Laminated electronic component

Abstract

The invention relates to a laminated electronic component. The electronic component includes a laminate, a first inductor, and a second inductor. The first inductor includes a first conductor layer, a first columnar conductor, and a second columnar conductor. The second inductor includes a second conductor layer, a third columnar conductor, and a fourth columnar conductor. At least a portion of the first conductor layer extends in a direction intersecting a direction in which the first columnar conductor and the second columnar conductor are arranged at an angle other than an odd multiple of 90 DEG. At least a portion of the second conductor layer extends in a direction intersecting a direction in which the third and fourth columnar conductors are arranged at an angle other than an odd multiple of 90 DEG.

Description

Technical Field

[0001] The present invention relates to a laminated electronic component including an inductor. Background Art

[0002] One of the electronic components used in communication devices is a bandpass filter, which uses, for example, an LC resonator formed using an inductor and a capacitor.

[0003] In recent years, the market has demanded the miniaturization and space saving of small mobile communication devices, and also the miniaturization of bandpass filters used in such communication devices. As a bandpass filter suitable for miniaturization, a bandpass filter using a laminated body including a plurality of laminated dielectric layers and a plurality of conductor layers is known.

[0004] As an inductor used in a bandpass filter using a laminated body, there is known an inductor which is composed of a conductor layer and a plurality of through holes, and is wound around an axis orthogonal to the lamination direction of the plurality of dielectric layers.

[0005] A stacked filter device consisting of a secondary or tertiary LC parallel resonator is disclosed in Chinese Patent Application Publication No. 101953069A. A plurality of inductors (LC parallel resonant circuits) are arranged inside the stacked body of the stacked filter device. The plurality of inductors are respectively composed of an inductor internal electrode and two inductor through-hole electrodes arranged inside the stacked body. The inductor internal electrode and the two inductor through-hole electrodes are formed into a ring shape inside the stacked body. The plurality of inductors are arranged in the stacked body so that their respective ring surfaces are opposite. The inductor internal electrode extends along the short side direction of the stacked body.

[0006] In the laminated filter device disclosed in Chinese Patent Application Publication No. 101953069A, if the laminated body is miniaturized, the coupling between the multiple inductors may be too strong. On the other hand, in the laminated filter device disclosed in Chinese Patent Application Publication No. 101953069A, if the multiple inductors are arranged in a manner that the respective ring surfaces are not opposite, the coupling between the multiple inductors may be too weak. In this way, if the coupling between the multiple inductors is too strong or too weak, the desired characteristics may not be achieved.

[0007] The above-mentioned problem is not limited to the coupling between a plurality of inductors, but also applies to the coupling between an inductor and an arbitrary conductor. In addition, the above-mentioned problem is not limited to the bandpass filter, but also applies to all laminated electronic components including inductors. Summary of the invention

[0008] An object of the present invention is to provide a laminated electronic component including an inductor, which can achieve desired characteristics while suppressing the occurrence of problems caused by miniaturization and arrangement of the inductor.

[0009] A laminated electronic component according to a first aspect of the present invention includes:

[0010] A laminate comprising a plurality of laminated dielectric layers;

[0011] a first inductor including a first conductor layer extending along a plane intersecting a stacking direction of the plurality of dielectric layers, a first columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near one end of the first conductor layer, and a second columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near the other end of the first conductor layer;

[0012] The second inductor includes a second conductor layer extending along a plane intersecting the stacking direction, a third columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near one end of the second conductor layer, and a fourth columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near the other end of the second conductor layer.

[0013] The laminate has a first surface and a second surface located at both ends of the lamination direction, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first surface and the second surface. The first side surface and the second side surface face opposite sides to each other. The third side surface and the fourth side surface face opposite sides to each other. The first inductor is arranged at a position closer to the first side surface than the second side surface. The second inductor is arranged at a position closer to the second side surface than the first side surface. At least a portion of the first conductor layer extends in a direction intersecting with the direction in which the first columnar conductor and the second columnar conductor are arranged at an angle other than an odd multiple of 90°. At least a portion of the second conductor layer extends in a direction intersecting with the direction in which the third columnar conductor and the fourth columnar conductor are arranged at an angle other than an odd multiple of 90°.

[0014] A laminated electronic component according to a second aspect of the present invention comprises: a laminate including a plurality of laminated dielectric layers; an inductor including a conductor layer extending along a plane intersecting with a stacking direction of the plurality of dielectric layers, a first columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near one end of the conductor layer, and a second columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near the other end of the conductor layer. The conductor layer includes a first portion and a second portion extending in a direction intersecting with a direction in which the first columnar conductor and the second columnar conductor are arranged, extending in different directions, and having different lengths.

[0015] In the stacked electronic component of the first aspect of the present invention, at least a portion of the first conductor layer of the first inductor and at least a portion of the second conductor layer of the second inductor extend in the predetermined directions defined above. In the stacked electronic component of the second aspect of the present invention, the first portion and the second portion of the conductor layer of the inductor extend in the predetermined directions defined above. According to the stacked electronic components of the first and second aspects of the present invention, it is possible to achieve desired characteristics while suppressing the occurrence of problems caused by miniaturization and arrangement of the inductors.

[0016] Other objects, features and advantages of the present invention will become more apparent from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a circuit diagram showing a circuit configuration of a laminated electronic component according to a first embodiment of the present invention.

[0018] Figure 2 It is a perspective view showing the appearance of a laminated electronic component according to the first embodiment of the present invention.

[0019] Figure 3A to Figure 3C It is an explanatory diagram showing the pattern formation surface of the first to third dielectric layers in the laminated body of the laminated electronic component according to the first embodiment of the present invention.

[0020] Figure 4A It is an explanatory diagram showing the pattern formation surface of the fourth dielectric layer in the laminated body of the laminated electronic component according to the first embodiment of the present invention.

[0021] Figure 4B It is an explanatory diagram showing the pattern formation surface of the fifth to fifteenth dielectric layers in the laminated body of the laminated electronic component according to the first embodiment of the present invention.

[0022] Figure 4C It is an explanatory diagram showing a pattern-formed surface of a 16th dielectric layer in the laminated body of the laminated electronic component according to the first embodiment of the present invention.

[0023] Figure 5 It is an explanatory diagram showing a pattern-formed surface of a 17th dielectric layer in the laminated body of the laminated electronic component according to the first embodiment of the present invention.

[0024] Figure 6 It is a perspective view showing the interior of a laminated body of the laminated electronic component according to the first embodiment of the present invention.

[0025] Figure 7 It is a plan view showing a part of the interior of a laminated body of the laminated electronic component according to the first embodiment of the present invention.

[0026] Fig. 8A and Figure 8B It is an explanatory diagram showing the pattern formation surfaces of the 16th and 17th dielectric layers in the laminated body of the laminated electronic component of the comparative example.

[0027] Fig. 9 It is a perspective view showing the interior of a laminated body of a laminated electronic component according to a comparative example.

[0028] Fig.10 It is a characteristic diagram showing the pass-through attenuation characteristics of the model of the embodiment and the model of the comparative example.

[0029] Fig.11 Yes Fig.10 The characteristic diagram shown is an enlarged representation of a portion of the attenuation characteristic.

[0030] Fig.12 It is a perspective view showing the interior of a laminated body of a laminated electronic component according to a second embodiment of the present invention. DETAILED DESCRIPTION

[0031] [First embodiment]

[0032] Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings. Figure 1 , a schematic structure of a stacked electronic component (hereinafter, simply referred to as an electronic component) 1 according to a first embodiment of the present invention is described. Figure 1 : is a circuit diagram showing the circuit structure of the electronic component 1.

[0033] The electronic component 1 of the present embodiment includes a first signal terminal 2, a second signal terminal 3, a first high-pass filter 10, a second high-pass filter 20, and a low-pass filter 30. The first and second signal terminals 2 and 3 are terminals for inputting or outputting signals, respectively. That is, when a signal is input to the first signal terminal 2, a signal is output from the second signal terminal 3. When a signal is input to the second signal terminal 3, a signal is output from the first signal terminal 2.

[0034] The first high-pass filter 10, the second high-pass filter 20, and the low-pass filter 30 constitute a band-pass filter that selectively passes a signal of a frequency within a predetermined passband. The first high-pass filter 10, the low-pass filter 30, and the second high-pass filter 20 are connected in series in sequence from the first signal terminal 2 toward the second signal terminal 3. The low-pass filter 30 is arranged between the first high-pass filter 10 and the second high-pass filter 20 in terms of circuit structure. In addition, in the present application, the expression "in terms of circuit structure" is used to indicate a configuration on a circuit diagram, rather than a configuration in a physical structure.

