Machining method, machining device, and machining program

Abstract

This machining method is provided with: a step for rotating a workpiece (W) on a workpiece spindle (22); and performing a simultaneous process in which the additive process by the laser head (140) and the turning process by the tool (T) are simultaneously performed on the rotating workpiece (W). A laser head (140) and a tool (T) are fed and driven to one side of a workpiece spindle (22) in the rotational axis direction, and simultaneous machining is performed in a state in which an additive machining point (LP) of a workpiece (W) by the laser head (140) and a turning machining point (TP) of the workpiece (W) by the tool (T) are separated by a predetermined distance or more in the rotational axis direction.

Description

Technical Field

[0001] The present disclosure relates to a workpiece processing method, a workpiece processing device, and a workpiece processing program. Background Art

[0002] Japanese Patent Application Laid-Open No. 2022-041603 (Patent Document 1) discloses a processing device including an additive processing head and a tool holder for turning processing, which can perform additive processing and turning processing of a workpiece by a single device.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2022-041603 Summary of the invention

[0006] Problems to be solved by the invention

[0007] In order to improve the machining efficiency of a workpiece, a technique for performing additive machining and turning machining simultaneously is desired. Patent Document 1 does not disclose performing additive machining and turning machining simultaneously.

[0008] The present invention has been made in view of the above-mentioned problems, and an object of one aspect is to provide a technology for performing additive processing and turning processing simultaneously.

[0009] Solutions for solving problems

[0010] In one example of the present disclosure, a processing method is provided, which is a method for processing a workpiece performed by a processing device. The processing device includes: a workpiece spindle for rotationally driving the workpiece; a laser head capable of performing additive processing by supplying powder material to the workpiece and irradiating the workpiece with laser; and a tool holder for holding the tool. The processing method includes the following steps: rotating the workpiece on the workpiece spindle; and performing simultaneous processing, wherein the simultaneous processing is to simultaneously perform additive processing by the laser head and turning processing by the tool on the rotating workpiece. The simultaneous processing is performed in the following state: the laser head and the tool are feed-driven to one side in the direction of the rotation axis of the workpiece spindle, and the additive processing point of the workpiece by the laser head and the turning processing point of the workpiece by the tool are separated by a specified distance or more in the direction of the rotation axis.

[0011] In one example of the present disclosure, the simultaneous machining is performed in a state where the additive machining point is ahead of the turning machining point on the one side.

[0012] In one example of the present disclosure, the simultaneous machining is performed in a state where the turning machining point is ahead of the additive machining point on the one side.

[0013] In an example of the present disclosure, when viewed from the rotation axis direction, the additive processing point, the rotation center of the workpiece, and the turning processing point are arranged in the order of the additive processing point, the rotation center of the workpiece, and the turning processing point.

[0014] In one example of the present disclosure, the processing device further includes a spraying mechanism for spraying a fluid onto the workpiece, and the simultaneous processing is performed while spraying the fluid onto the workpiece.

[0015] In one example of the present disclosure, the fluid is air or a coolant.

[0016] In one example of the present disclosure, the simultaneous machining is performed in a state where the additive machining point is ahead of a portion where the fluid is ejected onto the workpiece on one side, and the ejection portion is ahead of the turning machining point on one side.

[0017] In other examples of the present disclosure, a processing device is provided, which is a processing device for a workpiece. The processing device includes: a workpiece spindle for driving the workpiece to rotate; a laser head capable of performing additive processing by supplying powder material to the workpiece and irradiating the workpiece with laser; a tool holder for holding the tool; and a control unit for controlling the processing device. The control unit performs the following processing: rotating the workpiece on the workpiece spindle; and performing simultaneous processing, which is to simultaneously perform additive processing by the laser head and turning processing by the tool on the rotating workpiece. The simultaneous processing is performed in the following state: the laser head and the tool are feed-driven to one side of the rotation axis direction of the workpiece spindle, and the additive processing point of the workpiece by the laser head and the turning processing point of the workpiece by the tool are separated by a specified distance or more in the rotation axis direction.

