Packaging structure, packaging method and electronic device

Abstract

The present application provides a packaging structure, a packaging method and an electronic device, the packaging structure comprising: a carrier board, a plurality of holes are provided on the carrier board, the holes penetrate the carrier board; a first heat conductor fills the holes; a solder pad is located on one side of the carrier board, the solder pad is connected to the first heat conductor; a plurality of second heat conductors are located on the side of the carrier board away from the solder pad, the second heat conductors are connected to the first heat conductor, a plurality of second heat conductors are arranged with a heat-conducting structure at intervals, the heat-conducting structure at least partially fills the intervals between adjacent second heat conductors, and the specific surface area of ​​the heat-conducting structure is greater than the specific surface area of ​​the second heat conductor. The technical solution provided by the present application is to arrange a plurality of holes penetrating the carrier board, arrange the first heat conductor in the holes and connect it to the solder pad; and arrange a plurality of spaced second heat conductors on the side of the carrier board away from the solder pad, and fill the intervals with the heat-conducting structure, thereby increasing the heat dissipation space, which is conducive to reducing thermal resistance, further improving heat dissipation efficiency, and thus improving the reliability of semiconductor devices.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor chip packaging, and in particular to a packaging structure, a packaging method and an electronic device. Background Art

[0002] At present, the thermal management of semiconductor chips has attracted much attention. The existing chip packaging structure has low thermal conductivity and low heat dissipation efficiency, which easily leads to heat accumulation, thus affecting the reliability of semiconductor devices. Summary of the invention

[0003] In view of this, the embodiments of the present application are directed to providing a packaging structure, a packaging method and an electronic device to solve the problem of low heat dissipation efficiency and influence on the reliability of semiconductor devices.

[0004] In a first aspect, the present application provides a packaging structure, comprising: a carrier board, a plurality of holes being provided on the carrier board, the holes penetrating the carrier board; a first heat-conducting member filling the holes; a soldering pad located on one side of the carrier board, the soldering pad being connected to the first heat-conducting member; a plurality of second heat-conducting members located on a side of the carrier board away from the soldering pad, the second heat-conducting members being connected to the first heat-conducting members, and the plurality of second heat-conducting members being arranged at intervals; and a heat-conducting structure, the heat-conducting structure at least partially filling the intervals between adjacent second heat-conducting members, the specific surface area of ​​the heat-conducting structure being greater than the specific surface area of ​​the second heat-conducting members.

[0005] In one embodiment, in the thickness direction of the carrier board, the length of the second heat conducting member is greater than or equal to 20 um.

[0006] In one embodiment, the material of the thermally conductive structure comprises a porous material.

[0007] In one embodiment, the material of the thermal conductive structure includes one or more of copper metal foam, silver metal foam, carbon foam, and silicon carbide foam.

[0008] In one embodiment, the packaging structure also includes: a chip, located on the side of the pad away from the carrier, and the chip is electrically connected to the pad; and / or, a first thermal conductive layer, located between the second thermal conductive member and the carrier, and the first thermal conductive layer and the second thermal conductive member are made of the same material; and / or, a second thermal conductive layer, located on the side of the second thermal conductive member away from the carrier, and the material of the second thermal conductive layer includes thermal grease; and / or, a third thermal conductive layer, located on the side of the second thermal conductive layer away from the carrier, and the material of the third thermal conductive layer includes copper.

[0009] A second aspect of the present application provides a packaging method, comprising: providing a carrier; forming a plurality of holes on the carrier, the holes penetrating the carrier; preparing a first heat conductor in the hole; preparing a solder pad on one side of the carrier, the solder pad being connected to the first heat conductor; preparing a plurality of second heat conductors on a side of the carrier away from the solder pad, the second heat conductors being connected to the first heat conductor, and the plurality of second heat conductors being arranged at intervals; preparing a heat-conducting structure on a side of the carrier away from the solder pad, the heat-conducting structure at least partially filling the intervals between adjacent second heat conductors, and the specific surface area of ​​the heat-conducting structure being greater than the specific surface area of ​​the second heat conductor.

[0010] In one embodiment, after the step of preparing a plurality of second heat conducting members on the side of the carrier away from the pad and before the step of preparing a heat conducting structure on the side of the carrier away from the pad, the method further includes: mounting a chip on the side of the pad away from the carrier.

[0011] In one embodiment, after the step of preparing a thermally conductive structure on the side of the carrier away from the solder pad, it also includes: preparing a second thermally conductive layer on the side of the second thermally conductive component away from the carrier, the material of the second thermally conductive layer includes thermally conductive silicone grease; and / or preparing a third thermally conductive layer on the side of the second thermally conductive layer away from the carrier, the material of the third thermally conductive layer includes copper.