[0035] The first high-pass filter 10, the second high-pass filter 20, and the low-pass filter 30 are LC filters each composed of at least one inductor and at least one capacitor. In the present embodiment, the first high-pass filter 10 includes a first inductor L11. The second high-pass filter 20 includes a second inductor L21. The low-pass filter 30 includes a third inductor L31 and a fourth inductor L32.

[0036] Next, refer to Figure 1 , an example of the circuit configuration of the electronic component 1 will be described. The first high-pass filter 10 includes a first inductor L11 and capacitors C11, C12, C13, and C14.

[0037] One end of the capacitor C11 is connected to the first signal terminal 2. One end of the capacitor C12 is connected to the other end of the capacitor C11. One end of the capacitor C13 is connected to one end of the capacitor C11. The other end of the capacitor C13 is connected to the other end of the capacitor C12.

[0038] One end of the first inductor L11 is connected to a connection point between the capacitor C11 and the capacitor C12. The other end of the first inductor L11 is grounded. The capacitor C14 is connected in parallel with the first inductor L11.

[0039] The second high-pass filter 20 includes a second inductor L21 and capacitors C21 , C22 , C23 , and C24 .

[0040] One end of the capacitor C21 is connected to the second signal terminal 3. One end of the capacitor C22 is connected to the other end of the capacitor C21. One end of the capacitor C23 is connected to one end of the capacitor C21. The other end of the capacitor C23 is connected to the other end of the capacitor C22.

[0041] One end of the second inductor L21 is connected to a connection point between the capacitor C21 and the capacitor C22. The other end of the second inductor L21 is grounded. The capacitor C24 is connected in parallel with the second inductor L21.

[0042] The low-pass filter 30 includes a third inductor L31 , a fourth inductor L32 , and capacitors C31 , C32 , C33 , C34 , and C35 .

[0043] One end of the capacitor C31 is connected to the other end of the capacitor C12 of the first high pass filter 10 . One end of the capacitor C32 is connected to the other end of the capacitor C31 . The other end of the capacitor C32 is connected to the other end of the capacitor C22 of the second high pass filter 20 .

[0044] One end of the third inductor L31 is connected to the connection point between the capacitor C12 and the capacitor C31. One end of the fourth inductor L32 is connected to the other end of the third inductor L31. The other end of the fourth inductor L32 is connected to the connection point between the capacitor C22 and the capacitor C32.

[0045] One end of the capacitor C33 is connected to the connection point between the capacitor C12 and the capacitor C31. One end of the capacitor C34 is connected to the connection point between the third inductor L31 and the fourth inductor L32 and the connection point between the capacitor C31 and the capacitor C32. One end of the capacitor C35 is connected to the connection point between the capacitor C22 and the capacitor C32. The other ends of the capacitors C33 to C35 are grounded.

[0046] Next, refer to Figure 2 , other structures of the electronic component 1 are described. Figure 2 It is a perspective view showing the appearance of the electronic component 1 .

[0047] The electronic component 1 further includes a laminate 50 including a plurality of laminated dielectric layers and a plurality of conductors (a plurality of conductor layers and a plurality of through holes). The first signal terminal 2 , the second signal terminal 3 , the first high pass filter 10 , the second high pass filter 20 , and the low pass filter 30 are integrated with the laminate 50 .

[0048] The stacked body 50 has a first surface 50A and a second surface 50B located at both ends of the stacking direction T of the plurality of dielectric layers, and four side surfaces 50C to 50F connecting the first surface 50A and the second surface 50B. The side surfaces 50C and 50D face opposite sides to each other, and the side surfaces 50E and 50F also face opposite sides to each other. The side surfaces 50C to 50F may also be perpendicular to the first surface 50A and the second surface 50B.

[0049] Here, if Figure 2 As shown, the X direction, Y direction, and Z direction are defined. The X direction, Y direction, and Z direction are orthogonal to each other. In this embodiment, a direction parallel to the stacking direction T is set as the Z direction. In addition, the direction opposite to the X direction is set as the -X direction, the direction opposite to the Y direction is set as the -Y direction, and the direction opposite to the Z direction is set as the -Z direction. In addition, the expression "when observed from the stacking direction T" means observing the object from a position away from the Z direction or the -Z direction.

[0050] like Figure 2As shown, the first surface 50A is located at one end of the stack 50 in the -Z direction. The first surface 50A is also the bottom surface of the stack 50. The second surface 50B is located at one end of the stack 50 in the Z direction. The second surface 50B is also the upper surface of the stack 50. The side surface 50C is located at one end of the stack 50 in the -X direction. The side surface 50D is located at one end of the stack 50 in the X direction. The side surface 50E is located at one end of the stack 50 in the -Y direction. The side surface 50F is located at one end of the stack 50 in the Y direction.

[0051] The side surface 50C and the side surface 50D are arranged in a direction parallel to the X direction. The direction parallel to the X direction corresponds to the "second direction" in the present invention. In addition, the side surface 50E and the side surface 50F are arranged in a direction parallel to the Y direction. The direction parallel to the Y direction corresponds to the "first direction" in the present invention.

[0052] Electronic component 1 further includes a plurality of electrodes 111, 112, and 113 provided on first surface 50A of laminate 50. Electrode 111 extends in the Y direction near side surface 50C. Electrode 112 extends in the Y direction near side surface 50D. Electrode 113 is disposed between electrodes 111 and 112.

[0053] The electrode 111 corresponds to the first signal terminal 2, and the electrode 112 corresponds to the second signal terminal 3. Therefore, the first and second signal terminals 2 and 3 are provided on the first surface 50A of the laminate 50. The electrode 113 is grounded.

[0054] Next, refer to Figure 3A to Figure 5 , an example of a plurality of dielectric layers and a plurality of conductors constituting a laminate 50 is described. In this example, the laminate 50 includes 17 laminated dielectric layers. Hereinafter, the 17 dielectric layers are referred to as the 1st to 17th dielectric layers in order from the bottom. In addition, the 1st to 17th dielectric layers are represented by reference numerals 51 to 67.

[0055] exist Figure 3A to Figure 4C In FIG. 1 , a plurality of circles represent a plurality of through holes. A plurality of through holes are formed in each of the dielectric layers 51 to 66. The plurality of through holes are formed by filling a conductor paste in a hole for the through hole. The plurality of through holes are connected to an electrode, a conductor layer, or another through hole.

[0056] exist Figure 3A to Figure 4C In the figure, a plurality of specific through holes among the plurality of through holes are denoted by reference numerals. The connection relationship between each of the plurality of specific through holes and the conductor layer or other through holes will be described in the state where the first to seventeenth dielectric layers 51 to 67 are stacked.

[0057] Figure 3AThe pattern formation surface of the first dielectric layer 51 is shown. Electrodes 111 to 113 are formed on the pattern formation surface of the dielectric layer 51 .

[0058] Figure 3B : shows the pattern forming surface of the second dielectric layer 52. Conductive layers 521, 522, 523, 524, 525, 526, and 527 are formed on the pattern forming surface of the dielectric layer 52. The conductive layers 522 and 524 are connected to the conductive layer 527. Figure 3B In FIG. 5 , the boundary between the conductor layer 522 and the conductor layer 527 and the boundary between the conductor layer 524 and the conductor layer 527 are indicated by dotted lines, respectively.

[0059] Figure 3C The pattern formation surface of the third dielectric layer 53 is shown. Conductive layers 531 , 532 , 533 , 534 , and 535 are formed on the pattern formation surface of the dielectric layer 53 .

[0060] Figure 3C The through hole denoted by the symbol 53T1a is connected to the conductor layer 531. In the following description, the through hole denoted by the symbol 53T1a is simply referred to as the through hole 53T1a. In addition, through holes denoted by symbols other than the through hole 53T1a are also described in the same manner as the through hole 53T1a.

[0061] Figure 3C The via 53T2 a shown is connected to the conductor layer 532 . Figure 3C The vias 53T1 b and 53T2 b shown are connected to the conductor layer 535 . Figure 3C The two vias 53T3 a shown are connected to the conductor layer 533 . Figure 3C The two vias 53T4 a shown are connected to the conductor layer 534 .