[0018] In other examples of the present disclosure, a processing program is provided, which is a processing program for a workpiece executed by a processing device. The processing device comprises: a workpiece spindle for driving the workpiece to rotate; a laser head capable of performing additive processing by supplying powder material to the workpiece and irradiating the workpiece with laser; and a tool holder for holding the tool. The processing program causes the processing device to perform the following steps: rotating the workpiece on the workpiece spindle; and performing simultaneous processing, wherein the simultaneous processing is to perform additive processing by the laser head and turning processing by the tool on the rotating workpiece at the same time. The simultaneous processing is performed in the following state: the laser head and the tool are feed-driven to one side in the direction of the rotation axis of the workpiece spindle, and the additive processing point of the workpiece by the laser head and the turning processing point of the workpiece by the tool are separated by more than a specified distance in the direction of the rotation axis.

[0019] The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a diagram showing an example of the appearance of a processing device.

[0021] Figure 2 This is a diagram showing an example of the device configuration of a processing device.

[0022] Figure 3 It is a figure which shows the cross section of the laser head in additive processing.

[0023] Figure 4 This is a diagram schematically showing a scheme of simultaneous processing from the X-axis direction.

[0024] Figure 5 This is a diagram schematically showing a scheme of simultaneous processing from the Z-axis direction.

[0025] Figure 6 This is a diagram showing an example of a driving mechanism of a processing device.

[0026] Figure 7 This is a diagram showing an example of the hardware configuration of the control unit.

[0027] Figure 8 Yes means Figure 4 Flowchart of the process flow of simultaneous processing shown.

[0028] Fig. 9 This is a diagram schematically showing a scheme of simultaneous processing according to Modification Example 1.

[0029] Fig.10This is a flowchart showing the flow of the simultaneous processing according to Modification Example 1.

[0030] Fig.11 This is a diagram schematically showing a scheme of simultaneous processing according to Modification Example 3. DETAILED DESCRIPTION

[0031] Hereinafter, with reference to the accompanying drawings, various embodiments of the present invention will be described. In the following description, the same reference numerals are used for the same components and constituent elements. Their names and functions are also the same. Therefore, detailed descriptions thereof will not be repeated. It should be noted that the various embodiments and modifications described below may also be appropriately and selectively combined.

[0032] <A. Appearance of processing device 100>

[0033] First, refer to Figure 1 , a processing device 100 according to an embodiment is described. Figure 1 It is a figure which shows an example of the external appearance of the processing apparatus 100.

[0034] The processing device 100 is an AM / SM hybrid processing machine capable of performing additive processing (AM (Additive manufacturing) processing) of a workpiece and subtractive processing (SM (Subtractive manufacturing) processing) of a workpiece. Examples of the subtractive processing function include a milling function and a turning function.

[0035] The processing device 100 includes, for example, a housing 130 and an operation table 200 .

[0036] The cover 130 is a mechanism for protecting components disposed inside the processing device 100. A door DR is disposed on the cover 130. The door DR is, for example, a sliding door. The door DR may be configured to be opened and closed by a driving source such as a motor, or may be configured to be opened and closed manually.

[0037] The operation console 200 is a general-purpose computer having a display for displaying various information related to processing. The display is, for example, a liquid crystal display, an organic EL (Electro Luminescence) display, or other display devices. In addition, the display has a display panel, and various operations for the processing device 100 are accepted through touch operation.

[0038] <B. Device Configuration of Processing Device 100>

[0039] Next, refer to Figure 2 , the device structure of the processing device 100 is described. Figure 2 It is a diagram showing an example of the device configuration of the processing device 100 .

[0040] As described above, the processing device 100 includes the cover 130. The cover 130 constitutes the appearance of the processing device 100, and defines and forms the processing area AR for performing additive processing on the workpiece W.

