A structural member and an electronic device

Abstract

This application discloses a structural component and an electronic device, relating to the field of electronic equipment technology, to address the technical problem of ESD (Electrostatic Discharge) easily generated by carbon fiber composite materials. The structural component includes a structural component body and a conductive portion. The structural component body includes an insulating component and carbon fiber filaments, with the carbon fiber filaments embedded within the insulating component and a portion of the filaments protruding outside the insulating component. At least a portion of the conductive portion contacts and is electrically connected to the exposed carbon fiber filaments. Due to the excellent conductivity of the carbon fiber filaments themselves, the conductive portion on the structural component body can conduct electricity with the exposed carbon fiber filaments, forming a conductive path, thereby allowing the carbon fiber filaments within the structural component to serve as a path for discharging electrostatic current. Simultaneously, the conductive portion within the structural component can also serve as a point of electrical connection. When a large current passes through the structural component, the electrostatic current can be discharged outwards through the carbon fiber filaments and the conductive portion, thereby reducing the ESD problem.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to a structural component and an electronic device. Background Technology

[0002] Currently, the frames or casings of electronic devices such as mobile phones, tablets, and laptops are mostly made of composite materials such as aluminum alloys, magnesium alloys, stainless steel, and titanium alloys, which makes it impossible to reduce the weight of these devices. Although carbon fiber composites have the characteristics of high strength, light weight, and good flexibility, their electrical conductivity is poor. When a large current passes through, carbon fiber composites are prone to electrostatic discharge (ESD), which can cause electronic components in the device to burn out. Summary of the Invention

[0003] This application provides a structural component and an electronic device to solve the technical problem that carbon fiber composite materials are prone to ESD.

[0004] To achieve the above objectives, this application adopts the following technical solution:

[0005] A first aspect of this application provides a structural member including a structural member body and a conductive portion. The structural member body includes an insulating member and carbon fiber filaments, the carbon fiber filaments being embedded within the insulating member, with a portion of the carbon fiber filaments protruding outside the insulating member. At least a portion of the conductive portion is in contact with and electrically connected to the exposed carbon fiber filaments.

[0006] As described above, this embodiment of the application exposes a portion of the carbon fiber filaments embedded within the insulating component. Simultaneously, a conductive portion is provided on the structural component body, with at least a portion of the conductive portion in contact with the carbon fiber filaments. In this way, due to the excellent conductivity of the carbon fiber filaments themselves, the conductive portion on the structural component body can conduct with the exposed carbon fiber filaments, forming a conductive path. This allows the carbon fiber filaments within the structural component to serve as a path for discharging electrostatic current. Furthermore, the conductive portion within the structural component can also serve as a point of electrical connection. When a large current passes through the structural component, the electrostatic current can be discharged outwards through the carbon fiber filaments and the conductive portion, thereby reducing ESD problems.

[0007] In some embodiments, a groove is provided on the surface of the structural component body, and a portion of the carbon fiber filaments protrudes from the groove. At least a portion of the conductive part is disposed within the groove of the structural component body, and the conductive part is in contact with and electrically connected to the exposed carbon fiber filaments within the groove. Thus, by providing a groove on the surface of the structural component body, a portion of the carbon fiber filaments embedded within the insulating component can be exposed within the groove. At this time, at least a portion of the conductive part can be disposed within the groove and in contact with the exposed carbon fiber filaments, thereby ensuring good contact between the conductive part and the exposed carbon fiber filaments under the shaping effect of the groove on the conductive part.

[0008] In some embodiments, multiple carbon fiber filaments are provided. The groove includes a groove wall, a groove bottom, and a groove space enclosed by the groove wall and the groove bottom. At least one of the groove wall, the groove bottom, and the groove space has exposed carbon fiber filaments. Thus, the carbon fiber filaments in the groove can be exposed at least one of the groove wall, the groove bottom, and the groove space, allowing the conductive part to contact the exposed carbon fiber filaments at multiple locations on the structural body, thereby improving the reliability of the contact between the conductive part and the carbon fiber filaments.

[0009] In some embodiments, the surface of the structural component body is provided with multiple grooves, and the structural component body includes a first wall and a second wall connected to each other. A portion of the grooves are located on the first wall, and another portion of the grooves are located on the second wall. Thus, some grooves can be located on the first wall of the structural component body, allowing conductive parts to be located there. Similarly, other grooves can be located on the second wall of the structural component body, allowing conductive parts to also be located there. This increases the number of electrical connection points in the structural component, facilitating electrical connections between the structural component and electronic devices.

[0010] In some embodiments, the outer surface of the exposed carbon fiber filament protrudes from the bottom of the groove, and the conductive part contacts and is electrically connected to the outer surface of the carbon fiber filament protruding from the bottom of the groove. Thus, the outer surface of the exposed carbon fiber filament in the groove can be a structure that protrudes from the bottom of the groove, allowing the structure to be grooved using methods such as ion beam etching or photolithography.

[0011] In some embodiments, the exposed carbon fiber filaments have a first cut surface flush with the groove wall, and the conductive part is in contact with and electrically connected to the first cut surface of the carbon fiber filaments. Thus, the first cut surface of the exposed carbon fiber filaments in the groove can be flush with the groove wall, allowing the structural component to be grooved using methods such as polishing, grinding, or wire drawing.

[0012] In some embodiments, the exposed carbon fiber filaments have a second cut surface that is flush with the bottom of the groove, and the conductive part is in contact with and electrically connected to the second cut surface of the carbon fiber filaments. Thus, the second cut surface of the exposed carbon fiber filaments in the groove can be flush with the bottom of the groove, which also allows the structural component to be grooved by methods such as polishing, grinding, or wire drawing.

[0013] In some embodiments, the groove further includes a partition wall connected to the bottom of the groove and spaced apart from the groove wall. The exposed carbon fiber filaments have a third sectional surface, which is flush with the sidewall of the partition wall. The conductive part is in contact with and electrically connected to the third sectional surface of the carbon fiber filaments. Thus, the third sectional surface of the exposed carbon fiber filaments in the groove can be flush with the sidewall of the partition wall, allowing the structure to be grooved using methods such as ion beam etching, photolithography, polishing, grinding, or wire drawing.

[0014] In some embodiments, the conductive part includes a conductive layer and a base layer. The base layer is disposed within a groove in the structural body and is in contact with and electrically connected to the exposed carbon fiber filaments. The conductive layer fills the groove in the structural body and is in contact with and electrically connected to the base layer. Thus, the exposed carbon fiber filaments can contact and be electrically connected to the base layer, and the conductive layer can contact and be electrically connected to the base layer, thereby forming a three-layer load-bearing structure of carbon fiber filaments, base layer, and conductive layer. This improves the reliability of the connection between the conductive part and the carbon fiber filaments and prevents detachment between them.

[0015] In some embodiments, the exposed carbon fiber filaments have an uneven surface, and the groove includes a groove wall and a groove bottom. An undercoat is deposited on the groove wall and groove bottom and contacts the uneven surface of the exposed carbon fiber filaments. This roughens the surface of the carbon fiber filaments, making it uneven, thereby increasing the specific surface area of ​​the carbon fiber filaments and improving the bonding strength between the undercoat and the carbon fiber filaments.