[0062] Figure 4A : shows the pattern forming surface of the fourth dielectric layer 54. Conductive layers 541, 542, 543, 544, and 545 are formed on the pattern forming surface of the dielectric layer 54. The conductive layers 543 and 544 are connected to the conductive layer 545. Figure 4A In FIG. 5 , the boundary between the conductor layer 543 and the conductor layer 545 and the boundary between the conductor layer 544 and the conductor layer 545 are indicated by dotted lines, respectively.

[0063] Through holes 53T1a, 53T1b, 53T2a, 53T2b are respectively Figure 4A The through holes 54T1a, 54T1b, 54T2a, and 54T2b are connected. Figure 4A The two through holes 54T3a are connected. The two through holes 53T4a are connected to Figure 4A The two through holes 54T4a are shown connected. Figure 4AThe two through holes 54T3b and Figure 4A The two vias 54T4 b shown are connected to the conductor layer 545 .

[0064] Figure 4B The pattern forming surfaces of the dielectric layers 55 to 65 of the 5th to 15th layers are shown. The through holes 54T1a, 54T1b, 54T2a, and 54T2b are connected to the through holes 55T1a, 55T1b, 55T2a, and 55T2b formed in the dielectric layer 55, respectively. The two through holes 54T3a, two through holes 54T3b, two through holes 54T4a, and two through holes 54T4b are connected to the two through holes 55T3a, two through holes 55T3b, two through holes 55T4a, and two through holes 55T4b formed in the dielectric layer 55, respectively. In addition, in the dielectric layers 55 to 65, the through holes with the same reference numerals adjacent to each other are connected to each other.

[0065] Figure 4C 1 shows the pattern formation surface of the dielectric layer 66 of the 16th layer. Conductive layers 661, 662, 663, and 664 for inductors are formed on the pattern formation surface of the dielectric layer 66. The conductive layer 661 has a first end and a second end located at both ends of the long side direction of the conductive layer 661. The conductive layer 662 has a first end and a second end located at both ends of the long side direction of the conductive layer 662. The conductive layer 663 has a first end and a second end located at both ends of the long side direction of the conductive layer 663. The conductive layer 664 has a first end and a second end located at both ends of the long side direction of the conductive layer 664.

[0066] The through hole 55T1a formed in the dielectric layer 65 and Figure 4C The through hole 66T1a shown is connected to the vicinity of the first end of the conductor layer 661. The through hole 55T1b formed in the dielectric layer 65 and Figure 4C The through hole 66T1b shown is connected to the vicinity of the second end of the conductor layer 661. The through hole 55T2a formed in the dielectric layer 65 and Figure 4C The through hole 66T2a shown is connected to the vicinity of the first end of the conductor layer 662. The through hole 55T2b formed in the dielectric layer 65 and Figure 4C The illustrated through-hole 66T2 b is connected to a portion near the second end of the conductor layer 662 .

[0067] The two through holes 55T3a formed in the dielectric layer 65 and Figure 4C The two through holes 66T3a shown are connected to the vicinity of the first end of the conductor layer 663. The two through holes 55T3b formed in the dielectric layer 65 and Figure 4C The two through holes 66T3b shown are connected to the vicinity of the second end of the conductor layer 663. The two through holes 55T4a formed in the dielectric layer 65 and Figure 4CThe two through holes 66T4a shown are connected to the vicinity of the first end of the conductor layer 664. The two through holes 55T4b formed in the dielectric layer 65 and Figure 4C The two vias 66T4 b shown are connected to the vicinity of the second end of the conductor layer 664 .

[0068] Figure 5 1 shows the pattern formation surface of the 17th layer dielectric layer 67. Conductor layers 671, 672, 673, and 674 for inductors are formed on the pattern formation surface of the dielectric layer 67. The conductor layer 671 has a first end and a second end located at both ends of the long side direction of the conductor layer 671. The conductor layer 672 has a first end and a second end located at both ends of the long side direction of the conductor layer 672. The conductor layer 673 has a first end and a second end located at both ends of the long side direction of the conductor layer 673. The conductor layer 674 has a first end and a second end located at both ends of the long side direction of the conductor layer 674.

[0069] The through hole 66T1a is connected to the portion near the first end of the conductor layer 671. The through hole 66T1b is connected to the portion near the second end of the conductor layer 671. The through hole 66T2a is connected to the portion near the first end of the conductor layer 672. The through hole 66T2b is connected to the portion near the second end of the conductor layer 672.

[0070] The two through holes 66T3a are connected to the vicinity of the first end of the conductor layer 673. The two through holes 66T3b are connected to the vicinity of the second end of the conductor layer 673. The two through holes 66T4a are connected to the vicinity of the first end of the conductor layer 674. The two through holes 66T4b are connected to the vicinity of the second end of the conductor layer 674.

[0071] The laminate 50 is constructed by laminating the first to seventeenth dielectric layers 51 to 67 such that the patterned surface of the first dielectric layer 51 becomes the first surface 50A of the laminate 50 and the surface opposite to the patterned surface of the seventeenth dielectric layer 67 becomes the second surface 50B of the laminate 50 .

[0072] When the first to seventeenth dielectric layers 51 to 67 are stacked, Figure 3A to Figure 4C The plurality of through holes shown are respectively connected to the conductor layers overlapped in the stacking direction T or other through holes overlapped in the stacking direction T. In addition, Figure 3A to Figure 4C Among the plurality of through holes shown, the through holes located in the electrode or the conductor layer are connected to the electrode or the conductor layer.

[0073] Figure 6 2 shows the interior of a laminate 50 formed by laminating the first to seventeenth dielectric layers 51 to 67. Figure 6 As shown, inside the stacked body 50, there are stacked Figure 3A to Figure 5Multiple conductor layers and multiple through-holes are shown.

[0074] The following, Figure 1 The components of the circuit of the electronic component 1 shown in FIG. Figure 3A to Figure 5 The corresponding relationship of the components inside the laminated body 50 shown will be described. First, the first high pass filter 10 will be described. The first inductor L11 is composed of the conductor layers 661 and 671 for inductors and the through holes 53T1a, 53T1b, 54T1a, 54T1b, 55T1a, 55T1b, 66T1a, and 66T1b.

[0075] Capacitor C11 is composed of conductor layers 521, 531, and dielectric layer 52 between these conductor layers. Capacitor C12 is composed of conductor layers 531, 541, and dielectric layer 53 between these conductor layers. Capacitor C13 is composed of conductor layers 521, 533, and dielectric layer 52 between these conductor layers. Capacitor C14 is composed of conductor layers 522, 531, and dielectric layer 52 between these conductor layers.

[0076] Next, the components of the second high-pass filter 20 are described. The second inductor L21 is composed of the inductor conductor layers 662 and 672 and the through holes 53T2a, 53T2b, 54T2a, 54T2b, 55T2a, 55T2b, 66T2a, and 66T2b.

[0077] Capacitor C21 is composed of conductor layers 523, 532, and dielectric layer 52 between these conductor layers. Capacitor C22 is composed of conductor layers 532, 542, and dielectric layer 53 between these conductor layers. Capacitor C23 is composed of conductor layers 523, 534, and dielectric layer 52 between these conductor layers. Capacitor C24 is composed of conductor layers 524, 532, and dielectric layer 52 between these conductor layers.

[0078] Next, the components of the low-pass filter 30 are described. The third inductor L31 is composed of the conductor layers 663 and 673 for inductors and the through holes 53T3a, 54T3a, 54T3b, 55T3a, 55T3b, 66T3a, and 66T3b. The fourth inductor L32 is composed of the conductor layers 664 and 674 for inductors and the through holes 53T4a, 54T4a, 54T4b, 55T4a, 55T4b, 66T4a, and 66T4b.

[0079] The capacitor C31 is composed of the conductor layers 533 and 543 and the dielectric layer 53 between these conductor layers. The capacitor C32 is composed of the conductor layers 534 and 544 and the dielectric layer 53 between these conductor layers.

[0080] Capacitor C33 is composed of conductor layers 525, 533, 535 and dielectric layer 52 between these conductor layers. Capacitor C34 is composed of conductor layers 535, 545 and dielectric layer 53 between these conductor layers. Capacitor C35 is composed of conductor layers 526, 534, 535 and dielectric layer 52 between these conductor layers.

