Substrate transfer apparatus and substrate transfer method

Abstract

The invention discloses a substrate conveying apparatus and a substrate conveying method. The substrate conveying device is provided with a conveying arm. The conveying arm comprises a base part; at least one arm part which is connected to the base part so as to extend from the base part, and which extends so as to surround the outer periphery of the substrate; a plurality of suction parts provided on the at least one arm part, each of the plurality of suction parts including a suction port for sucking the peripheral edge part of the back surface of the substrate; and a plurality of suction passages provided in at least one of the arm portions. The plurality of adsorption parts include: a first adsorption part group including a first adsorption part and a second adsorption part; and the second adsorption part group comprises a third adsorption part and a fourth adsorption part. The plurality of suction passages include: a first suction passage connected to the suction ports of the first suction part and the second suction part; and a second suction passage connected to the suction ports of the third suction unit and the fourth suction unit.

Description

Technical Field

[0001] The present disclosure relates to a substrate transporting device and a substrate transporting method. Background Art

[0002] Patent document 1 discloses a substrate transport device provided in a substrate processing device for processing substrates such as semiconductor wafers. The substrate transport device is configured to be able to move between different processing modules in the substrate processing device to transport a substrate from one processing module to another processing module. The substrate transport device is configured to be able to move between a carrier and a processing module to take out a substrate from a carrier that accommodates a plurality of substrates and transport the substrate to a processing module, or to return a substrate processed in a processing module to the carrier.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2017-183704 Summary of the invention

[0006] Problem that the invention aims to solve

[0007] The present disclosure describes a substrate transfer apparatus and a substrate transfer method that can appropriately transfer a substrate by a transfer arm even if the substrate is uneven such as warped.

[0008] Solutions for solving problems

[0009] An example of a substrate transport device includes: a transport arm; a driving unit that moves the transport arm; and a control unit that is configured to control the driving unit. The transport arm includes: a base; at least one arm, at least one arm connected to the base in a manner extending from the base and extending in a manner surrounding the periphery of the substrate; a plurality of adsorption units, the plurality of adsorption units are provided on at least one arm, and the plurality of adsorption units respectively include suction ports for adsorbing the peripheral portion of the back side of the substrate; and a plurality of suction passages, the plurality of suction passages are provided on at least one arm. The plurality of adsorption units include: a first adsorption unit group, which includes a first adsorption unit and a second adsorption unit; and a second adsorption unit group, which includes a third adsorption unit and a fourth adsorption unit. The plurality of suction passages include: a first suction passage connected to the suction ports of the first adsorption unit and the second adsorption unit; and a second suction passage connected to the suction ports of the third adsorption unit and the fourth adsorption unit.

[0010] Effects of the Invention

[0011] According to the substrate transfer apparatus and substrate transfer method according to the present disclosure, even if the substrate is uneven such as warping, the substrate can be appropriately transferred by the transfer arm. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a top view schematically showing an example of a substrate processing system.

[0013] Figure 2 This is a side view schematically showing an example of a substrate processing system.

[0014] Figure 3 This is a perspective view schematically showing an example of a processing station.

[0015] Figure 4 It is a perspective view showing an example of a transfer arm.

[0016] Figure 5 It is shown Figure 4 A plan view of the upper surface side of the illustrated transfer arm.

[0017] Figure 6 It is shown Figure 4 A plan view of the lower surface side of the illustrated transfer arm.

[0018] Figure 7 It is shown Figure 4 A perspective view of an example of a suction pad included in the illustrated transfer arm.

[0019] Figure 8 It is shown Figure 7 Cross-sectional view of the adsorption disk.

[0020] Fig. 9 This is a block diagram showing an example of the main parts of the substrate processing system.

[0021] Fig.10 This is a schematic diagram showing an example of the hardware configuration of the controller.

[0022] Fig.11 This is a flowchart for explaining an example of a transport process of a substrate by the substrate transport device.

[0023] Fig.12 This is a plan view schematically showing another example of a processing station.

[0024] Fig.13 It is a schematic representation Fig.12 A side view of an illustrated processing station.

[0025] Fig.14 It is mainly shown that the Fig.12 A perspective view of a support column of a substrate transfer device of an exemplary processing station.

[0026] Fig.15 It is a plan view showing another example of the transfer arm.

[0027] Fig.16 It is a plan view showing another example of the transfer arm.

[0028] Fig.17 It is a plan view showing another example of the transfer arm.

[0029] Fig.18 It is a plan view showing another example of the transfer arm. DETAILED DESCRIPTION

[0030] In the following description, the same reference numerals are used for the same elements or elements having the same functions, and repeated descriptions are omitted. In addition, in this specification, when referring to the top, bottom, right, and left in the drawings, the orientation of the reference numerals in the drawings is used as a reference. In some drawings, an orthogonal coordinate system defined by an X-axis, a Y-axis, and a Z-axis is shown. In this specification, the X-axis and the Y-axis correspond to the horizontal direction, and the Z-axis corresponds to the vertical direction.

[0031] [Substrate processing system]

[0032] First, refer to Figure 1 and Figure 2 The following describes a substrate processing system 1 (substrate processing device) configured to process a substrate W. The substrate processing system 1 may be configured to perform various processes such as photolithography, cleaning, and etching on the substrate W. The photolithography process may include, for example, a process of forming a photosensitive film (such as a resist film) on the surface of the substrate W, a process of developing the exposed photosensitive film, and the like.

[0033] The substrate W may be in the shape of a circular plate or a plate other than a circular plate such as a polygon. The substrate W may have a cutout portion formed by cutting out a portion. The cutout portion may be, for example, a groove (a groove of a U-shape, a V-shape, etc.), or a straight portion extending in a straight line (a so-called orientation plane). The substrate W may be, for example, a semiconductor substrate (silicon wafer), a glass substrate, a mask substrate, an FPD (Flat Panel Display) substrate, and various other substrates.

[0034] The substrate processing system 1 includes: a box station 2, which carries in and out a box 5 capable of accommodating a plurality of substrates W; and a processing station 3, which is equipped with a plurality of various processing devices for performing prescribed processing on the substrate W. The substrate processing system 1 includes an interface station 4 for transferring the substrate W between the box station 2 and an exposure device (not shown). The exposure device may be adjacent to the interface station 4 on the side of the interface station 4 opposite to the processing station 3. Figure 1 and Figure 2 As illustrated, two processing stations 3 may be provided between the cassette station 2 and the interface station 4. Alternatively, one processing station 3 may be provided between the cassette station 2 and the interface station 4, or three or more processing stations 3 may be provided.

[0035] The cassette station 2 includes substrate transfer devices 2b and 2c and a plurality of cassette stages 21. The plurality of cassette stages 2a may be arranged, for example, along the X direction (the width direction of the substrate processing system 1). Each of the plurality of cassette stages 2a is configured to be able to mount one cassette 5 thereon.

[0036] The substrate transport devices 2b and 2c are configured to transport the substrate W between the cassette 5 placed on the cassette mounting table 2a and the processing station 3. The substrate transport devices 2b and 2c are configured to be movable in, for example, the X-axis direction (horizontal direction), the Y-axis direction (horizontal direction), the Z-axis direction (up and down direction), and the directions around the Z-axis (θ direction). Therefore, the substrate transport devices 2b and 2c may include a driving mechanism in at least one direction of the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ direction, or may include a driving mechanism in all directions as needed.

[0037] At least one of the substrate transport devices 2b and 2c can transfer substrates W to and from the cassette 5, and can also transfer substrates W to and from the processing station 3. The transfer of substrates W by the substrate transport devices 2b and 2c to and from the processing station 3 may include the transfer of substrates W to and from the block G3. In addition, an inspection device (not shown) for inspecting the substrates W may be provided at a position accessible to at least one of the substrate transport devices 2b and 2c.

[0038] The processing station 3 is configured to perform various photolithography processes on the substrate W. Figure 2 As shown in the example, the processing station 3 may include a plurality of modules 3a stacked in the vertical direction. Figure 1 and Figure 2 As illustrated, each module 3a may include, for example, blocks G1 and G2 and a substrate transfer space 3b extending in the Y-axis direction. The block G1 and the block G2 may be arranged in the X-axis direction so as to face each other with the substrate transfer space 3b interposed therebetween.

[0039] Block G1 includes at least one thin film processing device U1. The thin film processing device U1 may be a device that supplies a processing liquid to the substrate W to perform film processing, or may be a device that supplies a specified gas to the substrate W to perform film processing. The thin film processing device U1 may include, for example, a thin film forming device, a developing device, and the like. The thin film forming device may include, for example, a photosensitive thin film forming device, an anti-reflective film forming device, and the like. The photosensitive thin film forming device may be a device for forming a resist film, which is a film used as a mask when forming a pattern of a film on the lower side. The anti-reflective film forming device may be a device for forming an anti-reflective film, which is a film used for efficiently performing a light irradiation process such as an exposure process. The developing device may be a device for removing a portion of the exposed resist film to form a concave-convex shape as the above-mentioned mask. Thin film processing may include forming a thin film and performing a developing process. In Figure 1 In the example shown in FIG. 1 , the plurality of thin film processing apparatuses U1 are arranged in a row along the Y-axis direction, but the number, arrangement, and type of the thin film processing apparatuses U1 can be arbitrarily selected.

[0040] Block G2 includes a plurality of heat treatment devices U2, a hydrophobic treatment device (not shown) and a peripheral exposure device U3. A plurality of heat treatment devices U2 are configured to perform heat treatment (e.g., heating, cooling) of substrate W. A plurality of heat treatment devices U2 can be arranged in an up-down direction and a horizontal direction in block G2. The hydrophobic treatment device is configured to hydrophobize the surface of substrate W to improve the fixability of the processing liquid and substrate W that become the photosensitive film. The peripheral exposure device U3 is configured to expose the portion of the photosensitive film formed on the surface of substrate W that is located at the peripheral portion. The hydrophobic treatment device and the peripheral exposure device U3 can be arranged in an up-down direction and a horizontal direction in block G2. The number and configuration of the heat treatment device U2, the hydrophobic treatment device and the peripheral exposure device U3 can be selected arbitrarily.

