A method, system and application for preparing a protective layer of a heat sink structure

Abstract

The present invention provides a method, a system and an application for preparing a protective layer of a heat sink structure. The method includes: obtaining and analyzing the laying data on both sides of a ceramic substrate; calculating the spacing between components according to the positional relationship; determining the materials of the first protective layer and the second protective layer; determining the main layer thicknesses of the first protective layer and the second protective layer, and making the thickness ratio of the first protective layer to the second protective layer in the main layer thickness not less than 1.1; determining the side layer structures of the first protective layer and the second protective layer, determining the side layer thickness of the second protective layer according to the edge shape and thickness ratio of the heat conduction layer, and determining the side layer thickness of the first protective layer according to each spacing group and its minimum spacing; preparing the protective layer. This solution conducts personalized design according to the specific parameters of different functional layers and heat conduction layers to provide the most suitable protection solution. By introducing advanced data analysis technology and automated preparation processes, the repeatability and consistency of products are improved to meet the needs of mass production.

Description

Technical Field

[0001] The present invention relates to the field of semiconductors, and particularly to a method for preparing a protective layer of a heat sink structure, a system thereof, and an application thereof. Background Art

[0002] In the field of semiconductor technology, a heat sink structure is a key structure applied to heat dissipation, which transfers heat from a heating element to the outside through heat conduction, convection, radiation, etc. In modern electronic devices, the heat sink structure plays a crucial role in effectively conducting and dissipating the heat generated by electronic components, ensuring the stable operation and long life of the devices. With the development of electronic products towards miniaturization and high performance, the design requirements for the heat sink structure are becoming increasingly strict, especially posing higher challenges in terms of material selection, structure design, and manufacturing processes.

[0003] Traditional heat sink structures usually adopt a single material or a simple combination, which may lead to compatibility problems between the heat conduction layer and the functional layer. Especially in harsh environments such as high temperature and high humidity, corrosion or performance degradation is likely to occur. In addition, there is a lack of effective protection measures for sensitive functional layers, affecting their long-term stability. Moreover, existing heat sink designs often focus on improving the heat conduction ability while neglecting the optimization of the overall heat dissipation path. For example, some protective layers may hinder the effective conduction of heat due to improper thickness or unreasonable material selection, thereby reducing the heat dissipation efficiency of the entire system. Summary of the Invention

[0004] In view of the above deficiencies in the prior art, the present invention provides a method for preparing a protective layer of a heat sink structure, a system thereof, and an application thereof to solve at least one of the above technical problems.

[0005] In the first part, the present application proposes a method for preparing a protective layer of a heat sink structure, including the following:

[0006] Obtain the laying data of the heat conduction layer and the functional layer on both sides of the ceramic substrate, and parse out the thickness of the heat conduction layer, the material of the heat conduction layer, the thickness of the functional layer, the material of the functional layer, and the positional relationship between the respective components in the functional layer according to the laying data;

[0007] Calculate the distance between the components according to the positional relationship, group the components with a distance less than a preset distance into the same distance group, and calculate the minimum distance between the components in each distance group;

[0008] Determine the material of the first protective layer and the material of the second protective layer respectively according to the material of the functional layer and the material of the heat conduction layer. Both the first protective layer and the second protective layer include a main layer covering the planar side and a side layer covering the thickness side;

[0009] Determine the main layer thicknesses of the first protective layer and the second protective layer respectively according to the thickness of the functional layer and the thickness of the heat conduction layer, and make the thickness ratio of the first protective layer to the second protective layer in terms of the main layer thickness not less than 1.1;

[0010] Determine the side layer structures of the first protective layer and the second protective layer respectively according to the edge shapes of the functional layer and the heat conduction layer, determine the side layer thickness of the second protective layer according to the edge shape of the heat conduction layer and the thickness ratio, and determine the side layer thickness of the first protective layer according to each spacing group and its minimum spacing;

[0011] Prepare the first protective layer covering the functional layer and the second protective layer covering the heat conduction layer on both sides of the ceramic substrate respectively according to the materials, main layer thicknesses, side layer structures and side layer thicknesses of the first protective layer and the second protective layer.

[0012] In some specific embodiments, the ratio of the first protective layer to the second protective layer in terms of the main layer thickness is between 1.1 and 2.0.

[0013] In some specific embodiments, when the ratio of the first protective layer to the second protective layer in terms of the main layer thickness exceeds 1.5, at least increase the thickness at the junction of the side layer and the main layer of the second protective layer.

[0014] In some specific embodiments, when the thickness of the heat conduction layer is greater than a preset thickness and the edge shape meets a preset condition, before setting the second protective layer, it further includes:

[0015] Set a third protective layer covering at least part of the edge of the heat conduction layer on the thickness side of the heat conduction layer, make the thickness of the third protective layer not higher than the thickness of the heat conduction layer, and fit it to the ceramic substrate;

[0016] After incorporating the third protective layer into a part of the heat conduction layer, calculate the material, main layer thickness, side layer structure and side layer thickness of the second protective layer.

[0017] In some specific embodiments, the preset condition includes: the angle between the thickness side of the heat conduction layer and the ceramic substrate in the direction towards the heat conduction layer is greater than 80 degrees.

[0018] In some specific embodiments, determining the side layer thickness of the first protective layer according to each spacing group and its minimum spacing specifically includes:

[0019] Determine the standard side layer thickness according to the ratio of the thickness of the first protective layer to the main layer thickness, and use the standard side layer thickness as the side layer thickness of all components in the functional layer except the spacing group;

[0020] Calculate the difference between twice the standard side layer thickness and the minimum spacing of each spacing group;

[0021] If the difference corresponding to a certain spacing group is greater than the preset standard distance, use the standard side layer thickness as the side layer thickness of the components in this spacing group;

[0022] If the difference corresponding to a certain spacing group is not greater than the preset standard distance, establish the side layer thickness of the components in this spacing group according to the standard distance.

