Automatic grinding, cleaning and thickness measuring system for quartz wafer

Abstract

The invention provides an automatic grinding, cleaning and thickness measuring system for a quartz wafer, and relates to the technical field of quartz wafer processing. Comprising a scanning gun used for scanning a two-dimensional code of a to-be-ground quartz wafer to obtain grinding related data, a touch screen used for displaying the current grinding related data, a grinding machine used for grinding the to-be-ground quartz wafer to obtain a ground quartz wafer, a circle counting module used for counting the number of grinding circles of the grinding machine, and a display module used for displaying the counted number of the grinding circles. The cleaning and drying module is used for cleaning and drying the ground quartz wafer to obtain the cleaned quartz wafer, the thickness measuring module is used for measuring the thickness of the cleaned quartz wafer to obtain thickness data, and the turn number calculating module is used for calculating the turn number according to the current thickness data, preset thickness data and thickness data before grinding. By means of the wafer thickness measuring method and device, the problem that in the prior art, the wafer thickness measuring precision is not high is solved.

Description

Technical Field

[0001] The invention relates to the technical field of quartz wafer processing, in particular to an automatic grinding, cleaning and thickness measuring system for quartz wafers. Background Art

[0002] The integrated circuit industry is the core foundation of the artificial intelligence era. my country has raised the development of the integrated circuit industry to the level of national strategy, and quartz chips play an extremely important role in the artificial intelligence industry. China is a producer and exporter of quartz chip components, but there is still a large gap in output value and product quality compared with developed countries. The industry has developed very rapidly in recent years, and the demand for processing equipment and online high-precision measurement and control equipment in the production process of quartz chip components is also increasing.

[0003] In the existing quartz wafer grinding process, the machine is stopped, and the grinding liquid and abrasive residue on the surface of the quartz wafer are manually cleaned and dried before being inspected with measuring tools such as micrometers. After the inspection, the required number of grinding circles must be manually calculated and the machine is restarted for grinding. As a result, the production process has a long cycle, low efficiency, frequent shutdowns, large errors and low precision in manual inspections using external measuring tools, and problems such as over-grinding of the grinder due to unskilled workers.

[0004] CN202111239605.2 discloses a Jingtuo thickness measurement system, which uses an automatic thickness measurement module to automatically measure the thickness of the wafer during the wafer grinding process. However, the quartz wafer needs to be manually cleaned and the grinding liquid and abrasive residue on the surface need to be wiped dry before and after thickness measurement after grinding. If it is not cleaned thoroughly, the measurement accuracy will be reduced. Summary of the invention

[0005] In order to overcome the deficiencies of the prior art, the purpose of the present invention is to provide a quartz wafer automatic grinding, cleaning and thickness measurement system, which solves the problem of low precision in measuring wafer thickness in the prior art.

[0006] To achieve the above object, the present invention provides the following solutions:

[0007] A quartz wafer automatic grinding, cleaning and thickness measurement system, comprising:

[0008] A cleaning and drying module, a grinder, a lap counting module, a microprocessor module, a scanning gun connected to the microprocessor module, a touch screen, a thickness measuring module, and a lap counting module;

[0009] The scanning gun is connected to the touch screen, the touch screen is connected to the grinder, the grinder is connected to the cleaning and drying module and the circle counting module, and the cleaning and drying module is connected to the thickness measuring module;

[0010] The scanning gun is used to scan the QR code of the quartz wafer to be ground to obtain grinding-related data, the touch screen is used to display the current grinding-related data, the grinder is used to grind the quartz wafer to be ground to obtain the ground quartz wafer, the circle counting module is used to count the number of grinding circles of the grinder, the cleaning and drying module is used to clean and dry the ground quartz wafer to obtain the cleaned quartz wafer, the thickness measuring module is used to measure the thickness of the cleaned quartz wafer to obtain thickness data, the circle number calculation module is used to calculate according to the current thickness data, the preset thickness data and the thickness data before grinding to obtain the grinding instruction, the grinding rate and the number of circles to be ground, wherein the grinding instruction is used to control whether the grinder continues to grind.

[0011] Preferably, the thickness measurement module comprises:

[0012] Micrometer submodule, average thickness calculation submodule and data transmission submodule;

[0013] The micrometer submodule is used to measure the cleaned quartz wafer using a digital micrometer to obtain a measurement data set, the average thickness calculation submodule is used to perform average numerical calculation on the measurement data set to obtain thickness data, and the sending submodule is used to transmit the thickness data to the microprocessor module.

[0014] Preferably, the calculation expression of the thickness data is:

[0015]

[0016] in, is the thickness data, x is the number of samples extracted from the quartz wafer to be ground, D x The data is concentrated measurement data.

