Detection device and detection method

Abstract

The invention provides a technology capable of detecting the resistance of a contact part of a sealing component of a plating device. A detection device (1) is provided with: a plate member (60) which is configured so as to be held by a holder during resistance detection for detecting the resistance of a contact portion (51) of a seal member (50), and which has a prescribed surface (61) that faces the contact portion when held by the holder during resistance detection; a first electrode (70) configured so as to be disposed on a predetermined surface of the plate member and configured to come into contact with the contact portion during resistance detection; a second electrode (71) configured so as to be disposed on the predetermined surface of the plate member, and configured so as to be in contact with a portion different from the portion in contact with the first electrode among the contact portions during resistance detection; and a resistance detector (80) that is electrically connected to the first electrode and the second electrode, and that detects the resistance of the contact portion by detecting the resistance between the first electrode and the second electrode during resistance detection.

Description

Technical Field

[0001] The invention relates to a detection device and a detection method. Background Art

[0002] Conventionally, a plating device for plating a substrate is known (for example, see Patent Documents 1 and 2). Specifically, such a plating device comprises: a plating tank having an anode; a support configured to hold the substrate in a manner such that the plated surface of the substrate faces the anode when the substrate, which serves as a cathode, is plated; and a sealing member having a contact portion configured to contact the plated surface of the substrate during the plating process.

[0003] Patent Document 1: Japanese Patent No. 6975650

[0004] Patent Document 2: Japanese Patent No. 7194305

[0005] In the above-mentioned plating device, a conductive film containing a plating component is often formed around the sealing component, specifically around the contact portion. In this case, there is a concern that the plating component will precipitate on the conductive film. Therefore, in order to determine whether a conductive film is formed, it is required to develop a technology that can detect the resistance of the sealing component. Summary of the invention

[0006] The present invention has been made in view of the above circumstances, and one object of the present invention is to provide a technology capable of detecting the electrical resistance of a sealing member of a plating device.

[0007] (Method 1)

[0008] In order to achieve the above-mentioned purpose, a detection device involved in one embodiment of the present invention is a detection device for detecting the resistance of a sealing component of a plating device, and the above-mentioned plating device comprises: a plating tank, which is equipped with an anode; a bracket, which is configured to hold the above-mentioned substrate in a manner such that the plated surface of the above-mentioned substrate is opposite to the above-mentioned anode when a plating treatment of plating is performed on the substrate serving as a cathode; and the above-mentioned sealing component, which has a contact portion configured to contact the above-mentioned plated surface of the above-mentioned substrate during the above-mentioned plating treatment, and the above-mentioned detection device comprises: a plate component, which is configured to be held on the above-mentioned bracket instead of the above-mentioned substrate when the resistance of the above-mentioned contact portion is detected. , and having a specified surface opposite to the above-mentioned contact part when maintained on the above-mentioned bracket during the above-mentioned resistance detection; a first electrode, which is configured to be arranged on the above-mentioned specified surface of the above-mentioned plate member, and contacts the above-mentioned contact part during the above-mentioned resistance detection; a second electrode, which is configured to be arranged on the above-mentioned specified surface of the above-mentioned plate member, and contacts a part of the above-mentioned contact part different from the part contacted by the above-mentioned first electrode during the above-mentioned resistance detection; and a resistance detector, which is configured to be electrically connected to the above-mentioned first electrode and the above-mentioned second electrode, and detects the resistance between the above-mentioned first electrode and the above-mentioned second electrode during the above-mentioned resistance detection, thereby detecting the resistance of the above-mentioned contact part.

[0009] According to this aspect, the resistance of the contact portion of the sealing member where the first electrode and the second electrode are in contact can be detected by the resistance detector.

[0010] (Method 2)

[0011] In the above-mentioned method 1, it can also be that the above-mentioned contact portion of the above-mentioned sealing component is constructed in an annular shape, the above-mentioned first electrode has a first annular portion constructed in an annular shape, the above-mentioned second electrode has a second annular portion constructed in an annular shape, and the above-mentioned second annular portion is arranged on the side closer to the center than the above-mentioned first annular portion in the radial direction of the above-mentioned first annular portion, and has a diameter smaller than the diameter of the above-mentioned first annular portion.

[0012] According to this aspect, the electrical resistance of the annular contact portion of the sealing member can be effectively detected.

[0013] (Method 3)

[0014] In the second aspect, a groove having an annular shape may be provided on the predetermined surface of the plate member, and the groove may be configured so that the contact portion is fitted into the groove during the resistance detection.

[0015] (Method 4)

[0016] In the above-mentioned method 3, it may also be that the above-mentioned first electrode has a plurality of first branch electrodes extending from the above-mentioned first annular portion toward the above-mentioned second annular portion, the above-mentioned second electrode has a plurality of second branch electrodes extending from the above-mentioned second annular portion toward the above-mentioned first annular portion, the above-mentioned plurality of first branch electrodes have a portion arranged in the above-mentioned groove, and the above-mentioned plurality of second branch electrodes have a portion arranged in the above-mentioned groove.

[0017] According to this aspect, the contact area between the contact portion of the sealing member and the electrode can be easily increased, thereby enabling the electrical resistance of the contact portion of the sealing member to be effectively detected.

[0018] (Method 5)

[0019] In any one of the above aspects 1 to 4, the plate member may be held by the holder during the plating process so that the predetermined surface contacts the back surface of the substrate that is located on the opposite side to the surface to be plated.

[0020] (Method 6)

[0021] In order to achieve the above-mentioned purpose, a detection method involved in one embodiment of the present invention uses a detection device involved in any one of the above-mentioned embodiments 1 to 5, and the above-mentioned detection method includes: when the above-mentioned plate part is maintained on the above-mentioned bracket, the above-mentioned first electrode is brought into contact with the above-mentioned contact part of the above-mentioned sealing part, and the above-mentioned second electrode is brought into contact with a part of the above-mentioned contact part of the above-mentioned sealing part that is different from the part contacted by the above-mentioned first electrode; and the above-mentioned resistance detector detects the resistance between the above-mentioned first electrode and the above-mentioned second electrode, thereby detecting the resistance of the above-mentioned contact part of the above-mentioned sealing part.