[0023] Second part, the present application proposes a preparation system for the protective layer of a heat sink structure, including the following:

[0024] A data analysis unit, configured to obtain the laying data of the heat conduction layer and the functional layer on both sides of the ceramic substrate, and analyze the heat conduction layer thickness, heat conduction layer material, functional layer thickness, functional layer material, and the positional relationship of each component in the functional layer according to the laying data;

[0025] A spacing calculation unit, configured to calculate the spacing between components according to the positional relationship, group the components with a spacing less than the preset distance into the same spacing group, and calculate the minimum spacing between the components in each spacing group;

[0026] A material determination unit, configured to determine the material of the first protective layer and the material of the second protective layer according to the functional layer material and the heat conduction layer material respectively. The first protective layer and the second protective layer both include a main layer covered on the planar side and a side layer covered on the thickness side;

[0027] A main layer unit, configured to determine the main layer thickness of the first protective layer and the second protective layer according to the functional layer thickness and the thickness of the heat conduction layer respectively, and make the thickness ratio of the first protective layer to the second protective layer in the main layer thickness not less than 1.1;

[0028] A side layer unit, configured to determine the side layer structure of the first protective layer and the second protective layer according to the edge shapes of the functional layer and the heat conduction layer respectively, determine the side layer thickness of the second protective layer according to the edge shape of the heat conduction layer and the thickness ratio, and determine the side layer thickness of the first protective layer according to each spacing group and its minimum spacing;

[0029] A preparation unit, configured to prepare the first protective layer covering the functional layer and the second protective layer covering the heat conduction layer on both sides of the ceramic substrate according to the materials, main layer thicknesses, side layer structures, and side layer thicknesses of the first protective layer and the second protective layer respectively.

[0030] Part III. The present application proposes a heat sink structure prepared by using the protective layer preparation method described in any item of Part I. The heat sink structure includes a ceramic substrate, a heat conduction layer, a functional layer, a first protective layer, and a second protective layer. One side of the ceramic substrate is provided with the heat conduction layer, and the other side is provided with the functional layer. The first protective layer wraps the functional layer, and the second protective layer wraps the heat conduction layer.

[0031] Both the first protective layer and the second protective layer include a main layer disposed on the planar side and a side layer disposed on the thickness side. The ratio of the thickness of the main layer of the first protective layer to that of the second protective layer is not less than 1.05.

[0032] Part IV. The present application proposes a laser having the heat sink structure described in Part III.

[0033] Part V. The present application proposes a semiconductor device having the laser described in Part IV.

[0034] Beneficial effects: The present invention provides a method and system for preparing a protective layer of a heat sink structure and its application. It is designed individually according to the specific parameters (such as thickness, material, and positional relationship) of different functional layers and heat conduction layers to provide the most suitable protection scheme. By introducing advanced data analysis technology and automated preparation processes, the repeatability and consistency of products are improved to meet the needs of mass production. The most suitable protective layer design scheme is customized for each specific application scenario, so as to ensure that the protective layer can effectively cover the underlying structure without negatively affecting its heat dissipation performance. The prepared heat sink structure not only improves the compatibility between different components but also enhances the stability of the entire system, reducing problems caused by mechanical stress or differences in thermal expansion coefficients. Considering various possible changing factors (such as different material combinations, thickness ratios, edge shapes, etc.), it has strong adaptability and is applicable to various types of heat sink structures and their application scenarios. Description of the Drawings

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0036] Figure 1 It is a schematic flow chart of the preparation method of the present application;

[0037] Figure 2 It is a schematic diagram of the heat sink structure of the present application;

[0038] Figure 3Schematic diagram of the positions of the main layer and the side layer of the present application;

[0039] Figure 4 Schematic diagram of the angle of the present application;

[0040] Figure 5 Schematic diagram of the position of the third protective layer of the present application;

[0041] Figure 6 Schematic diagram of the preparation system module of the present application.

[0042] The reference numerals are as follows: 1 - ceramic substrate; 2 - functional layer; 3 - heat-conducting layer; 21 - component; 41 - first protective layer; 42 - second protective layer; 43 - third protective layer. Detailed implementation manners

[0043] Hereinafter, the concept, specific structure and technical effects of the present invention will be clearly and completely described in combination with the embodiments and the drawings, so as to fully understand the purpose, features and effects of the present invention.

[0044] Hereinafter, various embodiments of the present invention will be described more comprehensively. The present invention can have various embodiments and adjustments and changes can be made therein. However, it should be understood that there is no intention to limit the various embodiments of the present invention to the specific embodiments disclosed herein, but the present invention should be understood to cover all adjustments, equivalents and / or alternative solutions falling within the spirit and scope of the various embodiments of the present invention.

[0045] Hereinafter, the term "comprising" or "may comprise" that can be used in various embodiments of the present invention indicates the presence of the disclosed functions, operations or elements, and does not limit the addition of one or more functions, operations or elements. In addition, as used in various embodiments of the present invention, the terms "comprising", "having" and their cognates are only intended to indicate specific features, numbers, steps, operations, elements, components or combinations of the foregoing items, and should not be construed as precluding the existence or addition of the presence of one or more other features, numbers, steps, operations, elements, components or combinations of the foregoing items first.

[0046] In various embodiments of the present invention, the expression "or" or "at least one of A or / and B" includes any combination or all combinations of the recited words. For example, the expression "A or B" or "at least one of A or / and B" may include A, may include B, or may include both A and B.

[0047] In various embodiments of the present invention, expressions (such as "first", "second", etc.) used may modify various constituent elements in the various embodiments, but do not limit the corresponding constituent elements. For example, the above expressions do not limit the order and / or importance of the elements. The above expressions are only for the purpose of distinguishing one element from other elements. For example, the first user device and the second user device indicate different user devices, although both are user devices. For example, without departing from the scope of the various embodiments of the present invention, the first element may be referred to as the second element, and similarly, the second element may also be referred to as the first element.

[0048] It should be noted that in the present invention, unless otherwise clearly specified and defined, terms such as "install", "connect", "fix", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] In the present invention, those of ordinary skill in the art need to understand that the terms indicating orientation or positional relationship in the text are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0050] The terms used in the various embodiments of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the various embodiments of the present invention. As used herein, the singular form is also intended to include the plural form unless the context clearly indicates otherwise. Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the various embodiments of the present invention belong. The terms (such as those defined in a commonly used dictionary) will be interpreted as having the same meaning as the contextual meaning in the relevant technical field and will not be interpreted as having an idealized meaning or an overly formal meaning unless clearly defined in the various embodiments of the present invention.

