High-power laser assembly

Abstract

The utility model provides a high-power laser assembly. The high-power laser assembly comprises a substrate, an aspheric lens, an optical chip and an optical fiber assembly. The aspheric lens, the optical chip and the optical fiber assembly are sequentially arranged on the same side surface of the substrate; the optical chip is provided with at least N planar optical wavelength export channels, and N is greater than or equal to 4; the optical fiber assembly is provided with a capillary hole through which at least one optical fiber can penetrate, the at least one optical fiber penetrates through the capillary hole and corresponds to the laser incident end of the optical chip, and the laser emergent end of the optical chip corresponds to the incident end of the aspheric lens; compared with a multi-channel coupler adopted at present, the optical chip is adopted to replace the multi-channel coupler, and different calibration positions are modulated, so that the cost of the high-power laser assembly is greatly reduced, mass production is facilitated, the manufacturing cost is reduced, and the laser transmission efficiency and stability of the high-power laser assembly are improved.

Description

Technical Field

[0001] This utility model relates to the field of laser communication technology, and in particular to a high-power laser component. Background Technology

[0002] In the field of laser communication technology, fiber optic arrays play an important role, especially multi-channel fiber optic arrays, which are one of the key components for achieving high-precision signal transmission in laser communication.

[0003] In existing technologies, the design of multi-channel fiber optic arrays often involves using multiple optical fibers, each of which is fixed on a grooved substrate according to specific design requirements to fabricate the multi-channel fiber optic array. During optical signal transmission, multi-channel couplers are used to achieve signal transmission and coupling alignment across the multi-channel fiber optic network. However, this process presents several challenges. First, fabricating a multi-channel fiber optic array and achieving collimation coupling is technically challenging, and manual operation introduces errors, making high-precision coupling calibration difficult. Second, multi-channel fiber optic arrays require the use of multi-channel couplers to transmit multi-channel optical signals. Those skilled in the art know that multi-channel couplers are generally expensive, leading to a high price for the entire laser communication module and resulting in significant costs for mass production.

[0004] Therefore, based on the above two factors, the existing multi-channel fiber optic modules can no longer meet daily needs, and new laser communication components need to be developed. Utility Model Content

[0005] This utility model provides a high-power laser component that solves the problems existing in the prior art, reduces the manufacturing process difficulty of laser modules, reduces the cost of laser components, improves the stability of laser signal transmission, and has the advantages of simple structure, convenient assembly and adjustment, and high reliability.

[0006] A high-power laser component, characterized in that it comprises: a substrate, an aspherical lens, an optical chip, and an optical fiber assembly; the aspherical lens, the optical chip, and the optical fiber assembly are sequentially disposed on the same side surface of the substrate; the optical chip is provided with a planar waveguide emission channel group, the number of channels in the planar waveguide emission channel group being N, where N≥4; the optical fiber assembly has a capillary aperture through which at least one optical fiber passes, the at least one optical fiber passing through the capillary aperture and corresponding to the laser incident end of the optical chip, and the laser emitting end of the optical chip being disposed corresponding to the incident end of the aspherical lens.

[0007] Optionally, the optical chip includes M planar waveguide emission channel groups to form a planar waveguide array, where M ≥ 1 and is a natural number.

[0008] Furthermore, the optical chip and the optical fiber assembly are connected to form an assembly, and the axis of the assembly forms a certain angle with the horizontal axis of the substrate shown.

[0009] Furthermore, the optical chip has a trapezoidal structure, and the trapezoidal slope of the optical chip forms a certain angle with the direction perpendicular to the bottom of the optical chip, the angle ranging from 5° to 10°.

[0010] Alternatively, the laser assembly may further include a handheld portion that at least partially covers and is formed on the aspherical lens and the optical chip.

[0011] In some embodiments, the surface connecting the optical fiber assembly and the optical chip is an inclined plane, and there is a gap between them, the size of which satisfies [0,10]μm.

[0012] In some embodiments, a capillary hole is provided in the optical fiber assembly. The capillary hole is disposed through the optical fiber assembly in a direction parallel to the substrate and is kept coaxial with the incident end of the planar light waveguide emission channel of the optical chip.