[0041] like Figure 1 As shown in the example, in a plan view, a substrate transfer space 3b is formed in a region sandwiched between the block G1 and the block G2. In the substrate transfer space 3b, for example, a substrate transfer device 3c is disposed. The substrate transfer device 3c includes, for example, a transfer arm 10 that can move in the X direction (horizontal direction), the Y direction (horizontal direction), the Z direction (up and down direction), and in directions around the vertical axis (θ direction). The substrate transfer device 3c may include a drive mechanism DM (see Figure 3 ).

[0042] The substrate transfer device 3c can move within the substrate transfer space 3b to transfer the substrate W to a predetermined device in the surrounding blocks G1, G2, G3, and G4. Figure 1As illustrated, when there are a plurality of processing stations 3, the substrate transfer device 3c provided at the processing station 3 located on the interface station 4 side can transfer the substrate W to a specified device in a block G5 (described later) in addition to the blocks G1, G2, and G4.

[0043] A plurality of substrate transport devices 3c may be arranged vertically. One substrate transport device 3c can transport a substrate W to a predetermined device of a module 3a located on the upper side among a plurality of modules 3a stacked vertically. Another substrate transport device 3c can transport a substrate W to a predetermined device of a module 3a located on the lower side. In addition, the number of substrate transport devices 3c and the number of modules 3a corresponding to one substrate transport device 3c can be arbitrarily selected, for example, a substrate transport device 3c may be provided for each module 3a.

[0044] The substrate transfer space 3b or the blocks G1 and G2 may also include a shuttle transfer device (not shown). The shuttle transfer device may be configured to transfer the substrate W linearly between a space adjacent to one side of the processing station 3 and another space adjacent to the opposite side.

[0045] The block G3 may be arranged in the cassette station 2 so as to be located near the substrate transfer space 3b of the processing station 3. The block G3 may also be provided in the processing station 3. The block G3 may include a plurality of delivery devices (not shown) arranged in the vertical direction.

[0046] exist Figure 1 In the example of FIG. 1 , the block G4 is arranged at a position of the substrate transfer space 3b at the boundary of the two processing stations 3. The block G4 may include a plurality of handover devices (not shown) arranged in the vertical direction. Each handover device may be configured to be accessible by a substrate transfer device 3c of one of the two processing stations 3 and a substrate transfer device 3c of the other of the two processing stations 3, respectively.

[0047] exist Figure 1 In the example of FIG. 4 , the block G5 can be arranged in the interface station 4 in a manner of being located near the substrate transfer space 3b in the processing station 3. The block G5 can also be arranged in the processing station 3. The block G5 may include a plurality of handover devices (not shown) arranged in the vertical direction. Each handover device can be configured to be accessible by the substrate transfer device 3c and the substrate transfer devices 4a and 4b (described later) of the interface station 4, respectively.

[0048] The interface station 4 connects the processing station 3 and the exposure device to transfer the substrate W between the processing station 3 and the exposure device (not shown). The exposure device may be adjacent to the interface station 4 so as to be located on the opposite side of the interface station 4 from the processing station 3 .

[0049] The interface station 4 includes substrate transport devices 4a and 4b. The substrate transport devices 4a and 4b are respectively configured to be movable in, for example, the X direction (horizontal direction), the Y direction (horizontal direction), the Z direction (up and down direction), and the direction around the Z axis (θ direction). The substrate transport devices 4a and 4b may include a drive mechanism in at least one direction of the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ direction, or may include a drive mechanism in all directions as required.

[0050] At least one of the substrate transport devices 4b and 4c can transfer substrates W to and from the processing station 3, and can also transfer substrates W to and from the exposure device. The transfer of substrates W to and from the processing station 3 by the substrate transport devices 4b and 4c may also include the transfer of substrates W to and from the block G5.

[0051] The cleaning device for cleaning the surface of the substrate W and the aforementioned peripheral exposure device U3 may be provided in the interface station 4 at a position accessible by at least one of the substrate transfer devices 4b and 4c.

[0052] As described above, the inspection device may be provided in the cassette station 2. The inspection device may be provided in the processing station 3 or the interface station 4 at a position accessible by certain substrate transfer devices 3c, 4b, 4c provided inside the processing station 3 or the interface station 4.

[0053] The above-mentioned substrate processing system 1 includes a controller Ctr (control unit). The controller Ctr is configured to control the substrate processing system 1 partially or entirely.

[0054] [Details of the substrate transport device]

[0055] Next, refer to Figure 3 to Figure 8 The details of the substrate transfer device 3c will be described. In addition, the substrate transfer devices 2b, 2c, 4a, and 4b may also be configured in the same manner as the substrate transfer device 3c.

[0056] As described above, the substrate transport device 3c is configured to transport the substrate W to the blocks G1 to G5. Figure 3 As shown in the example, the block G2 may include a temporary placement unit UT for correcting the holding position of the substrate W when the transfer arm 10 holds the substrate W. Each unit (thin film processing device U1, heat treatment device U2, hydrophobic treatment device, peripheral exposure device U3, transfer device, etc.) constituting the blocks G1 to G5 may include an opening OP provided on the side wall facing the substrate transfer space 3b. The substrate transfer device 3c transfers the substrate W to and from each unit through the opening OP.

[0057] like Figure 3 and Figure 5As illustrated, the substrate transfer device 3c includes a lift table 3d, a rotation mechanism 3e, a drive mechanism DM (drive unit), at least one transfer arm 10, suction pumps P1 and P2, and sensors SE1 and SE2.

[0058] like Figure 3 As shown in the example, the lifting platform 3d supports the rotating mechanism 3e and the transport arm 10. The lifting platform 3d is configured to be able to move up and down along a Z-axis guide rail (not shown) extending in the Z-axis direction. The Z-axis guide rail is covered by a cover 3f. The cover 3f is configured to slide along a Y-axis guide rail 3g extending linearly in the Y-axis direction.

[0059] The rotating mechanism 3e is installed on the lifting platform 3d. The rotating mechanism 3e is configured to rotate the base 3h holding at least one transfer arm 10 around the Z axis (θ direction). The driving mechanism DM is configured to perform the up and down movement of the lifting platform 3d along the Z axis guide rail, the horizontal movement of the cover 3f along the Y axis guide rail 3g, the rotation of the base 3h by the rotating mechanism 3e, and the forward and backward movement of at least one transfer arm 10 relative to the base 3h (described later). The driving mechanism DM can be a rotary motor, a linear actuator, etc.

[0060] At least one transfer arm 10 is configured to be able to move forward and backward along the long side direction (X-axis direction) of the base 3h. In the case where the substrate transfer device 3c includes a plurality of transfer arms 10, the plurality of transfer arms 10 are held on the base 3h in an overlapping manner, and can be configured to be able to move forward and backward independently of the base 3h. The structure of one transfer arm 10 is described below, but the other transfer arms 10 can also be configured in the same manner.

[0061] like Figures 4 to 6 As illustrated, the transfer arm 10 includes a base portion 20 , a pair of arm portions 30 , four adsorption portions 40 , and two suction passages 50 .

[0062] The base 20 and the pair of arms 30 are flat plate-shaped. The pair of arms 30 are integrally connected to the base 20 in a manner extending from the base 20 in the same direction. Figure 4 As shown in the example, the pair of arm portions 30 extend in a substantially arc shape so as to surround the outer circumference of the substrate W.

[0063] like Figure 4 and Figure 5 As shown in the example, two connection holes 31 (31A, 31B) are provided in one arm 30A (first arm) of the pair of arm portions 30. The connection holes 31A and 31B extend in the thickness direction of the arm portion 30A so as to penetrate the arm portion 30A. The connection hole 31A is arranged on the front end side of the arm portion 30A, and the connection hole 31B is arranged on the base 20 side of the arm portion 30A.

[0064] Two connection holes 31 (31C, 31D) are provided in the other arm 30B (second arm) of the pair of arm portions 30. The connection holes 31C and 31D extend in the thickness direction of the arm portion 30B so as to penetrate the arm portion 30B. The connection hole 31C is arranged on the front end side of the arm portion 30B, and the connection hole 31D is arranged on the base 20 side of the arm portion 30B.

[0065] The four adsorption units 40 each include a suction port 41 for adsorbing the peripheral edge portion Wc of the back surface Wb of the substrate W. Two adsorption units 40A and 40B of the four adsorption units 40 are provided from the lower surface S2 (see FIG. 1 ) of the transfer arm 10. Figures 4 to 6 ) side is attached to the arm portion 30A. Two adsorption portions 40C and 40D of the four adsorption portions 40 are attached to the arm portion 30B from the lower surface S2 side of the transfer arm 10.

[0066] In addition, if Figure 5 As shown in the example, the separation distances between adjacent adsorption parts 40 may be substantially equal. Specifically, the separation distance L1 between the suction ports 41 of adjacent adsorption parts 40A and 40B, the separation distance L2 between the suction ports 41 of adjacent adsorption parts 40C and 40D, the separation distance L3 between the suction ports 41 of adjacent adsorption parts 40A and 40C, and the separation distance L4 between the suction ports 41 of adjacent adsorption parts 40B and 40D may all be substantially equal. The “substantially equal” mentioned here may include, for example, an error of about ±40 mm.

[0067] The adsorption portion 40A (first adsorption portion, first adsorption portion group) is located at a position corresponding to the connection hole 31A, and the adsorption portion 40B (third adsorption portion, second adsorption portion group) is located at a position corresponding to the connection hole 31B. That is, the adsorption portion 40A is arranged on the front end side of the arm portion 30A, and the adsorption portion 40B is arranged on the base 20 side of the arm portion 30A.

[0068] The adsorption portion 40C (second adsorption portion, first adsorption portion group) is located at a position corresponding to the connection hole 31C, and the adsorption portion 40D (fourth adsorption portion, second adsorption portion group) is located at a position corresponding to the connection hole 31D. That is, the adsorption portion 40C is arranged on the front end side of the arm portion 30B, and the adsorption portion 40D is arranged on the base 20 side of the arm portion 30B.

