Cold source integration device, heat dissipation system, controller and related method

Abstract

The invention discloses a cold source integration device, a heat dissipation system, a controller and a heat dissipation control method, and relates to the technical field of heat dissipation, the cold source integration device is connected with an air-liquid heat exchange mode assembly through a liquid cooling pipeline and connected with a liquid-liquid heat exchange mode assembly through a liquid cooling pipeline, and the air-liquid heat exchange mode assembly and the liquid-liquid heat exchange mode assembly are connected through the liquid cooling pipeline. The cold source integration device is used for providing cooling liquid through the liquid cooling pipeline, the cooling liquid sequentially passes through an air-liquid heat exchange mode assembly used for dissipating heat of a first device of the equipment and a liquid-liquid heat exchange mode assembly used for dissipating heat of a second device of the equipment, and the cold source integration device is further used for receiving the cooling liquid output after the second device is subjected to heat dissipation. According to the device, by supplying one path of cooling liquid, the requirements of different liquid cooling modes for the temperature are met, the number of cooling liquid supply lines is reduced, the number of cooling towers, the number of circulating pumps and the number of liquid cooling pipelines are reduced, and the system complexity is greatly reduced.

Description

[0001] This application is a divisional application. The application number of the original application is 202311724720.8, and the original application date is December 14, 2023. The entire contents of the original application are incorporated into this application by reference. Technical Field

[0002] The present application relates to the field of heat dissipation technology, and in particular to a cold source integrated device, a heat dissipation system, a controller, and a heat dissipation control method. Background Art

[0003] With the advent of the information age, massive amounts of data have been generated, and data centers (DCs) that store massive amounts of data have emerged. A data center is a specific network of devices that supports collaboration and is used to transmit, accelerate, display, calculate, and store data on a network infrastructure. As the computing power of chips in data centers increases, the power consumption of chips is also increasing. How to better utilize natural cooling sources (such as water and wind) to reduce power consumption and improve device reliability has become an important issue.

[0004] At present, the industry mainly uses the full liquid cooling mode to dissipate heat for equipment in the data center. Take the heat dissipation solution of the server in the data center as an example. The heat dissipation solutions of the server include liquid cooling plate heat dissipation and liquid cooling door heat dissipation. The liquid cooling plate heat dissipation circuit uses a liquid cooling distribution unit (CDU) or an embedded liquid cooling unit (ECU) to transfer the heat of large heat-generating devices such as chips to the primary side (i.e., the low-temperature side) of the ECU through a liquid-liquid heat exchange mode (a mode in which liquid is used as a heat transfer medium to flow in the internal flow channel of the liquid cooling plate and cooling is achieved through heat transfer), and then a circulating water pump is used to transport the heat to a closed cooling tower. The liquid cooling door heat dissipation circuit uses a liquid cooling door (a typical example is a water cooling door), and transfers the heat of small heat-generating devices such as memory and hard disks to the primary side of the liquid cooling door through an air-liquid heat exchange mode (a mode in which the hot air generated by the server is exchanged with the coolant provided by the cooling tower), and then a circulating water pump is used to transport the heat to a closed cooling tower.

[0005] Taking into account the different requirements of the liquid cooling plate and the liquid cooling door for the water temperature at the water inlet, the above liquid cooling solution usually requires one water circuit to supply water to the CDU and configure the corresponding cooling tower, circulating pump and other components to achieve the heat exchange treatment of the liquid cooling plate; the other water circuit is used to supply water to the liquid cooling door. Accordingly, the water circuit also needs to be equipped with corresponding cooling towers, circulating pumps and other components to achieve the heat exchange treatment of the liquid cooling door. The above two water circuits form circulation loops respectively. During the setting process, not only the requirements of the liquid cooling plate and the liquid cooling door for the water temperature must be considered, but also the location of the components in the water circuit, space occupancy and other issues need to be considered. This makes the entire water circuit setting complicated, requiring more cooling towers, circulating pumps and other components, which increases the cost. Summary of the invention

[0006] In response to the above problems, the present application provides a cold source integrated device, a heat dissipation system, a controller, and a heat dissipation control method, which solves the problem that the existing liquid cooling solutions have complex pipelines, require more cooling towers, circulating pumps and other components, and increase costs.

[0007] In the first aspect, the present application provides a cold source integrated device. The cold source integrated device is connected to an air-liquid heat exchange mode component through a liquid cooling pipeline (a pipeline for conveying coolant used for liquid cooling and heat dissipation, which can usually be a water cooling pipeline), and is connected to a liquid-liquid heat exchange mode component through a liquid cooling pipeline, and the air-liquid heat exchange mode component and the liquid-liquid heat exchange mode component are connected through a liquid cooling pipeline. Among them, the air-liquid heat exchange mode component refers to a component that exchanges heat between the hot air generated by the server and the coolant provided by the cooling tower, including but not limited to a liquid cooling door. The liquid-liquid heat exchange mode component refers to a component that uses liquid as a heat transfer medium to flow in the internal flow channel of the liquid cooling plate and realizes cooling through heat transfer, including but not limited to a liquid cooling plate heat dissipation control unit, and the liquid cooling plate heat dissipation control unit can be a liquid cooling distribution unit (Cooling Distribution Unit, CDU) or an embedded liquid cooling unit (Embedded Cooling Unit, ECU).

[0008] Specifically, the cold source integrated device is used to provide cooling liquid through a liquid cooling pipeline, and the cooling liquid flows through an air-to-liquid heat exchange mode component for dissipating heat to a first device of the equipment and a liquid-to-liquid heat exchange mode component for dissipating heat to a second device of the equipment. Then, the cold source integrated device is also used to receive the cooling liquid output by the liquid-to-liquid heat exchange mode component after dissipating heat to the second device.

[0009] The air-liquid heat exchange mode component and the liquid-liquid heat exchange mode component have different requirements for the temperature of the coolant. Generally, the temperature of the liquid inlet of the air-liquid heat exchange mode component is lower than that of the liquid-liquid heat exchange mode component. Therefore, the coolant first enters the air-liquid heat exchange mode component, and the air-liquid heat exchange mode component dissipates heat to the first device based on the coolant, and can take away the heat of the first device. At this time, the coolant will heat up because it takes away the heat of the first device. The heated coolant can still meet the temperature requirement of the liquid-liquid heat exchange mode component, and can enter the liquid-liquid heat exchange mode component again. The liquid-liquid heat exchange mode component dissipates heat to the second device based on the heated coolant. In this way, the cold source integrated device can meet the requirements of the air-liquid heat exchange mode component and the liquid-liquid heat exchange mode component through one channel of coolant, simplify the liquid cooling pipeline, reduce the number of components such as cooling towers and circulating pumps, and reduce costs. Moreover, the above components can be integrated into one piece, reduce the floor space, shorten the construction period, and are easy to deploy and maintain. In addition, the scheme reuses the coolant output by the air-liquid heat exchange mode component, thereby improving energy efficiency.

[0010] In some possible implementations, the coolant flows sequentially through an air-to-liquid heat exchange mode component for dissipating heat for a first device of the equipment and a liquid-to-liquid heat exchange mode component for dissipating heat for a second device of the equipment.

[0011] In some possible implementations, the cold source integrated device is specifically used to provide mixed coolant through the liquid cooling pipeline when the supplementary cooling condition is triggered, and the temperature of the mixed coolant meets the temperature requirements of the air-liquid heat exchange mode components. The device can adopt a supplementary cooling design of mixed coolant (supplementary cooling load so that the temperature of the coolant can meet the requirements), which can further simplify the system architecture and improve the system energy efficiency.

[0012] In some possible implementations, the cold source integrated device includes a cooling tower, a circulating pump, a three-way valve and a supplementary cooling machine, the cooling tower and the circulating pump are connected through a liquid cooling pipeline, the circulating pump and the supplementary cooling machine are connected through a liquid cooling pipeline, and the liquid cooling pipeline connecting the circulating pump and the supplementary cooling machine is deployed with a three-way valve. The cold source integrated device is specifically used for: when the supplementary cooling condition is triggered, adjusting the state of the three-way valve to a three-way state, so that the coolant provided by the cooling tower is divided into two paths after passing through the circulating pump, and the coolant in one of the two paths is mixed with the coolant in the other path after passing through the supplementary cooling machine to obtain a mixed coolant.

[0013] This solution adjusts the three-way valve to a three-way state so that the coolant is split and one path enters the supplementary cooling chiller before being mixed with the other path. There is no need to provide a separate circulation pump for the supplementary cooling line, thus achieving the reuse of the circulation pump, simplifying the system architecture and improving the system energy efficiency.

[0014] In some possible implementations, the circulation pump includes a primary circulation pump and a secondary circulation pump, and the three-way valve includes a first three-way valve and a second three-way valve. The cold source integration device is specifically used to: when the supplementary cooling condition is triggered, adjust the state of the first three-way valve to a three-way state, so that the coolant of the cooling tower is divided into two paths after passing through the primary circulation pump, and one of the two paths of coolant passes through the condenser of the supplementary cooling machine and the other path of coolant passes through the plate heat exchanger and merges in front of the cooling tower, and adjust the state of the second three-way valve to a three-way state, so that the coolant passing through the plate heat exchanger is divided into two paths after passing through the secondary circulation pump, and one of the two paths of coolant passes through the evaporator of the supplementary cooling machine and is mixed with the other path of coolant to obtain a mixed coolant.

[0015] This solution implements reuse of the primary circulation pump through the first three-way valve and reuse of the secondary circulation pump through the second three-way valve, thereby simplifying the system architecture, reducing the number of circulation pumps, and lowering costs.

[0016] In some possible implementations, the supplementary cooling condition includes that the liquid supply temperature is greater than or equal to a preset threshold. The cold source integrated device also includes a controller, which is used to control the state of the three-way valve to a three-way state and start the supplementary cooling machine when detecting that the liquid supply temperature is greater than or equal to the preset threshold. In this way, automatic supplementary cooling control based on temperature at the cold source end can be used to achieve on-demand cooling and fine adjustment.

