Touch panel assembly

Abstract

A touchpad assembly comprises a cover plate, a touch circuit board, a bearing mechanism, a magnet group and a plurality of shock isolators. The touch control circuit board is arranged below the cover plate and comprises a first touch control electrode layer, a second touch control electrode layer and a single-layer embedded coil layer arranged away from the cover plate. The bearing mechanism is provided with a central accommodating part. The magnet group is arranged in the central accommodating part and forms a vibration module with the single-layer embedded coil layer. A pressing gap is formed between the touch control circuit board and the magnet set. The shock insulation body is arranged between the touch control circuit board and the bearing mechanism. The maximum downward pressing deformation of pressing on the central area of the cover plate ranges from 0.3 mm to 0.7 mm. The vibration module is configured to generate a vibration acceleration ranging from 2G to 15G. The total thickness of the touchpad assembly is between 2.5 mm and 3.5 mm. The pressing gap is separated by the single embedded coil layer and the magnet group, and the single embedded coil layer and the magnet group jointly form the vibration module, so that the total thickness of the touchpad assembly can be effectively reduced.

Description

Technical Field

[0001] The present disclosure relates to a touch panel assembly. Background Art

[0002] The current development trend of touch panel components is from simple touch function to the integration of touch, force sensing and tactile feedback. A conventional touch panel component is to set the force sensor on an elastic member (such as a metal bracket) and fix the elastic member to the touch circuit board, such as Chinese patent application publication No. 107025017B. However, this conventional technology has the disadvantages of a large number of components, a complex assembly process, a high overall cost and a large overall thickness.

[0003] Therefore, how to propose a touch panel assembly that can solve the above problems is one of the problems that the industry is eager to invest research and development resources to solve. Summary of the invention

[0004] In view of this, an object of the present disclosure is to provide a touch panel assembly that can solve the above problems.

[0005] In order to achieve the above-mentioned purpose, according to one embodiment of the present disclosure, a touch pad assembly includes a cover plate, a touch circuit board, a supporting mechanism, a magnet group and a plurality of seismic isolation bodies. The touch circuit board is arranged under the cover plate, and includes a first touch electrode layer, a second touch electrode layer and a single-layer embedded coil layer arranged away from the cover plate. The supporting mechanism has a central accommodating portion. The magnet group is arranged in the central accommodating portion, and constitutes a vibration module with the single-layer embedded coil layer. A pressing gap is formed between the touch circuit board and the magnet group. The seismic isolation body is arranged between the touch circuit board and the supporting mechanism. The maximum downward deformation of pressing in the central area of ​​the cover plate is between 0.3mm and 0.7mm. The vibration module is configured to generate a vibration acceleration between 2G and 15G. The total thickness of the touch pad assembly is between 2.5mm and 3.5mm.

[0006] In one or more embodiments of the present disclosure, the supporting mechanism includes a first supporting portion and a second supporting portion. The first supporting portion has a through hole. The second supporting portion covers an opening of the through hole away from the touch circuit board. The central accommodating portion is formed by the through hole and the second supporting portion.

[0007] In one or more embodiments of the present disclosure, the first supporting portion has a first thickness, and the second supporting portion has a second thickness, and the first thickness is greater than the second thickness.

[0008] In one or more embodiments of the present disclosure, the first thickness is between 0.45 mm and 0.55 mm.

[0009] In one or more embodiments of the present disclosure, the second thickness is between 0.25 mm and 0.35 mm.

[0010] In one or more embodiments of the present disclosure, the material of the second carrying portion includes silicon steel.

[0011] In one or more embodiments of the present disclosure, a critical upper limit value of the second thickness of the second supporting portion is less than or equal to 0.5 mm.

[0012] In one or more embodiments of the present disclosure, the vibration acceleration generated by the vibration module is between 3.5G and 15G.

[0013] In one or more embodiments of the present disclosure, the vibration acceleration generated by the vibration module is between 8G and 15G.

[0014] In one or more embodiments of the present disclosure, the height of the seismic isolation body is between 0.55 mm and 0.95 mm.

[0015] In one or more embodiments of the present disclosure, the non-contact bearing force between the single embedded coil layer and the magnet assembly is greater than 110 gf.

[0016] In one or more embodiments of the present disclosure, the number of metal layers included in the touch circuit board is no more than five.

[0017] In one or more embodiments of the present disclosure, the single-layer embedded coil layer includes two coil units. The touch circuit board further includes a shielding layer. The shielding layer is located between the second touch electrode layer and the single-layer embedded coil layer. The two coil units are electrically connected via the shielding layer.

