A device for improving target material magnetron sputtering thickness and uniformity

Abstract

The present invention relates to the technical field of magnetron sputtering coating, and specifically to a device for improving the thickness and uniformity of target material magnetron sputtering; the device comprises a vacuum chamber and a connecting protective chamber, the connecting protective chamber is fixedly connected to the top of the vacuum chamber; a rotating disk is rotatably connected in the vacuum chamber, and a first rotating mechanism cooperating with the rotating disk is provided in the vacuum chamber; a plurality of fixed control blocks are fixedly connected to the rotating disk, each of the fixed control blocks is provided with a substrate, and each of the fixed control blocks is provided with an angle adjustment mechanism cooperating with the corresponding substrate; a target material fixing disk is provided in the vacuum chamber, the target material fixing disk is located above one of the substrates and concentrically corresponds to it; a first lifting mechanism cooperating with the target material fixing disk is provided in the connecting protective chamber.

Description

Technical Field

[0001] The invention relates to the technical field of magnetron sputtering coating, in particular to a device for improving the thickness and uniformity of target material magnetron sputtering. Background Art

[0002] Magnetron sputtering coating technology is increasingly used in the vacuum coating industry due to its two major advantages of high speed and low temperature, and has become one of the most important technologies in industrial coating production. The main working principle of magnetron sputtering coating equipment is to use the glow discharge process of gas to generate positive ions (usually argon ions when the reaction gas is argon). These positive ions bombard the surface of the cathode target with very high energy under the acceleration of the electric field, causing the target to sputter. The generated sputtered particles (atoms or molecules) detach from the cathode and deposit on the anode substrate to form a thin film, thus completing the coating process.

[0003] The magnetron coating technology in the prior art has problems with coating thickness and uniformity during the coating process because the molecular paths after bombardment are divergent, resulting in unqualified products; on the other hand, the coating thickness and uniformity are unqualified due to the flatness of the target material and the substrate; in order to solve this technical problem, the prior art often uses a support plate to support the substrate. This process is not only time-consuming and labor-intensive, but also requires different support plates to support different substrates, which is time-consuming and labor-intensive, and there is also the problem of troublesome target material installation; in addition, the magnetron sputtering coating technology in the prior art can only coat a single substrate, and the coating efficiency is low. Therefore, there is an urgent need for a device to improve the target material magnetron sputtering thickness and uniformity method to solve the current problem. Summary of the Invention

[0004] To solve the above problems, the present invention proposes a device for improving the thickness and uniformity of target materials during magnetron sputtering, which effectively solves the problem of insufficient coating thickness and uniformity in the magnetron sputtering coating process in the prior art; it also solves the problem of insufficient coating thickness and uniformity caused by the flatness of the target material or substrate; it also enables multiple substrates to be magnetron sputtered at the same time, greatly improving the coating efficiency.

[0005] In order to solve the above problems, the present invention proposes the following technical solutions: a device for improving the thickness and uniformity of target material magnetron sputtering; comprising a vacuum chamber and a connecting protective chamber, the connecting protective chamber is fixedly connected to the top of the vacuum chamber; a rotating disk is rotatably connected in the vacuum chamber, and a first rotating mechanism cooperating with the rotating disk is provided in the vacuum chamber; a plurality of fixed control blocks are fixedly connected to the rotating disk, each of the fixed control blocks is provided with a substrate, and each of the fixed control blocks is provided with an angle adjustment mechanism cooperating with the corresponding substrate; a target material fixing disk is provided in the vacuum chamber, the target material fixing disk is located above one of the substrates and concentrically corresponds to it; a matching target material mounting groove and a sputtering chamber are provided in the target material fixing disk; a pair of target material positioning blocks cooperating with the target material mounting groove are slidably connected to the target material fixing disk, and a first positioning mechanism cooperating with the target material fixing disk is provided in the target material positioning block; a first lifting mechanism cooperating with the target material fixing disk is provided in the connecting protective chamber;

[0006] The first positioning mechanism includes a positioning column, a first sliding disk and a movable pull rod that are slidably connected to the target material fixing plate. The positioning column, the first sliding disk and the movable pull rod are all coaxially fixed, and the positioning column and the movable pull rod are respectively located on both sides of the first sliding disk; a return spring is connected to the outer sleeve of the movable pull rod, one end of the return spring is fixed to the first sliding disk, and the other end of the return spring is fixed to the target material positioning block; an arc groove that cooperates with the target material positioning block is provided on the target material fixing plate; a positioning hole that cooperates with the positioning column is provided on the target material fixing plate.