[0022] According to this aspect, the electrical resistance of the contact portion of the sealing member can be detected. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a perspective view showing the overall structure of the plating apparatus according to the embodiment.

[0024] Figure 2 It is a plan view showing the overall structure of the plating device according to the embodiment.

[0025] Figure 3 It is a schematic diagram showing the structure of the plating module according to the embodiment.

[0026] Figure 4 It is a schematic diagram showing a state where the substrate according to the embodiment is immersed in a plating solution.

[0027] Figure 5 (A) is a part of the substrate holder involved in the embodiment ( Figure 3A cross-sectional view showing an enlarged and schematic representation of the A1 portion of the device. Figure 5 (B) is a schematic plan view of the sealing member according to the embodiment.

[0028] Figure 6 It is a schematic cross-sectional view for explaining an example of a formation pattern of a conductive film.

[0029] Figure 7 It is a schematic cross-sectional view for explaining an example of a formation pattern of a conductive film.

[0030] Figure 8 It is a schematic cross-sectional view for explaining an example of a formation pattern of a conductive film.

[0031] Fig. 9 It is a schematic diagram for explaining the detection device involved in the embodiment.

[0032] Fig.10 It is a schematic diagram for explaining the detection device involved in the embodiment.

[0033] Fig.11 It is a schematic diagram showing a state where the plate member according to the embodiment is held by the substrate holder.

[0034] Fig.12 This is an example of a flowchart for describing the detection method involved in the embodiment.

[0035] Fig.13 (A) is a schematic bottom view of the plate member of the detection device involved in the first modification. Fig.13 (B) is a schematic diagram showing an enlarged portion of the first electrode and the second electrode according to Modification Example 1.

[0036] Fig.14 This is a schematic enlarged cross-sectional view showing the peripheral structure of the groove in the plate member according to Modification 1.

[0037] Fig.15 This is a schematic diagram for explaining the detection device involved in Modification Example 2.

[0038] Fig.16 This is a schematic diagram for explaining the detection device involved in Modification Example 2. DETAILED DESCRIPTION

[0039] Hereinafter, the embodiments of the present invention will be described with reference to the accompanying drawings. In addition, the accompanying drawings are schematically illustrated to facilitate understanding of the features of the components, and the size ratios of the components may not be the same as the actual ones. In addition, in some drawings, XYZ orthogonal coordinates are illustrated for reference. In the orthogonal coordinates, the Z direction corresponds to the top, and the -Z direction corresponds to the bottom (the direction in which gravity acts).

[0040] (Implementation Method 1)

[0041] Figure 1 It is a perspective view showing the overall structure of the plating apparatus 1000 according to the present embodiment. Figure 2 2 is a plan view (top view) showing the overall structure of the plating device 1000 of this embodiment. Figure 1 and Figure 2 As shown, the plating device 1000 includes: a loading port 100, a transfer robot 110, an aligner 120, a pre-wet module 200, a pre-preg module 300, a plating module 400, a cleaning module 500, a spin rinse and dry device 600, a transfer device 700, and a control module 800.

[0042] The loading port 100 is a module for carrying a substrate contained in a box such as a FOUP (not shown) into the plating device 1000, or carrying a substrate out of the box from the plating device 1000. In the present embodiment, four loading ports 100 are arranged side by side in the horizontal direction, but the number and configuration of the loading ports 100 are arbitrary. The transport robot 110 is a robot for transporting substrates, and is configured to transfer substrates between the loading port 100, the aligner 120, the pre-wetting module 200, and the rotary rinsing and drying device 600. When the transport robot 110 and the transport device 700 transfer substrates between the transport robot 110 and the transport device 700, the substrates can be transferred via a temporary stage (not shown).

[0043] The aligner 120 is a module for aligning the orientation plane, notch and other positions of the substrate in a specified direction. In the present embodiment, two aligners 120 are arranged side by side in the horizontal direction, but the number and configuration of the aligners 120 are arbitrary. The pre-wet module 200 wets the plated surface of the substrate before the plating process using a treatment liquid such as pure water or degassed water, thereby replacing the air inside the pattern formed on the surface of the substrate with the treatment liquid. The pre-wet module 200 is configured to implement a pre-wet process, which is a process of easily supplying the plating liquid to the inside of the pattern by replacing the treatment liquid inside the pattern with the plating liquid during plating. In the present embodiment, two pre-wet modules 200 are arranged side by side in the up and down direction, but the number and configuration of the pre-wet modules 200 are arbitrary.

[0044] The prepreg module 300 is configured to implement a prepreg treatment, which is, for example, etching with a treatment solution such as sulfuric acid or hydrochloric acid to remove the oxide film with large resistance on the surface of the seed layer formed on the plated surface of the substrate before the plating treatment, and cleaning or activating the surface of the plated substrate. In the present embodiment, two prepreg modules 300 are arranged side by side in the vertical direction, but the number and configuration of the prepreg modules 300 are arbitrary. The plating module 400 implements plating on the substrate. In the present embodiment, there are two groups of twelve plating modules 400, three of which are arranged side by side in the vertical direction and four of which are arranged side by side in the horizontal direction, and a total of twenty-four plating modules 400 are provided, but the number and configuration of the plating modules 400 are arbitrary.