[0041] Furthermore, the processing device 100 includes a machine base 11 , a tool rest 16 , a workpiece spindle 22 , a tailstock 25 , a tool spindle 30 , and a laser head 140 .

[0042] For the sake of convenience, the rotation axis direction of the workpiece spindle 22 is also referred to as the "Z-axis direction" below. Figure 2 The axes AX1 to AX3 shown are parallel. In addition, a direction on the horizontal plane perpendicular to the Z-axis direction is also referred to as the "X-axis direction". The direction perpendicular to both the X-axis direction and the Z-axis direction is referred to as the "Y-axis direction". Figure 2 In the example, the Y-axis direction corresponds to the direction of gravity.

[0043] The machine base 11 is a base member for supporting various devices provided in the processing device 100. Figure 2 In the example of FIG. 1 , the machine base 11 supports the tool rest 16, the work spindle 22, the tail stock 25, the tool spindle 30, and the laser head 140. The machine base 11 is installed on the floor of a factory or the like. The machine base 11 is formed of metal such as cast iron.

[0044] The tool rest 16 has a turret 18. The turret 18 is configured to be rotatable around the axis AX1. The turret 18 holds a plurality of tools at intervals in the circumferential direction around the axis AX1. In addition, the tool rest 16 is configured to be movable in the X-axis direction and the Y-axis direction by various drive mechanisms such as a motor. The tool rest 16 brings a fixed tool held in the turret 18 into contact with a workpiece W driven by the workpiece spindle 22 for turning.

[0045] The workpiece spindle 22 is configured to be rotatable while holding the workpiece W. More specifically, the workpiece spindle 22 is provided with a chuck mechanism 23. The chuck mechanism 23 is a mechanism for fixing the workpiece W to the workpiece spindle 22. The workpiece spindle 22 is configured to be rotatable around an axis AX2 along its axial direction.

[0046] The tailstock 25 is configured to be movable along the axis AX3 by various drive mechanisms such as a motor. Thus, the tailstock 25 supports the long workpiece W from the side opposite to the workpiece spindle 22. Typically, the axis AX3 is coaxial with the axis AX2. In addition, the tailstock 25 is configured to be rotatable around the axis AX3.

[0047] The tool spindle 30 is provided, for example, at a position higher than the work spindle 22 and the tailstock 25. The tool spindle 30 is configured so that a tool and a laser head 140 can be attached and detached. Figure 2 An example in which the laser head 140 is attached to the tool spindle 30 is shown.

[0048] The laser head 140 can be attached and detached from the tool spindle 30 by, for example, an automatic tool changer (ATC). When the processing device 100 is to perform additive processing of the workpiece W, the laser head 140 is attached to the tool spindle 30. On the other hand, when the processing device 100 is to perform subtractive processing of the workpiece W, the tool is attached to the tool spindle 30.

[0049] As an example of material reduction processing, there is milling processing in which a rotating tool is brought into contact with the workpiece W fixed to the workpiece spindle 22. As another example of material reduction processing, there is turning processing in which a tool is pressed against the workpiece W rotating about the axis AX2.

[0050] The laser head 140 performs additive processing based on the DED (Direct Energy Deposition) method while being attached to the tool spindle 30. The laser head 140 includes a head body 142 and a laser nozzle 146 as a mechanism for realizing additive processing.

[0051] The powder material is supplied to the head main body 142 via a cable (not shown). The supplied powder material may be metal powder, resin powder, or other types of powder that melts by laser irradiation.

[0052] The laser nozzle 146 irradiates laser light toward the workpiece W, and determines an irradiation area of ​​the laser light on the workpiece W. The powder material supplied to the laser head 140 is ejected toward the workpiece W through the laser nozzle 146 .