[0012] In one embodiment, after the step of preparing the first heat conducting member in the hole and before the step of preparing the pad on one side of the carrier, the method further includes: preparing a first heat conducting layer on one side of the carrier, wherein the first heat conducting layer and the second heat conducting member are made of the same material.

[0013] In one embodiment, after preparing the solder pad on one side of the carrier and before preparing multiple second thermal conductive members on the side of the carrier away from the solder pad, the method further includes: preparing a first thermal conductive layer on the side of the carrier away from the solder pad, wherein the first thermal conductive layer and the second thermal conductive members are made of the same material.

[0014] A third aspect of the present application provides an electronic device, comprising: a packaging structure as mentioned in any of the above embodiments.

[0015] The technical solution provided by the present application is to set a plurality of holes that penetrate the carrier, set the first heat conductor in the holes, and connect it to the pad, thereby improving the heat dissipation efficiency of the carrier. A plurality of spaced second heat conductors are set on the side of the carrier away from the pad, and the space is filled with a heat-conducting structure, which increases the heat dissipation space and helps to reduce thermal resistance; and the second heat conductor is connected to the first heat conductor located in the plurality of holes of the carrier, forming a heat conduction path between the pad, the first heat conductor and the second heat conductor, thereby further improving the heat dissipation efficiency. In summary, the packaging structure provided by the present application can improve the heat dissipation efficiency, thereby improving the reliability of semiconductor devices.

[0016] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present application, nor is it intended to limit the scope of the present application. Other features of the present application will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 Shown is a schematic structural diagram of a packaging structure provided in one embodiment of the present application.

[0019] Figure 2 Shown is a schematic diagram of the planar structure of a packaging structure provided in one embodiment of the present application.

[0020] Figure 3 Shown is a schematic diagram of the planar structure of a packaging structure provided in another embodiment of the present application.

[0021] Figure 4 Shown is a schematic diagram of a heat conduction structure provided in an embodiment of the present application.

[0022] Figure 5 Shown is a schematic structural diagram of a packaging structure provided in another embodiment of the present application.

[0023] Figure 6 Shown is a schematic structural diagram of a packaging structure provided in yet another embodiment of the present application.

[0024] Figure 7 Shown is a schematic structural diagram of a packaging structure provided in yet another embodiment of the present application.

[0025] Figure 8 Shown is a schematic structural diagram of a packaging structure provided in yet another embodiment of the present application.

[0026] Fig. 9 Shown is a schematic flow chart of a packaging method provided in one embodiment of the present application.

[0027] Figure 10a-10l Shown is a schematic structural diagram of an intermediate product of a packaging structure provided in one embodiment of the present application.

[0028] Fig.11 Shown is a schematic flow chart of a packaging method provided in another embodiment of the present application.

[0029] Fig.12Shown is a schematic flow chart of a packaging method provided in yet another embodiment of the present application.

[0030] Fig.13 Shown is a schematic flow chart of a packaging method provided in yet another embodiment of the present application.

[0031] Fig.14 Shown is a schematic flow chart of a packaging method provided in yet another embodiment of the present application.

[0032] Fig.15 Shown is a schematic flow chart of a packaging method provided in yet another embodiment of the present application. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0034] Figure 1 FIG. 1 is a schematic diagram of a packaging structure provided by an embodiment of the present application. Figure 2 FIG. 1 is a schematic diagram of a planar structure of a packaging structure provided by an embodiment of the present application. Figure 3 FIG. 2 is a schematic diagram of a planar structure of a packaging structure provided by another embodiment of the present application. Figure 1-Figure 3 The packaging structure includes: a carrier 101, the carrier 101 is provided with a plurality of holes 1011, and the holes 1011 penetrate the carrier 101; a first heat-conducting member 102, filling the holes 1011; a soldering pad 103, located at one side of the carrier 101, and connected to the first heat-conducting member 102; a plurality of second heat-conducting members 104, located at a side of the carrier 101 away from the soldering pad 103, and connected to the first heat-conducting member 102, and the plurality of second heat-conducting members 104 are arranged at intervals; a heat-conducting structure 105, the heat-conducting structure 105 at least partially fills the intervals between adjacent second heat-conducting members 104, and the specific surface area of ​​the heat-conducting structure 105 is greater than the specific surface area of ​​the second heat-conducting member 104.