[0045] The cleaning module 500 is configured to perform cleaning treatment on the substrate so as to remove the plating liquid etc. remaining on the substrate after the plating treatment. In the present embodiment, two cleaning modules 500 are arranged side by side in the up-down direction, but the number and configuration of the cleaning modules 500 are arbitrary. The rotating rinsing and drying device 600 is a module for rotating and drying the substrate after the cleaning treatment at high speed. In the present embodiment, two rotating rinsing and drying devices 600 are arranged side by side in the up-down direction, but the number and configuration of the rotating rinsing and drying devices 600 are arbitrary. The transport device 700 is a device for transporting substrates between multiple modules in the plating device 1000. The control module 800 is configured to control multiple modules of the plating device 1000, for example, it can be composed of a general computer or a special computer having an input and output interface with an operator.

[0046] An example of a series of plating processes based on the plating device 1000 is described. First, a substrate contained in a box is carried into the loading port 100. Next, the transport robot 110 takes out the substrate from the box of the loading port 100 and transports the substrate to the aligner 120. The aligner 120 aligns the positions of the orientation plane, the notch, etc. of the substrate in a predetermined direction. The transport robot 110 delivers the substrate aligned by the aligner 120 to the pre-wet module 200.

[0047] The prewetting module 200 performs a prewetting process on the substrate. The transport device 700 transports the substrate subjected to the prewetting process to the prepreg module 300. The prepreg module 300 performs a prepreg process on the substrate. The transport device 700 transports the substrate subjected to the prepreg process to the plating module 400. The plating module 400 performs plating on the substrate.

[0048] The transport device 700 transports the substrate subjected to the plating process to the cleaning module 500. The cleaning module 500 performs a cleaning process on the substrate. The transport device 700 transports the substrate subjected to the cleaning process to the spin rinse and dry device 600. The spin rinse and dry device 600 performs a drying process on the substrate. The transport robot 110 receives the substrate from the spin rinse and dry device 600 and transports the substrate subjected to the drying process to the box of the loading port 100. Finally, the box containing the substrate is unloaded from the loading port 100.

[0049] also, Figure 1 , Figure 2 The structure of the plating device 1000 described in the above is merely an example, and the structure of the plating device 1000 is not limited to Figure 1 , Figure 2 structure.

[0050] Next, the plating module 400 will be described. In addition, since the plurality of plating modules 400 included in the plating apparatus 1000 according to the present embodiment have the same structure, one plating module 400 will be described.

[0051] Figure 3 It is a schematic diagram of the structure of the plating module 400 of the plating apparatus 1000 according to the present embodiment. Figure 4 1 is a schematic diagram showing a state where a substrate Wf is immersed in a plating solution Ps. As an example, the plating device 1000 according to the present embodiment is a cup-type plating device. The plating module 400 of the plating device 1000 mainly includes: a plating tank 10, an overflow tank 15, a substrate support 20, a rotating mechanism 30, a tilting mechanism 35, and a lifting mechanism 36. Figure 3 , a cross section of a part of the structure of the plating module 400 (the plating tank 10, the overflow tank 15, the substrate support 20, etc.) is schematically illustrated.

[0052] The plating tank 10 involved in this embodiment is composed of a bottomed container with an opening at the top. Specifically, the plating tank 10 has a bottom wall 10a and an outer peripheral wall 10b extending upward from the outer peripheral edge of the bottom wall 10a, and the upper part of the outer peripheral wall 10b is open. In addition, the shape of the outer peripheral wall 10b of the plating tank 10 is not particularly limited, but as an example, the outer peripheral wall 10b involved in this embodiment has a cylindrical shape.

[0053] A plating solution Ps is stored inside the plating tank 10. A supply port (not shown) for supplying the plating solution Ps to the plating tank 10 is provided in the plating tank 10. The plating solution Ps can be any solution containing ions of metal elements constituting the plating film, and its specific example is not particularly limited. However, as an example, the plating solution Ps involved in the present embodiment contains tin (Sn) ions and further contains silver (Ag) ions. That is, as an example, the plating treatment performed in the present embodiment is a "tin-silver plating treatment". However, the specific composition of the plating solution Ps is not limited thereto, and can be appropriately set according to the type of the plating film.

[0054] An anode 11 is disposed inside the plating solution Ps of the plating tank 10. The specific type of the anode 11 is not particularly limited, and a soluble anode or an insoluble anode can be used. In the present embodiment, an insoluble anode is used as the anode 11. The specific type of the insoluble anode is not particularly limited, and platinum, iridium oxide, etc. can be used.

[0055] The overflow tank 15 is composed of a bottomed container arranged in an area radially outside the plating tank 10. The overflow tank 15 is a tank provided to temporarily store the plating solution Ps exceeding the upper end of the outer peripheral wall 10b of the plating tank 10 (i.e., the plating solution Ps overflowing from the plating tank 10). The overflow tank 15 is provided with a discharge port (not shown) for discharging the plating solution Ps of the overflow tank 15 from the overflow tank 15. The plating solution Ps discharged from the discharge port is then temporarily stored in a circulation tank (not shown), and then supplied to the plating tank 10 again from the supply port.

[0056] A porous ion resistor 12 may also be disposed above the anode 11 inside the plating tank 10. The ion resistor 12 is composed of a porous plate member having a plurality of holes (pores). The plating liquid Ps below the ion resistor 12 can flow through the ion resistor 12 to the upper side of the ion resistor 12. The ion resistor 12 is a member provided to achieve uniformity of the electric field formed between the anode 11 and the substrate Wf. In this way, the plating device 1000 has the ion resistor 12, so that the film thickness of the plating film (plating layer) formed on the substrate Wf can be easily uniformed.

[0057] The substrate holder 20 is configured to hold the substrate Wf in a manner such that the plated surface Wfa of the substrate Wf faces the anode 11 when the substrate Wf, which is the cathode, is plated in a "plating process". In the present embodiment, the substrate Wf is arranged above the anode 11. In addition, the substrate holder 20 involved in the present embodiment holds the plate member 60 of the detection device 1 described later instead of the substrate Wf during the "resistance detection" described later. The substrate holder 20 involved in the present embodiment is an example of a "holder".

