Heat dissipation module and assembled switch cabinet

Abstract

The invention relates to the technical field of switch cabinets, and discloses a heat dissipation module and an assembled switch cabinet. The heat exchange structure comprises main flow channels, semiconductor chilling plates and side suction pipes, a plurality of main flow channels distributed in rows are formed in the end of the heat exchange block, one semiconductor chilling plate is arranged between every two adjacent rows of main flow channels, and the side suction pipes obliquely extending towards the air collection cover are arranged in each row of main flow channels; air in the air collecting cover is exhausted through the draught fan, then air on one side of the heat exchange block can be sucked into the main flowing channels and then exhausted through the draught fan, a plurality of side suction pipes extending into the main flowing channels are arranged, the side suction pipes can exhaust external air into the main flowing channels to exchange heat with cold air in a colliding mode, air is sucked through the main flowing channels and the side suction pipes, and the heat exchange efficiency is improved. The main flowing channel adsorbs air from one end of the heat exchange block, the side suction pipes suck air from the two sides of the heat exchange block, the suction range of hot air can be increased, and the refrigeration effect is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of switch cabinets, and in particular to a heat dissipation module and an assembled switch cabinet. Background Art

[0002] The switch cabinet is an electrical equipment. The external line of the switch cabinet first enters the main control switch inside the cabinet, and then enters the sub-control switch. Each branch is set according to its needs, such as instruments, automatic control, motor magnetic switches, various AC contactors, etc. Considering that the components are installed in a relatively sealed cabinet, a matching heat dissipation component is required to cool the components.

[0003] Publication number CN218102129U discloses an existing technology called an assembled switch cabinet, including a base and a heat dissipation mechanism; the base: vertical supports are symmetrically arranged at the four corners of the upper end, and grooves are arranged inside the vertical supports. The front end of the vertical support on the front left side is connected to the front door by a hinge, a left side plate is inserted between the two vertical supports on the left side, a rear plate is inserted between the two vertical supports on the rear side, and a right side plate is inserted between the two vertical supports on the right side. Threaded holes are provided at the top ends of the vertical supports, and the top ends of the vertical supports are in contact with the bottom surface of the top plate. Through holes are evenly provided on the upper surface of the top plate, and fixing bolts are inserted inside the through holes, and the bottoms of the fixing bolts are threadedly connected to the corresponding threaded holes in the vertical direction respectively; the heat dissipation mechanism: it is arranged on the right side of the right side plate, and the heat dissipation mechanism is fixedly connected to the right side of the left side plate.

[0004] In the prior art, the cooling and heat dissipation inside the cabinet is mainly achieved by blowing air with a fan. The open heat dissipation method will allow dust to enter while cooling, thereby affecting the life of the components. At the same time, dust adsorbed on the components will also reduce the heat dissipation effect. Therefore, closed heat dissipation is more suitable. However, in the prior art, a refrigeration element is arranged inside the cabinet and used in conjunction with a fan. One side of the fan is the air inlet, and the air inlet position is single. For air convection and heat exchange inside the cabinet, the effect is not good, and there is a certain space for optimization.

[0005] To this end, we propose a heat dissipation module and an assembled switch cabinet. Summary of the invention

[0006] The present invention mainly solves the technical problem that the open heat dissipation dust will be adsorbed on the components and affect the heat dissipation effect, and provides a heat dissipation module and an assembled switch cabinet.

[0007] In order to achieve the above object, the present invention adopts the following technical solution, a heat dissipation module and an assembled switch cabinet, comprising: A heat exchange block, one end of the heat exchange block is fixedly installed with an air collecting hood, a fan is fixedly installed at the port of the air collecting hood, and a lifting lug for installation is fixedly provided on the top of the heat exchange block; The heat exchange structure is arranged at the end of the heat exchange block away from the wind collecting hood for air heat exchange. The heat exchange structure includes a main flow channel, a semiconductor refrigeration plate and a side suction pipe. A plurality of main flow channels distributed in rows are opened at the end of the heat exchange block, a semiconductor refrigeration plate is arranged between two adjacent rows of main flow channels, and a plurality of side suction pipes extending obliquely toward the wind collecting hood are arranged inside each row of main flow channels.

[0008] As a preferred embodiment of the present invention, the heat exchange block is formed into a rectangular metal block, and the main flow channel is a rectangular groove, and the main flow channel extends from one side of the heat exchange block to the other side.