[0007] Furthermore, the angle adjustment mechanism includes a plurality of first coaxial gears that are coaxially rotatably connected in the fixed control block, a plurality of second driving gears are rotatably connected in the fixed control block, and the second driving gears are respectively engaged with the corresponding first coaxial gears; a first right-angle connecting rod, a second right-angle connecting rod and a third right-angle connecting rod are rotatably connected on the fixed control block, and the first right-angle connecting rod, the second right-angle connecting rod and the third right-angle connecting rod are respectively coaxially fixed with the corresponding first coaxial gears; a curved connecting rod is rotatably connected to the first right-angle connecting rod, the second right-angle connecting rod and the third right-angle connecting rod, and a connecting and fixing block is coaxially fixed under the base plate, and the curved connecting rods are all rotatably connected to the connecting and fixing block.

[0008] Furthermore, the first lifting mechanism includes a first driving gear and a first internal gear connected for rotation in the protective cavity, and the first internal gear is engaged with the first driving gear; a pair of first rotating pinions are connected for rotation in the protective cavity, and the first rotating pinions are engaged with the first internal gear, and the first rotating pinions are coaxially fixed with lifting studs, and a magnetic control controller and a fixed screw sleeve are connected for sliding movement in the protective cavity, and the magnetic control controller is fixed to the fixed screw sleeve; the lifting studs are screwed to the fixed screw sleeve; the lifting studs are symmetrically arranged on both sides of the magnetic control controller; and the bottom of the magnetic control controller is fixed to the target material fixing disk.

[0009] Furthermore, the target positioning blocks are all fixed with target limiting blocks; the target limiting blocks are all matched with the corresponding target mounting grooves; when the target limiting blocks on the same target fixing plate are fitted with the side of the target mounting groove, the angle between the centers of the target mounting grooves at the other ends of the two target limiting blocks is not greater than 180°.

[0010] Furthermore, the diameter of the sputtering chamber is not less than the diameter of the substrate.

[0011] Furthermore, the first rotating mechanism includes a first rotating worm and a first rotating worm wheel which are rotatably connected in the vacuum chamber, the first rotating worm wheel is meshed with the first rotating worm; the first rotating worm wheel is coaxially fixed to the rotating disk.

[0012] Furthermore, the fixed control blocks are all located at the edge of the rotating disk.

[0013] Compared with the prior art, the present invention has the following gain effects:

[0014] 1. The setting of the angle adjustment mechanism effectively solves the problem of insufficient coating thickness and uniformity caused by the flatness of the target material or substrate in the prior art.

[0015] 2. Under the action of the first rotating mechanism, the cooperation between multiple substrates and the target material fixing plate enables multiple substrates to be magnetron sputtered at the same time, greatly improving the coating efficiency.

[0016] 3. The setting that the diameter of the sputtering chamber is not less than the diameter of the substrate ensures that the bombarded linear running molecules can cover the entire substrate area and ensure the uniformity.

[0017] 4. The setting of the first lifting mechanism enables the target material to be lowered above the substrate during bombardment, effectively avoiding the atomic escape problem caused by sputtering of the target material, thereby ensuring the thickness and uniformity of the coating.

[0018] 5. The setting of the first positioning mechanism greatly facilitates the installation of the target. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional diagram of the present invention.

[0020] Figure 2 It is a three-dimensional diagram of the local structure of the present invention.

[0021] Figure 3 This is a cutaway view of the present invention.

[0022] Figure 4 This is a three-dimensional diagram of the angle adjustment mechanism of the present invention.

[0023] Figure 5 This is a three-dimensional diagram of the first rotating mechanism of the present invention.

