Integrated circuit product testing method and device

Abstract

The present invention belongs to the technical field of integrated circuit products, and in particular, relates to an integrated circuit product testing method and device to solve the technical problem that there is no way to judge whether the integrated circuit product package has defects such as internal cavities, bubbles, slag inclusions and tiny gaps. The method and device include an ultrasonic transmitting module, an ultrasonic receiving module, a signal processing module, an imaging module and a computer processing module. The ultrasonic transmitting module and the ultrasonic receiving module are installed in a body frame. The computer processing module performs data processing according to the image information sent, judges whether the integrated circuit product package has defects such as internal cavities, bubbles, slag inclusions and tiny gaps, judges whether the product is qualified, and numbers unqualified integrated circuit products, and manually performs secondary inspection on the numbers of unqualified integrated circuit products.

Description

Technical Field

[0001] The present invention belongs to the technical field of integrated circuit products, and in particular relates to an integrated circuit product testing method and device. Background Art

[0002] Patent application number CN202411414632.2 discloses a multi-chip positioning and packaging device for integrated circuits and a packaging method thereof, including a processing platform, a transfer mechanism is provided on the top of the processing platform; a multi-chip stacking mechanism is transmission-connected to the output end of the transfer mechanism; a substrate fixing mechanism is provided at the top center of the processing platform; a glue recovery box is provided at the edge of one side of the top of the processing platform; a chip bonding mechanism is provided on one side wall of the transfer mechanism; a gold wire bonding mechanism is provided on the side wall of the transfer mechanism away from the chip bonding mechanism; the multi-chip stacking mechanism includes a first electric turntable; the bottom of the first electric turntable is transmission-connected to a mounting frame; a scanning camera is provided at the bottom of the mounting frame; a vacuum adsorption component is provided in the mounting frame, but the disadvantage of this technical solution is that there is no way to determine whether the integrated circuit product package has defects such as internal voids, bubbles, slag inclusions and tiny gaps. Summary of the invention

[0003] The purpose of the invention is to provide an integrated circuit product testing method and device to solve the technical problem that there is no way to determine whether the integrated circuit product package has defects such as internal voids, bubbles, slag inclusions and tiny gaps.

[0004] To achieve the above-mentioned purpose, the specific technical scheme of an integrated circuit product testing method and device invented is as follows:

[0005] An integrated circuit product testing device comprises a body assembly, wherein the body assembly comprises a body frame, a load-bearing detection platform, a sealing end cover, a vacuum pump and a detection device, wherein the load-bearing detection platform is installed in the body frame, the sealing end cover is rotatably installed on the body frame, the vacuum pump and the detection device are installed on the body frame, and the detection device comprises an ultrasonic transmitting module, an ultrasonic receiving module, a signal processing module, an imaging module and a computer processing module, wherein the ultrasonic transmitting module and the ultrasonic receiving module are installed in the body frame;

[0006] Furthermore, the ultrasonic transmitting module is used to transmit high-frequency ultrasonic signals, the common frequency of high-frequency ultrasonic waves is 2-14 MHz, and the high-frequency ultrasonic waves are propagated inside the integrated circuit product;

[0007] Furthermore, the ultrasonic receiving module is used to receive ultrasonic signals reflected back from the integrated circuit product;

[0008] Furthermore, the signal processing module is used to convert the ultrasonic signal received by the ultrasonic receiving module from a sound wave signal into an electrical signal, and send the electrical signal to the imaging module;

[0009] Further, the imaging module is used to form a corresponding detection waveform from the electrical signal converted by the signal processing module, and to generate a scanned image according to the corresponding detection waveform, and to send the scanned image information to the computer processing module;

[0010] Furthermore, the computer processing module performs data processing based on the image information sent, determines whether the integrated circuit product package has defects such as internal voids, bubbles, slag inclusions and tiny gaps, determines whether the product is qualified, and numbers the unqualified integrated circuit products, and manually performs a second inspection on the numbers of the unqualified integrated circuit products.

[0011] Furthermore, the ultrasonic emission module is placed directly above the load-bearing detection platform.

[0012] Furthermore, the vacuum pump creates a vacuum inside the machine frame.

[0013] Furthermore, when the integrated circuit product is fixed on the carrying and testing platform, the integrated circuit product is placed in the liquid coupling agent.

[0014] Furthermore, the liquid coupling agent is deionized water.

[0015] Furthermore, the ultrasonic transmitting module model is HTC300-S / SP2.

[0016] Furthermore, the ultrasonic receiving module model is HTC4000-S / SP2.

[0017] Furthermore, the imaging module model is F-ii910.

