Electronic equipment and vapor chamber thereof

Abstract

The invention provides electronic equipment and a vapor chamber thereof. The vapor chamber comprises a first cover plate, a second cover plate, a first intermediate plate and a second intermediate plate, a first containing cavity is formed between the first cover plate and the first middle plate, a second containing cavity is formed between the side, away from the first cover plate, of the first middle plate and the second middle plate, and a third containing cavity is formed between the side, away from the first middle plate, of the second middle plate and the second cover plate. A first liquid guide part is arranged in the first containing cavity, a second liquid guide part is arranged in the second containing cavity, a third liquid guide part is arranged in the third containing cavity, and heat conduction media are arranged in the first containing cavity, the second containing cavity and the third containing cavity. Compared with a traditional vapor chamber, the vapor chamber provided by the embodiment of the invention has the advantages that multiple layers of accommodating cavities are additionally arranged, meanwhile, the number of the vapor chamber layers is increased, heat can be quickly transmitted and diffused in a three-dimensional manner (in the thickness direction and the plane direction), and the vapor chamber performance of the vapor chamber is greatly improved.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation structures of electronic equipment, and in particular to an electronic equipment and a heat spreader thereof. Background Art

[0002] As electronic products have more and more functions and higher power, the heat generation of products is becoming more and more serious. VC temperature plate has a capillary structure and cooling medium inside. When the coolant changes phase, it absorbs or releases the latent heat of phase change, so the heat from the heat source can be moved to a relatively low temperature position. It is currently an ideal solution to solve the heat dissipation problem of various electronic products.

[0003] The heat spreader in the prior art generally has a structure in which a liquid containing cavity is formed between two metal plates. The heat spreader has limited heat dissipation performance and can no longer meet the heat dissipation requirements of electronic equipment. Summary of the invention

[0004] A first aspect of an embodiment of the present application provides a heat spreader, which includes a first cover plate, a second cover plate, a first middle plate and a second middle plate; a first accommodating chamber is formed between the first cover plate and the first middle plate, a second accommodating chamber is formed between the side of the first middle plate facing away from the first cover plate and the second middle plate, and a third accommodating chamber is formed between the side of the second middle plate facing away from the first middle plate and the second cover plate; a first liquid guiding member is provided in the first accommodating chamber, a second liquid guiding member is provided in the second accommodating chamber, a third liquid guiding member is provided in the third accommodating chamber, and a heat conducting medium is provided in the first accommodating chamber, the second accommodating chamber and the third accommodating chamber.

[0005] In a second aspect, an embodiment of the present application provides an electronic device, which includes a heating device and the heat sink described in the above embodiment, wherein the heating device is in contact with an outer surface of the heat sink.

[0006] The heat spreader provided in the embodiment of the present application has a multi-layer accommodating cavity added compared to the traditional heat spreader, and at the same time the number of heat spreader layers is increased, which can quickly transfer and diffuse heat in a three-dimensional manner (both in the thickness direction and in the plane direction), thereby greatly improving the heat spreader's heat spreader performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0008] Figure 1It is a front structural schematic diagram of an embodiment of a heat spreader for electronic equipment of the present application;

[0009] Figure 2 yes Figure 1 A schematic diagram of the back structure of the heat spreader in the embodiment;

[0010] Figure 3 yes Figure 2 A schematic diagram of the cross-sectional structure of the vapor chamber at AA in the embodiment;

[0011] Figure 4 yes Figure 2 Schematic diagram of the structure disassembly of the heat sink in the embodiment;

[0012] Figure 5 is a schematic cross-sectional view of the structure of another embodiment of the vapor chamber of the present application;

[0013] Figure 6 is a schematic cross-sectional view of the structure of another embodiment of the vapor chamber of the present application;

[0014] Figure 7 It is a structural schematic diagram of an embodiment of the electronic device of the present application;

[0015] Figure 8 yes Figure 7 A schematic cross-sectional view of the structure of the electronic device at position BB in the embodiment;

[0016] Fig. 9 It is a schematic diagram of the structural composition block diagram of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION

[0017] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0018] The terms "first", "second", and "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", and "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of the present application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. The terms "including" and "having" in the embodiments of the present application and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or components inherent to these processes, methods, products, or devices.