[0081] Next, refer to Figure 1 to Figure 7 , structural features of the electronic component 1 of this embodiment will be described. Figure 7 is a plan view showing a portion of the interior of the stacked body 50. Figure 7 The interior of the stacked body 50 as viewed from the second surface 50B side of the stacked body 50 is shown.

[0082] First, the features related to the first to fourth inductors L11, L21, L31, and L32 are described. Figure 7 As shown, the first inductor L11 of the first high pass filter 10 is disposed closer to the side surface 50C of the laminate 50 than to the side surface 50D of the laminate 50. In addition, the first inductor L11 is disposed closer to the side surface 50E of the laminate 50 than to the side surface 50F of the laminate 50.

[0083] like Figure 7 As shown in FIG. 1 , the second inductor L21 of the second high-pass filter 20 is disposed at a position closer to the side surface 50D than to the side surface 50C. In addition, the second inductor L21 is disposed at a position closer to the side surface 50F than to the side surface 50E.

[0084] The first inductor L11 and the second inductor L21 are arranged in a direction from a first corner portion located at a position where the side surface 50C and the side surface 50E intersect toward a second corner portion located at a position where the side surface 50D and the side surface 50F intersect. Figure 7 As shown in FIG. 1 , the third inductor L31 and the fourth inductor L32 of the low-pass filter 30 are arranged in a direction intersecting the direction in which the first inductor L11 and the second inductor L21 are arranged. In this embodiment, in particular, the third inductor L31 is arranged between the first inductor L11 and the side surface 50F, and between the second inductor L21 and the side surface 50C. The fourth inductor L32 is arranged between the first inductor L11 and the side surface 50D, and between the second inductor L21 and the side surface 50E.

[0085] The first inductor L11, the second inductor L21, the third inductor L31, and the fourth inductor L32 are inductors wound around an axis extending in a direction perpendicular to the stacking direction T. Here, a columnar structure formed by connecting a plurality of through holes in series is referred to as a columnar conductor. The columnar conductor extends in a direction parallel to the stacking direction T. The first to fourth inductors L11, L21, L31, and L32 each include at least one conductor layer and a plurality of columnar conductors.

[0086] In addition, the inductors L11, L21, L31, and L32 are also rectangular or substantially rectangular windings. In rectangular or substantially rectangular windings, the number of turns may be counted 1 / 4 times on one side of the rectangle when the winding is considered as a rectangle. In the present embodiment, the number of turns of the inductors L11, L21, L31, and L32 is 3 / 4 times.

[0087] The first inductor L11 includes a conductor layer 661, a first columnar conductor T1a connected to a portion near the first end of the conductor layer 661, and a second columnar conductor T1b connected to a portion near the second end of the conductor layer 661. The first columnar conductor T1a is formed by connecting through holes 53T1a, 54T1a, and 55T1a in series. The second columnar conductor T1b is formed by connecting through holes 53T1b, 54T1b, and 55T1b in series. The first inductor L11 is wound around a first axis orthogonal to the stacking direction T to form a first opening surrounded by the conductor layer 661, the first columnar conductor T1a, and the second columnar conductor T1b.

[0088] The first inductor L11 further includes a conductor layer 671 and through holes 66T1a and 66T1b that electrically connect the conductor layer 661 and the conductor layer 671. Figure 7 In the embodiment, the conductor layer 671 and the through holes 66T1a and 66T1b in the first inductor L11 are omitted.

[0089] The second inductor L21 includes a conductor layer 662, a third columnar conductor T2a connected to a portion near the first end of the conductor layer 662, and a fourth columnar conductor T2b connected to a portion near the second end of the conductor layer 662. The third columnar conductor T2a is formed by connecting through holes 53T2a, 54T2a, and 55T2a in series. The fourth columnar conductor T2b is formed by connecting through holes 53T2b, 54T2b, and 55T2b in series. The second inductor L21 is wound around a second axis orthogonal to the stacking direction T to form a second opening surrounded by the conductor layer 662, the third columnar conductor T2a, and the fourth columnar conductor T2b.

[0090] The second inductor L21 further includes a conductor layer 672, and through holes 66T2a and 66T2b that electrically connect the conductor layer 662 and the conductor layer 672. Figure 7 In the embodiment, the conductor layer 672 and the through holes 66T2a and 66T2b in the second inductor L21 are omitted.

[0091] The third inductor L31 includes a conductor layer 663, two columnar conductors T3a respectively connected to the vicinity of the first end of the conductor layer 663, and two columnar conductors T3b respectively connected to the vicinity of the second end of the conductor layer 663. The two columnar conductors T3a are formed by connecting the through holes 53T3a, 54T3a, and 55T3a in series. The two columnar conductors T3b are formed by connecting the through holes 54T3b and 55T3b in series. The third inductor L31 is wound around a third axis orthogonal to the stacking direction T to form a third opening surrounded by the conductor layer 663, the two columnar conductors T3a, and the two columnar conductors T3b.

[0092] The third inductor L31 further includes a conductor layer 673, and through holes 66T3a and 66T3b that electrically connect the conductor layer 663 and the conductor layer 673. Figure 7 In the embodiment, the conductor layer 673 and the through holes 66T3a and 66T3b in the third inductor L31 are omitted.

[0093] The fourth inductor L32 includes a conductor layer 664, two columnar conductors T4a respectively connected to the vicinity of the first end of the conductor layer 664, and two columnar conductors T4b respectively connected to the vicinity of the second end of the conductor layer 664. The two columnar conductors T4a are formed by connecting the through holes 53T4a, 54T4a, and 55T4a in series. The two columnar conductors T4b are formed by connecting the through holes 54T4b and 55T4b in series. The fourth inductor L32 is wound around a fourth axis orthogonal to the stacking direction T to form a fourth opening surrounded by the conductor layer 664, the two columnar conductors T4a, and the two columnar conductors T4b.

[0094] The fourth inductor L32 further includes a conductor layer 674, and through holes 66T4a and 66T4b that electrically connect the conductor layer 664 and the conductor layer 674. Figure 7 In the embodiment of the present invention, the conductor layer 674 and the through holes 66T4a and 66T4b in the fourth inductor L32 are omitted.

[0095] The first inductor L11 and the second inductor L21 are configured so that the first opening portion and the second opening portion do not overlap and the first axis and the second axis do not overlap when viewed in a direction parallel to the Y direction. The third inductor L31 and the fourth inductor L32 are configured so that the third opening portion and the fourth opening portion do not overlap and the third axis and the fourth axis do not overlap when viewed in a direction parallel to the Y direction.

[0096] In addition, the first inductor L11 and the third inductor L31 are configured so that the first opening portion and the third opening portion overlap when viewed in a direction parallel to the Y direction. The first inductor L11 and the third inductor L31 may be configured so that the first axis and the third axis overlap when viewed in a direction parallel to the Y direction, or may be configured so that the first axis and the third axis do not overlap. The first axis and the third axis may be parallel to each other or may not be parallel to each other.

[0097] In addition, the second inductor L21 and the fourth inductor L32 are configured so that the second opening portion overlaps with the fourth opening portion when viewed in a direction parallel to the Y direction. The second inductor L21 and the fourth inductor L32 may be configured so that the second axis overlaps with the fourth axis when viewed in a direction parallel to the Y direction, or may be configured so that the second axis does not overlap with the fourth axis. The second axis and the fourth axis may be parallel to each other or may not be parallel to each other.

[0098] Next, refer to Figure 7 , the features related to the conductor layer 661 of the first inductor L11 and the conductor layer 662 of the second inductor L21 are described. The conductor layers 661 and 662 extend along a plane intersecting the stacking direction T, that is, a pattern formation surface of the dielectric layer 66 .

[0099] At least a portion of the conductor layer 661 extends in a direction that intersects with the direction in which the first columnar conductors T1a and the second columnar conductors T1b are arranged (hereinafter referred to as the first arrangement direction) at an angle other than an odd multiple of 90°. That is, at least a portion of the conductor layer 661 extends in a direction that intersects with the first arrangement direction, and does not extend in the first arrangement direction and in a direction orthogonal to the first arrangement direction. In addition, in the case where "at least a portion of the conductor layer 661" is "the entire conductor layer 661", the conductor layer 661 may also include a plurality of portions extending in a direction intersecting with the first arrangement direction. In addition, in the case where "at least a portion of the conductor layer 661" is "a portion of the conductor layer 661", the conductor layer 661 may also include at least one of a portion extending in the first arrangement direction and a portion extending in a direction orthogonal to the first arrangement direction.