[0053] <C. Additive Processing>

[0054] Next, refer to Figure 3 , the additive processing performed by the laser head 140 is further described in detail. Figure 3 It is a diagram showing a cross section of the laser head 140 during additive processing.

[0055] The processing device 100 can realize various additive processing by controlling the laser head 140. Types of additive processing include lamination processing and coating processing. Lamination processing is processing in which a layer SL is deposited on a workpiece W. Coating processing is processing in which the surface of the workpiece W is covered with a layer SL.

[0056] The processing device 100 of the embodiment is configured to realize high-speed additive processing. As a high-speed additive processing technology, for example, EHLA (Extreme High-speed Laser Application) can be cited.

[0057] More specifically, the laser head 140 irradiates the rotating workpiece W with the laser beam LS while moving in the axial direction of the workpiece spindle 22 (ie, the Z-axis direction). As a result, the irradiated portion of the laser beam LS melts, and a molten pool MP is formed on the workpiece W.

[0058] In addition, the laser head 140 supplies the powder material PM to the workpiece W in parallel with the irradiation of the laser LS. The supplied powder material PM is melted by the laser LS before reaching the surface of the workpiece W. As a result, the molten powder material PM is put into the molten pool MP. When the molten pool MP solidifies on the workpiece W, it becomes a layer SL.

[0059] <D. Simultaneous processing>

[0060] The processing device 100 rotates the workpiece W at high speed during the high-speed additive processing. Therefore, the processing device 100 can perform turning processing of the workpiece W in parallel with the additive processing of the workpiece W. Hereinafter, the processing of performing additive processing of the workpiece W and turning processing of the workpiece W at the same time will also be referred to as "simultaneous processing".

[0061] Reference Figure 4 and Figure 5 , the simultaneous processing performed by the processing device 100 is described. Figure 4 This is a diagram schematically showing a scheme of simultaneous processing from the X-axis direction. Figure 5 This is a diagram schematically showing a scheme of simultaneous processing from the Z-axis direction.

[0062] Figure 4 1 shows a laser head 140 for performing additive processing on a workpiece W and a tool T for performing turning processing on the workpiece W. The tool T is fixed to the tool holder 16 (see FIG. 1 ) via the turret 18 described above. Figure 2 ).

[0063] The processing device 100 simultaneously performs additive processing by the laser head 140 and turning processing by the tool T on the rotating workpiece W. At this time, the processing device 100 performs simultaneous processing in the following state: the laser head 140 and the tool T are driven to one side in the Z-axis direction, and the additive processing point LP of the workpiece W by the laser head 140 and the turning processing point TP of the workpiece W by the tool T are separated by a predetermined distance ΔD1 or more in the Z-axis direction.

[0064] The additive processing point LP corresponds to the position where the laser head 140 irradiates the workpiece W with laser light. The turning processing point TP corresponds to the position where the tool T performs turning processing on the workpiece W. In other words, the turning processing point TP corresponds to the contact point between the tool T and the workpiece W.

[0065] exist Figure 4In the example of , the processing device 100 performs simultaneous processing in the following state: the additive processing point LP is ahead of the turning processing point TP in the feed direction of the laser head 140 and the tool T. Thus, each part on the workpiece W is processed in the order of "additive processing → turning processing". Typically, the feed speed of the laser head 140 is the same as the feed speed of the tool T.

[0066] The additive processing point LP will become high temperature. Therefore, if turning is performed immediately on the part that has been additively processed, the tool T will be consumed by heat. In addition, the workpiece W will expand at high temperature. If turning is performed when the workpiece W has expanded, dimensional management becomes difficult and the desired processing accuracy may not be obtained.

[0067] In contrast, the processing device 100 of the present embodiment performs simultaneous processing in a state where the additive processing point LP is separated from the turning processing point TP by a distance ΔD1 or more. Therefore, the processing device 100 can perform turning processing after the temperature of the workpiece W is lowered. As a result, the processing device 100 can suppress the consumption of the tool T caused by heat. In addition, the processing device 100 can perform turning processing in a state where the workpiece W does not expand, and can avoid a decrease in processing accuracy.