[0019] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0020] As used herein, "electronic devices" (or simply "terminals") include, but are not limited to, devices configured to receive / send communication signals via a wireline connection (e.g., via a public switched telephone network (PSTN), a digital subscriber line (DSL), a digital cable, a direct cable connection, and / or another data connection / network) and / or via a wireless interface (e.g., for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). Communication terminals configured to communicate via a wireless interface may be referred to as "wireless communication terminals", "wireless terminals" or "mobile terminals". Examples of mobile terminals include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that may combine cellular radiotelephones with data processing, fax, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, organizers, calendars, and / or global positioning system (GPS) receivers; and conventional laptop and / or palmtop receivers or other electronic devices that include radiotelephone transceivers. A mobile phone is an electronic device equipped with a cellular communication module.

[0021] The present application embodiment provides a heat sink structure, please refer to Figures 1 to 4 , Figure 1 It is a front structural schematic diagram of an embodiment of a heat spreader for electronic equipment of the present application; Figure 2 yes Figure 1 A schematic diagram of the back structure of the heat spreader in the embodiment, Figure 3 yes Figure 2 A schematic diagram of the cross-sectional structure of the vapor chamber at AA in the embodiment; Figure 4 yes Figure 2 Schematic diagram of the structure of the heat spreader in the embodiment. It should be noted that the heat spreader in the present application can be used for heat dissipation of electronic devices, and the electronic devices may include mobile phones, tablet computers, laptops, wearable devices, etc. The heat spreader 100 for electronic devices includes but is not limited to the following structures: a first cover plate 110, a second cover plate 120, a first middle plate 130, and a second middle plate 140.

[0022] Specifically, the first cover plate 110, the first middle plate 130, the second middle plate 140 and the second cover plate 120 may be stacked in sequence. A first accommodating cavity 101 is formed between the first cover plate 110 and the first middle plate 130, a second accommodating cavity 102 is formed between the side of the first middle plate 130 away from the first cover plate 110 and the second middle plate 140, and a third accommodating cavity 103 is formed between the side of the second middle plate 140 away from the first middle plate 130 and the second cover plate 120; wherein a first liquid guide 1001 is provided in the first accommodating cavity 101, a second liquid guide 1002 is provided in the second accommodating cavity 102, and a third liquid guide 1003 is provided in the third accommodating cavity 103.

[0023] A heat-conducting medium (not shown) is disposed in the first accommodation chamber 101, the second accommodation chamber 102 and the third accommodation chamber 103. Optionally, the heat-conducting medium may be a liquid heat-dissipating medium, such as water or oil, which is not specifically limited here.

[0024] Optionally, the first cover plate 110, the second cover plate 120, the first middle plate 130 and the second middle plate 140 may be made of metal or alloy, such as stainless steel, copper and its alloys, aluminum and its alloys, etc. The material of the first liquid guide 1001, the second liquid guide 1002 and the third liquid guide 1003 may be selected from any one of copper mesh, fiber, non-woven fabric or foam.

[0025] Optionally, see Figure 3 and Figure 4In this embodiment, a plurality of first support columns 111 are disposed in the first accommodating cavity 101 of the heat spreader 100. The plurality of first support columns 111 are integrally formed with the first cover plate 110. Of course, in some other embodiments, the plurality of first support columns 111 may be integrally formed with the first intermediate plate 130, which is not specifically limited here. The plurality of first support columns 111 are used to support the first liquid guide member 1001, so as to fix the first liquid guide member 1001. The plurality of first support columns 111 may be formed by integrally stamping, integrally etching, or integrally injection molding with the first cover plate 110.

[0026] Optionally, a plurality of second support columns 112 are provided in the second accommodating cavity 102. The plurality of second support columns 112 are integrally structured with the first intermediate plate 130. Of course, in some other embodiments, the plurality of second support columns 112 may be integrally structured with the second intermediate plate 140, which is not specifically limited here. The plurality of second support columns 112 are used to support the second liquid guide member 1002, so as to realize the positioning and fixing of the second liquid guide member 1002. The plurality of second support columns 112 may be formed with the second intermediate plate 140 by integral etching, integral stamping, or integral injection molding.

