A heat dissipation device for laser

Abstract

The invention relates to the technical field of laser heat dissipation, and discloses a heat dissipation device for a laser, comprising a protection box, a mounting plate provided on the protection box, a water pump and a radiator for heat dissipation provided in the protection box, a plurality of pump sources provided on the mounting plate, the heat dissipation device having an integrated constant temperature maintenance system and a pump source heat reduction system, having a water-cooling heat dissipation structure and an air-cooling heat dissipation structure, the integrated constant temperature maintenance system providing a constant temperature environment for a plurality of pump sources, the pump source heat reduction system performing heat dissipation treatment on heat generating components inside the pump sources, the water-cooling heat dissipation structure and the air-cooling heat dissipation structure providing cooling liquid circulation and dust-free air circulation respectively, the device having an integrated constant temperature maintenance system and a pump source heat reduction system, and being equipped with a water-cooling heat dissipation structure and an air-cooling heat dissipation structure, realizing constant temperature environment control of the integrated mounting plate and independent heat dissipation of heat generating components inside the pump source, and greatly improving the heat dissipation efficiency of the integrated pump source in the high-power laser.

Description

Technical Field

[0001] The invention relates to the technical field of laser heat dissipation, and in particular to a heat dissipation device for a laser. Background Art

[0002] A laser is a device that can amplify light through stimulated emission of radiation. Its working principle is based on the process of "stimulated emission of radiation", in which atoms or molecules release photons corresponding to specific wavelengths under the stimulation of an external light source. These photons will promote more atoms or molecules to release photons, thereby achieving light amplification. It is mainly composed of a gain medium, a pump source, a resonant cavity and a heat dissipation system. The pump source, as a key component in the laser, includes laser chips, collimators, polarization fractional beam combiners and other laser generation and beam-focusing components. In the process of "stimulated emission of radiation", the laser generates heat due to energy conversion efficiency issues, and the corresponding optical components heat up due to light loss, which causes the temperature of these components to continue to rise during operation. A high-efficiency cooling system is required to ensure the stability and life of the laser.

[0003] Due to the excellent performance of lasers in metal cutting, the market is particularly looking forward to higher-power laser cutters, hoping to achieve cutting effects on thicker profiles and meet the needs of the metal processing industry. Usually, high-power lasers are implemented by integrating multiple pump sources and combining multiple laser beams into one through a beam combiner. This requires high-power lasers to match a more efficient cooling system. The existing cooling system uses air cooling or water cooling to maintain an appropriate operating temperature, mainly to provide a constant temperature environment for the outside of multiple pump sources and accelerate the heat dissipation of the pump sources. In the internal design of the pump source, multiple groups of laser chips and collimators are added, which makes the internal heat of the pump source higher. In order to ensure the stability of the laser, the pump source adopts a closed design. The accumulated temperature inside cannot be effectively dissipated, which will cause the internal components of the pump source to burn out during long-term operation. While increasing the higher power density of the laser, a more efficient heat dissipation device is required. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the above difficulties and provide a heat dissipation device for a laser.

[0005] In order to solve the above technical problems, the present invention provides a technical solution: a heat dissipation device for a laser, comprising a protection box, a mounting plate is provided on the protection box, a water pump and a radiator for heat dissipation are provided in the protection box, and a plurality of pump sources are provided on the mounting plate.

[0006] The heat dissipation device has an integrated constant temperature maintenance system and a pump source heat reduction system, and has a water-cooling heat dissipation structure and an air-cooling heat dissipation structure;

[0007] The integrated constant temperature maintenance system includes a first insulation cover and a second insulation cover installed on the top and bottom of the mounting plate, a pump source is arranged in the first insulation cover, a water cooling pipe and a water cooling radiator are arranged at the bottom of the mounting plate, the water cooling radiator is connected with the water cooling pipe, and the water cooling radiator is installed in a through hole on the mounting plate and contacts with the pump source;

[0008] The pump source heat reduction system includes a cooling cover for replacing the pump source cover and an isolation radiator. The cooling cover is installed on the base of the pump source, and the isolation radiator is installed at the bottom of the cooling cover to isolate the grouped laser chips and slow axis collimator mirrors in different areas.

[0009] The water-cooling heat dissipation structure includes a water pump, which outputs two branches. One branch is connected to the water-cooling exhaust pipe of the integrated constant temperature maintenance system to keep the upper and lower sides of the mounting plate in a constant temperature state, and cool the base of the pump source through the water-cooling radiator. The other branch is connected to the internal channel of the cooling cover to cool the isolation radiator. The return coolant is cooled by the radiator and then input into the water pump.