[0035] Specifically, the material of the carrier 101 includes glass, which has good air tightness, moisture resistance and dimensional stability, strong process compatibility and good structural stability. Through glass vias (TGV) are punched on the glass carrier, which can be used as heat conduction channels in the carrier 101. The carrier 101 serves as a basic packaging structure and provides support for the pads 103 located on one side of the carrier 101.

[0036] The pad 103 is used to fix electronic components such as the chip 106 on one hand, and help the electronic components to be electrically connected to the external circuit; on the other hand, it serves as a heat dissipation structure to help the chip 106 dissipate heat and conduct away the heat generated by the electronic components.

[0037] See also Figure 2 , multiple holes 1011 are distributed in an array on the carrier 101, with a high density, which can dissipate heat more efficiently and evenly. The holes 1011 in each row are arranged along the length direction F3 of the carrier 101, and the holes 1011 in each column are arranged along the width direction F2 of the carrier 101. The first heat conductor 102 corresponds to the multiple holes 1011 on the carrier 101 one by one. The first heat conductor 102 is a columnar heat conductor filled in the hole 1011, and multiple first heat conductors 102 are connected to the pad 103. On the one hand, the heat transferred by the pad 103 is dissipated, and on the other hand, the heat of the pad 103 is transferred to the second heat conductor 104. Exemplarily, the material of the first heat conductor 102 includes metal, and preferably, the first heat conductor 102 may include a gold column, a silver column or a copper column.

[0038] A plurality of second heat-conducting members 104 are arranged on the side of the carrier 101 away from the pad 103, connected with the first heat-conducting member 102, and the heat transferred by the first heat-conducting member 102 is dissipated and further transferred. In this way, a heat conduction path is formed between the pad 103, the first heat-conducting member 102 and the second heat-conducting member 104, and the heat dissipation efficiency is improved. In addition, there is a gap between the adjacent second heat-conducting members 104, which increases the heat dissipation space. The number of the second heat-conducting members 104 and the number of the first heat-conducting members 102 can be the same or different. The second heat-conducting member 104 and the first heat-conducting member 102 can be directly connected or indirectly connected. For example, the second heat-conducting member 104 and the first heat-conducting member 102 correspond one by one and are connected in a direct contact manner. For another example, the number of the second heat-conducting member 104 is greater than the number of the first heat-conducting member 102, or the density of the two is different, and a connecting structure made of a heat-conducting material can be arranged between the second heat-conducting member 104 and the first heat-conducting member 102 to indirectly connect the two. Exemplarily, the material of the connection structure is the same as the material of the first heat conducting member 102 and / or the second heat conducting member 104 .

[0039] Exemplarily, the shape of the second heat-conducting member 104 includes a columnar shape. The material of the second heat-conducting member 104 includes metal, and preferably, the material of the second heat-conducting member 104 includes gold, silver or copper.

[0040] The heat-conducting structure 105 at least partially fills the space between adjacent second heat-conducting members 104, further improving the heat dissipation efficiency. Figure 3, the heat-conducting structure 105 wraps the plurality of second heat-conducting members 104, which is beneficial to the uniform distribution of heat in the packaging structure and reduces local hot spots. Specific surface area refers to the size of the surface area of ​​a substance per unit mass. The specific surface area of ​​the heat-conducting structure 105 is set to be larger than the specific surface area of ​​the second heat-conducting member 104, that is, the ratio of the surface area to the volume of the heat-conducting structure 105 is larger than the corresponding ratio of the second heat-conducting member 104, so that the heat conduction efficiency of the heat-conducting structure 105 is higher than that of the second heat-conducting member 104. On the one hand, the heat-conducting structure 105 dissipates the heat transferred from the first heat-conducting member 102 and the second heat-conducting member 104, and on the other hand, further transfers the undissipated heat.

[0041] The technical solution provided in this embodiment improves the heat dissipation efficiency of the carrier 101 by setting a plurality of holes 1011 penetrating the carrier 101, setting the first heat conductor 102 in the holes 1011, and connecting it to the pad 103. A plurality of spaced second heat conductors 104 are set on the side of the carrier 101 away from the pad 103, and the space is filled with a heat-conducting structure 105, which increases the heat dissipation space and helps to reduce thermal resistance; and the second heat conductor 104 is connected to the first heat conductor 102 located in the plurality of holes 1011 of the carrier 101, forming a heat conduction path between the pad 103, the first heat conductor 102 and the second heat conductor 104, further improving the heat dissipation efficiency. In summary, the packaging structure provided in this application can improve the heat dissipation efficiency, thereby improving the reliability of semiconductor devices.