[0027] Please continue reading Figure 3 In this embodiment, a plurality of third support columns 113 are disposed in the third accommodating cavity 103 of the heat spreader. The plurality of third support columns 113 are integrally structured with the second cover plate 120, and the plurality of third support columns 113 are used to support the third liquid guide member 1003, so as to fix the third liquid guide member 1003. Of course, in some other embodiments, the plurality of third support columns 113 may be integrally structured with the second intermediate plate 140, see Figure 5 , Figure 5 It is a schematic cross-sectional view of the structure of another embodiment of the heat spreader of the present application. In this embodiment, a plurality of third support columns 113 are an integral structure with the second middle plate 140. Among them, a plurality of third support columns 113 are formed with the second middle plate 140 or the second cover plate 120 by integral etching, integral stamping or integral injection molding. The first cover plate 110 and the second cover plate 120 can be a groove structure formed by a stamping or etching process for accommodating corresponding liquid guides, and the adjacent plates (the plate body is the general term for the first cover plate, the second cover plate, the first middle plate and the second middle plate) can be connected around the edge by welding, for example, between the first cover plate and the first middle plate, between the first middle plate and the second middle plate, and between the second middle plate and the second middle plate. The gap in the middle is the first accommodating cavity (first liquid injection layer), the second accommodating cavity (second liquid injection layer) and the third accommodating cavity (third liquid injection layer).

[0028] The technical solution in the embodiment of the present application creatively changes the structure of the traditional VC with two layers of metal sandwiching a layer of liquid absorbing material into a structure of N layers of metal sandwiching N-1 layers of liquid absorbing material (liquid guide). Thereby, the one liquid injection layer of the traditional VC is increased to multiple liquid injection layers. Each liquid injection layer can be provided with a liquid injection port. Compared with the traditional heat spreader, the heat spreader of this structure adds multiple layers of accommodating cavities, and at the same time increases the number of layers of the heat spreader, which can quickly transfer and diffuse heat in a three-dimensional manner (both in the thickness direction and in the plane direction), greatly improving the heat spreader's heat spread performance.

[0029] Optionally, see Figure 4 In the embodiment of the present application, the projection areas of adjacent accommodating cavities of the heat spreader in the thickness direction may be different, that is, the projections of the first accommodating cavity 101, the second accommodating cavity 102 and the third accommodating cavity 103 in the thickness direction of the heat spreader in the present embodiment do not completely overlap. That is, each layer of metal (the first cover plate 110, the second cover plate 120, the first middle plate 130 and the second middle plate 140) is not designed according to equal area, and can be adjusted according to actual conditions. Because the internal space of electronic devices such as mobile phones is limited, if the multi-layer structure of the entire heat spreader is designed according to an equal area structure, the thickness of the whole machine will be too large, or too much internal space of the electronic device will be occupied. Therefore, the number of layers (the number of layers here refers to the number of metal plate layers) can generally be reduced at the bottleneck position of the thickness of the whole machine, such as setting three or even two layers in a local position, and setting four or more layers in some positions. The number of layers can be adjusted according to specific circumstances, and the size of each layer of the accommodating cavity can also be adjusted according to specific circumstances. In this way, the heat dissipation performance of the heat spreader can be maximized within the limited space of the entire machine, and the purpose of occupying less space and achieving maximum heat dissipation efficiency can be achieved.

[0030] In addition, the support columns in the adjacent accommodating chambers may be Figure 5 In some other embodiments, the support columns in adjacent accommodating cavities may not be arranged in a one-to-one correspondence. For example, the support columns may be designed to have different cross-sectional areas or different densities. In order to increase the support strength of adjacent accommodating cavities in thickness, the distribution density of the support columns inside the adjacent accommodating cavities with a larger projection area in the thickness direction may be: the density of the support columns at the positions corresponding to the adjacent accommodating cavities is greater than the density of the support columns at other positions, or the density of the support columns at the positions corresponding to the adjacent accommodating cavities is greater than the cross-section of the support columns at other positions. The advantage of this arrangement is that, on the one hand, the support strength of the adjacent accommodating cavities in thickness can be guaranteed, and on the other hand, at other positions where a greater support strength is not required (i.e., positions without adjacent accommodating cavities), the density of the support columns can be made smaller or the area smaller, thereby reducing the manufacturing difficulty.