[0010] The air-cooled heat dissipation structure includes a heat exchange tube and an embedded fan. The heat exchange tube allows the coolant and hot air to exchange heat through an internal passage. The pump source and the cooling cover form a closed cavity. The embedded fan and the heat exchange tube form a closed loop with the inside of the pump source.

[0011] As an improvement: the mounting plate is provided with a plurality of mounting grooves 1, the base bolts are connected to the mounting grooves 1, the mounting grooves 1 are arranged in two rows and multiple columns, two groups of water-cooling exhaust pipes are provided, the water-cooling exhaust pipes are U-shaped and surround the bottom of the mounting plate and both sides of the pump source, the water-cooling radiator is arranged corresponding to the mounting grooves 1, a spider-foot-shaped tube is provided between adjacent water-cooling radiators in each row, and multiple branches of the spider-foot-shaped tube are connected to the water-cooling exhaust pipe, thereby improving the cooling efficiency of the mounting plate.

[0012] As an improvement: the water-cooled radiator includes a connecting plate and a shell, the connecting plate and the shell are connected, a heat conducting plate is provided on the top of the connecting plate, and fins connected to the heat conducting plate are provided on the bottom, the heat conducting plate is in contact with the bottom of the base, a plurality of heat conducting platforms are evenly provided on the top of the heat conducting plate, the heat conducting platforms are in contact with the wire grooves at the bottom of the base, a liquid tank is provided on the shell, the fins are provided in the liquid tank, and the pipe openings at both ends of the liquid tank are connected to the water cooling exhaust pipe to improve the cooling efficiency of the base.

[0013] As an improvement: a sealing gasket is provided between the cooling cover and the base, a plurality of pipe interfaces are provided on the top of the cooling cover, a water cooling circuit is provided inside the cooling cover, a second installation groove is provided at the bottom of the cooling cover, an isolation radiator is sealably installed in the second installation groove, the isolation radiator is partially located in the water cooling circuit, a main air supply port and an air exhaust port are respectively provided at the front and rear ends of the cooling cover, auxiliary air supply ducts are provided on both sides of the bottom of the cooling cover, so as to independently cool the inside of the pump source without affecting the operation of the laser.

[0014] As an improvement: the isolation radiator includes a mounting plate, a plurality of isolation plates are arranged at the bottom of the mounting plate, the isolation plates are arranged between adjacent laser chips, a plurality of heat transfer plates are arranged between adjacent isolation plates, the heat transfer plates are provided with through holes, an avoidance groove is arranged at the bottom of the heat transfer plate, a heat sink is arranged at the top of the mounting plate, the heat sink passes through the through hole on the second mounting groove, and is arranged in a water cooling circuit, air guide plates are arranged at both ends of the bottom of the mounting plate, so as to divide the multiple laser chips into independent spaces for heat dissipation.

[0015] As an improvement: the base is provided with a heat-conducting block on the rear side of the beam-combining glass slide, the heat-conducting block is inserted into the groove on the side of the base, the optical fiber passes through the through hole on the heat-conducting block, a conical hole is provided at one end of the heat-conducting block close to the beam-combining glass slide, a heat-conducting strip is provided on the top of the heat-conducting block, the heat-conducting strip passes through the through hole on the cooling cover and enters the water cooling circuit, and a heat-dissipating cross piece is provided at the end of the heat-conducting strip to independently dissipate heat for the laser beam-combining point.

[0016] As an improvement: one end of the heat exchange tube is provided with an air inlet pipe interface and a liquid inlet pipe interface, and the other end is provided with an exhaust pipe interface and a liquid discharge pipe interface, a plurality of honeycomb cavities are provided inside the heat exchange tube, the outside of the honeycomb inner cavity is a honeycomb outer cavity, the honeycomb inner cavities are connected at intervals, and the honeycomb inner cavity at the end is connected with the air inlet pipe interface and the exhaust pipe interface, and the honeycomb outer cavity is connected with the liquid inlet pipe interface and the liquid discharge pipe interface, thereby improving the heat exchange efficiency between hot air and cooling liquid.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows: the present device is specially designed for heat dissipation of high-power lasers, has an integrated constant temperature maintenance system and a pump source heat reduction system, and is equipped with a water-cooling heat dissipation structure and an air-cooling heat dissipation structure, which realizes the constant temperature environment control of the integrated mounting plate and the independent heat dissipation of the internal heating components of the pump source, greatly improving the heat dissipation efficiency of the integrated pump source in the high-power laser. Specifically:

[0018] 1. A combination of water cooling and air cooling is adopted to achieve constant temperature environment control and independent heat dissipation of multiple pump sources, which greatly improves the heat dissipation efficiency of the internal heating components of the pump source and meets the working temperature requirements of the pump source;

[0019] 2. The water cooling pipes and spider-foot-shaped tubes at the bottom of the mounting plate increase the water cooling exchange area with the mounting plate, achieving constant temperature control in the mounting plate area. The water cooling radiator achieves independent heat dissipation of the pump source base, strengthens the control of the temperature inside the insulation cover, and ensures the normal working requirements of multiple pump sources.