[0009] As a preferred embodiment of the present invention, the heat exchange structure also includes a slot and a side hole, a plurality of side holes are opened on the side wall of the main flow channel, the side suction pipe is inserted into the side hole and extends into the main flow channel, a slot is opened between two adjacent rows of main flow channels, and the semiconductor refrigeration plate is embedded in the slot.

[0010] As a preferred embodiment of the present invention, the side suction pipe is a square tube, and the side hole is adapted to the side suction pipe. The side hole extends from an outer wall on one side of the main flow channel to an inner wall on the other side of the main flow channel, and the side hole runs through each main flow channel in the same row.

[0011] As a preferred embodiment of the present invention, side panels are fixedly installed on opposite sides of the side suction pipe, the side panels form a prismatic structure, the inclined surfaces of the side panels are respectively facing the two sides of the heat exchange block, and a spray hole is opened on the top of each side suction pipe, and the spray hole is respectively located in each main flow channel.

[0012] As a preferred embodiment of the present invention, the heat exchange structure also includes a drying box, a loading carrier, an air inlet groove and an exhaust hole. A hollow drying box is arranged on each side of the heat exchange block. The drying box is fixedly connected to the corresponding side suction pipe and is interconnected. A detachable loading carrier is arranged on one side of the drying box. The top of the loading carrier is recessed to form a loading cavity, and an air inlet groove and an exhaust hole are respectively arranged on both sides of the loading body.

[0013] As a preferred embodiment of the present invention, the drying box forms a box body with an opening on one side, the carrier is adapted to the drying box and slidably arranged in the cavity of the drying box, the side suction pipe penetrates the drying box and extends into the cavity of the drying box, and a gap is left between the carrier and the side suction pipe port.

[0014] An assembled switch cabinet comprises a cabinet body, the front wall of the cabinet body is open, a cabinet door is hingedly connected to the front wall of the cabinet body, all the above-mentioned heat dissipation modules are arranged inside the cabinet body, and the lifting ears are fixedly mounted on the top of the cabinet body by screws; The assembly structure is arranged on the top of the cabinet and is used to lock two adjacent cabinets.

[0015] As a preferred embodiment of the present invention, the assembly structure includes a connecting seat, an anti-slip groove, an anti-slip rod and a positioning screw. Two symmetrically distributed connecting seats are fixedly installed on the top of the heat exchange block. An anti-slip groove is provided on the top of the connecting seat. The anti-slip rod can be slidably inserted into the anti-slip groove, and the anti-slip rod is locked and limited by the positioning screw.

[0016] As a preferred embodiment of the present invention, the anti-slip groove forms an arc-shaped groove, the anti-slip rod forms an arc-shaped rod body with a diameter equal to that of the anti-slip groove, the bottom of the anti-slip rod forms an annular guard, the anti-slip groove and the anti-slip rod are used in conjunction with each other, the positioning screw is threadedly connected to the anti-slip rod, and a positioning hole is provided on the inner bottom surface of the connecting seat, and the positioning screw can be inserted into the positioning hole.

[0017] The present invention provides a heat dissipation module and an assembled switch cabinet, which have the following beneficial effects: 1. This kind of heat dissipation module and assembled switch cabinet connect the fan and the semiconductor refrigeration plate to a power source, the semiconductor refrigeration plate cools the main flow channel, and the fan exhausts air inside the wind collecting hood, and then the air on one side of the heat exchange block is sucked into the main flow channel and then discharged through the fan to achieve air flow, and a plurality of side suction pipes extending into the main flow channel are provided. Since the ports of the side suction pipes are located outside the heat exchange block, when the air passes through the main flow channel, under the Venturi effect, the side suction pipes will discharge the external air into the main flow channel to collide with the cold air for heat exchange, and air is sucked through multiple main flow channels and side suction pipes. The main flow channel absorbs air from one end of the heat exchange block, and the multiple side suction pipes suck air from both sides of the heat exchange block, which can increase the suction range of hot air and improve the cooling effect.

[0018] 2. This heat dissipation module and assembled switch cabinet form a grid structure inside the heat exchange block by setting the main flow channel and the semiconductor refrigeration plate. The semiconductor refrigeration plate has a larger contact area with the air inside the heat exchange block, thereby improving the cooling effect of the semiconductor refrigeration plate on the air flowing through the main flow channel.