[0042] In one embodiment, in the thickness direction F1 of the carrier 101 , the length d of the second heat conducting member 104 is greater than or equal to 20 um.

[0043] Specifically, see Figure 1 In the thickness direction F1 of the carrier 101, the length d of the second heat conductor 104 is greater than or equal to 20um, which further increases the heat dissipation area and is conducive to quickly conducting heat from the electronic components to the outside. The thickness of the carrier 101 refers to the distance from the surface of the carrier 101 close to the pad 103 to the surface of the carrier 101 close to the second heat conductor 104.

[0044] Figure 4 FIG. 1 is a schematic diagram of a heat conduction structure provided in an embodiment of the present application. Figure 4 As shown, the material of the thermal conductive structure 105 includes a porous material.

[0045] Specifically, porous materials refer to materials containing a large number of pores, which can be connected or closed, and they form a complex network structure inside the material. Porous materials usually have a higher specific surface area. Using porous materials in the thermal conductive structure 105 can provide more heat conduction paths, so that heat can be more effectively transferred inside the thermal conductive structure 105, thereby improving the thermal conductivity efficiency of the thermal conductive structure 105. In addition, the thermal expansion coefficient of porous materials is usually low, which is conducive to reducing the thermal stress caused by temperature changes, thereby improving the stability of the packaging structure.

[0046] In one embodiment, the material of the thermal conductive structure 105 includes one or more of copper metal foam, silver metal foam, carbon foam, and silicon carbide foam.

[0047] Specifically, copper metal foam is a porous material made of copper metal, which has high thermal conductivity. Silver metal foam is a porous material made of silver metal, and silver has higher thermal conductivity. Carbon foam is a porous material composed of carbon elements, which has good thermal stability and low thermal expansion coefficient. Silicon carbide foam is a porous material made of silicon carbide, which has high thermal conductivity. These materials can be used alone or in combination to form the thermal conductive structure 105.

[0048] The copper metal foam, silver metal foam, carbon foam and silicon carbide foam exemplified in this embodiment are all high thermal conductivity materials that can quickly conduct heat and can be used as materials for preparing the thermal conductive structure 105, but the materials of the thermal conductive structure 105 in this application are not limited thereto.

[0049] Figure 5 FIG. 1 is a schematic diagram of a packaging structure provided by another embodiment of the present application. Figure 5 As shown, the package structure further includes: a chip 106 located on a side of the pad 103 away from the carrier 101 , and the chip 106 is electrically connected to the pad 103 .

[0050] Specifically, the chip 106 is usually made of semiconductor materials and contains a large number of electronic components and circuits. The chip 106 is arranged on the side of the pad 103 away from the carrier 101, that is, the front or main functional surface of the chip 106 faces the pad 103. The chip 106 forms an electrical connection with the pad 103 through its pins or bumps, so that the chip 106 can communicate and transmit data with the external circuit. In this way, the heat of the chip 106 can be effectively conducted through the pad 103, thereby improving the heat dissipation efficiency, which is further beneficial to the thermal management of the chip 106. In addition, the space occupied between the chip 106 and the pad 103 is reduced, which is conducive to achieving high-density packaging.

[0051] Figure 6 FIG. 1 is a schematic diagram of a packaging structure provided by another embodiment of the present application. Figure 6As shown, based on the above embodiments, optionally, the packaging structure further includes: a first heat conducting layer 107 located between the second heat conducting member 104 and the carrier 101 , and the first heat conducting layer 107 and the second heat conducting member 104 are made of the same material.

[0052] Specifically, a first heat-conducting layer 107 is disposed between the second heat-conducting member 104 and the carrier 101, and the first heat-conducting layer 107 is connected to the first heat-conducting member 102 filled in the carrier 101, further increasing the heat dissipation area of ​​the packaging structure. The first heat-conducting layer 107 and the second heat-conducting member 104 are made of the same material, so that the thermal resistance between the first heat-conducting layer 107 and the second heat-conducting member 104 is low, which is conducive to further improving the heat dissipation efficiency.

[0053] Exemplarily, the material of the first heat-conducting layer 107 includes metal. Preferably, the material of the first heat-conducting layer 107 includes gold, silver or copper.

[0054] Figure 7 FIG. 1 is a schematic diagram of a packaging structure provided by another embodiment of the present application. Figure 7 As shown, based on the above embodiments, optionally, the packaging structure further includes: a second heat conducting layer 108 located on the side of the second heat conducting member 104 away from the carrier 101 , and the material of the second heat conducting layer 108 includes thermal conductive silicone grease.