[0020] 3. The pump source cover is independently designed, with a water cooling circuit and multiple air supply channels added. Together with the isolation radiator and heat conduction block, independent heat dissipation of the internal components of the pump source is achieved, which can speed up the heat dissipation inside the pump source;

[0021] 4. The air-cooling structure adopts a closed circulation structure design to prevent external dust from entering the pump source and affecting the stability of the laser, thereby achieving timely discharge of the hot air formed inside the pump source and improving the heat dissipation efficiency;

[0022] 5. The heat exchange between the air-cooled structure and the water-cooled structure is realized through the heat exchange tube. The multiple honeycomb cavities inside increase the heat exchange area and improve the heat exchange efficiency. At the same time, it also meets the closed cycle structure design of the air-cooled structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 The figure is a schematic diagram of the external structure of a heat dissipation device for a laser according to the present invention.

[0024] Figure 2 The figure is a schematic diagram of the internal structure of a heat dissipation device for a laser according to the present invention.

[0025] Figure 3 The present invention is a pump source position arrangement diagram of a heat dissipation device for a laser.

[0026] Figure 4 It is an exploded view of a heat dissipation device integrated with a constant temperature maintaining system for a laser according to the present invention.

[0027] Figure 5 The present invention is a schematic structural diagram of a heat sink mounting plate for a laser.

[0028] Figure 6 The present invention is a schematic structural diagram of a water-cooling exhaust pipe of a heat dissipation device for a laser.

[0029] Figure 7 It is an exploded view of a water-cooled radiator of a heat dissipation device for a laser according to the present invention.

[0030] Figure 8 The present invention is a schematic structural diagram of a heat reduction system of a pump source of a heat dissipation device for a laser.

[0031] Fig. 9 It is an exploded diagram of a heat reduction system of a pump source of a heat dissipation device for a laser according to the present invention.

[0032] Fig.10 This is a cross-sectional view of a heat dissipation device for a laser pump source heat reduction system of the present invention. Figure 1 .

[0033] Fig.11 It is a partial cross-sectional view of a heat conducting block of a heat dissipation device for a laser according to the present invention.

[0034] Fig.12 The present invention is a schematic diagram of the internal structure of a heat reduction system of a pump source of a heat dissipation device for a laser.

[0035] Fig.13 The present invention is a schematic structural diagram of an isolation radiator of a heat dissipation device for a laser.

[0036] Fig.14 The present invention is a cross-sectional view of a cooling cover of a heat dissipation device for a laser.

[0037] Fig.15 The present invention is a schematic diagram of the bottom structure of a cooling cover of a heat dissipation device for a laser.

[0038] Fig.16 It is a cross-sectional view of a heat exchange cylinder of a heat dissipation device for a laser according to the present invention.

[0039] Fig.17 The present invention is a schematic diagram of a heat exchange cylinder of a heat dissipation device for a laser.

[0040] Fig.18 The present invention is a schematic diagram of pipeline connection of a heat dissipation device for a laser.

[0041] Fig.19 It is a schematic diagram of the structure of a pump source in the prior art.

[0042] Fig. 20 It is a schematic diagram of the bottom structure of a pump source base in the prior art.