[0017] In some possible implementations, the controller is specifically used to determine the bypass flow of the three-way valve based on the liquid supply temperature, the cooling temperature of the supplementary cooling machine, the required temperature of the air-liquid heat exchange mode component, and the flow required for heat dissipation, determine the opening ratio of the three-way valve based on the bypass flow, and adjust the state of the three-way valve to the three-way state according to the opening ratio.

[0018] This solution uses the law of conservation of energy to determine the bypass flow of the three-way valve, and then determines the valve opening ratio of the three-way valve based on the bypass flow. The state of the three-way valve is adjusted according to the valve opening ratio, which can more accurately control the temperature of the mixed coolant, thereby meeting the temperature requirements of the air-to-liquid heat exchange mode components.

[0019] In some possible implementations, the controller is also used to: control the liquid supply temperature of the cooling tower according to the wet-bulb temperature and the degree of approach of the cooling tower, and then control the secondary side temperature of the plate heat exchanger according to the liquid supply temperature and the degree of approach of the plate heat exchanger. In this way, the liquid supply temperature of the integrated cold source device (such as the secondary side temperature of the plate heat exchanger) can be linked with the wet-bulb temperature in the environment. When the wet-bulb temperature in the environment decreases, the liquid supply temperature of the integrated cold source device also decreases. On the machine room side, the embodiment is that the air outlet temperature of the air-liquid heat exchange mode component decreases, and the machine room temperature decreases.

[0020] In some possible implementations, the controller is further used to control the secondary side temperature of the plate heat exchanger according to the wet bulb temperature and the approach degree of the cooling tower and the approach degree of the plate heat exchanger. In this solution, the controller directly uses the secondary side temperature of the plate heat exchanger as an anchor point to perform temperature control, so that the liquid supply temperature of the integrated cold source device (such as the secondary side temperature of the plate heat exchanger) is linked with the wet bulb temperature in the environment.

[0021] In some possible implementations, the controller is also used to: detect that the temperature difference between the liquid outlet of the liquid-liquid heat exchange mode component and the liquid inlet of the air-liquid heat exchange mode component is lower than a set value, and reduce the opening of the electric valve deployed at the liquid inlet of the air-liquid heat exchange mode component. This can reduce the flow rate, reduce the power consumption of the secondary circulation pump, and achieve energy-saving control.

[0022] In some possible implementations, the circulation pump includes a primary circulation pump and a secondary circulation pump, a plate heat exchanger is arranged between the primary circulation pump and the secondary circulation pump, and the controller is also used to: detect that the temperature difference between the primary side liquid outlet and the primary side liquid inlet of the plate heat exchanger is lower than the set value, and control the primary circulation pump to operate with variable frequency; or, detect that the temperature difference between the primary side liquid outlet and the secondary side liquid inlet of the plate heat exchanger is lower than the approach of the plate heat exchanger, and control the primary circulation pump to operate with variable frequency. In this way, the power consumption of the primary circulation pump can be saved, and energy-saving control can be achieved.

[0023] In a second aspect, the present application provides a heat dissipation system. The heat dissipation system includes a cold source integrated device as provided in the first aspect of the present application, and an air-liquid heat exchange mode component and a liquid-liquid heat exchange mode component. The cold source integrated device is used to cooperate with the air-liquid heat exchange mode component and the liquid-liquid heat exchange mode component to dissipate heat for the device.

[0024] In a third aspect, the present application provides a heat dissipation control method. The method is applied to a cold source integrated device, the cold source integrated device includes a controller, a cooling tower, a circulating pump, a three-way valve and a supplementary cooling machine, the cooling tower and the circulating pump are connected through a liquid cooling pipeline, the circulating pump and the supplementary cooling machine are connected through a liquid cooling pipeline, the liquid cooling pipeline connecting the circulating pump and the supplementary cooling machine is deployed with the three-way valve, the method includes:

[0025] The controller detects the temperature of the liquid supply;

[0026] When the liquid supply temperature is greater than or equal to a preset threshold, the controller controls the state of the three-way valve to be a three-way state, and turns on the supplementary cooling machine so that the coolant in the cooling tower is divided into two paths after passing through the circulating pump, and one of the two paths of coolant is mixed with the other path of coolant after passing through the supplementary cooling machine to obtain a mixed coolant.

[0027] In some possible implementations, the controller controls the state of the three-way valve to be a three-way state, including:

[0028] The controller determines the bypass flow of the three-way valve according to the liquid supply temperature, the cooling temperature of the supplementary cooling machine, the required temperature of the air-liquid heat exchange mode component and the flow required for heat dissipation;

[0029] The controller determines the valve opening ratio of the three-way valve according to the bypass flow, and adjusts the state of the three-way valve to a three-way state according to the valve opening ratio.

[0030] In some possible implementations, the circulation pump includes a primary circulation pump and a secondary circulation pump, a plate heat exchanger is provided between the primary circulation pump and the secondary circulation pump, and the method further includes:

[0031] controlling the liquid supply temperature of the cooling tower according to the wet bulb temperature and the degree of approach of the cooling tower, and then controlling the secondary side temperature of the plate heat exchanger according to the liquid supply temperature and the degree of approach of the plate heat exchanger; or,

[0032] The secondary side temperature of the plate heat exchanger is controlled according to the wet bulb temperature, the proximity of the cooling tower, and the proximity of the plate heat exchanger.

[0033] In some possible implementations, the method further includes:

[0034] When it is detected that the temperature difference between the liquid outlet of the liquid-liquid heat exchange mode component and the liquid inlet of the air-liquid heat exchange mode component is lower than a set value, the opening of the electric valve deployed at the liquid inlet of the air-liquid heat exchange mode component is reduced.

[0035] In some possible implementations, the circulation pump includes a primary circulation pump and a secondary circulation pump, a plate heat exchanger is provided between the primary circulation pump and the secondary circulation pump, and the method further includes:

[0036] It is detected that the temperature difference between the primary side liquid outlet and the primary side liquid inlet of the plate heat exchanger is lower than the set value, and the primary circulation pump is controlled to operate with variable frequency; or,

[0037] It is detected that the temperature difference between the primary side liquid outlet and the secondary side liquid inlet of the plate heat exchanger is lower than the approach degree of the plate heat exchanger, and the primary circulation pump is controlled to operate at a variable frequency.

[0038] In a fourth aspect, the present application provides a controller. The controller includes a processor and an input-output unit, the input-output unit is used to communicate with a three-way valve in a cold source integrated device, and the processor is used to execute computer-readable instructions, so that the controller executes the heat dissipation control method provided in any implementation of the third aspect of the present application.

[0039] In some possible implementations, the controller further includes a memory, and the processor is specifically configured to:

[0040] The computer readable instructions are loaded from the memory and executed.

[0041] Based on the implementations provided in the above aspects, the present application can also be further combined to provide more implementations. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 A schematic diagram of the architecture of a data center provided for this application;

[0043] Figure 2 A schematic diagram of a liquid cooling pipeline of a cold source integrated device provided in this application;

[0044] Figure 3 A schematic diagram of another data center architecture provided for this application;

[0045] Figure 4 A schematic diagram of the circulation path of the coolant in a cold source integrated device or a heat dissipation system provided in the present application when the cooling source is not supplemented;

[0046] Figure 5 A schematic diagram of the circulation path of the coolant in a cooling source integrated device or a cooling system provided in the present application in a supplementary cooling operation state;

[0047] Figure 6 A schematic diagram of another data center architecture provided for this application;

[0048] Figure 7 A schematic diagram of determining the valve opening ratio of a three-way valve provided in the present application;

[0049] Figure 8 A schematic diagram of temperature control provided for this application;

[0050] Fig. 9 A schematic diagram of energy-saving control of a circulation pump provided in the present application;

[0051] Fig.10 A flow chart of a heat dissipation control method provided in this application. DETAILED DESCRIPTION

[0052] In order to solve the problem that the above-mentioned liquid cooling heat dissipation solution has complex pipelines and needs to configure multiple circulating pumps, cooling towers and other components, resulting in high costs, the present application provides a cold source integrated device and a heat dissipation system including the above-mentioned cold source integrated device. Among them, the cold source integrated device can be an integrated liquid cooling module. The heat dissipation system can include the above-mentioned cold source integrated device, an air-liquid heat exchange mode component (or called an air-liquid heat exchange device) and a liquid-liquid heat exchange mode component (or called a liquid-liquid heat exchange device). The cold source integrated device is connected to the air-liquid heat exchange mode component through a liquid cooling pipeline, and is connected to the liquid-liquid heat exchange mode component (such as a liquid cooling plate heat dissipation control unit such as an ECU or CDU) through a liquid cooling pipeline. The air-liquid heat exchange mode component and the liquid-liquid heat exchange mode component are connected through a liquid cooling pipeline. The cold source integrated device is used to provide coolant through the above-mentioned liquid cooling pipeline, and the coolant passes through the air-liquid heat exchange mode component for cooling the first device of the device and the liquid-liquid heat exchange mode component for cooling the second device of the device in turn, and then the cold source integrated device receives the coolant output after cooling the second device.

[0053] Among them, the air-cooled heat exchange mode component and the liquid-liquid heat exchange mode component have different requirements for the temperature of the coolant. Under normal circumstances, the temperature of the liquid inlet of the air-cooled heat exchange mode component (such as the liquid cooling door) is lower than the temperature of the liquid-liquid heat exchange mode component (such as the liquid cooling plate heat dissipation control unit such as ECU or CDU). Therefore, the coolant first enters the air-cooled heat exchange mode component, and the air-cooled heat exchange mode component dissipates heat to the first device based on the coolant, and can take away the heat of the first device. At this time, the coolant will heat up because it takes away the heat of the first device. The heated coolant can still meet the temperature requirements of the liquid-liquid heat exchange mode component, and can enter the liquid-liquid heat exchange mode component again. The liquid-liquid heat exchange mode component dissipates heat to the second device based on the heated coolant. In this way, the cold source integrated device can meet the requirements of the air-cooled heat exchange mode component and the liquid-liquid heat exchange mode component through one channel of coolant, simplify the liquid cooling pipeline, reduce the number of components such as cooling towers and circulating pumps, and reduce costs. Moreover, the above components can be integrated in an integrated manner, reduce the footprint, shorten the construction period, and are easy to deploy and maintain.

