Board placing device and control method thereof

Abstract

The invention relates to a board placing device and a control method thereof, and relates to the technical field of PCB automatic machining, the board placing device comprises a protection cover, a controller installed outside the protection cover and a rack installed in the protection cover, the rack is provided with a feeding table close to the feeding end, and the rack is provided with a discharging table close to the discharging end; an anti-sticking mechanism is arranged on the feeding table, the anti-sticking mechanism comprises first moving equipment, a plurality of fixed anti-sticking assemblies and a plurality of movable anti-sticking assemblies, and the first moving equipment is used for driving the movable anti-sticking assemblies to move in the direction close to or away from the fixed anti-sticking assemblies; a thickness detection mechanism is mounted above the discharging end; a moving mechanism is arranged above the feeding table and the discharging table and comprises second moving equipment and adsorption equipment, and the second moving equipment is used for driving the adsorption equipment to move in the direction close to or away from the feeding table or the discharging table. The method has the effect of improving the automatic processing efficiency of the flexible PCB.

Description

Technical Field

[0001] The present application relates to the technical field of automated processing of PCB boards, and in particular to a board placement device and a control method thereof. Background Art

[0002] During the PCB processing, each process usually needs to be connected by a PCB placing machine. The PCB placing machine can quickly and continuously move the PCB from one position to another and accurately place it in the correct position, which can effectively improve the efficiency of PCB automated processing.

[0003] Existing board placement machines usually load and unload materials through the cooperation of conveyor belts, rollers and other conveying mechanisms and grabbers. Such board placement machines can usually only handle PCB boards of a specific width and thickness, and have low adaptability to boards of different specifications. When the thickness of the PCB board is thin, the overall hardness of the PCB board is low, and it is easy to detach from the conveying mechanism during the transmission process and cannot be grabbed by the grabber. In addition, static electricity is easily generated between the two boards, causing them to stick to each other. Therefore, the existing board placement machine cannot be applied to thinner PCB soft boards, resulting in a relatively limited use scenario of the board placement machine. Summary of the invention

[0004] The purpose of this application is to provide a board placement device and a control method thereof, which can improve the automated processing efficiency of PCB soft boards.

[0005] In the first aspect, the present application provides a board placement device that adopts the following technical solution: A board placing device comprises a protective cover, a controller installed outside the protective cover and a frame installed inside the protective cover, wherein the frame is provided with a loading platform near a loading end and a unloading platform near a unloading end; The loading platform is provided with an anti-sticking mechanism, which includes a first moving device, a plurality of fixed anti-sticking components and a plurality of mobile anti-sticking components, wherein the fixed anti-sticking components are fixedly installed in the middle of the loading platform, and the mobile anti-sticking components are movably installed at both ends of the loading platform through the first moving device, and the first moving device is used to drive the mobile anti-sticking components to move toward or away from the fixed anti-sticking components; The unloading platform is provided with a conveying mechanism, which moves towards the unloading end, and a thickness detection mechanism is installed above the unloading end; A moving mechanism is provided above the loading platform and the unloading platform, and the moving mechanism includes a second moving device and an adsorption device, and the adsorption device is movably mounted on the frame through the second moving device, and the second moving device is used to drive the adsorption device to move toward or away from the loading platform or the unloading platform; The anti-sticking mechanism, the conveying mechanism, the thickness detecting mechanism and the moving mechanism are respectively connected to the controller for communication.

[0006] By adopting the above technical scheme, considering that when the thickness of the PCB board is thin, the overall hardness of the PCB board is low, it is easy to detach from the conveying mechanism during the transmission process and cannot be grabbed by the grab hook, and static electricity is easily generated between the two boards, causing the problem of sticking to each other, the present application sets an anti-sticking mechanism on the loading table to prevent the PCB boards placed on the loading table from sticking to each other, and also sets a thickness detection mechanism at the unloading end of the unloading table to detect the thickness of the unloaded PCB boards, thereby further ensuring that the PCB boards transmitted to the unloading end do not have the problem of excessive thickness caused by the adhesion of two boards. In addition, the present application uses an adsorption device to adsorb the PCB board and move it from the loading table to the unloading table, which is more suitable for the material of the PCB soft board and can effectively improve the efficiency of the automated processing of the PCB soft board.

[0007] Furthermore, the adsorption device includes a supporting assembly and several suction cup assemblies installed at the bottom of the supporting assembly. The suction cup assembly includes a magnetic block, a magnetic suction part, a connecting part and a suction cup part from top to bottom. The magnetic suction part is used to cooperate with the magnetic block to fix the suction cup assembly to the bottom of the supporting assembly.