[0043] As shown in the figure: 1. Protective box; 2. Integrated constant temperature maintenance system; 3. Pump source cooling system; 4. Cooling cover; 5. Isolation radiator; 6. Water pump; 7. Heat exchange tube; 8. Radiator; 9. Embedded fan; 21. Mounting plate; 211. Mounting slot 1; 212. Combiner; 22. Insulation cover 1; 23. Insulation cover 2; 24. Water cooling pipe; 241. Spider-foot tube; 25. Water cooling radiator; 251. Connecting plate; 252. Enclosure; 253. Heat conducting plate; 254. Heat conducting platform; 255. Fins; 256. Liquid tank; 41. Sealing pad; 42. Heat conducting block; 421. Conical hole; 422. Heat conducting strip; 423. Heat dissipation cross Plate; 43, main air supply port; 44, auxiliary air supply duct; 45, water cooling circuit; 46, exhaust port; 47, second installation slot; 48, pipe interface; 51, installation plate; 52, isolation plate; 53, heat transfer plate; 54, avoidance slot; 55, heat sink; 56, air guide plate; 71, air inlet pipe interface; 72, liquid inlet pipe interface; 73, exhaust pipe interface; 74, liquid discharge pipe interface; 75, honeycomb inner cavity; 76, honeycomb outer cavity; 00, pump source; 01, base; 02, laser chip; 03, slow axis collimator; 04, fast axis collimator; 05, polarization fractional beam combiner; 06, beam combining glass; 07, optical fiber; 08, reflection glass; 09, wire trough. DETAILED DESCRIPTION

[0044] The present invention is further described in detail below in conjunction with the accompanying drawings.

[0045] Combined with Figure 1 , Attachment Figure 2 and attached Figure 3 As shown, a heat dissipation device for a laser comprises a protective box 1, a mounting plate 21 is provided on the protective box 1, a water pump 6 and a radiator 8 for heat dissipation are provided inside the protective box 1, a plurality of pump sources 00 are provided on the mounting plate 21, the heat dissipation device comprises an integrated constant temperature maintaining system 2 and a pump source heat reduction system 3, and has a water-cooled heat dissipation structure and an air-cooled heat dissipation structure. The integrated constant temperature maintaining system 2 provides a constant temperature environment for the plurality of pump sources 00, the pump source heat reduction system 3 performs heat dissipation treatment on the internal heating components of the pump source 00, and the water-cooled heat dissipation structure and the air-cooled heat dissipation structure provide cooling liquid circulation and dust-free air circulation respectively.

[0046] Combined with Figure 3 , Attachment Figure 4 , Attachment Fig. 9 and attached Fig.19 As shown, the integrated constant temperature maintenance system 2 includes a heat preservation cover 1 22 and a heat preservation cover 23 installed on the top and bottom of the mounting plate 21, the pump source 00 is arranged in the heat preservation cover 1 22, the top of the mounting plate 21 is provided with a beam combiner 212, the bottom of the mounting plate 21 is provided with a water cooling pipe 24 and a water cooling radiator 25, the water cooling radiator 25 is connected with the water cooling pipe 24, the water cooling radiator 25 is installed in the through hole on the mounting plate 21, and contacts with the pump source 00, the pump source cooling system 3 includes a cooling cover 4 and an isolation radiator 5 for replacing the cover of the pump source 00, the cooling cover 4 is installed on the base 01 of the pump source 00, and the isolation radiator 5 is installed at the bottom of the cooling cover 4, and the grouped laser chips 02 and the slow axis collimator 03 are isolated by partition.

[0047] Working principle of the integrated constant temperature maintenance system 2 and the pump source cooling system 3: the insulation cover 1 22 and the insulation cover 2 23 form an insulation chamber, which is divided into an upper layer and a lower layer by the mounting plate 21. The water-cooling exhaust pipe 24 of the lower layer transports coolant to the water-cooling radiator 25. The surrounding water-cooling exhaust pipe 24 keeps the mounting plate 21 at a constant temperature, so that the outside of the upper pump source 00 is in a constant temperature environment. The water-cooling radiator 25 of the lower layer cools the base 01 of the pump source 00, thereby providing a constant temperature environment for the pump source 00 integrated on the mounting plate 21. The pump source cooling system 3 dissipates heat inside the pump source 00 separately. The isolation radiator 5 is distributed on the main heating components. The cooling cover 4 has water cooling and air cooling channels. The water cooling channel mainly cools the isolation radiator 5 and the heat conductive block 42, and the air cooling channel cools the inside of the pump source 00 to ensure the discharge of heat from the heating components.

[0048] Combined with Figure 2 , Attachment Figure 6 , Attachment Fig. 9 , Attachment Fig.17 and attached Fig.18 As shown, the water-cooled heat dissipation structure includes a water pump 6, and the water pump 6 outputs two branches. One branch is connected to the water-cooling exhaust pipe 24 of the integrated constant temperature maintenance system 2, so that the upper and lower sides of the mounting plate 21 are in a constant temperature state, and the base 01 of the pump source 00 is cooled by the water-cooled radiator 25; the other branch is connected to the internal channel of the cooling cover 4 to cool the isolation radiator 5. The reflux coolant is cooled by the radiator 8 and then input into the water pump 6. The air-cooled heat dissipation structure includes a heat exchange tube 7 and an embedded fan 9. The heat exchange tube 7 exchanges heat between the coolant and the hot air through the internal passage. The pump source 00 and the cooling cover 4 form a closed cavity, and the embedded fan 9 and the heat exchange tube 7 form a closed loop with the inside of the pump source 00.

