to perform vertical and rotational movements, the first conveying part 22 drives the second conveying part 23 and the third conveying part 24 to perform horizontal movements, the second conveying part 23 drives the third conveying part 24 to perform longitudinal movements, the first conveying part 22 can be a linear motor module, and the second conveying part 23 can be a combination of a servo motor, a slider, and a screw nut pair. When the adsorbent 242 is controlled by the linear rotary actuator to adsorb the chip, the linear rotary actuator is adjusted so that the adsorbent 242 continues to move down a small distance when contacting the chip, thereby applying a small elastic pressing force to the chip. The pressing force can be controlled within 2.5N, and the pressure accuracy can be controlled within ±0.1N, to prevent the adsorbent 242 from failing to adsorb the chip or falling off after adsorption, thereby damaging the chip.

[0036] Furthermore, the material picking mechanism 2 also includes a static elimination unit 25 for eliminating static electricity when picking up materials. The static elimination unit 25 is fixed to the bottom of the bracket 21. The static elimination unit 25 includes a static elimination device 251 and a flexible nozzle 252 connected to the static elimination device 251. In order to prevent the alignment mechanism 3 from affecting the shooting when performing the alignment work, the flexible nozzle 252 is surrounded by the chip to be sucked, that is, the material picking position. Static electricity is generated when the adsorbent 242 contacts and absorbs the chip. The static elimination unit 25 will be in a real-time working state when picking up materials, releasing positive and negative ions that neutralize the static electricity between the adsorbent 242 and the chip. The adsorbent 242 is an anti-static, traceless suction nozzle, which can prevent the adsorbent 242 from damaging the chip due to static electricity when adsorbing the chip on the wafer.

[0037] In this embodiment, combined with Figure 5As shown, the ejector mechanism 4 includes an ejector assembly 43 and a moving assembly. The moving assembly drives the ejector assembly 43 to perform two-step vertical movement. The moving assembly includes a first moving part 41 and a second moving part 42. The ejector assembly 43 and the second moving part 42 are fixed to the first moving part 41. The first moving part 41 drives the second moving part 42 and the ejector assembly 43 to perform the first step of vertical movement. The first moving part 41 can be a linear module, and the second moving part 42 can be a push rod motor. The ejector assembly 43 includes an ejector 432 and a mounting seat 431 for mounting the ejector 432. The ejector 432 is movably arranged in the mounting seat 431. The second moving part 42 includes a connecting rod 421 and a moving part 422 for moving the connecting rod 421. The connecting rod 421 is connected to the moving part 422. The mounting seat 431 is installed on the end of the connecting rod 421 away from the moving part 422. The connecting rod 421 is driven to move upward by the moving part 422. The connecting rod 421 is inserted into the mounting seat 431 and the ejector pin 432 is pushed upward to perform the second step of vertical movement. The mounting seat 431 is provided with a plurality of ejector pin 432 mounting holes, and a plurality of ejector pins 432 can be installed in the ejector pin 432 mounting holes. The pins 432 can disperse the lifting force, avoid excessive local stress on the chip caused by a single ejector pin 432, and reduce the risk of chip damage. Of course, it should be noted that when the connecting member 422 drives the connecting rod 421 to move upward, the connecting rod 421 contacts the bottoms of the multiple ejector pins 432, thereby driving the multiple ejector pins 432 to move upward synchronously. Of course, a movable ejector plate can be provided in the mounting seat 431, which contacts the ejector plate when the connecting rod 421 moves upward, and the multiple ejector pins 432 can be further pushed upward synchronously through the ejector plate.

[0038] In this embodiment, combined with Figure 4 As shown, the alignment mechanism 3 is arranged above the bracket 21, and the alignment mechanism 3 includes a shooting part 31 and an adjustable light source 32 arranged on both sides of the shooting part 31. The shooting part 31 includes a camera, which is a panoramic camera. The camera, the ejector pin 432, and the adsorbent 242 are always arranged on the same vertical line. After the wafer is placed on the pallet 111, the first layer of raised parts 1212 on the film expansion bottom plate 121 uniformly expands the wafer upward through the third driving part 133. Before each chip is absorbed by the adsorbent 242, the camera takes a picture, and the chip is moved to the material extraction position above the ejector pin 432 through the second driving part 132 and the third driving part 133. The adsorbent 242 is moved to the material extraction position through the first conveying part 22, the second conveying part 23 and the linear rotary actuator. While the ejector pin 432 lifts the chip through the first moving part 41 and the second moving part 42, the adsorbent 242 adsorbs the chip.