[0054] To facilitate understanding, the technical terms involved in this application are first introduced.

[0055] Liquid cooling refers to the technology of using liquid as a heat transfer medium to exchange heat for heat-generating devices in a computing system (such as a server in a data center) and conduct heat to the outside of the heat-generating device. Liquid cooling technology supports a variety of heat dissipation modes, including but not limited to liquid-to-liquid heat exchange (such as water-to-water heat exchange) mode and air-to-liquid heat exchange mode. Usually, the liquid-to-liquid heat exchange mode components include a liquid cooling plate heat dissipation control unit, and the liquid cooling plate heat dissipation circuit adopts liquid cooling distribution unit (Cooling Distribution Unit, CDU) or embedded liquid cooling unit (Embedded Cooling Unit, ECU) and other liquid-to-liquid heat exchange mode components, and the liquid-to-liquid heat exchange mode is used to dissipate heat for devices with larger heat generation, such as the central processing unit (CPU). The air-to-liquid heat exchange mode components include components such as liquid cooling doors in the cabinet or air-cooling terminal devices such as row-level air conditioners outside the cabinet to achieve heat exchange between the hot air generated by the server and the coolant. If the liquid cooling door heat dissipation circuit adopts a liquid cooling door, the air-to-liquid heat exchange mode is used to dissipate heat for devices with smaller heat generation, such as memory and hard disk. Alternatively, when the air-liquid heat exchange mode component is a row-level air conditioner, the air-liquid heat exchange process can be realized by the row-level air conditioner. For ease of description, the following embodiments are described by taking the liquid-liquid heat exchange mode component as a liquid cooling plate heat dissipation control unit and the air-liquid heat exchange mode component as a liquid cooling door as an example.

[0056] The liquid cooling distribution unit CDU is a liquid cooling control unit located inside the computer room of the data center, which is used to adjust the cooling capacity, temperature and flow rate of the cooling liquid of a group of cabinets.

[0057] The embedded liquid cooling unit ECU is pre-integrated into the cabinet. As a component of the cabinet, it is used to control the cooling capacity, temperature and flow rate of the coolant, etc. of the cabinet.

[0058] The principles of the liquid cooling door heat dissipation route and the liquid cooling plate heat dissipation route are described in detail below with reference to the accompanying drawings.

[0059] Figure 1 This is a schematic diagram of the architecture of a data center provided in this application. This application uses the example of heat dissipation of the cabinets contained in the data center by liquid cooling. Figure 1 As shown, the data center 100 includes a liquid cooling room 110 and a heat dissipation system 120 .

[0060] The liquid cooling room 110 includes a plurality of liquid cooling cabinets 111. The liquid cooling cabinet 111 is an entity that provides high-performance computing and dissipates heat for servers in the cabinet based on a liquid cooling method. For example, the liquid cooling cabinet 111 includes a plurality of server nodes. A server node can be an independent physical device.

[0061] The heat dissipation system 120 includes one or more heat dissipation subsystems, each of which is used to dissipate heat for the liquid-cooled cabinet 111. In order to improve the heat dissipation efficiency. When there are multiple heat dissipation subsystems in the heat dissipation system 120, different heat dissipation subsystems can dissipate heat for the liquid-cooled cabinet 111 through different heat dissipation circuits. For example, the liquid-cooled plate heat dissipation subsystem can dissipate heat for the liquid-cooled cabinet 111 through the liquid-cooled plate heat dissipation circuit, and the liquid-cooled door heat dissipation subsystem can dissipate heat for the liquid-cooled cabinet through the liquid-cooled door heat dissipation circuit.

[0062] The liquid cooling plate heat dissipation subsystem includes a cooling tower 121, a circulating pump 123 (for example, a circulating water pump, referred to as a water pump) and a liquid cooling plate heat dissipation control unit 125 (for example, a CDU). The cooling tower 121 is used to use a liquid cooling medium (for example, water) as a circulating cooling medium (coolant) to discharge heat into the atmosphere to reduce the temperature. The circulating pump 123 is used to provide power for conveying coolant, for example, it is suitable for conveying water or liquid cooling medium of physical and chemical properties in a high-pressure operating system. The cooling tower 121 can supply a coolant with a lower temperature, such as cold water, and the circulating pump 123 conveys the coolant to the CDU in the computer room. The CDU controls the cooling capacity of the liquid cooling cabinet 111, the temperature and flow rate of the coolant, thereby cooling the server nodes in the liquid cooling cabinet 111. The coolant can take away the heat of the liquid cooling cabinet 111, and return to the cooling tower 121 through the CDU and the circulating pump 123, and the cooling tower 121 performs heat exchange.

[0063] The liquid cooling door heat dissipation subsystem includes a cooling tower 122, a circulating pump 124, a plate heat exchanger 126 (referred to as plate exchange), and a liquid cooling door 128. Among them, the plate heat exchanger 126 is a new type of high-efficiency heat exchanger made of stacked metal plates with a certain corrugated shape. The plate heat exchanger 126 includes a gasket, a clamping plate (movable end plate, fixed end plate) and a frame (upper and lower guide rods, front support). The plates are sealed and guided by sealing gaskets to separate the cold / hot fluid channels. The cold / hot heat exchange medium flows through their respective channels and exchanges heat with the separated plates to achieve the temperature required by the user. The cooling tower 122 can supply a coolant with a lower temperature, such as cold water, and the circulating pump 124 delivers the coolant to the plate heat exchanger 126. When the temperature of the coolant separated by the plate heat exchanger 126 is less than 28°C, the coolant can be delivered to the liquid cooling door 128 to cool the server in the liquid cooling cabinet 111. The coolant can take away the heat of the liquid-cooled cabinet 111 and return to the cooling tower 122 for heat exchange.

[0064] Compared with the liquid-cooled plate heat dissipation subsystem, the liquid-cooled door heat dissipation subsystem has higher requirements for the temperature of the coolant. When the ambient temperature is high, the liquid-cooled door heat dissipation subsystem usually also needs to supplement the cold load (referred to as supplementary cooling) so that the coolant meets the temperature requirements of the liquid-cooled door heat dissipation subsystem. Specifically, the liquid-cooled plate heat dissipation subsystem also includes a circulating pump 12A, a chiller 12C, a circulating pump 12E and a cooling tower 12G. Specifically, when the temperature of the coolant separated by the plate heat exchanger 126 is greater than 28°C, the circulating pump 12A and the chiller 12C (usually a large unit) are turned on to supplement the cooling of the coolant separated by the plate heat exchanger 126, so that the coolant temperature is less than 28°C and then transported to the liquid-cooled door 128. In addition, the coolant (such as cold water) used for supplementary cooling of the chiller 12C can be provided by the cooling tower 12G. Among them, the cooling tower 12G can be an open cooling tower. The cooling tower 12G transports the coolant to the chiller 12C through the circulating pump 12E. The chiller 12 can further cool the coolant transported by the cooling tower through the refrigeration system, thereby providing a coolant with a temperature of 18°C. The chiller 12C can take away the heat after supplementary cooling with the coolant with a temperature of 18°C, and return it to the cooling tower 12G through the circulating pump 12E, and the cooling tower 12G performs heat exchange.

[0065] It should be noted that the cooling tower that provides coolant for the liquid cooling plate heat dissipation control unit 125 and the liquid cooling door 128, the circulating pump that transports the coolant and other components can also be reused, and the cooling tower, circulating pump and other components can be integrated to form a cold source integrated device.

[0066] Figure 2 A schematic diagram of a liquid cooling pipeline of a cold source integrated device provided in this application, such as Figure 2As shown, the cold source integrated device is used to provide cooling liquid through the liquid cooling pipeline, and the cooling liquid can sequentially pass through the liquid cooling door used to dissipate heat for the first device of the equipment (for example, a small heat-generating device of a server in a data center, including but not limited to a memory and a hard disk) and the liquid cooling plate control unit used to dissipate heat for the second device of the equipment (for example, a large heat-generating device of a server in a data center, including but not limited to a CPU). The cold source integrated device is also used to receive the cooling liquid output by the liquid cooling plate heat dissipation control unit after dissipating heat for the second device.

[0067] Figure 1 , Figure 2 The air-to-liquid heat exchange mode component is a liquid cooling door, and the liquid-to-liquid heat exchange mode component is a liquid cooling plate heat dissipation control unit. The heat dissipation components such as the liquid cooling door can usually be arranged inside a liquid cooling cabinet (the inside of a cabinet where a server using liquid cooling is located, which can also be referred to as the cabinet). Figure 1 , Figure 2 In order to facilitate the display of the flow direction of the coolant, the liquid cooling door is placed outside the liquid cooling cabinet in the figure. When the air-to-liquid heat exchange mode component is a row-level air conditioner, the row-level air conditioner can be set outside the cabinet. Among them, the row-level air conditioner can perform air-to-liquid heat exchange on the cabinets arranged in rows in the computer room, so as to achieve row-level cooling. In some examples, the air-to-liquid heat exchange mode component can also be a room-level air conditioner, which is usually set outside the cabinet to perform air-to-liquid heat exchange on multiple cabinets in the computer room, so as to achieve room-level cooling.