[0008] By adopting the above-mentioned technical solution, the suction cup assembly of the present application is connected to the bottom of the support assembly through the magnetic suction part and the magnetic block, which makes it easy to adjust and replace the position of the suction cup assembly at any time, so that the present application can be applicable to PCB boards of different sizes and models, thereby improving the adaptability of the board placement device to different PCB boards.

[0009] Furthermore, the support assembly includes a first support plate, a second support plate and a plurality of support columns, the first support plate is connected to the second mobile device, the first support plate and the second support plate are connected via a plurality of support columns, and the second support plate is connected to the plurality of suction cup assemblies.

[0010] By adopting the above-mentioned technical solution, the present application forms a support assembly by connecting two support plates and a number of support columns. The hollowing out between the two support plates can reduce the weight, ensure the stability of the adsorption device when the second mobile device drives it to move, and at the same time leave adjustment space for the suction cup assembly.

[0011] Further, the second mobile device includes a horizontal moving component and a vertical moving component, the horizontal moving component includes a first slide rail and a first slider, the first slide rail is installed on the frame along the horizontal direction, and the first slider is slidably connected to the first slide rail; The vertical moving assembly includes a second slide rail and a second slider, the second slide rail is installed on the first slider along the vertical direction, the second slider is slidably connected to the second slide rail, and the adsorption device is installed on the second slider.

[0012] By adopting the above-mentioned technical solution, the present application drives the adsorption device to move to the loading table to adsorb the PCB board through the second mobile device, and then drives the adsorption device to move the PCB board to the unloading table, and realizes movement in the horizontal and vertical directions through the horizontal moving component and the vertical moving component, thereby ensuring the stable transportation of the PCB board.

[0013] Furthermore, the loading platform is provided with two loading stations, the plurality of fixed anti-sticking components are installed between the two loading stations, and the plurality of movable anti-sticking components are respectively installed at two ends of the two loading stations away from the fixed anti-sticking components; The fixed anti-sticking component and the movable anti-sticking component both include a support block, and the support block is provided with an anti-sticking brush and a plurality of vents on a side close to the loading station, and the vents are used to connect to an external air source and ventilate toward the loading station.

[0014] By adopting the above technical solution, the present application can load two PCB boards at the same time by setting up a double workstation. The anti-sticking component includes an anti-sticking brush and a vent. The vent is used to ventilate the upper feeding station, which can effectively prevent static electricity from being generated between the stacked PCB boards and thus prevent them from sticking together. The anti-sticking brush further ensures that the PCB boards will not stick together when the adsorption equipment adsorbs them, thereby improving the applicability to PCB soft boards.

[0015] Furthermore, the first moving device is installed under the loading platform, and a plurality of movable limiting grooves are provided at both ends of the loading platform. The plurality of movable anti-sticking components pass through the movable limiting grooves and are connected to the first moving device. The movable anti-sticking component moves in the movable limiting groove toward the direction of approaching or fixing the anti-sticking component through the first moving device.

[0016] By adopting the above-mentioned technical scheme, the present application cooperates with the fixed anti-sticking component and the mobile anti-sticking component. The mobile anti-sticking component can freely adjust its position in the mobile limit groove, so that the size of the workstation can be adjusted according to the actual size of the PCB board, thereby improving the applicability to PCB boards of different sizes.

[0017] Further, the first mobile device includes a sliding assembly, a transmission assembly and a locking assembly, the sliding assembly is connected to the transmission assembly, and the sliding assembly is used to drive the transmission assembly to move; The locking assembly is installed above the transmission assembly. When the locking assembly is closed, it is connected to the transmission assembly and used to lock the transmission assembly. When the locking assembly is released, it is separated from the transmission assembly and used to release the transmission assembly.

[0018] By adopting the above technical solution, the present application adjusts the position of the mobile anti-sticking component through the sliding component and the transmission component, and the locking component locks the transmission component so that the mobile anti-sticking component can be fixed in the desired position, thereby ensuring the stability of the anti-sticking mechanism.

[0019] Furthermore, the sliding assembly includes a sliding rod and two connecting plates, the two ends of the sliding rod are fixed to the two ends of the bottom of the loading platform, the connecting plate is slidably connected to the sliding rod, and the tops of the two connecting plates are respectively connected to the mobile anti-sticking assemblies at the two ends of the loading platform; The transmission assembly includes pulleys installed at both ends of the bottom of the loading platform and belt strips connecting the pulleys, and the connecting plate is connected to the belt strips; The locking assembly comprises a driving member and a clamping member, wherein the driving member is used to drive the clamping member to be connected with the belt strip when closed and to be separated from the belt strip when released.

