Movable light assembly and camera module thereof

Abstract

The invention discloses a movable light assembly, which is characterized by comprising a fixed assembly, a movable assembly and a driving assembly, the retaining assembly is arranged on the fixing assembly; the movable assembly is movably connected with the fixed assembly through the retaining assembly, the movable assembly is provided with a hollow area, and the fixed assembly is arranged in the hollow area; the photosensitive chip is arranged on the movable component; the at least one bending part is movably connected to the movable component and the fixed component; the at least one driving assembly is used for driving the movable assembly to move relative to the fixed assembly, the driving assembly is arranged on one side of the fixed assembly in the horizontal direction, and the photosensitive chip is arranged on the other side of the fixed assembly. The driving assembly and the photosensitive chip are arranged on the two sides of the fixed assembly respectively, and the movable assembly and the fixed assembly are electrically connected to move through the bending part, so that structures such as flexible board extension and a lead frame are omitted, the size of the movable optical assembly is reduced, and the flatness of the movable optical assembly is improved.

Description

Technical Field

[0001] The present invention relates to the field of electronic technology, and in particular to a movable photosensitive component and a camera module thereof. Background Art

[0002] Electronic devices have gradually become an indispensable social and entertainment tool in people's daily lives, and people's requirements for electronic devices are getting higher and higher. In terms of video, people are increasingly interested in the performance of video anti-shake in order to obtain photos with higher image quality. The increase in the chip image surface can effectively increase the light flux per unit time and further improve the image quality. However, the increase in the chip image surface will be accompanied by the increase in the lens, resulting in an increase in the lens' own weight. Therefore, the driving force and stroke of the common lens anti-shake motor are difficult to meet the demand.

[0003] The principle of photosensitive chip anti-shake technology is similar to that of lens anti-shake. Usually, the photosensitive chip is set on a movable substrate and electrically connected to the movable substrate. The movable substrate is electrically connected to the external circuit through a flexible retainer to achieve electrical connection between the photosensitive chip and the external circuit. During the chip anti-shake process, the movable substrate carries the photosensitive chip to move and pulls and squeezes the flexible retainer. The flexible retainer can deformably electrically connect the movable substrate and the external circuit. With the development of the industry, flexible retainers are no longer limited to flexible movable substrates or lead frames.

[0004] At present, the flexible holder is easily set to have a large rebound force. If the rebound force is large, a larger driving force is required to resist the rebound force. If the rebound force is small, the effect of the flexible holder will be weakened. At the same time, the flexible holder will expand the size of the photosensitive chip, resulting in a larger overall size of the camera module. Designing a flexible holder so that the chip anti-shake has a good anti-shake effect and is as compact as possible is an urgent problem to be solved. Summary of the invention

[0005] One object of the present invention is to provide a movable photosensitive component, which can suspend the movable component carrying the photosensitive chip on the fixed component through a retaining component, and the retaining component has uniform reaction force, so that the driving component can move or rotate the movable component within a required stroke through a smaller rated driving force.

[0006] Another object of the present invention is to provide a movable photosensitive component, wherein the driving component and the photosensitive chip are respectively arranged on both sides of the fixed component, and the fixed component and the movable component carrying the photosensitive chip are electrically connected through a flexible portion, so as to reduce the volume of the movable photosensitive component.

[0007] Another object of the present invention is to provide a movable photosensitive component, wherein the movable component is formed by semiconductor technology to improve the flatness of the movable photosensitive component.

[0008] Another object of the present invention is to provide a movable photosensitive component, the flexure of which has a lighter mass and a smaller reaction force, thereby reducing the rated driving force of the driving component.

[0009] Another object of the present invention is to provide a camera module, which can reduce weight, reduce overall volume, and improve imaging quality by applying the above-mentioned movable photosensitive component.

[0010] To achieve one of the purposes of the present application, the technical solution adopted by the present invention is: a movable photosensitive component, comprising: a fixed component; a retaining component, which is arranged on the fixed component; a movable component, which is movably connected to the fixed component through the retaining component, and the movable component has a hollow area, and the fixed component is arranged in the hollow area; a photosensitive chip, which is arranged in the movable component; at least one flexure, which is movably connected to the movable component and the fixed component; at least one driving component to drive the movable component to move relative to the fixed component, and the driving component is arranged on one side of the fixed component along the horizontal direction, and the photosensitive chip is arranged on the other side of the fixed component.

[0011] In one embodiment of the present application, the hollow area on the movable component is opened between the photosensitive chip and the at least one driving component, the fixed component accommodated in the hollow area is arranged adjacent to the photosensitive chip and the at least one driving component located on both sides thereof, and the at least one flexible portion is horizontally placed on the hollow area and close to the photosensitive chip.

[0012] In one embodiment of the present application, the driving component and the photosensitive chip are respectively located on opposite sides of the hollow area, and the driving component is horizontally arranged on a side of the fixed component relatively away from the photosensitive chip. The driving component is electrically connected to the movable component and is conductive to the movable component on one side of the photosensitive chip and is conductive to the flexible portion.

[0013] In one embodiment of the present application, the flexible portion includes a first flexible portion and a second flexible portion, the first flexible portion and the second flexible portion are respectively located on both sides of the photosensitive chip, one end of the first flexible portion is connected to the fixed component located on one side of the movable component, the other end of the first flexible portion is connected to an adjacent side of the movable component close to the photosensitive chip, one end of the second flexible portion is located at the fixed component on the other side of the movable component, and the other end of the second flexible portion is connected to the other adjacent side of the movable component close to the photosensitive chip, so as to electrically connect the fixed component and the movable component.

[0014] In one embodiment of the present application, the fixing component includes a first fixing plate and a second fixing plate, the first fixing plate and the second fixing plate are respectively located on opposite sides of the photosensitive chip, the first fixing plate is arranged in the hollow area of ​​the movable component, and the second fixing plate is arranged on a side of the movable component relatively away from the hollow area, and the movable component is suspendedly connected to the first fixing plate and the second fixing plate through the retaining component.