[0024] Figure 6 This is a three-dimensional diagram of the first lifting mechanism of the present invention.

[0025] Figure 7 This is a partial cross-sectional view of the first positioning mechanism of the present invention.

[0026] Figure 8 It is a partial three-dimensional diagram of the first positioning mechanism of the present invention.

[0027] In the figure: 1. vacuum chamber, 2. connecting protection chamber, 3. magnetron controller, 4. fixing screw sleeve, 5. lifting stud, 6. first rotating pinion, 7. first internal gear, 8. first driving gear, 9. base plate, 10. fixed control block, 11. rotating disk, 12. first rotating worm gear, 13. first rotating worm, 14. connecting fixed block, 15. curved connecting rod, 16. first right-angle connecting rod, 17. second right-angle connecting rod, 18. third right-angle connecting rod, 19. first coaxial gear, 20. second driving gear, 21. target fixing disk, 22. target positioning block, 23. target limiting block, 24. positioning column, 25. first sliding disk, 26. return spring, 27. movable pull rod, 28. sputtering chamber. DETAILED DESCRIPTION

[0028] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0029] The following describes the specific embodiments of the present invention in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention and are not intended to limit the present invention.

[0030] Example 1

[0031] A device for improving the thickness and uniformity of target material magnetron sputtering; comprising a vacuum chamber 1 and a connecting protective chamber 2, the connecting protective chamber 2 being fixedly connected above the vacuum chamber 1; a rotating disk 11 is rotatably connected in the vacuum chamber 1, a plurality of fixed control blocks 10 are fixedly connected to the rotating disk 11, each of the fixed control blocks 10 is provided with a substrate 9, and each of the fixed control blocks 10 is provided with an angle adjustment mechanism that cooperates with the corresponding substrate 9; a target material fixing disk 21 is provided in the vacuum chamber 1, the target material fixing disk 21 is located above one of the substrates 9 and concentrically corresponds thereto; a first lifting mechanism that cooperates with the target material fixing disk 21 is provided in the connecting protective chamber 2; the diameter of the sputtering chamber 28 is not less than the diameter of the substrate 9.

[0032] The angle adjustment mechanism includes a plurality of first coaxial gears 19 coaxially connected in rotation within the fixed control block 10, a plurality of second driving gears 20 rotatably connected within the fixed control block 10, and the second driving gears 20 are respectively engaged with the corresponding first coaxial gears 19; a first right-angle link 16, a second right-angle link 17 and a third right-angle link 18 are rotatably connected to the fixed control block 10, and the first right-angle link 16, the second right-angle link 17 and the third right-angle link 18 are respectively coaxially fixed to the corresponding first coaxial gears 19; a curved link 15 is rotatably connected to the first right-angle link 16, the second right-angle link 17 and the third right-angle link 18, and a connecting and fixing block 14 is coaxially fixed below the base plate 9, and the curved links 15 are all rotatably connected to the connecting and fixing block 14.

[0033] The first lifting mechanism includes a first driving gear 8 and a first internal gear 7 which are connected for rotation in the connecting protective chamber 2, and the first internal gear 7 is engaged with the first driving gear 8; a pair of first rotating pinions 6 are connected for rotation in the connecting protective chamber 2, and the first rotating pinions 6 are engaged with the first internal gear 7, and the first rotating pinions 6 are coaxially fixed with a lifting stud 5, and a magnetron controller 3 and a fixed screw sleeve 4 are slidingly connected in the connecting protective chamber 2, and the magnetron controller 3 is fixed to the fixed screw sleeve 4; the lifting studs 5 are screwed to the fixed screw sleeve 4; the lifting studs 5 are symmetrically arranged on both sides of the magnetron controller 3; and the lower part of the magnetron controller 3 is fixed to the target material fixing plate 21.