[0020] By adopting the above-mentioned technical solution, the present application drives the mobile anti-sticking component to move through the sliding rod and the connecting plate, and realizes the locking and loosening of the mobile anti-sticking component through the linkage of the pulley, the belt strip, the driving part and the clamping part, thereby ensuring the reliability of the anti-sticking mechanism when in use.

[0021] Furthermore, the thickness detection mechanism includes a plurality of thickness sensors, which are used to detect whether the thickness of the PCB board transmitted by the conveying mechanism to the unloading end is within a preset thickness range. When the thickness of the PCB board is not within the thickness range, an error signal is generated and the error signal is uploaded to the controller.

[0022] By adopting the above technical solution, the present application further ensures that there is no sticking of two PCB boards during unloading through a thickness measuring sensor, thereby ensuring the efficiency and reliability when processing the PCB soft board.

[0023] In the second aspect, the present application provides a control method for a board placement device using the following technical solution: A control method for a board placing device, comprising: After the PCB board is loaded from the loading section to the loading table, the controller controls the anti-sticking mechanism to continuously perform anti-sticking treatment on the PCB board placed on the loading table; The controller controls the moving mechanism to move the PCB boards placed on the loading table to the unloading table in sequence; The controller controls the conveying mechanism to convey the PCB board placed on the unloading table to the unloading end; The thickness detection mechanism detects whether the thickness of the PCB board conveyed to the unloading end is within the preset thickness range; When the thickness of the PCB board is within the preset thickness range, the controller controls the conveying mechanism to unload the PCB board normally; When the thickness of the PCB board is within a preset thickness range, the thickness detection mechanism generates an error signal and uploads the error signal to the controller.

[0024] By adopting the above technical solution, the present application uniformly controls the anti-sticking mechanism, moving mechanism, transmission mechanism and thickness detection mechanism through a controller to realize the automatic feeding of PCB boards, and can report errors according to the detection conditions of the thickness detection mechanism, thereby ensuring the efficiency and reliability of the automated processing of PCB soft boards.

[0025] In summary, the present application includes at least one of the following beneficial technical effects: 1. The present application sets an anti-sticking mechanism on the loading platform to prevent the PCB boards placed on the loading platform from sticking to each other, and also sets a thickness detection mechanism on the unloading end of the unloading platform to detect the thickness of the unloaded PCB boards, thereby further ensuring that the PCB boards transferred to the unloading end do not have the problem of excessive thickness caused by the adhesion of two boards. In addition, the present application uses an adsorption device to adsorb the PCB board and move it from the loading platform to the unloading platform, which is more suitable for the material of the PCB soft board and can effectively improve the automated processing efficiency of the PCB soft board; 2. The suction cup assembly of the present application is connected to the bottom of the support assembly through the magnetic suction part and the magnetic block, which is convenient for adjusting and replacing the position of the suction cup assembly at any time, so that the present application can be applied to PCB boards of different sizes and models, and improve the adaptability of the board placement device to different PCB boards; 3. The present application forms a support assembly by connecting two support plates and a plurality of support columns. The hollowing out between the two support plates can reduce the weight, ensure the stability of the adsorption device when the second mobile device drives the adsorption device to move, and leave adjustment space for the suction cup assembly; 4. The present application can load two PCB boards at the same time by setting up a double station. The anti-sticking component includes an anti-sticking brush and a vent. The vent is used to ventilate the upper feeding station, which can effectively prevent static electricity from being generated between the stacked PCB boards and thus prevent them from sticking together. The anti-sticking brush is used to further ensure that the PCB boards will not stick together when the adsorption device adsorbs them, thereby improving the applicability to PCB soft boards. 5. In this application, a fixed anti-sticking component and a mobile anti-sticking component cooperate with each other. The mobile anti-sticking component can freely adjust its position in a mobile limit groove, so that the size of the workstation can be adjusted according to the actual size of the PCB board, thereby improving the applicability to PCB boards of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application; Figure 2 It is a schematic diagram of the internal structure of the protective cover of an embodiment of the present application; Figure 3Schematic diagram of a loading platform and an anti-sticking mechanism in an embodiment of the present application; Figure 4 is a schematic diagram of the structure of a first mobile device according to an embodiment of the present application; Figure 5 is a schematic diagram of the structure of the mobile mechanism of an embodiment of the present application; Figure 6 It is a schematic diagram of the structure of the unloading platform, the conveying mechanism and the thickness detection mechanism of the embodiment of the present application; Figure 7 is a flow chart of the control method of an embodiment of the present application; In the figure, 1, protective cover; 2, controller; 3, frame; 4, loading platform; 41, loading station; 42, movable limit slot; 5, unloading platform; 6, anti-sticking mechanism; 61, first moving device; 611, sliding assembly; 6111, sliding rod; 6112, connecting plate; 612, transmission assembly; 6121, pulley; 6122, belt strip; 613, locking assembly; 6131, driving member; 6132, clamping member; 62, fixed anti-sticking assembly; 621, supporting block; 622, anti-sticking brush; 623, vent; 63, mobile anti-sticking assembly; 7, Conveying mechanism; 8. Thickness detecting mechanism; 81. Thickness measuring sensor; 9. Moving mechanism; 91. Second moving device; 911. Horizontal moving assembly; 9111. First slide rail; 9112. First slider; 912. Vertical moving assembly; 9121. Second slide rail; 9122. Second slider; 92. Adsorption device; 921. Support assembly; 9211. First support plate; 9212. Second support plate; 9213. Support column; 922. Suction cup assembly; 9221. Magnetic block; 9222. Magnetic attraction portion; 9223. Connecting portion; 9224. Suction cup portion. DETAILED DESCRIPTION