[0013] Furthermore, the end of the capillary furthest from the optical chip is an enlarged aperture structure, and the aperture diameter at the end of the enlarged aperture structure furthest from the capillary is larger than the aperture diameter at the end closest to the capillary.

[0014] In some embodiments, the spacing between each of the N planar waveguide emission channels is not less than 125 μm.

[0015] In some embodiments, at least one layer of optical antireflection film is provided on both ends of the optical chip and on the side of the optical fiber assembly facing the optical chip along the laser emission direction.

[0016] In some embodiments, a vacuum gap or air gap is formed at the center of the mating surfaces of the optical fiber assembly and the optical chip.

[0017] This invention provides a high-power laser component, comprising a substrate, an aspherical lens, an optical chip, and an optical fiber assembly. The aspherical lens, the optical chip, and the optical fiber assembly are sequentially disposed on the same side surface of the substrate. The optical chip has at least N planar waveguide emission channels, where N≥4. The optical fiber assembly has a capillary aperture through which at least one optical fiber passes, and the at least one optical fiber passes through the capillary aperture and corresponds to the laser incident end of the optical chip. The laser emitting end of the optical chip is disposed corresponding to the incident end of the aspherical lens. Compared to the currently used multi-channel couplers, this application uses an optical chip instead of a multi-channel coupler and modulates different calibration positions, which significantly reduces the cost of the high-power laser component, facilitates mass production and reduces manufacturing costs, and improves the efficiency and stability of laser transmission in the high-power laser component. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A front view of a high-power laser component structure provided by this utility model;

[0020] Figure 2 A top view of a high-power laser component structure provided by this utility model;

[0021] Figure 3 A schematic diagram of the structure of an optical chip provided by this utility model;

[0022] Figure 4 A schematic diagram of the structure of an optical fiber assembly provided by this utility model;

[0023] Figure 5 A front view of another high-power laser component structure provided by this utility model;

[0024] Figure 6 for Figure 5 The embodiment provides a top view of the high-power laser component structure;

[0025] Attached image labels:

[0026] 10: Aspherical lens; 20: Optical chip; 30: Fiber optic assembly; 40: Substrate;

[0027] 50: Optical fiber; 60: Handheld part; 31: Capillary pore; 32: Enlarged pore structure. Detailed Implementation

[0028] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0029] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0030] A high-power laser component is provided, such as Figures 1-2 As shown, the device includes a substrate 40, an aspherical lens 10, an optical chip 20, and an optical fiber assembly 30. The aspherical lens 10, the optical chip 20, and the optical fiber assembly 30 are sequentially disposed on the same side surface of the substrate 40. The optical chip 20 is provided with a planar light waveguide emission channel group. As can be defined, the optical chip 20 has at least one 1*N planar light waveguide emission channel group, where N is the number of planar light waveguide emission channels, N≥4, and is a natural number. The optical fiber assembly 30 has a capillary aperture 31 through which at least one optical fiber 50 passes. The at least one optical fiber 50 passes through the capillary aperture 31 and corresponds to the laser incident end of the optical chip. The laser emitting end of the optical chip 20 is disposed corresponding to the incident end of the aspherical lens 10.

[0031] The high power defined in this application refers to an average power greater than or equal to 2W and a peak power of at least 2KW.

[0032] In one embodiment, Figures 1-2Only one embodiment is shown, which includes an optical fiber passing through a capillary 31, i.e., a 1*N planar waveguide emission channel group. Of course, it is understood that it can be limited to include M planar waveguide emission channel groups, where M is equal to the number of capillary 31, i.e., both are the same, M≥1, and is a natural number, i.e., including multiple capillary 31. Based on this, it can be limited to include two or three array structures forming 1*N, i.e., two 1*N planar waveguide emission channel group arrays, three 1*N planar waveguide emission channel group arrays, four 1*N planar waveguide emission channel group arrays, or even more array structures. This application does not make such a limitation, and they are all within the protection scope of this application.

[0033] On the other hand, such as Figure 3 As shown in (b), the 1*N planar light waveguide emission channel group is divided into two and more channels, as shown in the figure, forming four planar light waveguide emission channels by dividing one into two and two into four.