[0016] In some embodiments, an alloy is formed by fusing the interface between the conductive layer and the substrate. This improves the bonding strength between the conductive layer and the substrate, making it less likely for the conductive layer to detach from the substrate.

[0017] In some embodiments, the conductive layer is made of tin, bismuth, gallium, or indium. Tin, bismuth, gallium, or indium are low-melting-point metals that can conformally bond with carbon fiber filaments in a liquid state and can conformally fill grooves. After hardening and shaping, they can also serve as electrical connection points, allowing the structural component to be electrically connected to external electronic devices.

[0018] In some implementations, the underlayer material includes chromium, nickel, titanium, copper, iron, or aluminum. Thus, chromium, nickel, titanium, copper, iron, or aluminum can be fused with tin, bismuth, gallium, or indium to form an alloy, thereby improving the bonding strength between the conductive layer and the underlayer.

[0019] In some embodiments, the structural component further includes a connector disposed on and electrically connected to the conductive portion. This connector facilitates electrical connection between the structural component and external electronic devices.

[0020] In some implementations, the connector includes solder pads, conductive springs, or conductive silicone. Thus, different connector structures can be selected depending on the structure of the electronic device.

[0021] In some embodiments, the structural component further includes a metal plating layer deposited on the outer surface of the structural component body, with the conductive portion electrically connected to the metal plating layer. This electrical connection between the conductive portion and the metal plating layer allows the metal plating layer of the structural component to serve as a reference ground for electronic devices, thereby enabling the electronic devices to be grounded through the metal plating layer.

[0022] In some embodiments, the structural component also includes graphene embedded within the insulating component, with the graphene in contact with the carbon fiber filaments. Thus, graphene possesses excellent thermal conductivity, allowing the structural component to serve as a good thermal conductive medium.

[0023] In some implementations, the structural component is the mid-frame or back cover of the electronic device. Thus, the structural component can serve as the mid-frame or back cover of the electronic device, thereby enabling electrical connection between the structural component and the electronic components within the electronic device, thus reducing ESD issues.

[0024] A second aspect of this application provides an electronic device, which includes a circuit board, a connector, and a structural component as described in the above embodiments. The connector is electrically connected between the circuit board and the structural component. The structural component of this electronic device has the same technical effects as the structural component of the first aspect described above, and will not be repeated here.

[0025] In some embodiments, the connector is disposed on and electrically connected to the circuit board. The connector on the circuit board is electrically connected to a conductive part on the structural component. Thus, the connector can be disposed on the circuit board, and the circuit board can be electrically connected to the conductive part on the structural component through the connector, thereby realizing conductivity between the circuit board and the structural component.

[0026] In some embodiments, the electronic device further includes a mid-frame, which comprises a connected mid-plate and a frame, the mid-plate and the frame being made of the aforementioned structural components. A conductive portion is disposed on the mid-plate, and a connector is disposed at the center of the circuit board and electrically connected to the circuit board. The connector on the circuit board is electrically connected to the conductive portion on the mid-plate. Thus, the connector can be disposed on the circuit board, and the mid-plate can have conductive portions corresponding to the positions of the connectors, thereby enabling electrical conduction between the mid-plate and the circuit board through the electrical connection between the connector and the conductive portion.

[0027] In some embodiments, the electronic device further includes a mid-frame, which comprises a connected mid-plate and a frame, the mid-plate and the frame being made of the aforementioned structural components. Conductive portions are disposed on the frame, and connectors are disposed at the edge of the circuit board and electrically connected to the circuit board. The connectors on the circuit board are electrically connected to the conductive portions on the frame. Thus, the connectors can be disposed on the circuit board, and the frame can have conductive portions corresponding to the positions of the connectors, thereby enabling electrical conduction between the frame and the circuit board through the electrical connection between the connectors and the conductive portions.

[0028] In some embodiments, the connector is disposed on the structural member and electrically connected to the conductive part. The circuit board is electrically connected to the connector on the structural member. Thus, the connector can also be disposed on the structural member, and the circuit board can be electrically connected to the connector on the structural member, thereby realizing conductivity between the circuit board and the structural member.

[0029] In some embodiments, the electronic device further includes a mid-frame, which comprises a connected mid-plate and a frame, the mid-plate and the frame being made of the aforementioned structural components. A conductive portion is disposed on the mid-plate, and a connector is disposed on the mid-plate and electrically connected to the conductive portion. The circuit board is electrically connected to the connector on the mid-plate. Thus, the connector can also be disposed on the mid-plate of the aforementioned mid-frame, allowing the circuit board to be electrically connected to and conduct electricity with the mid-plate via the connector.

[0030] In some embodiments, the electronic device further includes a mid-frame, which comprises a connected mid-plate and a frame, the mid-plate and the frame being made of the aforementioned structural components. A conductive portion is disposed on the frame, a connector is disposed on the frame and electrically connected to the conductive portion, and the circuit board is electrically connected to the connector on the frame. Thus, the connector can also be disposed on the frame of the mid-frame, allowing the circuit board to be electrically connected to and conduct electricity with the frame via the connector. Attached Figure Description

[0031] Figure 1 A three-dimensional structural schematic diagram of an electronic device provided in an embodiment of this application;

[0032] Figure 2 for Figure 1 A schematic diagram of the exploded structure of an electronic device in China;

[0033] Figure 3 for Figure 2 A three-dimensional structural diagram of the mid-frame of an electronic device;

[0034] Figure 4 for Figure 3 The portion of the frame shown in the image serves as a three-dimensional structural diagram of the structural component.

[0035] Figure 5 for Figure 4 A schematic diagram of the planar arrangement of carbon fiber filaments within the structural components;

[0036] Figure 6 for Figure 4 A three-dimensional structural diagram of the main body of the intermediate structural component;

[0037] Figure 7 for Figure 6 AA section view of the main body of the middle structural component Figure 1 ;

[0038] Figure 8 for Figure 6 AA section view of the main body of the middle structural component Figure 2 ;

[0039] Figure 9 for Figure 6 AA section view of the main body of the middle structural component Figure 3 ;

[0040] Figure 10 for Figure 6 AA section view of the main body of the middle structural component Figure 4 ;

[0041] Figure 11 for Figure 9 A cross-sectional view of the conductive part filling the groove in the body of the middle structural component.

[0042] Figure 12 for Figure 11 Schematic diagram of the three-dimensional structure of surface roughening of carbon fiber filament Figure 1 ;

[0043] Figure 13 for Figure 11 Schematic diagram of the three-dimensional structure of surface roughening of carbon fiber filament Figure 2 ;

[0044] Figure 14 for Figure 11 Enlarged structural diagram of point A on the main body of the middle structural component;

[0045] Figure 15 for Figure 9 A cross-sectional view of the structure of the middle structural component with solder pads installed in the groove.