[0015] In one embodiment of the present application, the number of the retaining components is four, two of which are arranged at two ends of the first fixed plate, and the other two are arranged at two ends of the second fixed plate, so that the restoring force of the movable component relative to the fixed plate in at least two directions parallel to the photosensitive chip is balanced.

[0016] In one embodiment of the present application, the driving component further includes a first driving coil and a second driving coil, the first driving coil is arranged on a side of the first fixed plate relatively away from the photosensitive chip, the second driving coil is arranged between the first fixed plate and the second fixed plate, and is located on the adjacent side of the photosensitive chip relative to the first driving component, and the long side direction of the first driving coil is perpendicular to the long side direction of the second driving coil, so as to drive the movable component to move and rotate in an orthogonal plane to the optical axis of the photosensitive chip.

[0017] In one embodiment of the present application, the driving component also includes a third driving coil, which is arranged on one side of the photosensitive chip and opposite to the second driving coil. The photosensitive chip is located between the second driving coil and the third driving coil, and the long side direction of the third driving component is consistent with the long side direction of the second driving component.

[0018] In one embodiment of the present application, the movable photosensitive component also includes a supporting component, and the supporting component includes a base portion and an upper cover portion, the base portion is arranged below the movable component and the fixed component to support the movable component and the fixed component, and the upper cover portion is arranged above the movable component and the fixed component and is snapped with the base portion to accommodate the movable component and the fixed component.

[0019] In one embodiment of the present application, the driving component further includes at least one driving magnet, which is arranged opposite to the driving coil along the optical axis direction of the photosensitive chip and fixed to the upper cover.

[0020] In one embodiment of the present application, the base portion includes a base plate and a support member, wherein the support member is arranged on the base plate to separate the movable component from the base plate and keep the movable component movable within an orthogonal plane to the optical axis of the photosensitive chip, and the fixed component is fixed to the base portion.

[0021] In one embodiment of the present application, the supporting member is a ball bearing, and a groove adapted for the ball bearing is provided on the base plate. The ball bearing is accommodated in the groove, so as to support the movable component to move in a rolling manner in a plane orthogonal to the optical axis of the photosensitive chip.

[0022] In one embodiment of the present application, the circuit component includes a conductive portion and a flexible portion, the conductive portion includes a plurality of first wires and a plurality of second wires, the first wires are arranged on the outside of the photosensitive chip and between the photosensitive chip and the flexible portion, so as to electrically connect the photosensitive chip and the movable component, the second wires are arranged on a side of the fixed component relatively away from the photosensitive chip, the second wires and the flexible portion are respectively located on both sides of the fixed component, so as to electrically connect the fixed component and the base plate, and the flexible portion is located between the first wires and the second wires.

[0023] In one embodiment of the present application, the movable assembly includes a first movable plate, a second movable plate and a third movable plate, and the first movable plate and the second movable plate are respectively fixed to opposite sides of the third movable plate.

[0024] In one embodiment of the present application, the movable photosensitive component further includes a circuit board, which is disposed on the base plate and electrically connected to the fixed component.

[0025] In one embodiment of the present application, the movable photosensitive component also includes at least one reinforcement plate, which is respectively arranged at the bottom of the first fixed plate, the bottom of the second fixed plate and the bottom of the movable component, so as to keep the first fixed plate, the second fixed plate and the movable component in a horizontal state.

[0026] In one embodiment of the present application, the reinforcing plate has ferromagnetism and is able to generate an adsorption force with the driving magnet to maintain the distance between the upper cover portion of the movable photosensitive component and the base plate.

[0027] To achieve another purpose of the present application, the technical solution adopted by the present invention is: a camera module, which includes: a lens assembly, equipped with at least one lens; a focus motor, the focus motor is placed on the outside of the lens assembly; the movable photosensitive assembly as described above, the movable photosensitive assembly is located below the lens assembly, so that the image sensor senses light and forms an image.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] (1) By arranging the driving component and the photosensitive chip on both sides of the fixed component respectively, and electrically connecting the movable component and the fixed component through the flexure, structures such as the flexible board extension and the lead frame are omitted, the volume of the movable photosensitive component is reduced, and the flatness of the movable photosensitive component is improved;

[0030] (2) The movable component carrying the photosensitive chip is suspended on the fixed component by uniformly holding the component through the reaction force. The flexure is light in mass and has a small reaction force, so that the movable component can be moved and rotated within the required stroke through a small rated driving force. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a structural diagram of a movable photosensitive component according to some embodiments of the present application;

[0032] Figure 2 is an exploded view of a movable photosensitive assembly according to some embodiments of the present application;

[0033] Figure 3 is an internal structural diagram of a movable photosensitive component according to some embodiments of the present application;

[0034] Figure 4 is a top view of a movable photosensitive component according to some embodiments of the present application;

[0035] Figure 5 This application is along Figure 4 Sectional view in the AA direction;

[0036] Figure 6 This application Figure 5 An enlarged schematic diagram of the local B in the middle;

[0037] Figure 7 is a structural diagram of an upper cover portion of a movable photosensitive component according to some embodiments of the present application;

[0038] Figure 8 It is a structural diagram of the base portion of the movable photosensitive component according to some embodiments of the present application.

[0039] In the figure: 1, movable photosensitive component; 10, photosensitive chip; 20, movable component; 21, hollow area; 22, first movable plate; 23, second movable plate; 24, third movable plate; 30, fixed component; 31, first fixed plate; 32, second fixed plate; 40, driving component; 41, driving coil; 411, first driving coil; 412, second driving coil; 413, third driving coil; 42, driving magnet; 421, first driving magnet; 422, second driving magnet; 423, third driving magnet; 43, Hall element; 50, circuit Component; 51, flexure; 511, first flexure; 512, second flexure; 52, conducting portion; 521, first conductor; 522, second conductor; 53, resistor and capacitor; 60, retaining component; 70, bearing component; 71, base portion; 711, base plate; 712, support block; 713, inner support block; 714, outer support block; 72, upper cover portion; 721, lens mount; 722, color filter; 723, magnetic sheet; 80, circuit board; 90, reinforcement plate; 91, first reinforcement plate; 92, second reinforcement plate; 93, third reinforcement plate. DETAILED DESCRIPTION

[0040] The present invention is further described below in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0041] In the description of the present invention, it should be noted that directional words, such as the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of narrating the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific scope of protection of the present invention.

