SMA OIS product assembly method and system

Abstract

The invention discloses an SMA OIS product assembly method and system, and the method comprises the steps: installing an SMA wire on an OIS product, and enabling the SMA wire to be in a bent state; in the subsequent assembly process of the OIS product, the SMA wires are kept in a straightened state; and after the assembly is completed, the SMA wire is restored to be in a bent state. By means of the scheme, interference caused by SMA bending to installation of other parts in a product in the product assembling process can be effectively avoided, and the product assembling yield is increased.

Description

Technical Field

[0001] The invention relates to the technical field of precision manufacturing, and in particular to a SMA OIS product assembly method and system. Background Art

[0002] Optical image stabilization refers to the use of optical components, such as lens settings, in cameras or other similar imaging instruments to avoid or reduce instrument jitter that occurs during the capture of optical signals, thereby improving image quality. SMA (Shape Memory Alloys) is a metal that can remember its shape and will return to its original shape when the temperature reaches above the memory temperature. SMA OIS (Optical Image Stabilizer) uses tiny SMA wires as driving elements to drive the image sensor chip or lens to move in order to achieve optical image stabilization. Compared with the traditional optical image stabilization mechanism that requires a voice coil motor to drive the lens to complete the anti-shake movement, SMA wires occupy a smaller volume and are therefore increasingly widely used.

[0003] In OIS products, the required length of the SMA wire is usually greater than the distance between the clamping parts at both ends. Therefore, the SMA wire will be in a bent state after installation. In addition, in order to reduce the overall volume of the module, the distance between the SMA and other components must be minimized. Therefore, during the subsequent assembly of the product, the bending of the SMA is likely to interfere with the installation of other components inside the product, affecting the product assembly yield. Summary of the invention

[0004] The embodiment of the present invention provides an SMA OIS product assembly method and system to avoid interference of SMA bending on the installation of other components inside the product during the product assembly process, thereby improving the product assembly efficiency.

[0005] On the one hand, an embodiment of the present invention provides a SMA OIS product assembly method, the method comprising:

[0006] Installing an SMA wire on the OIS product, wherein the SMA wire is in a bent state;

[0007] During the subsequent assembly process of the OIS product, the SMA wire is kept in a straight state;

[0008] After the assembly is completed, the SMA wire is restored to its bent state.

[0009] Optionally, keeping the SMA wire in a straight state includes: keeping the SMA wire in a straight state by heating at each assembly station; and restoring the SMA wire to a bent state includes: after assembly is completed, placing the SMA wire at room temperature to restore the SMA wire to a bent state.

[0010] Optionally, keeping the SMA wire in a straight state by heating comprises:

[0011] Setting a heating platform and keeping the SMA wire in a straight state by the heating platform; or

[0012] Applying current to the SMA wire keeps the SMA wire in a straight state.

[0013] Optionally, the step of providing a heating platform and keeping the SMA wire in a straight state by means of the heating platform comprises:

[0014] Setting a heating platform, and controlling the temperature of the heating platform to be within a set range;

[0015] The carrier plate carrying the product is placed on the heating platform, and the temperature of the heating platform is used to keep the SMA wire in a straight state.

[0016] Optionally, keeping the SMA wire in a straight state by means of a heating platform further comprises: using a fixing device to press down the carrier plate so that the carrier plate is closely fitted to the heating platform.

[0017] Optionally, applying current to the SMA wire to keep the SMA wire in a straight state includes: energizing a PCB board where the SMA wire is located, and applying current to the SMA wire by the PCB board to keep the SMA wire in a straight state.

[0018] Optionally, energizing the PCB board where the SMA wire is located includes: connecting an external connection end of the PCB board where the SMA wire is located to a power supply provided by a current assembly station.

[0019] Optionally, the assembly station includes any one or more of the following: a dispensing station, a mounting station, and heating and curing.