[0019] 4. This heat dissipation module and assembled switch cabinet achieve the purpose of heat dissipation and cooling by exhausting air through the wind collecting hood to realize air flow. The lifting ear is an L-shaped rod structure. The top of the lifting ear is provided with a mounting groove, and the lifting ear can be installed and fixed by screws. It has the characteristics of convenient disassembly and assembly, convenient inspection and maintenance, and the overall structure is streamlined, small in size, and occupies little space.

[0020] 5. In the heat dissipation module and assembled switch cabinet, when the air flows radially from the main flow channel and passes through the inclined side suction pipe, the side plate can reduce the blocking effect on the air. At the same time, through the guidance of the side plate, the air flow rate above the side suction pipe is relatively large, which facilitates the formation of a pressure difference between the inside and outside of the side suction pipe, thereby ensuring the suction effect of the side suction pipe. At the same time, by setting the side suction pipe and the side plate, the contact surface area between the air and the heat exchange block can be further increased to improve the cooling effect. 6. The heat dissipation module and assembled switch cabinet, because the side suction pipe is connected with the drying box, the side suction pipe can make the gas in the drying box be sucked into the main flow channel. Before being sucked into the main flow channel, the air will enter the load body from the air inlet groove, and after being adsorbed by the water-absorbing material in the load body, it will be discharged into the drying box from the exhaust hole, so as to realize the drying treatment of the air while cooling, and have stronger functionality and better practical effect. 7. The heat dissipation module and assembled switch cabinet are configured such that the carrier and the drying box are detachable, and a sealing strip can be provided at the opening of the drying box to ensure the sealing. When replacing or regenerating the water-absorbing material, it is only necessary to pull out the carrier to replace it, which is convenient for subsequent maintenance operations, has a simple structure and a long service life.

[0021] 8. This heat dissipation module and assembled switch cabinet improve the air flow inside the cabinet by installing hanging ears on the top or side wall of the cabinet, and greatly improve the refrigeration and cooling effect by increasing the air intake range and improving the contact area between air and semiconductor refrigeration plates. As a result, the working environment temperature of the electrical components inside the switch cabinet can be stably controlled, heat accumulation is suppressed, and high temperature is prevented from shortening the service life of the components. Secondly, the entire heat dissipation module is installed inside the cabinet, and the relatively closed heat dissipation placement reduces the probability of dust entering the cabinet.

[0022] 9. This kind of heat dissipation module and assembled switch cabinet, by setting a connecting seat at the position near both sides of the top of the cabinet, when multiple cabinets are placed side by side for assembly, first insert the anti-slip rod into the anti-slip groove of one of the connecting seats, and after placing another cabinet, push the anti-slip rod to slide in the anti-slip groove. When the anti-slip rod slides into the two anti-slip grooves, the positioning screw is aligned with the positioning hole. The positioning screw is rotated so that the end of the positioning screw is inserted into the positioning hole to fix the position of the anti-slip rod, and then the arc-shaped anti-slip rod can tighten the two cabinets to achieve combined use, convenient disassembly and assembly, high construction efficiency, strong locking effect on the two cabinets, and not easy to fall off.

[0023] 10. This heat dissipation module and assembled switch cabinet, through the modular design of the heat dissipation module, can increase or decrease the number of heat dissipation modules according to the number of components inside the cabinet and the heat intensity, balance the cooling effect and energy consumption, and have stronger selectivity and higher degree of customization. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is one of the overall stereograms of the present invention; Figure 2 This is the second overall stereogram of the present invention; Figure 3 This is a three-dimensional diagram of the heat exchange block of the present invention; Figure 4 This is a schematic diagram of a drying box installed on the side suction pipe of the present invention; Figure 5 This is the assembly diagram of the carrier and the drying box of the present invention; Figure 6 It is a three-dimensional picture of the cabinet; Figure 7 A three-dimensional diagram of the connection seat; Figure 8 This is a three-dimensional diagram of the anti-trip rod.