[0042] It should be noted that the terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0043] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, a contact connection, or an indirect connection through an intermediate medium, and it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] like Figure 1-Figure 3 As shown, a movable photosensitive component 1 includes a fixed component 30, a holding component 60, a movable component 20, a photosensitive chip 10, at least one flexure 51 and at least one driving component 40. The holding component 60 is extended in the horizontal direction and is arranged between the fixed component 30 and the movable component 20. The movable component 20 is movably connected to the fixed component 30 through the holding component 60. The photosensitive chip 10 is arranged in the central area of ​​the movable component 20. Under the driving force of the plurality of driving components 40, the movable component 20 carries the photosensitive chip 10 and moves relative to the fixed component 30 along an orthogonal plane to the optical axis of the photosensitive chip 10, that is, in the XY plane.

[0045] In some optional embodiments, the movable component 20 has at least one hollow area 21, and the hollow area 21 is located on one side, two sides or three sides of the central area of ​​the movable component 20. The fixed component 30 is arranged in the hollow area 21, so as to reduce the space occupied by the fixed component 30, which is beneficial to reduce the overall size of the movable photosensitive component 1.

[0046] The at least one flexible portion 51 is movably connected to the movable component 20 and the fixed component 30. The flexible portion 51 is made of metal material and has conductivity, so that the movable component 20 and the fixed component 30 can be electrically connected. The flexible portion 51 has low elasticity and reaction force, so that it can deformably adapt to the movement of the movable component 20 relative to the fixed component 30. In some optional embodiments, a plurality of the flexible portions 51 are arranged parallel to each other in the gap between the movable component 20 and the fixed component 30.

[0047] In an optional embodiment, the driving component 40 is composed of a driving coil 41 and a driving magnet 42. At least some of the components of the driving component 40 are arranged in the movable component 20. At least one driving component 40 is arranged on one side of the fixed component 30 in the horizontal direction, and the photosensitive chip 10 is arranged on the other side of the fixed component 30. In an optional embodiment, at least one driving coil 41 is arranged in the movable component 20, and the driving coil 41, the fixed component 30 and the photosensitive chip 10 are arranged in the horizontal direction, so as to reduce the height of the movable photosensitive component 1, and the at least one driving component 40 can drive the movable component 20 to move relative to the fixed component 30. In an optional implementation, the photosensitive chip 10, the fixed component 30 and at least part of the components of at least one of the driving components 40 are arranged one by one outward along the central area of ​​the movable component 20, that is, the photosensitive chip 10 is arranged in the central area of ​​the movable component 20, the fixed component 30 is arranged in the hollow area 21 on at least one side of the central area, and at least part of the components of the driving component 40, such as the driving coil 41, are arranged in the area more peripheral to the hollow area 21 of the movable component 20. In other words, the driving component 40 is located outside the fixed component 30, and the photosensitive chip 10 is located inside the fixed component 30.

[0048] In some embodiments, the hollow area 21 of the movable component 20 is opened between the photosensitive chip 10 and the at least one driving component 40, the fixed component 30 accommodated in the hollow area 21 is arranged adjacent to the photosensitive chip 10 and at least a portion of the at least one driving component 40 located on both sides thereof, and the at least one flexure 51 is horizontally arranged on the hollow area 21 and close to the photosensitive chip 10. Specifically, the driving component 40 is arranged on a side of the fixed component 30 relatively far away from the photosensitive chip 10, and the flexure 51 is arranged on a side of the fixed component 30 adjacent to the photosensitive chip 10. The flexure 51 is deformably connected to the opposite sides of the fixed component 30 and the movable component 20, so as to shorten the routing length of the flexure 51.

[0049] In some embodiments, Figure 1As shown, the driving component 40 and the photosensitive chip 10 are respectively located on opposite sides of the hollow area 21, and at least part of at least one of the driving components 40, such as the driving coil 41, is horizontally arranged on the side of the fixed component 30 relatively far away from the photosensitive chip 10, and the driving component 40 is electrically connected to the movable component 20 and is connected to the flexible portion 51 on the side of the movable component 20 located on the photosensitive chip 10. In other words, the driving component 40 is arranged on the outside of the fixed component 30 and is electrically connected to the movable component 20. The line connecting the driving component 40 is connected from the side of the fixed component 30 relatively far away from the photosensitive chip 10 to the side close to the photosensitive chip 10, so as to be connected to the flexible portion 51 arranged on the side of the photosensitive chip 10, and further electrically connected to the fixed component 30. This electrical connection method is beneficial to reducing the wiring distance of the photosensitive chip. In addition, the flexible portion 51 is relatively soft, and its elastic coefficient at the maximum deformation end in the original state and within the rated stroke is maintained within 10 times. The flexible portion 51 is arranged relatively close to the inside to reduce the risk of damage to the flexible portion 51.

[0050] In some embodiments, Figure 4-Figure 8 As shown, the movable photosensitive component 1 also includes a bearing component 70, and the bearing component 70 includes a base portion 71 and an upper cover portion 72. The base portion 71 is arranged below the movable component 20 and the fixed component 30 to support the movable component 20 and the fixed component 30. The upper cover portion 72 is arranged above the movable component 20 and the fixed component 30 and is engaged with the base portion 71 to accommodate the movable component 20 and the fixed component 30. In an optional embodiment, the driving magnet 42 of the driving component 40 is fixed to the lower side of the upper cover portion 72, and is arranged relative to the driving coil 41 fixed to the movable component 20 along the optical axis direction of the photosensitive chip 10, that is, the Z-axis direction. It can be understood that the fixed component 30 is fixed relative to the supporting component 70, the movable component 20 is connected to the fixed component 30 through the retaining component 60, and moves inside the supporting component 70 through the driving force of multiple driving components 40, and the flexible portion 51 is flexibly supported and electrically connected between the movable component 20 and the fixed component 30.