[0068] The technical solution realizes providing a channel of water coolant to meet the requirements of the liquid cooling door and the liquid cooling plate heat dissipation control unit at the same time. For example, the cold source integrated device provides a channel of coolant, which first enters the liquid cooling door to dissipate heat for the first device of the equipment. The coolant output from the liquid cooling door will heat up due to the heat it carries. Since the liquid inlet temperature of the liquid cooling door is lower than the liquid inlet temperature of the liquid cooling plate, the heated coolant can still meet the temperature requirements of the liquid cooling plate heat dissipation control unit. Therefore, the heated coolant can enter the liquid cooling plate heat dissipation control unit such as the ECU to dissipate heat for the second device of the equipment. The coolant output by the liquid cooling plate heat dissipation control unit after heat treatment of the second device returns to the cold source integrated device for heat exchange. The technical solution can reduce the number of coolant supply lines, the number of cooling towers, the number of circulating pumps and the number of liquid cooling pipelines, and reduce costs. Moreover, the solution can greatly reduce the complexity of the system, is easy to deploy and maintain, and shortens the construction period. In addition, the technical solution improves the energy utilization efficiency (Power Usage Effectiveness, PUE) by reusing the coolant output by the liquid cooling door, which can meet business needs.

[0069] Furthermore, the technical solution can use mixed coolant for supplementary cooling (e.g., mixed water for supplementary cooling), and can reuse circulation pumps (e.g., reuse primary circulation pumps and secondary circulation pumps), further simplifying the system architecture and improving system energy efficiency. In addition, the technical solution also supports integrated controllers, such as integrated embedded programmable logic controllers (PLCs), to achieve linkage of cooling systems, thereby achieving on-demand cooling and refined regulation.

[0070] The integrated cold source device of the present application and the heat dissipation system architecture including the integrated cold source device are described in detail below in conjunction with the accompanying drawings.

[0071] See also Figure 3 The schematic diagram of the architecture of a data center shown in the figure includes a liquid cooling room 310 and a heat dissipation system 320. The liquid cooling room 310 includes a plurality of liquid cooling cabinets 311, and the liquid cooling cabinets 311 include one or more server nodes. The server node can be an independent physical device. The heat dissipation system 320 includes a cold source integrated device 322, a liquid cooling door 324, and a liquid cooling plate heat dissipation control unit 326. Among them, the liquid cooling plate heat dissipation control unit 326 can be an ECU or a CDU. The cold source integrated device 322 is connected to the liquid cooling door 324 through a liquid cooling pipeline, and is connected to the liquid cooling plate heat dissipation control unit 326 through a liquid cooling pipeline. The liquid cooling door 324 and the liquid cooling plate heat dissipation control unit 326 are connected through a liquid cooling pipeline. The cold source integrated device 322, the liquid cooling door 324, and the liquid cooling plate heat dissipation control unit 326 cooperate to dissipate heat for the equipment.

[0072] In specific implementation, the cold source integrated device 322 is used to provide cooling liquid through the liquid cooling pipeline, and the cooling liquid can be a cooled liquid, for example, cold water. The cooling liquid sequentially passes through the liquid cooling door 324 for cooling the first device of the equipment (such as the server node) in the liquid cooling room 310 and the liquid cooling plate heat dissipation control unit 326 for cooling the second device of the equipment in the liquid cooling room 310. The cold source integrated device 322 is also used to receive the cooling liquid (for example, hot water) output by the liquid cooling plate heat dissipation control unit 326 after the heat dissipation treatment of the second device.

[0073] In some possible implementations, the cold source integrated device 322 is specifically used to provide mixed coolant through the liquid cooling pipeline when the supplementary cooling condition is triggered, so as to supplement the cooling of the coolant entering the liquid cooling door 324. The temperature of the mixed coolant meets the temperature requirement of the liquid cooling door 324. The temperature requirement of the liquid cooling door may be less than or equal to the target temperature, which may be 28°C or 25°C. The target temperature may be different depending on the application scenario. The supplementary cooling condition can be set according to business needs. For example, the supplementary cooling condition can be set to a liquid supply temperature greater than or equal to a preset threshold. The cold source integrated device 322 can achieve mixed coolant supplementary cooling by opening the three-way valve.

[0074] Specifically, the cold source integrated device 322 includes a cooling tower 3222, a circulating pump 3224, a three-way valve 3226 and a supplementary cooling machine 3228. Among them, the three-way valve 3226 and the supplementary cooling machine 3228 can be optional components. For example, in an area where the ambient temperature is maintained at a low level all year round, the cold source integrated device 322 does not need a supplementary cooling design, and thus the three-way valve 3226 or the supplementary cooling machine 3228 may not be included. This embodiment is illustrated by an example of an area where the ambient temperature changes significantly with the seasons. Due to the hot weather in summer and the high ambient temperature, in order to achieve supplementary cooling, the cold source integrated device 322 is configured with a three-way valve 3226 and a supplementary cooling machine 3228 for supplementary cooling. Among them, the cooling tower 3222 and the circulating pump 3224 are connected by a liquid cooling pipeline, the circulating pump 3224 and the supplementary cooling machine 3228 are connected by a liquid cooling pipeline, and the liquid cooling pipeline connecting the circulating pump 3224 and the supplementary cooling machine 3228 is deployed with a three-way valve 3226.

[0075] The cold source integrated device 322 is specifically used to adjust the state of the three-way valve 3226 to the three-way state when the supplementary cooling condition is triggered, so that the coolant in the cooling tower 3222 is divided into two paths after passing through the circulation pump 3224, and the coolant in one path of the two paths is mixed with the coolant in the other path after passing through the supplementary cooling machine 3228 to obtain a mixed coolant. The mixed coolant can meet the temperature requirement of the liquid cooling door 324.

[0076] The circulation pump 3224 may include a primary circulation pump 3224A and a secondary circulation pump 3224B, and correspondingly, the three-way valve 3226 includes a first three-way valve 3226A and a second three-way valve 3226B. The primary circulation pump 3224A is connected to the first three-way valve 3226A, and the secondary circulation pump is connected to the second three-way valve 3226B. The cold source integrated device 322 is specifically used to adjust the state of the first three-way valve 3226A to a three-way state when the supplementary cooling condition is triggered, so that the coolant of the cooling tower 3222 is divided into two paths after passing through the primary circulation pump 3224A, and one of the two paths of coolant passes through the condenser of the supplementary cooling machine 3228 and the other path of coolant passes through the plate heat exchanger 3225 and merges in front of the cooling tower 3222, and the state of the second three-way valve 3226B is adjusted to a three-way state, so that the coolant passing through the plate heat exchanger 3225 is divided into two paths after passing through the secondary circulation pump 3224B, and one of the two paths of coolant passes through the evaporator of the supplementary cooling machine 3228 and mixes with the other path of coolant to obtain a mixed coolant. The mixed coolant can achieve supplementary cooling and can meet the temperature requirements of the liquid cooling door 324.

[0077] Considering that the cooling pump 3222 and the plate heat exchanger 3225 can output the coolant to supply the coolant to the downstream equipment, the cold source integrated device 322 can decide whether to open the three-way valve 3224 to mix the coolant and supplement the coolant entering the liquid cooling door 324 based on the liquid supply temperature of the cooling pump 3222 and the plate heat exchanger 3225, or the final liquid supply temperature of the entire cold source integrated device 322. In other words, the liquid supply temperature in the supplementary cooling condition can be the liquid supply temperature of the cooling tower 3222, the liquid supply temperature of the plate heat exchanger 3225 (such as the secondary side liquid outlet temperature) or the final liquid supply temperature of the entire cold source integrated device 322. Accordingly, the preset thresholds corresponding to the supply temperatures at different points can be different. For example, the preset threshold corresponding to the liquid supply temperature of the cooling tower 3222 can be set to 32°C, and the preset threshold corresponding to the final liquid supply temperature of the entire cold source integrated device 322 can be set to 28°C.

[0078] It should be noted that the cooling tower 322 in the cold source integrated device 322 of the present application can be an open cooling tower or a closed cooling tower. The cooling liquid of the closed cooling tower flows in a closed pipe without contacting the outside air. The heat is exchanged with the outside air, spray water, etc. through the heat exchanger tube wall. The cooling liquid will not be polluted, evaporated, or concentrated, and no water replenishment or drug addition is required, thereby ensuring the performance and life of the associated equipment. The cooling liquid of the open cooling tower circulates in an open system. The cooling liquid is concentrated due to evaporation and needs to be replenished. In addition, the cooling liquid is directly in contact with the air and is exposed to sunlight, and is easily polluted, such as producing algae and salt crystals. Therefore, it is usually necessary to treat the cooling liquid, such as applying drugs to prevent the growth of algae and salt crystals. Figure 3Taking the cooling tower 322 as an example of an open cooling tower, the cold source integrated device 322 also includes a cooling liquid treatment device 3223A, which is used to descale, filter, soften or sterilize the cooling liquid. Among them, a three-way valve 3227 can also be connected between the cooling liquid treatment device 3223A and the plate heat exchanger 3225. Similarly, a cooling liquid treatment device 3223B can also be included between the liquid outlet of the liquid cooling cabinet 311 and the plate heat exchanger 3225, which is used to descale, filter, soften or sterilize the cooling liquid output after the heat dissipation treatment of the liquid cooling cabinet 311. The above-mentioned cooling liquid treatment device 3223A or cooling liquid treatment device 3223B can be an optional component. For example, when the cold source integrated device 322 adopts a closed cooling tower, the above-mentioned cooling liquid treatment device 3223A and cooling liquid treatment device 3223B may not be included.

[0079] In some possible implementations, the cold source integrated device 322 may also be integrated with a refilling device 3229. For example, the refilling device 3229 may be a constant pressure refilling device. The constant pressure refilling device is a pressure stabilizing refilling device, which includes a pressure stabilizing tank, a water pump, a pressure switch, an intelligent control box, a safety valve, a base and a pipeline, and is used to reduce the number of startups of the circulation pump 3224, and can adjust the water pressure and water volume of the system, making it easy to achieve automatic refilling. Similarly, the refilling device 3229 may be an optional component. When the cold source integrated device 322 does not include the above-mentioned refilling device 3229, the pressure and flow rate may be adjusted manually.

[0080] Figure 3 The cold source integrated device 322 shown or the heat dissipation system 320 including the cold source integrated device 322 has multiple operating states. For example, the operating state of the cold source integrated device 322 or the heat dissipation system 320 can be divided into: non-cooling supplement operating state and cooling supplement operating state according to whether the cooling supplement condition is triggered. The following introduces the circulation paths (such as water circulation paths) of the coolant under different operating states of the above-mentioned cold source integrated device 322 or the heat dissipation system 320.