[0034] Furthermore, such as Figure 1 As shown, the optical chip 20 has a trapezoidal structure and is placed between the fiber optic assembly 30 and the aspherical lens 10. It is connected to the substrate 40 via a connector, such as a curing adhesive. Figure 1 As shown in the black portion, this is the connector, a type of curing adhesive, used to achieve a fixed connection with the substrate 40 and the fiber optic assembly 30; further as... Figure 3 The optical chip 20 has a 1*N planar waveguide emission channel group, where N≥4 and is a natural number. Figure 3 The example shows four planar waveguide emission channels; this 1*N design enables laser beam expansion of more than one planar waveguide emission channels, such as... Figure 3 The optical chip 20 is shown to include laser beam expansion with at least four planar waveguide emission channels to achieve at least 1*4 four-channel laser beam expansion. Of course, this invention is also limited to various forms such as 8 channels, 16 channels, 32 channels, etc., and this patent does not impose any limitations.

[0035] The optical chip 20 can be selected from a planar lightwave circuit (PLC) waveguide chip, which is fabricated using semiconductor processes (photolithography, etching, development, etc.). It is designed with multiple channels to achieve mass production based on design requirements. Due to the inherent mass production capability and relatively low price of PLC-type chips, the cost of high-power laser components can be effectively reduced. Compared to currently used multi-channel couplers, the optical chip used in this application replaces the multi-channel coupler, and different calibration positions are modulated, significantly reducing the cost of the high-power laser components, which is beneficial for mass production and cost reduction. Simultaneously, the inherent transmission efficiency and stability advantages of the optical chip improve the efficiency and stability of laser transmission in high-power laser components.

[0036] Continue to refer to Figures 1-2 Using the N planar light waveguide emission channels in the optical chip 20 as a reference, the plane containing the N planar light waveguide emission channels is perpendicular to the substrate 40, so that the optical chip 20 and the fiber optic assembly 30 are connected in a direction that allows them to cooperate. The optical chip 20 and the fiber optic assembly 30 are connected in a way that forms an assembly. The axis of the assembly is at a certain angle to the horizontal axis of the substrate 40. This angle allows the assembly to be adjusted to different directions during laser multi-channel coupling and collimation so that the energy of each laser channel is maximized and the light spot meets the preset requirements.

[0037] Of course, the optical chip 20 and the aspherical lens 10 are fitted with a gap to accommodate the orientation adjustment of the aforementioned assembly.

[0038] Furthermore, such as Figure 3 As shown in Figure (a), the optical chip 20 has a trapezoidal structure, and several planar light waveguide emission channels are arranged in the middle of the trapezoidal structure. Of course, the positions shown in the figure are only examples. Those skilled in the art can make appropriate adjustments according to specific design requirements and adjust the positions of different planar light waveguide emission channels. In this regard, this application does not impose any positional limitations.

[0039] Furthermore, combining Figure 3 As shown in (b), the optical chip 20 has N planar waveguide emission channels of 1*N. In the figure, N=4, meaning it includes 4 planar waveguide emission channels. The arrangement of these planar waveguide emission channels achieves the beam expansion effect of the laser beam. Of course, N can be limited to natural numbers such as 8, 16, or 32. This limitation is based on design requirements, and this application does not impose any numerical limitation. Furthermore, based on the technical requirements of this application, the spacing between each of the N planar waveguide emission channels is limited to no less than 125μm, such as 127μm or 250μm.

[0040] Furthermore, in some embodiments, such as Figure 4As shown, a capillary aperture 31 is provided in the optical fiber assembly 30. This capillary aperture 31 is disposed through the optical fiber assembly 30 in a direction parallel to the substrate 40, and is coaxial with the incident end of the planar light waveguide emission channel of the optical chip 20. This ensures that the emission end of the optical fiber assembly 30 and the incident end of the optical chip 20 are correspondingly coaxially aligned, achieving coaxial beam expansion of the laser. Of course, depending on specific design requirements, the capillary aperture 31 can be located at different positions within the optical fiber assembly 30; however, this application does not impose any positional limitations.