[0051] In some embodiments, Figure 5 and Figure 6As shown, the movable photosensitive component 1 further includes a circuit component 50 and a circuit board 80. The circuit board 80 is arranged on the upper surface of the base portion 71 and is electrically connected to the fixed component 30. The circuit component 50 includes a conductive portion 52 and the flexible portion 51. The conductive portion 52 includes a plurality of first conductive wires 521 and a plurality of second conductive wires 522. The plurality of first conductive wires 521 are arranged in parallel on at least two sides of the photosensitive chip 10 and are located between the photosensitive chip 10 and the flexible portion 51, so as to electrically connect the photosensitive chip 10 and the movable component 20. The plurality of second conductive wires 522 are arranged in parallel on a side of the fixed component 30 relatively away from the photosensitive chip 10. That is, the second conductive wires 522 and the flexible portion 51 are respectively located on both sides of the fixed component 30, so as to electrically connect the fixed component 30 and the circuit board 80 on the base portion 71. The flexible portion 51 is located between the first conductive wires 521 and the second conductive wires 522, so as to electrically connect the movable component 20 and the fixed component 30.

[0052] That is to say, the photosensitive chip 10 and at least part of the components of the driving component 40, such as the driving coil 41, are electrically connected to the fixing component 30 through the first wire 521 and the flexure 51, and then electrically connected to the circuit board 80 through the second wire 522, so as to achieve conduction with the external circuit. It can be understood that the line of the second wire 522 close to the circuit board 80 is longer than the line close to the fixing component 30, so that the second wire 522 passes through the hollow area 21 and extends downward to the circuit board 80. It is worth mentioning that the first wire 521 and the second wire 522 of the conductive part 52 can be a variety of conduction methods, such as: gold wire conduction, flip-chip gold ball conduction, etc.

[0053] In some embodiments, the flexible portion 51 includes a first flexible portion 511 and a second flexible portion 512, and the first flexible portion 511 and the second flexible portion 512 are respectively located on at least two sides of the photosensitive chip 10, one end of the first flexible portion 511 is connected to the fixed component 30 located on one side of the movable component 20, and the other end of the first flexible portion 511 is connected to an adjacent side of the movable component 20 close to the photosensitive chip 10, one end of the second flexible portion 512 is located on the other side of the movable component 20, and the other end of the second flexible portion 512 is connected to the other adjacent side of the movable component 20 close to the photosensitive chip 10, so as to electrically connect the fixed component 30 and the movable component 20. In some optional embodiments, multiple first flexible portions 511 are connected in parallel to one side of the movable component 20 and the fixed component 30 adjacent to this side, so as to shorten the routing length of the first flexible portion 511, and multiple second flexible portions 512 are connected in parallel to one side of the movable component 20 and the fixed component 30 adjacent to this side, so as to shorten the routing length of the second flexible portion 512, thereby making the structure of the movable photosensitive component 1 more compact and reducing the overall size.

[0054] It is worth mentioning that in the traditional lead frame structure, the elastic coefficient of the flexure in the high stiffness state and the low stiffness state is quite different. When a certain deformation displacement is reached, the elastic coefficient decreases sharply. A small increase in force may also produce excessive displacement, causing the flexure to deform sharply and be damaged and broken. In the solution of the present application, the elastic coefficient of the flexure 51 in the original state and the maximum deformation end within the rated stroke is kept within 10 times, that is, its elastic coefficient changes less, so that the reaction force is more uniform, avoiding the flexure 51 from deforming sharply and being damaged and broken after being stressed.

[0055] In some embodiments, the fixing assembly 30 includes a first fixing plate 31 and a second fixing plate 32, the first fixing plate 31 and the second fixing plate 32 are respectively located at opposite sides of the photosensitive chip 10 and are disposed on a reinforcing plate 90, the first fixing plate 31 is disposed in the hollow area 21 of the movable assembly 20, and the second fixing plate 32 is disposed on a side of the movable assembly 20 relatively away from the hollow area 21, and the movable assembly 20 is suspendedly connected to the first fixing plate 31 and the second fixing plate 32 through the holding assembly 60. The reinforcing plate 90 includes at least a first reinforcing plate 91 and a second reinforcing plate 92, the first reinforcing plate 91 is fixedly connected to the bottom of the first fixing plate 31, and the second reinforcing plate 92 is fixedly connected to the bottom of the second fixing plate 32, so as to improve the flatness of the first fixing plate 31 and the second fixing plate 32.