[0025] Legend: 10. Heat exchange block; 11. Air collecting hood; 12. Fan; 13. Lifting ear; 20. Main flow channel; 21. Semiconductor cooling plate; 22. Slot; 23. Side plug hole; 24. Side suction pipe; 25. Spray hole; 30. Drying box; 31. Carrier; 32. Air inlet slot; 33. Exhaust hole; 40. Cabinet; 50. Connecting seat; 51. Anti-slip groove; 52. Anti-slip rod; 53. Positioning screw. DETAILED DESCRIPTION

[0026] A heat dissipation module and assembled switch cabinet, such as Figure 1 and Figure 2 As shown, including: A heat exchange block 10 is provided, and an air collecting hood 11 is fixedly installed at one end of the heat exchange block 10, and a fan 12 is fixedly installed at the port of the air collecting hood 11. A lifting ear 13 for installation is fixedly provided on the top of the heat exchange block 10, wherein the air collecting hood 11 is a square funnel structure, and the air collecting hood 11 is locked and fixed to the heat exchange block 10 by screws. The fan 12 is a duct fan, and the fan 12 is fixedly installed at the smaller port of the air collecting hood 11. Air flow is achieved by exhausting air through the air collecting hood 11 to achieve the purpose of heat dissipation and cooling. The lifting ear 13 is an L-shaped rod structure, and an installation groove is provided on the top of the lifting ear 13, and the lifting ear 13 can be installed and fixed by screwing through the installation. It has the characteristics of convenient disassembly and assembly, convenient inspection and maintenance, and the overall structure is simple and small in size.

[0027] like Figure 2 , Figure 3 and Figure 4As shown, the heat exchange structure is arranged at the end of the heat exchange block 10 away from the wind collecting cover 11 for air heat exchange. The heat exchange structure includes a main flow channel 20, a semiconductor cooling plate 21 and a side suction pipe 24. A plurality of main flow channels 20 distributed in rows are opened at the end of the heat exchange block 10. A semiconductor cooling plate 21 is arranged between two adjacent rows of main flow channels 20. A plurality of side suction pipes 24 extending obliquely toward the wind collecting cover 11 are arranged inside each row of main flow channels 20. The heat exchange block 10 forms a rectangular metal block, and the main flow channel 20 is a rectangular groove. The main flow channel 20 penetrates from one side of the heat exchange block 10. The heat exchange structure further includes a slot 22 and a side plug hole 23. A plurality of side plug holes 23 are provided on the side wall of the main flow channel 20. The side suction pipe 24 is inserted into the side plug hole 23 and extends into the main flow channel 20. A slot 22 is provided between two adjacent rows of main flow channels 20. The semiconductor cooling sheet 21 is embedded in the slot 22. The side suction pipe 24 is a square tube. The side plug hole 23 is matched with the side suction pipe 24. The side plug hole 23 extends from the outer wall of one side of the main flow channel 20 to the inner wall of the other side of the main flow channel 20. The side plug hole 23 runs through each main flow channel 20 in the same row. In the present solution, by connecting the fan 12 and the semiconductor refrigeration plate 21 to a power source, the semiconductor refrigeration plate 21 cools the main flow channel 20, and the fan 12 exhausts air from the inside of the wind collecting hood 11, and then the air on one side of the heat exchange block 10 is sucked into the main flow channel 20 and then discharged through the fan 12, so as to realize air flow, and a plurality of side suction pipes 24 extending into the main flow channel 20 are provided. Since the ports of the side suction pipes 24 are located outside the heat exchange block 10, when the air passes through the main flow channel 20, under the Venturi effect, the side suction pipes 24 will discharge the external air into the main flow channel 20 to collide with the cold air for heat exchange, and air is sucked through multiple main flow channels 20 and side suction pipes 24. The main flow channel 20 absorbs air from one end of the heat exchange block 10, and the multiple side suction pipes 24 suck air from both sides of the heat exchange block 10, which can increase the suction range of hot air and improve the cooling effect.

[0028] By providing the main flow channel 20 and the semiconductor cooling plate 21, a grid structure is formed inside the heat exchange block 10, and the semiconductor cooling plate 21 has a larger contact area with the air inside the heat exchange block 10, thereby improving the cooling effect of the semiconductor cooling plate 21 on the air flowing through the main flow channel 20.