[0051] This application provides a method for preparing a protective layer of a heat sink structure, which is customized according to the specific parameters (such as thickness, material, positional relationship) of different functional layers and heat conduction layers to provide the most suitable protection solution. By introducing advanced data analysis technology and automated preparation processes, the repeatability and consistency of the product are improved to meet the needs of mass production. The process of the method for preparing the protective layer is as shown in the appendix Figure 1 as follows. The specific solutions are as follows:

[0052] A method for preparing a protective layer of a heat sink structure, comprising the following steps:

[0053] 101. Obtain the laying data of the heat conduction layer 3 and the functional layer 2 on both sides of the ceramic substrate 1, and analyze the thickness of the heat conduction layer 3, the material of the heat conduction layer 3, the thickness of the functional layer 2, the material of the functional layer 2, and the positional relationship of each component 21 in the functional layer 2 according to the laying data;

[0054] 102. Calculate the spacing between the components 21 according to the positional relationship, group the components 21 with a spacing less than the preset distance into the same spacing group, and calculate the minimum spacing between the components 21 in each spacing group;

[0055] 103. Determine the material of the first protective layer 41 and the material of the second protective layer 42 according to the material of the functional layer 2 and the material of the heat conduction layer 3 respectively. Both the first protective layer 41 and the second protective layer 42 include a main layer covered on the planar side and a side layer covered on the thickness side;

[0056] 104. Determine the main layer thickness of the first protective layer 41 and the second protective layer 42 according to the thickness of the functional layer 2 and the thickness of the heat conduction layer 3 respectively, and make the thickness ratio of the first protective layer 41 to the second protective layer 42 in the main layer thickness not less than 1.1;

[0057] 105. Determine the side layer structure of the first protective layer 41 and the second protective layer 42 according to the edge shapes of the functional layer 2 and the heat conduction layer 3 respectively, determine the side layer thickness of the second protective layer 42 according to the edge shape and thickness ratio of the heat conduction layer 3, and determine the side layer thickness of the first protective layer 41 according to each spacing group and its minimum spacing;

[0058] 106. Prepare the first protective layer 41 covering the functional layer 2 and the second protective layer 42 covering the heat conduction layer 3 on both sides of the ceramic substrate 1 respectively according to the materials, main layer thickness, side layer structure and side layer thickness of the first protective layer 41 and the second protective layer 42.

[0059] In this application, the functional layer 2 is mainly a copper layer covering the ceramic substrate 1, and various electronic components can be integrated on the functional layer 2 as needed. It should be noted that the laser device is officially integrated on one side of the functional layer 2. The heat conduction layer 3 is located on the other side of the ceramic substrate 1 and is mainly used for heat dissipation. The structural schematic diagrams of the functional layer 2, the heat conduction layer 3, the first protective layer 41 and the second protective layer 42 are as shown in the appendix Figure 2 shown. The main layer on the planar side is as shown by P in the appendix Figure 3 and the side layer on the thickness side is as shown by H in the appendix Figure 3 shown. The planar side represents one side of the plane of the functional layer 2 and the heat conduction layer 3, and the thickness side represents one side of the layer thickness of the functional layer 2 and the heat conduction layer 3.

[0060] Step 101 involves obtaining the laying data of the thermal conductive layer 3 and the functional layer 2 on both sides of the ceramic substrate 1, aiming to comprehensively understand the specific layout of the thermal conductive layer 3 and the functional layer 2 on both sides (front and back) of the ceramic substrate 1, including their physical dimensions, positional relationships, and material properties.

[0061] In this application, the preparation method of the protective layer of the heat sink structure can be during the specific preparation process of the heat sink structure or can also be applied before the preparation of the heat sink structure. For example, during the process of pre-customizing the parameters of the heat sink structure, the preparation method of this application can be adopted. Another example is that after the copper layers on both sides of the ceramic substrate 1 are prepared, high-precision measuring tools or non-contact scanning devices can be used, such as laser scanners, optical microscopes, X-ray fluorescence analyzers (XRF), three-dimensional profilers, etc. These tools can provide accurate geometric information and material composition analysis.

[0062] Identify the material type used for the thermal conductive layer 3, such as metals (aluminum, copper, etc.), ceramics, or other composite materials. This helps to select a protective layer material with good compatibility. The material composition can be identified by an X-ray fluorescence analyzer (XRF) or energy-dispersive spectroscopy (EDS). For example, for an aluminum thermal conductive layer 3, XRF can directly detect the presence of aluminum and the proportion of its alloy components. Similarly, the thickness of the functional layer 2 needs to be analyzed. Since the functional layer 2 may contain multiple electronic components or circuit structures and its thickness may vary, special attention is required. An optical microscope combined with image processing software can be used to measure the thickness changes in different regions to ensure the accuracy of the data.

[0063] In step 102, the goal is to calculate the spacing between the respective components 21 on the functional layer 2 based on their positional relationships, and group the components 21 with a spacing less than a preset distance into the same spacing group. In addition, the minimum spacing between the components 21 within each spacing group needs to be calculated. This process is crucial for the subsequent design of the protective layer because it directly affects the determination of the side layer structure and thickness of the protective layer.

[0064] Based on the data obtained in step 101 (such as high-resolution images or 3D models of the copper layer and the electronic components integrated thereon), clarify the specific positions of each component 21 (such as chips, resistors, capacitors, etc.). When the preparation method is applied to the specific preparation process of the heat sink structure, a scanning electron microscope (SEM), an optical microscope, and image processing software are used to generate a detailed plan view or 3D model to visually display the positional relationship of each component. Through image processing software or a dedicated algorithm, calculate the actual spacing between each component 21 on the functional layer 2. This step requires precise measurement of the shortest distance between the edges of each component. Use the automatic measurement function in the image processing software to mark and measure the spacing between components. For complex shapes or overlapping parts, manual intervention may be required for correction to ensure the accuracy of the measurement results.

[0065] Set a reasonable preset distance threshold according to the actual application requirements. This threshold determines which components 21 will be grouped into the same spacing group. Considering that different components may have different heat dissipation requirements, select an appropriate threshold to avoid overheating problems. Ensure that the protective layer design does not affect the physical connection or signal transmission between components. If some components are sensitive to electromagnetic interference, the threshold should be adjusted appropriately to reduce mutual interference.