[0049] Working principles of water-cooled heat dissipation structure and air-cooled heat dissipation structure: In the water-cooled heat dissipation structure, the water pump 6 is the power source, and the coolant is divided into two paths, which are respectively transported to the water-cooled exhaust pipe 24 and the cooling cover 4. The water-cooled exhaust pipe 24 controls the overall temperature of the mounting plate 21 through the spider-foot tube 241. When passing through the cooling cover 4, the isolation radiator 5 and the heat conductive block 42 are cooled to achieve the control of the temperature of the main heating component area. In the air-cooled heat dissipation structure, the hot air inside the pump source 00 is transferred to the heat exchange tube 7 through a closed circulation air duct to prevent external dust from entering the pump source 00. The heat of the hot air is transferred to the coolant circulation of this path through the heat exchange tube 7, and finally the heat is discharged by the radiator 8. The radiator 8 is an existing mechanism, including equipment that adopts fan heat dissipation, evaporation heat dissipation, expansion heat dissipation and other methods.

[0050] Combined with Figure 3 , Attachment Figure 4 , Attachment Figure 5 and attached Figure 6 As shown, the mounting plate 21 is provided with a plurality of mounting grooves 211, the base 01 is bolted to the mounting grooves 211, the mounting grooves 211 are arranged in two rows and multiple columns, two groups of water-cooling exhaust pipes 24 are provided, the water-cooling exhaust pipes 24 are U-shaped and surround the bottom of the mounting plate 21 and both sides of the pump source 00, the water-cooling radiator 25 is arranged corresponding to the mounting grooves 211, and a spider-foot-shaped tube 241 is provided between adjacent water-cooling radiators 25 in each row, and multiple branches of the spider-foot-shaped tube 241 are connected to the water-cooling exhaust pipe 24.

[0051] Working principle of the mounting plate 21 and the water-cooling exhaust pipe 24: the water-cooling exhaust pipe 24 surrounds the single-row pump source 00 to reduce the temperature of the mounting plates 21 on both sides of the pump source 00. The spider-foot-shaped tube 241 has multiple branches to maximize the contact area with the mounting plate 21 to achieve a comprehensive temperature control effect on the mounting plate 21. The water-cooling exhaust pipe 24 and the spider-foot-shaped tube 241 are both made of copper. The coolant does not contact the mounting plate 21 to avoid corrosion of the aluminum mounting plate 21. Since the internal heating components of the pump source 00 are installed on the base 01, the local temperature of the base 01 is higher than that of the mounting plate 21. The water-cooling radiator 25 dissipates heat from the base 01 of the pump source 00 alone to accelerate the cooling process of the base 01.

[0052] Combined with Figure 6 , Attachment Figure 7 and attached Fig. 20 As shown, the water-cooled radiator 25 includes a connecting plate 251 and a shell 252, the connecting plate 251 and the shell 252 are connected, a heat conducting plate 253 is provided on the top of the connecting plate 251, and fins 255 connected to the heat conducting plate 253 are provided on the bottom, the heat conducting plate 253 is in contact with the bottom of the base 01, a plurality of heat conducting platforms 254 are evenly provided on the top of the heat conducting plate 253, the heat conducting platforms 254 are in contact with the wire groove 09 at the bottom of the base 01, a liquid tank 256 is provided on the shell 252, the fins 255 are arranged in the liquid tank 256, and the pipe openings at both ends of the liquid tank 256 are connected to the water-cooled exhaust pipe 24.

[0053] Working principle of water-cooled radiator 25: When the pump source 00 is working, the internal components will heat up the base 01, and the temperature of the base 01 will be transferred to the heat conducting plate 253, and the heat will be transferred to the coolant in the liquid tank 256 through multiple fins 255. The heat conducting platform 254 cooperates with the wire groove 09 at the bottom of the base 01 to increase the contact area. During installation, thermal grease needs to be applied between the heat conducting plate 253 and the base 01.