[0017] Preferably, the calculation expression of the grinding rate is:

[0018]

[0019] Where α is the grinding rate, To measure the average thickness of the quartz wafer sample before pre-grinding, To measure the average thickness of the quartz wafer sample after pre-grinding, n0 is the number of pre-grinding turns.

[0020] Preferably, the calculation expression of the circle to be ground is:

[0021]

[0022] Among them, n left is the number of circles to be ground, This is the lower limit of the grinding target.

[0023] The present invention discloses the following technical effects:

[0024] The present invention provides a quartz wafer automatic grinding, cleaning and thickness measurement system, comprising: a cleaning and drying module, a microprocessor module, a scanning gun connected to the microprocessor module, a touch screen, a grinder, a circle counting module, and a thickness measurement module; the scanning gun is connected to the touch screen, the touch screen is connected to the grinder, the grinder is connected to the cleaning and drying module and the circle counting module, and the cleaning and drying module is connected to the thickness measurement module; the scanning gun is used to scan a two-dimensional code of a quartz wafer to be ground to obtain grinding-related data, the touch screen is used to display current grinding-related data, the grinder is used to grind the quartz wafer to be ground to obtain a ground quartz wafer, the circle counting module is used to count the number of grinding circles of the grinder, the cleaning and drying module is used to clean and dry the ground quartz wafer to obtain a cleaned quartz wafer, the thickness measurement module is used to measure the thickness of the cleaned quartz wafer to obtain thickness data, the circle number calculation module is used to calculate according to the current thickness data, the preset thickness data and the thickness data before grinding to obtain a grinding instruction, a grinding rate and the number of circles to be ground, wherein the grinding instruction is used to control whether the grinder continues grinding. The present invention inputs the state data and grinding requirement parameters of the quartz wafer to be ground into the microprocessor module through a scanning gun, calculates the number of turns to be ground and automatically sends it to the grinder, then starts the grinder to grind the quartz wafer; when the grinder runs to the set number of turns, the grinding is automatically stopped; then the manipulator of the cleaning and drying module automatically grabs the quartz wafer sample in the grinding disc of the grinder for cleaning and drying, and the dried wafer is sent to the thickness measurement module for automatic thickness measurement. The data of the system in the grinding, cleaning and thickness measurement process are all transmitted to the touch screen in real time to realize monitoring and display, so that the entire quartz wafer grinding process is not only automated, but also shortens the production cycle; during use, the quartz wafer can be automatically ground, cleaned and thickness measured online in real time, and it is determined whether to continue grinding and set the subsequent grinding number of turns by calculation according to the measurement data results, and the staff does not need to repeatedly stop the machine before and during grinding to clean and measure the thickness of the quartz wafer, which not only avoids the error of manual measurement affecting the accuracy of the finished product, but also avoids the shutdown operation for automatic cleaning and measurement during the process, greatly improving the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0026] Figure 1 This is a system architecture diagram of the present invention;

[0027] Figure 2 It is the overall flow chart of the system of the present invention;

[0028] Figure 3 This is a flow chart of initializing the grinding related parameters of the system of the present invention;

[0029] Figure 4 This is a grinding flow chart of the grinding machine of the present invention;

[0030] Figure 5 This is a flow chart of online cleaning and drying of the present invention;

[0031] Figure 6 This is the flow chart of online thickness measurement of the present invention;

[0032] Figure 7 This is a flow chart for online calculation of grinding rate and number of revolutions of the present invention. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0035] like Figure 1-7 As shown, the present invention provides a quartz wafer automatic grinding, cleaning and thickness measurement system, characterized in that it includes:

[0036] A cleaning and drying module, a grinder, a lap counting module, a microprocessor module, a scanning gun connected to the microprocessor module, a touch screen, a thickness measuring module, and a lap counting module;

[0037] The scanning gun is connected to the touch screen, the touch screen is connected to the grinder, the grinder is connected to the cleaning and drying module and the circle counting module, and the cleaning and drying module is connected to the thickness measuring module;

[0038] The scanning gun is used to scan the QR code of the quartz wafer to be ground to obtain grinding-related data, the touch screen is used to display the current grinding-related data, the grinder is used to grind the quartz wafer to be ground to obtain the ground quartz wafer, the circle counting module is used to count the number of grinding circles of the grinder, the cleaning and drying module is used to clean and dry the ground quartz wafer to obtain the cleaned quartz wafer, the thickness measuring module is used to measure the thickness of the cleaned quartz wafer to obtain thickness data, the circle number calculation module is used to calculate according to the current thickness data, the preset thickness data and the thickness data before grinding to obtain the grinding instruction, the grinding rate and the number of circles to be ground, wherein the grinding instruction is used to control whether the grinder continues to grind.