[0056] In an optional embodiment, the hollow area 21 is adapted to the first fixing plate 31, so that the first fixing plate 31 can be accommodated in the hollow area 21, and a plurality of the first wires 521 are arranged in parallel with each other on the movable component 20 between the photosensitive chip 10 and the first fixing plate 31, so as to electrically connect the photosensitive chip 10 and one side of the movable component 20, and a plurality of the first flexures 511 are arranged in parallel with each other on the hollow area 21 between the first fixing plate 31 and the movable component 20, so as to electrically connect the movable component 20 and the The first fixing plate 31 conducts the circuits of at least part of the components of the photosensitive chip 10 and the driving component 40 to the first fixing plate 31. A plurality of second conducting wires 522 extend downward from the outer side of the first fixing plate 31 in parallel to each other through the hollow area 21, and electrically connect the first fixing plate 31 and the circuit board 80 located on the base portion 71, so that the circuit on the movable component 20 is conducted to the circuit board 80 through the first fixing plate 31, and further realizes connection with an external circuit; the second fixing plate 32 is located on the movable component 2 0, and is arranged opposite to the first fixing plate 31, a gap is arranged between the second fixing plate 32 and the movable component 20, so that the movable component 20 can move relative to the second fixing plate 32, a plurality of first wires 521 are arranged on the movable component 20 between the photosensitive chip 10 and the second fixing plate 32 in parallel with each other, so as to electrically connect the photosensitive chip 10 and the other side of the movable component 20, a plurality of second flexures 512 are arranged horizontally on the gap between the second fixing plate 32 and the movable component 20 in parallel with each other, so as to The movable component 20 is electrically connected to the second fixed plate 32, and the circuits of at least part of the components of the photosensitive chip 10 and the driving component 40 are conducted to the second fixed plate 32. A plurality of second wires 522 extend downward from the outer side of the second fixed plate 32 in parallel to each other through the gap between the second fixed plate 32 and the movable component 20, and electrically connect the second fixed plate 32 and the circuit board 80, so that the circuit on the movable component 20 is conducted to the circuit board 80 through the second fixed plate 32, and further connection with an external circuit is achieved. It is worth mentioning that the first reinforcement plate 91 and the second reinforcement plate 92 both maintain a wiring space between the movable component 20, and the wiring space at least partially overlaps with the hollow area 21, so as to facilitate the passage of the second wire 522, so that the first fixed plate 31 and the second fixed plate 32 are electrically connected to the circuit board 80 through the second wire 522.It can be understood that the first fixed plate 31 and the second fixed plate 32 are closer to the central area of ​​the movable component 20 than at least some components of the driving component 40, such as the driving coil 41, so as to reduce the routing length of the first flexible portion 511 and the second flexible portion 512, thereby making the structure of the movable photosensitive component 1 more compact and reducing its overall size. In addition, this electrical connection method allows the relatively soft first flexible portion 511, the second flexible portion 512, the first wire 521 and the second wire 522 to be arranged relatively close to the inside to reduce the risk of damage to the flexible portion 51 and the conductive portion 52, thereby improving the reliability of the movable photosensitive component 1.

[0057] In some embodiments, Figure 3 As shown, the movable assembly 20 includes a first movable plate 22, a second movable plate 23 and a third movable plate 24. The first movable plate 22 and the second movable plate 23 are respectively fixed to opposite sides of the third movable plate 24, so as to improve the yield of the movable assembly 20. Specifically, the material of the movable assembly 20 can be a semiconductor substrate. A large semiconductor substrate is prone to bending during molding, and as long as there is a defective part on the semiconductor substrate, the entire semiconductor substrate is considered defective. The movable assembly 20 is divided into the first movable plate 22, the second movable plate 23 and the third movable plate 24, so as to reduce the risk of bending of a single movable plate during molding.

[0058] The reinforcing plate 90 further includes a third reinforcing plate 93, and the first movable plate 22, the second movable plate 23, and the third movable plate 24 of the movable assembly 20 are assembled on the third reinforcing plate 93 in sections, so as to improve the flatness of the movable assembly 20. Specifically, the first movable plate 22 and the second movable plate 23 are first assembled on the third reinforcing plate 93 and are located on opposite sides of the third reinforcing plate 93, and then the third movable plate 24 is partially assembled on the first movable plate 22 and the third movable plate 24 in a superimposed manner and is located between the first movable plate 22 and the second movable plate 23, which is conducive to better controlling the flatness of the movable assembly 20. It can be understood that there is a wiring space between the first reinforcement plate 91, the second reinforcement plate 92 and the third reinforcement plate 93 to facilitate the passage of the second wire 522, extending downward from the fixing assembly 30 to the base portion 71, so that the first fixing plate 31 and the second fixing plate 32 are electrically connected to the circuit board 80 through the second wire 522.

[0059] In some embodiments, the reinforcing plate 90 is ferromagnetic, and can generate an adsorption force with the driving magnet 42 fixed to the upper cover 72, so as to maintain the distance between the upper cover 72 and the base plate 711 of the movable photosensitive component 1. In an optional embodiment, the material of the reinforcing plate 90 can be a steel sheet with magnetic attraction, so as to enhance the attraction between the movable component 20 and the driving magnet 42, which is conducive to the movable component 20 to remain suspended. The surface flatness of the reinforcing plate 90 is less than 5μm, so as to improve the flatness of the movable component 20 and the fixed component 30 fixed to the reinforcing plate 90, and further improve the installation accuracy of the movable photosensitive component 1. The movable component 20 and the fixed component 30 can be bonded to the corresponding reinforcing plate 90 by glue, so as to improve the reliability of the installation of the movable photosensitive component 1.

[0060] In some embodiments, the number of the retaining components 60 is four, wherein each of the two ends of the first fixed plate 31 is provided with a retaining component 60 connected to the movable component 20, and each of the two ends of the second fixed plate 32 is provided with a retaining component 60 connected to the movable component 20, so that the movable component 20 is suspended between the first fixed component 30 and the second fixed component 30 through the four retaining components 60. In some optional embodiments, one end of the retaining component 60 is fixed to the side of the movable component 20 and close to one of its corners, and the other end of the retaining component 60 is fixed to one of the end portions of the first fixed plate 31 or the second fixed plate 32. The retaining component 60 extends in the horizontal direction and is accommodated between the first fixed plate 31 and the movable component 20, or between the second fixed plate 32 and the movable component 20, and elastically deformably connects the fixed component 30 and the movable component 20 so that the movable component 20 moves in an orthogonal plane to the optical axis of the photosensitive chip 10, i.e., the XY plane, and at the same time, the restoring force of the movable component 20 relative to the fixed component 30 in at least two directions in the XY plane is balanced. It is worth mentioning that the flexible portion 51 and the retaining assembly 60 arranged on the same fixed plate are located on the same side of the fixed plate, and the two retaining assemblies 60 are located on the outermost sides of the multiple flexible portions 51, which facilitates the installation of the flexible portion 51 and makes the structure of the movable photosensitive assembly 1 more compact, thereby reducing the overall size.