[0066] Group all components 21 with a spacing less than the preset threshold into the same spacing group. This helps to simplify the subsequent protective layer design, especially the determination of the side layer thickness. For each spacing group, calculate the minimum spacing between the internal components 21. This is to ensure that even in the most compact case, the protective layer can provide the necessary protection without affecting the function. Use a software algorithm to automatically calculate the minimum spacing within each spacing group. By systematically calculating the spacing between each component 21 on the functional layer 2 and reasonably grouping them, this not only improves the design accuracy but also provides accurate basic data for the subsequent protective layer design. This method ensures that the protective layer can adapt to different levels of requirements, provide effective protection, and at the same time maintain the high heat dissipation performance of the heat sink structure.

[0067] In step 103, the goal is to determine the materials of the first protective layer 41 (covering the functional layer 2) and the second protective layer 42 (covering the heat conduction layer 3) according to the specific materials of the functional layer 2 (copper layer and the electronic components integrated thereon) and the heat conduction layer 3. Both of these protective layers include a main layer laid on the planar side and a side layer laid on the thickness side. Selecting appropriate protective layer materials is crucial for ensuring the long-term stability and efficient heat dissipation of the heat sink structure.

[0068] Analyze the material information of the functional layer 2 parsed in step 101, especially the material properties of the copper layer and the electronic components integrated thereon. Since the copper layer may be exposed to a humid or corrosive environment, the protective layer must have good corrosion resistance. To prevent short circuits or other electrical failures, the protective layer should have excellent electrical insulation properties. Considering the physical stresses that may be encountered during the assembly process, the protective layer needs to have sufficient mechanical strength and appropriate flexibility. In addition, the protective layer should maintain stable physical and chemical properties within the operating temperature range to ensure its long-term reliability.

[0069] Analyze the material information of the heat-conducting layer 3 parsed in step 101, especially the material properties of the copper layer. The protective layer should not significantly impede heat conduction, so a material with good thermal conductivity needs to be selected. The protective layer material should be compatible with the material of the heat-conducting layer 3 to avoid adverse reactions (such as electrochemical corrosion) caused by contact. Considering the stress distribution in the heat-conducting layer 3 during the heat dissipation process, the protective layer needs to have sufficient mechanical strength.

[0070] According to the material properties of the functional layer 2, select a suitable material for the first protective layer 41. The main task of the first protective layer 41 is to provide effective protection for the copper layer and the electronic components thereon. In this application, the first protective layer 41 and / or the second protective layer 42 include materials such as a gold-tin layer and polyimide. The functional layer 2 and the heat-conducting layer 3 generally choose a copper layer. The first protective layer 41 and the second protective layer 42 are responsible for heat conduction on the one hand and wrapping the copper layer to prevent oxidation on the other hand. In the functional layer 2, the copper layer is also responsible for conducting electricity. In practical applications, suitable materials can also be selected as the first protective layer 41 and the second protective layer 42 according to the material library. For example, if there is an abundant supply of gold-tin material in the material library, the gold-tin material can be selected as the first protective layer 41 and the second protective layer 42. When the supply of gold-tin material in the material library is insufficient, other mentioned materials can be selected as the first protective layer 41 and the second protective layer 42.

[0071] Suppose a heat sink structure is being designed for a high-performance laser module, where the functional layer 2 includes multiple electronic components such as laser devices, resistors, capacitors, etc., and the heat-conducting layer 3 is made of aluminum. The functional layer 2 is mainly composed of a copper layer and integrates various electronic components. Considering that the copper layer and the electronic components are sensitive to environmental humidity, temperature changes, and chemical corrosion, a material with both corrosion resistance and electrical insulation properties needs to be selected as the first protective layer 41. The gold-tin layer is an ideal choice due to its excellent corrosion resistance and mechanical strength. The heat-conducting layer 3 is made of aluminum and has good thermal conductivity. To ensure that the protective layer does not become part of the thermal resistance while providing the necessary mechanical protection, the gold-tin layer is a suitable choice because it is not only compatible with aluminum but also provides excellent solderability and contact resistance characteristics.

[0072] In step 104, the goal is to determine the main layer thicknesses of the first protective layer 41 (covering the functional layer 2) and the second protective layer 42 (covering the heat-conducting layer 3) based on the specific thicknesses of the functional layer 2 and the heat-conducting layer 3. In particular, it is necessary to ensure that the ratio of the main layer thickness of the first protective layer 41 to that of the second protective layer 42 is not less than 1.1. This step is crucial for optimizing the performance of the protective layer because it directly affects the reliability of electrical connections, the heat dissipation efficiency, and the overall structural stability.

[0073] Specifically, based on the specific thickness of the functional layer 2 and its working environment requirements, the main layer thickness of the first protective layer 41 is determined. In practical applications, the mapping relationship between the thickness of the functional layer 2 and the main layer thickness of the protective layer can be preset according to experience, and the main layer thickness of the first protective layer 41 is determined by looking up the mapping relationship. Similarly, for the second protective layer 42, based on the specific thickness of the heat-conducting layer 3 and its heat dissipation requirements, the main layer thickness of the second protective layer 42 is determined. The heat-conducting layer 3, relatively speaking

[0074] The selection criteria include:

[0075] Protection requirements: Considering that the functional layer 2 contains various sensitive electronic components, the protective layer needs to provide sufficient mechanical protection and electrical insulation.

[0076] Heat dissipation requirements: If there are heat-generating components (such as laser devices) on the functional layer 2, the protective layer should not significantly impede heat conduction.

[0077] Minimum spacing: According to each spacing group and its minimum spacing, ensure that the protective layer does not affect signal transmission or physical connection between components.

[0078] Cost-effectiveness: On the premise of ensuring performance, try to select a reasonable thickness to reduce costs.