[0069] like Figure 7 and Figure 8As shown in the example, the adsorption unit 40 includes a disk body 42 and a holding member 43. The disk body 42 includes a substantially circular adsorption surface 42a for vacuum adsorption of the substrate W to hold the substrate W, and a suction port 41 provided substantially at the center of the adsorption surface 42a. The disk body 42 is mounted on a through hole 43a provided at the front end of the holding member 43 via a sealing member 44 (e.g., an O-ring). Therefore, the suction port 41 is fluidically connected to a flow path 43b provided inside the holding member 43 while being kept airtight.

[0070] A cylindrical connecting portion 45 is provided at the base end of the holding member 43. The inner space of the connecting portion 45 is fluidically connected to the flow path 43b. That is, the flow path 43b extends from the front end of the holding member 43 to the base end. The connecting portion 45 is installed in the connecting hole 31 by being inserted into the connecting hole 31 from the lower surface S2 side of the conveying arm 10. A sealing member 46 (for example, an O-ring) is installed on the outer periphery of the connecting portion 45. Therefore, the inner space of the connecting portion 45 and the flow path 43b are fluidically connected to the connecting hole 31 while being kept airtight.

[0071] like Figures 4 to 6 As shown in the example, the two suction passages 50 are grooves provided in the base 20 and the pair of arm portions 30. A cover member (not shown) is attached to the upper portion of the suction passage 50 by adhesive or the like. Therefore, the inside of the suction passage 50 is kept airtight.

[0072] One of the two suction passages 50, the suction passage 50A (first suction passage), extends on the upper surface S1 (one main surface) of the transfer arm 10. Specifically, Figure 5 As shown in the example, the suction passage 50A includes a first passage 51, a second passage 52, and a third passage 53. The first passage 51 extends in the width direction of the base 20. The second passage 52 branches from the first passage 51 and extends to the vicinity of the front end of the arm 30A. The third passage 53 branches from the first passage 51 and extends to the vicinity of the front end of the arm 30B.

[0073] The front end of the second passage 52 is connected to the connection hole 31A. The front end of the third passage 53 is connected to the connection hole 31C. Therefore, the suction passage 50A is fluidically connected to the suction ports 41 of the adsorption portions 40A and 40C.

[0074] The other suction passage 50B (second suction passage) of the two suction passages 50 extends on the upper surface S1 (one main surface) and the lower surface S2 (the other main surface) of the transfer arm 10. Specifically, Figure 5 and Figure 6As shown in the example, the suction passage 50B includes a first passage 54 (first part), a second passage 55 (first part), a third passage 56 (first part), and a fourth passage 57 (second part). The first passage 54 extends along the width direction of the base 20 on the upper surface S1 of the base 20. The second passage 55 branches from the first passage 54 and extends to the vicinity of the center of the arm 30A. The third passage 54 branches from the first passage 54 and extends to the vicinity of the center of the arm 30B. The fourth passage 57 extends along the width direction of the base 20 on the lower surface S2 of the base 20.

[0075] The front end of the second passage 55 is connected to the connection hole 31B. The front end of the third passage 56 is connected to the connection hole 31D. The end of the fourth passage 57 on the central side of the base 20 is connected to the first passage 54 via the through hole 58. The through hole 58 extends in the thickness direction of the base 20 so as to penetrate the base 20. Therefore, the suction passage 50B is fluidically connected to the suction port 41 of the adsorption portion 40B, 40D.

[0076] The suction pump P1 is connected to the first passage 51 via the pipe D1. The suction pump P1 is configured to operate based on a control signal from the controller Ctr to generate negative pressure at the suction ports 41 of the adsorption parts 40A and 40C through the suction passage 50A. The suction pump P2 is connected to the fourth passage 57 via the pipe D2. The suction pump P2 is configured to operate based on a control signal from the controller Ctr to generate negative pressure at the suction ports 41 of the adsorption parts 40B and 40D through the suction passage 50B.

[0077] The sensor SE1 (first sensor) is configured to detect the magnitude of the pressure in the pipe D1. The sensor SE1 is configured to send data on the magnitude of the detected pressure to the controller Ctr. The sensor SE2 (second sensor) is configured to detect the magnitude of the pressure in the pipe D2. The sensor SE2 is configured to send data on the magnitude of the detected pressure to the controller Ctr.

[0078] [Controller details]

[0079] The controller Ctr is configured to control the substrate processing system 1 partially or entirely. Fig. 9As illustrated, the controller Ctr has a reading unit M1, a storage unit M2, a processing unit M3, an indication unit M4, and a communication unit M5 as functional modules. Regarding these functional modules, the functions of the controller Ctr are divided into multiple modules just for convenience, which does not necessarily mean that the hardware constituting the controller Ctr is divided into such modules. Each functional module is not limited to being implemented by the execution of a program, and can also be implemented by a dedicated circuit (such as a logic circuit) or an integrated circuit (ASIC: Application Specific Integrated Circuit: Application Specific Integrated Circuit) integrated with the dedicated circuit.

[0080] The reading unit M1 is configured to read a program from a computer-readable recording medium RM. The recording medium RM records a program for operating each unit of the substrate processing system 1. The recording medium RM may be, for example, a semiconductor memory, an optical recording disk, a magnetic recording disk, or an optical magneto-recording disk. In addition, the following each unit of the substrate processing system 1 may include each unit of the driving mechanism DM, the suction pumps P1, P2, and the sensors SE1, SE2.

[0081] The storage unit M2 is configured to store various data. The storage unit M2 may store, for example, a program read from the recording medium RM in the reading unit M1, setting data input by an operator via an external input device (not shown), and the like. The storage unit M2 may also store, for example, data on processing conditions (processing recipes) for processing the substrate W. The storage unit M2 may also store, for example, data on the magnitude of pressure detected by the sensors SE1 and SE2.

[0082] The processing unit M3 is configured to process various data and can generate a control signal for operating each unit of the substrate processing system 1 based on the various data stored in the storage unit M2, for example.

[0083] For example, the processing unit M3 may execute a process of changing the moving speed of the transfer arm 10 by the driving mechanism DM based on the detection results of the sensors SE1 and SE2.

[0084] In addition, for example, when the back surface Wb of the substrate W is adsorbed by the suction ports 41 of the adsorption parts 40A and 40C, the pressure of the suction passage 50A is reduced to a value below the prescribed value. Similarly, when the back surface Wb of the substrate W is adsorbed by the suction ports 41 of the adsorption parts 40B and 40D, the pressure of the suction passage 50B is reduced to a value below the prescribed value. On the other hand, when the back surface Wb of the substrate W is not adsorbed by the suction ports 41 of at least one of the adsorption parts 40A and 40C due to warping of the substrate W, the suction ports 41 of at least one of the adsorption parts 40A and 40C are opened. Therefore, the suction passage 50A is evacuated by the suction pump P1, but the pressure of the suction passage 50A is still higher than the prescribed value. Similarly, when the back surface Wb of the substrate W is not adsorbed by the suction ports 41 of at least one of the adsorption parts 40B and 40D due to warping of the substrate W, the suction ports 41 of at least one of the adsorption parts 40B and 40D are opened. Therefore, even though the suction passage 50B is evacuated by the suction pump P2, the pressure in the suction passage 50B continues to be higher than the prescribed value.

[0085] Therefore, when the detection result of the sensor SE1 indicates that the pressure is below the predetermined value, the processing unit M3 can determine that the back surface Wb of the substrate W is being sucked by the suction ports 41 of the suction units 40A and 40C. Similarly, when the detection result of the sensor SE2 indicates that the pressure is below the predetermined value, the processing unit M3 can determine that the back surface Wb of the substrate W is being sucked by the suction ports 41 of the suction units 40B and 40D.

[0086] The processing unit M3 may control the driving mechanism DM to move the transport arm 10 at a predetermined speed V1 (first speed) when it is determined that the back side Wb of the substrate W is adsorbed by the suction ports 41 of the adsorption units 40A to 40D. The processing unit M3 may control the driving mechanism DM to move the transport arm 10 at a predetermined speed V2 (second speed) when it is determined that the back side Wb of the substrate W is adsorbed by the suction ports 41 of the adsorption units 40A and 40C but not by the other suction ports 41. Similarly, the processing unit M3 may control the driving mechanism DM to move the transport arm 10 at a speed V2 when it is determined that the back side Wb of the substrate W is adsorbed by the suction ports 41 of the adsorption units 40B and 40D but not by the other suction ports 41. Here, the speed V1 may be a transport speed set in the substrate transport device 3c. The speed V2 is a speed lower than the speed V1, for example, it may be about 50% to 90% of the speed V1.

[0087] When the back side Wb of the substrate W is adsorbed by the suction ports 41 of the adsorption portions 40A and 40C but not by the other suction ports 41, the adsorption portions 40A and 40C (first adsorption portion group) located at the front end side of the transfer arm 10 perform the adsorption function. On the other hand, when the back side Wb of the substrate W is adsorbed by the suction ports 41 of the adsorption portions 40B and 40D but not by the other suction ports 41, the adsorption portions 40B and 40D (second adsorption portion group) located at the base 20 side of the transfer arm 10 perform the adsorption function. In such a case, Figures 4 to 6 In the case of the embodiment of the transfer arm 10 illustrated, the speed V2 can be set to, for example, approximately 90% of the speed V1.

[0088] The processing unit M3 may control the driving mechanism DM so as not to move the transport arm 10 when the detection results of the sensors SE1 and SE2 indicate that the pressures are both higher than a predetermined value. That is, when the processing unit M3 determines that the back surface Wb of the substrate W is not adsorbed by the suction port 41 of the adsorption unit 40A to 40D, the transport arm 10 remains stopped. In this case, the processing unit M3 may report an alarm from a reporting unit (not shown). The reporting of the alarm by the reporting unit may be, for example, displaying an alarm (e.g., text, graphics, etc.) on a display (not shown), or issuing an alarm sound or an alarm guide from a speaker (not shown).