[0027] The following is combined with Figure 1 -Attached Figure 7 , further details of this application are given.

[0028] Existing board placement machines usually load and unload materials through the cooperation of a conveying mechanism 7 such as a conveyor belt or roller and a grab hook. Such board placement machines can usually only process PCB boards of a specific width and thickness, and have low adaptability to boards of different specifications. When the thickness of the PCB board is relatively thin, the overall hardness of the PCB board is relatively low, and it is easy to separate from the conveying mechanism 7 during the transmission process and cannot be grabbed by the grab hook. In addition, static electricity is easily generated between the two boards, causing them to stick to each other. Therefore, the existing board placement machines are not suitable for thinner PCB soft boards, resulting in a relatively limited use scenario of the board placement machines. Therefore, an embodiment of the present application provides a board placement device, referring to Figure 1 and Figure 2, including a protective cover 1, a controller 2 installed outside the protective cover 1 and a frame 3 installed inside the protective cover 1, the frame 3 is provided with a loading platform 4 near the loading end, and the frame 3 is provided with a unloading platform 5 near the unloading end. The PCB boards to be fed are stacked on the loading platform 4, and then transferred to the unloading platform 5 in sequence for unloading. The loading platform 4 is provided with an anti-sticking mechanism 6, and the unloading platform 5 is provided with a conveying mechanism 7, which moves toward the unloading end. A thickness detection mechanism 8 is installed above the unloading end. A moving mechanism 9 is provided above the loading platform 4 and the unloading platform 5. The anti-sticking mechanism 6, the conveying mechanism 7, the thickness detection mechanism 8 and the moving mechanism 9 are respectively connected to the controller 2 for communication. Among them, the anti-sticking mechanism 6 is used to prevent the PCB boards stacked on the loading platform 4 from sticking, the moving mechanism 9 is used to transfer the PCB boards from the loading platform 4 to the unloading platform 5 in sequence, the conveying mechanism 7 is used to convey the PCB boards to the unloading end, and the thickness detection mechanism 8 is used to detect the thickness of the unloaded PCB boards to determine whether there is a situation where the two boards are stuck and the thickness exceeds the preset thickness range.

[0029] The implementation principle of the embodiment of the present application is as follows: considering that when the thickness of the PCB board is thin, the overall hardness of the PCB board is low, and it is easy to detach from the conveying mechanism 7 during the conveying process and cannot be grabbed by the grab hook, and static electricity is easy to generate between the two boards, causing the problem of sticking to each other. In the embodiment of the present application, an anti-sticking mechanism 6 is arranged on the loading table 4 to prevent the PCB boards placed on the loading table 4 from sticking to each other, and a thickness detection mechanism 8 is arranged at the unloading end of the unloading table 5 to detect the thickness of the unloaded PCB board, thereby further ensuring that the PCB board conveyed to the unloading end does not have the problem of excessive thickness caused by the adhesion of two boards, which can effectively improve the efficiency of the automated processing of PCB soft boards.

[0030] like Figure 3 and Figure 4 As shown, the anti-sticking mechanism 6 of the embodiment of the present application includes a first mobile device 61, four fixed anti-sticking components 62 and four mobile anti-sticking components 63. Two loading stations 41 are provided on the loading platform 4. The fixed anti-sticking component 62 is fixedly installed in the middle of the loading platform 4. The mobile anti-sticking component 63 is movably installed at both ends of the loading platform 4 through the first mobile device 61. The first mobile device 61 is used to drive the mobile anti-sticking component 63 to move in a direction close to or away from the fixed anti-sticking component 62. The fixed anti-sticking component and the mobile anti-sticking component 63 both include a support block 621. The support block 621 is provided with an anti-sticking brush 622 and a plurality of vents 623 on one side close to the loading station 41. The vents are used to connect an external air source and ventilate in the direction of the loading station 41. The embodiment of the present application ventilates the loading station 41 through the vents 623, which can effectively prevent the stacked PCB boards from generating static electricity and thus sticking together. The anti-sticking brush 622 further ensures that the PCB boards will not stick together when the adsorption device 92 adsorbs them.