[0068] Preferably, when viewed from the Z-axis direction, the additive processing point LP, the rotation center CP of the workpiece W, and the turning processing point TP are arranged in the order of the additive processing point LP, the rotation center CP of the workpiece W, and the turning processing point TP. In other words, the rotation center CP of the workpiece W is located between the additive processing point LP and the turning processing point TP in the orthogonal direction of the Z-axis direction. Figure 5 In the example of , the additive processing point LP, the rotation center CP of the workpiece W, and the turning processing point TP are located on a straight line when viewed from the Z-axis direction. That is, the additive processing in the simultaneous processing is performed from one side in the Y-axis direction, and the turning processing in the simultaneous processing is performed from the other side in the Y-axis direction.

[0069] Typically, the additive processing point LP is located at the uppermost portion of the workpiece W when viewed from the Z-axis direction. On the other hand, the turning processing point TP is located at the lowermost portion of the workpiece W when viewed from the Z-axis direction. The additive processing and the turning processing are performed from opposite sides of the workpiece W, respectively, so that the processing apparatus 100 can prevent one of the additive processing and the turning processing from affecting the processing accuracy of the other.

[0070] <E. Driving mechanism of processing device 100>

[0071] Next, refer to Figure 6 , the driving mechanism in the processing device 100 is described. Figure 6 It is a diagram showing an example of a driving mechanism of the processing device 100 .

[0072] like Figure 6 As shown, the processing device 100 includes a control unit 50 , a driving unit 210 , a driving unit 220 , a driving unit 230A, a driving unit 230B, and a driving unit 240 .

[0073] The control unit 50 controls various devices in the processing device 100. The device configuration of the control unit 50 is arbitrary. The control unit 50 can be composed of a single control unit or a plurality of control units. As an example, the control unit 50 includes at least one of a CNC (Computer Numerical Control) and a PLC (Programmable Logic Controller).

[0074] The driving unit 210 is a driving mechanism for rotationally driving the workpiece spindle 22. The driving unit 210 may be composed of a single driving unit or a plurality of driving units. Figure 6 In the example shown in FIG. 2 , the driving unit 210 is composed of a motor driver 211C and a motor 212C.

[0075] The motor driver 211C receives the input of the target rotation angle or the target rotation speed of the workpiece spindle 22 from the control unit 50 one by one, and outputs the current corresponding to the target rotation angle or the target rotation speed to the motor 212C. As a result, the workpiece held by the workpiece spindle 22 rotates with the Z-axis direction as the rotation center. The motor 212C can be an AC motor, a stepping motor, a servo motor, or other types of motors.

[0076] The driving unit 220 is a driving mechanism for driving the tailstock 25. The driving unit 220 may be composed of a single driving unit or a plurality of driving units. Figure 6 In the example of FIG. 2 , the driving unit 220 is composed of a motor driver 221Z and a motor 222Z.

[0077] The motor driver 221Z receives the input of the target position related to the workpiece spindle 22 from the control unit 50 one by one, and outputs the current corresponding to the target position to the motor 222Z. Thus, the motor 222Z moves the tailstock 25 to any position in the Z-axis direction. The motor 222Z can be an AC motor, a stepping motor, a servo motor, or other types of motors.

[0078] The driving unit 230A is a driving mechanism for moving the position of the tool spindle 30. The laser head 140 is driven by being attached to the tool spindle 30. The driving unit 230A may be composed of a single driving unit or a plurality of driving units. Figure 6In the example of FIG. 1 , the driving unit 230A is composed of motor drivers 231X to 231Z and motors 232X to 232Z.