[0089] The processing unit M3 may, for example, also perform processing to change the moving speed of the conveying arm 10 by the driving mechanism DM based on the detection results of the sensors SE1 and SE2 and the moving direction of the conveying arm 10. The moving direction may, for example, include at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ-axis direction. For example, the processing unit M3 may move the conveying arm 10 at a speed V1 when the conveying arm 10 is moved along the Z-axis. For example, the processing unit M3 may move the conveying arm 10 at a speed V2 when the conveying arm 10 is moved along any one of the X-axis, the Y-axis, and the θ-direction.

[0090] For example, the processing unit M3 can pre-calculate the moving time of the conveying arm 10 to the destination when the conveying arm 10 is moved in at least two directions of the X-axis, the Y-axis, the Z-axis, and the θ direction, and select a path that allows the conveying arm 10 to reach the destination in the shortest time. Specifically, when it is set to move at a speed V1 in the Z-axis direction and at a speed V2 (for example, 60% of the speed V1) in the Z-axis direction, the processing unit M3 can pre-calculate the moving time for each of the first path that moves in a straight line to the destination and the second path that moves in the Z-axis direction and the X-axis direction, and select the path with the shortest moving time.

[0091] The instruction unit M4 is configured to transmit a control signal generated in the processing unit M3 to each unit of the substrate processing system 1 .

[0092] The hardware of the controller Ctr may be composed of, for example, one or more computers for control. Fig.10 As shown in the example, the controller Ctr may include a circuit C1 as a hardware structure. The circuit C1 may be composed of circuit elements. The circuit C1 may include, for example, a processor C2, a memory C3, a storage device C4, a driver C5, and an input / output port C6.

[0093] The processor C2 may be configured to execute a program in cooperation with at least one of the memory C3 and the storage device C4, and to perform input and output of signals via the input / output port C6, thereby realizing the above-mentioned functional modules. The memory C3 and the storage device C4 may function as the storage unit M2. The driver C5 may be a circuit configured to drive each part of the substrate processing system 1 respectively. The input / output port C6 may be configured to relay the input and output of signals between the driver C5 and each part of the substrate processing system 1.

[0094] The substrate processing system 1 may have one controller Ctr, or may have a controller group (control unit) composed of multiple controllers Ctr. When the substrate processing system 1 has a controller group, the above-mentioned functional modules may be implemented by one controller Ctr respectively, or may be implemented by a combination of two or more controllers Ctr. When the controller Ctr is composed of multiple computers (circuit C1), the above-mentioned functional modules may be implemented by one computer (circuit C1) respectively, or may be implemented by a combination of two or more computers (circuit C1). The controller Ctr may have multiple processors C2. In this case, the above-mentioned functional modules may be implemented by one processor C2 respectively, or may be implemented by a combination of two or more processors C2.

[0095] [Substrate transportation method]

[0096] Next, refer to Fig.11 A method of transporting the substrate W by the substrate transport device 3 c will be described.

[0097] First, the transfer arm 10 of the substrate transfer device 3c receives the substrate W from other devices or the like ( Fig.11 Then, the controller Ctr instructs the suction pumps P1 and P2 to evacuate the suction passage 50, thereby generating a negative pressure at the suction port 41 of the adsorption unit 40 ( Fig.11 Step S12).

[0098] In step S12, after the controller Ctr operates the suction pump P1 to generate negative pressure at the suction ports 41 of the adsorption parts 40A and 40C, the controller Ctr may operate the suction pump P2 to generate negative pressure at the suction ports 41 of the adsorption parts 40B and 40D. In this case, the back surface Wb of the substrate W is preferentially adsorbed by the suction ports 41 of the adsorption parts 40A and 40C (first adsorption part group) located at the front end side of the arm parts 30A and 30B. Therefore, compared with the case where the back surface Wb of the substrate W is adsorbed by the suction ports 41 of the adsorption parts 40B and 40D (second adsorption part group) located at the base 20 side of the arm parts 30A and 30B, there is a tendency that the substrate W tends to be easily maintained to be adsorbed and held by the transport arm 10. Therefore, even if inertial force acts on the substrate W when the transfer arm 10 moves in the extending direction of the arm portion 30 or centrifugal force acts on the substrate W when the transfer arm 10 rotates in the θ direction, the substrate W can be properly transferred.

[0099] Next, the controller Ctr determines whether the magnitudes of the pressures detected by the sensors SE1 and SE2 are both below a predetermined value ( Fig.11 In step S13 of the controller Ctr, when the controller Ctr determines that the pressure detected by both sensors SE1 and SE2 is below the specified value (in Fig.11 In step S13, the controller Ctr may control the driving mechanism DM to move the transfer arm 10 to the destination at a speed V1 ( Fig.11 When the transfer arm 10 reaches the destination at the speed V1, the transfer process of the substrate W is completed.

[0100] On the other hand, if the result of the controller Ctr's determination is that the pressures detected by both sensors SE1 and SE2 are not equal to or lower than the predetermined value (in Fig.11 In step S13, the controller Ctr determines whether the pressure detected by one of the sensors SE1 and SE2 is below a predetermined value ( Fig.11 Step S15).

[0101] When the controller Ctr determines that the pressure detected by one of the sensors SE1 and SE2 is less than the predetermined value (in Fig.11 In step S15, the controller Ctr may control the driving mechanism DM to move the transfer arm 10 to the destination at a speed V2 ( Fig.11 When the transport arm 10 reaches the destination at the speed V1, the transport process of the substrate W is completed. In addition, when the path of the transport arm 10 to the destination includes movement in the Z-axis direction, the transport arm 10 can also move at the speed V1 regarding the movement in the Z-axis direction.

[0102] On the other hand, if the controller Ctr determines that the pressure detected by one of the sensors SE1 and SE2 is not equal to or lower than the predetermined value (in Fig.11 In step S15, the controller Ctr controls the driving mechanism DM to keep the transfer arm 10 stopped ( Fig.11 In this case, the controller Ctr may also control a reporting unit (not shown) to report an alarm from the reporting unit. The above-mentioned process of conveying the substrate W is completed.

[0103] [effect]

[0104] According to the above example, the substrate W is sucked at at least one of the suction ports 41 of the first suction portion group (the suction portions 40A and 40C) and the suction ports 41 of the second suction portion group (the suction portions 40B and 40D) by suction through the suction passage 50. Therefore, even if the substrate W is warped, the substrate W is sucked and held at at least two suction portions 40. Therefore, even if the substrate W is warped and uneven, the substrate W can be properly transported by the transport arm 10.

[0105] According to the above example, when the pressure drop is detected by the sensor SE1, it can be determined that the substrate W is adsorbed by the suction port 41 of the first adsorption part group (adsorption parts 40A, 40C). Similarly, when the pressure drop is detected by the sensor SE2, it can be determined that the substrate W is adsorbed by the suction port 41 of the second adsorption part group (adsorption parts 40B, 40D). In this case, based on the detection results of the sensors SE1 and SE2, it is determined whether the substrate W is adsorbed by the suction port 41 of the first adsorption part group, the suction port 41 of the second adsorption part group, or the suction port 41 of the first adsorption part and the second adsorption part group. Therefore, by changing the moving speed of the conveying arm 10 according to the number of suction ports 41 adsorbing the substrate W, the substrate W can be properly conveyed while preventing the position of the substrate W relative to the conveying arm 10 from being offset, the substrate W from falling off the conveying arm 10, etc.

[0106] According to the above example, the moving speed of the transfer arm 10 can be controlled based on the moving direction of the transfer arm 10 in addition to the detection results of the sensors SE1 and SE2. In this case, by changing the moving speed of the transfer arm 10 in consideration of the magnitude of the inertial force acting on the substrate W in addition to the adsorption state of the substrate W, the substrate W can be appropriately transferred while preventing the position of the substrate W relative to the transfer arm 10 from being offset, the substrate W from falling off the transfer arm 10, etc.

[0107] According to the above example, when the detection results of the sensors SE1 and SE2 indicate that the back surface Wb of the substrate W is adsorbed by the suction ports 41 of the adsorption units 40A to 40D, the transport arm 10 can move at the speed V1. In this case, since the substrate W is adsorbed by the suction ports 41 of the four adsorption units 40A to 40D, it is difficult for the position of the substrate W to deviate from the transport arm 10 or for the substrate W to fall off from the transport arm 10. Therefore, by moving the transport arm 10 at a relatively fast speed V1, the substrate W can be efficiently transported.

[0108] In addition, when the substrate W is adsorbed by the suction ports 41 of two adsorption parts 40, the holding property of the substrate W relative to the transport arm 10 is lower than when it is adsorbed by the suction ports 41 of four adsorption parts 40. However, according to the above example, when the detection results of the sensors SE1 and SE2 indicate that the back surface Wb of the substrate W is adsorbed by the suction ports 41 of two adsorption parts 40 among the four adsorption parts 40, the transport arm 10 can move at a speed V2 that is slower than the speed V1. In this case, even when the substrate W is adsorbed by the suction ports 41 of two adsorption parts 40, the transport of the substrate W is not stopped as an adsorption error, and the substrate W can be properly transported while preventing the position of the substrate W relative to the transport arm 10 from being shifted or the substrate W from falling off the transport arm 10.

[0109] According to the above example, when it is determined that the substrate W is not adsorbed by the suction port 41 in the first adsorption unit group and the second adsorption unit group, the transfer arm 10 can be stopped as an adsorption error. In this case, it is possible to prevent the substrate W from being transferred when the holding performance of the substrate W with respect to the transfer arm 10 is significantly low.