[0055] Specifically, a second heat-conducting layer 108 is provided on the side of the second heat-conducting member 104 facing away from the carrier 101, further increasing the heat dissipation area of ​​the packaging structure. Thermal grease is a thermal interface material commonly used in electronic packaging, which has good thermal conductivity and compressibility, can fill small gaps and improve heat conduction efficiency. The material used to provide the second heat-conducting layer 108 includes thermal grease, which can fill the small gap between the second heat-conducting member 104 and the heat-conducting structure 105 facing away from the surface of the carrier 101, reduce the heat dissipation barrier caused by the air gap, and thus improve the heat conduction efficiency. Since the thermal resistance of the thermal grease is low, it is beneficial to reduce the resistance in the heat flow path and further improve the heat dissipation efficiency.

[0056] Figure 8 FIG. 1 is a schematic diagram of a packaging structure provided by another embodiment of the present application. Figure 8 As shown, based on the above embodiments, optionally, the packaging structure further includes: a third heat conducting layer 109 located on a side of the second heat conducting layer 108 away from the carrier 101 , and the material of the third heat conducting layer 109 includes copper.

[0057] Specifically, a third heat-conducting layer 109 is provided on the side of the second heat-conducting layer 108 facing away from the carrier 101, further increasing the heat dissipation area of ​​the package structure. Copper is a metal material with very high thermal conductivity and is often used in situations where efficient heat dissipation is required. The material of the third heat-conducting layer 109 includes copper, which further improves the heat conduction efficiency.

[0058] Exemplarily, the third heat-conducting layer 109 is copper foil, and the third heat-conducting layer 109 is combined with the second heat-conducting layer 108 (thermal grease) to form an optimized heat conduction path, thereby further improving the heat dissipation efficiency.

[0059] In addition, the third heat-conducting layer 109 is made of copper, which can have higher mechanical strength and improve the overall mechanical stability of the package structure. Copper has good electrical conductivity, so that the third heat-conducting layer 109 can help the chip 106 to be electrically connected to the external circuit.

[0060] In some embodiments, the heat generated by the chip 106 during operation is dissipated through a first heat dissipation path formed by the pad 103, the first heat conductor 102, the first heat conductive layer 107, the second heat conductor 104, and the heat conductive structure 105, and / or, through a second heat dissipation path formed by the pad 103, the first heat conductor 102, the second heat conductor 104, the heat conductive structure 105, and the second heat conductive layer 108, and / or, through a third heat dissipation path formed by the pad 103, the first heat conductor 102, the second heat conductor 104, the heat conductive structure 105, and the third heat conductive layer 109. In this way, the heat generated by the chip 106 during operation can be conducted from the pad 103 and transferred to the second heat conductor 104 through the first heat conductor 102 in the hole 1011 for heat dissipation, thereby establishing at least three heat dissipation paths and improving heat dissipation efficiency.

[0061] Fig. 9 The figure is a schematic flow chart of a packaging method provided by an embodiment of the present application. The packaging method is applicable to packaging semiconductor chips. Figure 10a-10l The figure shows a schematic diagram of the structure of an intermediate product of a packaging structure provided by an embodiment of the present application. Fig. 9 As shown, the packaging method includes:

[0062] S110, provides carrier board.

[0063] Specifically, see Fig.10a The shape of the carrier 101 includes a square. Exemplarily, the material of the carrier 101 includes glass. Exemplarily, the glass of the incoming material is washed and used as the carrier 101.

[0064] S120, forming a plurality of holes on the carrier board, wherein the holes penetrate the carrier board.

[0065] Specifically, see Fig.10b , a plurality of holes 1011 can be accurately formed on the carrier 101 according to a predetermined design pattern by laser induced etching (LIE) technology.

[0066] S130, preparing a first heat conducting member in the hole.

[0067] Specifically, the first heat conducting member 102 may be prepared in the hole 1011 by electroplating or evaporating metal.

[0068] Taking electroplating process as an example, see Fig.10c , a seed layer is deposited on the carrier 101 using a physical vapor deposition (PVD) technique. Exemplarily, the materials of the seed layer are titanium and copper, the deposition thickness of the titanium seed layer is 200 nm, and the deposition thickness of the copper seed layer is 200 nm. Fig.10d , electroplating metal on the seed layer to form a first heat conducting member 102. The first heat conducting member 102 corresponds to the plurality of holes 1011 on the carrier 101 one by one, and the first heat conducting member 102 is a columnar heat conductor. The material of the first heat conducting member 102 is copper, gold or other heat conducting metal materials.

[0069] S140, preparing a solder pad on one side of the carrier board, and connecting the solder pad to the first heat conducting member.