[0061] It can be understood that when the external force driving the movable component 20 to move is removed, the holding component 60 can provide a restoring force to the movable component 20, so that the movable component 20 returns to the initial position, or when the movable component 20 is subjected to an external force, the holding component 60 keeps the movable component 20 in the initial position. Secondly, the movable component 20 moves relative to the fixed component 30 in the plane orthogonal to the optical axis of the photosensitive chip 10, that is, the XY plane, wherein when the driving component 40 drives the movable component 20 to move in the X direction, it needs to resist the reaction force in the X direction, and when driving the movable component 20 to move in the Y direction, it needs to resist the reaction force in the Y direction. In the scheme of the present application, the difference in the elastic coefficients of each of the holding components 60 in the two directions is less than or equal to 20%, which is relatively consistent, so as to provide a relatively uniform reaction force, and at the same time, it is possible to more accurately predict the resultant force of the reaction force of each of the holding components 60 in the XY plane, so as to more conveniently control the driving component 40 to provide the required driving force. It is worth mentioning that the elastic coefficients of each retaining component 60 in the two directions are slightly different, so that the driving force required to drive the movable component 20 to move in the X and Y directions is similar, so as to avoid the driving force required in one direction being larger, resulting in the driving coil 41 and the driving magnet 42 in this direction being larger, which is beneficial to reducing the overall size of the movable photosensitive component 1.

[0062] In some embodiments, Figure 1-Figure 3 As shown, the driving coil 41 further includes a first driving coil 411 and a second driving coil 412. The first driving coil 411 is arranged on a side of the first fixing plate 31 relatively away from the photosensitive chip 10. The second driving coil 412 is arranged between the first fixing plate 31 and the second fixing plate 32 and is located on one side of the photosensitive chip 10. The long side direction of the first driving coil 411 is perpendicular to the long side direction of the second driving coil 412, so as to drive the movable component 20 to move and rotate in a plane orthogonal to the optical axis of the photosensitive chip 10. The driving magnet 42 includes a first driving magnet 421 and a second driving magnet 422 fixed to the upper cover 72. The first driving magnet 421 and the second driving magnet 422 are respectively arranged relative to the first driving coil 411 and the second driving coil 412 relative to the optical axis direction of the photosensitive chip 10, that is, the Z-axis direction. When each of the driving coils 41 fixed on the movable component 20 is energized, each of the driving coils 41 interacts with the relative driving magnets 42 to generate a Lorentz force, thereby driving the movable component 20 to move. It is understood that in addition to the electromagnetic driving method in which the driving coils 41 and the driving magnets 42 cooperate, the driving component 40 can also be driven by a piezoelectric motor, etc., and this application does not make any specific restrictions.

[0063] In an optional embodiment, the first driving coil 411 is fixed to the movable component 20 outside the first fixed plate 31, and the long side direction of the first driving coil 411 is consistent with the extension direction of the first fixed plate 31, so that the structure of the movable photosensitive component 1 is more compact, and the first driving magnet 421 is fixed to the lower side of the upper cover 72 relative to the first driving coil 411, wherein the extension direction of the first driving magnet 421 is consistent with the long side direction of the first driving coil 411, and the N / S poles of the first driving magnet 421 are arranged along the short side direction of the first driving coil 411. The second drive coil 412 is arranged on one side of the photosensitive chip 10, and the long side direction of the second drive coil 412 is parallel to the side of the photosensitive chip 10, so as to reduce the space occupied by the second drive coil 412, which is conducive to reducing the overall size of the movable photosensitive component 1. The second drive magnet 422 is fixed to the lower side of the upper cover 72 opposite to the second drive coil 412, wherein the extension direction of the second drive magnet 422 is consistent with the long side direction of the second drive coil 412, and the N / S poles of the second drive magnet 422 are arranged along the short side direction of the second drive coil 412. It can be understood that the second drive coil 412 is located beside the first drive coil 411, and the long side direction of the second drive coil 412 is perpendicular to the long side direction of the first drive coil 411, so as to drive the movable component 20 to move in at least two directions in the orthogonal plane of the optical axis of the photosensitive chip 10, that is, the XY plane. It is worth mentioning that the second drive coil 412 is eccentrically arranged on one side of the photosensitive chip 10, that is, the midline of the second drive coil 412 perpendicular to its long side deviates from the geometric center of the photosensitive chip 10, so as to drive the movable component 20 to rotate in an orthogonal plane to the optical axis of the photosensitive chip 10.

[0064] In some embodiments, the driving coil 41 further includes a third driving coil 413, and the driving magnet 42 further includes a third driving magnet 423. The third driving coil 413 is disposed on one side of the photosensitive chip 10 and is opposite to the second driving coil 412. That is, the photosensitive chip 10 is located between the second driving coil 412 and the third driving coil 413, the long side direction of the third driving coil 413 is consistent with the long side direction of the second driving coil 412, and the third driving magnet 423 is fixed to the lower surface of the upper cover 72 so as to be arranged opposite to the third driving coil 413, wherein the extension direction of the third driving magnet 423 is consistent with the long side direction of the third driving coil 413, and the N / S poles of the third driving magnet 423 are arranged along the short side direction of the third driving coil 413. It is worth mentioning that the third drive coil 413 and the second drive coil 412 are symmetrically arranged relative to the optical axis center of the photosensitive chip 10, that is, the third drive coil 413 is also eccentrically arranged on one side of the photosensitive chip 10, that is, the midline of the third drive coil 413 perpendicular to its long side deviates from the geometric center of the photosensitive chip 10, so that the torque applied to the movable component in the orthogonal plane of the optical axis of the photosensitive chip 10, that is, the XY plane, is balanced, and the driving component 40 is able to drive the movable component 20 to rotate smoothly, thereby improving the operating reliability of the movable photosensitive component 1.

[0065] In an optional embodiment, the N pole of the first drive coil 411 is close to the central area of ​​the movable component 20, and the S pole is far away from the central area of ​​the movable component 20. The S poles of the second drive coil 412 and the third drive coil 413 are close to the central area of ​​the movable component 20, and the N poles are far away from the central area of ​​the movable component 20. By passing alternating current in different directions to each of the drive coils 41, driving forces in at least two directions are further generated to drive the movable component 20 to move in the XY plane.