[0110] According to the above example, the arms 30A and 30B can extend in the same direction from the base 20. The suction portion 40A can be arranged on the front end side of the arm 30A, the suction portion 40B can be arranged on the front end side of the arm 30B, the suction portion 40C can be arranged on the base 20 side of the arm 30A, and the suction portion 40D can be arranged on the base 20 side of the arm 30B. In this case, even if the substrate W is warped, the substrate W is suctioned and held at at least two suction portions 40. More specifically, in this case, the suction portions 40A and 40C constituting the first suction portion group can be located on the front end side of the arms 30A and 30B, respectively, and the suction portions 40B and 40D constituting the second suction portion group can be located on the base 20 side of the arms 30A and 30B, respectively. Therefore, the substrate W is suctioned at at least one of the front end side and the base 20 side of the arms 30A and 30B. Therefore, even if the substrate W is uneven such as warping, the substrate W can be appropriately transferred by the transfer arm 10 .

[0111] According to the above example, the suction passage 50A can be provided on the upper surface S1 side of the conveying arm 10. The suction passage 50B can include: first passage to third passage 54-56, the first passage to third passage 54-56 are provided on the upper surface S1 side of the conveying arm 10; and a fourth passage 57, which is connected to the first passage 54 through a through hole 58 provided on the conveying arm 10, and the fourth passage 57 is provided on the lower surface S2 side of the conveying arm 10. In this case, the suction passages 50A and 50B, which are suction passages 50 of different systems, pass through the upper surface S1 or the lower surface S2 of the conveying arm 10, and have independent fluid properties. Therefore, while the paths of the suction passages 50A and 50B are compacted, the substrate W can be independently adsorbed at the suction port 41 connected to the suction passage 50A and the suction port 41 connected to the suction passage 50B.

[0112] According to the above example, the driving mechanism DM can move the transfer arm 10 in at least one direction among the X-axis, the Y-axis, the Z-axis, and the θ direction. In this case, the transfer arm 10 can transfer the substrate W in various directions.

[0113] According to the above example, the transfer arm 10 can be moved along the Z axis at a speed V1. When the substrate W is transferred along the Z axis direction (vertical direction), it is not easy to cause the position of the substrate W relative to the transfer arm 10, the substrate W to fall off from the transfer arm 10, etc. Therefore, the substrate W can be efficiently transferred by moving the transfer arm 10 at a relatively fast speed V1.

[0114] On the other hand, when the substrate W is transported along any one of the X-axis, Y-axis, and θ-direction, it is easier to cause the position of the substrate W relative to the transport arm 10, the substrate W to fall off from the transport arm 10, etc. due to the inertial force acting on the substrate W than when the substrate W is transported along the Z-axis direction (vertical direction). However, according to the above example, the transport arm 10 can be moved along any one of the X-axis, Y-axis, and θ-direction at a speed V2 that is slower than the speed V1. In this case, the inertial force acting on the substrate W is weakened, so the substrate W can be properly transported while preventing the position of the substrate W relative to the transport arm 10, the substrate W from falling off from the transport arm 10, etc.

[0115] [Modifications]

[0116] All points disclosed in this specification should be considered as illustrative rather than restrictive. Various omissions, substitutions, and changes may be made to the above examples without departing from the scope of the claims and their gist.

[0117] (1) The substrate processing system 1 in the present disclosure is not limited to the above-mentioned structure or action. For example, in the above-mentioned example, it is described that the substrate W is transferred between the interface station 4 and the exposure device, but the substrate processing system 1 may not be directly connected to the exposure device. In this case, for example, after the substrate W is transported from the box station 2 to the processing station 3 and the required processing is performed, the substrate W can be transported to the box station 2 again to be transported to the outside. In addition, the substrate processing system 1 may not include any device among the devices exemplified as the processing device, and may not process the substrate W in the device.

[0118] (2) The substrate transport device 3c may also be configured as Figure 12 to Figure 14 More specifically, the substrate transfer device 3c includes arms 3i, 3j, a base 3k, and a support column 100. Fig.12 and Fig.13 As shown in the example, the front end of the arm 3i is connected to the base 3h in a manner that can rotate around the Z axis (θ direction). The front end of the arm 3j is connected to the base end of the arm 3i in a manner that can rotate around the Z axis (θ direction). The base end of the arm 3j is connected to the base 3k in a manner that can rotate around the Z axis (θ direction). By the mutual rotation of the arms 3i and 3j, the base 3h and the transport arm 10 move forward and backward relative to the base 3k.

[0119] like Fig.13 and Fig.14 As shown in the example, the support column 100 includes a lifting mechanism 101 and a slider 102. The lifting mechanism 101 is configured to move the slider 102 up and down. The lifting mechanism 101 can be composed of an endless belt 104 mounted on a pair of pulleys 103. In this case, the slider 102 can be connected to the endless belt 104. The slider 102 is connected to the base 3k via a connecting member 3l. Therefore, the transport arm 10 moves up and down via the slider 102, the connecting member 3l, the base 3k, and the arm parts 3i and 3j as the lifting mechanism 101 moves.

[0120] (3) Fig.15 As shown in the example, the substrate transport device 3c may be configured to evacuate the suction passages 50A and 50B by means of a suction pump P1, sensors SE1 and SE2, and valves VL1 and VL2. The suction pump P1 is connected to the first passage 51 via the pipe D1, and is connected to the fourth passage 57 via the pipe D2. The pipe D1 is provided with a sensor SE1 and a valve VL1. The pipe D2 is provided with a sensor SE2 and a valve VL2. The valves VL1 and VL2 are configured to open and close the pipes D1 and D2, respectively, according to control signals from the controller Ctr.

[0121] according to Fig.15In the example of FIG. 1 , the controller Ctr instructs the suction pump P1 and the valves VL1 and VL2 to evacuate the suction passages 50A and 50B while the valves VL1 and VL2 are open, so that a negative pressure is generated at the suction port 41 of the adsorption unit 40. At this time, when the substrate W is adsorbed at the suction port 41 of the adsorption units 40A to 40D, the detection pressures of the sensors SE1 and SE2 are both below the specified value, so the controller Ctr maintains the valves VL1 and VL2 in the open state. On the other hand, when the substrate W is adsorbed at the suction port 41 of the first adsorption unit group (adsorption units 40A and 40C) and the substrate W is not adsorbed at the suction port 41 of the second adsorption unit group (adsorption units 40B and 40D), the detection pressure of the sensor SE2 is higher than the specified value. Therefore, the controller Ctr maintains the valve VL1 in the open state and closes the valve VL2. Similarly, when the suction port 41 of the second suction part group (the suction parts 40B and 40D) adsorbs the substrate W and the suction port 41 of the first suction part group (the suction parts 40A and 40C) does not adsorb the substrate W, the detection pressure of the sensor SE1 is higher than the specified value. Therefore, the controller Ctr maintains the valve VL2 in an open state and closes the valve VL1. In addition, it may be set that the controller Ctr closes the valves VL1 and VL2 after a specified time has passed since the detection pressures of the sensors SE1 and SE2 become higher than the specified value.

[0122] (4) The two suction passages 50 may also be provided Fig.16 The structure shown in the example. In more detail, the suction passage 50A extends on the upper surface S1 of the conveying arm 10. The suction passage 50A includes a first passage 51, a second passage 52, and a third passage 53. The first passage 51 extends along the width direction of the base 20. The second passage 52 branches from the first passage 51 and extends to the vicinity of the front end of the arm 30A. The third passage 53 branches from the first passage 51 and extends to the vicinity of the center of the arm 30B.

[0123] The front end of the second passage 52 is connected to the connection hole 31A. The front end of the third passage 53 is connected to the connection hole 31D. Therefore, the suction passage 50A is fluidically connected to the suction ports 41 of the adsorption parts 40A and 40D. In other words, the adsorption parts 40A and 40D constituting the first adsorption part group are located on the diagonal lines of the arm parts 30A and 30B, respectively.

[0124] The suction passage 50B extends on the upper surface S1 and the lower surface S2 of the transport arm 10. The suction passage 50B includes a first passage 54, a second passage 55, a third passage 56, and a fourth passage 57. The first passage 54 extends along the width direction of the base 20 on the upper surface S1 of the base 20. The second passage 55 branches from the first passage 54 and extends to the vicinity of the center of the arm 30A. The third passage 54 extends from the base 20 to the vicinity of the center of the arm 30B outside the third passage 53 of the suction passage 50A. The fourth passage 57 extends along the width direction of the base 20 on the lower surface S2 of the base 20.

[0125] An end portion of the first passage 54 on the arm portion 30B side is connected to the fourth passage 57 via a through hole 58 .

[0126] The front end of the second passage 55 is connected to the connection hole 31B. The front end of the third passage 56 is connected to the connection hole 31C. The end of the third passage 56 close to the base 20 is connected to the fourth passage 57 via the through hole 59. The through holes 58 and 59 extend in the thickness direction of the base 20 in a manner penetrating the base 20. Therefore, the suction passage 50B is fluidically connected to the suction port 41 of the adsorption part 40B and 40C. In other words, the adsorption parts 40B and 40C constituting the second adsorption part group are respectively located on the diagonal lines of the arm parts 30A and 30B.

[0127] according to Fig.16 In the illustrated embodiment, even if the substrate W is warped, the substrate W is held by suction at at least two suction portions 40. Therefore, even if the substrate W is warped or uneven, the substrate W can be properly transported by the transport arm 10. Fig.16 In the illustrated embodiment, the adsorption parts 40A and 40D constituting the first adsorption part group are respectively located on the diagonal lines of the arm parts 30A and 30B, and the adsorption parts 40B and 40C constituting the second adsorption part group are respectively located on the other diagonal lines of the arm parts 30A and 30B. Therefore, even if centrifugal force acts on the substrate W when the transfer arm 10 rotates, the substrate W can be properly transferred.

[0128] (5) The two suction passages 50 may also be provided as Fig.17 The structure shown in the example. In more detail, the suction passage 50A extends on the upper surface S1 of the transport arm 10. The suction passage 50A includes a first passage 51, a second passage 52, and a third passage 53. The first passage 51 extends along the width direction of the base 20 on the arm 30A side of the base 20. The second passage 52 extends from the first passage 51 to the vicinity of the front end of the arm 30A. The third passage 53 branches and extends from the vicinity of the center of the second passage 52.