[0081] When the cold source integrated device 322 or the heat dissipation system 320 is in a non-supplementing operation state, the coolant does not need to be supplemented with coolant, and thus will not pass through the supplementing cooler, but will circulate on the primary side and secondary side of the plate heat exchanger 3225 respectively. Among them, the coolant provided by the cooling tower 3222 is transported to the plate heat exchanger 3225 through the primary circulation pump 3224A for heat exchange, and the primary side of the plate heat exchanger 3225 can output the coolant with increased temperature, which is returned to the cooling tower 3222 after being processed by the coolant treatment device 3223A, thereby realizing a single cycle. The coolant with reduced temperature obtained by the heat exchange of the plate heat exchanger 3225 can be output from the secondary side of the plate heat exchanger 3225. The coolant output from the secondary side liquid outlet of the plate heat exchanger 3225 is transported to the liquid cooling door 324 through the secondary circulation pump 3224B, and the liquid cooling door 324 dissipates heat to the first device according to the coolant. Then the coolant is output from the liquid outlet of the liquid cooling door 324 and enters the liquid cooling plate heat dissipation control unit 326, and the liquid cooling plate heat dissipation control unit 326 dissipates heat to the second device. The coolant output from the liquid outlet of the liquid cooling plate heat dissipation control unit 326 is processed by the coolant treatment device 3223B and reaches the secondary side liquid inlet of the plate heat exchanger 3225, thereby realizing secondary circulation.

[0082] For ease of understanding, the present application also introduces the circulation path of the coolant in conjunction with the accompanying drawings.

[0083] See also Figure 4 The schematic diagram of the circulation path of the coolant in a non-supplementing cooling operation state is shown, and the cold source integration device 322 or the heat dissipation system 320 includes a primary circulation and a secondary circulation.

[0084] During one cycle, the circulation path of the coolant is 1->2->3->4->5->6->7, and the three-way valves between 2->3 and 5->6 are in a two-way state. In other words, the coolant of the cooling tower 3222 passes through the primary circulation pump 3224A, reaches the first three-way valve 3224A, and then is output from a passage of the first three-way valve 3224A to reach the plate heat exchanger 3225, for example, to the primary side liquid inlet of the plate heat exchanger 3225, and the plate heat exchanger 322 (for example, through the primary side liquid outlet) transports the coolant to the three-way valve 3227, and the three-way valve 3227 transports the coolant to the coolant treatment device 3223A for treatment, and then returns to the cooling tower 3222.

[0085] During the secondary circulation, the circulation path of the coolant is 8->9->10->11->12->13, and the three-way valve between 9->10 is in a two-way state. In other words, after the coolant in the open cooling tower 3222 passes through the plate heat exchanger 3225 for heat exchange, it is transported to the secondary circulation pump 3224B through the secondary side liquid outlet of the plate heat exchanger 3225. The secondary circulation pump 3224B transports the coolant to the second three-way valve 3224B. Since the second three-way valve 3224B is in a two-way state, the coolant is output from one passage (normally closed passage) of the second three-way valve 3224B and reaches the liquid cooling room 310. The coolant first enters the liquid cooling door 324 to dissipate heat for small heat-generating devices such as memory and hard disk in the server node of the liquid cooling cabinet 311. The coolant takes away the heat from the memory and hard disk, which may cause the temperature of the coolant to rise. The heated coolant can then enter the liquid cooling plate heat dissipation control unit 326 (such as ECU). The ECU can control the flow rate of the coolant to dissipate the heat of large heat-generating devices such as the CPU in the server node of the liquid cooling cabinet 311. The coolant takes away the heat from the CPU, which may cause the temperature of the coolant to rise further. The heated coolant can reach the plate heat exchanger 3225 (for example, the secondary side liquid inlet of the plate heat exchanger 3225) after being processed by the coolant processing device 3223B. Among them, the plate heat exchanger 3225 can recycle the heated coolant for heat exchange.

[0086] When the cold source integrated device 322 or the heat dissipation system 320 is in the supplementary cooling operation state, the coolant needs to be supplemented with cooling to meet the temperature requirement of the liquid cooling door 324. In other words, in the supplementary cooling operation state, the coolant also needs to enter the supplementary cooling machine 3228. Specifically, when the coolant circulates on the primary side and the secondary side of the plate heat exchanger 3225, it will also be diverted to enter the supplementary cooling machine 3228. Among them, the coolant provided by the cooling tower 3222 is transported to the first three-way valve 3226A through the primary circulation pump 3224A, and is divided into two ways by the first three-way valve 3226A and respectively transported to the plate heat exchanger 3225 and the supplementary cooling machine 3228 for heat exchange. The coolant output from the primary side liquid outlet of the plate heat exchanger 3225 and the coolant output from the condenser of the supplementary cooling machine 3228 are processed by the coolant treatment device 3223A and then merged in front of the cooling tower 3222, thereby realizing a single cycle. The coolant with a lowered temperature obtained by heat exchange in the plate heat exchanger 3225 can be output from the secondary side of the plate heat exchanger 3225. The coolant output from the secondary side liquid outlet of the plate heat exchanger 3225 is transported to the second three-way valve 3226B through the secondary circulation pump 3224B, and is divided into two paths by the second three-way valve 3226B, one of which enters the evaporator of the supplementary cooling machine 3228 for heat exchange, and the coolant output from the evaporator is mixed with the other coolant to form a mixed coolant. The mixed coolant first enters the liquid cooling door 324, and then enters the liquid cooling plate heat dissipation control unit 326. The coolant output from the liquid outlet of the liquid cooling plate heat dissipation control unit 326 is processed by the coolant treatment device 3223B and reaches the secondary side liquid inlet of the plate heat exchanger 3225, thereby realizing secondary circulation.

[0087] For ease of understanding, the present application also introduces the circulation path of the coolant in conjunction with the accompanying drawings.

[0088] See also Figure 5 The schematic diagram of the circulation path of the coolant in a supplementary cooling operation state is shown, and the cold source integration device 322 or the heat dissipation system 320 includes a primary circulation and a secondary circulation.

[0089] In one cycle, the circulation path of the coolant can be 1->2->4->5->7->8 and 1->2->3->6->7->8. Among them, the three-way valve between 2->3 and 5->7 is in a three-way state. The coolant output from point 2 is diverted through the three-way valve to enter the condenser of the supplementary cooling machine 3228, and then passes through point 6 and converges at the three-way valve in front of the cooling tower 3222. In other words, the coolant of the cooling tower 3222 passes through a circulation pump 3224A and reaches the first three-way valve 3224A. Since the first three-way valve 3224A is in a three-way state, the coolant is divided into two paths. One path passes through the plate heat exchanger 3225 and reaches the coolant treatment device 3223A through a passage of the three-way valve 3227. The other path passes through the condenser of the supplementary cooling machine 3228 for condensation and then reaches the coolant treatment device 3223A through another passage of the three-way valve 3227. The coolant treatment device 3223A descales, filters, softens or sterilizes the above two paths of coolant and then merges them in front of the cooling tower.

[0090] During the secondary circulation, the circulation path of the coolant can be 9->10->12->14->15->16 and 9->10->11->13->14->15->16. Among them, the three-way valve between 10->12 is in a three-way state, and part of the coolant output from point 12 passes through point 11, and after being cooled by the evaporator of the supplementary cooling machine 3228, it is mixed with the coolant at point 12 to become a cold source that meets the cooling temperature requirements of the server node. In other words, after the coolant in the cooling tower 3222 passes through the plate heat exchanger 3225 for heat exchange, it is transported to the secondary circulation pump 3224B. The secondary circulation pump 3224B transports the coolant to the second three-way valve 3224B. Since the second three-way valve 3224B is in a three-way state, the coolant is output from the two passages of the second three-way valve 3224B respectively. One passage of the coolant reaches the evaporator of the supplementary cooling machine 3228 for evaporation and cooling, and then mixes with the other passage of the coolant. The temperature of the mixed coolant can meet the temperature requirement of the liquid cooling door 324 and can be input into the liquid cooling door 324. The liquid cooling door 324 dissipates heat to the small heating devices in the equipment based on the mixed coolant. The coolant takes away the heat of the small heating devices, which may cause the temperature of the coolant to increase. The heated coolant can then enter the liquid cooling plate heat dissipation control unit 326 (such as ECU). The ECU can control the flow rate of the coolant to dissipate the large heating devices in the server nodes of the liquid cooling cabinet 311. The heated coolant is processed by the coolant treatment device 3223B and then reaches the plate heat exchanger 3225. The plate heat exchanger 3225 can heat exchange and circulate the heated coolant.

[0091] It should be noted that Figure 4 , Figure 5 The same point number can indicate different points, for example Figure 4 Midpoint No. 3 and Figure 5 The midpoint number 3 indicates different passages of the three-way valve.

[0092] In the above scheme, the cold source end can be integrated as a whole, for example, a circulation pump 3224 (such as a primary circulation pump 3224A, a secondary circulation pump 3224B), a plate heat exchanger 3225, a three-way valve 3226 (a first three-way valve 3226A and a second three-way valve 3226B) and a supplementary cooling machine 3228 can be integrated in the container, and then the container is integrated with the cooling tower 3222 to form a cold source integrated device 322. In this device, the supplementary cooling design is based on a mixed coolant solution that reuses a primary circulation pump and a secondary circulation pump, which greatly simplifies the system architecture and improves the system energy efficiency.

[0093] Further, see Figure 6 , the cold source integrated device 322 can also integrate a controller 3221. The controller 3221 is used to implement linkage control based on liquid temperature, thereby realizing on-demand cooling and forming a normal temperature machine room. Among them, the controller 3221 can be implemented by a PLC control board. Specifically, the controller 3221 can detect whether the supplementary cooling condition is triggered. For example, the controller 3221 can detect whether the liquid supply temperature (also called the water supply temperature when the coolant is cold water) is greater than or equal to a preset threshold. Specifically, the cold source integrated device 322 can deploy a temperature sensor at a set point, and the temperature sensor can detect the temperature of the coolant at the set point. The temperature sensor establishes a communication connection with the controller 3221, and the temperature sensor can report the detection result to the controller 3221, so that the controller 3221 can obtain the liquid supply temperature.