[0041] In some embodiments, reference Figures 3-4 The surface of the fiber optic assembly 30 that mates with the optical chip 20 is inclined. This inclined surface, in conjunction with the inclined surface of the optical chip 20, enables the transmission of fiber optic signals. Furthermore, the inclined surface of the optical chip 20 can be defined to form a certain angle with the direction perpendicular to the bottom of the optical chip 20, such as... Figure 3 That is, the angle between the inclined surface of the trapezoidal structure of the optical chip 20 and the outer side perpendicular to the bottom surface, as shown by A in the figure, and the angle ranges from 5° to 10°, such as 6°, 7°, 8°, etc.; and according to relevant knowledge, the angle between the two inclined surfaces of the trapezoidal structure is the same, and the angle between the inclined surface of the fiber optic assembly 30 and the inclined surface of the optical chip 20 is the same.

[0042] Furthermore, the aperture of the capillary 31 can be specifically adapted to the core size of the optical fiber 50, allowing the core to pass through and be fixedly disposed within the capillary. For example, the aperture of the capillary 31 can be limited to 200–300 μm, or even 250 μm. Simultaneously, the end of the capillary 31 furthest from the optical chip 20 has an enlarged aperture structure, such as… Figure 4 The aperture expansion structure 32 shown is disposed on the side of the capillary 31 away from the optical chip 20. The aperture diameters at the two ends of the aperture expansion structure 32 are different. The aperture diameter at the end of the aperture expansion structure 32 away from the capillary 31 is larger than the aperture diameter at the end closer to the capillary 31. For example, it can be limited to ≥400μm or even larger, in order to accommodate the curing adhesive for fixing the fiber core and realize the fixed encapsulation of the optical fiber.

[0043] In some embodiments, continue to refer to Figure 4 The side of the fiber optic assembly 30 that mates with the optical chip 20 is inclined. This inclined surface, in conjunction with the inclined surface of the optical chip 20, enables the transmission of fiber optic signals. That is, the connecting surface is inclined, and there is a gap between them, the size of which satisfies [0, 10] μm. By limiting the distance between them, the loss of laser light during transmission is reduced, the loss rate is lowered, and the accuracy of the transmitted signal is improved, which is beneficial to this structure.

[0044] Furthermore, there is a gap between the fiber optic assembly 30 and the optical chip 20, the size of which satisfies [0, 10] μm, enabling lossless transmission of light between the fiber optic assembly 30 and the optical chip 20. Moreover, the gap between them is either a vacuum gap or an air gap, thus achieving a seamless connection. Figure 1 As shown, the fiber optic assembly 30 and the optical chip 20 are connected by an adhesive, such as UV-curable adhesive, or other connection methods, creating a vacuum gap or air gap at the center of their mating surfaces. This prevents excessive laser energy from melting the connection, improving the stability of the assembly. Figure 1 As shown in the black area of ​​the connecting part, the optical fiber assembly 30 and the optical chip 20 are connected in this manner.

[0045] like Figures 1-2 The aspherical lens 10, optical chip 20 and fiber optic assembly 30 are sequentially mounted on the same side surface of the substrate 40 using a curing adhesive to achieve a fixed connection between the parts.

[0046] In some embodiments, this application provides a high-power laser component, including a substrate 40, an aspherical lens 10, an optical chip 20, and an optical fiber assembly 30; the aspherical lens 10, the optical chip 20, and the optical fiber assembly 30 are sequentially disposed on the same side surface of the substrate 40; a planar light waveguide emission channel group is provided in the optical chip 20; the optical fiber assembly 30 has a capillary aperture 31 through which at least one optical fiber can pass, the at least one optical fiber passes through the capillary aperture 31 and corresponds to the laser incident end of the optical chip, and the laser emitting end of the optical chip 20 is disposed corresponding to the incident end of the aspherical lens 10; along the laser emission direction, at least one layer of optical antireflection film is disposed on both ends of the optical chip 20 and on the side of the optical fiber assembly 30 facing the optical chip to provide laser transmittance.

[0047] Of course, in some embodiments, multiple layers of antireflective coatings may be provided on both sides of the optical chip and on one side of the optical fiber assembly. Here, this application does not limit the number of antireflective coating layers.

[0048] In some embodiments, the aspherical lens 10 is used to achieve beam expansion and collimation of the laser to facilitate collimation coupling.