[0058] The specific structure of the substrate holder 20 is not particularly limited as long as it can hold the substrate Wf, and a known substrate holder can be used. As an example, the substrate holder 20 involved in this embodiment includes a first holding member 21 and a second holding member 22. As an example, the second holding member 22 is connected to the first holding member 21.

[0059] The first holding member 21 is configured to hold the back side Wfb (the side opposite to the plated surface Wfa) of the substrate Wf. Specifically, as an example, the first holding member 21 involved in this embodiment holds the back side Wfb of the substrate Wf via the back plate 23 and the pressing member 24 described later. The second holding member 22 is configured to hold the outer peripheral edge of the plated surface Wfa of the substrate Wf via the sealing member 50 described later. The substrate holder 20 holds the substrate Wf in a manner that the substrate Wf is clamped by the first holding member 21 and the second holding member 22.

[0060] In addition, the second holding member 22 also has the function of holding (supporting) the sealing member 50 described later from the bottom. The second holding member 22 is generally a member called a "seal ring holder (SRH)". The first holding member 21 involved in this embodiment has a disc shape. The second holding member 22 involved in this embodiment has an annular shape.

[0061] like Figure 3 As illustrated, the plating module 400 of the plating device 1000 may further include a back plate 23 and a pressing member 24. The back plate 23 is composed of a plate member arranged to contact the back surface Wfb of the substrate Wf. The back plate 23 is provided mainly to apply pressure to the substrate Wf.

[0062] The pressing member 24 is a member for being arranged between the back plate 23 and the first holding member 21 of the substrate holder 20, and for pressing the back plate 23 toward one side (lower side) of the substrate Wf. The number of the pressing members 24 is not particularly limited, but as an example, the pressing members 24 involved in this embodiment are arranged in plurality. Specifically, the pressing members 24 involved in this embodiment are arranged in plurality in the circumferential direction of the substrate holder 20.

[0063] The specific structure of the pressing component 24 is not particularly limited, and known techniques can be applied. If specific examples of the pressing component 24 are listed, as the pressing component 24, for example, a cylinder or an air bag that is retracted and extended using air can be used. Alternatively, a spring or the like can also be used as the pressing component 24. In addition, when a cylinder or an air bag or the like is used as the pressing component 24, the plating module 400 can also be provided with a compressor (not shown) outside the plating tank 10 for supplying air to the pressing component 24.

[0064] The plating module 400 includes the pressing member 24 and the back plate 23 , and can effectively bring the substrate Wf into contact with the sealing member 50 described later. In addition, the plating module 400 may be configured without the back plate 23 and the pressing member 24 .

[0065] The substrate holder 20 is connected to a rotating shaft 31 of a rotating mechanism 30. The rotating mechanism 30 is a mechanism for rotating the substrate holder 20. As the rotating mechanism 30, a known mechanism such as a motor can be used.

[0066] The tilting mechanism 35 is a mechanism for tilting the rotating mechanism 30 and the substrate holder 20. As the tilting mechanism 35, a known tilting mechanism such as a piston cylinder can be used. The lifting mechanism 36 is supported by a support shaft 37 extending in the vertical direction. The lifting mechanism 36 is a mechanism for lifting the substrate holder 20, the rotating mechanism 30, and the tilting mechanism 35 in the vertical direction. As the lifting mechanism 36, a known lifting mechanism such as a direct-acting actuator can be used.

[0067] like Figure 4 As shown in the example, when plating is performed on the plated surface Wfa of the substrate Wf, the lifting mechanism 36 moves the substrate holder 20 downward so that the substrate Wf is immersed in the plating solution Ps in the plating tank 10. In addition, the rotating mechanism 30 rotates the substrate holder 20. In addition, when the substrate Wf is immersed in the plating solution Ps, the tilting mechanism 35 can also tilt the substrate holder 20 as needed. After the substrate Wf is immersed in the plating solution Ps, the current is caused to flow between the anode 11 and the substrate Wf by the power supply device (not shown). As a result, a plated film is formed on the plated surface Wfa of the substrate Wf.

[0068] The operation of the plating module 400 is controlled by the control module 800. The control module 800 includes a microcomputer including a processor 801 and a storage device 802 as a non-temporary storage medium. The control module 800 operates through the processor 801 based on the instructions of the program stored in the storage device 802, thereby controlling the controlled part of the plating module 400.

[0069] Figure 5 (A) is to place a portion of the substrate holder 20 ( Figure 3A cross-sectional view (a portion A1 of the substrate) is enlarged and schematically shown. The plating module 400 of the plating device 1000 involved in the present embodiment includes a contact component 40. The contact component 40 is a component for contacting the outer peripheral edge of the plated surface Wfa of the substrate Wf to supply power to the substrate Wf. As an example, the contact component 40 involved in the present embodiment is arranged on the second holding component 22 of the substrate holder 20. A plurality of contact components 40 can also be arranged in the circumferential direction of the substrate holder 20. In addition, the specific structure of the contact component 40 is the same as the well-known contact component disclosed in Patent Document 2, and therefore further detailed description is omitted.

[0070] In addition, the plating module 400 includes a sealing member 50 . Figure 5 (B) is a schematic top view of the sealing member 50. Figure 5 (A) and Figure 5 (B), the sealing member 50 according to the present embodiment is mainly provided to prevent the plating solution Ps from contacting the contact member 40 when the substrate Wf is immersed in the plating solution Ps. Specifically, as an example, the sealing member 50 according to the present embodiment is disposed on the second holding member 22 of the substrate holder 20.

[0071] The sealing member 50 according to the present embodiment includes a main body portion 52 and a contact portion 51. As an example, the main body portion 52 according to the present embodiment is configured in an annular shape.