[0100] In the present embodiment, in particular, the conductor layer 661 includes a first portion 661A including a first end of the conductor layer 661 and a second portion 661B including a second end of the conductor layer 661 as "at least a portion of the conductor layer 661". The first portion 661A extends in one direction so as to approach the side surface 50F as it moves away from the first end of the conductor layer 661. The second portion 661B extends in one direction so as to approach the side surface 50F as it moves away from the second end of the conductor layer 661. In addition, the second portion 661B has a different length from the first portion 661A. In the present embodiment, in particular, the second portion 661B is longer than the first portion 661A.

[0101] The conductive layer 661 further includes a bent portion 661C extending in a bent manner. In this embodiment, the first portion 661A is connected to one end of the bent portion 661C, and the second portion 661B is connected to the other end of the bent portion 661C. Figure 7 In FIG. 6 , the boundary between the first portion 661A and the curved portion 661C, and the boundary between the second portion 661B and the curved portion 661C are indicated by dotted lines, respectively.

[0102] When viewed from the stacking direction T, the conductor layer 661 has a shape that protrudes in the direction from the side surface 50E toward the side surface 50F as a whole.

[0103] At least a portion of the conductor layer 662 extends in a direction that intersects with the direction in which the third columnar conductor T3a and the fourth columnar conductor T4b are arranged at an angle other than an odd multiple of 90° (hereinafter referred to as the second arrangement direction). That is, at least a portion of the conductor layer 662 extends in a direction that intersects with the second arrangement direction, and does not extend in the second arrangement direction and in a direction orthogonal to the second arrangement direction. In addition, in the case where "at least a portion of the conductor layer 662" is "the entire conductor layer 662", the conductor layer 662 may also include a plurality of portions extending in a direction intersecting with the second arrangement direction. In addition, in the case where "at least a portion of the conductor layer 662" is "a portion of the conductor layer 662", the conductor layer 662 may also include at least one of a portion extending in the second arrangement direction and a portion extending in a direction orthogonal to the second arrangement direction.

[0104] In the present embodiment, the conductor layer 662 includes, as “at least a portion of the conductor layer 662”, a third portion 662A including a first end of the conductor layer 662 and a fourth portion 662B including a second end of the conductor layer 662. The third portion 662A extends in one direction so as to approach the side surface 50E as it moves away from the first end of the conductor layer 662. The fourth portion 662B extends in one direction so as to approach the side surface 50E as it moves away from the second end of the conductor layer 662. In addition, the fourth portion 662B has a different length from the third portion 662A. In the present embodiment, the fourth portion 662B is longer than the third portion 662A.

[0105] The conductive layer 662 further includes a bent portion 662C extending in a bent manner. In this embodiment, the third portion 662A is connected to one end of the bent portion 662C, and the fourth portion 662B is connected to the other end of the bent portion 662C. Figure 7 In FIG. 6 , a boundary between the third portion 662A and the curved portion 662C, and a boundary between the fourth portion 662B and the curved portion 662C are indicated by dotted lines, respectively.

[0106] When viewed in the stacking direction T, the conductor layer 662 has a shape that protrudes in the direction from the side surface 50F toward the side surface 50C as a whole.

[0107] The first portion 661A of the conductor layer 661 and the third portion 662A of the conductor layer 662 each include a straight portion extending substantially straight. The straight portion of the first portion 661A and the straight portion of the third portion 662A may be parallel or substantially parallel to each other.

[0108] The second portion 661B of the conductor layer 661 and the fourth portion 662B of the conductor layer 662 each include a straight portion extending substantially in a straight line. The straight portion of the second portion 661B and the straight portion of the fourth portion 662B may also be parallel or substantially parallel to each other. Figure 7 In the example shown, the straight portion of the second portion 661B and the straight portion of the fourth portion 662B are parallel to each other.

[0109] In this embodiment, the distance from the second portion 661B to the fourth portion 662B is shorter than the distance from the first portion 661A to the third portion 662A. In addition, there is no other conductor between the portion of the second portion 661B closer to the fourth portion 662B and the portion of the fourth portion 662B closer to the second portion 661B. Therefore, the above-mentioned portion of the second portion 661B and the above-mentioned portion of the fourth portion 662B are opposite to each other. Thus, a portion of the first inductor L11 and a portion of the second inductor L21 are also opposite to each other.

[0110] When viewed from the stacking direction T, the conductor layer 661 and the conductor layer 662 have a shape that approaches each other from the outer periphery (side surfaces 50E and 50F) of the stacked body 50 as a whole. In addition, in each of the conductor layer 661 and the conductor layer 662, the position where the interval between the conductor layer 661 and the conductor layer 662 becomes the smallest in the direction parallel to the Y direction exists between the first end and the second end.

[0111] The shape of the conductor layer 671 is the same as or similar to the shape of the conductor layer 661. In addition, the configuration of the conductor layer 671 is the same as or substantially the same as the configuration of the conductor layer 661, except for the position in the stacking direction T. In addition, the shape of the conductor layer 672 is the same as or similar to the shape of the conductor layer 662. In addition, the configuration of the conductor layer 672 is the same as or substantially the same as the configuration of the conductor layer 662, except for the position in the stacking direction T. When the conductor layers 661, 662 and the columnar conductors T1a, T1b, T2a, T2b are replaced by the conductor layers 671, 672 and the through holes 66T1a, 66T1b, 66T2a, 66T2b, respectively, the above description about the conductor layers 661, 662 is also applicable to the conductor layers 671, 672.

[0112] Next, refer to Figure 7 , the features related to the first and second columnar conductors T1a, T1b of the first inductor L11 and the third and fourth columnar conductors T2a, T2b of the second inductor L21 are described. Figure 7 As shown in FIG. 1 , the first columnar conductor T1a and the second columnar conductor T1b are arranged along the side surface 50E. The second columnar conductor T1b is arranged at a position farther from the side surface 50E than the first columnar conductor T1a. Therefore, the direction in which the first columnar conductor T1a and the second columnar conductor T1b are arranged, that is, the first arrangement direction is inclined relative to the side surface 50E. In addition, the first arrangement direction is inclined relative to each of the X direction and the Y direction.

[0113] like Figure 7 As shown in FIG. 1 , the third columnar conductor T2a and the fourth columnar conductor T2b are arranged along the side surface 50F. The fourth columnar conductor T2b is arranged at a position farther from the side surface 50F than the third columnar conductor T2a. Therefore, the direction in which the third columnar conductor T2a and the fourth columnar conductor T2b are arranged, that is, the second arrangement direction is inclined relative to the side surface 50F. In addition, the second arrangement direction is inclined relative to each of the X direction and the Y direction.

[0114] The second columnar conductor T1b and the fourth columnar conductor T2b are arranged between the first columnar conductor T1a and the third columnar conductor T2a in a direction parallel to the X direction. The interval between the second columnar conductor T1b and the fourth columnar conductor T2b in a direction parallel to the Y direction is smaller than the interval between the first columnar conductor T1a and the third columnar conductor T2a in a direction parallel to the Y direction.

[0115] Next, the function and effect of the electronic component 1 of the present embodiment will be described. In the present embodiment, at least a portion of the conductor layer 661 of the first inductor L11 extends in a direction intersecting the first arrangement direction (the direction in which the first columnar conductor T1a and the second columnar conductor T1b are arranged). In the present embodiment, in particular, the first portion 661A and the second portion 661B of the conductor layer 661 correspond to the above-mentioned "at least a portion of the conductor layer 661", respectively. Therefore, according to the present embodiment, the conductor layer 661 can be extended compared to the case where the conductor layer 661 extends in the first arrangement direction, and as a result, the inductance of the first inductor L11 can be increased.

[0116] Similarly, in the present embodiment, at least a portion of the conductor layer 662 of the second inductor L21 extends in a direction intersecting the second arrangement direction (the direction in which the third columnar conductors T2a and the fourth columnar conductors T2b are arranged). In the present embodiment, in particular, the third portion 662A and the fourth portion 662B of the conductor layer 662 correspond to the above-mentioned "at least a portion of the conductor layer 662". Thus, according to the present embodiment, the conductor layer 662 can be extended similarly to the conductor layer 661, and as a result, the inductance of the second inductor L21 can be increased.