[0129] The front end of the second passage 52 is connected to the connection hole 31A. The front end of the third passage 53 is connected to the connection hole 31B. Therefore, the suction passage 50A is fluidically connected to the suction ports 41 of the adsorption parts 40A and 40B. In other words, the adsorption parts 40A and 40B constituting the first adsorption part group are both arranged on the arm part 30A.

[0130] The suction passage 50B extends on the upper surface S1 of the transport arm 10. The suction passage 50B includes a first passage 54, a second passage 55, and a third passage 56. The first passage 54 extends along the width direction of the base 20 on the arm 30B side of the base 20. The second passage 55 extends from the first passage 54 to the vicinity of the front end of the arm 30B. The third passage 56 branches from the vicinity of the center of the second passage 55 and extends.

[0131] The front end of the second passage 55 is connected to the connection hole 31C. The front end of the third passage 56 is connected to the connection hole 31D. Therefore, the suction passage 50B is fluidically connected to the suction ports 41 of the adsorption parts 40C and 40D. In other words, the adsorption parts 40C and 40D constituting the second adsorption part group are both arranged on the arm part 30B.

[0132] according to Fig.17 In the illustrated embodiment, the adsorption parts 40A and 40B constituting the first adsorption part group are located at the arm part 30A, and the adsorption parts 40C and 40D constituting the second adsorption part group are located at the arm part 30B. Therefore, even if the substrate W is warped, the substrate W is adsorbed and held at at least two adsorption parts 40. Therefore, even if the substrate W is uneven due to warping, the substrate W can be properly transported by the transport arm 10. In addition, when the substrate W is adsorbed by the suction port 41 of the adsorption parts 40A and 40B constituting the first adsorption part group or the suction port 41 of the adsorption parts 40C and 40D constituting the second adsorption part group, the speed V2 can be set to about 50%.

[0133] (6) Fig.18 As shown in the example, the transport arm 10 may include four suction passages 50 (50A to 50D). The suction passage 50A extends on the upper surface S1 of the transport arm 10. The suction passage 50A extends from the area on the arm portion 30A side of the base 20 to the vicinity of the front end of the arm portion 30A. The front end of the suction passage 50A is connected to the connection hole 31A.

[0134] The suction passage 50B extends on the upper surface S1 and the lower surface S2 of the transport arm 10. The suction passage 50B includes a portion extending from the lower surface S2 in the area on the side of the arm portion 30A in the base 20 and a portion extending from the upper surface S1 to the vicinity of the center of the arm portion 30A. These portions are connected by a through hole. The front end of the suction passage 50B is connected to the connection hole 31B. In addition, the suction passage 50B may extend on the upper surface S1 in a manner that does not intersect with other suction passages 50.

[0135] The suction passage 50C extends on the upper surface S1 of the transfer arm 10. The suction passage 50C extends from the area on the arm portion 30B side of the base 20 to the vicinity of the front end of the arm portion 30A. The front end of the suction passage 50C is connected to the connection hole 31C.

[0136] The suction passage 50D extends on the upper surface S1 and the lower surface S2 of the transport arm 10. The suction passage 50D includes a portion extending from the lower surface S2 in the area on the side of the arm portion 30B in the base 20 and a portion extending from the upper surface S1 to the vicinity of the center of the arm portion 30B. These portions are connected by a through hole. The front end of the suction passage 50D is connected to the connection hole 31D. In addition, the suction passage 50D may extend on the upper surface S1 in a manner that does not intersect with other suction passages 50.

[0137] according to Fig.18 In the illustrated embodiment, the substrate W is sucked by the suction ports 41 of at least two suction portions 40 among the plurality of suction portions 40A to 40D by suction through the plurality of suction passages 50A to 50D. That is, even if the substrate W is warped, the substrate W is sucked and held by at least two suction portions 40. Therefore, even if the substrate W is warped and uneven, the transfer arm 10 can properly transfer the substrate W.

[0138] exist Fig.18 In the illustrated embodiment, the substrate transport device 3c may include a plurality of suction pumps. Each suction pump may be connected to a corresponding suction passage 50A to 50D, and a negative pressure may be generated at the suction port 41 of each adsorption portion 40A to 40D through each suction passage 50A to 50D. In addition, the substrate transport device 3c may include a plurality of sensors configured to detect the pressure in each suction passage 50A to 50D.

[0139] exist Fig.18In the illustrated embodiment, when the detection results of the multiple sensors indicate that the substrate W is adsorbed by the suction ports 41 of three or more adsorption parts 40 among the multiple adsorption parts 40, the transport arm 10 may be moved at a speed V1. When the detection results of the multiple sensors indicate that the substrate W is adsorbed by the suction ports 41 of two adsorption parts 40 among the multiple adsorption parts 40, the transport arm 10 may be moved at a speed V2 slower than the speed V1. When the detection results of the multiple sensors indicate that the substrate W is adsorbed by the suction ports 41 of one or less adsorption parts 40 among the multiple adsorption parts 40, the transport arm 10 may not be moved.

[0140] [Other examples]

[0141] Example 1. An example of a substrate transport device comprises: a transport arm; a driving unit that moves the transport arm; and a control unit that is configured to control the driving unit. The transport arm includes: a base; at least one arm, at least one arm connected to the base in a manner extending from the base and extending in a manner surrounding the periphery of the substrate; a plurality of adsorption units, the plurality of adsorption units are provided on at least one arm, and the plurality of adsorption units respectively include suction ports for adsorbing the peripheral portion of the back side of the substrate; and a plurality of suction passages, the plurality of suction passages are provided on at least one arm. The plurality of adsorption units include: a first adsorption unit group including a first adsorption unit and a second adsorption unit; and a second adsorption unit group including a third adsorption unit and a fourth adsorption unit. The plurality of suction passages include: a first suction passage connected to the suction ports of the first adsorption unit and the second adsorption unit; and a second suction passage connected to the suction ports of the third adsorption unit and the fourth adsorption unit. In this case, the substrate is sucked at at least one of the suction ports of the first suction unit group (the first suction unit and the second suction unit) and the suction ports of the second suction unit group (the third suction unit and the fourth suction unit) by suction through the first suction passage and the second suction passage. Therefore, even if the substrate is warped, the substrate is sucked and held at at least two suction units. Therefore, even if the substrate is warped and uneven, the substrate can be properly transported by the transport arm.

[0142] Example 2. Alternatively, the device of Example 1 further includes: a first sensor configured to detect the pressure in the first suction passage; and a second sensor configured to detect the pressure in the second suction passage, and the control unit is configured to execute a process of causing the driving unit to change the moving speed of the conveying arm based on the detection results of the first sensor and the second sensor. In this case, when the first sensor detects a pressure drop, it is determined that the substrate is adsorbed at the suction port of the first adsorption unit group. Similarly, when the second sensor detects a pressure drop, it is determined that the substrate is adsorbed at the suction port of the second adsorption unit group. Therefore, based on the detection results of the first sensor and the second sensor, it is determined whether the substrate is adsorbed by the suction port of the first adsorption unit group, the suction port of the second adsorption unit group, or the suction ports of the first adsorption unit and the second adsorption unit group. Therefore, by changing the moving speed of the conveying arm according to the number of suction ports adsorbing the substrate, the substrate can be appropriately conveyed while preventing the position of the substrate relative to the conveying arm from being offset, the substrate from falling off from the conveying arm, etc.

[0143] Example 3. Alternatively, in the device of Example 2, the control unit is configured to execute a process of causing the driving unit to change the moving speed of the conveying arm based on the detection results of the first sensor and the second sensor and the moving direction of the conveying arm. In addition, the magnitude of the inertial force acting on the substrate may differ depending on the moving direction of the conveying arm. However, according to Example 2, the moving speed of the conveying arm is controlled based on the moving direction of the conveying arm in addition to the detection results of the first sensor and the second sensor. Therefore, the substrate can be properly conveyed while changing the moving speed of the conveying arm in consideration of the magnitude of the inertial force acting on the substrate in addition to the adsorption condition of the substrate, thereby preventing the position of the substrate relative to the conveying arm, the substrate from falling off the conveying arm, etc.

[0144] Example 4. Alternatively, in the device of Example 2 or Example 3, the control unit is configured to control the drive unit to move the transport arm at the first speed when the detection results of the first sensor and the second sensor determine that the back side of the substrate is adsorbed by the suction ports of the first adsorption unit to the fourth adsorption unit. In this case, since the substrate is adsorbed by the suction ports of the four adsorption units, it is not easy for the position of the substrate to deviate from the transport arm or for the substrate to fall off the transport arm. Therefore, the substrate can be efficiently transported by moving the transport arm at the relatively fast first speed.

[0145] Example 5. Alternatively, in the device of Example 4, the control unit is configured to: when the detection results of the first sensor and the second sensor are that the pressure of the suction passage of one of the first suction passage and the second suction passage is higher than a predetermined threshold value, and the pressure of the suction passage of the other of the first suction passage and the second suction passage is below the threshold value, control the drive unit to move the conveying arm at a second speed slower than the first speed. In this case, the substrate is adsorbed by the suction ports of the two adsorption parts. Therefore, compared with the case where the substrate is adsorbed by the suction ports of the four adsorption parts, the retention of the substrate relative to the conveying arm is low. However, in the fifth example, the conveying arm is moved at the second speed slower than the first speed. Therefore, the inertial force acting on the substrate is weakened, so even when the substrate is adsorbed by the suction ports of the two adsorption parts, the conveying of the substrate is not stopped as an adsorption error, and the substrate can be properly conveyed while preventing the position of the substrate relative to the conveying arm from being offset, the substrate from falling off from the conveying arm, etc.