[0031] Since the internal heat source (generally the processor chip) of electronic devices such as mobile phones is relatively small, it is impossible to quickly transfer heat to the traditional VC, which limits the heat-averaging rate of the traditional VC. This affects the heat dissipation of the entire electronic device. The internal heat source of the electronic device is generally distributed in the middle and upper part of the VC. Compared with the heat-averaging structure of the traditional VC, the structural scheme in this embodiment is equivalent to adding several small VCs between the heat source and the large VC. The small VC can quickly spread the heat of the heat source, which can greatly help the large VC to better perform heat-averaging. The heat dissipation efficiency of the entire machine is significantly improved. The part with the multi-layer injection structure can only exist in part of the VC. This is because the internal space of the electronic device is limited. Generally, the middle and lower part of the VC is the thickness bottleneck position of the entire machine, so the middle and lower part of the VC is generally the thinner the better. The technical solution of this embodiment creatively adjusts the single-layer injection structure of the traditional VC to a multi-layer injection structure without increasing the thickness of the entire electronic device, so that the original one-layer heat-averaging structure becomes a multi-layer three-dimensional heat-averaging. The heat-averaging performance of the VC is significantly improved, which helps to solve the problem of rapid heat dissipation of electronic devices, and at the same time will not occupy too much internal space of the electronic device.

[0032] See also Figure 6 , Figure 6 1 is a schematic diagram of a cross-sectional structure of another embodiment of the heat spreader of the present application. Different from the aforementioned embodiment, the heat spreader 100 in this embodiment further includes a third cover plate 150, wherein a fourth accommodation chamber 104 is formed between the third cover plate 150 and the side of the second cover plate 120 away from the second intermediate plate 140, and a heat-conducting medium and a fourth liquid guide member 1004 are arranged in the fourth accommodation chamber 104; a plurality of fourth support columns 114 are arranged in the fourth accommodation chamber 104, and the plurality of fourth support columns 114 are integrally structured with the second cover plate 120 or the third cover plate 150 (it may also be that the plurality of fourth support columns 114 are partially integrally structured with the second cover plate 120 and partially integrally structured with the third cover plate 150), and the plurality of fourth support columns 114 are used to support the fourth liquid guide member 1004. The structure, material and other features of the fourth liquid guide member 1004 and the third cover plate 150 may correspond to the same components in the aforementioned embodiment, and will not be described in detail here.

[0033] The embodiments of the present application only schematically show a structure in which three layers of liquid guide parts are sandwiched between four layers of metal plates and a structure in which four layers of liquid guide parts are sandwiched between five layers of metal plates. In some other embodiments, those skilled in the art may set the number of layers in different areas according to actual heat dissipation requirements and spatial stacking conditions of electronic equipment, and design a heat spreader with more layers, which will not be listed or described in detail here.

[0034] Furthermore, the present application also provides an electronic device, please refer to Figure 7 and Figure 8 , Figure 7is a structural diagram of an embodiment of the electronic device of the present application, Figure 8 yes Figure 7 The schematic cross-sectional view of the structure of the electronic device at position BB in the embodiment, the electronic device in this embodiment may include a display screen 30, a housing 10, a control circuit board 20, a middle frame 40 and a heat spreader 100.

[0035] Optionally, the display screen 30 in this embodiment cooperates with the housing 10 (which can be a back cover) and the middle frame 40 to form a receiving cavity 1000, and the control circuit board 20 is arranged in the receiving cavity 1000, and the control circuit board 200 is electrically connected to the display screen 30, and is used to control the display surface (working state) of the display screen 30. Among them, a chip 21 can be provided on the control circuit board 20, and the chip 21 and the display screen 30 can both be heating devices of electronic devices. The heat spreader 100 is bonded to the heating device, and one end of the heat spreader 100 is in contact with the heating device (in this embodiment, the chip 21 is used as an example of a heat source). In order to achieve better results, TIMs material (Thermal Interface Material, a general term for materials used to coat between heat dissipation devices and heating devices to reduce the contact thermal resistance between them) can also be used between the heat source and the heat spreader to enhance the heat transfer to the heat spreader, and the other end of the heat spreader extends to the cold area of ​​the electronic device, such as an area away from the heat source, or is bonded to structural parts such as the middle frame to achieve the purpose of heat dissipation.

[0036] See also Fig. 9 , Fig. 9 It is a schematic diagram of the structural composition block diagram of an embodiment of an electronic device of the present application. The electronic device can be a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. The mobile phone is used as an example in the diagram of this embodiment. The structure of the electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (which may be the display screen 30 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which may be the chip 21 in the above embodiment) and a power supply 990, etc. Among them, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960 and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to provide power to the entire electronic device 10.