[0072] The contact portion 51 is configured to contact the plated surface Wfa of the substrate Wf during the plating process. Specifically, as an example, the contact portion 51 according to the present embodiment is configured to protrude upward from the edge portion (inner peripheral edge portion) located at the radial center side of the main body portion 52 as a starting point.

[0073] The contact part 51 according to the present embodiment is annular (i.e., has an annular shape). That is, the contact part 51 according to the present embodiment is composed of an annular protrusion. However, this is an example of the structure of the contact part 51, and the specific structure of the contact part 51 is not limited thereto.

[0074] The material of the sealing member 50 is not particularly limited, but the sealing member 50 according to the present embodiment is made of a non-conductive material.

[0075] In addition, the structure of the sealing member 50 is the same as that of the known sealing member disclosed in Patent Document 2, and therefore further detailed description is omitted. Figure 5 As illustrated in FIG. 5(A) , the plating module 400 may include an inner ring 55 as a member for effectively holding the sealing member 50 on the second holding member 22 .

[0076] Here, a conductive film 90 is often formed around the contact portion 51 of the sealing member 50. To give an example, a metal component (for example, Sn (divalent)) contained in the plating solution Ps is often oxidized, and conductive metal ions (for example, Sn (quadrivalent)) and / or conductive amorphous oxides (for example, amorphous oxides of Sn (SnOx(OH)y)) are often precipitated as a conductive film 90 around the contact portion 51. When such a conductive film 90 is formed, the conductive film 90 functions as a power supply path for the plating current, and as a result, there is a concern that plating components (for example, Sn, Ag) are precipitated on the conductive film 90.

[0077] Figure 6 , Figure 7 ,as well as Figure 8 1 is a schematic cross-sectional view for explaining an example of a formation pattern of the conductive film 90. Figure 6 As illustrated, when a defective portion (Df) is formed in a part of the contact portion 51 of the sealing member 50, there is a concern that the conductive film 90 is formed starting from the defective portion (Df) of the contact portion 51. In addition, there is a concern that the plating component is precipitated in the conductive film 90 to form a precipitation portion 91.

[0078] In addition, if Figure 7 As illustrated, the plated film 92 is often formed near the contact site 51 of the sealing member 50 and the contact site of the substrate Wf. In this case, the conductive film 90 may be formed due to the plated film 92.

[0079] In addition, if Figure 8 As illustrated, the conductive film 90 is often formed from the contact portion 51 of the sealing member 50 to one side of the inner ring 55 .

[0080] As described above, when the conductive film 90 is formed around the contact portion 51 of the sealing member 50 and the plating component is precipitated on the conductive film 90, the plating component that should have been formed on the substrate Wf is used for precipitation on the conductive film 90. Therefore, there is a concern that the uniformity of the film thickness of the plated film formed on the substrate Wf may deteriorate. In order to cope with this problem, the plating module 400 of the plating device 1000 according to the present embodiment includes a detection device 1 described below.

[0081] First, when the conductive film 90 is formed around the contact portion 51 of the sealing member 50, the resistance around the contact portion 51 is reduced. Therefore, by detecting the resistance of the contact portion 51 of the sealing member 50, the formation of the conductive film 90 can be detected. Therefore, the detection device 1 involved in this embodiment has the structure described below, so as to detect the resistance of the contact portion 51 of the sealing member 50.

[0082] Fig. 9 and Fig.10 1 is a schematic diagram for explaining the detection device 1 according to the present embodiment. Specifically, Fig. 9 is a schematic bottom view of the detection device 1 visually confirmed from below, Fig.10 This is a schematic front view showing the detection device 1 visually confirmed from the front. Fig.11 It is a schematic diagram showing a state where a plate member 60 described later is held by the substrate holder 20 .

[0083] Reference Fig. 9 and Fig.10 The detection device 1 according to the present embodiment mainly includes a plate member 60 , a first electrode 70 , a second electrode 71 , and a resistance detector 80 .

[0084] The plate member 60 is configured to be held on the substrate holder 20 (see FIG. 1 ) in place of the substrate Wf during “resistance detection” for detecting the resistance of the contact portion 51 of the sealing member 50. Fig.11 ).

[0085] Specifically, the plate member 60 involved in the present embodiment is held on the substrate holder 20 during resistance detection, and is also pressed by the back plate 23 and the pressing member 24. In addition, when the plating device 1000 does not include the back plate 23 and the pressing member 24, the plate member 60 is held on the substrate holder 20 in such a manner that the surface of the plate member 60 opposite to the specified surface 61 described later (i.e., the back surface (upper surface)) contacts the first holding member 21 of the substrate holder 20. In addition, the plate member 60 involved in the present embodiment is not held on the substrate holder 20 during "plating treatment", but is stored, for example, in a specified storage location of the plating device 1000.

[0086] Reference Fig. 9 and Fig.10 The plate member 60 has a predetermined surface 61 that faces the contact portion 51 of the sealing member 50 when the plate member 60 is held by the substrate holder 20. Specifically, the “prescribed surface 61” according to the present embodiment is constituted by the lower surface of the plate member 60.

[0087] also, Fig. 9The illustrated “region Rg” illustrates “a region facing the contact portion 51 of the sealing member 50 ” on the predetermined surface 61 of the plate member 60 . That is, the width of the region Rg (the length in the radial direction of the plate member 60 ) corresponds to the width of the contact portion 51 .

[0088] The first electrode 70 is disposed on the predetermined surface 61 of the plate member 60. The first electrode 70 is configured to contact a predetermined portion (first portion) of the contact portion 51 of the sealing member 50 during resistance detection (see Fig.10 Specifically, when the plate member 60 is held by the substrate holder 20 during resistance detection, the shape, arrangement position, etc. of the first electrode 70 are set so that the first electrode 70 contacts a predetermined portion of the contact portion 51 .