[0039] Specifically, the thickness data before grinding is measured according to the thickness measurement module.

[0040] Specifically, the microprocessor module will calculate the grinding rate of the grinder and the number of turns to be ground, and automatically send the number of turns to the touch screen and the grinder counter, and then the grinder will automatically start running and grind the quartz wafer; when the grinder runs to a given number of turns, the grinder automatically stops grinding; after the grinder stops, the cleaning and drying module cleans and dries the ground quartz wafer samples, and the thickness measuring module measures the thickness of the cleaned and dried quartz wafer samples, and the microprocessor module compares the sent thickness data with the preset standard lower limit thickness value data to determine whether to continue grinding or automatically calculate the number of turns to continue grinding.

[0041] Furthermore, the thickness measurement module includes:

[0042] Micrometer submodule, average thickness calculation submodule and data transmission submodule;

[0043] The micrometer submodule is used to measure the cleaned quartz wafer using a digital micrometer to obtain a measurement data set, the average thickness calculation submodule is used to perform average numerical calculation on the measurement data set to obtain thickness data, and the sending submodule is used to transmit the thickness data to the microprocessor module.

[0044] Specifically, the online thickness measurement process of the thickness measurement module includes:

[0045] 1) Set the number of quartz wafer samples for online automatic thickness measurement;

[0046] 2) Select a corresponding number of quartz wafer samples from the sample and measure their thickness using a digital micrometer;

[0047] 3) Calculate the average thickness and related information;

[0048] 4) Send the calculated average thickness and related information to the microprocessor module and the touch screen.

[0049] Furthermore, the calculation expression of the thickness data is:

[0050]

[0051] in, is the thickness data, x is the number of samples extracted from the quartz wafer to be ground, D x The data is concentrated measurement data.

[0052] Furthermore, the calculation expression of the grinding rate is:

[0053]

[0054] Where α is the grinding rate, To measure the average thickness of the quartz wafer sample before pre-grinding, To measure the average thickness of the quartz wafer sample after pre-grinding, n0 is the number of pre-grinding turns.

[0055] Further, the calculation expression of the circle to be ground is:

[0056]

[0057] Among them, n left is the number of circles to be ground, This is the lower limit of the grinding target.

[0058] Specifically, the microprocessor module online calculates the number of turns to be ground and the grinding rate process includes:

[0059] 1) Calculate the current grinding rate according to the thickness of the quartz wafer sample before and after pre-grinding;

[0060] 2) Calculate the number of grinding turns of the quartz wafer sample based on the difference between the current product thickness and the standard lower limit;

[0061] 3) Send the measured thickness and related statistical information to the microprocessor module and touch screen.

[0062] More specifically, after power-on, each module and data of the system is initialized and configured. The initialization configuration of each module includes indicator light initialization, cleaning and drying module initialization, scanner initialization, touch screen initialization, grinder motor status initialization, grinder start and stop control port initialization, grinder turn signal detection port initialization, grinding sand start and stop control port initialization, calculation turn initialization, serial port initialization, power-off storage module initialization, and comparator initialization; the data initialization process includes initialization control and setting buttons, setting the abnormal system status indicator light in the main interface according to the data read from the power-off storage module; initializing measurement statistics; reading online frequency measurement parameters, static test parameters and control strategy parameters from the power-off storage module, and sending them for display; reading the grinding starting wafer thickness, grinder grinding rate, and grinding target lower limit thickness value from the power-off storage module and sending them for display. The data initialization process includes initializing control and setting buttons, batch number of quartz wafer to be ground, abrasive number, thickness tolerance, thickness lower limit, etc.; setting abnormal system status indicator in the main interface according to the data read from the power-off storage module; initializing thickness measurement statistics; reading online frequency measurement parameters, static test parameters and control strategy parameters from the power-off storage module and sending them for display; reading the grinding starting wafer thickness from the power-off storage module Grinding target thickness Send display.

[0063] The microprocessor module records and saves the relevant data of the system during and after the grinding process in real time. All data are stored in the designed data table for real-time viewing and archiving.

[0064] More specifically, when the quartz wafer automatic grinding, cleaning and thickness measurement system provided by the present invention is used for grinding with a grinder, first, the upper grinding disc of the grinder is raised, and the quartz wafers to be ground are evenly placed on the planetary wheel of the lower grinding disc of the grinder, and then the upper grinding disc of the grinder is lowered; secondly, the sand liquid pump is turned on, the grinding motor is turned on to start grinding and the circle counting module is started at the same time. During the grinding process of the grinder, the microprocessor module compares in real time whether the circle counting module count reaches a preset number of grinding circles. If the circle counting module count reaches the preset number of grinding circles, the grinder stops grinding and transmits relevant data information to the microprocessor module.