[0070] Specifically, the pad 103 can be prepared on one side of the carrier 101 by electroplating or evaporating metal. Figure 10d-10f , electroplating metal on the carrier 101, forming metal layers on both sides of the carrier 101. It is understandable that the metal layers on both sides of the carrier 101 can be formed synchronously with the first heat-conducting member 102, that is, electroplating metal on the seed layer, forming the first heat-conducting member 102 in the hole 1011, and forming metal layers on both sides of the carrier 101. In other embodiments, the metal layers on both sides of the carrier 101 can also be formed in different processes from the first heat-conducting member 102, which is also within the protection scope of the present application. Thereafter, the metal layer is ground and polished to reduce the thickness of the metal layer. The metal layer located on one side of the carrier 101 is patterned and etched to form a pad 103. The pad 103 is connected to a plurality of first heat-conducting members 102, and the heat of the pad 103 is conducted to the first heat-conducting member 102 to improve the heat dissipation efficiency.

[0071] S150, preparing a plurality of second heat-conducting members on a side of the carrier away from the solder pad, the second heat-conducting members being connected to the first heat-conducting members, and the plurality of second heat-conducting members being arranged at intervals.

[0072] Specifically, a plurality of second heat conducting members 104 may be prepared on the side of the carrier 101 away from the pad 103 by using a semi-additive method. The semi-additive method combines photolithography, etching and electroplating technology and has very high precision. Figure 10g , a photoresist 110 is coated on a preset position on the side of the carrier 101 away from the pad 103, and the photoresist 110 is exposed and developed. Fig.10h , electroplating metal on the side of the carrier 101 away from the pad 103 to form a plurality of second heat conducting members 104. Fig.10i, the photoresist 110 is removed to form a plurality of intervals between the second heat conducting members 104. Exemplarily, the material of the second heat conducting members 104 includes gold, silver or copper.

[0073] S160, preparing a heat-conducting structure on a side of the carrier away from the solder pad, wherein the heat-conducting structure at least partially fills a gap between adjacent second heat-conducting members.

[0074] Specifically, see Figure 10k , a solution is scraped on the side of the carrier 101 away from the pad 103, the solvent in the solution is removed, and the solution is solidified to form a thermal conductive structure 105. Exemplarily, the solution is a solution including a porous material. Exemplarily, the solution includes one or more of a copper foam solution, a silver foam solution, a carbon foam solution, and a silicon carbide foam solution. The use of porous materials in the thermal conductive structure 105 can provide more heat conduction paths, so that heat can be more effectively transferred inside the thermal conductive structure 105, thereby improving the thermal conduction efficiency of the thermal conductive structure 105. In addition, the thermal expansion coefficient of porous materials is generally low, which is conducive to reducing thermal stress caused by temperature changes, thereby improving the stability of the packaging structure.

[0075] The technical solution provided by the present application improves the heat dissipation efficiency of the carrier by forming a plurality of holes penetrating the carrier on the carrier, preparing a first heat conductor in the hole, and connecting it to a solder pad prepared on one side of the carrier. In addition, a plurality of spaced second heat conductors are prepared on the side of the carrier away from the solder pad, and a heat-conducting structure is prepared on the side of the carrier away from the solder pad, thereby increasing the heat dissipation space and reducing thermal resistance; the second heat conductor is connected to the first heat conductor located in the plurality of holes of the carrier, forming a heat conduction path between the solder pad, the first heat conductor and the second heat conductor, further improving the heat dissipation efficiency. In summary, the packaging method provided by the present application can obtain a packaging structure, which can improve the heat dissipation efficiency, thereby improving the reliability of semiconductor devices.

[0076] Fig.11 FIG. 1 is a flow chart of a packaging method provided by another embodiment of the present application. The packaging method is applicable to packaging semiconductor chips. Fig.11 As shown, based on the above embodiment, optionally, after the step of preparing a plurality of second heat-conducting members on the side of the carrier away from the pad and before the step of preparing a heat-conducting structure on the side of the carrier away from the pad, the packaging method further includes:

[0077] S210, mounting the chip on the side of the pad facing away from the carrier board.

[0078] Specifically, see Fig.10j, the chip 106 is mounted on the side of the pad 103 away from the carrier 101, and the front or main functional surface of the chip 106 faces the pad 103. The chip 106 forms an electrical connection with the pad 103 through its pins or bumps, so that the chip 106 can communicate and transmit data with the external circuit. In this way, the heat of the chip 106 can be effectively conducted through the pad 103, thereby improving the heat dissipation efficiency, which is further beneficial to the thermal management of the chip 106. In addition, the space occupied between the chip 106 and the pad 103 is reduced, which is conducive to achieving high-density packaging.