[0079] The motor driver 231X successively receives input of the target position of the tool spindle 30 in the X-axis direction from the control unit 50, and outputs a current corresponding to the target position to the motor 232X. Thus, the motor 232X drives the tool spindle 30 to any position in the X-axis direction. The motor 232X may be an AC motor, a stepping motor, a servo motor, or other types of motors.

[0080] The motor driver 231Y receives the input of the target position of the tool spindle 30 in the Y-axis direction from the control unit 50 one by one, and outputs the current corresponding to the target position to the motor 232Y. Thus, the motor 232Y drives the tool spindle 30 to any position in the Y-axis direction. The motor 232Y can be an AC motor, a stepping motor, a servo motor, or other types of motors.

[0081] The motor driver 231Z successively receives input of the target position of the tool spindle 30 in the Z-axis direction from the control unit 50, and outputs a current corresponding to the target position to the motor 232Z. Thus, the motor 232Z moves the tool spindle 30 to any position in the Z-axis direction. The motor 232Z may be an AC motor, a stepping motor, a servo motor, or other types of motors.

[0082] The driving unit 230B is a driving mechanism for rotationally driving the tool spindle 30. The driving unit 230B may be composed of a single driving unit or a plurality of driving units. Figure 6 In the example of FIG. 1 , the driving unit 230B is composed of a motor driver 231A, a motor driver 231B, a motor 232A, and a motor 232B.

[0083] The motor driver 231A receives the input of the target rotation angle or the target rotation speed of the tool spindle 30 centered on the X-axis direction from the control unit 50 one by one, and outputs the current corresponding to the target rotation angle or the target rotation speed to the motor 232A. The motor 232A drives the tool spindle 30 to rotate centered on the X-axis direction. The motor 232A may be an AC motor, a stepping motor, a servo motor, or other types of motors.

[0084] The motor driver 231B successively receives input of a target rotation angle or a target rotation speed of the tool spindle 30 with the axial direction of the tool spindle 30 as the rotation center from the control unit 50, and outputs a current corresponding to the target rotation angle or the target rotation speed to the motor 232B. The motor 232B rotationally drives the tool spindle 30 with the axial direction of the tool spindle 30 as the rotation center. The motor 232B may be an AC motor, a stepping motor, a servo motor, or other types of motors.

[0085] The driving unit 240 is a driving mechanism for driving the tool rest 16 and the turret 18. The driving unit 240 may be composed of a single driving unit or a plurality of driving units. Figure 6 In the example of FIG. 1 , the driving unit 240 includes a motor driver 241C, a motor driver 241Y, a motor driver 241Z, a motor 242C, a motor 242Y, and a motor 242Z.

[0086] The motor driver 241C receives an input of a target value for the rotation angle of the turret 18 with the Z-axis direction as the center, and outputs a current corresponding to the target value to the motor 242C. Thus, the motor driver 241C controls the rotation angle of the turret 18 with the Z-axis direction as the rotation center. The motor 242C may be an AC motor, a stepping motor, a servo motor, or other types of motors.

[0087] The motor driver 241Y receives the input of the target position of the tool rest 16 in the Y-axis direction from the control unit 50 one by one, and outputs the current corresponding to the target position to the motor 242Y. Thus, the motor 242Y moves the tool rest 16 to any position in the Y-axis direction. The motor 242Y may be an AC motor, a stepping motor, a servo motor, or other types of motors.

[0088] The motor driver 241Z successively receives input of the target position of the tool rest 16 in the Z-axis direction from the control unit 50, and outputs a current corresponding to the target position to the motor 242Z. Thus, the motor 242Z moves the tool rest 16 to any position in the Z-axis direction. The motor 242Z may be an AC motor, a stepping motor, a servo motor, or other types of motors.

[0089] <F. Hardware Configuration of Control Unit 50>

[0090] Next, refer to Figure 7 ,right Figure 6 The hardware configuration of the control unit 50 shown will be described. Figure 7 It is a diagram showing an example of the hardware configuration of the control unit 50 .