[0031] like Figure 3and Figure 4 As shown, the first mobile device 61 of the embodiment of the present application is installed under the loading platform 4, and a plurality of movable limiting grooves 42 are provided at both ends of the loading platform 4. A plurality of movable anti-adhesion components 63 pass through the movable limiting grooves 42 and are connected to the first mobile device 61. The movable anti-adhesion component 63 moves in the movable limiting groove 42 toward the direction of approaching or fixing the anti-adhesion component 62 through the first mobile device 61. Through the cooperation between the fixed anti-adhesion component 62 and the movable anti-adhesion component 63, the movable anti-adhesion component 63 can freely adjust the position in the movable limiting groove 42, so that the station size can be adjusted according to the actual size of the PCB board, thereby improving the applicability to PCB boards of different sizes. The first mobile device 61 includes a sliding component 611, a transmission component 612 and a locking component 613. The sliding component 611 is connected to the transmission component 612, and the sliding component 611 is used to drive the transmission component 612 to move. The locking assembly 613 is installed above the transmission assembly 612. When closed, the locking assembly 613 is connected to the transmission assembly 612 for locking the transmission assembly 612. When released, the locking assembly 613 is separated from the transmission assembly 612 for releasing the transmission assembly 612.

[0032] like Figure 4 As shown, the sliding assembly 611 of the embodiment of the present application includes a sliding rod 6111 and two connecting plates 6112. The two ends of the sliding rod 6111 are fixed at the two ends of the bottom of the loading platform 4. The connecting plates 6112 are slidably connected to the sliding rod 6111. The tops of the two connecting plates 6112 are respectively connected to the mobile anti-sticking components 63 at the two ends of the loading platform 4. The transmission assembly 612 includes pulleys 6121 installed at both ends of the bottom of the loading platform 4 and a belt strip 6122 connecting the pulleys 6121. The connecting plates 6112 are connected to the belt strip 6122. The locking assembly 613 includes a driving member 6131 and a clamping member 6132. The driving member 6131 is used to drive the clamping member 6132 to connect with the belt strip 6122 when closed, and to separate from the belt strip 6122 when released. During the specific implementation process, when it is necessary to adjust the position of the mobile anti-sticking component 63, the driving member 6131 drives the clamping member 6132 to loosen the belt strip 6122, and adjusts the position of the mobile anti-sticking component 63 through the connecting plate 6112 and the sliding rod 6111. When it is necessary to fix the position of the mobile anti-sticking component 63, the controller 2 drives the clamping member 6132 to clamp the belt strip 6122, so that the transmission component 612 is locked, and the sliding component 611 is also locked, so that the position of the mobile anti-sticking component 63 will no longer move at will.

[0033] like Figure 2 and Figure 5As shown, the mobile mechanism 9 of the embodiment of the present application includes a second mobile device 91 and an adsorption device 92. The adsorption device 92 is movably mounted on the frame 3 through the second mobile device 91. The second mobile device 91 is used to drive the adsorption device 92 to move toward or away from the loading table 4 or the unloading table 5, so that the adsorption device 92 adsorbs the PCB board on the loading table 4 and transfers it to the unloading table 5. The adsorption transfer can be more suitable for the material of the PCB soft board.

[0034] like Figure 5 As shown, the adsorption device 92 of the embodiment of the present application includes a support assembly 921 and a plurality of suction cup assemblies 922 installed at the bottom of the support assembly 921. The suction cup assembly 922 includes a magnetic block 9221, a magnetic attraction portion 9222, a connecting portion 9223 and a suction cup portion 9224 from top to bottom. The magnetic attraction portion 9222 is used to cooperate with the magnetic block 9221 to fix the suction cup assembly 922 at the bottom of the support assembly 921. The suction cup assembly 922 is connected to the bottom of the support assembly 921 through the magnetic attraction portion 9222 and the magnetic block 9221, so that the position of the suction cup assembly 922 can be adjusted and replaced at any time. The support assembly 921 includes a first support plate 9211, a second support plate 9212 and a plurality of support columns 9213. The first support plate 9211 is connected to the second mobile device 91. The first support plate 9211 and the second support plate 9212 are connected via a plurality of support columns 9213. The second support plate 9212 is connected to the plurality of suction cup assemblies 922. The support assembly 921 is formed by connecting two support plates and a plurality of support columns 9213. The hollowing out between the two support plates can reduce the weight, ensure the stability of the second mobile device 91 when driving the adsorption device 92 to move, and leave adjustment space for the suction cup assembly 922. In the specific implementation process, the position where the suction cup assembly 922 is installed below the support assembly 921 can be adjusted according to the size of the PCB board, and the position usually corresponds to the four corners of the PCB board.