[0018] In summary, in the touchpad assembly disclosed herein, the pressing gap is separated by a single-layer embedded coil layer disposed on the touch circuit board and a magnet group disposed on the carrier mechanism, and the two together constitute a vibration module, so that the total thickness of the touchpad assembly can be effectively reduced. By accommodating the magnet group in the central accommodating portion of the carrier mechanism, the total thickness of the touchpad assembly can be further reduced. By matching the range of the maximum downward deformation of the central area of ​​the cover plate with the range of the vibration acceleration generated by the vibration module, an excellent balance can be achieved between the thinning of the touchpad assembly and the vibration requirements. By using a silicon steel sheet with a critical upper limit thickness (i.e., less than or equal to 0.5 mm), it is possible to both control the thinning of the overall touchpad assembly thickness and simultaneously achieve an excellent vibration acceleration effect (i.e., the vibration module is configured to produce excellent vibration acceleration).

[0019] The above description is only used to illustrate the problem to be solved by the present disclosure, the technical means to solve the problem, and the effects produced, etc. The specific details of the present disclosure will be described in detail in the following implementation methods and related drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to make the above and other objects, features, advantages and embodiments of the present disclosure more clearly understood, the accompanying drawings are described as follows:

[0021] Figure 1 A schematic diagram illustrating an electronic device according to an embodiment of the present disclosure;

[0022] Figure 2 To illustrate Figure 1 A cross-sectional schematic diagram of a touch panel assembly in FIG.

[0023] Figure 3 A cross-sectional schematic diagram illustrating a touch panel assembly according to another embodiment of the present disclosure;

[0024] Figure 4 A cross-sectional schematic diagram illustrating a touch panel assembly according to another embodiment of the present disclosure;

[0025] Figure 5 A cross-sectional schematic diagram illustrating a touch panel assembly according to another embodiment of the present disclosure;

[0026] Fig. 6A A schematic diagram illustrating magnetic field lines of a magnet group according to an embodiment of the present disclosure;

[0027] Figure 6B A schematic diagram illustrating magnetic field lines of a magnet group disposed on a silicon steel sheet according to an embodiment of the present disclosure;

[0028] Figure 7 To illustrate Figure 2 A cross-sectional schematic diagram of a touch circuit board in FIG.

[0029] Figure 8 A top view of a touch panel assembly according to an embodiment of the present disclosure is shown;

[0030] Fig. 9 A top view of a touch panel assembly according to another embodiment of the present disclosure is shown;

[0031] Fig.10 A top view of a single-layer embedded coil layer and a magnet assembly according to an embodiment of the present disclosure is shown;

[0032] Fig.11 A top view of a single-layer embedded coil layer and a magnet assembly according to another embodiment of the present disclosure is shown;

[0033] Fig.12 A top view of a single-layer embedded coil layer and a magnet assembly according to another embodiment of the present disclosure is shown;

[0034] Fig.13 A partial top view of each layer of circuits on a touch circuit board according to an embodiment of the present disclosure is shown;

[0035] Fig.14AReveal the conversion calculation of vibration-sensing voltage and acceleration G value of DRV-ACC16-EVM model;

[0036] Fig. 14B The design of the TI three-axis measurement platform is revealed, in which the vibration sensing element is set in the rightmost measurement area for measurement;

[0037] Fig. 14C Reveal as a basis Fig.14A The calculation theory and its user manual are used for actual calculation.

[0038]

Explanation of symbols

[0039] 100: Electronic devices

[0040] 110:Host

[0041] 111,311,411: Shell

[0042] 111a,311a: opening

[0043] 111b: Internal components

[0044] 120: Display

[0045] 200,300: Touch panel assembly

[0046] 210: Cover

[0047] 220: Touch circuit board

[0048] 221: first touch electrode layer

[0049] 221a: first touch unit

[0050] 222: second touch electrode layer

[0051] 222a: second touch unit

[0052] 223: Single layer embedded coil layer

[0053] 223a, 223b: Coil unit

[0054] 223a1,223a2,223b1,223b2: Straight line segment

[0055] 224: Shielding layer

[0056] 224a: Jumper

[0057] 225: Insulation layer

[0058] 230,330: bearing mechanism

[0059] 231: first bearing part

[0060] 231a:Through hole

[0061] 232: Second bearing part

[0062] 233: Central accommodating portion

[0063] 240: Magnet group

[0064] 250: Force support member

[0065] 251: Plastic layer

[0066] 252,253: Pressure sensitive adhesive layer

[0067] 260:Isolation body

[0068] 411a: Groove

[0069] 510: Glue firmware

[0070] G: Pressing gap

[0071] P1, P2, P3: Pressing points

[0072] Ta, T1, T2, T3: thickness

[0073] X,Y: Axis

[0074] MZ: Measurement Zone DETAILED DESCRIPTION

[0075] The following will disclose multiple embodiments of the present disclosure with the accompanying drawings. For the purpose of clear description, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present disclosure. In other words, in some embodiments of the present disclosure, these practical details are not necessary. In addition, in order to simplify the drawings, some conventional structures and elements will be depicted in a simple schematic manner in the drawings.