[0079] The heat-conducting layer 3 is placed on the other side of the ceramic substrate 1, which can provide a certain mechanical stability for the ceramic substrate 1. When the functional layer 2 generates heat, it will cause the ceramic substrate 1 to expand and bend towards the heat-conducting layer 3 side. The presence of the heat-conducting layer 3 can inhibit the occurrence of this phenomenon. By increasing the thickness of the first protective layer 41 (usually covering the functional layer 2), the contact resistance can be reduced, thereby improving the reliability of the electrical connection. In the existing heat sink structures, the thickness of the protective layer at the heat-conducting layer 3 is generally set to be the same as that of the protective layer at the functional layer 2, which will result in performance redundancy of the protective layer thickness. The relatively thick first protective layer 41 can provide better electrical conductivity and ensure more stable current transmission. Although the thickness of the second protective layer 42 (usually covering the heat-conducting layer 3) is relatively thin, it still maintains good heat-conducting performance. Appropriately controlling its thickness can ensure that heat can be quickly conducted to the external heat dissipation device without significantly increasing the thermal resistance. By reasonably adjusting the thickness ratio of the first and second protective layers 42, the heat dissipation path of the entire heat sink structure can be optimized without affecting the heat dissipation performance, ensuring efficient heat dissipation. A reasonable thickness ratio allows for a more flexible plating process during manufacturing, ensuring uniform and consistent plating, improving production efficiency and product quality. On the premise of ensuring performance, optimizing the thickness ratio can reduce costs, especially for mass production, which helps to maximize economic benefits.

[0080] In step 105, the side layer structure of the first protective layer 41 (covering the functional layer 2) and the second protective layer 42 (covering the heat-conducting layer 3) is determined according to the edge shapes of the functional layer 2 and the heat-conducting layer 3, and the side layer thickness of the second protective layer 42 is determined according to the edge shape and thickness ratio of the heat-conducting layer 3. In addition, the side layer thickness of the first protective layer 41 also needs to be determined according to each spacing group and its minimum spacing.

[0081] The side layer structure of the protective layer must match the edge shape of the covered layer (such as functional layer 2 or heat-conducting layer 3). For example, if the functional layer 2 has irregular edges (such as stepped), then the side layer of the first protective layer 41 should also be designed in the corresponding shape to ensure complete coverage without leaving any unprotected areas. Similarly, if the heat-conducting layer 3 has smooth edges, the side layer of the second protective layer 42 can also be smooth. For the second protective layer 42, the thickness of its side layer needs to particularly consider the edge shape of the heat-conducting layer 3. For instance, if the edge of the heat-conducting layer 3 is thick or has protruding parts, it may be necessary to increase the thickness of the side layer of the second protective layer 42 to ensure sufficient protection for these parts. The thickness of the side layer of the second protective layer 42 also depends on the thickness ratio between the main layers. If the main layer of the second protective layer 42 is thinner than the first protective layer 41, then to maintain the stability and protection effect of the overall structure, it may be necessary to appropriately increase the thickness of the side layer. For the first protective layer 41, the design of the side layer thickness is affected by each spacing group and its minimum spacing. For example, if the minimum spacing within a certain spacing group is very small, indicating that the functional components in this area are arranged closely, at this time, the side layer thickness of the first protective layer 41 can be relatively thin because even slightly reducing the thickness will not affect these components; conversely, if the spacing is large, it may be necessary to thicken the side layer to prevent damage to the underlying structure during the preparation process or to ensure better mechanical strength.

[0082] Suppose there is a ceramic substrate 1, and the functional layer 2 on it consists of multiple electronic components, some of which are very close to each other (less than the preset value), while others are relatively dispersed. At the same time, the heat-conducting layer 3 has smooth but slightly inclined edges. For the first protective layer 41 (covering the functional layer 2), due to the existence of groups of components with small spacings, we can group these components into the same spacing group and calculate the minimum spacing between them. For this spacing group, we may choose a moderate side layer thickness that can protect these closely arranged components without overly occupying space. For those components with larger spacings, we can appropriately increase the side layer thickness to provide additional protection and support. For the second protective layer 42 (covering the heat-conducting layer 3), considering the inclination of the edge of the heat-conducting layer 3, we need to ensure that the side layer can not only completely wrap this part but also take into account the thickness ratio between it and the main layer. If the main layer of the second protective layer 42 is relatively thin, we may choose a thicker side layer to maintain the structural integrity of the entire protective layer, especially at the edge of the heat-conducting layer 3, to avoid potential damage caused by stress concentration.

[0083] Step 106 is the final implementation stage of the preparation method for the entire heat sink structure's protective layer. It involves preparing the first protective layer 41 (covering the functional layer 2) and the second protective layer 42 (covering the heat conduction layer 3) on both sides of the ceramic substrate 1 according to the results of all previous analyses and calculations. Select appropriate materials based on the material of the functional layer 2 determined in step 103. For example, if the functional layer 2 is made of a highly conductive metal, the first protective layer 41 may need to be made of materials with good insulation and corrosion resistance, such as certain types of polymers or ceramic materials, to prevent short circuits and other electrochemical reactions. Similarly, select suitable materials based on the material of the heat conduction layer 3. Assuming the heat conduction layer 3 is a highly efficient heat-conducting material such as aluminum or copper, then the second protective layer 42 may choose materials with high thermal stability and good mechanical strength, such as specific types of glass fiber-reinforced plastics or ceramic materials. Determine the specific structure of the side layer according to the edge shape defined in step 105. This may involve special molds or templates for forming shapes that match the edges of the heat conduction layer 3 and the functional layer 2. For example, if the edge of the heat conduction layer 3 has a complex geometry, the side layer also needs to be designed to fit these shapes perfectly. For the second protective layer 42, the thickness of its side layer is determined by the edge shape and thickness ratio of the heat conduction layer 3; for the first protective layer 41, it is adjusted according to each spacing group and its minimum spacing. For example, if the components within a spacing group are very close, the side layer can be made thinner, and vice versa, a thicker side layer is required. Different technical means may be used in the actual preparation process, such as spraying, coating, impregnation, physical vapor deposition (PVD), chemical vapor deposition (CVD), etc., depending on the selected materials and the desired effects. Each technique has its advantages and disadvantages and different requirements for environmental conditions (temperature, humidity, etc.). During the preparation process, various parameters must be strictly monitored, including but not limited to temperature, pressure, coating uniformity, etc., to ensure that the quality of the protective layer meets the expected standards. In addition, appropriate inspections and tests, such as thickness measurement, hardness test, adhesion test, etc., are also required to verify whether the protective layer meets the design requirements.