[0054] Combined with Figure 8 , Attachment Fig. 9 , Attachment Fig.14 and attached Fig.15 As shown, a sealing gasket 41 is provided between the cooling cover 4 and the base 01, a plurality of pipe interfaces 48 are provided on the top of the cooling cover 4, a water cooling circuit 45 is provided inside the cooling cover 4, a mounting groove 2 47 is provided at the bottom of the cooling cover 4, an isolation radiator 5 is sealed and installed in the mounting groove 2 47, a part of the isolation radiator 5 is located in the water cooling circuit 45, a main air supply port 43 and an air exhaust port 46 are provided at the front and rear ends of the cooling cover 4, and auxiliary air supply ducts 44 are provided at both sides of the bottom of the cooling cover 4.

[0055] Working principle of cooling cover 4: cold air enters into base 01 through main air supply port 43 and auxiliary air supply duct 44. Main air supply port 43 will take away the hot air from fast axis collimator 04, polarization fractional beam combiner 05 and reflective glass 08. Auxiliary air supply duct 44 will pass between isolation plates 52, take away the heat generated by laser chip 02 and slow axis collimator 03, and discharge it from exhaust port 46. Since laser chip 02 generates the highest amount of heat, in order to improve heat dissipation efficiency, heat around laser chip 02 is absorbed by isolating radiator 5. After coolant enters water cooling circuit 45 through one of pipe interfaces 48, it will take away the heat from isolating radiator 5, and coolant will not enter into base 01.

[0056] Combined with Fig.12 , Attachment Fig.13 , Attachment Fig.14 and attached Fig.15 As shown, the isolation heat sink 5 includes a mounting plate 51, a plurality of isolation plates 52 are provided at the bottom of the mounting plate 51, the isolation plates 52 are provided between adjacent laser chips 02, a plurality of heat transfer plates 53 are provided between adjacent isolation plates 52, the heat transfer plates 53 are provided with through holes, and a avoidance groove 54 is provided at the bottom of the heat transfer plates 53. A heat sink 55 is provided on the top of the mounting plate 51, the heat sink 55 passes through the through holes on the mounting groove 47, and is provided in the water cooling circuit 45, and air guide plates 56 are provided at both ends of the bottom of the mounting plate 51.

[0057] Working principle of the isolation radiator 5: The isolation radiator 5 is mounted on the rows of laser chips 02 on both sides, and the adjacent laser chips 02 are divided into single areas by the isolation sheets 52 to avoid heat exchange, and the heat is absorbed by the heat transfer sheets 53. After the heat transfer sheets 53 transfer the heat to the heat sink 55, the coolant in the water cooling circuit 45 will take away the heat of the heat sink 55, and the air guide sheets 56 and the isolation sheets 52 will guide the airflow.

[0058] Combined with Fig.10 and attached Fig.11 As shown, the base 01 is provided with a heat conducting block 42 at the rear side of the beam combining glass sheet 06, the heat conducting block 42 is inserted into the groove on the side of the base 01, the optical fiber 07 passes through the through hole on the heat conducting block 42, the heat conducting block 42 is provided with a tapered hole 421 at one end close to the beam combining glass sheet 06, a heat conducting strip 422 is provided on the top of the heat conducting block 42, the heat conducting strip 422 passes through the through hole on the cooling cover 4 and enters the water cooling circuit 45, and a heat dissipation cross piece 423 is provided at the end of the heat conducting strip 422.

[0059] Working principle of the heat conductive block 42: After passing through the beam combining glass slide 06, the focus of most of the laser is gathered at the end of the optical fiber 07, which is also a place with a higher temperature. The beam combining point is semi-covered through the conical hole 421 of the heat conductive block 42, so that the heat can be absorbed by the heat conductive block 42. The heat of the heat conductive block 42 is transferred to the heat dissipation cross plate 423 through the heat conductive strip 422, and the coolant in the water cooling circuit 45 will take away the heat of the heat dissipation cross plate 423.

[0060] Combined with Figure 2 , Attachment Fig.16 , Attachment Fig.17 and attached Fig.18 As shown, the heat exchange tube 7 is provided with an air inlet pipe interface 71 and a liquid inlet pipe interface 72 at one end, and an exhaust pipe interface 73 and a liquid discharge pipe interface 74 at the other end. A plurality of honeycomb inner cavities 75 are provided inside the heat exchange tube 7, and the outer side of the honeycomb inner cavity 75 is a honeycomb outer cavity 76. The honeycomb inner cavities 75 are connected at intervals, and the honeycomb inner cavity 75 at the end is connected with the air inlet pipe interface 71 and the exhaust pipe interface 73, and the honeycomb outer cavity 76 is connected with the liquid inlet pipe interface 72 and the liquid discharge pipe interface 74.