[0117] In addition, according to the present embodiment, the coupling between the first inductor L11 and other conductors in the laminate 50 can be adjusted by the conductor layer 661, and the coupling between the second inductor L21 and other conductors in the laminate 50 can be adjusted by the conductor layer 662. In the present embodiment, in particular, the coupling between the first inductor L11 and the second inductor L21 can be adjusted by the conductor layers 661 and 662. This effect will be described in detail below.

[0118] In the present embodiment, the first inductor L11 and the second inductor L21 are arranged so that the first opening and the second opening do not overlap and the first axis and the second axis do not overlap when viewed in a direction parallel to the Y direction. Thus, according to the present embodiment, it is possible to prevent the coupling between the first inductor L11 and the second inductor L21 from becoming too strong as the laminate 50 is miniaturized.

[0119] In the present embodiment, the conductor layers 661 and 662 are shaped close to each other, so that the coupling between the first inductor L11 and the second inductor L21 can be enhanced. As a result, the coupling between the first inductor L11 and the second inductor L21 can be prevented from being too weak due to the arrangement of the first inductor L11 and the second inductor L21.

[0120] In the present embodiment, in particular, the second portion 661B of the conductor layer 661 and the fourth portion 662B of the conductor layer 662 each include a straight line portion extending substantially in a straight line. Here, an imaginary straight line intersecting both the straight line portion of the second portion 661B and the straight line portion of the fourth portion 662B is assumed. In the present embodiment, when viewed from a direction parallel to the imaginary straight line, the second portion 661B of the conductor layer 661 and the fourth portion 662B of the conductor layer 662 overlap each other. In addition, the straight line portion of the second portion 661B and the straight line portion of the fourth portion 662B are parallel or substantially parallel to each other. Thus, according to the present embodiment, the coupling between the first inductor L11 and the second inductor L21 can be enhanced.

[0121] In addition, in the present embodiment, the first and second inductors L11 and L21 are arranged in a posture such that the interval between the second columnar conductor T1b and the fourth columnar conductor T2b is reduced. Specifically, the interval between the second columnar conductor T1b and the fourth columnar conductor T2b in the direction parallel to the Y direction is made smaller than the interval between the first columnar conductor T1a and the third columnar conductor T2a in the direction parallel to the Y direction. Therefore, according to the present embodiment, the coupling between the first inductor L11 and the second inductor L21 can also be enhanced.

[0122] As described above, according to the present embodiment, it is possible to achieve desired characteristics while suppressing the occurrence of problems due to the miniaturization of the laminated body 50 and the arrangement of the first and second inductors L11 and L21.

[0123] Next, the effect of this embodiment will be described in more detail by comparing with the electronic component 101 of the comparative example. First, the structure of the electronic component 101 of the comparative example will be described in detail. Figure 1 The circuit structure of the electronic component 1 of the present embodiment shown is the same. In addition, the physical structure of the electronic component 101 of the comparative example is the same as the physical structure of the electronic component 1 except for the points described below.

[0124] Similar to electronic component 1, electronic component 101 of the comparative example includes laminate 50. However, laminate 50 of electronic component 101 of the comparative example includes dielectric layers 166 and 167 instead of dielectric layers 66 and 67 in the present embodiment. Dielectric layer 166 is the 16th dielectric layer, and dielectric layer 167 is the 17th dielectric layer.

[0125] Fig. 8A The figure shows the pattern formation surface of the dielectric layer 166 of the 16th layer. Conductor layers 1661, 1662, 1663, and 1664 for inductors are formed on the pattern formation surface of the dielectric layer 166. The conductor layer 1661 has a first end and a second end located at both ends of the long side direction of the conductor layer 1661. The conductor layer 1662 has a first end and a second end located at both ends of the long side direction of the conductor layer 1662. The conductor layer 1663 has a first end and a second end located at both ends of the long side direction of the conductor layer 1663. The conductor layer 1664 has a first end and a second end located at both ends of the long side direction of the conductor layer 1664.

[0126] The through hole 55T1a (see Figure 4B )and Fig. 8A The through hole 166T1a shown is connected to the vicinity of the first end of the conductor layer 1661. The through hole 55T1b (see Figure 4B )and Fig. 8A The through hole 166T1b shown is connected to the vicinity of the second end of the conductor layer 1661. The through hole 55T2a (see Figure 4B )and Fig. 8A The through hole 166T2a shown is connected to the vicinity of the first end of the conductor layer 1662. The through hole 55T2b (see Figure 4B )and Fig. 8A The illustrated through-hole 166T2 b is connected to a portion near the second end of the conductor layer 1662 .

[0127] The two through holes 55T3a (see Figure 4B )and Fig. 8A The two through holes 166T3a shown are connected to the vicinity of the first end of the conductor layer 1663. The two through holes 55T3b (see Figure 4B )and Fig. 8A The two through holes 166T3b shown are connected to the vicinity of the second end of the conductor layer 1663. The two through holes 55T4a (see Figure 4B )and Fig. 8AThe two through holes 166T4a shown are connected to the vicinity of the first end of the conductor layer 1664. The two through holes 55T4b (see Figure 4B )and Fig. 8A The two vias 166T4 b shown are connected to the vicinity of the second end of the conductor layer 1664 .

[0128] Figure 8B The figure shows the pattern formation surface of the 17th layer dielectric layer 167. Conductor layers 1671, 1672, 1673, and 1674 for inductors are formed on the pattern formation surface of the dielectric layer 167. The conductor layer 1671 has a first end and a second end located at both ends of the long side direction of the conductor layer 1671. The conductor layer 1672 has a first end and a second end located at both ends of the long side direction of the conductor layer 1672. The conductor layer 1673 has a first end and a second end located at both ends of the long side direction of the conductor layer 1673. The conductor layer 1674 has a first end and a second end located at both ends of the long side direction of the conductor layer 1674.

[0129] The via 166T1a is connected to a portion near the first end of the conductor layer 1671. The via 166T1b is connected to a portion near the second end of the conductor layer 1671. The via 166T2a is connected to a portion near the first end of the conductor layer 1672. The via 166T2b is connected to a portion near the second end of the conductor layer 1672.

[0130] The two through holes 166T3a are connected to the vicinity of the first end of the conductor layer 1673. The two through holes 166T3b are connected to the vicinity of the second end of the conductor layer 1673. The two through holes 166T4a are connected to the vicinity of the first end of the conductor layer 1674. The two through holes 166T4b are connected to the vicinity of the second end of the conductor layer 1674.

[0131] Fig. 9 The inside of the laminate 50 of the electronic component 101 of the comparative example is shown. The arrangement of the first to fourth inductors L11 , L21 , L31 , and L32 in the electronic component 101 of the comparative example is substantially the same as the arrangement of the first to fourth inductors L11 , L21 , L31 , and L32 in the electronic component 1 .

[0132] In the electronic component 101 of the comparative example, the first inductor L11 is composed of the inductor conductor layers 1661 and 1671, the first columnar conductor T1a, the second columnar conductor T1b, and the through holes 166T1a and 166T1b. Figure 8BAs shown, the conductor layer 1661 includes a first portion including the first end of the conductor layer 1661 and extending in a direction parallel to the Y direction, a second portion including the second end of the conductor layer 1661 and extending in a direction parallel to the Y direction, and a third portion extending in a direction parallel to the X direction and connecting the first portion and the second portion. The conductor layer 1671 has the same shape as the conductor layer 1661.

[0133] In the electronic component 101 of the comparative example, the second inductor L21 is formed by the inductor conductor layers 1662 and 1672, the third columnar conductor T2a, the fourth columnar conductor T2b, and the through holes 166T2a and 166T2b. Figure 8B As shown, the conductor layer 1662 includes a fourth portion including the first end of the conductor layer 1662 and extending in a direction parallel to the Y direction, a fifth portion including the second end of the conductor layer 1662 and extending in a direction parallel to the Y direction, and a sixth portion extending in a direction parallel to the X direction and connecting the fourth portion and the fifth portion. The conductor layer 1672 has the same shape as the conductor layer 1662.

[0134] In the electronic component 101 of the comparative example, the third inductor L31 is composed of inductor conductor layers 1663 and 1673, two columnar conductors T3a and two columnar conductors T3b, and vias 166T3a and 166T3b. The shapes of the conductor layers 1663 and 1673 are the same as those of the conductor layers 663 and 673 in the present embodiment.

[0135] In the electronic component 101 of the comparative example, the fourth inductor L32 is formed of inductor conductor layers 1664 and 1674, two columnar conductors T4a, two columnar conductors T4b, and vias 166T4a and 166T4b. The shapes of the conductor layers 1664 and 1674 are the same as those of the conductor layers 664 and 674 in the present embodiment.