[0084] In some embodiments, the ratio of the thickness of the first protective layer 41 to that of the second protective layer 42 is between 1.1 and 2.0. A higher thickness ratio (such as approaching 2.0) can significantly reduce the contact resistance and improve the reliability of electrical connections, especially in high-frequency circuits or high-current applications. By controlling the thickness ratio within a reasonable range, the heat dissipation path of the entire heat sink structure can be optimized without affecting the heat dissipation performance. A thicker first protective layer 41 will not significantly increase the thermal resistance, while an appropriate thickness of the second protective layer 42 can still maintain good thermal conductivity.

[0085] In some embodiments, when the ratio of the thickness of the first protective layer 41 to that of the second protective layer 42 in the main layer exceeds 1.5, at least increase the thickness of the second protective layer 42 at the junction of the side layer and the main layer. A larger thickness ratio may cause stress concentration at the junction of the side layer and the main layer, increasing the mechanical stress in this area. By increasing the thickness of the side layer of the second protective layer 42, these stresses can be effectively dispersed, avoiding local stress concentration points, thereby improving the mechanical strength and durability of the overall structure. The side layer is usually located at the edge and is easily affected by the external environment (such as physical impact, chemical corrosion, etc.). Increasing the thickness of the side layer can provide additional protection to ensure that the edge area is not easily damaged during long-term use. Although a larger thickness of the main layer helps to improve electrical performance, an overly large thickness may have a certain impact on heat dissipation. By increasing the thickness of the side layer, it can be ensured that heat can be conducted more evenly to the external heat dissipation device, optimizing the heat dissipation path.

[0086] In some embodiments, when the thickness of the heat-conducting layer 3 is greater than a preset thickness and the edge shape meets the preset conditions, before setting the second protective layer 42, it further includes: setting a third protective layer 43 on the thickness side of the heat-conducting layer 3 to cover at least part of the edge of the heat-conducting layer 3, making the thickness of the third protective layer 43 not higher than the thickness of the heat-conducting layer 3, and fitting it with the ceramic substrate 1; after incorporating the third protective layer 43 into a part of the heat-conducting layer 3, calculate the material, main layer thickness, side layer structure and side layer thickness of the second protective layer 42. To further optimize the performance and reliability of the heat sink structure, before setting the second protective layer 42, a third protective layer 43 can be set on the thickness side of the heat-conducting layer 3 to cover at least part of the edge of the heat-conducting layer 3. This additional step is applicable to the case where the thickness of the heat-conducting layer 3 is greater than the preset thickness and its edge shape meets the preset conditions. Based on the specific thickness of the heat-conducting layer 3 and its edge shape, judge whether it is necessary to introduce the third protective layer 43. If the thickness of the heat-conducting layer 3 exceeds the preset value (for example, 0.8 mm), additional protective measures may be required. If the edge shape of the heat-conducting layer 3 is complex or there are sharp corners, it may cause stress concentration or mechanical damage. At this time, introducing the third protective layer 43 can provide additional protection. Set a third protective layer 43 on the thickness side of the heat-conducting layer 3 to cover at least part of the edge of the heat-conducting layer 3, ensure that the thickness of the third protective layer 43 is not higher than the thickness of the heat-conducting layer 3, and fit it with the ceramic substrate 1. The material of the third protective layer 43 should be compatible with the heat-conducting layer 3 to avoid adverse reactions (such as electrochemical corrosion). Common choices include polyimide, silica gel or metallized polymer composites, etc. The thickness of the third protective layer 43 should not exceed the thickness of the heat-conducting layer 3 to ensure the stability and heat dissipation efficiency of the overall structure. Usually, the thickness of the third protective layer 43 can be set to 30%-80% of the thickness of the heat-conducting layer 3. The third protective layer 43 needs to be closely fitted with the ceramic substrate 1 to ensure good mechanical connection and heat conduction performance. According to the updated characteristics of the heat-conducting layer 3 (including the third protective layer 43), recalculate the material, main layer thickness, side layer structure and side layer thickness of the second protective layer 42. Select a suitable material for the second protective layer 42 according to the new characteristics of the heat-conducting layer 3 to ensure that it has good heat conductivity and mechanical strength. Adjust the main layer thickness of the second protective layer 42 to ensure that the ratio of the main layer thickness of the first protective layer 41 to the second protective layer 42 still meets the design requirements (between 1.1 and 2.0). According to the edge shape and thickness ratio of the heat-conducting layer 3, determine the structure of the side layer of the second protective layer 42 to ensure that it can effectively protect the heat-conducting layer 3 and optimize the heat dissipation path. According to each spacing group and its minimum spacing, determine the thickness of the side layer of the second protective layer 42 to ensure that it can provide sufficient mechanical protection without affecting the heat dissipation performance. By systematically introducing the third protective layer 43, the performance and reliability of the heat sink structure are further optimized. This method not only improves the design accuracy but also provides guarantee for quality control in the manufacturing process, ensuring the long-term stability and high-efficiency heat dissipation performance of the heat sink structure in complex working environments.

[0087] In some embodiments, the preset conditions include: the angle between the thickness side of the heat-conducting layer 3 and the ceramic substrate 1 in the direction towards the heat-conducting layer 3 is greater than 80 degrees. The angle is as shown by a and b in the appendix Figure 4 In the appendix Figure 4 , a is less than 80 degrees, and there is no need to provide the third protective layer 43. B is greater than 80 degrees, and the third protective layer 43 needs to be provided. The third protective layer 43 is as shown in the appendix Figure 5 . When the thickness of the heat-conducting layer 3 is greater than the preset thickness and the angle between its thickness side and the ceramic substrate 1 in the direction towards the heat-conducting layer 3 is greater than 80 degrees, before providing the second protective layer 42, a third protective layer 43 covering at least part of the edge of the heat-conducting layer 3 can be provided on the thickness side of the heat-conducting layer 3. A larger angle (greater than 80 degrees) may cause stress concentration at the junction of the thickness side of the heat-conducting layer 3 and the ceramic substrate 1. Introducing the third protective layer 43 can effectively disperse these stresses and reduce the risk of mechanical damage. Based on the specific thickness of the heat-conducting layer 3 and the angle between its thickness side and the ceramic substrate 1, it is determined whether to introduce the third protective layer 43. If the angle between the thickness side of the heat-conducting layer 3 and the ceramic substrate 1 in the direction towards the heat-conducting layer 3 is greater than 80 degrees, there is a high risk of stress concentration or a possibility of mechanical damage. At this time, introducing the third protective layer 43 can provide additional protection.