[0029] like Figure 4As shown, side panels are fixedly installed on opposite sides of the side suction pipe 24, and the side panels form a prism structure. The inclined surfaces of the side panels face the two sides of the heat exchange block 10 respectively. A spray hole 25 is opened on the top of each side suction pipe 24, and the spray holes 25 are respectively located in each main flow channel 20. The bottom of the side suction pipe 24 fits the bottom of the main flow channel 20. There is space between the top surface of the side suction pipe 24 and the top surface of the main flow channel 20 for air flow. The height of the side suction pipe 24 is less than half of the height of the main flow channel 20, and the side panel can be integrally formed with the side suction pipe 24. In the present solution, exhaust is mainly achieved through the nozzle 25 provided at the top of the side suction pipe 24. When the air flows radially from the main flow channel 20 and passes through the inclined side suction pipe 24, the side plate can reduce the blocking effect on the air. At the same time, through the guidance of the side plate, the air flow rate above the side suction pipe 24 is relatively large, which facilitates the formation of a pressure difference between the inside and outside of the side suction pipe 24, thereby ensuring the air suction effect of the side suction pipe 24. At the same time, by providing the side suction pipe 24 and the side plate, the contact surface area between the air and the heat exchange block 10 can be further increased to enhance the cooling effect.

[0030] like Figure 4 and Figure 5 As shown, the heat exchange structure also includes a drying box 30, a loading carrier 31, an air inlet groove 32 and an exhaust hole 33. A hollow drying box 30 is arranged on each side of the heat exchange block 10. The drying box 30 is fixedly connected to the corresponding side suction pipe 24 and communicated with each other. A detachable loading carrier 31 is arranged on one side of the drying box 30. The top of the loading carrier 31 is recessed to form a loading cavity. The air inlet groove 32 and the exhaust hole 33 are respectively arranged on both sides of the loading carrier 31. The drying box 30 forms a box body with one side open. The loading carrier 31 is adapted to the drying box 30 and is slidably arranged in the cavity of the drying box 30. The side suction pipe 24 penetrates the drying box 30 and extends into the cavity of the drying box 30. A gap is left between the loading carrier 31 and the port of the side suction pipe 24. In the present solution, considering that the air needs to be dehumidified while being cooled to reduce interference with electrical components, since the side suction pipe 24 is connected to the drying box 30, the side suction pipe 24 can allow the gas in the drying box 30 to be sucked into the main flow channel 20. Before being sucked into the main flow channel 20, the air will enter the carrier 31 from the air inlet groove 32, and after being adsorbed by the water-absorbing material in the carrier 31, it will be discharged into the drying box 30 from the exhaust hole 33, thereby achieving drying of the air while being cooled, with stronger functionality and better practical effect. The water-absorbing material filled in the drying box 30 can be a highly absorbent resin, and the specific type is not restricted too much here.

[0031] By making the carrier 31 and the drying box 30 detachable, a sealing strip can be provided at the opening of the drying box 30 to ensure sealing. When replacing or regenerating the water-absorbing material, it is only necessary to pull out the carrier 31 for replacement, which is convenient for subsequent maintenance operations, has a simple structure and a long service life.

[0032] like Figure 6 As shown, an assembled switch cabinet includes a cabinet body 40, the front wall of the cabinet body 40 is open, the front wall of the cabinet body 40 is hinged with a cabinet door, the cabinet body 40 is provided with all the above-mentioned heat dissipation modules, and the ear 13 is fixedly installed on the top of the cabinet body 40 by screws, wherein the internal structure of the cabinet body 40 is not shown in the figure; In this solution, by installing a hanging ear 13 on the top or side wall of the cabinet, the air flow inside the cabinet is improved. By increasing the air intake range and improving the contact area between the air and the semiconductor refrigeration plate 21, the refrigeration and cooling effect is greatly improved, so that the working environment temperature of the electrical components inside the switch cabinet can be stably controlled, heat accumulation is suppressed, and high temperature is prevented from shortening the service life of the components. Secondly, the entire heat dissipation module is installed inside the cabinet, and the relatively closed heat dissipation placement reduces the probability of dust entering the cabinet.