[0136] Next, the pass-through attenuation characteristics of the model of the example and the model of the comparative example obtained by simulation are described. The model of the example is a model of the electronic component 1 of the present embodiment. The model of the comparative example is a model of the electronic component 101 of the comparative example.

[0137] Fig.10 It is a characteristic diagram showing the pass-through attenuation characteristics of the model of the embodiment and the model of the comparative example. Fig.11 Yes Fig.10 A characteristic diagram showing a part of the enlarged image. Fig.10 and Fig.11 In the figure, the horizontal axis represents frequency and the vertical axis represents attenuation. Fig.10 and Fig.11In FIG. 1 , the curve denoted by the symbol 81 represents the pass-through attenuation characteristic of the model of the embodiment, and the curve denoted by the symbol 82 represents the pass-through attenuation characteristic of the model of the comparative example.

[0138] exist Fig.10 and Fig.11 The frequency region where the absolute value of the attenuation becomes a value close to 0 is the passband of the bandpass filter. In the model of the embodiment, the interval (difference in frequency) between the two attenuation poles generated in the frequency region on the lower band side than the passband is wider than the model of the comparative example. Thus, in the model of the embodiment, in the frequency region lower than the passband and close to the passband, a characteristic in which the absolute value of the attenuation changes steeply is achieved. This result is caused by the enhanced coupling between the first inductor L11 and the second inductor L21 in the model of the embodiment compared with the model of the comparative example. As can be understood from this result, the characteristics can be adjusted by adjusting the shape of the conductor layer included in each of the first and second inductors L11 and L21.

[0139] However, if Figure 1 As shown, the first inductor L11 is included in the first high-pass filter 10, and the second inductor L21 is included in the second high-pass filter 20. In terms of circuit structure, the low-pass filter 30 is provided between the first high-pass filter 10 and the second high-pass filter 20. As can be understood from the simulation results, according to the present embodiment, the coupling between the first inductor L11 and the second inductor L21 included in the first high-pass filter 10 and the second high-pass filter 20 which are not adjacent in circuit structure can be adjusted.

[0140] [Second Embodiment]

[0141] Next, refer to Fig.12 , a second embodiment of the present invention is described. Fig.12 It is a perspective view showing the inside of a laminated body of the electronic component according to the present embodiment.

[0142] The circuit structure of the electronic component 201 of this embodiment is the same as that of the electronic component 1 of the first embodiment. In addition, the physical structure of the electronic component 201 of this embodiment is the same as that of the electronic component 1 of the first embodiment except for the following aspects.

[0143] Like the electronic component 1 of the first embodiment, the electronic component 201 of the present embodiment includes a laminate 50. However, the laminate 50 of the electronic component 201 of the present embodiment includes a 16th dielectric layer and a 17th dielectric layer in the present embodiment instead of the dielectric layers 66 and 67 in the first embodiment.

[0144] On the patterned surface of the 16th dielectric layer in this embodiment, conductor layers 661, 663, 664, and 1662 for inductors are formed. The shapes and arrangements of the conductor layers 661, 663, and 664 are the same as the shapes and arrangements of the conductor layers 661, 663, and 664 formed on the patterned surface of the dielectric layer 66 in the first embodiment. The shape and arrangement of the conductor layer 1662 are the same as the shapes and arrangements of the conductor layer 1662 formed on the patterned surface of the dielectric layer 166 of the electronic component 101 of the comparative example described in the first embodiment.

[0145] The connection relationship between the conductor layers 661, 663, 664 and the columnar conductors T1a, T1b, T3a, T3b, T4a, T4b is the same as that of the electronic component 1 of the first embodiment. The connection relationship between the conductor layer 1662 and the columnar conductors T2a, T2b is the same as that of the electronic component 101 of the comparative example.

[0146] On the patterned surface of the 17th dielectric layer in this embodiment, conductor layers 671, 673, 674, and 1672 for inductors are formed. The shapes and arrangements of the conductor layers 671, 673, and 674 are the same as the shapes and arrangements of the conductor layers 671, 673, and 674 formed on the patterned surface of the dielectric layer 67 in the first embodiment. The shape and arrangement of the conductor layer 1672 are the same as the shapes and arrangements of the conductor layer 1672 formed on the patterned surface of the dielectric layer 167 of the electronic component 101 of the comparative example described in the first embodiment.

[0147] In this embodiment, the 16th dielectric layer is connected to the conductor layers 661, 663, 664, 671, 673, and 674. Figure 4C The through holes 66T1a, 66T1b, 66T3a, 66T3b, 66T4a, and 66T4b are similar to the through holes 66T1a, 66T1b, 66T3a, 66T3b, 66T4a, and 66T4b shown in the figure. In addition, the 16th dielectric layer in this embodiment is also formed with a connection relationship with the conductor layers 1662 and 1672. Fig. 8A The through holes 166T2a, 166T2b shown are two identical through holes.

[0148] The shapes and arrangements of the first, third and fourth inductors L11, L31, L32 in this embodiment are the same as those of the first, third and fourth inductors L11, L31, L32 in the electronic component 1 of the first embodiment. The shapes and arrangements of the second inductor L21 in this embodiment are the same as those of the second inductor L21 in the electronic component 101 of the comparative example.

[0149] Except for the function and effect related to the second inductor L21 , other structures, functions and effects in this embodiment are the same as those in the first embodiment.

[0150] The present invention is not limited to the above-described embodiments, and various modifications are possible. For example, the multilayer electronic component of the present invention may be an electronic component other than a bandpass filter such as a splitter.

[0151] In addition, the electronic component 1 may include a first low-pass filter including an inductor corresponding to the third inductor L31 and a second low-pass filter including an inductor corresponding to the fourth inductor L32 instead of the low-pass filter 30. The first low-pass filter and the second low-pass filter may be directly or indirectly connected in series.

[0152] As described above, the laminated electronic component according to the first aspect of the present invention includes:

[0153] A laminate comprising a plurality of laminated dielectric layers;

[0154] a first inductor including a first conductor layer extending along a plane intersecting a stacking direction of the plurality of dielectric layers, a first columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near one end of the first conductor layer, and a second columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near the other end of the first conductor layer;

[0155] The second inductor includes a second conductor layer extending along a plane intersecting the stacking direction, a third columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near one end of the second conductor layer, and a fourth columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near the other end of the second conductor layer.

[0156] The laminate has a first surface and a second surface located at both ends of the lamination direction, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first surface and the second surface. The first side surface and the second side surface face opposite sides to each other. The third side surface and the fourth side surface face opposite sides to each other. The first inductor is arranged at a position closer to the first side surface than the second side surface. The second inductor is arranged at a position closer to the second side surface than the first side surface. At least a portion of the first conductor layer extends in a direction intersecting with the direction in which the first columnar conductor and the second columnar conductor are arranged at an angle other than an odd multiple of 90°. At least a portion of the second conductor layer extends in a direction intersecting with the direction in which the third columnar conductor and the fourth columnar conductor are arranged at an angle other than an odd multiple of 90°.

[0157] In the laminated electronic component according to the first aspect of the present invention, the first inductor may be arranged closer to the third side surface than the fourth side surface. The second inductor may be arranged closer to the fourth side surface than the third side surface.

[0158] In addition, in the laminated electronic component of the first aspect of the present invention, the first conductor layer may include a first portion extending so as to approach the second side surface as it moves away from one end of the first conductor layer, and a second portion extending so as to approach the second side surface as it moves away from the other end of the first conductor layer. The second conductor layer may include a third portion extending so as to approach the first side surface as it moves away from one end of the second conductor layer, and a fourth portion extending so as to approach the first side surface as it moves away from the other end of the second conductor layer.

[0159] In the laminated electronic component according to the first aspect of the present invention, the first conductor layer and the second conductor layer may each include a straight portion extending linearly. The straight portion of the first conductor layer and the straight portion of the second conductor layer may be parallel to each other.

[0160] In addition, in the stacked electronic component of the first aspect of the present invention, the first conductor layer may include a first portion extending in one direction, and a second portion extending in a direction different from the first portion and having a length different from the first portion. The second conductor layer may include a third portion extending in one direction, and a fourth portion extending in a direction different from the third portion and having a length different from the third portion. The distance from the second portion to the fourth portion may be smaller than the distance from the first portion to the third portion.