[0094] When the liquid supply temperature is greater than or equal to the preset threshold, it indicates that the supplementary cooling condition is triggered. The controller can control the state of the three-way valve 3224 to be a three-way state and turn on the supplementary cooling machine 3228 to achieve supplementary cooling control.

[0095] Among them, when the supplementary cooling condition is triggered, the controller 3221 can adjust the state of the first three-way valve 3224A to a three-way state, so that the coolant of the cooling tower 3222 is divided into two paths after passing through the primary circulation pump 3224A, and one of the two paths of coolant passes through the condenser of the supplementary cooling machine 3228 and the other path of coolant passes through the plate heat exchanger 3225 and merges in front of the cooling tower, and the state of the second three-way valve 3224B is adjusted to a three-way state, so that the coolant passing through the plate heat exchanger 3225 is divided into two paths after passing through the secondary circulation pump 3224B, and one of the two paths of coolant passes through the evaporator of the supplementary cooling machine 3228 and mixes with the other path of coolant to obtain a mixed coolant. The mixed coolant meets the temperature requirement of the liquid cooling door 324.

[0096] When performing supplementary cooling control, the controller 3221 can determine the bypass flow of the three-way valve 3224 based on the liquid supply temperature, the cooling temperature of the supplementary cooling machine 3228, the required temperature of the liquid cooling door and the flow required for heat dissipation, determine the opening ratio of the three-way valve 3224 based on the bypass flow, and adjust the state of the three-way valve 3224 to the three-way state according to the opening ratio.

[0097] Furthermore, the controller 3221 can also control the liquid supply temperature to be linked with the ambient temperature to reduce the overall power consumption and achieve energy-saving control. Similarly, the controller 3221 can also perform energy-saving control on the primary circulation pump 3224A and the secondary circulation pump 3224B to improve the energy efficiency of the system.

[0098] Still Figure 6 Taking the example, the linkage control of the controller 3221 is described in detail.

[0099] The control points of the controller 3221 include, but are not limited to, the fan frequency of the cooling tower 3222, the frequency of the primary circulation pump 3224A, the opening of the electric valve (including a three-way valve and a two-way valve), the operating parameters of the supplementary cooling machine 3228, the operating parameters of the liquid replenishing device 3229, the operating parameters of the coolant treatment device 3223, and the operating parameters of the liquid cooling plate heat dissipation control unit 326 (such as an ECU). Among them, the operating parameters of the supplementary cooling machine 3228 include the input frequency and the outlet liquid temperature of the variable frequency compressor, the operating parameters of the liquid replenishing device 3229 may include the start and stop state of the liquid pump (such as a water pump), the operating parameters of the coolant treatment device 3223 include the start and stop state of the coolant treatment device 3223, and the operating parameters of the liquid cooling plate heat dissipation control unit 326 include the opening of the primary side proportional valve (such as the reused V5, V6, or a separate proportional valve), the secondary side liquid supply temperature, and the liquid pump frequency.

[0100] The controller 3221 can collect data, and then analyze the collected data, and control the above control points through the analysis results. The data collected by the controller 3221 may include one or more of the operating parameters of the cooling tower 3222, the external environment temperature, the operating parameters of the primary circulation pump 3224A, the opening of the electric valve (including three-way valves and two-way valves, such as V1 to V7 in the figure), the temperature collected by the temperature sensor, the pressure collected by the pressure sensor, the operating parameters of the liquid replenishing device 3229, the operating parameters of the coolant treatment device 3223, the operating parameters of the supplementary cooling machine 3228, the parameters of the flow meter, and the operating parameters of the liquid cooling plate heat dissipation control unit 326.

[0101] The operating parameters of the cooling tower 3222 collected by the controller 3221 include one or more of fan frequency, power consumption, liquid outlet temperature, and liquid inlet temperature. The ambient temperature collected by the controller 3221 includes dry bulb temperature and wet bulb temperature. The dry bulb temperature is the actual temperature of the air in contact with the surface of the sphere, and the wet bulb temperature is the temperature of the sphere after the water evaporates and takes away the heat when water is attached to the surface of the sphere. The evaporation of water is related to the humidity of the air. The greater the air humidity, the smaller the evaporation, the less heat is taken away by evaporation, and the smaller the difference between the dry and wet bulb temperatures; the smaller the air humidity, the greater the evaporation of water, the greater the heat taken away by evaporation, and the greater the dry and wet bulb temperature difference. Therefore, the current air humidity condition can be reflected by the change law of the dry and wet bulb temperature difference. Based on this, the wet bulb temperature can also be determined by the dry bulb temperature and relative humidity. The operating parameters of the primary circulation pump 3224A collected by the controller 3221 include one or more of the operating frequency, power consumption, inlet pressure, and outlet pressure. The operating parameters of the liquid replenishing device 3229 collected by the controller 3221 may include the start and stop status of the liquid replenishing device 3229, and the operating parameters of the coolant treatment device 3223 collected by the controller 3221 may include the start and stop status of the coolant treatment device 3223. The operating parameters of the supplementary cooling machine 3228 collected by the controller 3221 include the input frequency and the liquid outlet temperature of the variable frequency compressor. The operating parameters of the liquid cooling plate heat dissipation control unit 326 collected by the controller 3221 may include the opening of the primary side proportional valve, the secondary side liquid supply temperature, and the liquid pump frequency.

[0102] When the controller 3221 detects that the liquid supply temperature is greater than or equal to a preset threshold, for example, the controller 3221 detects that the liquid supply temperature of the integrated cold source device 322 is greater than 32 degrees Celsius for three consecutive times, the controller 3221 can control the first three-way valve 3224A and the second three-way valve 3224B (for example, Figure 6 The state of V1 and V4 in the valve is a three-way state, and the supplementary cooling machine 3228 is turned on. Among them, the three-way valve usually includes a normally open passage and a normally closed passage. Figure 6 In the example, the normally open passage is also equipped with an electric valve (e.g. Figure 6 For this purpose, the controller 3221 can also control the states of V2 and V3 to be open valve states, thereby closing the normally open passage.

[0103] Among them, the controller 3221 is used to determine the bypass flow of the three-way valve according to the liquid supply temperature, the cooling temperature of the supplementary cooling machine 3228, the required temperature of the liquid cooling door 324 and the flow required for heat dissipation, and then determine the opening ratio of the three-way valve (such as V1, V4) according to the bypass flow, and adjust the state of the three-way valve to the three-way state according to the valve opening ratio.

[0104] The following uses V4 as an example to illustrate the process of determining the valve opening ratio. Specifically, the valve opening ratio (opening degree) of the V4 valve corresponds to the flow rate one by one. The valve opening ratio (also called bypass opening degree) of V4 can be determined by calculating the required bypass flow rate. The bypass flow rate can be calculated based on the law of energy conservation. Figure 7 As shown, the temperature of the coolant flowing into V4 is recorded as T1, and the flow rate of the coolant flowing into V4 is the flow rate required for heat dissipation (for example, the flow rate required for heat dissipation of the server in the liquid cooling cabinet 311), recorded as Q3. The coolant is divided into two paths when passing through V4, and the temperature of the two paths of coolant remains unchanged, still T1, and the flow rates of the two paths of coolant are Q1 and Q2 respectively. Among them, the coolant with a flow rate of Q2 drops to T2 after passing through the supplementary cooling machine 3228, and then merges with the coolant with a flow rate of Q1.

[0105] Based on the law of conservation of energy, the following model can be established:

[0106] Q1*T1+Q2*T2=Q3*T3 (1)

[0107] Q3=Q1+Q2 (2)

[0108] Among them, Q3 is the flow required for server heat dissipation, Q3 can usually be obtained by sensor measurement, and T1 can be obtained based on the wet-bulb temperature and the approach of the cooling tower 3222. Among them, the approach of the cooling tower 3221 can be the difference between the coolant temperature (such as water temperature) after cooling by the cooling tower 3221 and the wet-bulb temperature, which is used to indicate the degree to which the coolant temperature after cooling by the cooling tower 3221 approaches the wet-bulb temperature. Normally, the approach of the cooling tower 3221 can be 3-4°C. T2 can be set, for example, T2 can be set to 15°C, and similarly, T3 can be set to 32°C. Based on the formula in the above model, Q1 and Q2 (bypass flow) can be solved.

[0109] After the controller 3221 determines the valve opening ratio based on the bypass flow, it can send the valve opening ratio to the corresponding three-way valve, so as to control the state of the three-way valve to be a three-way state according to the valve opening ratio.

[0110] Similarly, when the controller 3221 starts the supplementary cooling machine 3228, it can also send a start instruction to the supplementary cooling machine. After receiving the start instruction, the supplementary cooling machine 3228 can start the supplementary cooling.

[0111] Furthermore, in order to avoid the disadvantages of high-temperature computer rooms, improve the reliability of information technology (IT) equipment, reduce IT power consumption, and achieve global optimization, the integrated cold source device 322 can also perform global linkage control based on the coolant temperature.

[0112] One control method is that the controller 3221 controls the cooling tower supply temperature according to the wet bulb temperature and the proximity of the cooling tower, and then controls the secondary side temperature of the plate heat exchanger 3225 according to the supply temperature and the proximity of the plate heat exchanger.