[0066] In some embodiments, the driving component 40 also includes at least one Hall element 43, which can detect the position of the movable component 20. The Hall element 43 is fixed on the movable component 20 and is located between the first driving coil 411 and / or the second driving coil 412 and / or the third driving coil 413, so as to reduce the space occupied by the Hall element 43, thereby making the structure of the movable photosensitive component 1 more compact and reducing the overall volume.

[0067] In some embodiments, the flexure 51 is a plurality of V-shaped silicon wires arranged in parallel. When the movable component 20 is not driven by external force and is placed between the first fixed plate 31 and the second fixed plate 32, the V-shaped silicon wire is located in the plane where the movable component 20 and the fixed component 30 are located. When the movable component 20 is subjected to force and moves relative to the fixed component 30, the V-shaped silicon wire stretches or squeezes the oblique bending protrusion away from the plane where it is located, so that the movable component 20 and the fixed component 30 can be deformably electrically connected. In other embodiments, the flexure 51 is a plurality of parallel oblique silicon wires, and the height of the oblique silicon wire in the optical axis direction is less than 200μm, so as to reduce the height of the movable photosensitive component 1, which is conducive to reducing the overall height of the camera module. It is worth mentioning that the oblique silicon wire is suitable for semiconductor process molding and is easy to process.

[0068] In some embodiments, Figure 8 As shown, the base portion 71 includes a support member 712, a base plate 711, and the circuit board 80 arranged on the upper side of the base plate 711. The support member 712 is arranged above the base plate 711 to separate the movable component 20 from the base plate 711 and keep the movable component 20 movable in an orthogonal plane to the optical axis of the photosensitive chip 10, that is, in the XY plane. The fixed component 30 is fixed to the base portion 71 through the support member 712. That is, there is a gap between the movable component 20 and the base plate 711. In some cases, the distance of the gap is 100 μm-200 μm. The support block 712 is fixed on the base plate 711 and is slidably and frictionally connected to the movable component 20 located on the upper side of the base plate 711. The support block 712 is able to support and maintain the height of the movable component 20 in the direction perpendicular to the optical axis, that is, in the Z-axis direction, so that the movable component 20 moves on a constant XY plane, and is conducive to improving the flatness of the movable component 20. It can be understood that when the reinforcing plate 90 is fixed to the bottom of the movable component 20 and the fixed component 30, the support member 71 is arranged between the base plate 711 and the reinforcing plate 90.

[0069] In an optional embodiment, the support block 712 is a rectangular parallelepiped, further comprising an inner support block 713 and an outer support block 714, wherein the inner support block 713 is disposed in the region corresponding to the photosensitive chip 10 on the base plate 711, so as to support the movable assembly 20 to move in a plane in a constant vertical optical axis direction, i.e., an XY plane, and the outer support block 714 is fixed below the first fixing plate 31 and the second fixing plate 32, so that the first fixing plate 31 and the second fixing plate 32 are at the same height as the movable assembly 20, so as to improve the surface assembly accuracy of the movable assembly 20. It is understandable that the contact surface between the support block 712 and the movable assembly 20 is a smooth plane, preferably, with a roughness of less than 5 μm.

[0070] In another optional embodiment, the supporting member 712 is a ball bearing, and a groove adapted for the ball bearing is provided on the base plate 711. The ball bearing is accommodated in the groove, so as to support the movable component 20 to move in a rolling manner in an orthogonal plane to the optical axis of the photosensitive chip 10, so as to connect the movable component 20 by rolling friction to reduce friction.

[0071] The circuit assembly 50 further includes a resistor and capacitor component 53, which is placed on the base plate 711, so as to reduce the weight carried by the movable assembly 20, which is beneficial to reduce the rated driving force of the driving assembly 40. It is worth mentioning that the resistor and capacitor component 53 is arranged on the outside of the movable assembly 20, so as to reduce the height of the movable photosensitive assembly 1, and further reduce the overall size of the movable photosensitive assembly 1.

[0072] The present application also provides a camera module, including a lens assembly, a focus motor and the movable photosensitive assembly 1 as described above, wherein the lens assembly is equipped with at least one lens, and the focus motor is placed on the outside of the lens assembly to drive the lens assembly to move along its optical axis to achieve the focusing function of the camera module. The movable photosensitive assembly 1 is located below the lens assembly to achieve the anti-shake function of the camera module. The movable photosensitive assembly 1 has a compact structure, which is conducive to reducing the overall size of the camera module and reducing the weight of the camera module.

[0073] In some embodiments, the upper cover portion 72 of the movable photosensitive component 1 further includes a lens mount 721 and a color filter 722. The lens mount 721 is adapted to the lens assembly, and the color filter 722 is arranged on the lens mount 721 and is arranged relative to the photosensitive chip 10 along the optical axis direction, that is, the Z-axis direction, so as to filter out stray light entering the photosensitive chip 10.

[0074] In an alternative embodiment, if Figure 7As shown, the upper cover portion 72 is also provided with a magnetic sheet 723, and the magnetic sheet 723 is located between the upper cover portion 72 and the driving magnet 42. A limiting structure is provided on the lower side of the lens mount 721 to facilitate the placement of the magnetic sheet 723. The magnetic sheet 723 is attached to the lower surface of the lens mount 721 to avoid mutual interference between the magnetic field of the driving magnet 42 located below the lens mount 721 and the magnetic field of the focus motor located above the lens mount 721, so as to improve the operating reliability of the movable photosensitive component 1.

[0075] The above describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention to be protected. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. A movable photosensitive component, characterized in that: include: Fixing components; A retaining component, arranged on the fixing component; A movable component is movably connected to the fixed component through the retaining component, the movable component has a hollow area, and the fixed component is arranged in the hollow area; A photosensitive chip, arranged on the movable component; at least one flexure, movably connected to the movable component and the fixed component; At least one driving component is used to drive the movable component to move relative to the fixed component. The driving component is arranged on one side of the fixed component along the horizontal direction, and the photosensitive chip is arranged on the other side of the fixed component.