[0161] In the laminated electronic component according to the first aspect of the present invention, each of the first conductive layer and the second conductive layer may include a bent portion extending in a bent manner.

[0162] In addition, in the stacked electronic component of the first aspect of the present invention, when the direction perpendicular to the stacking direction and in which the first side surface and the second side surface are arranged is set as the first direction, and the direction perpendicular to the stacking direction and in which the third side surface and the fourth side surface are arranged is set as the second direction, the second columnar conductor and the fourth columnar conductor may be arranged between the first columnar conductor and the third columnar conductor in the second direction. The interval between the second columnar conductor and the fourth columnar conductor in the first direction may be smaller than the interval between the first columnar conductor and the third columnar conductor in the first direction.

[0163] In addition, the stacked electronic component of the first aspect of the present invention may also include a first high-pass filter, a second high-pass filter, and a low-pass filter arranged between the first high-pass filter and the second high-pass filter in the circuit structure. The first high-pass filter may also include a first inductor. The second high-pass filter may also include a second inductor. The low-pass filter may also include a third inductor and a fourth inductor each including a conductor layer extending along a plane and a pair of columnar conductors extending in a direction parallel to the stacking direction and connected to the conductor layer. The third inductor and the fourth inductor may also be arranged in a direction intersecting with the direction in which the first inductor and the second inductor are arranged.

[0164] A laminated electronic component according to a second aspect of the present invention comprises: a laminate including a plurality of laminated dielectric layers; an inductor including a conductor layer extending along a plane intersecting with a stacking direction of the plurality of dielectric layers, a first columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near one end of the conductor layer, and a second columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near the other end of the conductor layer. The conductor layer includes a first portion and a second portion extending in a direction intersecting with a direction in which the first columnar conductor and the second columnar conductor are arranged, extending in different directions, and having different lengths.

[0165] In the laminated electronic component according to the second aspect of the present invention, the conductive layer may further include a bent portion extending in a bent manner and arranged between the first portion and the second portion in the longitudinal direction of the conductive layer.

[0166] In addition, in the stacked electronic component of the second viewpoint of the present invention, the stacked body may also have a first face and a second face located at both ends of the stacking direction, and a first side face, a second side face, a third side face, and a fourth side face connecting the first face and the second face. The first side face and the second side face may also face opposite sides to each other. The third side face and the fourth side face may also face opposite sides to each other. The inductor may also be arranged at a position closer to the first side face than the second side face. The first portion may also include one end of the conductor layer and extend in a manner approaching the second side face as it leaves one end. The second portion may also include the other end of the conductor layer and extend in a manner approaching the second side face as it leaves the other end.

[0167] In the multilayer electronic component according to the second aspect of the present invention, the distance between the second columnar conductor and the first side surface may be larger than the distance between the first columnar conductor and the first side surface.

[0168] It is clear from the above description that the present invention can be implemented in various forms and modifications. Therefore, within the scope of equivalents of the claims, the present invention can be implemented in forms other than the best form described above.

Claims

1. A laminated electronic component, characterized in that: have: A laminate comprising a plurality of laminated dielectric layers; a first inductor including a first conductor layer extending along a plane intersecting a stacking direction of the plurality of dielectric layers, a first columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near one end of the first conductor layer, and a second columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near the other end of the first conductor layer; a second inductor including a second conductor layer extending along a plane intersecting the stacking direction, a third columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near one end of the second conductor layer, and a fourth columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near the other end of the second conductor layer, The stacked body has a first surface and a second surface located at both ends of the stacking direction, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first surface and the second surface. The first side surface and the second side surface face opposite sides to each other, The third side surface and the fourth side surface face opposite sides to each other, The first inductor is arranged at a position closer to the first side surface than the second side surface. The second inductor is arranged at a position closer to the second side surface than the first side surface. At least a portion of the first conductor layer extends in a direction intersecting the direction in which the first columnar conductors and the second columnar conductors are arranged at an angle other than an odd multiple of 90°. At least a portion of the second conductor layer extends in a direction intersecting the direction in which the third columnar conductors and the fourth columnar conductors are arranged at an angle other than an odd multiple of 90°.

2. The laminated electronic component according to claim 1, wherein: The first inductor is arranged at a position closer to the third side surface than the fourth side surface. The second inductor is arranged at a position closer to the fourth side surface than to the third side surface.

3. The laminated electronic component according to claim 1, wherein: The first conductor layer includes a first portion extending so as to approach the second side surface as it moves away from the one end portion of the first conductor layer, and a second portion extending so as to approach the second side surface as it moves away from the other end portion of the first conductor layer. The second conductor layer includes a third portion extending so as to approach the first side surface as it moves away from the one end portion of the second conductor layer, and a fourth portion extending so as to approach the first side surface as it moves away from the other end portion of the second conductor layer.

4. The laminated electronic component according to claim 1, wherein: The first conductor layer and the second conductor layer each include a straight line portion extending in a straight line. The straight line portion of the first conductor layer and the straight line portion of the second conductor layer are parallel to each other.

5. The laminated electronic component according to claim 1, wherein: The first conductor layer includes a first portion extending in one direction and a second portion extending in a direction different from the first portion and having a different length from the first portion. The second conductor layer includes a third portion extending in one direction and a fourth portion extending in a direction different from the third portion and having a different length from the third portion.

6. The laminated electronic component according to claim 5, characterized in that A distance from the second portion to the fourth portion is smaller than a distance from the first portion to the third portion.

7. The laminated electronic component according to claim 1, wherein: The first conductor layer and the second conductor layer each include a bent portion extending in a meandering manner.

8. The laminated electronic component according to claim 1, wherein: When a direction perpendicular to the stacking direction and in which the first side surface and the second side surface are arranged is defined as a first direction, and a direction perpendicular to the stacking direction and in which the third side surface and the fourth side surface are arranged is defined as a second direction, the second columnar conductor and the fourth columnar conductor are arranged between the first columnar conductor and the third columnar conductor in the second direction. A distance between the second columnar conductor and the fourth columnar conductor in the first direction is smaller than a distance between the first columnar conductor and the third columnar conductor in the first direction.

9. The laminated electronic component according to any one of claims 1 to 8, wherein: Also available: First high pass filter; A second high pass filter; A low-pass filter is arranged between the first high-pass filter and the second high-pass filter in terms of circuit structure, The first high pass filter comprises the first inductor, The second high pass filter includes the second inductor.

10. The laminated electronic component according to claim 9, wherein: The low-pass filter includes a third inductor and a fourth inductor each including a conductor layer extending along the plane and a pair of columnar conductors extending in a direction parallel to the stacking direction and connected to the conductor layer. The third inductor and the fourth inductor are arranged in a direction crossing a direction in which the first inductor and the second inductor are arranged.

11. A laminated electronic component, characterized in that: have: A laminate comprising a plurality of laminated dielectric layers; An inductor comprising a conductor layer extending along a plane intersecting a stacking direction of the plurality of dielectric layers, a first columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near one end of the conductor layer, and a second columnar conductor extending in a direction parallel to the stacking direction and connected to a portion near the other end of the conductor layer. The conductor layer includes a first portion and a second portion extending in a direction intersecting a direction in which the first columnar conductors and the second columnar conductors are arranged, extending in directions different from each other, and having different lengths.

12. The laminated electronic component according to claim 11, wherein: The conductor layer further includes a bent portion extending in a bent manner and arranged between the first portion and the second portion in the longitudinal direction of the conductor layer.

13. The laminated electronic component according to claim 11, wherein: The stacked body has a first surface and a second surface located at both ends of the stacking direction, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first surface and the second surface. The first side surface and the second side surface face opposite sides to each other, The third side surface and the fourth side surface face opposite sides to each other, The inductor is arranged at a position closer to the first side surface than the second side surface, The first portion includes the one end portion of the conductor layer and extends in a manner approaching the second side surface as it moves away from the one end portion. The second portion includes the other end portion of the conductor layer, and extends so as to approach the second side surface as it moves away from the other end portion.

14. The laminated electronic component according to claim 11, wherein: The stacked body has a first surface and a second surface located at both ends of the stacking direction, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first surface and the second surface. The first side surface and the second side surface face opposite sides to each other, The third side surface and the fourth side surface face opposite sides to each other, A distance between the second columnar conductor and the first side surface is greater than a distance between the first columnar conductor and the first side surface.

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