[0020] On the other hand, an embodiment of the present invention further provides a SMAOIS product assembly system, the system comprising:

[0021] An installation device, used for installing the SMA wire on the OIS product, wherein the SMA wire is in a bent state;

[0022] A control device, used to keep the SMA wire in a straight state during the subsequent assembly process of the OIS product;

[0023] The static device is used to restore the SMA wire to a bent state after assembly is completed.

[0024] Optionally, there are multiple control devices, which are respectively arranged at each assembly station.

[0025] Optionally, the control device comprises:

[0026] A heating platform is provided on the assembly station, and the temperature of the heating platform is controlled within a set range; or

[0027] A power supply is arranged on the assembly station, and the power supply is used to connect to an external connection end of a PCB board where the SMA wire is located, so as to apply current to the SMA wire through the PCB board.

[0028] Compared with the prior art, the technical solution of the embodiment of the present invention has the following beneficial effects:

[0029] The SMA OIS product assembly method and system provided by the embodiment of the present invention installs an SMA wire on the OIS product, and the SMA wire is in a bent state; in the subsequent assembly process of the OIS product, the SMA wire is kept in a straight state, and after the assembly is completed, the SMA wire is restored to a bent state. This effectively avoids the interference of the bending of the SMA wire on the installation of other parts inside the product, and does not damage the SMA wire, thereby improving the product assembly yield.

[0030] Furthermore, by utilizing the fact that the shape of the SMA itself is affected by temperature changes and that the SMA has shape memory characteristics, the SMA wire can be kept in a straight state by heating at each assembly station, thereby making it simple and convenient to keep the SMA wire in a straight state until assembly is completed.

[0031] Furthermore, at different workstations, the SMA wire can be kept straight in different ways, for example, by setting a heating platform and keeping the SMA wire straight through the heating platform; or applying current to the SMA wire to keep the SMA wire straight. Thus, it is possible to adapt to local conditions according to the facilities of the workstation, and facilitate the operation of keeping the SMA wire straight in different assembly links of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a flow chart of the SMA OIS product assembly method provided by an embodiment of the present invention;

[0033] Figure 2 Schematic diagram of the SMA wire in the embodiment of the present invention being changed into a straightened state by passing through a heating platform;

[0034] Figure 3Schematic diagram of the SMA wire in the embodiment of the present invention being changed into a straightened state by powering on;

[0035] Figure 4 It is a structural schematic diagram of a SMAOIS product assembly system provided by an embodiment of the present invention;

[0036] Figure 5 It is a structural schematic diagram of a control device in an embodiment of the present invention. DETAILED DESCRIPTION

[0037] In order to make the above-mentioned objects, features and beneficial effects of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0038] In order to solve the problem that a bent SMA wire during the assembly process of a product using the SMA wire easily interferes with the installation of other components inside the product, thereby affecting the product assembly efficiency, an embodiment of the present invention provides an SMA OIS product assembly method and system, which utilizes the memory characteristics of the SMA wire to keep the SMA wire in a straight state during the assembly process of the product after the SMA wire is installed; and restores the SMA wire to a bent state after the assembly is completed.

[0039] like Figure 1 FIG. 1 is a flow chart of a SMA OIS product assembly method provided by an embodiment of the present invention, comprising the following steps:

[0040] Step 101: Install an SMA wire on an OIS product, wherein the SMA wire is in a bent state.

[0041] Step 102, during the subsequent assembly process of the OIS product, the SMA wire is kept in a straight state.

[0042] In step 103, after the assembly is completed, the SMA wire is restored to a bent state.

[0043] In specific applications, the shape of the SMA itself can be affected by temperature changes and the SMA has shape memory characteristics. The SMA wire can be kept straight by heating at each assembly station, thereby simply and conveniently keeping the SMA wire straight.

[0044] Since the SMA wire is heated at each assembly station, even if the SMA wire returns to its bent state due to temperature changes when being transferred between different stations, it can be straightened again by heating at the next station without interfering with the installation of other components inside the product.