[0065] When the quartz wafer automatic grinding, cleaning and thickness measurement system provided by the present invention is used to clean and dry the ground quartz wafer, firstly, the upper grinding disc of the grinder is raised, and the manipulator of the cleaning and drying module grabs the quartz wafer in the lower grinding disc of the grinder and places it in the cleaning basket, and then the first cleaning water pump is started for a few seconds and then the second cleaning water pump is started for a few seconds to clean the wafer, and finally the drying heating blower is turned on to dry the quartz wafer.

[0066] When the quartz wafer automatic grinding, cleaning and thickness measurement system provided by the present invention is used to measure the thickness of the cleaned and dried quartz wafer, firstly, the small vacuum pump of the thickness measurement module sucks the quartz wafer and places it in the measuring port of the digital micrometer, and the thickness data measured by the digital micrometer is automatically sent to the microprocessor module through the data line.

[0067] When the quartz wafer automatic grinding, cleaning and thickness measurement system provided by the present invention is used, after the system starts to be powered on, the system first performs peripheral initialization configuration and data initialization configuration, and then the staff selects a certain grinder and scans the two-dimensional code of the quartz wafer to be ground through a scanning gun to transmit relevant data to the microprocessor module and the touch screen; the thickness measurement module randomly measures the thickness of the quartz wafer sample, starts the grinder for pre-grinding n0 circles, cleans and dries the quartz wafer, and measures the thickness of the quartz wafer again, calculates the grinding rate α according to the wafer thickness measured twice and the number of pre-grinding circles, and calculates the number of circles n required for grinding according to the thickness after pre-grinding, the grinding rate and the limit thickness in the process requirements left , start the grinder again for grinding, the circle counting module counts the set number of circles in real time and then stops grinding, and measures the thickness of the quartz wafer again to see if the thickness reaches the thickness value in the process requirements. If not, calculate the number of circles to be ground and grind until the required thickness value is reached. If it has been reached, save the relevant data. The grinding of this batch of quartz wafers is completed.

[0068] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0069] The principles and implementation methods of the present invention are described in this article using specific examples. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A quartz wafer automatic grinding, cleaning and thickness measurement system, characterized in that: include: A cleaning and drying module, a grinder, a lap counting module, a microprocessor module, a scanning gun connected to the microprocessor module, a touch screen, a thickness measuring module, and a lap counting module; The scanning gun is connected to the touch screen, the touch screen is connected to the grinder, the grinder is connected to the cleaning and drying module and the circle counting module, and the cleaning and drying module is connected to the thickness measuring module; The scanning gun is used to scan the QR code of the quartz wafer to be ground to obtain grinding-related data, the touch screen is used to display the current grinding-related data, the grinder is used to grind the quartz wafer to be ground to obtain the ground quartz wafer, the circle counting module is used to count the number of grinding circles of the grinder, the cleaning and drying module is used to clean and dry the ground quartz wafer to obtain the cleaned quartz wafer, the thickness measuring module is used to measure the thickness of the cleaned quartz wafer to obtain thickness data, the circle number calculation module is used to calculate according to the current thickness data, the preset thickness data and the thickness data before grinding to obtain the grinding instruction, the grinding rate and the number of circles to be ground, wherein the grinding instruction is used to control whether the grinder continues to grind.

2. The automatic grinding of quartz wafer according to claim 1, characterized in that: The thickness measurement module comprises: Micrometer submodule, average thickness calculation submodule and data transmission submodule; The micrometer submodule is used to measure the cleaned quartz wafer using a digital micrometer to obtain a measurement data set, the average thickness calculation submodule is used to perform average numerical calculation on the measurement data set to obtain thickness data, and the sending submodule is used to transmit the thickness data to the microprocessor module.

3. The automatic grinding of quartz wafer according to claim 1, characterized in that: The calculation expression of the thickness data is: in, is the thickness data, x is the number of samples extracted from the quartz wafer to be ground, D x The data is concentrated measurement data.

4. The automatic grinding of quartz wafer according to claim 1, characterized in that: The calculation expression of grinding rate is: Where α is the grinding rate, To measure the average thickness of the quartz wafer sample before pre-grinding, To measure the average thickness of the quartz wafer sample after pre-grinding, n0 is the number of pre-grinding turns.

5. The automatic grinding of quartz wafer according to claim 4, characterized in that: The calculation expression of the circle to be ground is: Among them, n left is the number of circles to be ground, This is the lower limit of the grinding target.

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