[0091] As described above, the control unit 50 may be a CNC or a PLC. Figure 7 2 shows the hardware configuration of the control unit 50 as the CNC.

[0092] The control unit 50 includes, for example, a control circuit 101 , a ROM (Read Only Memory) 102 , a RAM (Random Access Memory) 103 , a communication interface 104 , and an auxiliary storage device 120 . These components are connected to an internal bus 109 .

[0093] The control circuit 101 is, for example, composed of at least one integrated circuit. The integrated circuit may be, for example, composed of at least one CPU (Central Processing Unit), at least one GPU (Graphics Processing Unit), at least one ASIC (Application Specific Integrated Circuit), at least one FPGA (Field Programmable Gate Array), or a combination thereof.

[0094] The control circuit 101 controls the operation of the control unit 50 by executing various programs such as the processing program 122. The processing program 122 is a program for realizing various processes described in this specification. Based on the execution command received from the processing program 122, the control circuit 101 reads the processing program 122 from the ROM 102 to the RAM 103. The RAM 103 functions as a working memory and temporarily stores various data required for the execution of the processing program 122.

[0095] The communication interface 104 is an interface for communicating with various devices. The processing device 100 communicates with various drive units (such as the above-mentioned drive unit 210, drive unit 220, drive unit 230A, drive unit 230B, drive unit 240, etc.) for implementing additive processing of the workpiece via the communication interface 104.

[0096] The auxiliary storage device 120 is a storage medium such as a hard disk or a flash memory. The auxiliary storage device 120 stores a processing program 122, etc. The storage location of the processing program 122 is not limited to the auxiliary storage device 120, and may also be stored in a storage area (such as a cache memory) of the control circuit 101, ROM 102, RAM 103, an external device (such as a server), etc.

[0097] In addition, the processing program 122 may not be provided as a single program, but may be provided embedded in a part of an arbitrary program. In this case, the various processes of the present embodiment are implemented in collaboration with an arbitrary program. Even a program that does not include such a part of the module does not deviate from the main purpose of the processing program 122 of the present embodiment. Moreover, part or all of the functions provided by the processing program 122 may also be implemented by dedicated hardware. Moreover, the control unit 50 may also be configured in the form of a so-called cloud service in which at least one server executes a part of the processing of the processing program 122.

[0098] <G. Control flow of simultaneous processing>

[0099] Next, refer to Figure 8 , the control flow of simultaneous processing is explained. Figure 8 Yes means Figure 4 Flowchart of the process flow of simultaneous processing shown.

[0100] Figure 8 The processing shown is realized, for example, by executing the processing program 122 described above by the control unit 50 of the processing device 100. In other aspects, part or all of the processing may be executed by circuit elements or other hardware.

[0101] In step S112, the control unit 50 controls the driving unit 210 (see Figure 6 ) is controlled to start the rotation of the workpiece W.

[0102] In step S114, the control unit 50 starts the simultaneous processing of additive processing and turning processing. At this time, the control unit 50 feeds the laser head 140 and the tool holder 31 at the same speed in the Z-axis direction in such a way that the additive processing point LP is ahead of the turning processing point TP. In addition, the control unit 50 maintains the distance between the additive processing point LP and the turning processing point TP at a predetermined distance ΔD1 (refer to Figure 4 ). The distance ΔD1 may be preset or arbitrarily set by the user.

[0103] In step S120 , the control unit 50 determines whether the laser head 140 has reached the processing end position. The processing end position of the laser head 140 is described in the processing program 122 , for example.

[0104] If it is determined that the laser head 140 has reached the processing end position ("YES" in step S120), the control unit 50 switches control to step S122. If not ("NO" in step S120), the control unit 50 executes the process of step S120 again.

[0105] In step S122, the control unit 50 stops the additive processing performed by the laser head 140. More specifically, the control unit 50 causes the laser head 140 to stop supplying the powder material and irradiating the laser.