[0146] Example 6. Alternatively, in the device of Example 2, the control unit is configured to: when the detection results of the first sensor and the second sensor determine that the back side of the substrate is adsorbed by the suction port of the first adsorption unit group and the suction port of the second adsorption unit group, execute the process of controlling the drive unit to move the transport arm at a first speed; when the detection results of the first sensor and the second sensor determine that the back side of the substrate is adsorbed by the suction port of the first adsorption unit group or the suction port of the second adsorption unit group, execute the process of controlling the drive unit to move the transport arm at a second speed slower than the first speed; when the detection results of the first sensor and the second sensor determine that the back side of the substrate is adsorbed by one or less of the suction ports of the first adsorption unit group and the second adsorption unit group, execute the process of controlling the drive unit not to move the transport arm. In this case, the same effect as the device of Examples 4 and 5 can be obtained. In addition, in the case of Example 6, when the substrate is adsorbed by the suction port of one or less of the adsorption units, the transport of the substrate is stopped as an adsorption error. Therefore, it is possible to prevent the substrate from being transported when the retention of the substrate relative to the transport arm is significantly low.

[0147] Example 7. Alternatively, in any device of Examples 1 to 6, at least one arm includes a first arm and a second arm extending from the base in the same direction as a pair, the first suction portion is arranged at the front end side of the first arm, the second suction portion is arranged at the front end side of the second arm, the third suction portion is arranged at the base side of the first arm, and the fourth suction portion is arranged at the base side of the second arm. In the case of Example 7, even if the substrate is warped, the substrate is suctioned and held at at least two suction portions. More specifically, in the case of Example 7, the first suction portion and the second suction portion constituting the first suction portion group are respectively located at the front end side of the first arm and the second arm, and the third suction portion and the fourth suction portion constituting the second suction portion group are respectively located at the base side of the first arm and the second arm. Therefore, the substrate is suctioned at at least one of the front end side and the base side of the first arm and the second arm. Therefore, even if the substrate is uneven due to warping, the substrate can be properly transported by the transport arm. In particular, when the substrate is adsorbed at the front end side of the first arm and the second arm, it is easier to maintain the substrate adsorbed and held by the transfer arm than when the substrate is adsorbed at the base side of the first arm and the second arm. Therefore, even if an inertial force acts on the substrate when the transfer arm moves in the extending direction of the first arm and the second arm, or a centrifugal force acts on the substrate when the transfer arm rotates, the substrate can be properly transferred.

[0148] Example 8. Alternatively, in any device of Examples 1 to 6, at least one arm portion includes a first arm portion and a second arm portion as a pair extending from the base portion toward the same direction, the first adsorption portion is arranged at the front end side of the first arm portion, the second adsorption portion is arranged at the base side of the second arm portion, the third adsorption portion is arranged at the front end side of the second arm portion, and the fourth adsorption portion is arranged at the base side of the first arm portion. In the case of Example 8, even if the substrate is warped, etc., the substrate is adsorbed and held at at least two adsorption portions. Therefore, even if the substrate is uneven with warping, etc., the substrate can be properly transported by the transport arm. In addition, in the case of Example 8, the first adsorption portion and the second adsorption portion constituting the first adsorption portion group are respectively located on the diagonal lines of the first arm portion and the second arm portion, and the third adsorption portion and the fourth adsorption portion constituting the second adsorption portion group are respectively located on the other diagonal lines of the first arm portion and the second arm portion. Therefore, even if centrifugal force acts on the substrate when the transport arm rotates, the substrate can be properly transported.

[0149] Example 9. Alternatively, in the device of Example 7 or Example 8, the first suction passage is disposed on the main surface side of one side of the conveying arm, and the second suction passage includes: a first portion, which is disposed on the main surface side of one side of the conveying arm; and a second portion, which is connected to the first portion through a through hole disposed in the conveying arm, and the second portion is disposed on the main surface side of the other side of the conveying arm. In this case, the first suction passage and the second suction passage, which are suction passages of different systems, pass through each main surface of the conveying arm, and have independent fluid properties. Therefore, while the paths of the first suction passage and the second suction passage are compacted, the substrate can be independently adsorbed at the suction port connected to the first suction passage and the suction port connected to the second suction passage.

[0150] Example 10. Alternatively, in the apparatus of Examples 1 to 6, at least one arm may include a first arm and a second arm as a pair extending from a base toward the same direction, wherein the first suction portion is disposed on the front end side of the first arm, the second suction portion is disposed on the base side of the first arm, the third suction portion is disposed on the front end side of the second arm, and the fourth suction portion is disposed on the base side of the second arm. In the case of Example 10, even if the substrate is warped, etc., the substrate is suctioned and held at at least two suction portions. More specifically, in the case of Example 10, the first suction portion and the second suction portion constituting the first suction portion group are located in the first arm, and the third suction portion and the fourth suction portion constituting the second suction portion group are located in the second arm. Therefore, even if the substrate is warped, etc., the substrate is suctioned and held at at least two suction portions. Therefore, even if the substrate is uneven due to warping, etc., the substrate can be properly transported by the transport arm.

[0151] Example 11. Alternatively, in any of the devices of Examples 1 to 10, the driving unit may be configured to move the transport arm along at least one of an X-axis, a Y-axis, a Z-axis, and a θ direction around the Z-axis, wherein the X-axis extends in the horizontal direction, the Y-axis extends in the horizontal direction and is orthogonal to the X-axis, and the Z-axis is orthogonal to both the X-axis and the Y-axis and extends in the vertical direction. In this case, the transport arm can transport the substrate in various directions.

[0152] Example 12. Alternatively, in the device of Example 11, the control unit is configured to: execute a process of controlling the drive unit so that the conveying arm moves along the Z axis at a first speed, and execute a process of controlling the drive unit so that the conveying arm moves along any one of the X axis, the Y axis, and the θ direction at a second speed slower than the first speed. In the case of conveying the substrate along the Z axis direction (vertical direction), it is not easy to cause the position deviation of the substrate relative to the conveying arm, the substrate to fall off from the conveying arm, etc. Therefore, the substrate can be efficiently conveyed by moving the conveying arm at a relatively fast first speed. On the other hand, in the case of conveying the substrate along the X axis direction, the Y axis direction, or the θ direction, compared with the case of conveying the substrate along the Z axis direction (vertical direction), it is easier to cause the position deviation of the substrate relative to the conveying arm, the substrate to fall off from the conveying arm, etc. due to the inertial force acting on the substrate. However, in Example 12, in this case, the conveying arm is moved at a second speed slower than the first speed. Therefore, the inertial force acting on the substrate is weakened, so the substrate can be appropriately transported while preventing the position of the substrate relative to the transport arm, the substrate from falling off the transport arm, and the like.

[0153] Example 13. Alternatively, another example of a substrate transport device includes: a transport arm; a drive unit that moves the transport arm; and a control unit that is configured to control the drive unit. The transport arm includes: a base; at least one arm, at least one arm connected to the base in a manner extending from the base and extending in a manner surrounding the periphery of the substrate; a plurality of adsorption units, the plurality of adsorption units are provided on at least one arm, and the plurality of adsorption units respectively include suction ports for adsorbing the peripheral portion of the back side of the substrate; and a plurality of suction passages, the plurality of suction passages are provided on at least one arm. The plurality of suction passages are respectively connected to the suction ports of different plurality of adsorption units. In this case, the substrate is adsorbed at the suction ports of at least two adsorption units among the plurality of adsorption units by using the suction through the plurality of suction passages. That is, even if the substrate is warped, etc., the substrate is adsorbed and held at at least two adsorption units. Therefore, even if the substrate is uneven with warping, etc., the substrate can be properly transported by the transport arm.

[0154] Example 14. Alternatively, the device of Example 13 may further include a plurality of sensors configured to detect pressures in a plurality of suction paths, respectively, and the control unit may be configured to execute a process of causing the driving unit to change the moving speed of the conveying arm based on the detection results of the plurality of sensors. In this case, the same effect as that of the device of Example 2 can be obtained.

[0155] Example 15. Alternatively, in the device of Example 14, the control unit is configured to: when the detection results of the multiple sensors determine that the back side of the substrate is adsorbed by the suction ports of three or more adsorption units among the multiple adsorption units, the control unit controls the driving unit to move the transport arm at a first speed; when the detection results of the multiple sensors determine that the back side of the substrate is adsorbed by the suction ports of two adsorption units among the multiple adsorption units, the control unit controls the driving unit to move the transport arm at a second speed slower than the first speed; when the detection results of the multiple sensors determine that the back side of the substrate is adsorbed by the suction ports of less than one adsorption unit among the multiple adsorption units, the control unit controls the driving unit not to move the transport arm. In this case, the same effect as the device of Example 6 can be obtained.

[0156] Example 16. An example of a substrate transporting method is a method in which a substrate is transported by a transport arm pair provided in a substrate transporting device, and a plurality of processing modules are configured to process the substrate. The transport arm includes: a base; at least one arm, at least one arm is connected to the base in a manner extending from the base, and at least one arm extends in a manner surrounding the periphery of the substrate; a plurality of adsorption portions, the plurality of adsorption portions are provided on at least one arm, and the plurality of adsorption portions respectively include suction ports for adsorbing the peripheral portion of the back side of the substrate; and a plurality of suction passages, the plurality of suction passages are provided on at least one arm. The plurality of adsorption portions include: a first adsorption portion group, which includes a first adsorption portion and a second adsorption portion; and a second adsorption portion group, which includes a third adsorption portion and a fourth adsorption portion. The plurality of suction passages include: a first suction passage, which is connected to the suction ports of the first adsorption portion and the second adsorption portion; and a second suction passage, which is connected to the suction ports of the third adsorption portion and the fourth adsorption portion. The substrate transport method includes: a first step of detecting the pressure of the first suction passage by a first sensor; a second step of detecting the pressure of the second suction passage by a second sensor; and a third step of changing the moving speed of the transport arm based on the detection results of the first sensor and the second sensor. In this case, the same effect as the apparatus of Examples 1 and 2 can be obtained.