[0076] Please refer to Figure 1 , which is a schematic diagram illustrating an electronic device 100 according to an embodiment of the present disclosure. Figure 1 As shown, in this embodiment, the electronic device 100 includes a host 110, a display 120, and a touchpad assembly 200. The touchpad assembly 200 is disposed in the host 110 and is exposed through an opening 111a of a housing portion 111 (also referred to as an A-cover) of the host 110. The touchpad assembly 200 is an input device disposed in the host 110, but the disclosure is not limited thereto. In addition, the touchpad assembly 200 is a rectangular area composed of length and width, and the left and right widths can be lengthened according to different models (i.e., a longer touchpad assembly 200), and the size is not limited to the left and right widths. Figure 1The length shown is limited. In actual applications, the touchpad assembly 200 can also be an electronic product that uses a touchpad as an input or operating interface (e.g., a personal digital assistant, a keyboard including a touchpad, etc.). In other words, the concept of the touchpad assembly 200 disclosed herein can be applied to any electronic product that uses a touchpad as an input or operating interface. The following will describe in detail the structure and function of some components included in the touchpad assembly 200 and the connection and actuation relationship between these components.

[0077] Please refer to Figure 2 , which is a drawing Figure 1 A cross-sectional schematic diagram of the touch panel assembly 200 in FIG. Figure 2 As shown, in this embodiment, the touch panel assembly 200 includes a cover plate 210, a touch circuit board 220, a supporting mechanism 230, a magnet group 240, a force support member 250 and a plurality of seismic isolation bodies 260. The touch circuit board 220 is disposed under the cover plate 210. Specifically, the touch circuit board 220 is coupled to the cover plate 210 via the force support member 250. The supporting mechanism 230 is disposed below the touch circuit board 220 and is fixed to the inner member 111b inside the housing portion 111 (for example, by screws). The magnet group 240 is disposed on the supporting mechanism 230 and faces the touch circuit board 220. In other words, the magnet group 240 is located between the supporting mechanism 230 and the touch circuit board 220. In addition, the seismic isolation body 260 is disposed between the touch circuit board 220 and the supporting mechanism 230. The seismic isolation body 260 is configured to reduce vibration noise and effectively release vibration stress in the horizontal direction.

[0078] like Figure 2 As shown, in this embodiment, the force support member 250 is a laminated structure. The laminated structure includes two pressure sensitive adhesive layers 252 and 253 (PSA) and a plastic layer 251 located between the pressure sensitive adhesive layers 252 and 253. The pressure sensitive adhesive layers 252 and 253 contact the cover plate 210 and the touch circuit board 220 respectively. In some embodiments, the material of the plastic layer 251 includes polyethylene terephthalate (PET), but the present disclosure is not limited thereto.

[0079] In other embodiments, the force supporting member 250 may also adopt a single-layer structure, and the material of the force supporting member 250 may include silicone, but the present disclosure is not limited thereto.

[0080] like Figure 2 As shown, in this embodiment, the supporting mechanism 230 has a central accommodating portion 233. The magnet group 240 is accommodated in the central accommodating portion 233. In this way, the distance between the supporting mechanism 230 and the touch circuit board 220 can be further reduced, thereby further reducing the total thickness Ta of the touch panel assembly 200 to a range between 2.5 mm and 3.5 mm.

[0081] Specifically, if Figure 2 As shown, the supporting mechanism 230 includes a first supporting portion 231 and a second supporting portion 232. The first supporting portion 231 is plate-shaped and has a through hole 231a. The second supporting portion 232 covers the opening of the through hole 231a away from the touch circuit board 220 (that is, covers the lower opening of the through hole 231a). The central accommodating portion 233 is formed by the through hole 231a and the second supporting portion 232.

[0082] In some embodiments, the first supporting portion 231 has a first thickness T1, and the second supporting portion 232 has a second thickness T2. The first thickness T1 is greater than the second thickness T2.