[0088] In some embodiments, determining the side layer thickness of the first protective layer 41 according to each spacing group and its minimum spacing specifically includes: determining the standard side layer thickness according to the ratio of the thickness of the first protective layer 41 to the main layer thickness, and taking the standard side layer thickness as the side layer thickness of all components 21 in the functional layer 2 except the spacing groups; calculating the difference between twice the standard side layer thickness and the minimum spacing of each spacing group; if the difference corresponding to a certain spacing group is greater than the preset standard distance, taking the standard side layer thickness as the side layer thickness of the component 21 in this spacing group; if the difference corresponding to a certain spacing group is not greater than the preset standard distance, establishing the side layer thickness of the component 21 in this spacing group according to the standard distance.

[0089] To ensure that the first protective layer 41 provides effective protection between the various components 21 on the functional layer 2 without affecting its electrical performance and mechanical stability, it is necessary to accurately determine the side layer thickness of the first protective layer 41 according to each spacing group and its minimum spacing. The standard side layer thickness is determined according to the ratio of the thickness of the first protective layer 41 to the main layer thickness.

[0090] Thickness ratio: Assuming that the total thickness of the first protective layer 41 is TT and the main layer thickness is TmTm, the side layer thickness Ts can be calculated by the following formula:

[0091] Ts = k×(T−Tm)

[0092] Among them, k is a proportionality coefficient, usually set between 0.5 and 1.0, and the specific value depends on the application scenario and technical requirements.

[0093] Take the calculated standard side layer thickness Ts as the side layer thickness of all components 21 in the functional layer 2 except for the spacing groups.

[0094] Calculate the difference between twice the standard side layer thickness and the minimum spacing of each spacing group. For each spacing group, determine the minimum spacing dmin between the internal components 21. Calculate the difference Δ between twice the standard side layer thickness Ts and the minimum spacing dmin:

[0095] Δ = 2Ts − dmin

[0096] Decide whether to adjust the side layer thickness according to whether the difference is greater than the preset standard distance.

[0097] Preset standard distance: Set a reasonable preset standard distance D, such as 0.5 mm, for judging whether the side layer thickness needs to be adjusted.

[0098] The difference is greater than the preset standard distance: If the difference Δ corresponding to a certain spacing group is Δ > D, then keep the standard side layer thickness Ts unchanged as the side layer thickness of the components 21 in this spacing group.

[0099] The difference is not greater than the preset standard distance: If the difference Δ corresponding to a certain spacing group is Δ ≤ D, then establish the side layer thickness of the components 21 in this spacing group according to the preset standard distance DD. The specific adjustment method is as follows:

[0100]

[0101] This can ensure that even in the most compact situation, the protective layer can provide the necessary protection without affecting the normal operation of the functional layer 2.

[0102] A protective layer preparation system for a heat sink structure of the present application, the modules are as shown in the appendix Figure 6 as follows:

[0103] A data analysis unit A1, which is used to obtain the laying data of the heat conduction layer 3 and the functional layer 2 on both sides of the ceramic substrate 1, and analyze the thickness of the heat conduction layer 3, the material of the heat conduction layer 3, the thickness of the functional layer 2, the material of the functional layer 2, and the positional relationship of each component 21 in the functional layer 2 according to the laying data;

[0104] A spacing calculation unit A2, which is used to calculate the spacing between the components 21 according to the positional relationship, group the components 21 with a spacing less than the preset distance into the same spacing group, and calculate the minimum spacing between the components 21 in each spacing group;

[0105] A material determination unit A3 is configured to determine the material of the first protective layer 41 and the material of the second protective layer 42 according to the material of the functional layer 2 and the material of the heat conduction layer 3 respectively. Both the first protective layer 41 and the second protective layer 42 include a main layer covering the planar side and a side layer covering the thickness side.

[0106] A main layer unit A4 is configured to determine the main layer thicknesses of the first protective layer 41 and the second protective layer 42 according to the thickness of the functional layer 2 and the thickness of the heat conduction layer 3 respectively, and make the thickness ratio of the first protective layer 41 to the second protective layer 42 in terms of the main layer thickness not less than 1.1.

[0107] A side layer unit A5 is configured to determine the side layer structures of the first protective layer 41 and the second protective layer 42 according to the edge shapes of the functional layer 2 and the heat conduction layer 3 respectively, determine the side layer thickness of the second protective layer 42 according to the edge shape and thickness ratio of the heat conduction layer 3, and determine the side layer thickness of the first protective layer 41 according to each spacing group and its minimum spacing.

[0108] A preparation unit A6 is configured to prepare the first protective layer 41 capable of covering the functional layer 2 and the second protective layer 42 covering the heat conduction layer 3 on both sides of the ceramic substrate 1 respectively according to the materials, main layer thicknesses, side layer structures and side layer thicknesses of the first protective layer 41 and the second protective layer 42.

[0109] This application proposes a heat sink structure prepared by using the above-mentioned protective layer preparation method. The heat sink structure includes a ceramic substrate 1, a heat conduction layer 3, a functional layer 2, a first protective layer 41 and a second protective layer 42. One side of the ceramic substrate 1 is provided with the heat conduction layer 3, and the other side is provided with the functional layer 2; the first protective layer 41 wraps the functional layer 2, and the second protective layer 42 wraps the heat conduction layer 3.

[0110] Both the first protective layer 41 and the second protective layer 42 include a main layer covering the planar side and a side layer covering the thickness side; the ratio of the main layer thickness of the first protective layer 41 to the second protective layer 42 is not less than 1.05.

[0111] The heat sink structure prepared by the preparation method in the foregoing technical solution can effectively enhance the connection strength between the heat conduction layer 3 and the ceramic substrate 1 in the heat sink structure, reduce the possibility of cracking at the edge of the heat conduction layer 3 due to external force bending, etc., and further extend the service life of the semiconductor device.

[0112] This application proposes a laser having the above-mentioned heat sink structure.