[0018] Further, a method for testing an integrated circuit product comprises the following steps:

[0019] S1: Input the workpiece number information and set the parameters of the ultrasonic transmitting module;

[0020] S2: focusing the ultrasonic transmitting module and the integrated circuit product, and then scanning the integrated circuit product and the packaging of the integrated circuit product through the ultrasonic transmitting module;

[0021] S3: Receive the ultrasonic signal reflected by the integrated circuit product through the ultrasonic receiving module;

[0022] S4: converting the ultrasonic signal into an electrical signal through a signal processing module;

[0023] S5: converting the electrical signal into a corresponding detection waveform through an imaging module, and generating a scan image through the corresponding detection waveform;

[0024] S6: Processing the scanned image data obtained by the computer processing module to determine whether the integrated circuit product packaging is qualified;

[0025] S7: If the integrated circuit product is qualified, the next integrated circuit product is tested;

[0026] S8: If it fails, obtain the number of the integrated circuit product in S1, and manually conduct a second inspection on the integrated circuit product with the number.

[0027] Furthermore, the parameters of the ultrasonic transmitting module are specifically the scanning range of the ultrasonic wave and the thickness of the integrated circuit product.

[0028] Further, the method for judging whether the integrated circuit product packaging is qualified is:

[0029] S6.1: Obtain the inner boundary of the integrated circuit product package by scanning the image data, and the inner boundary area is S 内边界 , unit is mm 2 ;

[0030] S6.2: Obtain the outer boundary of the integrated circuit product package by scanning the image data, and the outer boundary area is S 外边界 , unit is mm 2 ;

[0031] S6.3: Determine the effective package area S 有效 =S 外边界 -S 内边界 ;

[0032] S6.4: Define unit pixel position = 1mm 2 , and divide the effective package area S equally according to the unit pixel position 有效 , and determine the total number of unit pixels as A, the unit is: pieces;

[0033] S6.5: Define the unit pixel with gray value ≤ 30 as valid pixel, define the unit pixel with gray value > 30 as invalid pixel, and count the number of valid pixel as A. 有效 , the unit is: piece;

[0034] S6.6: Determine the effective pixel ratio n, n = A 有效 / A;

[0035] S6.7: The positioning pass rate is m. When n is greater than or equal to m, it is qualified. When n is less than m, it is unqualified.

[0036] Furthermore, when the invalid point pixels are clustered in a large area and concentrated manner, there are internal voids or bubbles in the integrated circuit product package; when the invalid point pixels are clustered in a linear and concentrated manner, there are internal tiny gaps in the integrated circuit product package; when the valid point pixels are clustered in a large area and concentrated manner, and the average grayscale value of the valid point pixels is ≤10, there are internal slag inclusions in the integrated circuit product package.

[0037] The present invention uses an ultrasonic transmitting module to transmit high-frequency ultrasonic signals, the common frequency of which is 2-14 MHz, and the high-frequency ultrasonic signals are propagated inside the integrated circuit product; an ultrasonic receiving module is used to receive ultrasonic signals reflected by the integrated circuit product; a signal processing module is used to convert the ultrasonic signals received by the ultrasonic receiving module from sound wave signals into electrical signals, and send the electrical signals to the imaging module;

[0038] The imaging module is used to form a corresponding detection waveform from the electrical signal converted by the signal processing module, and generate a scanned image based on the corresponding detection waveform, and send the scanned image information to the computer processing module; the computer processing module performs data processing based on the image information sent, determines whether the integrated circuit product package has internal defects such as internal voids, bubbles, slag inclusions and tiny gaps, determines whether the product is qualified, and numbers the unqualified integrated circuit products, and manually performs secondary inspection on the numbers of the unqualified integrated circuit products. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a schematic diagram of the entire structure of the invention;

[0040] Figure 2 A flowchart of the invented integrated circuit product testing method;

[0041] Figure 3 The present invention is a flow chart of a method for determining whether an integrated circuit product package is qualified. DETAILED DESCRIPTION

[0042] The technical solution of the invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the invention, not all of them. Based on the embodiments of the invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the invention.

[0043] In the description of the invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0044] Example 1

[0045] like Figure 1 As shown, an integrated circuit product testing device includes a body assembly, the body assembly includes a body frame, a load-bearing detection platform, a sealing end cover, a vacuum pump and a detection device, the body frame is installed with the load-bearing detection platform, the body frame is rotatably installed with the sealing end cover, the body frame is installed with the vacuum pump and the detection device, the detection device includes an ultrasonic transmitting module, an ultrasonic receiving module, a signal processing module, an imaging module and a computer processing module, and the ultrasonic transmitting module and the ultrasonic receiving module are installed in the body frame;

[0046] The ultrasonic transmitting module is used to transmit high-frequency ultrasonic signals, the common frequency of which is 2-14 MHz, and the high-frequency ultrasonic signals are propagated inside the integrated circuit product;

[0047] Wherein, the ultrasonic receiving module is used to receive the ultrasonic signal reflected back by the integrated circuit product;