[0083] In some embodiments, the first thickness T1 of the first carrier portion 231 is between 0.45 mm and 0.55 mm. The first thickness T1 can be designed to match the thickness of the magnet group 240. For example, the thickness of the magnet group 240 can be equal to or slightly greater than the first thickness T1. Preferably, when the thickness of the magnet group 240 is equal to the first thickness T1, it has a perfect accommodation effect and can effectively control the thinning of the thickness.

[0084] In some embodiments, the second thickness T2 of the second supporting portion 232 is between 0.25 mm and 0.35 mm.

[0085] Please refer to Figure 3 , which is a cross-sectional schematic diagram illustrating a touch panel assembly 300 according to another embodiment of the present disclosure. Figure 2 The embodiment shown in the figure provides a modified housing portion 311 and a supporting mechanism 330. Specifically, the touch panel assembly 300 is disposed in the opening 311a of the housing portion 311 and fixed to the inner surface of the housing portion 311 (e.g., by screws). In detail, the touch panel assembly 300 is fixed to the inner surface of the housing portion 311 by its supporting mechanism 330. The magnet group 240 and the seismic isolation body 260 are directly disposed on the upper surface of the supporting mechanism 330. In addition, compared to Figure 2 The supporting mechanism 230 shown, the supporting mechanism 330 of this embodiment is a single-layer plate.

[0086] Please refer to Figure 4 , which is a cross-sectional schematic diagram illustrating a touch panel assembly 300 according to another embodiment of the present disclosure. Figure 3 The embodiment shown in the figure provides a modified housing portion 411. Specifically, the touchpad assembly 300 is disposed in the groove 411a of the housing portion 411 and fixed to the bottom surface of the groove 411a (e.g., by screws), wherein the groove 411a of the housing portion 411 is located on the outer surface of the housing portion 411.

[0087] Please refer to Figure 5 , which is a cross-sectional schematic diagram illustrating a touch panel assembly 300 according to another embodiment of the present disclosure. Figure 4 In the embodiment shown, the fixing method between the touch panel assembly 300 and the housing portion 411 is modified. Specifically, the touch panel assembly 300 and the housing portion 411 in the embodiment are fixed to each other via an adhesive 510. In some embodiments, the adhesive 510 is a pressure-sensitive adhesive layer, but the present disclosure is not limited thereto.

[0088] In some embodiments, the material of the second bearing portion 232 includes silicon steel. It should be noted that the second bearing portion 232 in the shape of an ultra-thin silicon steel sheet can not only reduce the total thickness Ta of the touch panel assembly 200, but also has good magnetic conductivity and can reduce eddy current loss.

[0089] Please refer to Fig. 6A as well as Figure 6B . Fig. 6A FIG. 2 is a schematic diagram illustrating magnetic lines of force of a magnet assembly 240 according to an embodiment of the present disclosure. Figure 6B FIG. 2 is a schematic diagram illustrating magnetic lines of force of a magnet group 240 disposed on a silicon steel sheet according to an embodiment of the present disclosure. Fig. 6A and Figure 6B From the magnetic lines of force, it can be seen that silicon steel sheets have a magnetic conductivity, which will constrain the divergence of the magnetic field and make the magnetic field more concentrated, thereby making the magnetic lines of force more concentrated within the same range.

[0090] Please refer to Figure 7 , which is a drawing Figure 2 FIG. 2 is a cross-sectional diagram of the touch circuit board 220. Figure 2 and Figure 7 As shown, in this embodiment, the touch circuit board 220 includes a first touch electrode layer 221, a second touch electrode layer 222, and a single-layer embedded coil layer 223 disposed away from the cover plate 210. The magnet group 240 disposed on the carrier mechanism 230 and the single-layer embedded coil layer 223 disposed on the touch circuit board 220 constitute a vibration module. A pressing gap G is formed between the touch circuit board 220 and the magnet group 240. It should be noted that since the conductor part used in the vibration module only includes the single-layer embedded coil layer 223, the total thickness Ta of the touch panel assembly 200 can be effectively reduced.

[0091] Please refer to Figure 8 , which is a top view of a touch panel assembly 200 according to an embodiment of the present disclosure. Figure 8As shown, in this embodiment, the number of the seismic isolation bodies 260 included in the touch panel assembly 200 is four. The seismic isolation bodies 260 are respectively adjacent to the four corners of the touch panel assembly 200. Two of the seismic isolation bodies 260 are aligned with the upper long sides of the touch panel assembly 200, and the other two seismic isolation bodies 260 are aligned with the lower long sides of the touch panel assembly 200. However, the number of the seismic isolation bodies 260 included in the touch panel assembly 200 is not limited thereto.