[0045] Of course, in some assemblies that require the SMA shape to remain straight, the transfer time of the product between different workstations can be controlled to be less than a preset time, such as 6s (the smaller the better), so that the effect of temperature on the SMA shape change can be ignored, and the SMA shape can also be kept straight from the current workstation to the next workstation.

[0046] In a specific implementation, the SMA wire can be heated in a variety of ways to keep it in a straight state.

[0047] For example, in a non-limiting embodiment, a heating platform may be provided at the assembly station, and the SMA wire may be kept in a straight state by the heating platform.

[0048] For another example, in another non-limiting embodiment, an electric current may be applied to the SMA wire to keep the SMA wire in a straight state.

[0049] In practical applications, the SMA wire can be heated in an appropriate manner according to the actual environment of the workstation. The SMA wire can be heated in the same manner at all workstations, or in different manners. For example, a heating platform is provided at the dispensing workstation, and current is applied to the SMA wire at the mounting workstation to increase its temperature and change it from a bent state to a straight state. This embodiment of the present invention is not limited to this.

[0050] The above two methods of straightening the SMA wire by heating are further described in detail below.

[0051] (1) Using the heating platform heating method to heat the SMA wire to make it straight

[0052] Reference Figure 2 In this method, it is first necessary to set up a heating platform 20 on the corresponding assembly station in advance, and control the temperature of the heating platform 20 within a set range (for example, 80°C-100°C). Then, a carrier plate 31 carrying the product 30 is placed on the heating platform 20, and the temperature of the heating platform 20 is used to keep the SMA wire 32 in the product 30 in a straight state.

[0053] In a specific implementation, a heating wire or heating rod 21 may be provided inside or below the heating platform 20 to heat the heating platform 20 and keep the temperature of the heating platform 20 within a certain range. The heating platform 20 may be made of a material with high thermal conductivity, such as aluminum alloy.

[0054] The carrier plate 31 can be controlled by the transmission device to automatically move to a predetermined position of the heating platform 20, and at the same time complete the corresponding operation process of the product 30 on the platform, such as the glue dispensing operation.

[0055] Furthermore, in this manner, if Figure 2As shown, the fixing device 10 can also be used to press down the carrier 31 so that the carrier 31 fits tightly with the heating platform 20, thereby ensuring that the product 30, the carrier 31 and the heating platform 20 are in full contact, which is beneficial to heat conduction. At this time, the SMA wire 32 will be instantly straightened due to the heat, effectively preventing the glue from sticking to the SMA.

[0056] Furthermore, a temperature sensor 22 may be provided on the heating platform 20 to monitor the temperature of the heating platform 20 in real time to ensure that the temperature is within a set range.

[0057] (2) Use electricity to heat and straighten the SMA wire

[0058] Usually, the SMA wire is installed on the PCB board of the product. Therefore, the PCB board where the SMA wire is located can be powered on, and the PCB board applies current to the SMA wire to keep the SMA wire in a straight state. Specifically, the external connection end of the PCB board where the SMA wire is located can be connected to the power supply provided by the current assembly station, and the external power supply is connected through the external connection end to make the SMA wire generate current, thereby heating up and becoming straightened. Figure 3 shown.

[0059] The following uses the three assembly steps of glue dispensing, mounting, and heating and curing in the product assembly process as an example to further explain the method of the present invention in detail.

[0060] Example 1

[0061] Process 1: Glue Dispensing

[0062] A heating platform is set at the dispensing station. According to the material of the SMA wire, the temperature of the heating platform is set in an appropriate temperature range, such as between 80℃ and 100℃. When the carrier plate carries the product to the designated position, the fixing device presses down to tightly fit the carrier plate on the heating platform to ensure that the product, carrier plate and heating platform are in full contact, which is conducive to heat conduction. At this time, the SMA wire will be instantly straightened due to the heat, effectively preventing the dispensing glue from sticking to the SMA wire.