[0046] Figure 16 for Figure 9 A three-dimensional structural diagram of a component body with a metal coating on its surface;

[0047] Figure 17 for Figure 16 A schematic diagram of the structure in which carbon fiber filaments and graphene fibers are woven together within the main body of the intermediate structural component;

[0048] Figure 18 This is a schematic diagram of the usage state of an electronic device provided in an embodiment of this application;

[0049] Figure 19 This is a cross-sectional view of a carbon fiber plate in the prior art;

[0050] Figure 20 for Figure 18 3D diagram of the circuit board structure inside an electronic device Figure 1 ;

[0051] Figure 21 For containing Figure 20 A cross-sectional view of an electronic device on a circuit board.

[0052] Figure 22 for Figure 21 A magnified schematic diagram of the structure at point B in the electronic device;

[0053] Figure 23 for Figure 18 3D diagram of the circuit board structure inside an electronic device Figure 2 ;

[0054] Figure 24 For containing Figure 23 A cross-sectional view of an electronic device on a circuit board.

[0055] Figure 25 A three-dimensional structural diagram of a structural component provided in this application embodiment. Figure 1 ;

[0056] Figure 26 for Figure 25 A schematic diagram of the planar structure of the middle structural component as the middle plate of electronic equipment;

[0057] Figure 27 A three-dimensional structural diagram of a structural component provided in this application embodiment. Figure 2 ;

[0058] Figure 28 This is a three-dimensional structural diagram illustrating the application of the structural component provided in this application embodiment in a laptop computer.

[0059] Figure label:

[0060] 01-Electronic device; 02-Structural component; 03-Laptop; 100-Mid-frame; 200-Display; 300-Back cover; 400-Circuit board; 500-Battery; 101-Hollow section; 110-Mid-plate; 120-Frame; 121-Frame antenna; 122-Slot; 123-Separation; 130-Local area; 210-Structural component body; 220-Conductive part; 211-Carbon fiber filament; 212-Insulating component; 213-Groove; 2131-Groove bottom; 2132-Groove wall; 2133-Groove space; 2134-Partition wall; 211a-First section; 211b-Second section Sectional cut; 211c - Third sectional cut; 221 - Conductive layer; 222 - Underlayer; 223 - Alloy area; 2111 - Recess; 2112 - Gap; 230 - Pad; 240 - Metal plating; 250 - Graphene; 410 - Substrate; 420 - Chip; 430 - Memory; 440 - Shielding cover; 450 - Connector; 460 - Wire; 451 - Conductive silicone; 452 - Conductive spring; 470 - Patch antenna; 480 - Grounding point; 490 - Feed point; 210a - First wall surface; 210b - Second wall surface; 310 - Computer body; 320 - Screen; 330 - Housing. Detailed Implementation

[0061] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0062] In the following description, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0063] Furthermore, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0064] This application provides an electronic device 01. For example... Figure 1 As shown, the electronic device 01 can be a mobile phone, tablet computer, e-reader, laptop computer, wearable device, drone, or other electronic product. This application embodiment does not impose any specific limitations on the type of electronic device 01. To better illustrate the content of this application embodiment, the following description will use a mobile phone as an example of electronic device 01.

[0065] The aforementioned electronic device 01, such as Figure 1 As shown, the electronic device 01 may include a mid-frame 100, a display screen 200, and a back cover 300. The display screen 200 can be attached to one side of the mid-frame 100 by adhesive bonding, and the back cover 300 can be attached to the side of the mid-frame 100 away from the display screen 200 by screwing, welding, bonding, or fastening. This application embodiment does not impose special restrictions on the connection methods between the components of the electronic device 01. For example... Figure 1 As shown, the electronic device 01 can have a length direction, a width direction, and a thickness direction. For ease of explanation in the following embodiments, the X direction will be used as the length direction of the electronic device 01, the Y direction as the width direction, and the Z direction as the thickness direction. Taking a mobile phone as an example, the outline of the mobile phone can be rectangular, the direction of the long side can be the length direction of the mobile phone, and the direction of the short side can be the width direction of the mobile phone.

[0066] Figure 2 An exploded view of the above-mentioned electronic device 01 is shown. To realize the relevant functions of the electronic device 01, the electronic device 01 may also include a circuit board 400 and a battery 500. The circuit board 400 can electrically connect multiple electronic devices such as chips, memory, and antennas, and the battery 500 can be electrically connected to the circuit board 400 to provide the power required by the circuit board 400. Depending on the structural design of different electronic devices 01, the circuit board 400 and the battery 500 can be installed between the middle frame 100 and the back cover 300, or between the middle frame 100 and the display screen 200. This application embodiment does not impose any special restrictions on the installation position of the circuit board 400 and the battery 500.

[0067] In addition, such as Figure 2 As shown, to facilitate the installation of the battery 500, a hollow portion 101 can be formed on the middle frame 100, allowing the battery 500 to be installed in the hollow portion 101. This application embodiment does not impose any special limitations on the internal structure of the electronic device 01. For ease of explanation in the following embodiments, hollow components such as slots and holes are labeled with arrowed guide lines, while other components are labeled with guide lines without arrows. The same labeling method will be used in the accompanying drawings of the following embodiments, and will not be repeated here.

[0068] To reduce the structural weight of the electronic device 01, this application embodiment provides a structural component 02. For example, the mid-frame 100 of the aforementioned electronic device 01 can adopt the structural component 02 provided in this application embodiment. Figure 3 As shown, Figure 2A three-dimensional structural diagram of the middle frame 100 in the electronic device 01. The middle frame 100 may include a middle plate 110 and a frame 120, with the frame 120 connected to the outer periphery of the middle plate 110. The middle plate 110 and the frame 120 may be made of carbon fiber composite material. The middle plate 110 and the frame 120 may be integrally formed structural components 02, or they may be structural components 02 formed by bonding, screwing, or riveting. To better illustrate the specific structure of the structural component 02, a partial area 130 of the middle plate 110, as shown by the dotted line in the figure, will be selected below for detailed explanation as structural component 02.

[0069] Furthermore, the frame 120 of the aforementioned middle frame 100 can also be made of the same structural component 02 material, and the back cover 300 of the aforementioned electronic device 01 can also be made of the same structural component 02 material. This application embodiment does not impose any special restrictions on the specific structural parts in which the structural component 02 can be applied in the electronic device 01. The following is merely an example of the structure of the structural component 02 in the selected local area 130, using the middle plate 110 as an example.