[0079] Fig.12 FIG. 1 is a flow chart of a packaging method provided by another embodiment of the present application. The packaging method is applicable to packaging semiconductor chips. Fig.12 As shown, based on the above embodiment, optionally, after the step of preparing a heat-conducting structure on the side of the carrier away from the pad, the packaging method further includes:

[0080] S310, preparing a second heat-conducting layer on a side of the second heat-conducting member facing away from the carrier board, wherein the material of the second heat-conducting layer includes thermally conductive silicone grease.

[0081] Specifically, see Figure 10l Thermal grease is applied on the surface of the second heat conducting member 104 facing away from the carrier 101 to form a second heat conducting layer 108, which further increases the heat dissipation area of ​​the packaging structure, reduces thermal resistance, and further improves heat dissipation efficiency.

[0082] Fig.13 FIG. 1 is a flow chart of a packaging method provided by another embodiment of the present application. The packaging method is applicable to packaging semiconductor chips. Fig.13 As shown, based on the above embodiment, optionally, after the step of preparing a heat-conducting structure on the side of the carrier away from the pad, the packaging method further includes:

[0083] S410, preparing a third heat-conducting layer on a side of the second heat-conducting layer facing away from the carrier board, wherein the material of the third heat-conducting layer includes copper.

[0084] Specifically, see Figure 10l , a third heat-conducting layer 109 is prepared on the side of the second heat-conducting layer 108 away from the carrier 101, further increasing the heat dissipation area of ​​the package structure. The material of the third heat-conducting layer 109 includes copper, which further improves the heat conduction efficiency. Exemplarily, the third heat-conducting layer 109 is copper foil, and the third heat-conducting layer 109 is attached to the side of the second heat-conducting layer 108 away from the carrier 101. The third heat-conducting layer 109 is combined with the second heat-conducting layer 108 (thermal conductive silicone grease) to form an optimized heat conduction path, further improving the heat dissipation efficiency.

[0085] Fig.14FIG. 1 is a flow chart of a packaging method provided by another embodiment of the present application. The packaging method is applicable to packaging semiconductor chips. Fig.14 As shown, based on the above embodiment, optionally, after the step of preparing the first heat conducting member in the hole and before the step of preparing the solder pad on one side of the carrier, the packaging method further includes:

[0086] S510, preparing a first heat-conducting layer on one side of the carrier board, wherein the first heat-conducting layer and the second heat-conducting member are made of the same material.

[0087] Specifically, see Figure 10c-Figure 10e , a seed layer is deposited on the carrier 101 using a physical vapor deposition (PVD) technique. Metal is electroplated on the seed layer to form metal layers on both sides of the carrier 101. The metal layer on one side of the carrier 101 is ground and polished to reduce the thickness of the metal layer, and then a first heat-conducting layer 107 is formed. Exemplarily, the material of the first heat-conducting layer 107 includes metal, and preferably, the material of the first heat-conducting layer 107 includes gold, silver or copper. The first heat-conducting layer 107 is connected to the first heat-conducting member 102 filled in the carrier 101, and the first heat-conducting layer 107 is located between the carrier 101 and the second heat-conducting member 104, further increasing the heat dissipation area of ​​the packaging structure. The first heat-conducting layer 107 and the second heat-conducting member 104 are made of the same material, so that the thermal resistance between the first heat-conducting layer 107 and the second heat-conducting member 104 is low, which is conducive to further improving the heat dissipation efficiency.

[0088] Fig.15 FIG. 1 is a flow chart of a packaging method provided by another embodiment of the present application. The packaging method is applicable to packaging semiconductor chips. Fig.15 As shown, based on the above embodiment, optionally, after the step of preparing the solder pad on one side of the carrier and before the step of preparing a plurality of second heat conducting members on the side of the carrier away from the solder pad, the packaging method further includes:

[0089] S610, preparing a first heat-conducting layer on a side of the carrier away from the solder pad, wherein the first heat-conducting layer and the second heat-conducting member are made of the same material.

[0090] Specifically, the difference between this embodiment and the above-mentioned embodiment is that after forming the metal layer on both sides of the carrier 101, the pad 103 is first prepared on one side of the carrier 101, and then the metal layer on the side of the carrier 101 away from the pad 103 is ground and polished to reduce the thickness of the metal layer, and then the first heat-conducting layer 107 is formed to further improve the heat dissipation efficiency. It should be noted that the preparation order of the first heat-conducting layer 107 and the pad 103 in the present application can be exchanged, and the present application does not limit this.