2. The movable photosensitive component according to claim 1, characterized in that: The hollow area on the movable component is opened between the photosensitive chip and the at least one driving component. The fixed component accommodated in the hollow area is arranged adjacent to the photosensitive chip and the at least one driving component located on both sides thereof. The at least one flexible portion is horizontally placed on the hollow area and close to the photosensitive chip.

3. The movable photosensitive component according to claim 2, characterized in that: The driving component and the photosensitive chip are respectively located on opposite sides of the hollow area. The driving component is horizontally arranged on a side of the fixed component relatively away from the photosensitive chip. The driving component is electrically connected to the movable component and is conductive to the movable component on one side of the photosensitive chip and is conductive to the flexible portion.

4. The movable photosensitive component according to claim 3, characterized in that: The flexible portion includes a first flexible portion and a second flexible portion, the first flexible portion and the second flexible portion are respectively located on both sides of the photosensitive chip, one end of the first flexible portion is connected to the fixed component located on one side of the movable component, the other end of the first flexible portion is connected to an adjacent side of the movable component close to the photosensitive chip, one end of the second flexible portion is located at the fixed component on the other side of the movable component, and the other end of the second flexible portion is connected to the other adjacent side of the movable component close to the photosensitive chip, so as to electrically connect the fixed component and the movable component.

5. The movable photosensitive component according to claim 2, characterized in that: The fixing component includes a first fixing plate and a second fixing plate, the first fixing plate and the second fixing plate are respectively located on opposite sides of the photosensitive chip, the first fixing plate is arranged in the hollow area of ​​the movable component, and the second fixing plate is arranged on a side of the movable component relatively away from the hollow area, and the movable component is suspendedly connected to the first fixing plate and the second fixing plate through the retaining component.

6. The movable photosensitive component according to claim 5, characterized in that: There are four retaining components, two of which are arranged at two ends of the first fixed plate, and the other two are arranged at two ends of the second fixed plate, so that the restoring force of the movable component relative to the fixed plate in at least two directions parallel to the photosensitive chip is balanced.

7. The movable photosensitive component according to claim 6, characterized in that: The driving component further includes a first driving coil and a second driving coil. The first driving coil is arranged on a side of the first fixed plate relatively away from the photosensitive chip, and the second driving coil is arranged between the first fixed plate and the second fixed plate, and is located on the adjacent side of the photosensitive chip relative to the first driving component. The long side direction of the first driving coil is perpendicular to the long side direction of the second driving coil, so as to drive the movable component to move and rotate in an orthogonal plane to the optical axis of the photosensitive chip.

8. The movable photosensitive component according to claim 7, characterized in that: The driving component also includes a third driving coil, which is arranged on one side of the photosensitive chip and opposite to the second driving coil. The photosensitive chip is located between the second driving coil and the third driving coil, and the long side direction of the third driving component is consistent with the long side direction of the second driving component.

9. The movable photosensitive component according to claim 8, characterized in that: The movable photosensitive component also includes a supporting component, which includes a base portion and an upper cover portion. The base portion is arranged below the movable component and the fixed component to support the movable component and the fixed component. The upper cover portion is arranged above the movable component and the fixed component and is buckled with the base portion to accommodate the movable component and the fixed component.

10. The movable photosensitive component according to claim 9, characterized in that: The driving component further includes at least one driving magnet, which is arranged opposite to the driving coil along the optical axis direction of the photosensitive chip and fixed to the upper cover.

11. The movable photosensitive component according to claim 10, characterized in that: The base portion includes a base plate and a support member, wherein the support member is arranged on the base plate and is used to separate the movable component from the base plate and keep the movable component movable in a plane orthogonal to the optical axis of the photosensitive chip, and the fixed component is fixed to the base portion.

12. The movable photosensitive component according to claim 11, characterized in that: The supporting member is a ball bearing, and a groove adapted for the ball bearing is provided on the base plate. The ball bearing is accommodated in the groove so as to support the movable component to move in a rolling manner in a plane orthogonal to the optical axis of the photosensitive chip.

13. The movable photosensitive component according to claim 1, characterized in that: The circuit component includes a conductive part and a flexible part, the conductive part includes a plurality of first conductive wires and a plurality of second conductive wires, the first conductive wires are arranged on the outside of the photosensitive chip and between the photosensitive chip and the flexible part, so as to electrically connect the photosensitive chip and the movable component, the second conductive wires are arranged on a side of the fixed component relatively away from the photosensitive chip, the second conductive wires and the flexible part are respectively located on both sides of the fixed component, so as to electrically connect the fixed component and the base plate, and the flexible part is located between the first conductive wires and the second conductive wires.

14. The movable photosensitive component according to any one of claims 1 to 13, characterized in that: The movable assembly includes a first movable plate, a second movable plate and a third movable plate, wherein the first movable plate and the second movable plate are respectively fixed to opposite sides of the third movable plate.

15. The movable photosensitive component according to any one of claims 1 to 13, characterized in that: The movable photosensitive component further includes a circuit board, which is disposed on the base plate and electrically connected to the fixed component.

16. The movable photosensitive component according to any one of claims 5 to 13, characterized in that: The movable photosensitive component also includes at least one reinforcement plate, which is respectively arranged at the bottom of the first fixed plate, the bottom of the second fixed plate and the bottom of the movable component to keep the first fixed plate, the second fixed plate and the movable component in a horizontal state.

17. The movable photosensitive component according to claim 16, characterized in that: The reinforcing plate has ferromagnetism and can generate an adsorption force with the driving magnet to maintain the distance between the upper cover portion of the movable photosensitive component and the base plate.

18. A camera module, characterized in that: include: A lens assembly, equipped with at least one lens; A focus motor, the focus motor being disposed outside the lens assembly; The movable photosensitive component as described in any one of claims 1-17 is located below the lens assembly, so that the image sensor senses light and forms an image.

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