[0070] Based on this, such as Figure 4 As shown, Figure 3 The diagram shows an enlarged view of a portion 130 of the middle plate 110. The structural component 02 provided in this embodiment may include a structural component body 210 and a conductive portion 220. The conductive portion 220 is disposed on and connected to the structural component body 210. The structural component body 210 may include carbon fiber filaments 211 and an insulating component 212. The carbon fiber filaments 211 are embedded in the insulating component 212. A portion of the carbon fiber filaments 211 may be exposed outside the insulating component 212 by means of slotting or opening, thereby allowing the carbon fiber filaments 211 and the conductive portion 220 to contact and be electrically connected, enabling conductivity between them. This allows the conductive portion 220 to serve as a welding point on the structural component 02 for connection with the aforementioned circuit board 400. Figure 2 (as shown) and battery 500 ( Figure 2 At least one electrical connection is shown. The insulating element 212 can be an insulating material such as resin or ceramic, and the carbon fiber filaments 211 can be embedded in the insulating element 212 through processes such as adhesive application and molding. This application does not impose specific limitations on the specific materials of the insulating element 212 or the manufacturing process of the structural body 210. In some embodiments, such as... Figure 4 As shown, multiple carbon fiber filaments 211 can be provided. These multiple carbon fiber filaments 211 can be arranged along the X direction and aligned along the Y direction, and can also be layered along the Z direction. In other embodiments, such as... Figure 5As shown, the multiple carbon fiber filaments 211 can also be arranged in a mesh pattern in the XY plane. This application embodiment does not impose any special restrictions on the specific number and arrangement of the carbon fiber filaments 211 within the insulating component 212.

[0071] in, Figure 4 and Figure 5 The spacing between carbon fiber filaments 211 shown does not represent the actual spacing between carbon fiber filaments 211 in the carbon fiber composite material. It is merely an illustration of the specific arrangement of carbon fiber filaments 211 within the insulating component 212. The actual density of carbon fiber filaments 211 in the carbon fiber composite material is much greater than the density shown in the figure. When the density between carbon fiber filaments 211 is large, during the brushing, coating, and molding processes of the carbon fiber composite material, the carbon fiber filaments 211 overlap, wrap, and twist, allowing them to conduct electricity to each other. Simultaneously, due to the large density, the spacing between carbon fiber filaments 211 is small, resulting in indirect coupling between them, which also allows them to conduct electricity to each other.

[0072] Based on this, the structural component 02 provided in the application embodiment, such as Figure 6 The diagram illustrates the structure of structural member 02 before the conductive portion 220 is installed. For example, a groove 213 can be formed on the surface of the structural member body 210, allowing a portion of the carbon fiber filament 211 to be exposed within the groove 213. The groove 213 may include a groove bottom 2131, a groove wall 2132, and a groove space 2133 enclosed by the groove bottom 2131 and the groove wall 2132. The carbon fiber filament 211 exposed within the groove 213 may be located at the groove bottom 2131, the groove wall 2132, or within the groove space 2133. This embodiment does not impose any specific limitations on the exact location of the carbon fiber filament 211 exposed within the groove 213.

[0073] The groove 213 can be created on the surface of the structural component body 210 using mechanical equipment via CNC (Computer Numerical Control), polishing, grinding, or wire drawing processes, or by methods such as ion beam etching or photolithography. Of course, different shapes of grooves 213 can be created on the surface of the structural component body 210 using different processing techniques. For example, a rectangular groove 213 can be formed using CNC machining. This application does not impose any special limitations on the processing technology or specific shape of the groove 213. For better illustration, the following embodiments will provide examples of the shape of the groove 213 and the exposed carbon fiber filaments 211 within the groove 213.

[0074] For example, such as Figure 7 As shown, ion beam etching or photolithography can also be used to create the groove 213 ( Figure 6 As shown, the shape is set to an arc. Of course, depending on different processing techniques, the exposed carbon fiber filaments 211 in the groove 213 can be in the form of a cylindrical curved surface or a truncated cross-section. As long as there are exposed carbon fiber filaments 211 in the groove 213, this embodiment does not impose any special restrictions on the specific shape of the exposed carbon fiber filaments 211 in the groove 213.

[0075] For example, such as Figure 8 As shown, groove 213 ( Figure 6 The shape shown can also be trapezoidal. In some embodiments, the above processing technology can be used to remove only the insulating element 212 in the groove 213, while retaining the carbon fiber filament 211 located at the bottom 2131 of the groove. This allows the outer surface of the carbon fiber filament 211 located at the bottom 2131 of the groove to protrude from the bottom 2131 of the groove, and the conductive part 220 can contact and be electrically connected with the outer surface of the carbon fiber filament 211 protruding from the bottom 2131 of the groove. In other embodiments, the above processing technology can be used to remove both the carbon fiber filament 211 and the insulating element 212 in the groove 213, so that the carbon fiber filament 211 located at the groove wall 2132 can have a first cutting surface 211a. The first cutting surface 211a can be flush with the groove wall 2132, so that the conductive part 220 can also contact and be electrically connected with the first cutting surface 211a of the carbon fiber filament 211 in the groove wall 2132. Of course, a combination of the above processing techniques can also be used so that the exposed carbon fiber filaments 211 in the groove 213 have both an outer surface protruding from the bottom of the groove 2131 and a first cutting surface 211a flush with the groove wall 2132.

[0076] For example, such as Figure 9 As shown, the remaining structures are the same as Figure 8 The structure shown is the same, except that the above processing technology can also be used to remove groove 213 simultaneously. Figure 6 The carbon fiber filaments 211 and insulating components 212 within the groove (as shown) allow the carbon fiber filaments 211 located at the bottom of the groove 2131 to have a second cut surface 211b, which is flush with the bottom of the groove 2131. This allows the conductive portion 220 to contact and electrically connect with the second cut surface 211b of the carbon fiber filaments 211 at the bottom of the groove 2131. Alternatively, a combination of the above processing techniques can be used so that the exposed carbon fiber filaments 211 within the groove 213 have both a second cut surface 211b flush with the bottom of the groove 2131 and a first cut surface 211a flush with the groove wall 2132.

[0077] For example, such as Figure 10 As shown, the above processing technology can also be used to remove groove 213 simultaneously. Figure 6A portion of the carbon fiber filaments 211 and a portion of the insulating element 212 are arranged within the groove (as shown), so that the remaining carbon fiber filaments 211 and insulating element 212 form a partition wall 2134 connected to the bottom of the groove 2131. The partition wall 2134 can be spaced apart from the groove wall 2132. The partition wall 2134 may include carbon fiber filaments 211 and insulating element 212. The carbon fiber filaments 211 on the partition wall 2134 may have a third cut surface 211c, which may be flush with the side wall of the partition wall 2134, so that the conductive part 220 can also contact and electrically connect with the third cut surface 211c of the carbon fiber filaments 211 on the side wall of the partition wall 2134. At this time, the exposed carbon fiber filaments 211 are located in the groove space 2133. Of course, there can be multiple partition walls 2134 on the bottom of the groove 2131. This embodiment of the application does not impose a special limitation on the specific number of partition walls 2134.

[0078] Of course, in order to expose a portion of the carbon fiber filament 211 embedded in the insulating element 212, a portion of the carbon fiber filament 211 can also protrude from the surface of the structural element body 210 during the fabrication of the structural element body 210. That is, carbon fiber filament 211 and insulating element 212 protruding relative to the surface of the structural element body 210 are provided on the surface of the structural element body 210. For example, a multi-layer carbon fiber filament 211 structure can be used in a local area of ​​the structural element body 210, so that the carbon fiber filament 211 in that local location protrudes from the surface of the structural element body 210 after being coated with adhesive or molded. In this case, it is only necessary to directly remove the insulating element 212 protruding from the surface of the structural element body 210 by methods such as CNC machining, polishing, grinding, wire drawing, ion beam etching, or photolithography, so that it is not necessary to open the groove 213 on the surface of the structural element body 210, and a portion of the carbon fiber filament 211 embedded in the insulating element 212 can be exposed outside the insulating element 212.