[0091] The present application also provides an electronic device, including: the packaging structure mentioned in any of the above embodiments. The electronic device provided by the present application has the beneficial effects of the packaging structure mentioned in the above embodiments, and its technical principles and effects are similar, which will not be repeated here.

[0092] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this application can be executed in parallel, sequentially or in different orders, as long as the expected results of the technical solution of this application can be achieved, and this document is not limited here.

[0093] The above specific implementations do not constitute a limitation on the protection scope of this application. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of this application should be included in the protection scope of this application.

Claims

1. A packaging structure, characterized in that: include: A carrier plate, wherein a plurality of holes are formed on the carrier plate, and the holes penetrate the carrier plate; a first heat conducting member filling the hole; A soldering pad, located at one side of the carrier, and connected to the first heat conducting member; A plurality of second heat-conducting members are located on a side of the carrier away from the solder pad, the second heat-conducting members are connected to the first heat-conducting members, and the plurality of second heat-conducting members are arranged at intervals; A heat-conducting structure at least partially fills the interval between adjacent second heat-conducting members, and the specific surface area of ​​the heat-conducting structure is greater than the specific surface area of ​​the second heat-conducting member.

2. The packaging structure according to claim 1, characterized in that: In the thickness direction of the carrier board, the length of the second heat conducting member is greater than or equal to 20 um.

3. The packaging structure according to claim 1, characterized in that: The material of the heat-conducting structure includes porous material.

4. The packaging structure according to claim 1, characterized in that: The material of the heat-conducting structure includes one or more of copper metal foam, silver metal foam, carbon foam, and silicon carbide foam.

5. The packaging structure according to claim 1, characterized in that: Also includes: A chip is located at a side of the pad away from the carrier, and the chip is electrically connected to the pad; and / or, a first heat-conducting layer is located between the second heat-conducting member and the carrier board, and the first heat-conducting layer and the second heat-conducting member are made of the same material; and / or, a second heat-conducting layer, located on a side of the second heat-conducting member facing away from the carrier board, wherein the material of the second heat-conducting layer includes thermally conductive silicone grease; And / or, a third heat-conducting layer is located on a side of the second heat-conducting layer away from the carrier board, and a material of the third heat-conducting layer includes copper.

6. A packaging method, characterized in that: include: Provide carrier board; forming a plurality of holes on the carrier plate, wherein the holes penetrate the carrier plate; preparing a first heat conducting member in the hole; A solder pad is prepared on one side of the carrier, and the solder pad is connected to the first heat conducting member; A plurality of second heat-conducting members are prepared on a side of the carrier away from the solder pad, the second heat-conducting members are connected to the first heat-conducting member, and the plurality of second heat-conducting members are arranged at intervals; A heat-conducting structure is prepared on the side of the carrier away from the pad, the heat-conducting structure at least partially fills the interval between adjacent second heat-conducting members, and the specific surface area of ​​the heat-conducting structure is greater than the specific surface area of ​​the second heat-conducting member.

7. The packaging method according to claim 6, characterized in that: After the step of preparing a plurality of second heat-conducting members on the side of the carrier away from the pad, and before the step of preparing a heat-conducting structure on the side of the carrier away from the pad, the step further includes: The chip is mounted on the side of the pad facing away from the carrier board.

8. The packaging method according to claim 6, characterized in that: After the step of preparing the heat-conducting structure on the side of the carrier away from the pad, the method further includes: A second heat-conducting layer is prepared on a side of the second heat-conducting member facing away from the carrier board, wherein the material of the second heat-conducting layer includes heat-conducting silicone grease; And / or, a third heat conducting layer is prepared on a side of the second heat conducting layer facing away from the carrier board, and a material of the third heat conducting layer includes copper.

9. The packaging method according to claim 6, characterized in that: After the step of preparing the first heat conducting member in the hole and before the step of preparing the solder pad on one side of the carrier, the method further includes: A first heat-conducting layer is prepared on one side of the carrier board, and the first heat-conducting layer and the second heat-conducting member are made of the same material.

10. The packaging method according to claim 6, characterized in that: After the step of preparing the solder pad on one side of the carrier, and before the step of preparing a plurality of second heat-conducting members on the side of the carrier away from the solder pad, the method further includes: A first heat-conducting layer is prepared on a side of the carrier away from the solder pad, and the first heat-conducting layer and the second heat-conducting member are made of the same material.

11. An electronic device, characterized in that: include: The packaging structure according to any one of claims 1 to 5.

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