[0039] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0040] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

[0041] The above is a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A wafer loading device, used for wafer loading, characterized in that: The invention comprises a material taking mechanism (2), a pin mechanism (4) located below the material taking mechanism (2), and a loading mechanism (1) located between the material taking mechanism (2) and the pin mechanism (4); the loading mechanism (1) comprises a platform (11) for placing wafers, a film expansion component (12) for uniformly stretching the wafer film and a driving component (13) for driving the platform (11) and the film expansion component to move horizontally, longitudinally and vertically are provided below the platform (11); The platform (11) comprises a support plate (111) for placing wafers, a first hollow area (1113) is provided in the middle of the support plate (111), a pressing plate (112) for fixing the wafers is provided above and parallel to the support plate (111), and the pressing plate (112) is provided with a second hollow area (1122); The film expansion assembly (12) comprises a film expansion base plate (121) arranged below the support plate (111); a third hollow area (1211) is arranged in the middle of the film expansion base plate (121); a first layer of raised portions (1212) is arranged at the edge of the third hollow area (1211) or near the edge of the third hollow area (1211); a second layer of raised portions (1213) is arranged on the periphery of the first layer of raised portions (1212); the outer edge diameter of the first layer of raised portions (1212) is smaller than the diameter of the first hollow area (1113); and the outer edge diameter of the second layer of raised portions (1213) is larger than the diameter of the first hollow area (1113); and a sensor (1214) is also arranged on the film expansion base plate (121); The drive assembly (13) includes a third drive unit (133), and the third drive unit (133) includes a plurality of screw rods and transmission parts. The screw rods are connected to the four corners of the film expansion base plate (121). The screw rods cooperate with the transmission parts to drive the film expansion base plate (121) to move toward the side where the support plate (111) is located. The first layer of protrusions (1212) rises vertically and contacts the bottom surface of the wafer to perform film expansion. The sensor (1214) senses the relative height between the second layer of protrusions (1213) and the pressure plate (112). When the rising height of the second layer of protrusions (1213) exceeds a set value, the sensor (1214) senses and emits an audible and visual alarm.

2. A wafer loading device as claimed in claim 1, characterized in that: Two rows of slide rail assemblies (113) are provided between the support plate (111) and the pressure plate (112); a handle (1111) is also provided on the support plate (111); a plurality of limit members (1112) are provided around the support plate (111) for placing wafers; and a sensing member (1121) is provided below the pressure plate (112).

3. The wafer loading device according to claim 1, characterized in that: The driving component (13) comprises a first driving part (131) and a second driving part (132); the two sides of the film expansion base plate (121) are connected to the second driving part (132); the second driving part (132) drives the platform (11) and the film expansion component (12) to move longitudinally; the lower part of the second driving part (132) is connected to the third driving part (133); the first driving part (131) drives the platform (11) and the film expansion component (12) to move transversely.

4. The wafer loading device according to claim 1, characterized in that: The material taking mechanism (2) comprises a bracket (21) and a conveying assembly, wherein the conveying assembly comprises a first conveying part (22) arranged on the bracket (21), a second conveying part (23) connected to the output end of the first conveying part (22), and a third conveying part (24) connected to the output end of the second conveying part (23); the output end of the third conveying part (24) is provided with an adsorption member (242), which drives the adsorption member (242) to move vertically downward at a grasping position to grasp and move upward and return after grasping, and to perform rotational movement while moving downward; the second conveying part (23) drives the third conveying part (24) to perform longitudinal movement, and the first conveying part (22) drives the second conveying part (23) and the third conveying part (24) to perform lateral movement.

5. The wafer loading device according to claim 4, characterized in that: The material taking mechanism (2) further comprises a static electricity removal unit (25); when taking materials, the static electricity removal unit (25) removes static electricity brought by the adsorption element (242).

6. The wafer loading device according to claim 5, characterized in that: The static electricity removal section (25) comprises a static electricity removal device (251) and a nozzle (252) connected to the static electricity removal device (251). The nozzle (252) has an emission port facing a wafer grabbing position, and the nozzle (252) can be bent.

7. A wafer loading device as described in any one of claims 4 to 6, characterized in that: The ejector mechanism (4) comprises an ejector assembly (43) and a moving assembly; when the suction piece (242) moves vertically downward at the grabbing position for grabbing, the moving assembly synchronously drives the ejector assembly (43) to move vertically upward, so as to push the wafer chip at the grabbing position in the direction of the suction piece (242); in the process of pushing the wafer chip upward, the moving assembly drives the ejector assembly (43) to perform two vertical movements forward and backward; the moving assembly comprises a first moving part (41) and a second moving part (42); the ejector assembly (43) and the second moving part (42) are fixed to the first moving part (41), and after the first moving part (41) drives the second moving part (42) and the ejector assembly (43) to move vertically for a set distance, the second moving part (42) drives the ejector (432) in the ejector assembly (43) to move vertically for a set distance again.

8. The wafer loading device according to claim 7, characterized in that: The ejector assembly (43) further comprises a mounting seat (431), and the ejector (432) is movably arranged in the mounting seat (431); the second movable part (42) vertically ejects the ejector (432) in the mounting seat (431) through its connecting rod (421).

9. The wafer loading device according to claim 8, characterized in that: A plurality of ejector pins (432) are provided, and a plurality of ejector pin mounting holes are provided on the mounting seat (431), and the ejector pins (432) are received in the ejector pin mounting holes.

10. The wafer loading device according to claim 9, characterized in that: A positioning mechanism (3) is provided above the support (21), the positioning mechanism (3) comprising a shooting section (31) and adjustable light sources (32) provided on both sides of the shooting section (31), the shooting section (31) collecting images of the wafer.

11. The wafer loading device according to claim 10, characterized in that: The photographing portion (31), the ejector pin (432), and the adsorption member (242) are located on the same vertical line.

12. The wafer loading device according to claim 4, characterized in that: The transport component can transport more than two chips at the same time.

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