[0033] like Figure 6 , Figure 7 and Figure 8 As shown, the assembly structure is arranged on the top of the cabinet 40 and is used to lock two adjacent cabinets 40; The assembly structure includes a connecting seat 50, an anti-slip groove 51, an anti-slip rod 52 and a positioning screw 53. Two symmetrically distributed connecting seats 50 are fixedly installed on the top of the heat exchange block 10. The top of the connecting seat 50 is provided with an anti-slip groove 51. The anti-slip rod 52 can be slidably inserted into the anti-slip groove 51. The anti-slip rod 52 is locked and limited by the positioning screw 53. The anti-slip groove 51 forms an arc groove. The anti-slip rod 52 forms an arc rod body with the same diameter as the anti-slip groove 51. The bottom of the anti-slip rod 52 forms an annular rib. The anti-slip groove 51 and the anti-slip rod 52 cooperate with each other. The positioning screw 53 is threadedly connected to the anti-slip rod 52. A positioning hole is provided on the inner bottom surface of the connecting seat 50, and the positioning screw 53 can be inserted into the positioning hole. In the present solution, in order to solve the difficulty in assembling and using multiple cabinets 40, a connecting seat 50 is provided at the top of the cabinet 40 near both sides. When the multiple cabinets 40 are placed side by side for assembly, the anti-slip rod 52 is first inserted into the anti-slip groove 51 of one of the connecting seats 50. After placing another cabinet 40, the anti-slip rod 52 is pushed to slide in the anti-slip groove 51. When the anti-slip rod 52 slides into the two anti-slip grooves 51, the positioning screw 53 is aligned with the positioning hole. The positioning screw 53 is rotated so that the end of the positioning screw 53 is inserted into the positioning hole to fix the position of the anti-slip rod 52. Then, the arc-shaped anti-slip rod 52 can tighten the two cabinets 40 to achieve combined use. The disassembly and assembly are convenient, the construction efficiency is high, and the locking effect of the two cabinets 40 is strong and it is not easy to fall off.

[0034] The working principle of the present invention is as follows: when assembling a plurality of cabinets 40 in parallel, first insert the anti-slip rod 52 into the anti-slip groove 51 of one of the connecting seats 50, and after placing another cabinet 40, push the anti-slip rod 52 to slide in the anti-slip groove 51. When the anti-slip rod 52 slides into the two anti-slip grooves 51, the positioning screw 53 is aligned with the positioning hole, and the positioning screw 53 is rotated so that the end of the positioning screw 53 is inserted into the positioning hole to fix the position of the anti-slip rod 52, and then the arc-shaped anti-slip rod 52 can tighten the two cabinets 40 to achieve combined use; The lugs 13 are fixed to the inner wall of the cabinet 40 by screws to realize the installation of the heat dissipation module, the water-absorbing material is filled in the carrier 31, the carrier 31 is pushed into the cavity of the drying box 30, the fan 12 and the semiconductor refrigeration sheet 21 are connected to the power supply, the semiconductor refrigeration sheet 21 cools the main flow channel 20, and the fan 12 exhausts the air inside the air collecting cover 11, and then the air on one side of the heat exchange block 10 is sucked into the main flow channel 20 and then discharged through the fan 12 to realize air flow, and a plurality of side suction pipes 24 extending into the main flow channel 20 are provided. Since the ports of the side suction pipes 24 are located outside the heat exchange block 10, the air is sucked from the main flow channel 20. When passing through, under the Venturi effect, the side suction pipe 24 will discharge the external air into the main flow channel 20 to collide with the cold air for heat exchange, and the air intake range is increased through multiple main flow channels 20 and the side suction pipe 24. Since the side suction pipe 24 is connected to the drying box 30, the side suction pipe 24 can make the gas in the drying box 30 be sucked into the main flow channel 20. Before being sucked into the main flow channel 20, the air will enter the carrier 31 from the air intake groove 32, and after being adsorbed by the water-absorbing material in the carrier 31, it will be discharged into the drying box 30 from the exhaust hole 33, so as to realize drying treatment of the air while refrigerating.

[0035] The specific specifications of the fan 12 and the semiconductor cooling plate 21 are not described in detail here, and their specific control methods and connection methods are well-known existing technologies and are not described in detail here.

[0036] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A heat dissipation module, characterized in that: include: A heat exchange block (10), wherein an air collecting hood (11) is fixedly mounted on one end of the heat exchange block (10), a fan (12) is fixedly mounted at the port of the air collecting hood (11), and a lifting lug (13) for mounting is fixedly mounted on the top of the heat exchange block (10); A heat exchange structure is provided at an end of a heat exchange block (10) away from an air collecting hood (11) for air heat exchange, the heat exchange structure comprising a main flow channel (20), a semiconductor cooling plate (21) and a side suction pipe (24), the end of the heat exchange block (10) being provided with a plurality of main flow channels (20) distributed in rows, a semiconductor cooling plate (21) being provided between two adjacent rows of main flow channels (20), and a plurality of side suction pipes (24) being provided inside each row of main flow channels (20) and extending obliquely toward the air collecting hood (11).