[0048] The signal processing module is used to convert the ultrasonic signal received by the ultrasonic receiving module from a sound wave signal into an electrical signal, and send the electrical signal to the imaging module;

[0049] The imaging module is used to form a corresponding detection waveform from the electrical signal converted by the signal processing module, generate a scanned image according to the corresponding waveform, and send the scanned image information to the computer processing module;

[0050] The computer processing module processes data according to the image information sent, determines whether the integrated circuit product package has internal voids, bubbles, slag inclusions, tiny gaps and other defects, determines whether the product is qualified, and numbers the unqualified integrated circuit products, and manually performs secondary inspection on the numbers of the unqualified integrated circuit products;

[0051] The computer processing module includes a CPU, a data storage device, an input / output terminal and a power supply. The power supply supplies power to the computer processing module. The input / output terminal communicates with the CPU in a two-way manner. The CPU communicates with the data storage device in a one-way manner. The image information sent is sent to the CPU through the input / output terminal. The CPU determines whether there are defects such as internal voids, bubbles, slag inclusions and tiny gaps in the integrated circuit product package based on the data, and sends the numbering information to the display through the input / output terminal for display, and stores the integrated circuit product package status and numbering information through the data storage device.

[0052] Example 2

[0053] Wherein, the ultrasonic emission module is placed directly above the load-bearing detection platform.

[0054] The vacuum pump creates a vacuum inside the machine frame.

[0055] Wherein, when the integrated circuit product is fixed on the carrying and testing platform, the integrated circuit product is placed in the liquid coupling agent.

[0056] Wherein, the liquid coupling agent is deionized water.

[0057] Wherein, the ultrasonic transmitting module model is HTC300-S / SP2.

[0058] Wherein, the ultrasonic receiving module model is HTC4000-S / SP2.

[0059] The imaging module model is F-ii910.

[0060] Example 3

[0061] like Figure 2 As shown, a method for testing an integrated circuit product comprises the following steps:

[0062] S1: Input the workpiece number information and set the parameters of the ultrasonic transmitting module;

[0063] S2: focusing the ultrasonic transmitting module and the integrated circuit product, and then scanning the integrated circuit product and the packaging of the integrated circuit product through the ultrasonic transmitting module;

[0064] S3: Receive the ultrasonic signal reflected by the integrated circuit product through the ultrasonic receiving module;

[0065] S4: converting the ultrasonic signal into an electrical signal through a signal processing module;

[0066] S5: converting the electrical signal into a corresponding detection waveform through an imaging module, and generating a scan image through the corresponding detection waveform;

[0067] S6: Processing the scanned image data obtained by the computer processing module to determine whether the integrated circuit product packaging is qualified;

[0068] S7: If the integrated circuit product is qualified, the next integrated circuit product is tested;

[0069] S8: If it fails, obtain the number of the integrated circuit product in S1, and manually conduct a second inspection on the integrated circuit product with the number.

[0070] The parameters of the ultrasonic transmitting module are specifically the scanning range of the ultrasonic wave and the thickness of the integrated circuit product.

[0071] Example 4

[0072] like Figure 3 As shown, the method for judging whether the integrated circuit product packaging is qualified is:

[0073] S6.1: Obtain the inner boundary of the integrated circuit product package by scanning the image data, and the inner boundary area is S 内边界 , unit is mm 2 ;

[0074] S6.2: Obtain the outer boundary of the integrated circuit product package by scanning the image data, and the outer boundary area is S 外边界 , unit is mm 2 ;

[0075] S6.3: Determine the effective package area S 有效 =S 外边界 -S 内边界 ;

[0076] S6.4: Define unit pixel position = 1mm 2 , and divide the effective package area S equally according to the unit pixel position 有效 , and determine the total number of unit pixels as A, the unit is: pieces;

[0077] S6.5: Define the unit pixel with gray value ≤ 30 as valid pixel, define the unit pixel with gray value > 30 as invalid pixel, and count the number of valid pixel as A. 有效 , the unit is: piece;

[0078] S6.6: Determine the effective pixel ratio n, n = A 有效 / A;

[0079] S6.7: The positioning pass rate is m. When n is greater than or equal to m, it is qualified. When n is less than m, it is unqualified.

[0080] Among them, when the invalid point pixels are clustered in a large area and concentrated manner, there are internal voids or bubbles in the integrated circuit product package; when the invalid point pixels are clustered in a linear and concentrated manner, there are tiny internal gaps in the integrated circuit product package; when the valid point pixels are clustered in a large area and concentrated manner, and the average grayscale value of the valid point pixels is ≤10, there are internal slag inclusions in the integrated circuit product package.

[0081] It is understood that the invention is described by some embodiments, and those skilled in the art are aware that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the invention. In addition, under the guidance of the invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the invention. Therefore, the invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the scope of the invention.