[0035] like Figure 5As shown, the second moving device 91 of the embodiment of the present application includes a horizontal moving component 911 and a vertical moving component 912. The horizontal moving component 911 includes a first slide rail 9111 and a first slider 9112. The first slide rail 9111 is installed on the frame 3 in the horizontal direction, and the first slider 9112 is slidably connected to the first slide rail 9111. The vertical moving component 912 includes a second slide rail 9121 and a second slider 9122. The second slide rail 9121 is installed on the first slider 9112 in the vertical direction. The second slider 9122 is slidably connected to the second slide rail 9121, and the adsorption device 92 is installed on the second slider 9122. During the specific implementation process, the adsorption device 92 is first moved to the top of the loading table 4 by the horizontal moving component 911, and then the adsorption device 92 is driven to descend by the vertical moving component 912 until the suction cup component 922 contacts the upper surface of the PCB board, and the suction cup component 922 is controlled to adsorb the PCB board. The vertical moving component 912 drives the adsorption device 92 and the PCB board to rise and move to the top of the unloading table 5. The vertical moving component 912 drives the adsorption device 92 and the PCB board to descend until the PCB board contacts the unloading table 5, and the suction cup component 922 is controlled to release the PCB board, so that the PCB board is placed on the unloading table 5.

[0036] like Figure 6 As shown, the thickness detection mechanism 8 of the embodiment of the present application includes a plurality of thickness sensors 81, which are used to detect whether the thickness of the PCB board delivered to the unloading end by the conveying mechanism 7 is within a preset thickness range. When the thickness of the PCB board is not within the thickness range, an error signal is generated and the error signal is uploaded to the controller 2. The sensing end of the thickness sensor 81 is aligned with the upper surface of the conveying mechanism 7 to detect the thickness of the PCB board delivered to the unloading end by the conveying mechanism 7. In the specific implementation process, the conveying mechanism 7 is a plurality of rollers driven by a motor, and other conveying mechanisms 7 such as a conveyor belt can also be used. The thickness sensor 81 can be an inductive thickness sensor 81, a capacitive thickness sensor 81, an eddy current thickness sensor 81 or an ultrasonic thickness sensor 81, wherein the inductive thickness sensor 81 detects the thickness of the material by measuring the change of inductance. When the thickness of the measured material changes, it will affect the inductance value of the inductor coil, so that the thickness of the material can be inferred by measuring the change of inductance. Capacitive thickness sensor 81 places plates on the upper and lower sides of the material to be measured to form two capacitors. When the material thickness changes, the capacitance value of the capacitor will change. The thickness of the material is estimated by measuring the change in capacitance. Eddy current thickness sensor 81 uses the eddy current effect to measure the thickness. The eddy current sensors are placed on the upper and lower sides of the material to be measured. The thickness of the material is estimated by measuring the change in eddy current. Ultrasonic thickness sensor 81 uses the propagation speed and propagation time of ultrasonic waves in the material to calculate the thickness of the material. The ultrasonic transmitter emits a pulse wave, and the receiver receives the reflected wave. The thickness of the material is estimated by calculating the propagation time.

[0037] The present application also provides a method for controlling a board placement device, referring to Figure 7 ,include: S1. After the PCB board is loaded from the loading section to the loading platform 4, the controller 2 controls the anti-sticking mechanism 6 to continuously perform anti-sticking treatment on the PCB board placed on the loading platform 4.

[0038] Specifically, the controller 2 controls the first mobile device 61 to adjust the position of the mobile anti-sticking component 63 according to the size of the PCB board, and then controls the vent 623 to continuously blow air to the PCB board placed on the loading table 4, which can effectively prevent static electricity from being generated between the stacked PCB boards.

[0039] S2, the controller 2 controls the moving mechanism 9 to move the PCB boards placed on the loading platform 4 to the unloading platform 5 in sequence.