[0113] Specifically, see Figure 8 A schematic diagram of temperature control is shown, in which the cooling tower 3222 controls the liquid supply temperature of the cooling tower 3222 (when the coolant is water, specifically the outlet water temperature) by the wet-bulb temperature and the approximation of the cooling tower 3222, and then the secondary side temperature of the plate heat exchanger 3225 is controlled by the liquid supply temperature of the cooling tower 3222 and the approximation of the plate heat exchanger 3225. In other words, when controlling the secondary side temperature of the plate heat exchanger 3225, it can be controlled by two anchor points. In this way, the liquid supply temperature of the integrated cold source device 322 is linked with the wet-bulb temperature. When the wet-bulb temperature of the external environment decreases, the liquid supply temperature of the integrated cold source device 322 also decreases. On the side of the liquid cooling room 310, it is reflected that the outlet air temperature of the liquid cooling door decreases, and the temperature of the liquid cooling room 310 decreases.

[0114] The controller 3221 can also simultaneously manage the liquid cooling plate heat dissipation control unit 326 such as ECU. The secondary side temperature can be set to the primary side temperature + approximation. At this time, the liquid supply temperature of the liquid cooling plate heat dissipation control unit 326 changes with the wet-bulb temperature of the external environment. When the temperature of the external environment is low, under the same business model, the temperature of the server node in the liquid cooling cabinet 311 is reduced, and the IT power consumption is reduced.

[0115] Another control method is that the controller 3221 controls the secondary side temperature of the plate heat exchanger 3225 according to the wet bulb temperature and the proximity of the cooling tower 3222 and the proximity of the plate heat exchanger 3225. In other words, the controller 3221 directly uses the secondary side temperature of the plate heat exchanger 3225 as an anchor point for temperature control.

[0116] In some possible implementations, the controller 3221 can also perform energy-saving control on the circulation pump 3224, such as the primary circulation pump 3224A and the secondary circulation pump 3224B. A plate heat exchanger 3225 is provided between the primary circulation pump 3224A and the secondary circulation pump 3224B. The controller 3221 can perform energy-saving control on the circulation pump 3224 in combination with the liquid outlet temperature or the liquid inlet temperature of the plate heat exchanger 3225.

[0117] For the primary circulation pump 3224A, the controller 3221 can respectively deploy temperature sensors at the primary side liquid inlet and the primary side liquid outlet of the plate heat exchanger 3225 after the primary circulation pump 3224A. The controller 3221 is used to detect the temperature of the primary side liquid outlet and the primary side liquid inlet of the plate heat exchanger 3225 after the primary circulation pump 3224A, for example, the temperature of the primary side liquid outlet and the primary side liquid inlet reported by the receiving temperature sensor. When the temperature difference between the primary side liquid outlet and the primary side liquid inlet of the plate heat exchanger 3225 is lower than the set value (for example, 9°C), the controller 3221 is used to control the primary circulation pump 3224A to operate at a variable frequency to save power consumption. Similarly, the controller 3221 can also control the primary circulation pump 3224A based on the proximity of the plate heat exchanger 3225 to save power consumption. In specific implementation, the controller 3221 can respectively deploy temperature sensors at the primary side liquid outlet and the secondary side liquid inlet of the plate heat exchanger 3225. When it is detected that the temperature difference between the primary side liquid outlet and the secondary side liquid inlet of the plate heat exchanger 3225 is lower than the approximation degree of the plate heat exchanger 3225 (for example, 1°C to 1.5°C), the primary circulation pump 3224A is controlled to operate at a variable frequency.

[0118] For secondary circulation pump 3224B, see Fig. 9 , the controller 3221 can deploy temperature sensors at the liquid outlet of the liquid cooling plate heat dissipation control unit 326 and the liquid inlet of the liquid cooling door 324. In addition, the controller 3221 can also deploy an electric valve at the liquid inlet of the liquid cooling door 324, and the controller 3221 is used to detect the temperature T1 of the liquid inlet of the liquid cooling door 324 and the temperature T2 of the liquid outlet of the liquid cooling plate heat dissipation control unit 326. When the temperature difference (T2-T1) between the liquid outlet of the liquid cooling plate heat dissipation control unit 326 and the liquid inlet of the liquid cooling door 324 is lower than the set value (for example, 9°C), the controller 3221 is also used to reduce the opening of the electric valve deployed at the liquid inlet of the liquid cooling door 324. In this way, the flow rate can be reduced and the power consumption of the secondary circulation pump 3224B can be reduced.

[0119] Based on the cold source integrated device 322 and the heat dissipation system 320 of the aforementioned embodiments, the present application also provides a heat dissipation control method.

[0120] The heat dissipation control method disclosed in the present application is described in detail below in conjunction with the accompanying drawings.

[0121] See also Fig.10A flow chart of a heat dissipation control method is shown, and the method is applied to a cold source integrated device 322, and the cold source integrated device 322 includes a controller 3221, a cooling tower 3222, a circulation pump 3224, a three-way valve 3226, and a supplementary cooling machine 3228. Among them, the cooling tower 3222 and the circulation pump 3224 are connected through a liquid cooling pipeline, and the circulation pump 3224 and the supplementary cooling machine 3228 are connected through a liquid cooling pipeline. The liquid cooling pipeline connecting the circulation pump 3224 and the supplementary cooling machine 3228 is deployed with a three-way valve 3224. The method includes the following steps:

[0122] S1002, the controller 3221 detects the liquid supply temperature. When the liquid supply temperature is greater than or equal to a preset threshold, S1004 is executed.

[0123] Specifically, the controller 3221 can deploy a temperature sensor at the liquid outlet of the cooling tower 3222, through which the liquid supply temperature (for example, the outlet water temperature) of the cooling tower 3222 can be detected. In some examples, the controller 3221 can also deploy a temperature sensor at the liquid outlet (such as the secondary side liquid outlet) of the plate heat exchanger 3225, or at the end (output end) of the entire cold source integrated device 322, and detect the liquid supply temperature of the plate heat exchanger 3225 or the final liquid supply temperature of the entire cold source integrated device 322 through the above-mentioned temperature sensor.

[0124] When the supply temperature is greater than or equal to the preset threshold, it indicates that the supplementary cooling condition is triggered, and the controller 3221 can perform supplementary cooling control. The controller 3221 can control the three-way valve 3224 to be in a three-way state to mix the coolants in different paths for supplementary cooling.

[0125] S1004, the controller 3221 determines the bypass flow of the three-way valve 3224 according to the liquid supply temperature, the cooling temperature of the supplementary cooling chiller 3228, the required temperature of the liquid cooling door, and the flow required for heat dissipation.

[0126] The flow rate of the coolant entering the three-way valve 3224 is equal to the sum of the flow rates of the different output paths of the three-way valve. The sum of the energy of the coolants in different paths is equal to the energy of the mixed coolant. Based on this, the controller 3221 can model the supply temperature, the cooling temperature of the supplementary cooling machine 3228, the required temperature of the liquid cooling door, and the required flow rate for heat dissipation through the law of conservation of energy, thereby establishing Figure 7 The controller 3221 determines the bypass flow of the three-way valve 3224 by solving the model.

[0127] In some possible implementations, the circulation pump 3224 includes a primary circulation pump 3224A and a secondary circulation pump 3224B, and the three-way valve 3226 includes a first three-way valve 3226A and a second three-way valve 3226B. Accordingly, the controller 3221 determines the bypass flow of the second three-way valve 3224B according to the liquid supply temperature, the cooling temperature of the supplementary cooling machine 3228, the required temperature of the liquid cooling door 324, and the required flow for heat dissipation. The controller 3221 can also determine the bypass flow of the first three-way valve 3224A in a similar manner.

[0128] S1006. The controller 3221 determines the valve opening ratio of the three-way valve 3224 according to the bypass flow rate, and adjusts the state of the three-way valve 3224 to the three-way state according to the valve opening ratio.

[0129] The bypass flow of the three-way valve 3224 corresponds to the valve opening ratio of the three-way valve 3224, and the controller 3221 can determine the valve opening ratio of the three-way valve 3224 according to the bypass flow. Then the controller 3221 can send the valve opening ratio to the three-way valve 3224, so as to adjust the state of the three-way valve 3224 to the three-way state according to the valve opening ratio.

[0130] When the three-way valve 3226 includes a first three-way valve 3226A and a second three-way valve 3226B, the controller 3221 can determine the opening ratio of the first three-way valve 3226A according to the bypass flow of the first three-way valve 3226A, and determine the opening ratio of the second three-way valve 3226B according to the bypass flow of the second three-way valve 3226B.

[0131] The controller 3221 can adjust the state of the first three-way valve 3226A to a three-way state according to the opening ratio of the first three-way valve 3226A, so that the coolant in the cooling tower 3222 is divided into two paths after passing through the primary circulation pump 3224A. One of the two paths of coolant passes through the condenser of the supplementary cooling machine 3228 and the other path of coolant passes through the plate heat exchanger 3225 and then converges in front of the cooling tower 3222.

[0132] The controller 3221 can adjust the state of the second three-way valve 3226B to a three-way state according to the opening ratio of the second three-way valve 3226B, so that the coolant passing through the plate heat exchanger 3225 is divided into two paths after passing through the secondary circulation pump 3224B, and one of the two coolant paths is mixed with the other coolant after passing through the evaporator of the supplementary cooling machine 3228 to obtain a mixed coolant.

[0133] It should be noted that the above S1004 and S1006 are a specific implementation method for the controller 3221 to control the state of the three-way valve 3224 to be a three-way state. In other possible implementation methods of the embodiments of the present application, the controller 3221 can also control the state of the three-way valve 3224 to be a three-way state according to a preset valve opening ratio (for example, a default valve opening ratio).

[0134] S1008, the controller 3221 turns on the supplementary cooling machine 3228 so that the coolant in the cooling tower 3222 is divided into two paths after passing through the circulation pump 3224, and the coolant in one path is mixed with the coolant in the other path after passing through the supplementary cooling machine 3228 to obtain a mixed supplementary cooling liquid.

[0135] Specifically, the controller 3221 can send a start instruction to the supplementary cooling machine 3228 to start the supplementary cooling machine 3228.

[0136] It should be noted that the above S1004 and S1006 can be executed in parallel with S1008, or can be executed in sequence, which is not limited in the embodiment of the present application.

[0137] In some possible implementations, the controller 3221 may also perform global temperature control, or perform energy-saving control on the circulation pump 3224 .