[0079] The above embodiments illustrate the specific shape of the groove 213 and the exposed carbon fiber filaments 211 within the groove 213. The conductive portion 220 disposed within the groove 213 will be described in detail below. Figure 11 As shown, the conductive portion 220 may include a conductive layer 221 and a substrate layer 222. The substrate layer 222 is disposed in the groove 213 ( Figure 9 As shown, the substrate 222 is directly connected to the exposed carbon fiber filaments 211 within the groove 213. The substrate 222 can be deposited within the groove 213 by electroplating, chemical plating, or other methods, allowing direct connection between the substrate 222 and the carbon fiber filaments 211. The substrate 222 can be a single layer or multiple layers; this embodiment does not impose any special limitation on the number of layers. The conductive layer 221 fills the groove 213 and is connected to the substrate 222.

[0080] Furthermore, in many embodiments, along the Z-direction, the surface of the conductive portion 220 may protrude from the surface of the insulating member 212, be flush with the surface of the insulating member 212, or be lower than the surface of the insulating member 212. This application embodiment does not impose any special limitations on the surface height of the conductive portion 220 along the Z-direction.

[0081] To ensure the connection strength between the underlayment 222 and the exposed carbon fiber filaments 211 in the groove 213, the surface of the exposed carbon fiber filaments 211 in the groove 213 can be roughened to make the surface of the carbon fiber filaments 211 uneven, thereby increasing the specific surface area of ​​the carbon fiber filaments 211 and improving the bonding strength of the underlayment 222. Figure 11 The connection strength between the carbon fiber filament 211 and the surface of the roughening treatment (as shown) can be determined by methods such as liquid phase oxidation etching, plasma treatment, or irradiation treatment. This application embodiment does not impose specific limitations on the specific method of roughening treatment. The surface of the roughened carbon fiber filament 211 can be... Figure 8 The outer surface of the carbon fiber filament 211 protruding from the bottom of the groove 2131 shown can also be Figure 8 The first section plane 211a shown, which is flush with the groove wall 2132, can also be Figure 9 The second section 211b shown, which is flush with the bottom 2131 of the groove, can also be Figure 10 The third section 211c on the side wall of the partition wall 2134 shown.

[0082] In some implementations, such as Figure 12 As shown, during the roughening treatment, different roughening processes can form pits 2111 on the surface of the carbon fiber filament 211. The shape of the pits 2111 can be various shapes such as triangles, circles, and rectangles. This application embodiment does not impose specific limitations on the specific shape and depth of the pits 2111. The aforementioned underlayer 222 ( Figure 11 As shown, the material can be embedded in the recess 2111, which not only increases the connection area between the carbon fiber filament 211 and the underlayment 222, but also increases the interlocking force between the underlayment 222 and the carbon fiber filament 211, thereby improving the bonding strength between the underlayment 222 and the carbon fiber filament 211. The area of ​​the recess 2111 on the surface of the carbon fiber filament 211 can be 1 μm. 2 -1mm 2 The depth of the recesses 2111 on the surface of the carbon fiber filaments 211 can be 1-1000 μm. If the size of the recesses 2111 is too large, it will reduce the specific surface area of ​​the carbon fiber filaments 211, thus affecting the bonding strength between the underlayment 222 and the carbon fiber filaments 211. If the size of the recesses 2111 is too small, the underlayment 222 will not be able to be embedded in the recesses 2111, which will also affect the bonding strength between the underlayment 222 and the carbon fiber filaments 211.

[0083] In other implementations, such as Figure 13 As shown, during the roughening treatment, different roughening processes can also form dense gaps 2112 on the surface of the carbon fiber filaments 211. This embodiment does not impose any special limitations on the density of the gaps 2112. Similarly, the aforementioned underlayer 222 ( Figure 11 (As shown) It can also be embedded within the gap 2112 to improve the bonding strength between the underlay 222 and the carbon fiber filament 211. The length, width, and depth of the gap 2112 on the surface of the carbon fiber filament 211 can be 1-1000 μm. If the size of the gap 2112 is too large, it will reduce the specific surface area of ​​the carbon fiber filament 211, thus affecting the bonding strength between the underlay 222 and the carbon fiber filament 211. If the size of the gap 2112 is too small, the underlay 222 cannot be embedded within the gap 2112, which will also affect the bonding strength between the underlay 222 and the carbon fiber filament 211.

[0084] Based on this, such as Figure 14 As shown, Figure 11 A magnified structural diagram at point A. For example, the conductive layer 221 can be made of low-melting-point tin, which, in its liquid state, can conformally fill the aforementioned groove 213. Figure 9 As shown in the figure, this avoids gaps between the conductive layer 221 and the groove 213, which would affect the connection strength between the conductive layer 221 and the groove 213. After the tin metal is cured, a solder surface can be formed on the side away from the base layer 222, which can then be used as a solder point. The base layer 222 can be made of chromium metal, and the liquid tin metal can fuse with the chromium metal to form an alloy. That is, an alloy region 223, as shown by the dashed line in the figure, can be formed between the conductive layer 221 and the base layer 222, thereby improving the bonding strength between the conductive layer 221 and the base layer 222.

[0085] Of course, the conductive layer 221 can also be made of gallium, bismuth, indium, or other low-melting-point metals, and the underlayer 222 can be made of titanium, nickel, copper, iron, or aluminum, or their alloys, which can also form an alloy at the interface between the conductive layer 221 and the underlayer 222. The melting point of the metal can be between 50℃ and 350℃. If the melting point of the metal is too high, it will be difficult to fuse with the underlayer 222 to form an alloy, and the insulating component 212 will be easily oxidized. If the melting point of the metal is too low, it will affect the stability of the alloy. This application does not impose any special restrictions on the specific materials of the conductive layer 221 and the underlayer 222.

[0086] In addition, such as Figure 15 As shown, structural component 02 may also include connector 450. Figure 20As shown), in some embodiments, the connector 450 may include a pad 230. The pad 230 may be disposed on the side of the conductive layer 221 opposite to the substrate 222, and the pad 230 is electrically connected to the conductive layer 221, thereby allowing the structural component 02 to be electrically connected to other electronic devices via the pad 230. The conductive layer 221 may partially fill the groove 213 (…). Figure 9 As shown, the pad 230 is flush with the surface of the insulating component 212. The conductive layer 221 may also completely fill the groove 213, causing the pad 230 to protrude from the surface of the insulating component 212. This embodiment does not impose any special restrictions on the relative positional relationship between the pad 230 and the insulating component 212.