[0092] Please refer to Fig. 9 , which is a top view of a touch panel assembly 200 according to another embodiment of the present disclosure. Fig. 9 As shown, in this embodiment, the number of the vibration isolation bodies 260 included in the touch panel assembly 200 is six. Figure 8 In the illustrated embodiment, the additional two seismic isolators 260 of this embodiment are respectively aligned with the upper long side and the lower long side of the touch panel assembly 200 and are respectively located at the center of the upper long side and the center of the lower long side.

[0093] In some embodiments, the thickness T3 of the seismic isolation body 260 is between 0.55 mm and 0.95 mm.

[0094] In some embodiments, the maximum deformation of pressing down on the central area of ​​the cover 210 is between 0.3mm and 0.7mm. The vibration module is configured to generate a vibration acceleration between 2G and 15G. By matching the range of the maximum deformation of pressing down with the range of the vibration acceleration, a good balance can be achieved between the thinning and vibration requirements. It should be noted that if the vibration acceleration is less than 2G, the user will not be able to feel the vibration obviously. If the vibration acceleration is to be greater than 15G, the size of the magnet group 240 will need to be increased, which is not conducive to the thinning of the touchpad assembly 200. In fact, the acceptable vibration range of the vibration module for commercial use must be between 2G and 15G, and it is generally between 3.5G and 15G in the general laptop brand market. Furthermore, in some high-end laptop application models, the commercial use of the vibration module must meet the vibration range of 8G to 15G to meet the user experience.

[0095] It should be noted that regarding vibration acceleration calculation, the present disclosure uses a commercial model DRV-ACC16-EVM Accelerometer from Texas Instruments and its user manual to perform vibration acceleration measurement. Fig.14A Reveal the conversion calculation of the vibration voltage and acceleration G value of the DRV-ACC16-EVM model, where G is the earth's gravity 9.81m / s 2 If the test acceleration is 8G, 8G is converted to 8x9.81 m / s 2 . Fig. 14B The design of TI's three-axis measurement platform is revealed, in which the vibration sensing element is set in the rightmost measurement zone MZ for measurement. Fig. 14C Based on Fig.14A The calculation theory and the manual are used for actual measurement and calculation. The V (Peak-Peak) voltage value is measured by the three-axis acceleration sensor, and the difference between the peak and the valley is taken as Fig. 14C The lower right corner (△Y = 589mV), and then according to the calculation formula, G (Peak-Peak) = V (Peak-Peak) / 57 = 589 / 57 = 10.33G. The above explanation can explain the conversion of G value units and its measurement verification and proof methods.

[0096] The applicant provides the following pressing simulation tests (I), (II) and (III) to verify the rationality of the above matching design. The common dimensional parameters used in the pressing simulation test (I) are: the length, width and height dimensions of the magnet group 240 are 60x40x0.8mm. The length, width and height dimensions of the seismic isolation body 260 are 7x4x0.5 mm. The length, width and height dimensions of the second bearing portion 232 are 75x45x0.3 mm. The pressing gap G between the touch circuit board 220 and the magnet group 240 is 0.2mm. The common material parameters used in the pressing simulation test (I) are: the Young's modulus of the cover plate 210 is 80000Mpa. The Poisson's ratio of the cover plate 210 is 0.22. The Young's modulus of the touch circuit board 220 is 30000Mpa. The Poisson's ratio of the touch circuit board 220 is 0.33. The Young's modulus of the plastic layer 251 is 1950 MPa. The Pusson's ratio of the plastic layer 251 is 0.4. The Young's modulus of the pressure-sensitive adhesive layers 252 and 253 is 100 MPa. The Pusson's ratio of the pressure-sensitive adhesive layers 252 and 253 is 0.4. The Young's modulus of the bearing mechanism 230 is 200000 MPa. The Pusson's ratio of the bearing mechanism 230 is 0.3. The Young's modulus of the seismic isolation body 260 is 0.6703 MPa. The Pusson's ratio of the seismic isolation body 260 is 0.4.

[0097] In separate Figure 8 and Fig. 9 After the pressing simulation test of the pressing points P1, P2, and P3 of the cover plate 210, the simulation data of the pressing simulation test (I) can be obtained as shown in Table 1. It should be noted that the pressing point P1 corresponds to Figure 8 and Fig. 9 The pressing point P2 corresponds to the center of the short side of the cover plate 210. Figure 8 and Fig. 9 The central area of ​​the cover plate 210 in FIG. Figure 8 and Fig. 9 The center between two adjacent seismic isolation bodies 260 on the long sides.