[0061] Working principle of heat exchange tube 7: hot air enters into honeycomb inner cavity 75 through air inlet pipe interface 71, and transfers between multiple honeycomb inner cavities 75, and finally is discharged from exhaust pipe interface 73. The coolant flowing through water cooling exhaust pipe 24 will enter into honeycomb outer cavity 76 through liquid inlet pipe interface 72 due to its low temperature rise and relatively stable temperature. The heat of hot air will be absorbed by the cavity wall during the transfer between honeycomb inner cavities 75, and then transferred to the flowing coolant, and then discharged from liquid discharge pipe interface 74. The coolant flowing through water cooling exhaust pipe 24 merges with the coolant flowing through heat exchange tube 7 and then flows into radiator 8 to cool the coolant. The coolant is re-injected into integrated constant temperature maintenance system 2 and pump source cooling system 3 through water pump 6. The internal structure of heat exchange tube 7 is relatively complex and is manufactured by 3D printing technology. The connecting direction in honeycomb inner cavity 75 adopts attached Fig.17 Diagram structure.

[0062] In the specific implementation of the present invention, multiple pump sources 00 realize the combination of overall constant temperature maintenance and independent heat dissipation through the integrated constant temperature maintenance system 2 and the pump source heat reduction system 3. In the water cooling cycle, the coolant is re-injected into the integrated constant temperature maintenance system 2 and the pump source heat reduction system 3 through the water pump 6. In the integrated constant temperature maintenance system 2, the water cooling radiator 25 and the water cooling exhaust pipe 24 are used to form a constant temperature environment for the mounting plate 21. In the pump source heat reduction system 3, the regional temperature of the main heat-generating components is controlled by water cooling. In the air cooling cycle, the embedded fan 9 is used as a circulating wind power source, and a closed circulating air duct is used to transfer the internal hot air of the pump source 00 to the heat exchange tube 7 to prevent external dust from entering the pump source 00. The heat of the hot air is transferred to the coolant circulation of this route through the heat exchange tube 7, and finally the heat is discharged by the radiator 8.

[0063] The device is provided with temperature sensors at heating points and cooling points, and also has corresponding valve components and sensing elements on the water pipe and gas pipe connection system. The arrangement points and models of sensors and valves can be adjusted according to actual conditions. On the basis of the device, multiple cooling routes can be additionally provided to cool the control system. The water pump 6, radiator 8 and embedded fan 9 are all existing technologies and can be replaced by equipment and structures with the same functions.

[0064] The present invention and its embodiments are described above, which is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if ordinary technicians in the field are inspired by it and do not deviate from the purpose of the invention, they can creatively design a structure and embodiment similar to the technical solution, which should fall within the protection scope of the present invention.

Claims

1. A heat dissipation device for a laser, comprising a protective box (1), a mounting plate (21) being provided on the protective box (1), a water pump (6) and a radiator (8) for heat dissipation being provided in the protective box (1), a plurality of pump sources (00) being provided on the mounting plate (21), characterized in that: The heat dissipation device has an integrated constant temperature maintenance system (2) and a pump source heat reduction system (3), and has a water cooling heat dissipation structure and an air cooling heat dissipation structure; The integrated constant temperature maintenance system (2) comprises a first insulation cover (22) and a second insulation cover (23) installed on the top and bottom of the mounting plate (21); the pump source (00) is arranged in the first insulation cover (22); a water cooling pipe (24) and a water cooling radiator (25) are arranged at the bottom of the mounting plate (21); the water cooling radiator (25) is connected to the water cooling pipe (24); the water cooling radiator (25) is installed in a through hole on the mounting plate (21) and contacts the pump source (00); The pump source heat reduction system (3) comprises a cooling cover (4) for replacing the pump source (00) cover and an isolation radiator (5), wherein the cooling cover (4) is mounted on a base (01) of the pump source (00), and the isolation radiator (5) is mounted on the bottom of the cooling cover (4) to isolate the grouped laser chips (02) and the slow axis collimator (03) in sections; The water-cooling heat dissipation structure includes a water pump (6), and the water pump (6) outputs two branches, one of which is connected to the water cooling exhaust pipe (24) of the integrated constant temperature maintenance system (2), so that the upper and lower sides of the mounting plate (21) are in a constant temperature state, and the base (01) of the pump source (00) is cooled through the water cooling radiator (25); and the other branch is connected to the internal channel of the cooling cover (4) to cool the isolation radiator (5), and the return coolant is cooled through the radiator (8) and then input into the water pump (6); The air-cooled heat dissipation structure comprises a heat exchange tube (7) and an embedded fan (9); the heat exchange tube (7) enables a coolant to exchange heat with hot air through an internal passage; a pump source (00) and a cooling cover (4) form a closed cavity; and the embedded fan (9) and the heat exchange tube (7) form a closed loop inside the pump source (00).