[0087] In some implementations, such as Figure 16 As shown, structural component 02 may further include a metal plating layer 240, which is plated on the outer surface of the structural component body 210, and the conductive portion 220 can be electrically connected to the metal plating layer 240. Along the Z direction in the figure, the conductive portion 220 may be flush with the surface of the metal plating layer 240, or it may protrude or be recessed relative to the surface of the metal plating layer 240. This application embodiment does not impose any special limitations on the relative positional relationship between the conductive portion 220 and the metal plating layer 240. For example, when structural component 02 is used as electronic device 01 (… Figure 2 The middle frame 100 (as shown) Figure 2 When the structural component 02 is used as the back cover 300 of the electronic device 01 (as shown), the structural component body 210 can be plated with a metal plating layer 240 on both sides. Figure 2 As shown, the structural component body 210 can also be plated with a metal plating layer 240 on one side. This application embodiment does not impose any special restrictions on the position or quantity of the metal plating layer 240.

[0088] Considering electronic device 01 ( Figure 2 To meet the heat dissipation requirements (as shown), the structural component body 210 of structural component 02 may also include graphene 250. In some embodiments, such as Figure 17 As shown, graphene 250 can be configured as graphene fibers, which can be mixed and woven with carbon fiber filaments 211. In other embodiments, graphene 250 can also be configured as graphene powder, which can be embedded in insulating element 212 ( Figure 15 (As shown) Previously, graphene 250 was integrally hot-pressed with carbon fiber filament 211, or it can be in-situ composited with carbon fiber filament 211 during the embedding of insulating component 212. This application does not impose any special restrictions on the specific method of composite formation of graphene 250 and carbon fiber filament 211. In this way, structural component 02 can also serve as a good thermal conductive medium.

[0089] In the above embodiments, the environment in which the carbon fiber filaments 211 exposed outside the insulating component 212 are located varies depending on the different scenarios of the structural component 02. For example, when the groove 213 is formed using methods such as CNC machining, polishing, grinding, or wire drawing, the carbon fiber filaments 211 exposed outside the insulating component 212 can be carbon fiber filaments 211 inside the groove 213 that are in contact with air. When the groove 213 is formed using methods such as ion beam etching or photolithography, since a protective gas is required during the processing, the carbon fiber filaments 211 exposed outside the insulating component 212 can be carbon fiber filaments 211 inside the groove 213 that are in contact with the protective gas. When the groove 213 is filled with the conductive part 220, the carbon fiber filaments 211 exposed outside the insulating component 212 can be carbon fiber filaments 211 inside the groove 213 that are in contact with and electrically connected to the conductive part 220.

[0090] The above embodiments use structural component 02 as an example of the middle frame 100 of electronic device 01, and provide a detailed description of the specific structure of structural component 02. The following will describe in detail the working principle of the middle frame 100 in conjunction with the specific structure of structural component 02. Figure 18 As shown, in order to reduce the weight of electronic device 01, high-strength, lightweight, and flexible carbon fiber composite plate is usually selected as the middle frame 100 of electronic device 01. Figure 2 (as shown) or back cover 300 ( Figure 2 (As shown).

[0091] Because carbon fiber itself has the property of absorbing electromagnetic waves, and the carbon fiber composite material formed by combining carbon fiber with insulating materials itself has magnetic hysteresis properties, carbon fiber composite materials suffer from the problems of self-absorption and passive intermodulation (PIM). To solve this problem, such as... Figure 19 As shown, a metal 2 is typically plated on the surface of the carbon fiber composite board 1, and an insulation 3 exists between the carbon fiber composite board 1 and the metal 2. Static electricity is easily generated by the human body during activity; when holding the electronic device 01, this static electricity is transferred to the device. When a large current passes through the metal 2 (e.g., static electricity), a certain type of charge (e.g., positive charge) is generated on the surface of the metal 2. At this time, due to the good conductivity of the carbon fibers in the carbon fiber composite board 1, the carbon fibers can generate another type of charge (e.g., negative charge) through electrostatic induction. Thus, with frequent use of the electronic device 01, the carbon fibers in the carbon fiber composite board 1 continuously accumulate charge. Because the carbon fibers are encapsulated within the insulation 3, they cannot be released externally. When the charge accumulates to a certain threshold, it will be directly released to the nearest electronic device, causing the electronic device in the electronic device 01 to burn out.

[0092] The structural component 02 provided in the embodiments of this application, such as... Figure 11As shown, by providing a groove 213 on the surface of the structural component body 210 ( Figure 9 As shown, a portion of the carbon fiber filament 211 is exposed within the groove 213, and is directly in contact with the carbon fiber filament 211 via the conductive part 220. This allows the conductive part 220 within the groove 213 to directly conduct electricity with the exposed carbon fiber filament 211, thereby enabling the carbon fiber filament 211, encapsulated within the insulating member 212, to serve as a path for discharging electrostatic current. For example, as... Figure 16 As shown, when the outer surface of the structural component body 210 is plated with a metal plating layer 240, the metal plating layer 240 can be used as a reference ground. Since the conductive part 220 is electrically connected to the metal plating layer 240, the electrostatic current can flow through the carbon fiber filament 211 and the conductive part 220 to the metal plating layer 240, thereby avoiding ESD problems caused by the lack of discharge path for the electrostatic current.

[0093] Furthermore, as in the aforementioned embodiments Figure 14 As shown, the surface of the exposed carbon fiber filaments 211 in the groove 213 is roughened, which improves the bonding strength between the underlayment 222 and the carbon fiber filaments 211. Simultaneously, the conductive layer 221, made of a low-melting-point metal, can fuse with the underlayment 222 in a liquid state to form an alloy, further enhancing the bonding strength between the conductive layer 221 and the underlayment 222. This results in a three-layer load-bearing structure consisting of the carbon fiber filaments 211, the underlayment 222, and the conductive layer 221. When the outer surface of the structural component body 210 is plated with a metal plating layer 240, the connection strength of the metal plating layer 240 on the structural component body 210 can be improved by welding the conductive layer 221 to the metal plating layer 240. This avoids the problem of the metal plating layer 240 detaching from the structural component body 210 due to the difference in thermal expansion coefficients, which can cause significant temperature fluctuations.

[0094] To better demonstrate the application of the structural component 02 provided in the embodiments of this application in the electronic device 01, in some embodiments, such as Figure 20 As shown, the circuit board 400 in the electronic device 01 may include electronic components such as a substrate 410, a chip 420, a memory 430, a shielding cover 440, multiple connectors 450, and wires 460. The wires 460 are disposed on the substrate 410. The chip 420, the memory 430, and the shielding cover 440 can be electrically connected to the surface of the substrate 410 by surface mount technology (SMT), and the chip 420 and the memory 430 can also be electrically connected to each other through the wires 460.

[0095] Of course, depending on the different functional requirements of electronic device 01, circuit board 400 may also include other electronic components such as fingerprint module, camera module, and microphone. Each electronic component can be electrically connected to circuit board 400 individually, or they can be electrically connected to each other via wires 460. This application embodiment does not impose any special restrictions on the type, quantity, or connection method of electronic components on circuit board 400.