[0040] Specifically, the adsorption device 92 is first moved to the top of the loading table 4 by the horizontal moving component 911, and then the adsorption device 92 is driven to descend by the vertical moving component 912 until the suction cup component 922 contacts the upper surface of the PCB board, and the suction cup component 922 is controlled to adsorb the PCB board. The vertical moving component 912 drives the adsorption device 92 and the PCB board to rise and move to the top of the unloading table 5. The vertical moving component 912 drives the adsorption device 92 and the PCB board to descend until the PCB board contacts the unloading table 5, and the suction cup component 922 is controlled to release the PCB board, so that the PCB board is placed on the unloading table 5.

[0041] S3, the controller 2 controls the conveying mechanism 7 to convey the PCB board placed on the unloading table 5 to the unloading end.

[0042] Specifically, the conveying mechanism 7 continuously conveys the PCB board transferred by the moving mechanism 9 to the unloading end.

[0043] S4, the thickness detection mechanism 8 detects whether the thickness of the PCB board conveyed to the unloading end is within a preset thickness range.

[0044] Specifically, according to the preset thickness range of the current PCB board, the thickness detection mechanism 8 performs thickness detection on the PCB board conveyed to the unloading end to determine whether the current thickness is within the thickness range.

[0045] S51, when the thickness of the PCB board is within the preset thickness range, the controller 2 controls the conveying mechanism 7 to unload the PCB board normally.

[0046] Specifically, if the thickness of the PCB board is within the preset thickness range, it indicates that the PCB board currently being conveyed to the unloading end is a single PCB board, and unloading can be performed normally.

[0047] S52 , when the thickness of the PCB board is within a preset thickness range, the thickness detection mechanism 8 generates an error signal and uploads the error signal to the controller 2 .

[0048] Specifically, if the thickness of the PCB board is within the preset thickness range, it indicates that two or more PCB boards currently being conveyed to the unloading end may be stuck together. The thickness detection mechanism 8 generates an error signal and uploads the error signal to the controller 2. The controller 2 issues an early warning based on the error signal to prompt the staff to promptly confirm whether there is currently a situation where the PCB boards are stuck together. In the specific implementation process, the controller 2 can control the alarm device to sound an alarm based on the error signal, or the controller 2 can control the conveying mechanism 7 to stop the current PCB board conveyance.

[0049] The implementation principle of the embodiment of the present application is: the anti-sticking mechanism 6, the moving mechanism 9, the transmission mechanism and the thickness detection mechanism 8 are uniformly controlled by the controller 2 to realize the automatic feeding of the PCB board, and errors can be reported according to the detection conditions of the thickness detection mechanism 8 to ensure the efficiency and reliability of the automated processing of the PCB soft board.

[0050] The embodiments of this specific implementation are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. The same components are represented by the same figure marks. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A board placing device, characterized in that: The machine comprises a protective cover (1), a controller (2) installed outside the protective cover (1), and a frame (3) installed inside the protective cover (1); a loading platform (4) is provided near a loading end of the frame (3), and a unloading platform (5) is provided near a unloading end of the frame (3); The loading platform (4) is provided with an anti-sticking mechanism (6), and the anti-sticking mechanism (6) comprises a first moving device (61), a plurality of fixed anti-sticking components (62) and a plurality of movable anti-sticking components (63), wherein the fixed anti-sticking component (62) is fixedly installed in the middle of the loading platform (4), and the movable anti-sticking component (63) is movably installed at both ends of the loading platform (4) through the first moving device (61), and the first moving device (61) is used to drive the movable anti-sticking component (63) to move in a direction close to or away from the fixed anti-sticking component (62); The unloading platform (5) is provided with a conveying mechanism (7), and the conveying mechanism (7) moves towards the unloading end, and a thickness detection mechanism (8) is installed above the unloading end; A moving mechanism (9) is provided above the loading platform (4) and the unloading platform (5), and the moving mechanism (9) comprises a second moving device (91) and an adsorption device (92), and the adsorption device (92) is movably mounted on the frame (3) via the second moving device (91), and the second moving device (91) is used to drive the adsorption device (92) to move in a direction close to or away from the loading platform (4) or the unloading platform (5); The anti-sticking mechanism (6), the conveying mechanism (7), the thickness detection mechanism (8) and the moving mechanism (9) are respectively connected to the controller (2) for communication.

2. A board placing device according to claim 1, characterized in that: The adsorption device (92) includes a support assembly (921) and a plurality of suction cup assemblies (922) installed at the bottom of the support assembly (921); the suction cup assembly (922) includes a magnetic block (9221), a magnetic attraction portion (9222), a connecting portion (9223) and a suction cup portion (9224) from top to bottom; the magnetic attraction portion (9222) is used to cooperate with the magnetic block (9221) to fix the suction cup assembly (922) at the bottom of the support assembly (921).