2. A heat dissipation device for a laser according to claim 1, characterized in that: The mounting plate (21) is provided with a plurality of mounting grooves (211), the base (01) is bolted to the mounting grooves (211), the mounting grooves (211) are arranged in two rows and multiple columns, two groups of water cooling exhaust pipes (24) are provided, the water cooling exhaust pipes (24) are U-shaped and surround the bottom of the mounting plate (21) and both sides of the pump source (00), the water cooling radiator (25) is arranged corresponding to the mounting grooves (211), a spider foot-shaped tube (241) is provided between adjacent water cooling radiators (25) in each row, and a plurality of branch pipes of the spider foot-shaped tube (241) are all connected to the water cooling exhaust pipe (24).

3. The heat dissipation device for a laser according to claim 1, characterized in that: The water-cooled radiator (25) comprises a connecting plate (251) and a sealing shell (252); the connecting plate (251) and the sealing shell (252) are connected; a heat conducting plate (253) is provided on the top of the connecting plate (251); a fin (255) connected to the heat conducting plate (253) is provided on the bottom; the heat conducting plate (253) contacts and cooperates with the bottom of the base (01); a plurality of heat conducting platforms (254) are evenly provided on the top of the heat conducting plate (253); the heat conducting platforms (254) contact and cooperate with the wire groove (09) at the bottom of the base (01); a liquid box (256) is provided on the sealing shell (252); the fin (255) is provided in the liquid box (256); and the pipe openings at both ends of the liquid box (256) are connected to the water-cooled exhaust pipe (24).

4. The heat dissipation device for a laser according to claim 1, characterized in that: A sealing gasket (41) is provided between the cooling cover (4) and the base (01), a plurality of pipe interfaces (48) are provided on the top of the cooling cover (4), a water cooling circuit (45) is provided inside the cooling cover (4), a second mounting groove (47) is provided on the bottom of the cooling cover (4), the isolation radiator (5) is sealed and installed in the second mounting groove (47), a portion of the isolation radiator (5) is located in the water cooling circuit (45), a main air supply port (43) and an air exhaust port (46) are provided at the front and rear ends of the cooling cover (4), and auxiliary air supply ducts (44) are provided on both sides of the bottom of the cooling cover (4).

5. A heat dissipation device for a laser according to claim 4, characterized in that: The isolation heat sink (5) comprises a mounting plate (51), a plurality of isolation plates (52) are provided at the bottom of the mounting plate (51), the isolation plates (52) are arranged between adjacent laser chips (02), a plurality of heat transfer plates (53) are provided between adjacent isolation plates (52), through holes are provided on the heat transfer plates (53), avoidance grooves (54) are provided at the bottom of the heat transfer plates (53), a heat sink (55) is provided at the top of the mounting plate (51), the heat sink (55) passes through the through holes on the second mounting groove (47), and is arranged in the water cooling circuit (45), and air guide plates (56) are provided at both ends of the bottom of the mounting plate (51).

6. A heat dissipation device for a laser according to claim 4, characterized in that: The base (01) is provided with a heat conducting block (42) at the rear side of the beam combining glass sheet (06), the heat conducting block (42) is inserted into a groove on the side of the base (01), the optical fiber (07) passes through a through hole on the heat conducting block (42), a conical hole (421) is provided at one end of the heat conducting block (42) close to the beam combining glass sheet (06), a heat conducting strip (422) is provided at the top of the heat conducting block (42), the heat conducting strip (422) passes through a through hole on the cooling cover (4) and enters the water cooling circuit (45), and a heat dissipation cross piece (423) is provided at the end of the heat conducting strip (422).

7. The heat dissipation device for a laser according to claim 1, characterized in that: The heat exchange tube (7) is provided with an air inlet pipe interface (71) and a liquid inlet pipe interface (72) at one end, and an exhaust pipe interface (73) and a liquid exhaust pipe interface (74) at the other end. A plurality of honeycomb inner cavities (75) are provided inside the heat exchange tube (7), and the outer sides of the honeycomb inner cavities (75) are honeycomb outer cavities (76). The honeycomb inner cavities (75) are connected at intervals, and the honeycomb inner cavities (75) at the ends are connected with the air inlet pipe interface (71) and the exhaust pipe interface (73), and the honeycomb outer cavities (76) are connected with the liquid inlet pipe interface (72) and the liquid exhaust pipe interface (74).

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