[0089] The second electrode 71 is disposed on the predetermined surface 61 of the plate member 60. In addition, the second electrode 71 is configured to contact a portion (second portion) of the contact portion 51 of the sealing member 50 different from the portion (first portion) contacted by the first electrode 70 during resistance detection (see Fig.10 Specifically, when the plate member 60 is held on the substrate holder 20 during resistance detection, the second electrode 71 is configured in a shape, a configuration position, etc. so that the second electrode 71 contacts a predetermined portion (second portion) of the contact portion 51 .

[0090] In addition, the first electrode 70 and the second electrode 71 are electrodes for detecting the resistance of the contact portion 51 of the sealing member 50. Therefore, the first electrode 70 and the second electrode 71 are electrically insulated from each other (i.e., insulation between a pair of electrodes is ensured). Specifically, the first electrode 70 and the second electrode 71 involved in this embodiment are configured not to contact each other (i.e., a gap is provided between the first electrode 70 and the second electrode 71).

[0091] The specific material of the plate member 60 is not particularly limited, but various materials such as ceramics and metals can be used. In addition, when the plate member 60 is made of a conductive material, in order to suppress the first electrode 70 and the second electrode 71 arranged on the plate member 60 from being electrically connected to each other via the plate member 60, it is preferable to take measures such as covering the arrangement positions of the first electrode 70 and the second electrode 71 in the plate member 60 with an insulating material.

[0092] In addition, the specific structure (shape) of the first electrode 70 and the second electrode 71 is not particularly limited, and they may be configured in a ring shape or a non-ring shape.

[0093] Reference Fig. 9As an example, the first electrode 70 involved in this embodiment has a first annular portion 72 configured in an annular shape. Similarly, as an example, the second electrode 71 involved in this embodiment has a second annular portion 73 configured in an annular shape. Specifically, in this embodiment, the first electrode 70 is entirely composed of the first annular portion 72, and the second electrode 71 is also entirely composed of the second annular portion 73.

[0094] The second annular portion 73 according to the present embodiment is arranged on the central side of the first annular portion 72 in the radial direction of the first annular portion 72. In addition, the diameter of the second annular portion 73 (specifically, the diameter; D2) is smaller than the diameter of the first annular portion 72 (specifically, the diameter; D1). In addition, "the diameter of the annular portion" means "the diameter of the outer peripheral edge of the annular portion" unless otherwise specified.

[0095] In addition, if Fig.10 As illustrated, the first annular portion 72 is configured to contact the contact portion 51 of the sealing member 50 during resistance detection, and the second annular portion 73 is configured to contact a portion (second portion) of the contact portion 51 different from the portion (first portion) contacted by the first annular portion 72 .

[0096] Specifically, the diameter (D1) of the first annular portion 72 and the diameter (D2) of the second annular portion 73 of the present embodiment are set so that the first annular portion 72 and the second annular portion 73 are in contact with the annular contact portion 51 of the sealing member 50 as a whole during resistance detection. More specifically, the diameter (D1) of the first annular portion 72 and the diameter (D2) of the second annular portion 73 of the present embodiment are smaller than the diameter (d1) of the outer peripheral edge of the contact portion 51 and larger than the diameter (d2) of the inner peripheral edge of the contact portion 51 (refer to the above-mentioned d1 and d2). Figure 5 (B)).

[0097] Reference Fig. 9 and Fig.10 The resistance detector 80 is electrically connected to the first electrode 70 and the second electrode 71. Specifically, the resistance detector 80 is connected to the first electrode 70 via the first wiring 74, and is connected to the second electrode 71 via the second wiring 75.

[0098] The resistance detector 80 is configured to detect the resistance between the first electrode 70 and the second electrode 71 during resistance detection, thereby detecting the resistance of the contact portion 51 of the sealing component 50. Specifically, the resistance detector 80 involved in this embodiment is composed of a so-called resistance sensor. As an example, the resistance detector 80 involved in this embodiment is electrically connected to the control module 800. As an example, the operation of the resistance detector 80 involved in this embodiment is controlled by the control module 800.

[0099] The specific placement position of the resistance detector 80 is not particularly limited, but as an example, the resistance detector 80 according to the present embodiment is placed on the plate member 60. Specifically, as an example, the resistance detector 80 according to the present embodiment is placed on the predetermined surface 61 (lower surface) of the plate member 60.

[0100] As an example, a portion of the first wiring 74 involved in the present embodiment is configured to penetrate the plate member 60, a portion thereof is configured on the back surface (specifically, the upper surface 62) of the plate member 60 on the opposite side to the prescribed surface 61, and a portion thereof is configured on the prescribed surface 61 of the plate member 60. In addition, the second wiring 75 involved in the present embodiment is entirely configured on the prescribed surface 61 of the plate member 60. However, this is only an example of the configuration of the first wiring 74 and the second wiring 75, and the specific configuration of the first wiring 74 and the second wiring 75 is not limited to this.

[0101] Fig.12 This is an example of a flow chart for describing the “detection method” according to the present embodiment. Specifically, Fig.12 The flowchart is executed during the above-mentioned "resistance detection". Fig.12 When the flowchart is executed, the substrate holder 20 is located above the plating tank 10, and thus, the substrate holder 20 is not immersed in the plating solution Ps.

[0102] First, the plate member 60 is held by the substrate holder 20 , and the electrodes (the first electrode 70 and the second electrode 71 ) are brought into contact with the contact portion 51 of the sealing member 50 (step S10 ).

[0103] Specifically, in this embodiment, the first electrode 70 (specifically, the first annular portion 72 ) is in contact with the sealing member 50 , and the second electrode 71 (specifically, the second annular portion 73 ) is in contact with a portion of the contact portion 51 of the sealing member 50 different from the first annular portion 72 .