[0037] Specifically, the RF circuit 910 is used to receive and send signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, which may specifically include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting user approach signals, distance signals, etc.; the speaker 961 and the microphone (or microphone) 962 are connected to the processor 980 through the audio circuit 960 for receiving and sending sound signals; the wifi module 970 is used to receive and transmit wifi signals, and the processor 980 is used to process data information of the electronic device. For the specific structural features of the electronic device, please refer to the relevant description of the above embodiment, which will not be described in detail here.

[0038] The electronic device in this embodiment has a heat spreader structure with multiple layers of cavities compared to traditional heat spreaders, and at the same time increases the number of layers of the heat spreader, which can quickly transfer and diffuse heat in a three-dimensional manner (both in the thickness direction and in the plane direction), greatly improving the heat spreader's heat spreader performance.

[0039] The above descriptions are only some embodiments of the present application, and do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A heat sink, characterized in that: The heat spreader includes a first cover plate, a second cover plate, a first middle plate and a second middle plate; a first accommodating chamber is formed between the first cover plate and the first middle plate, a second accommodating chamber is formed between the side of the first middle plate facing away from the first cover plate and the second middle plate, and a third accommodating chamber is formed between the side of the second middle plate facing away from the first middle plate and the second cover plate; a first liquid guiding member is provided in the first accommodating chamber, a second liquid guiding member is provided in the second accommodating chamber, a third liquid guiding member is provided in the third accommodating chamber, and a heat conducting medium is provided in the first accommodating chamber, the second accommodating chamber and the third accommodating chamber.

2. The vapor chamber according to claim 1, characterized in that: A plurality of first support columns are disposed in the first accommodating cavity. The plurality of first support columns are integrally formed with the first cover plate and / or the first intermediate plate. The plurality of first support columns are used to support the first liquid guiding member.

3. The heat sink according to claim 2, characterized in that: A plurality of second support columns are disposed in the second accommodating cavity, the plurality of second support columns are integrally structured with the first intermediate plate and / or the second intermediate plate, and the plurality of second support columns are used to support the second liquid guiding member; And / or, a plurality of third support columns are disposed in the third accommodating cavity, the plurality of third support columns are integrally formed with the second intermediate plate and / or the second cover plate, and the plurality of third support columns are used to support the third liquid guiding member.

4. The heat sink according to claim 3, characterized in that: The projection areas of adjacent accommodating cavities in the thickness direction are different.

5. The vapor chamber according to claim 4, characterized in that: The support columns in adjacent accommodating chambers are arranged in one-to-one correspondence.

6. The vapor chamber according to claim 4, characterized in that: For the adjacent accommodating cavity with a larger projected area in the thickness direction, the distribution density of the support columns inside it is as follows: the density of the support columns at the position corresponding to the adjacent accommodating cavity is greater than the density of the support columns at other positions, and / or the density of the support columns at the position corresponding to the adjacent accommodating cavity is greater than the cross-sectional area of ​​the support columns at other positions.

7. The vapor chamber according to any one of claims 1 to 6, characterized in that: The first liquid guiding member, the second liquid guiding member and the third liquid guiding member are made of any one of copper mesh, fiber, non-woven fabric or foam.

8. The vapor chamber according to claim 1, characterized in that: The projections of the first accommodating chamber, the second accommodating chamber and the third accommodating chamber in the thickness direction of the heat spreader do not completely overlap.

9. The vapor chamber according to claim 1, characterized in that: The heat spreader also includes a third cover plate, and a fourth accommodating chamber is formed between the third cover plate and the side of the second cover plate facing away from the second middle plate, and a heat-conducting medium and a fourth liquid-conducting member are arranged in the fourth accommodating chamber; a plurality of fourth support columns are arranged in the fourth accommodating chamber, and the plurality of fourth support columns are integrated with the second cover plate and / or the third cover plate, and the plurality of fourth support columns are used to support the fourth liquid-conducting member.

10. An electronic device, characterized in that: The electronic device comprises a heating device and the vapor chamber according to any one of claims 1 to 9, wherein the heating device is in contact with an outer surface of the vapor chamber.

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