[0049] Furthermore, combined with Figures 5-6The high-power laser assembly also includes a handheld portion 60, which is formed on the aspherical lens 10 and the optical chip 20, and at least partially covers the aspherical lens 10 and the optical chip 20. This design, on the one hand, protects the optical structure of the aspherical lens 10 and the optical chip 20 from damage by the external environment; on the other hand, it prevents dust, particles, and other impurities from the external environment from depositing on the aspherical lens and the optical chip, thereby improving the laser transmission efficiency. It also facilitates the handling and removal of the entire laser assembly during installation or disassembly, reducing operational difficulty. Therefore, this design is beneficial to the laser assembly of this application, improving the overall transmission and utilization efficiency of the laser assembly.

[0050] This application provides a high-power laser component, including a substrate, an aspherical lens, an optical chip, and an optical fiber assembly. The aspherical lens, optical chip, and optical fiber assembly are sequentially disposed on the same side surface of the substrate. The optical chip has at least N planar light waveguide emission channels, where N≥4. The optical fiber assembly has a capillary aperture through which at least one optical fiber passes, and the at least one optical fiber passes through the capillary aperture and corresponds to the laser incident end of the optical chip. The laser emitting end of the optical chip is disposed corresponding to the incident end of the aspherical lens. Compared with the multi-channel couplers currently used, this application uses an optical chip instead of a multi-channel coupler and modulates different calibration positions, which significantly reduces the cost of the high-power laser component, is beneficial for mass production and reducing manufacturing costs, and is beneficial for improving the efficiency and stability of laser transmission in the high-power laser component.

[0051] The specific embodiments described above do not constitute a limitation on the scope of protection of this utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A high power laser assembly, characterized by, The application relates to a laser module, which comprises a base, a non-spherical lens, an optical chip and a fiber assembly; the non-spherical lens, the optical chip and the fiber assembly are sequentially arranged on the same side surface of the base; the optical chip is provided with a group of plane light waveguide exit channels, the number of channels in the group of plane light waveguide exit channels is N, and N>=4; the fiber assembly is provided with a capillary hole through which at least one optical fiber passes, the at least one optical fiber passes through the capillary hole and corresponds to a laser incident end of the optical chip, and a laser exit end of the optical chip is arranged in correspondence with an incident end of the non-spherical lens. The optical chip comprises M groups of plane light waveguide exit channels, forms a plane light waveguide array, M>=1, and is a natural number. The optical chip and the fiber assembly are connected to form an assembly, the axis of the assembly and the horizontal axis of the base form a certain angle; further, the optical chip has a trapezoidal structure, and the trapezoidal slope of the optical chip forms a certain angle with the direction perpendicular to the bottom of the optical chip, and the angle ranges from 5 to 10 degrees. Further, the handheld part at least covers part of the non-spherical lens and the optical chip and is formed on the non-spherical lens and the optical chip.

2. The high power laser assembly of claim 1, wherein, The connecting surface between the fiber assembly and the optical chip is an inclined surface, and there is a gap between the two, and the gap size satisfies [0, 10] mu m.

3. The high power laser assembly of claim 1 or 2, wherein, A capillary hole is arranged in the fiber assembly, the capillary hole is arranged in the fiber assembly in a direction parallel to the base, and is coaxial with the incident end of the plane light waveguide exit channel of the optical chip.

4. The high power laser assembly of claim 3, wherein, The end of the capillary hole away from the optical chip is an expanded hole structure, and the aperture of the expanded hole structure away from the capillary tube is larger than the aperture of the end close to the capillary tube.

5. The high power laser assembly of claim 1 or 2, wherein, The distance between each channel in the N plane light waveguide exit channels is not less than 125 mu m.

6. The high power laser assembly of claim 1 or 4, wherein, At least one layer of optical antireflection film is arranged on the two end sides of the optical chip and the side of the fiber assembly facing the optical chip in the laser exit direction.

7. The high power laser assembly of claim 6, wherein, The middle part of the combined surface of the fiber assembly and the optical chip forms a vacuum gap or an air gap.

8. The high power laser assembly of claim 1, wherein, ​ 9. The high power laser assembly of claim 1 or 2, wherein, ​ 10. The high power laser assembly of claim 5, wherein, ​

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