[0034] The first positioning mechanism includes a positioning column 24, a first sliding plate 25 and a movable pull rod 27 slidably connected on the target material fixing plate 21. The positioning column 24, the first sliding plate 25 and the movable pull rod 27 are all coaxially fixed, and the positioning column 24 and the movable pull rod 27 are respectively located on both sides of the first sliding plate 25; a return spring 26 is connected to the outer sleeve of the movable pull rod 27, one end of the return spring 26 is fixed to the first sliding plate 25, and the other end of the return spring 26 is fixed to the target material positioning block 22; an arc-shaped sliding groove is provided on the target material fixing plate 21 to cooperate with the target material positioning block 22; a positioning hole is provided on the target material fixing plate 21 to cooperate with the positioning column 24; a target material limiting block 23 is fixed to the target material positioning block 22; the target material limiting block 23 is matched with the corresponding target material mounting groove; when the target material limiting block 23 on the same target material fixing plate 21 is in contact with the side of the target material mounting groove, the angle between the center points of the target material mounting grooves at the other ends of the two target material limiting blocks 23 is not greater than 180°.

[0035] like Figure 1 、 2, 3, 4 and 6: When magnetron sputtering coating is required, the staff can first adjust the angle of the substrate on the substrate 9 through the angle adjustment mechanism. During this process, the corresponding motor drives the corresponding second driving gear 20 and the first coaxial gear 19 to rotate. The rotation of the first coaxial gear 19 will drive the corresponding first right-angle connecting rod 16, the second right-angle connecting rod 17 or the third right-angle connecting rod 18 to move, thereby adjusting the position of the substrate 9 and the connecting and fixing block 14; so that the substrate to be coated corresponds to the target material; then the target is adjusted by the first lifting mechanism. The height of the target material fixing plate 21 is adjusted. During this process, the motor drives the first rotating pinion 6 to rotate simultaneously through the first driving gear 8 and the first internal gear 7. The rotation of the first rotating pinion 6 can drive the magnetron controller 3 and the fixed screw sleeve 4 to slide through the lifting stud 5. The sliding of the magnetron controller 3 can drive the height of the target material fixing plate 21 and the target material to be adjusted. At the same time, the diameter of the sputtering chamber 28 is not less than the diameter of the substrate 9. This ensures that the bombarded linear running molecules can cover the entire substrate area, ensures the thickness and uniformity of the coating, and also greatly improves the sputtering efficiency.

[0036] like Figure 7 and 8 As shown, when the target material needs to be installed or replaced, the target material positioning block 22 can be slid to a position that fits the target material installation groove, and then the target material is placed in the target material installation groove. After the target material is installed in place, the target material positioning block 22 can be rotated. The cooperation between the target material positioning block 22 and the target material installation groove in the target material fixing plate 21 ensures the positioning of the target material. The angle between the target material installation groove center at the other end of the two target material limiting blocks 23 is not greater than 180 degrees, which ensures that the target material can be smoothly installed in the target material installation groove; in this process, the target material limiting block 23 and the target material installation groove always cooperate At the same time, due to the setting of the positioning holes, the positioning of the target positioning block 22 can be achieved; when the target positioning block 22 needs to be slid, the movable pull rod 27 can be pulled first to drive the first sliding disk 25 and the positioning column 24 to slide, and the cooperation between the positioning column 24 and the positioning hole is released. When the movable pull rod 27 is released, the return spring 26 will give a certain pressure to the first sliding disk 25. When the positioning column 24 corresponds to the positioning hole, its cooperation can be achieved, thereby achieving the positioning of the target positioning block 22; this not only greatly facilitates the installation of the target, but also ensures the stability of the target after installation.

[0037] Example 2

[0038] A device for improving the thickness and uniformity of target material magnetron sputtering; comprising a vacuum chamber 1 and a connecting protective chamber 2, the connecting protective chamber 2 being fixedly connected above the vacuum chamber 1; a rotating disk 11 is rotatably connected in the vacuum chamber 1, and a first rotating mechanism cooperating with the rotating disk 11 is provided in the vacuum chamber 1; a plurality of fixed control blocks 10 are fixedly connected to the rotating disk 11, each of the fixed control blocks 10 is provided with a substrate 9, and each of the fixed control blocks 10 is provided with an angle adjustment mechanism cooperating with the corresponding substrate 9; a target material fixing disk 21 is provided in the vacuum chamber 1, and the target material fixing disk 21 is located above one of the substrates 9 and concentrically corresponds thereto; a first lifting mechanism cooperating with the target material fixing disk 21 is provided in the connecting protective chamber 2.