2. The heat dissipation module according to claim 1, characterized in that: The heat exchange block (10) is formed into a rectangular metal block, the main flow channel (20) is a rectangular groove, and the main flow channel (20) extends from one side of the heat exchange block (10) to the other side.

3. The heat dissipation module according to claim 1, characterized in that: The heat exchange structure further comprises a slot (22) and a side insertion hole (23); a plurality of side insertion holes (23) are provided on the side wall of the main flow channel (20); the side suction pipe (24) is inserted into the side insertion hole (23) and extends into the main flow channel (20); a slot (22) is provided between two adjacent rows of main flow channels (20); and the semiconductor cooling plate (21) is embedded in the slot (22).

4. The heat dissipation module according to claim 3, characterized in that: The side suction pipe (24) is a square tube, the side insertion hole (23) is adapted to fit the side suction pipe (24), the side insertion hole (23) extends from an outer wall on one side of the main flow channel (20) to an inner wall on the other side of the main flow channel (20), and the side insertion hole (23) runs through each main flow channel (20) in the same row.

5. The heat dissipation module according to claim 1, characterized in that: Side plates are fixedly mounted on opposite sides of the side suction pipe (24), the side plates forming a prism structure, the inclined surfaces of the side plates facing the two sides of the heat exchange block (10), and a spray hole (25) is formed at the top of each side suction pipe (24), the spray hole (25) being located in each main flow channel (20).

6. The heat dissipation module according to claim 1, characterized in that: The heat exchange structure further comprises a drying box (30), a loading carrier (31), an air inlet groove (32) and an exhaust hole (33). A hollow drying box (30) is arranged on each side of the heat exchange block (10). The drying box (30) is fixedly connected to the corresponding side suction pipe (24) and is in communication with each other. A detachable loading carrier (31) is arranged on one side of the drying box (30). The top of the loading carrier (31) is recessed to form a loading cavity. The air inlet groove (32) and the exhaust hole (33) are respectively arranged on both sides of the loading carrier (31).

7. The heat dissipation module according to claim 6, characterized in that: The drying box (30) forms a box body with one side open, the carrier (31) is adapted to the drying box (30) and is slidably disposed in the cavity of the drying box (30), the side suction pipe (24) penetrates the drying box (30) and extends into the cavity of the drying box (30), and a gap is left between the carrier (31) and an end of the side suction pipe (24).

8. An assembled switch cabinet, comprising a cabinet body (40), the front wall of the cabinet body (40) being open, the front wall of the cabinet body (40) being hinged with a cabinet door, characterized in that: The cabinet (40) is provided with a heat dissipation module according to any one of claims 1 to 7, and the lifting ear (13) is fixedly mounted on the top of the cabinet (40) by means of screws; The assembly structure is arranged on the top of the cabinet (40) and is used to lock two adjacent cabinets (40).

9. The assembled switch cabinet according to claim 8, characterized in that: The assembly structure comprises a connecting seat (50), an anti-slip groove (51), an anti-slip rod (52) and a positioning screw (53); two symmetrically distributed connecting seats (50) are fixedly mounted on the top of the heat exchange block (10); the anti-slip groove (51) is provided on the top of the connecting seat (50); the anti-slip rod (52) can be slidably inserted into the anti-slip groove (51); and the anti-slip rod (52) is locked and limited by the positioning screw (53).

10. The assembled switch cabinet according to claim 9, characterized in that: The anti-slip groove (51) forms an arc-shaped groove, the anti-slip rod (52) forms an arc-shaped rod body with a diameter equal to that of the anti-slip groove (51), the bottom of the anti-slip rod (52) forms an annular retaining edge, the anti-slip groove (51) and the anti-slip rod (52) cooperate with each other, the positioning screw (53) is threadedly connected to the anti-slip rod (52), and a positioning hole is provided on the inner bottom surface of the connecting seat (50), and the positioning screw (53) can be inserted into the positioning hole.

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