[0098] Table 1 Compression simulation test (I)

[0099]

[0100] It should be noted that type A in Table 1 above corresponds to Figure 8 The touch panel assembly 200 having four isolation bodies 260, type B corresponds to Fig. 9 The touch panel assembly 200 has six isolators 260. The pressing force in Table 1 above represents the force applied when the touch panel 220 is pressed to contact the support mechanism 230 or the magnet group 240 (i.e., the boundary of the non-contact bearing force). The (m) in Table 1 above represents that the touch panel 220 first contacts the magnet group 240. As shown in Table 1 above, the non-contact bearing force of the pressing point P3 of type A is less than 110 gf (gram-force), which does not meet the commercial bearing requirements.

[0101] Compared with the common dimensional parameters used in the press simulation test (I), the height of the seismic isolation body 260 is changed to 0.6 mm in the press simulation test (II), and the press gap G between the touch circuit board 220 and the magnet group 240 is changed to 0.3 mm. Figure 8 and Fig. 9 After the pressing simulation test of the pressing points P1, P2, and P3 of the cover plate 210, simulation data of the pressing simulation test (II) can be obtained as shown in Table 2 below.

[0102] Table 2 Compression simulation test (II)

[0103]

[0104] It should be noted that (s) in Table 2 above means that the touch circuit board 220 first contacts the supporting mechanism 230. As shown in Table 2 above, the non-contact bearing forces of all pressing points P1, P2, and P3 of types A and B are greater than 110 gf, thus meeting commercial bearing requirements.

[0105] Compared with the common dimensional parameters used in the press simulation test (I), the height of the seismic isolation body 260 is changed to 0.7 mm in the press simulation test (III), and the press gap G between the touch circuit board 220 and the magnet group 240 is changed to 0.4 mm. Figure 8 and Fig. 9 After the pressing simulation test of the pressing points P1, P2, and P3 of the cover plate 210, simulation data of the pressing simulation test (III) can be obtained as shown in Table 3 below.

[0106] Table 3 Compression simulation test (III)

[0107]

[0108] As shown in Table 3 above, the non-contact load-bearing capacity of all pressing points P1, P2, and P3 of Type A and B is greater than 110 gf, and therefore meets the commercial load-bearing requirements.

[0109] According to the simulation data of the above pressing simulation tests (I), (II) and (III), it can be known that the maximum pressing deformation of the central area of ​​the cover plate 210 between 0.3mm and 0.7mm is reasonable, because when the pressing gap G between the touch circuit board 220 and the magnet group 240 is greater than 0.3mm, it can meet the commercial load-bearing requirements. In addition, if the maximum pressing deformation exceeds 0.7mm, it will not be of obvious help, but will increase the total thickness Ta of the touch panel assembly 200.

[0110] The applicant provides the following measurement data, which are vibration accelerations measured under different driving voltages, coil resistances, and using silicon steel sheets of different thicknesses. The following table shows that in various scenario selection combinations of driving voltage (3.5-10.5 volt) and coil resistance (5-7 ohm), when the thickness of the silicon steel sheet gradually increases from 0.2 mm to close to 0.5 mm, the vibration acceleration increases and approaches the limit value. Under this verification, by using a silicon steel sheet with a critical upper limit thickness (i.e., less than or equal to 0.5 mm), it is possible to both control the thinning of the thickness of the overall touch panel assembly and achieve an excellent vibration acceleration effect (i.e., the vibration module is configured to produce excellent vibration acceleration). In other words, the critical value for effectively increasing the vibration acceleration has been verified, and there is no need for excessive thickness (e.g., a thickness exceeding 0.5 mm).

[0111]

[0112] Please refer to Fig.10 , which is a top view of a single-layer embedded coil layer 223 and a magnet group 240 according to an embodiment of the present disclosure. Fig.10 As shown, in this embodiment, the single-layer embedded coil layer 223 includes a single coil unit 223a. The coil unit 223a includes two straight line segments 223a1 and 223a2. The straight line segments 223a1 and 223a2 are arranged side by side. The polarity of the magnet group 240 located below the straight line segment 223a1 is the N pole. The polarity of the magnet group 240 located below the straight line segment 223a2 is the S pole. For example, when the current direction in the coil unit 223a (such as Fig.10 When the direction of the thick arrow in the coil unit 223a is counterclockwise, according to the left-hand rule (i.e., the palm faces the N pole, the four fingers point to the current direction, and the direction of the thumb is the force direction of the conductor), the force directions of the straight line segments 223a1 and 223a2 are both upward. Conversely, when the current direction in the coil unit 223a is clockwise, the force directions of the straight line segments 223a1 and 223a2 are both downward.