[0063] Process 2: Mounting

[0064] The product moves from the dispensing station to the mounting station. The mounting platform is also made into a heating platform that is the same as the dispensing platform. The heating platform is set to the same temperature as the dispensing platform to ensure that the SMA wire remains straight in a high temperature environment. The mounting head uses camera positioning and recognition to accurately fit the material and the dispensing glue.

[0065] Process 3: Heating and curing

[0066] An oven is designed in the unloading section (the temperature of the oven is also set to 80℃-100℃). After the materials are bonded, the product is quickly moved into the oven through an automatic transmission device to ensure that the SMA wire remains straight until the glue is completely dried and solidified. Usually, the SMA wire will bend and deform in a few seconds at room temperature. After deformation, the SMA wire has the risk of being stained with glue, which affects the product performance.

[0067] It should be noted that, in actual applications, the temperature of the oven and heating platform can be controlled by a temperature sensor connected to the equipment operating software. When the actual temperature exceeds the set temperature, the equipment will issue an alarm so that on-site engineers can maintain the equipment in time to avoid batch defects due to temperature problems.

[0068] In addition, it should be noted that the heating platform needs to be installed in a location without air convection, because the SMA wire is heated and straightened by conducting the temperature of the heating platform to the air, and air convection can easily carry away the heat in the air but not easily straighten the SMA wire.

[0069] Example 2

[0070] Process 1: Glue Dispensing

[0071] The product flows into the dispensing position, connects the external connection end of the PCB board to the external power supply, and gives a certain current to the SMA wire on the PCB board. During the power-on process, the SMA wire instantly rises in temperature due to resistance and becomes straight (power-on makes the temperature of the SMA wire between 80-100℃), thereby effectively avoiding the situation where the glue sticks to the SMA wire during the dispensing process.

[0072] Process 2: Mounting

[0073] After the product is dispensed and flows into the mounting position, a certain current is given to the SMA wire on the PCB board by connecting the external connection end of the PCB board (the temperature of the SMA wire is between 80-100℃). The SMA wire is heated and straightened by the power, ensuring that the SMA wire remains straight during the mounting process and does not interfere with the installation of other components.

[0074] Process 3: Heating and curing

[0075] An oven is designed in the unloading section (the temperature of the oven is also set to 80℃). After the materials are bonded, the products are quickly moved into the oven through an automatic transmission device to ensure that the SMA wire remains straight until the glue is completely dried and solidified. This effectively prevents the SMA wire from bending and deforming at room temperature and getting stained with glue, which affects product performance.

[0076] Accordingly, an embodiment of the present invention further provides a SMA OIS product assembly system, such as Figure 4 The figure shows a structural diagram of the system.

[0077] The SMA OIS product assembly system 400 includes: a mounting device 403, a control device 401 and a stationary device 402. Among them:

[0078] The mounting device 403 is used to mount the SMA wire on the OIS product, wherein the SMA wire is in a bent state;

[0079] The control device 401 is used to keep the SMA wire in a straight state during the subsequent assembly process of the OIS product;

[0080] The static device 402 is used to restore the SMA wire to a bent state after assembly is completed.

[0081] It should be noted that the stationary device 402 can be arranged inside the assembly system 400 or outside the assembly system 400, and this solution does not limit this.

[0082] In practical applications, there may be multiple control devices 401 , which are respectively arranged at each assembly station.

[0083] The control device 401 can be implemented in different ways. In an assembly station, one or more types of adapters can be provided, and the present invention does not limit this. For example, the above-mentioned heating platform and / or power supply can be included.

[0084] like Figure 5 FIG. 1 is a schematic diagram of a structure of a control device in an embodiment of the present invention.