[0096] See also Figure 20 Typically, to determine the operating voltage of each electronic device, it is electrically connected to a reference ground via a connector 450. For example, the connector 450 can be disposed on and electrically connected to a circuit board 400. The connector 450 may include conductive silicone 451 and conductive spring 452. For instance, the conductive silicone 451 can be disposed on the outer periphery of a shield 440 for grounding the shield 440. The conductive spring 452 can be disposed on the outer periphery of a chip 420 or a memory 430 for grounding the chip 420 or the memory 430. Of course, different types of connectors 450 can be used for grounding different electronic devices. Furthermore, the connector 450 can be disposed on the same side of the circuit board 400 as the electronic device, or on a different side of the circuit board 400. This embodiment does not impose any special restrictions on the type of connector 450 used for grounding the electronic devices or the placement of the connector 450.

[0097] Structural component 02 in the above embodiments ( Figure 16 The metal plating 240 shown can be used as a reference. For example... Figure 21 As shown, circuit board 400 can be disposed between the middle frame 100 and the display screen 200 of electronic device 01. Connector 450 on circuit board 400 can be soldered to conductive portion 220 on middle frame 100. Since conductive portion 220 is electrically connected to metal plating layer 240, electronic components on circuit board 400 can be grounded through connector 450. For example, along the Z direction in the figure, the surface of conductive portion 220 is lower than the surface of middle frame 100 facing circuit board 400, allowing metal plating layer 240 to be positioned in groove 213 (…). Figure 6 As shown, the metal plating layer 240 is electrically connected to the conductive part 220, thereby increasing the thickness of the metal plating layer 240 along the Z direction at the location of the conductive part 220. During welding, the problem of the metal plating layer 240 detaching from the conductive part 220 after welding is avoided due to the metal plating layer 240 being too thin, thus ensuring the quality of the welding.

[0098] Of course, such as Figure 21As shown, along the Z direction in the figure, pads 230 can also be provided on the surface of the conductive part 220. The pads 230 are electrically connected to the conductive part 220 and can also be electrically connected to the metal plating layer 240, so that the connector 450 can also be electrically connected to the middle frame 100 through the pads 230. This application embodiment does not impose any special restrictions on whether or not pads 230 are provided at the position of the conductive part 220 on the middle frame 100.

[0099] Among them, such as Figure 22 As shown, Figure 21 An enlarged structural diagram at point B. Depending on the different heights of the connector 450 along the Z-direction, different distances S can be set between the metal plating layer 240 and the conductive part 220. This allows the groove 213 on the structural body 210 to accommodate the connector 450, reducing the thickness of the electronic device 01 in the Z-direction and thus facilitating the thinning and lightening of the electronic device 01. Furthermore, when the conductive part 220 serves as an electrical connection point for the circuit board 400, because the conductive part 220 forms a three-layer stress-bearing structure consisting of carbon fiber filament 211, a base layer 222, and a conductive layer 221, it can withstand the high-pressure point contact of the connector 450 during welding, reducing the likelihood of weld point damage and ensuring the welding quality between the structural body 210 and the circuit board 400.

[0100] Example, combination Figure 20 and Figure 21 As shown, the conductive part 220 can be provided in the middle plate 110 of the middle frame 100. Figure 3 As shown, the connector 450 can be disposed at the center of the circuit board 400 and electrically connected to the circuit board 400. The center of the circuit board 400 can be a region outside the edge L of the circuit board 400, where 0 ≤ L ≤ 1 cm. This embodiment does not impose special restrictions on the center or edge position of the circuit board 400. In this way, the circuit board 400 can be electrically connected to the conductive portion 220 on the middle plate 110 via the connector 450. Alternatively, the connector 450 can be disposed on the middle plate 110 and electrically connected to the conductive portion 220 on the middle plate 110, thereby allowing the middle plate 110 to be electrically connected to the center of the circuit board 400 via the connector 450. This embodiment does not impose special restrictions on whether the connector 450 is disposed on the middle plate 110 or on the circuit board 400.

[0101] In some implementations, such as Figure 23As shown, the electronic components on the circuit board 400 may also include a patch antenna 470, a ground point 480, and a feed point 490, with the patch antenna 470 electrically connected to both the ground point 480 and the feed point 490. The ground point 480 and the feed point 490 may be located at the edge of the circuit board 400. Of course, depending on the different functional requirements of the antenna, a greater number of patch antennas 470, ground points 480, and feed points 490 may be provided on the circuit board 400. This embodiment of the application does not impose any special limitation on the specific number of patch antennas 470, ground points 480, and feed points 490 on the circuit board 400.

[0102] Based on this, such as Figure 24 As shown, the conductive part 220 in the above embodiment can be disposed not only on the middle plate 110 of the middle frame 100, but also on the side frame 120 of the middle frame 100. For example, the conductive part 220 can be disposed on the inner sidewall of the side frame 120, and the connector 450 can be disposed on the inner sidewall of the side frame 120 and electrically connected to the conductive part 220. Of course, the number of connectors 450 disposed on the inner sidewall of the side frame 120 can be multiple, and this application embodiment does not impose any special limitation on the specific number of connectors 450 on the side frame 120. In addition, the contact between the connector 450 and the circuit board 400 can be either point contact or surface contact. The connector 450 can be disposed on the circuit board 400, or on the middle plate 110 or the side frame 120. This application embodiment also does not impose any special limitation on the contact form and the location of the connector 450 and the circuit board 400.

[0103] Example, combination Figure 23 and Figure 24 As shown, the conductive part 220 can be disposed on the frame 120, and the connector 450 can be disposed on the frame 120 and electrically connected to the conductive part 220. The frame 120 can be electrically connected to the edge of the circuit board 400 through the connector 450. The edge of the circuit board 400 refers to the area within a range L from the edge of the circuit board 400, where 0 ≤ L ≤ 1 cm. Furthermore, the connector 450 can also be disposed at the edge of the circuit board 400 and electrically connected to it, thereby allowing the circuit board 400 to be electrically connected to the conductive part 220 on the frame 120 through the connector 450. This embodiment does not impose any special restrictions on whether the connector 450 is disposed on the frame 120 or on the circuit board 400.

[0104] In some implementations, such as Figure 23As shown, grounding point 480 and feed point 490 can be located at the edge of circuit board 400, allowing grounding point 480 and feed point 490 to be electrically connected to connector 450 on the inner sidewall of frame 120, thereby achieving the grounding function of patch antenna 470. In addition, when the side of electronic device 01 has electronic components such as data interface, fingerprint module, and microphone, the grounding function of these electronic components can also be achieved by setting connector 450 on frame 120. This application embodiment does not impose special restrictions on electronic components on the side of electronic device 01.

[0105] For example, such as Figure 24 As shown, when the shape of the structural component body 210 is designed as frame 100 in the above embodiment ( Figure 3 When the shape shown is such that the structural body 210 may include a first wall surface 210a and a second wall surface 210b connected to each other, the first wall surface 210a may be the wall surface of the middle plate 110 facing the circuit board 400, and the second wall surface 210b may be the wall surface of the frame 120 facing the circuit board 400. Furthermore, as shown... Figure 25 As shown, the structural component body 210 can also be designed as a plate structure. In this case, the first wall surface 210a can be the surface of the plate structure, and the second wall surface 210b can be the side surface of the plate structure. In the above embodiment, the groove 213 can be partially formed on the first wall surface 210a and partially on the second wall surface 210b. Of course, if the thickness of the structural component body 210 along the Z direction is sufficiently large, the groove 213 can also be entirely formed on the second wall surface 210b. This application does not impose any special restrictions on the specific shape of the structural component body 210 or the location of the groove 213.