[0104] Next, the resistance detector 80 detects the resistance (Ω) between the first electrode 70 and the second electrode 71, thereby detecting the resistance of the contact portion 51 (step S20). Specifically, the resistance detector 80 detects the resistance between the first electrode 70 and the second electrode 71, thereby detecting the resistance between the contact portion of the first electrode 70 and the contact portion of the second electrode 71 in the contact portion 51. The resistance detected by the resistance detector 80 is transmitted to the control module 800, for example.

[0105] The control module 800 may also determine whether the conductive film 90 is formed around the contact portion 51 based on the resistance detected in step S20 (step S30). Specifically, the control module 800 may determine that the conductive film 90 is formed around the contact portion 51 when the resistance detected in step S20 is less than a preset reference value (Ω), and determine that the conductive film 90 is not formed when the detected resistance is greater than the reference value.

[0106] Alternatively, instead of the control module 800 , the user may obtain the resistance detected by the resistance detector 80 , and determine whether the conductive film 90 is formed around the contact portion 51 based on the obtained resistance (step S30 ).

[0107] According to the present embodiment described above, the electrical resistance of the sealing member 50 , specifically, the electrical resistance of the contact portion 51 can be detected.

[0108] Therefore, according to the present embodiment, it is possible to determine whether or not the conductive film 90 is formed around the contact portion 51 based on the detected resistance (that is, the formation of the conductive film 90 can be detected).

[0109] In particular, according to the present embodiment, the resistance of the contact portion 51 of the sealing member 50 can be detected without disassembling the substrate holder 20 or removing the sealing member 50 from the substrate holder 20 , so the resistance of the contact portion 51 can be easily detected.

[0110] In addition, according to this embodiment, since the first electrode 70 has the first annular portion 72 and the second electrode 71 has the second annular portion 73, the first annular portion 72 and the second annular portion 73 are in contact with the annular contact portion 51 of the sealing member 50, the resistance of the annular contact portion 51 can be effectively detected.

[0111] (Variant 1)

[0112] Next, Modification 1 of the embodiment will be described. Fig.13 (A) is a schematic bottom view of the plate member 60 of the detection device 1 according to this modification. Fig.13In (A), illustration of the first electrode 70, the second electrode 71, the resistance detector 80, etc. is omitted. Fig.13 (B) is a schematic diagram showing a part of the first electrode 70 and the second electrode 71 involved in this modification example in an enlarged manner. Specifically, Fig.13 (B) will be combined with the above Fig. 9 The same part as the "A2" portion is schematically enlarged and illustrated. Fig.14 63 is a schematic enlarged cross-sectional view showing the peripheral structure of the groove 63 in the plate member 60. Specifically, Fig.14 Will Fig.13 The cross section near A4 in (B) is schematically enlarged and illustrated.

[0113] Reference Fig.13 (A) and Fig.14 The plate member 60 of this modification example is different from the plate member 60 of the above embodiment in that it has an annular groove 63 on the predetermined surface 61. The groove 63 of this modification example is provided in a region Rg of the predetermined surface 61 that is opposite to the contact portion 51 of the sealing member 50 (i.e., a region of the predetermined surface 61 that the contact portion 51 contacts).

[0114] Specifically, if Fig.14 As shown in the example, the groove 63 involved in this modification is configured so that the contact portion 51 is inserted into the groove 63 during resistance detection. The groove width Gw of the groove 63 involved in this modification is the same value as the radial width of the contact portion 51 (which is the same as the width of the region Rg). However, as long as the contact portion 51 can be inserted into the groove 63, the structure of the groove 63 is not limited thereto, and for example, the groove width Gw of the groove 63 may be larger than the width of the contact portion 51.

[0115] In addition, if Fig.14 As illustrated, when the area near the front end of the contact portion 51 has a shape whose cross-sectional area decreases toward the front end (a mountain-shaped cross-sectional shape), the groove 63 may have a shape along the shape near the front end of the contact portion 51 (a valley-shaped cross-sectional shape).

[0116] Reference Fig.13 (B), the first electrode 70 involved in this modification example has a plurality of first branch electrodes 76 extending from the first annular portion 72 toward the second annular portion 73. In addition, the second electrode 71 involved in this modification example has a plurality of second branch electrodes 77 extending from the second annular portion 73 toward the first annular portion 72.

[0117] The plurality of first branch electrodes 76 involved in this modification are arranged in the circumferential direction of the first annular portion 72. In addition, the plurality of second branch electrodes 77 involved in this modification are arranged in the circumferential direction of the second annular portion 73. In addition, the first branch electrodes 76 and the second branch electrodes 77 are arranged alternately. That is, the plurality of first branch electrodes 76 and the second branch electrodes 77 are arranged in a manner that the second branch electrode 77 is arranged between two adjacent first branch electrodes 76 (or, in a manner that the first branch electrode 76 is arranged between two adjacent second branch electrodes 77).

[0118] In the case of this modification, during the resistance detection, the plurality of first branch electrodes 76 and the plurality of second branch electrodes 77 are in contact with the contact portion 51 of the sealing member 50 .

[0119] Reference Fig.13 (B) and Fig.14 The plurality of first branch electrodes 76 may also have a portion disposed in the groove 63. Similarly, the plurality of second branch electrodes 77 may also have a portion disposed in the groove 63.

[0120] According to this structure, the contact area between the contact portion 51 of the sealing member 50 and the first branch electrode 76 and the second branch electrode 77 arranged in the groove 63 can be easily increased. In other words, the contact area between the contact portion 51 of the sealing member 50 and the electrode can be easily increased. Thus, the resistance of the contact portion 51 of the sealing member 50 can be effectively detected.