[0085] The control device 401 includes: a heating platform 411, and / or a power source 412. Wherein:

[0086] The heating platform 411 may be disposed on the assembly station, and the temperature of the heating platform 411 is controlled within a set range (e.g., 80-100° C.);

[0087] The power supply 412 can be arranged on the assembly station, and the power supply 412 is used to connect the external connection end of the PCB board where the SMA wire is located, so as to apply current to the SMA wire through the PCB board. The PCB board can be any PCB board in the product. In addition, the voltage of the power supply 412 can make the temperature of the SMA wire reach 80-100°C, which can be determined according to the actual resistance of the SMA wire and the required current.

[0088] For other related descriptions of the above-mentioned SMAOIS product assembly system 400, reference may be made to the related descriptions in the aforementioned method embodiment of the present invention, which will not be repeated here.

[0089] The SMA OIS product assembly method and system provided by the embodiment of the present invention, after the SMA wire in a bent state is installed in the product, the SMA wire is kept in a straight state in the subsequent installation process, and after the assembly is completed, the product is placed at room temperature to restore the SMA wire to a bent state. This effectively avoids the interference of the bending of the SMA wire on the installation of other parts inside the product, improves the product assembly efficiency, and does not cause damage to the SMA wire.

[0090] It should be understood that the term "and / or" in this article is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article indicates that the associated objects before and after are in an "or" relationship.

[0091] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A SMA OIS product assembly method, characterized in that: The method comprises: Installing an SMA wire on the OIS product, wherein the SMA wire is in a bent state; During the subsequent assembly process of the OIS product, the SMA wire is kept in a straight state; After the assembly is completed, the SMA wire is restored to its bent state.

2. The method according to claim 1, characterized in that The step of keeping the SMA wire in a straight state comprises: At each assembly station, the SMA wire is kept in a straight state by heating; The restoring the SMA wire to a bent state comprises: After the assembly is completed, the SMA wire is placed at room temperature to restore the SMA wire to a bent state.

3. The method according to claim 2, characterized in that The step of keeping the SMA wire in a straight state by heating comprises: Setting a heating platform and keeping the SMA wire in a straight state by the heating platform; or Applying current to the SMA wire keeps the SMA wire in a straight state.

4. The method according to claim 3, characterized in that The step of providing a heating platform and keeping the SMA wire in a straight state by means of the heating platform comprises: Setting a heating platform, and controlling the temperature of the heating platform to be within a set range; The carrier plate carrying the product is placed on the heating platform, and the temperature of the heating platform is used to keep the SMA wire in a straight state.

5. The method according to claim 4, characterized in that The step of keeping the SMA wire in a straight state by heating the platform further comprises: The carrier plate is pressed down by a fixing device so that the carrier plate is closely fitted to the heating platform.

6. The method according to claim 3, characterized in that The applying current to the SMA wire to keep the SMA wire in a straight state comprises: The PCB board where the SMA wire is located is powered on, and the PCB board applies current to the SMA wire to keep the SMA wire in a straight state.

7. The method according to claim 6, characterized in that The step of electrifying the PCB board where the SMA wire is located comprises: The external connection end of the PCB board where the SMA wire is located is connected to the power supply provided by the current assembly station.

8. The method according to any one of claims 2 to 7, characterized in that: The assembly stations include any one or more of the following: a dispensing station and a mounting station.

9. A SMAOIS product assembly system, characterized in that: The system comprises: An installation device, used for installing the SMA wire on the OIS product, wherein the SMA wire is in a bent state; A control device, used to keep the SMA wire in a straight state during the subsequent assembly process of the OIS product; The static device is used to restore the SMA wire to a bent state after assembly is completed.

10. The system according to claim 9, characterized in that There are multiple control devices, which are respectively arranged at each assembly station.

11. The system according to claim 10, characterized in that The control device comprises: A heating platform is provided on the assembly station, and the temperature of the heating platform is controlled within a set range; or A power supply is arranged on the assembly station, and the power supply is used to connect to an external connection end of a PCB board where the SMA wire is located, so as to apply current to the SMA wire through the PCB board.

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