[0039] The angle adjustment mechanism includes a plurality of first coaxial gears 19 coaxially connected in rotation within the fixed control block 10, a plurality of second driving gears 20 rotatably connected within the fixed control block 10, and the second driving gears 20 are respectively engaged with the corresponding first coaxial gears 19; a first right-angle link 16, a second right-angle link 17 and a third right-angle link 18 are rotatably connected to the fixed control block 10, and the first right-angle link 16, the second right-angle link 17 and the third right-angle link 18 are respectively coaxially fixed to the corresponding first coaxial gears 19; a curved link 15 is rotatably connected to the first right-angle link 16, the second right-angle link 17 and the third right-angle link 18, and a connecting and fixing block 14 is coaxially fixed below the base plate 9, and the curved links 15 are all rotatably connected to the connecting and fixing block 14.

[0040] The first lifting mechanism includes a first driving gear 8 and a first internal gear 7 which are connected for rotation in the connecting protective chamber 2, and the first internal gear 7 is engaged with the first driving gear 8; a pair of first rotating pinions 6 are connected for rotation in the connecting protective chamber 2, and the first rotating pinions 6 are engaged with the first internal gear 7, and the first rotating pinions 6 are coaxially fixed with a lifting stud 5, and a magnetron controller 3 and a fixed screw sleeve 4 are slidingly connected in the connecting protective chamber 2, and the magnetron controller 3 is fixed to the fixed screw sleeve 4; the lifting studs 5 are screwed to the fixed screw sleeve 4; the lifting studs 5 are symmetrically arranged on both sides of the magnetron controller 3; and the lower part of the magnetron controller 3 is fixed to the target material fixing plate 21.

[0041] The diameter of the sputtering chamber 28 is not smaller than the diameter of the substrate 9 .

[0042] The first rotating mechanism includes a first rotating worm 13 and a first rotating worm wheel 12 rotatably connected in the vacuum chamber 1 , the first rotating worm wheel 12 is engaged with the first rotating worm 13 ; the first rotating worm wheel 12 is coaxially fixed to the rotating disk 11 .

[0043] The fixed control blocks 10 are all located at the edge of the rotating disk 11 .

[0044] like Figure 1 、 2, 3, 4, 5 and 6: On the basis of Example 1, when the coating of the substrate corresponding to the target material is completed, the rotating disk 11 can be driven to rotate by the first rotating mechanism, and the rotation of the rotating disk 11 can drive the substrate 9 to rotate through the fixed control block 10 and the connecting fixed block 14, thereby realizing the rotation of the substrate on the substrate 9. During this process, the motor drives the first rotating worm gear 12 and the rotating disk 11 to rotate through the first rotating worm 13; when the next substrate corresponds to the target material, the substrate can be coated, thereby completing the corresponding coating operation; it is achieved that multiple substrates can be magnetron sputtered at the same time, which greatly improves the coating efficiency.

[0045] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0046] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

Claims

1. A device for improving the thickness and uniformity of target material during magnetron sputtering; characterized by: The invention comprises a vacuum cavity (1) and a connecting protective cavity (2), wherein the connecting protective cavity (2) is fixedly connected to the upper part of the vacuum cavity (1); a rotating disk (11) is rotatably connected in the vacuum cavity (1), and a first rotating mechanism cooperating with the rotating disk (11) is provided in the vacuum cavity (1); a plurality of fixed control blocks (10) are fixedly connected to the rotating disk (11), each of the fixed control blocks (10) is provided with a substrate (9), and each of the fixed control blocks (10) is provided with an angle adjustment mechanism cooperating with a corresponding substrate (9); A target material fixing plate (21) is provided, and the target material fixing plate (21) is located above one of the substrates (9) and concentrically corresponds thereto; a target material mounting groove and a sputtering cavity (28) are provided in the target material fixing plate (21); a pair of target material positioning blocks (22) that are compatible with the target material mounting grooves are slidably connected to the target material fixing plate (21); a first positioning mechanism that is compatible with the target material fixing plate (21) is provided in the target material positioning blocks (22); and a first lifting mechanism that is compatible with the target material fixing plate (21) is provided in the connecting protection cavity (2); The first positioning mechanism comprises a positioning column (24), a first sliding disk (25) and a movable pull rod (27) which are slidably connected to the target material fixing disk (21); the positioning column (24), the first sliding disk (25) and the movable pull rod (27) are all coaxially fixed, and the positioning column (24) and the movable pull rod (27) are respectively located on both sides of the first sliding disk (25); a return spring (26) is connected to the outer shell of the movable pull rod (27); one end of the return spring (26) is fixed to the first sliding disk (25), and the other end of the return spring (26) is fixed to the target material positioning block (22); an arc groove is provided on the target material fixing disk (21) and matches the target material positioning block (22); and a positioning hole is provided on the target material fixing disk (21) and matches the positioning column (24).