Claims

1. A method for testing an integrated circuit product, characterized in that: The steps are: S1: Input the workpiece number information and set the parameters of the ultrasonic transmitting module; S2: focusing the ultrasonic transmitting module and the integrated circuit product, and then scanning the integrated circuit product and the packaging of the integrated circuit product through the ultrasonic transmitting module; S3: Receive the ultrasonic signal reflected by the integrated circuit product through the ultrasonic receiving module; S4: converting the ultrasonic signal into an electrical signal through a signal processing module; S5: converting the electrical signal into a corresponding detection waveform through an imaging module, and generating a scan image through the corresponding detection waveform; S6: Processing the scanned image data obtained by the computer processing module to determine whether the integrated circuit product packaging is qualified; S7: If the integrated circuit product packaging is qualified, the next integrated circuit product is tested; S8: If it fails, obtain the number of the integrated circuit product in S1, and manually conduct a second test on the numbered integrated circuit product; The method for judging whether the integrated circuit product packaging is qualified is: S6.1: Obtain the inner boundary of the integrated circuit product package by scanning the image data, and the inner boundary area is S 内边界 , unit is mm 2 ; S6.2: Obtain the outer boundary of the integrated circuit product package by scanning the image data, and the outer boundary area is S 外边界 , unit is mm 2 ; S6.3: Determine the effective package area S 有效 =S 外边界 -S 内边界 ; S6.4: Define unit pixel position = 1mm 2 , and divide the effective package area S equally according to the unit pixel position 有效 , and determine the total number of unit pixels as A, the unit is: pieces; S6.5: Define the unit pixel with gray value ≤ 30 as valid pixel, define the unit pixel with gray value > 30 as invalid pixel, and count the number of valid pixel as A. 有效 , the unit is: piece; S6.6: Determine the effective pixel ratio n, n = A 有效 / A; S6.7: The positioning pass rate is m. When n is greater than or equal to m, it is qualified. When n is less than m, it is unqualified. When the invalid point pixels are clustered in a large area and concentrated manner, there are internal voids or bubbles in the integrated circuit product package; when the invalid point pixels are clustered in a linear and concentrated manner, there are tiny internal gaps in the integrated circuit product package; when the valid point pixels are clustered in a large area and concentrated manner, and the average grayscale value of the valid point pixels is ≤10, there are internal slag inclusions in the integrated circuit product package.

2. The integrated circuit product testing method according to claim 1, characterized in that: The parameters of the ultrasonic emission module are specifically the scanning range of the ultrasonic wave and the thickness of the integrated circuit product.

3. An integrated circuit product testing device applicable to the integrated circuit product testing method according to any one of claims 1 to 2, comprising a body assembly, the body assembly comprising a body frame, a load-bearing detection platform, a sealing end cover, a vacuum pump and a detection device, the body frame is provided with a load-bearing detection platform, the body frame is rotatably provided with a sealing end cover, the body frame is provided with a vacuum pump and a detection device, and is characterized in that: The detection device includes an ultrasonic transmitting module, an ultrasonic receiving module, a signal processing module, an imaging module and a computer processing module, and the ultrasonic transmitting module and the ultrasonic receiving module are installed in the body frame; The ultrasonic transmitting module is used to transmit high-frequency ultrasonic signals. The common frequency of high-frequency ultrasonic waves is 2-14 MHz. The high-frequency ultrasonic waves are propagated inside the integrated circuit product. The ultrasonic receiving module is used to receive the ultrasonic signal reflected by the integrated circuit product; The signal processing module is used to convert the ultrasonic signal received by the ultrasonic receiving module from a sound wave signal into an electrical signal, and send the electrical signal to the imaging module; The imaging module is used to form a corresponding detection waveform from the electrical signal converted by the signal processing module, generate a scanned image according to the corresponding detection waveform, and send the scanned image information to the computer processing module; The computer processing module performs data processing based on the image information sent, determines whether the integrated circuit product package has defects such as internal voids, bubbles, slag inclusions and tiny gaps, determines whether the product is qualified, and numbers unqualified integrated circuit products, and manually performs secondary inspection on the numbers of unqualified integrated circuit products.

4. The integrated circuit product testing device according to claim 3, characterized in that: When the integrated circuit product is fixed on the carrying and testing platform, the integrated circuit product is placed in the liquid coupling agent.

5. The integrated circuit product testing device according to claim 4, characterized in that: The liquid coupling agent is deionized water.

6. The integrated circuit product testing device according to claim 3, characterized in that: The ultrasonic transmitting module model is HTC300-S / SP2.

7. The integrated circuit product testing device according to claim 3, characterized in that: The ultrasonic receiving module model is HTC4000-S / SP2.

8. The integrated circuit product testing device according to claim 3, characterized in that: The imaging module model is F-ii910.

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