3. A board placing device according to claim 2, characterized in that: The support assembly (921) includes a first support plate (9211), a second support plate (9212) and a plurality of support columns (9213); the first support plate (9211) is connected to the second mobile device (91); the first support plate (9211) and the second support plate (9212) are connected via a plurality of support columns (9213); and the second support plate (9212) is connected to the plurality of suction cup assemblies (922).

4. A board placing device according to claim 3, characterized in that: The second moving device (91) comprises a horizontal moving component (911) and a vertical moving component (912); the horizontal moving component (911) comprises a first slide rail (9111) and a first slider (9112); the first slide rail (9111) is mounted on the frame (3) in a horizontal direction; the first slider (9112) is slidably connected to the first slide rail (9111); The vertical moving component (912) includes a second slide rail (9121) and a second slider (9122), the second slide rail (9121) is installed on the first slider (9112) along the vertical direction, the second slider (9122) is slidably connected to the second slide rail (9121), and the adsorption device (92) is installed on the second slider (9122).

5. A board placing device according to claim 1, characterized in that: The loading platform (4) is provided with two loading stations (41), the plurality of fixed anti-sticking components (62) are installed between the two loading stations (41), and the plurality of movable anti-sticking components (63) are respectively installed at two ends of the two loading stations (41) away from the fixed anti-sticking components; The fixed anti-sticking component and the movable anti-sticking component (63) both comprise a support block (621), and the support block (621) is provided with an anti-sticking brush (622) and a plurality of vents (623) on a side close to the loading station (41), and the vents (623) are used to connect to an external air source and ventilate in the direction of the loading station (41).

6. A board placing device according to claim 5, characterized in that: The first moving device (61) is installed below the loading platform (4), and a plurality of movable limiting grooves (42) are provided at both ends of the loading platform (4). The plurality of movable anti-sticking components (63) pass through the movable limiting grooves (42) and are connected to the first moving device (61). The movable anti-sticking component (63) moves in the movable limiting grooves (42) through the first moving device (61) toward a direction approaching or fixing the anti-sticking component (62).

7. A board placing device according to claim 6, characterized in that: The first moving device (61) comprises a sliding component (611), a transmission component (612) and a locking component (613); the sliding component (611) is connected to the transmission component (612); the sliding component (611) is used to drive the transmission component (612) to move; The locking assembly (613) is installed above the transmission assembly (612). When closed, the locking assembly (613) is connected to the transmission assembly (612) and is used to lock the transmission assembly (612). When released, the locking assembly (613) is separated from the transmission assembly (612) and is used to release the transmission assembly (612).

8. A board placing device according to claim 7, characterized in that: The sliding assembly (611) comprises a sliding rod (6111) and two connecting plates (6112), the two ends of the sliding rod (6111) are fixed to the two ends of the bottom of the loading platform (4), the connecting plates (6112) are slidably connected to the sliding rod (6111), and the tops of the two connecting plates (6112) are respectively connected to the movable anti-sticking assemblies (63) at the two ends of the loading platform (4); The transmission assembly (612) comprises pulleys (6121) installed at both ends of the bottom of the loading platform (4) and a belt strip (6122) connecting the pulleys (6121), and the connecting plate (6112) is connected to the belt strip (6122); The locking assembly (613) includes a driving member (6131) and a clamping member (6132), wherein the driving member (6131) is used to drive the clamping member (6132) to be connected to the belt strip (6122) when closed, and to be separated from the belt strip (6122) when released.

9. A board placing device according to any one of claims 1 to 8, characterized in that: The thickness detection mechanism (8) comprises a plurality of thickness sensors (81), and the thickness sensors (81) are used to detect whether the thickness of the PCB board transmitted by the transmission mechanism (7) to the unloading end is within a preset thickness range, and to generate an error signal when the thickness of the PCB board is not within the thickness range and upload the error signal to the controller (2).

10. A method for controlling a board placement device, characterized in that: include: After the PCB board is loaded from the loading section onto the loading platform (4), the controller (2) controls the anti-sticking mechanism (6) to continuously perform anti-sticking treatment on the PCB board placed on the loading platform (4); The controller (2) controls the moving mechanism (9) to move the PCB boards placed on the loading platform (4) to the unloading platform (5) in sequence; The controller (2) controls the conveying mechanism (7) to convey the PCB board placed on the unloading table (5) to the unloading end; The thickness detection mechanism (8) detects whether the thickness of the PCB board conveyed to the unloading end is within a preset thickness range; When the thickness of the PCB board is within a preset thickness range, the controller (2) controls the conveying mechanism (7) to unload the PCB board normally; When the thickness of the PCB board is within a preset thickness range, the thickness detection mechanism (8) generates an error signal and uploads the error signal to the controller (2).

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