[0157] In Example 17, it is also possible that in the method of Example 16, the third step includes: when the detection results of the first sensor and the second sensor are that the back side of the substrate is adsorbed by the suction port of the first adsorption part group and the suction port of the second adsorption part group, the conveying arm is moved at a first speed; when the detection results of the first sensor and the second sensor are that the back side of the substrate is adsorbed by the suction port of the first adsorption part group or the suction port of the second adsorption part group, the conveying arm is moved at a second speed slower than the first speed; and when the detection results of the first sensor and the second sensor are that the back side of the substrate is adsorbed by one or less of the suction ports of the first adsorption part group and the second adsorption part group, the conveying arm is not moved. In this case, the same effect as the device of Example 6 can be obtained.

[0158] Description of Reference Numerals

[0159] 1: substrate processing system; 3c: substrate transport device; 10: transport arm; 20: base; 30: arm; 30A: arm (first arm); 30B: arm (second arm); 40: adsorption part; 40A: adsorption part (first adsorption part, first adsorption part group); 40B: adsorption part (third adsorption part, second adsorption part group); 40C: adsorption part (second adsorption part, first adsorption part group); 40D: adsorption part (fourth adsorption part, second adsorption part group); 41: suction port; 50: suction passage; 50A: suction passage (first suction passage); 50B: suction passage (second attraction passage); 54: first passage (first part); 55: second passage (first part); 56: third passage (first part); 57: fourth passage (second part); 58: through hole; Ctr: controller (control part); DM: driving mechanism (driving part); S1: upper surface (main surface of one side); S2: lower surface (main surface of the other side); SE1: sensor (first sensor); SE2: sensor (second sensor); V1: speed (first speed); V2: speed (second speed); W: substrate; Wb: back side; Wc: peripheral part.

Claims

1. A substrate transport device, comprising: transfer arm; A driving unit that moves the conveying arm; as well as a control unit configured to control the driving unit, in, The conveying arm comprises: base; at least one arm portion connected to the base portion in a manner extending from the base portion and extending in a manner surrounding an outer circumference of the base plate; a plurality of adsorption parts, the plurality of adsorption parts being provided on the at least one arm part, and the plurality of adsorption parts respectively including a suction port for adsorbing a peripheral edge portion of the back surface of the substrate; and a plurality of suction passages, the plurality of suction passages being disposed in the at least one arm, The plurality of adsorption parts include: A first adsorption part group, which includes a first adsorption part and a second adsorption part; and The second adsorption part group includes a third adsorption part and a fourth adsorption part, The plurality of suction paths include: A first suction passage connected to the suction ports of the first adsorption portion and the second adsorption portion; and A second suction passage is connected to the suction ports of the third suction portion and the fourth suction portion.

2. The substrate transport device according to claim 1, wherein: Also available: a first sensor configured to detect pressure in the first suction passage; and a second sensor configured to detect a pressure in the second suction passage, The control unit is configured to execute a process of causing the drive unit to change a moving speed of the transfer arm based on detection results of the first sensor and the second sensor.

3. The substrate transport device according to claim 2, wherein: The control unit is configured to execute a process of causing the drive unit to change a moving speed of the transfer arm based on detection results of the first sensor and the second sensor and a moving direction of the transfer arm.

4. The substrate transport device according to claim 2, wherein: The control unit is configured to control the drive unit to move the transfer arm at a first speed when the detection results of the first sensor and the second sensor determine that the suction port from the first adsorption unit to the fourth adsorption unit adsorbs the back side of the substrate.

5. The substrate transporting device according to claim 4, wherein: The control unit is configured to control the drive unit to move the conveying arm at a second speed slower than the first speed when the detection results of the first sensor and the second sensor determine that the pressure of the suction passage of one of the first suction passage and the second suction passage is higher than a prescribed threshold and the pressure of the suction passage of the other of the first suction passage and the second suction passage is below the threshold.

6. The substrate transporting device according to claim 2, wherein: The control unit is composed of: When the detection results of the first sensor and the second sensor are that the back side of the substrate is adsorbed by the suction port of the first adsorption unit group and the suction port of the second adsorption unit group, a process of controlling the driving unit to move the transfer arm at a first speed is executed, When the detection results of the first sensor and the second sensor are that the back side of the substrate is adsorbed by the suction port of the first adsorption unit group or the suction port of the second adsorption unit group, a process of controlling the driving unit to move the transport arm at a second speed slower than the first speed is executed, When the detection results of the first sensor and the second sensor indicate that the back side of the substrate is adsorbed by one or more of the suction ports of the first adsorption unit group and the second adsorption unit group, a process of controlling the drive unit so as not to move the transfer arm is executed.

7. The substrate transporting device according to claim 1, wherein: The at least one arm portion includes a first arm portion and a second arm portion as a pair extending from the base portion toward the same direction, The first adsorption portion is arranged at the front end side of the first arm portion, The second adsorption portion is arranged at the front end side of the second arm portion, The third adsorption portion is arranged on the base side of the first arm portion, The fourth adsorption portion is disposed on the base side of the second arm portion.

8. The substrate transporting device according to claim 1, wherein: The at least one arm portion includes a first arm portion and a second arm portion as a pair extending from the base portion toward the same direction, The first adsorption portion is arranged at the front end side of the first arm portion, The second adsorption portion is arranged on the base side of the second arm portion, The third suction portion is arranged at the front end side of the second arm portion, The fourth adsorption portion is disposed on the base side of the first arm portion.

9. The substrate transporting device according to claim 7 or 8, wherein: The first suction passage is provided on one main surface side of the conveying arm. The second suction path comprises: A first portion provided on a main surface side of one of the transfer arms; and The second portion communicates with the first portion via a through hole provided in the transfer arm, and the second portion is provided on the other main surface side of the transfer arm.

10. The substrate transporting device according to claim 1, wherein: The at least one arm portion includes a first arm portion and a second arm portion as a pair extending from the base portion toward the same direction, The first adsorption portion is arranged at the front end side of the first arm portion, The second adsorption portion is arranged on the base side of the first arm portion, The third suction portion is arranged at the front end side of the second arm portion, The fourth adsorption portion is disposed on the base side of the second arm portion.

11. The substrate transporting device according to claim 1, wherein: The driving unit is configured to move the conveying arm along at least one of an X-axis, a Y-axis, a Z-axis, and a θ direction around the Z-axis, wherein the X-axis extends in a horizontal direction, the Y-axis extends in a horizontal direction and is orthogonal to the X-axis, and the Z-axis is orthogonal to both the X-axis and the Y-axis and extends in a vertical direction.

12. The substrate transporting device according to claim 11, wherein: The control unit is composed of: executing a process of controlling the driving unit so that the transfer arm moves along the Z axis at a first speed, A process of controlling the driving unit so that the transfer arm moves along any one of the X-axis, the Y-axis, and the θ direction at a second speed that is slower than the first speed is executed.

13. A substrate transporting device comprising: transfer arm; A driving unit that moves the conveying arm; as well as a control unit configured to control the driving unit, in, The conveying arm comprises: base; at least one arm portion connected to the base portion in a manner extending from the base portion and extending in a manner surrounding an outer circumference of the base plate; a plurality of adsorption parts, the plurality of adsorption parts being provided on the at least one arm part, and the plurality of adsorption parts respectively including a suction port for adsorbing a peripheral edge portion of the back surface of the substrate; and A plurality of suction passages are provided on the at least one arm portion, and the plurality of suction passages are respectively connected to the suction ports of different plurality of adsorption portions.

14. The substrate transporting device according to claim 13, wherein: further comprising a plurality of sensors configured to respectively detect the pressures in the plurality of suction paths, The control unit is configured to execute a process of causing the drive unit to change a moving speed of the transfer arm based on detection results of the plurality of sensors.

15. The substrate transporting device according to claim 14, wherein: The control unit is composed of: When the detection results of the plurality of sensors indicate that the back side of the substrate is adsorbed by the suction ports of three or more adsorption units among the plurality of adsorption units, a process of controlling the driving unit to move the transfer arm at a first speed is executed, When the detection results of the multiple sensors indicate that the back side of the substrate is adsorbed by the suction ports of two of the multiple adsorption units, a process of controlling the driving unit to move the transport arm at a second speed that is slower than the first speed is executed, When the detection results of the plurality of sensors indicate that the back surface of the substrate is adsorbed by the suction port of one or less adsorption units, a process of controlling the drive unit so as not to move the transfer arm is executed.

16. A substrate transporting method, comprising: a substrate transporting device having a transport arm that transports the substrate to each of a plurality of processing modules configured to process the substrate; The conveying arm comprises: base; at least one arm portion, the at least one arm portion being connected to the base portion in a manner extending from the base portion, and the at least one arm portion extending in a manner surrounding an outer circumference of the base plate; A plurality of adsorption parts, each of which is provided on the at least one arm and includes a suction port for adsorbing a peripheral edge portion of the back side of the substrate; as well as A plurality of suction passages, wherein the plurality of suction passages are arranged on the at least one arm portion, and the plurality of adsorption portions include: A first adsorption part group, which includes a first adsorption part and a second adsorption part; and The second adsorption part group includes a third adsorption part and a fourth adsorption part, The plurality of suction paths include: A first suction passage connected to the suction ports of the first adsorption portion and the second adsorption portion; and a second suction passage connected to the suction ports of the third suction portion and the fourth suction portion, The substrate transport method comprises: In a first step, a first sensor is used to detect the pressure of the first suction passage; In a second step, a second sensor is used to detect the pressure of the second suction passage; and In a third step, a moving speed of the transfer arm is changed based on the detection results of the first sensor and the second sensor.

17. The substrate transporting method according to claim 16, wherein: The third process comprises: When the detection results of the first sensor and the second sensor indicate that the back side of the substrate is adsorbed by the suction ports of the first adsorption unit group and the suction ports of the second adsorption unit group, the transfer arm is moved at a first speed; When the detection results of the first sensor and the second sensor indicate that the back side of the substrate is adsorbed by the suction port of the first adsorption unit group or the suction port of the second adsorption unit group, the transfer arm is moved at a second speed that is slower than the first speed; and When the detection results of the first sensor and the second sensor indicate that the back surface of the substrate is adsorbed by one or more of the suction ports of the first adsorption unit group and the second adsorption unit group, the transfer arm is not moved.

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