[0113] In some embodiments, the number of metal layers included in the touch circuit board 220 is not greater than five. Figure 7As shown, in this embodiment, the touch circuit board 220 further includes a shielding layer 224. The first touch electrode layer 221, the second touch electrode layer 222, the shielding layer 224 and the single-layer embedded coil layer 223 are stacked in sequence from top to bottom and are electrically isolated by the insulating layer 225. The single-layer embedded coil layer 223 can be electrically connected to the shielding layer 224 through the via 231a (Via).

[0114] Please refer to Fig.11 , which is a top view of a single-layer embedded coil layer 223 and a magnet group 240 according to another embodiment of the present disclosure. Fig.11 As shown, in this embodiment, the single-layer embedded coil layer 223 includes two coil units 223a and 223b. The two coil units 223a and 223b are electrically connected via the shielding layer 224. Specifically, the two coil units 223a and 223b have the same winding method and are connected in series through the shielding layer 224. The coil unit 223a includes two straight line segments 223a1 and 223a2. The straight line segments 223a1 and 223a2 are arranged side by side up and down. The coil unit 223b includes two straight line segments 223b1 and 223b2. The straight line segments 223b1 and 223b2 are arranged side by side up and down. The polarity of the magnet group 240 located below the straight line segments 223a1 and 223b1 is the N pole. The polarity of the magnet group 240 located below the straight line segments 223a2 and 223b2 is the S pole. For example, when the current direction in the coil units 223a, 223b (eg Fig.11 When the direction of the current (indicated by the thick arrow in FIG. 1 ) is counterclockwise, according to the left-hand rule, the force directions of the straight line segments 223a1, 223a2, 223b1, and 223b2 are all upward. Conversely, when the current direction in the coil units 223a and 223b is clockwise, the force directions of the straight line segments 223a1, 223a2, 223b1, and 223b2 are all downward.

[0115] Please refer to Fig.12 , which is a top view of a single-layer embedded coil layer 223 and a magnet group 240 according to another embodiment of the present disclosure. Fig.12As shown, in this embodiment, the single-layer embedded coil layer 223 includes two coil units 223a and 223b. The two coil units 223a and 223b are electrically connected via the shielding layer 224. Specifically, the two coil units 223a and 223b are wound in the same way and are connected in parallel through the shielding layer 224. The coil unit 223a includes two straight line segments 223a1 and 223a2. The straight line segments 223a1 and 223a2 are arranged side by side up and down. The coil unit 223b includes two straight line segments 223b1 and 223b2. The straight line segments 223b1 and 223b2 are arranged side by side up and down. The polarity of the magnet group 240 located below the straight line segments 223a1 and 223b2 is the N pole. The polarity of the magnet group 240 located below the straight line segments 223a2 and 223b1 is the S pole. For example, when the current direction in the coil unit 223a is counterclockwise and the current direction in the coil unit 223b is clockwise (eg Fig.11 ), according to the left-hand rule, the force directions of the straight line segments 223a1, 223a2, 223b1, and 223b2 are all upward. Conversely, when the current direction in the coil unit 223a is clockwise and the current direction in the coil unit 223b is counterclockwise, the force directions of the straight line segments 223a1, 223a2, 223b1, and 223b2 are all downward.

[0116] In some embodiments, the Young's modulus of the seismic isolation body 260 is in the range of 0.55 MPa to 0.8 MPa. The seismic isolation body 260 having the Young's modulus in the aforementioned range can effectively reduce vibration noise and effectively release vibration stress in the horizontal direction.

[0117] In some embodiments, the coil resistance of the single-layer embedded coil layer 223 is between 4 ohms and 21 ohms. In theory, the smaller the coil resistance, the better, because based on the same number of winding turns and the size of the magnet group 240, the lower the coil resistance, the greater the driving current, and the greater the force and vibration acceleration of the single-layer embedded coil layer 223. However, due to the limitation of the driver chip, the coil resistance cannot be lower than 4 ohms.

[0118] In some embodiments, the peak frequency of the vibration acceleration is between 170 Hz and 200 Hz, preferably about 180 Hz, which can provide the user with a more comfortable vibration feeling.

[0119] For example, Table 4 below is a table of physical properties of different materials launched by Titanium Technology.

[0120]

[0121] As shown in Table 4 above, the materials of type β gel, θ-F and NP gel can be selected as the materials for manufacturing the seismic isolation body 260 because the Young's modulus is in the range of 0.55Mpa to 0.8Mpa, so as to effectively reduce vibration noise and effectively release vibration stress in the horizontal direction. The material of the seismic isolation body 260 can be silicone.