[0121] (Variant 2)

[0122] Next, Modification 2 of the embodiment will be described. Fig.15 and Fig.16 is a schematic diagram for explaining the detection device 1 involved in this modification. Specifically, Fig.15 The state in which the plate member 60 of the detection device 1 according to the present modification is held by the substrate holder 20 during “plating processing” is schematically illustrated. Fig.16 The figure schematically shows a state in which the detection device 1 measures the resistance of the contact portion 51 of the sealing member 50 during “resistance measurement”. Fig.16 In the figure, the second holding member 22 of the substrate holder 20 is omitted.

[0123] Reference Fig.15 The plate member 60 of this modification is held on the substrate holder 20 in a manner such that a predetermined surface 61 of the plate member 60 contacts the back surface Wfb of the substrate Wf located on the opposite side of the plated surface Wfa during "plating treatment". The other structures of the plate member 60 of this modification are the same as those of the above-mentioned embodiment.

[0124] That is, the plate member 60 according to the present modification has a function as the above-mentioned back plate 23 during “plating processing.” Therefore, the plating apparatus 1000 according to the present modification does not include the back plate 23 separately from the plate member 60 .

[0125] On the other hand, in the “resistance measurement”, the plate member 60 according to the present modification is held on the substrate holder 20 in the same manner as in the above-described embodiment, so that the electrodes (the first electrode 70 and the second electrode 71) disposed on the plate member 60 are in contact with the contact portion 51 of the sealing member 50 (see Fig.16 ). In addition, the plating device 1000 according to the modification example includes the pressing member 24 similarly to the above-described embodiment, so that the plate member 60 receives the pressing from the pressing member 24 , and the electrode can be effectively brought into contact with the contact portion 51 of the sealing member 50 .

[0126] When the plating apparatus 1000 does not include the pressing member 24 , the plate member 60 is held by the substrate holder 20 such that the back surface (upper surface) of the plate member 60 opposite to the predetermined surface 61 contacts the first holding member 21 of the substrate holder 20 .

[0127] The resistance detector 80 according to this modification is preferably disposed at a location that is not immersed in the plating solution Ps during the plating process (for example, a location outside the plating tank 10 in the plating apparatus 1000 and outside the substrate holder 20). In this case, for example, a rotary connector 78 disposed on the rotating shaft 31 of the substrate holder 20 may be disposed in the middle of the wiring (first wiring 74, second wiring 75) that electrically connects the resistance detector 80 to the electrodes (first electrode 70, second electrode 71).

[0128] This modification example can also achieve the same effects as those of the above-described embodiment.

[0129] Furthermore, the detection device 1 according to the above-mentioned modification example 1 may also have the structure according to this modification example.

[0130] As mentioned above, although embodiment and modification of this invention are described in detail, this invention is not limited to this specific embodiment and modification, and various modifications and changes are possible within the scope of this invention described in the claims.

[0131] Description of Reference Numerals

[0132] 1…detection device; 10…plating tank; 11…anode; 20…substrate holder (“holder”); 50…sealing part; 51…contact part; 60…plate part; 61…specified surface; 63…groove; 70…first electrode; 71…second electrode; 72…first annular part; 73…second annular part; 76…first branch electrode; 77…second branch electrode; 80…resistance detector; 1000…plating device; Ps…plating solution; Rg…region; Wf…substrate; Wfa…plated surface; Wfb…back surface.

Claims

1. A detection device for detecting the resistance of a sealing component of a plating device, The detection device is characterized in that The plating device comprises: a plating tank, wherein the plating tank is provided with an anode; a bracket, wherein the bracket is configured to hold the substrate in a manner such that the plated surface of the substrate faces the anode when a plating process is performed on the substrate as a cathode; and the sealing component, wherein the sealing component has a contact portion configured to contact the plated surface of the substrate during the plating process. The detection device comprises: a plate member, the plate member being configured to be held on the support in place of the substrate during resistance detection for detecting the resistance of the contact portion, and having a predetermined surface facing the contact portion when held on the support during the resistance detection; a first electrode, the first electrode being configured to be disposed on the predetermined surface of the plate member and to be in contact with the contact portion during the resistance detection; a second electrode, the second electrode being configured to be disposed on the predetermined surface of the plate member and to contact a portion of the contact portion different from the portion contacted by the first electrode during the resistance detection; as well as A resistance detector is configured to be electrically connected to the first electrode and the second electrode, and detects the resistance between the first electrode and the second electrode during the resistance detection, thereby detecting the resistance of the contact portion.

2. The detection device according to claim 1, characterized in that: The contact portion of the sealing member is configured in an annular shape. The first electrode has a first annular portion configured in an annular shape, The second electrode has a second annular portion configured in an annular shape, The second annular portion is disposed on the side closer to the center of the first annular portion in the radial direction of the first annular portion, and has a diameter smaller than a diameter of the first annular portion.

3. The detection device according to claim 2, characterized in that: The plate member has a groove formed in an annular shape on the predetermined surface thereof. The groove is configured so that the contact portion can be inserted into the groove during the resistance detection.

4. The detection device according to claim 3, characterized in that: The first electrode has a plurality of first branch electrodes extending from the first annular portion toward the second annular portion, The second electrode has a plurality of second branch electrodes extending from the second annular portion toward the first annular portion, The plurality of first branch electrodes have a portion disposed in the groove, The plurality of second branch electrodes have portions disposed in the groove.

5. The detection device according to claim 1, characterized in that: During the plating process, the plate member is held by the holder so that the predetermined surface is in contact with the back surface of the substrate that is located on the opposite side to the surface to be plated.

6. A detection method, using the detection device according to claim 1, The detection method is characterized by comprising: With the plate member held on the holder, the first electrode is brought into contact with the contact portion of the sealing member, and the second electrode is brought into contact with a portion of the contact portion of the sealing member that is different from the portion contacted by the first electrode; and The resistance detector detects the resistance between the first electrode and the second electrode, thereby detecting the resistance of the contact portion of the sealing member.

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