2. The device for improving target material magnetron sputtering thickness and uniformity according to claim 1, characterized in that: The angle adjustment mechanism comprises a plurality of first coaxial gears (19) coaxially rotatably connected in a fixed control block (10); a plurality of second driving gears (20) rotatably connected in the fixed control block (10); the second driving gears (20) respectively meshing with the corresponding first coaxial gears (19); a first right-angle connecting rod (16), a second right-angle connecting rod (17) and a third right-angle connecting rod (18) rotatably connected to the fixed control block (10); the first right-angle connecting rod (16), the second right-angle connecting rod (17) and the third right-angle connecting rod (18) respectively coaxially fixed to the corresponding first coaxial gears (19); a curved connecting rod (15) rotatably connected to the first right-angle connecting rod (16), the second right-angle connecting rod (17) and the third right-angle connecting rod (18); a connecting fixed block (14) coaxially fixedly connected below the base plate (9); and the curved connecting rods (15) are all rotatably connected to the connecting fixed block (14).

3. The device for improving target material magnetron sputtering thickness and uniformity according to claim 1, characterized in that: The first lifting mechanism comprises a first driving gear (8) and a first internal gear (7) rotatably connected in the connecting protective cavity (2), the first internal gear (7) meshing with the first driving gear (8); a pair of first rotating pinions (6) rotatably connected in the connecting protective cavity (2), the first rotating pinions (6) meshing with the first internal gear (7), the first rotating pinions (6) coaxially fixedly connected with a lifting stud (5), a magnetron controller (3) and a fixed screw sleeve (4) slidably connected in the connecting protective cavity (2), the magnetron controller (3) and the fixed screw sleeve (4) being fixedly connected; the lifting studs (5) are screwed with the fixed screw sleeve (4); the lifting studs (5) are symmetrically arranged on both sides of the magnetron controller (3); and the lower portion of the magnetron controller (3) is fixedly connected to a target material fixing plate (21).

4. The device for improving target material magnetron sputtering thickness and uniformity according to claim 1, characterized in that: The target positioning blocks (22) are all fixedly connected with target limiting blocks (23); the target limiting blocks (23) are all matched with corresponding target mounting grooves; when the target limiting blocks (23) on the same target fixing plate (21) are fitted with the side of the target mounting groove, the angle between the target mounting groove centers at the other ends of the two target limiting blocks (23) is no greater than 180°.

5. The device for improving target material magnetron sputtering thickness and uniformity according to claim 1, characterized in that: The diameter of the sputtering chamber (28) is not less than the diameter of the substrate (9).

6. The device for improving target material magnetron sputtering thickness and uniformity according to claim 1, characterized in that: The first rotating mechanism comprises a first rotating worm (13) and a first rotating worm wheel (12) rotatably connected in the vacuum chamber (1), the first rotating worm wheel (12) being meshed with the first rotating worm (13); and the first rotating worm wheel (12) is coaxially fixedly connected to the rotating disk (11).

7. The device for improving target material magnetron sputtering thickness and uniformity according to claim 1, characterized in that: The fixed control blocks (10) are all located at the edge of the rotating disk (11).

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