[0106] Based on this, such as Figure 26 As shown, the electronic device 01 may further include a middle plate 110, a metal frame antenna 121, and multiple grounding points 480 and feed points 490. A slot 122 may be provided between the middle plate 110 and the frame antenna 121. A slit 123 may be provided on the frame antenna 121 to interrupt it. The multiple grounding points 480 and feed points 490 are located between the middle plate 110 and the frame antenna 121. (Combined with...) Figure 25 As shown, a conductive part 220 can be disposed in the groove 213 formed in the second wall surface 210b of the structural component body 210. Figure 16 (As shown). In this way, when the structural body 210 serves as the middle plate 110, multiple conductive parts 220 can be provided on the side wall of the middle plate 110, so that multiple grounding points 480 and feed points 490 can be electrically connected to the conductive parts 220 respectively, thereby realizing the grounding function of the frame antenna 121.

[0107] In addition, such as Figure 27 As shown in the above embodiments, it can be seen that, according to different functional requirements, multiple conductive parts 220 can be provided on the first wall surface 210a and the second wall surface 210b of the structural component body 210. For example... Figure 14 As shown, each conductive part 220 forms a three-layer stress-bearing structure consisting of carbon fiber filament 211, underlayment 222, and conductive layer 221. The conductive part 220 is also connected to the metal plating layer 240. Figure 16 The conductive parts 220 are connected to each other, so that multiple conductive parts 220 can fix the metal plating layer 240 at different positions. In this way, the conductive parts 220 not only meet the requirements of the welding points, but also prevent the metal plating layer 240 from falling off the surface of the structural body 210.

[0108] The above embodiments illustrate the application of structural component 02 in electronic device 01, primarily using a mobile phone as an example. Besides mobile phones, structural component 02 can also be applied to other electronic devices 01. For example, structural component 02 can also be applied to laptops 03, tablets, drones, and other electronic devices 01.

[0109] For example, such as Figure 28 As shown, the laptop computer 03 may include a computer body 310, a screen 320, and a casing 330. The casing 330 is rotatably connected to the computer body 310 via hinges, pivots, or other components. The screen 320 is connected to the side of the casing 330 facing the computer body 310 via adhesive, snap-on, or other methods. The structural component 02 provided in this embodiment can serve as the casing 330. That is, multiple conductive portions 220 as described in the above embodiments can be provided on the side of the casing 330 facing the screen 320. Figure 27 As shown), screen 320 can be connected via connector 450 in the above embodiment. Figure 24 (As shown) is electrically connected to the conductive part 220 on the housing 330, thereby realizing the function of grounding the screen 320.

[0110] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A structural member, characterized by, The structure is at least a part of a middle frame of an electronic device, and specifically comprises: a structure body comprising an insulating member and carbon fiber filaments embedded in the insulating member, and a part of the carbon fiber filaments exposed outside the insulating member; and a conductive part for grounding, the conductive part comprising a conductive layer and a primer layer, the primer layer being arranged close to the carbon fiber filaments relative to the conductive layer, and the primer layer and the conductive layer comprising different metals in material, the primer layer being in contact with and electrically connected to the exposed carbon fiber filaments, and the conductive layer being in contact with and electrically connected to the primer layer.

2. The structural member of claim 1, wherein The surface of the structure body is provided with a groove, and a part of the carbon fiber filaments is exposed in the groove. At least a part of the conductive part is arranged in the groove of the structure body, and the conductive part is in contact with and electrically connected to the carbon fiber filaments exposed in the groove.

3. The structural member of claim 2, wherein The carbon fiber filaments are provided in plurality, and the groove comprises a groove wall, a groove bottom, and a groove space surrounded by the groove wall and the groove bottom. At least one of the groove wall, the groove bottom, and the groove space is provided with the exposed carbon fiber filaments.

4. The structural member of claim 2, wherein The surface of the structure body is provided with a plurality of grooves, and the structure body comprises a first wall surface and a second wall surface connected to each other. A part of the grooves are arranged on the first wall surface, and another part of the grooves are arranged on the second wall surface.

5. The structural member of claim 3, wherein The outer surface of the exposed carbon fiber filaments protrudes from the groove bottom, and the conductive part is in contact with and electrically connected to the outer surface of the carbon fiber filaments protruding from the groove bottom.

6. The structural member of claim 3, wherein The exposed carbon fiber filaments have a first cross section, and the first cross section is flush with the groove wall, and the conductive part is in contact with and electrically connected to the first cross section of the carbon fiber filaments.

7. The structural member of claim 3, wherein The exposed carbon fiber filaments have a second cross section, and the second cross section is flush with the groove bottom, and the conductive part is in contact with and electrically connected to the second cross section of the carbon fiber filaments.

8. The structural member of any one of claims 1-7, wherein, The primer layer is arranged in the groove of the structure body, and the conductive layer is filled in the groove of the structure body.

9. The structural member of claim 8, wherein The exposed carbon fiber filaments are provided with an uneven surface, and the groove comprises a groove wall and a groove bottom. The primer layer is plated on the groove wall and the groove bottom, and is in contact with the uneven surface of the exposed carbon fiber filaments.

10. The structural member of claim 8, wherein An alloy is formed by fusion between the interface of the conductive layer and the primer layer.

11. The structural member of claim 8, wherein The material of the conductive layer comprises tin, bismuth, gallium, or indium.

12. The structural member of claim 8, wherein The material of the primer layer comprises chromium, nickel, titanium, copper, iron, or aluminum.

13. The structural member of any one of claims 1-7, wherein, The structure further comprises a connecting member. The connecting member is arranged on the conductive part and is electrically connected to the conductive part.

14. The structural member of claim 13, wherein The connecting member comprises a solder pad, a conductive spring, or conductive silicone.

15. The structural member of any one of claims 1-7, wherein, The structure further comprises a metal plating layer. The metal plating layer is plated on the outer surface of the structure body, and the conductive part is electrically connected to the metal plating layer.

16. The structural member of any one of claims 1-7, wherein, The structure further comprises graphene embedded in the insulating member. The graphene is in contact with the carbon fiber filaments.

17. An electronic device, comprising: The structure comprises: a circuit board; the structure according to any one of claims 1-16; and a connecting member electrically connected between the circuit board and the structure. ​ 18. The electronic device of claim 17, wherein, The connecting piece is arranged on the circuit board and is electrically connected with the circuit board; The connecting piece on the circuit board is electrically connected with the conductive part on the structural member.

19. The electronic device of claim 17, wherein, The connecting piece is arranged on the structural member and is electrically connected with the conductive part; The circuit board is electrically connected with the connecting piece on the structural member.

20. The electronic device of any of claims 17-19, wherein, The electronic device further comprises a battery and a display screen, and the battery is mounted between the display screen and the structural member.

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