[0113] This application proposes a semiconductor device having the above-mentioned laser.

[0114] The above is a specific description of the preferred embodiment of the present invention. However, the present invention is not limited to the described embodiment. Those skilled in the art can make various equivalent deformations or substitutions without departing from the spirit of the present invention, and these equivalent deformations or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A method for preparing a protective layer of a heat sink structure, characterized in that: These include: Obtaining the laying data of the thermal conductive layer and the functional layer on both sides of the ceramic substrate, and analyzing the thickness of the thermal conductive layer, the material of the thermal conductive layer, the thickness of the functional layer, the material of the functional layer, and the positional relationship of each component in the functional layer according to the laying data; Calculating the spacing between the components according to the positional relationship, classifying the components with spacings smaller than a preset distance into the same spacing group, and calculating the minimum spacing between the components in each spacing group; Determine the material of the first protective layer and the material of the second protective layer according to the material of the functional layer and the material of the heat-conducting layer, respectively, wherein the first protective layer and the second protective layer both include a main layer covering the plane side and a side layer covering the thickness side; Determining the main layer thickness of the first protective layer and the second protective layer according to the thickness of the functional layer and the thickness of the heat conductive layer, respectively, so that the thickness ratio of the first protective layer to the second protective layer in the main layer thickness is not less than 1.1; Determine the side layer structures of the first protective layer and the second protective layer according to the edge shapes of the functional layer and the heat conducting layer respectively, determine the side layer thickness of the second protective layer according to the edge shape of the heat conducting layer and the thickness ratio, and determine the side layer thickness of the first protective layer according to each spacing group and its minimum spacing; A first protective layer covering the functional layer and a second protective layer covering the thermal conductive layer are respectively prepared on both sides of the ceramic substrate according to the material, main layer thickness, side layer structure and side layer thickness of the first protective layer and the second protective layer.

2. The method for preparing a protective layer according to claim 1, characterized in that: The ratio of the thickness of the first protective layer to that of the second protective layer in the main layer is between 1.1 and 2.

0.

3. The method for preparing a protective layer according to claim 1, characterized in that: When the ratio of the thickness of the first protective layer to that of the second protective layer in the main layer exceeds 1.5, the thickness of at least the second protective layer at the junction of the side layer and the main layer is increased.

4. The method for preparing a protective layer according to claim 1, characterized in that: When the thickness of the heat-conducting layer is greater than the preset thickness and the edge shape meets the preset conditions, before the second protective layer is provided, the method further includes: A third protective layer is provided on the thickness side of the heat-conducting layer to cover at least part of the edge of the heat-conducting layer, so that the thickness of the third protective layer is not higher than the thickness of the heat-conducting layer and is bonded to the ceramic substrate; After the third protective layer is incorporated into a portion of the heat conducting layer, the material, main layer thickness, side layer structure and side layer thickness of the second protective layer are calculated.

5. The method for preparing a protective layer according to claim 4, characterized in that: The preset condition includes: an angle between the thickness side of the heat-conducting layer and the ceramic substrate in a direction toward the heat-conducting layer is greater than 80 degrees.

6. The method for preparing a protective layer according to claim 1, characterized in that: Determining the side layer thickness of the first protective layer according to each spacing group and its minimum spacing specifically includes: Determine a standard side layer thickness according to the ratio of the thickness of the first protective layer to the thickness of the main layer, and use the standard side layer thickness as the side layer thickness of all components in the functional layer except the spacing group; Calculate the difference between twice the standard side layer thickness and the minimum spacing of each spacing group; If the difference corresponding to a certain spacing group is greater than the preset standard distance, the standard side layer thickness is used as the side layer thickness of the component in the spacing group; If the difference corresponding to a certain spacing group is not greater than a preset standard distance, the side layer thickness of the components in the spacing group is established according to the standard distance.

7. A protective layer preparation system for a heat sink structure, characterized in that: These include: A data analysis unit, used to obtain the laying data of the thermal conductive layer and the functional layer on both sides of the ceramic substrate, and analyze the thickness of the thermal conductive layer, the material of the thermal conductive layer, the thickness of the functional layer, the material of the functional layer, and the positional relationship of each component in the functional layer according to the laying data; A spacing calculation unit, used to calculate the spacing between the components according to the positional relationship, classify the components whose spacing is less than a preset distance into the same spacing group, and calculate the minimum spacing between the components in each spacing group; A material determination unit, used to determine the material of the first protective layer and the material of the second protective layer according to the material of the functional layer and the material of the heat-conducting layer, respectively, wherein the first protective layer and the second protective layer both include a main layer covering the plane side and a side layer covering the thickness side; A main layer unit, used to determine the main layer thickness of the first protective layer and the second protective layer according to the thickness of the functional layer and the thickness of the heat conductive layer, respectively, so that the thickness ratio of the first protective layer to the second protective layer in the main layer thickness is not less than 1.1; A side layer unit, used to determine the side layer structures of the first protective layer and the second protective layer according to the edge shapes of the functional layer and the heat conducting layer, respectively, determine the side layer thickness of the second protective layer according to the edge shape of the heat conducting layer and the thickness ratio, and determine the side layer thickness of the first protective layer according to each spacing group and its minimum spacing; A preparation unit is used to prepare a first protective layer covering the functional layer and a second protective layer covering the thermal conductive layer on both sides of the ceramic substrate according to the material, main layer thickness, side layer structure and side layer thickness of the first protective layer and the second protective layer.

8. A heat sink structure, characterized in that: The heat sink structure is prepared by the protective layer preparation method according to any one of claims 1 to 6, comprising a ceramic substrate, a thermal conductive layer, a functional layer, a first protective layer and a second protective layer, wherein one side of the ceramic substrate is covered with the thermal conductive layer, and the other side is covered with the functional layer; the first protective layer wraps the functional layer, and the second protective layer wraps the thermal conductive layer; The first protective layer and the second protective layer both include a main layer covering the plane side and a side layer covering the thickness side; and a ratio of the main layer thickness of the first protective layer to the second protective layer is not less than 1.

05.

9. A laser, characterized in that: A heat sink structure as claimed in claim 8.

10. A semiconductor device, characterized in that: A laser as claimed in claim 9.

Images