[0122] Please refer to Fig.13 , which is a partial top view of each layer of circuits on a touch circuit board 220 according to an embodiment of the present disclosure. Figure 7 and Fig.13 As shown, in this embodiment, the two coil units 223a and 223b of the single-layer embedded coil layer 223 are electrically connected via the jumper 224a in the shielding layer 224. In addition, the first touch electrode layer 221 includes a plurality of first touch units 221a. The first touch units 221a extend along the axial direction Y and are arranged in sequence on the axial direction X. The second touch electrode layer 222 includes a plurality of second touch units 222a. The second touch units 222a extend along the axial direction X and are arranged in sequence on the axial direction Y. The jumper 224a of the shielding layer 224 runs completely on the second touch units 222a of the second touch electrode layer 222 and does not overlap with the first touch units 221a of the first touch electrode layer 221. In this way, interference with the touch signal when the single-layer embedded coil layer 223 is actuated can be avoided to the greatest extent.

[0123] From the above detailed description of the specific implementation methods of the present disclosure, it can be clearly seen that in the touch pad assembly disclosed in the present disclosure, the pressing gap is separated by a single-layer embedded coil layer disposed on the touch circuit board and a magnet group disposed on the carrier mechanism, and the two together constitute a vibration module, so that the total thickness of the touch pad assembly can be effectively reduced. By accommodating the magnet group in the central accommodating portion of the carrier mechanism, the total thickness of the touch pad assembly can be further reduced. By matching the range of the maximum downward deformation of the central area of ​​the cover plate with the range of the vibration acceleration generated by the vibration module, an excellent balance can be achieved between the thinning of the touch pad assembly and the vibration requirements. By having a silicon steel sheet with a critical upper limit thickness (i.e., less than or equal to 0.5 mm), it is possible to both control the thinning of the overall touch pad assembly thickness and simultaneously take into account the achievement of an excellent vibration acceleration effect (i.e., the vibration module is configured to produce excellent vibration acceleration).

[0124] Although the present disclosure has been disclosed in the above embodiments, it is not intended to limit the present disclosure. Anyone familiar with this technology can make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the definition of the attached claims.

Claims

1. A touch panel assembly, characterized in that: Include: a cover plate; A touch circuit board is disposed under the cover plate and comprises a first touch electrode layer, a second touch electrode layer and a single-layer embedded coil layer disposed away from the cover plate; A supporting mechanism having a central receiving portion; a magnet group, disposed in the central accommodating portion, and forming a vibration module with the single-layer embedded coil layer, wherein a pressing gap is formed between the touch circuit board and the magnet group; and A plurality of isolators are disposed between the touch panel circuit board and the supporting mechanism, wherein the maximum deformation of a central area of ​​the cover plate when pressed downward is between 0.3 mm and 0.7 mm, the vibration module is configured to generate a vibration acceleration between 2G and 15G, and the total thickness of the touch panel assembly is between 2.5 mm and 3.5 mm.

2. The touch panel assembly according to claim 1, wherein: The supporting mechanism includes a first supporting part and a second supporting part. The first supporting part has a through hole. The second supporting part covers an opening of the through hole away from the touch circuit board. The central accommodating part is formed by the through hole and the second supporting part.

3. The touch panel assembly according to claim 2, wherein: The first carrying portion has a first thickness, the second carrying portion has a second thickness, and the first thickness is greater than the second thickness.

4. The touch panel assembly according to claim 3, wherein: The first thickness is between 0.45 mm and 0.55 mm.

5. The touch panel assembly according to claim 3, wherein: The second thickness is between 0.25 mm and 0.35 mm.

6. The touch panel assembly according to claim 2, wherein: The material of the second bearing portion includes silicon steel.

7. The touch panel assembly according to claim 2, wherein: A critical upper limit value of the second thickness of the second bearing portion is less than or equal to 0.5 mm.

8. The touch panel assembly according to claim 1, wherein: The vibration acceleration generated by the vibration module is between 3.5G and 15G.

9. The touch panel assembly according to claim 8, wherein: The vibration acceleration generated by the vibration module is between 8G and 15G.

10. The touch panel assembly according to claim 1, wherein: The heights of the plurality of seismic isolation bodies are between 0.55 mm and 0.95 mm.

11. The touch panel assembly according to claim 1, wherein: A non-contact bearing force between the single-layer embedded coil layer and the magnet group is greater than 110 gf.

12. The touch panel assembly according to claim 1, wherein: The number of metal layers included in the touch circuit board is no more than five.

13. The touch panel assembly according to claim 1, wherein: The single-layer embedded coil layer includes two coil units. The touch circuit board further includes a shielding layer, which is located between the second touch electrode layer and the single-layer embedded coil layer, and the two coil units are electrically connected via the shielding layer.

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