[0138] When performing global temperature control, the controller 3221 can control the supply temperature of the cooling tower according to the wet-bulb temperature and the proximity of the cooling tower, and then control the secondary side temperature of the plate heat exchanger 3225 according to the supply temperature and the proximity of the plate heat exchanger, so as to realize the linkage between the supply temperature of the integrated cold source device 322 and the wet-bulb temperature. The controller 3221 can also control the secondary side temperature of the plate heat exchanger 3225 according to the wet-bulb temperature and the proximity of the cooling tower 3222 and the proximity of the plate heat exchanger 3225, so as to realize the linkage between the supply temperature of the integrated cold source device 322 and the wet-bulb temperature.

[0139] When performing energy-saving control on the circulation pump 3224, the controller 3221 can detect the temperature of the primary side liquid outlet and the primary side liquid inlet of the plate heat exchanger 3225 after the circulation pump (for example, the primary circulation pump 3224A). When the temperature difference between the primary side liquid outlet and the primary side liquid inlet of the plate heat exchanger 3225 is lower than the set value, the circulation pump (for example, the primary circulation pump 3224A) is controlled to operate at a variable frequency, so that the power consumption of the primary circulation pump 3224A can be saved. In some examples, the controller 3221 also supports energy-saving control of the primary circulation pump 3224A based on the approximation of the plate heat exchanger 3225. Specifically, the controller 3221 detects that the temperature difference between the primary side liquid outlet and the secondary side liquid inlet of the plate heat exchanger 3225 is lower than the approximation of the plate heat exchanger 3225, and controls the primary circulation pump 3224A to operate at a variable frequency to reduce the power consumption of the primary circulation pump 3224A.

[0140] The controller 3221 can also detect the temperature of the liquid outlet of the liquid cooling plate heat dissipation control unit 326 (for example, ECU) and the liquid inlet of the liquid cooling door 324. When the temperature difference between the liquid outlet of the liquid cooling plate heat dissipation control unit 326 and the liquid inlet of the liquid cooling door 324 is lower than the set value, the opening of the electric valve deployed at the liquid inlet of the liquid cooling door 324 is reduced, thereby reducing the power consumption of the secondary circulation pump 3224B.

[0141] Based on the above heat dissipation control method, the embodiment of the present application further provides a controller 3221. The controller 3221 may be a PLC control board, which is a digital electronic device with a microprocessor, a digital logic controller for automatic control, and the PLC control board may execute control instructions (computer-readable instructions) to execute the above heat dissipation control method.

[0142] Specifically, the controller 3221 includes a processor and an input-output module. The processor may be a CPU or a microprocessor, and the input-output module may be a network card or a transceiver. The input-output module may communicate with the circulation pump 3224 and the three-way valve 3226 in the cold source integrated device 322. For example, the input-output module may receive (input) and send (output) various types of electrical or electronic signals, and use them to control or monitor almost all types of mechanical and electrical systems. The processor may execute computer-readable instructions, so that the controller 3221 executes the aforementioned heat dissipation control method.

[0143] Furthermore, the controller 3221 may also include a memory, and the memory may store computer-readable instructions. Accordingly, the processor is specifically used to load the computer-readable instructions from the memory and execute the computer-readable instructions, so that the controller 3221 executes the above-mentioned heat dissipation control method.

[0144] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0145] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A liquid cooling cabinet, characterized in that: The liquid cooling cabinet comprises an air-liquid heat exchange mode component and a liquid-liquid heat exchange mode component, and the liquid-liquid heat exchange mode component and the air-liquid heat exchange mode component are connected via a liquid cooling pipeline; The cooling liquid passes through the air-to-liquid heat exchange mode component and the liquid-to-liquid heat exchange mode component in sequence, and the cooling liquid is used to dissipate heat for the equipment in the liquid cooling cabinet.

2. The liquid cooling cabinet according to claim 1, characterized in that: The air-to-liquid heat exchange mode component includes a liquid cooling door.

3. The liquid cooling cabinet according to claim 1 or 2, characterized in that: The liquid-liquid heat exchange mode component includes a liquid cooling distribution unit CDU and / or an embedded liquid cooling unit CDU.

4. The liquid cooling cabinet according to any one of claims 1 to 3, characterized in that: The cooling liquid is used to dissipate heat from the equipment in the liquid cooling cabinet, including: The coolant sequentially passes through the air-to-liquid heat exchange mode component for dissipating heat from a first device of the equipment and the liquid-to-liquid heat exchange mode component for dissipating heat from a second device of the equipment, wherein the heat generated by the second device is greater than the heat generated by the first device.

5. The liquid cooling cabinet according to any one of claims 1 to 4, characterized in that: The coolant is provided by a cold source integrated device, which includes a cooling tower, a circulating pump, a three-way valve and a supplementary cooling machine. The cold source integrated device is connected to the air-to-liquid heat exchange mode component and the liquid-to-liquid heat exchange mode component through the liquid cooling pipeline.

6. The liquid cooling cabinet according to claim 5, characterized in that: The cold source integrated device is specifically used for: When the supplementary cooling condition is triggered, a mixed coolant is provided through the liquid cooling pipeline, and the temperature of the mixed coolant meets the temperature requirement of the air-liquid heat exchange mode component.

7. A data center, characterized in that: The data center comprises a liquid cooling cabinet according to any one of claims 1 to 6.

8. A heat dissipation system, characterized in that: The heat dissipation system includes a liquid-cooled cabinet and a cold source integrated device as described in any one of claims 1 to 6, wherein the cold source integrated device is connected to the liquid-cooled cabinet through liquid cooling management, and the cold source integrated device provides cooling liquid to the liquid-cooled cabinet through the liquid cooling pipeline, and the cooling liquid is used to flow through the air-liquid heat exchange mode component and the liquid-liquid heat exchange mode component in sequence.

9. The heat dissipation system according to claim 8, characterized in that: The cold source integrated device is specifically used for: When the supplementary cooling condition is triggered, a mixed coolant is provided through the liquid cooling pipeline, and the temperature of the mixed coolant meets the temperature requirement of the air-liquid heat exchange mode component.

10. The heat dissipation system according to claim 9, characterized in that: The cold source integrated device comprises a cooling tower, a circulating pump, a three-way valve and a supplementary cooling machine, wherein the cooling tower and the circulating pump are connected via a liquid cooling pipeline, the circulating pump and the supplementary cooling machine are connected via a liquid cooling pipeline, and the liquid cooling pipeline connecting the circulating pump and the supplementary cooling machine is provided with the three-way valve; The cold source integrated device is specifically used for: When the supplementary cooling condition is triggered, the state of the three-way valve is adjusted to a three-way state so that the coolant provided by the cooling tower is divided into two paths after passing through the circulation pump, and one of the two paths of coolant is mixed with the other path of coolant after passing through the supplementary cooling chiller to obtain a mixed coolant.

11. The heat dissipation system according to claim 10, characterized in that: The circulation pump includes a primary circulation pump and a secondary circulation pump, and the three-way valve includes a first three-way valve and a second three-way valve; The cold source integrated device is specifically used for: When the supplementary cooling condition is triggered, the state of the first three-way valve is adjusted to a three-way state, so that the coolant in the cooling tower is divided into two paths after passing through the primary circulation pump, and one of the two coolant paths passes through the condenser of the supplementary cooling machine and merges with the other coolant path through the plate heat exchanger in front of the cooling tower, and the state of the second three-way valve is adjusted to a three-way state, so that the coolant passing through the plate heat exchanger is divided into two paths after passing through the secondary circulation pump, and one of the two coolant paths passes through the evaporator of the supplementary cooling machine and mixes with the other coolant path to obtain a mixed coolant.

12. The heat dissipation system according to claim 10 or 11, characterized in that: The cooling supplement condition includes that the liquid supply temperature is greater than or equal to a preset threshold value, and the cold source integrated device also includes a controller, which is used to: When it is detected that the liquid supply temperature is greater than or equal to the preset threshold, the state of the three-way valve is controlled to be a three-way state, and the supplementary cooling machine is turned on.

13. The heat dissipation system according to claim 12, characterized in that: The controller is specifically used for: Determining the bypass flow of the three-way valve according to the liquid supply temperature, the cooling temperature of the supplementary cooling machine, the required temperature of the air-liquid heat exchange mode component and the flow required for heat dissipation; The opening ratio of the three-way valve is determined according to the bypass flow, and the state of the three-way valve is adjusted to a three-way state according to the opening ratio.

14. The heat dissipation system according to claim 12, characterized in that: The controller is also used for: The supply liquid temperature of the cooling tower is controlled according to the wet bulb temperature and the approach of the cooling tower, and then the secondary side temperature of the plate heat exchanger is controlled according to the supply liquid temperature and the approach of the plate heat exchanger.

15. The heat dissipation system according to claim 12, characterized in that: The controller is also used for: The secondary side temperature of the plate heat exchanger is controlled according to the wet bulb temperature, the proximity of the cooling tower, and the proximity of the plate heat exchanger.

16. The heat dissipation system according to any one of claims 12 to 15, characterized in that: The controller is also used for: When it is detected that the temperature difference between the liquid outlet of the liquid-liquid heat exchange mode component and the liquid inlet of the air-liquid heat exchange mode component is lower than a set value, the opening of the electric valve deployed at the liquid inlet of the air-liquid heat exchange mode component is reduced.

17. The heat dissipation system according to any one of claims 12 to 15, characterized in that: The circulation pump comprises a primary circulation pump and a secondary circulation pump, a plate heat exchanger is arranged between the primary circulation pump and the secondary circulation pump, and the controller is further used for: It is detected that the temperature difference between the primary side liquid outlet and the primary side liquid inlet of the plate heat exchanger is lower than the set value, and the primary circulation pump is controlled to operate with variable frequency; or, It is detected that the temperature difference between the primary side liquid outlet and the secondary side liquid inlet of the plate heat exchanger is lower than the approach degree of the plate heat exchanger, and the primary circulation pump is controlled to operate at a variable frequency.

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