[0106] In step S130 , the control unit 50 determines whether the tool rest 31 has reached the machining end position. The machining end position of the tool rest 31 is described in the machining program 122 , for example.

[0107] If it is determined that the tool rest 31 has reached the machining end position (YES in step S130), the control unit 50 switches control to step S132. Otherwise (NO in step S130), the control unit 50 executes the process of step S130 again.

[0108] In step S132 , the control unit 50 stops the turning process performed by the tool T. More specifically, the control unit 50 stops the rotation of the workpiece W by the workpiece spindle 22 , and controls the drive of the tool rest 31 so that the tool T is separated from the workpiece W.

[0109] <H. Modification 1>

[0110] Next, refer to Fig. 9 ,right Figure 4 A modified example of the simultaneous processing shown will be described.

[0111] In the above Figure 4 In the example of , the simultaneous processing is performed in a state where the additive processing point LP is ahead of the turning processing point TP. However, the simultaneous processing may also be performed in a state where the turning processing point TP is ahead of the additive processing point LP.

[0112] Fig. 9 1 is a diagram schematically showing a scheme of simultaneous processing of Modification Example 1. Fig. 9 In the example of , the processing device 100 performs simultaneous processing in the following state: the turning processing point TP is ahead of the additive processing point LP in the feeding direction of the laser head 140 and the tool T. Fig. 9 In the example shown in FIG. 1 , the turning processing point TP leads the additive processing point LP by a distance ΔD2.

[0113] The distance ΔD2 is determined to be greater than the distance that the tool T or the laser head 140 moves in the Z-axis direction while the workpiece W rotates half a circle. As an example, when the tool T or the laser head 140 moves 0.2 mm in the feed direction while the workpiece W rotates one circle, the distance ΔD2 is determined to be greater than 0.1 mm.

[0114] Thus, each part on the workpiece W is processed in the order of "turning processing → additive processing". By first performing the turning processing, the surface of the workpiece becomes suitable for additive processing. As a result, the accuracy of the additive processing of the workpiece is improved.

[0115] <I. Control flow of simultaneous processing in modification 1>

[0116] Next, refer to Fig.10 , the control flow of simultaneous processing of variant example 1 is explained. Fig.10 Yes means Fig. 9 Flowchart of the process flow of simultaneous processing shown.

[0117] Fig.10 The processing shown is realized, for example, by executing the processing program 122 described above by the control unit 50 of the processing device 100. In other aspects, part or all of the processing may be executed by circuit elements or other hardware.

[0118] In step S212, the control unit 50 controls the driving unit 210 (see Figure 6 ) is controlled to start the rotation of the workpiece W.

[0119] In step S214, the control unit 50 starts the simultaneous processing of additive processing and turning processing. At this time, the control unit 50 feeds the laser head 140 and the tool holder 31 at the same speed in the Z-axis direction so that the turning processing point TP is ahead of the additive processing point LP. In addition, the control unit 50 maintains the distance between the turning processing point TP and the additive processing point LP at a predetermined distance ΔD2 (refer to Fig. 9 ). The distance ΔD2 may be preset or arbitrarily set by the user.

[0120] In step S220 , the control unit 50 determines whether the tool rest 31 has reached the machining end position. The machining end position of the tool rest 31 is described in the machining program 122 , for example.

[0121] If it is determined that the tool rest 31 has reached the machining end position (YES in step S220), the control unit 50 switches control to step S222. Otherwise (NO in step S220), the control unit 50 executes the process of step S220 again.

[0122] In step S222 , the control unit 50 stops the turning process performed by the tool T. More specifically, the control unit 50 controls the drive of the tool rest 31 so that the tool T is separated from the workpiece W.

[0123] In step S230 , the control unit 50 determines whether the laser head 140 has reached the processing end position. The processing end position of the laser head 140 is described in the processing program 122 , for example.

[0124] If it is determined that the laser head 140 has reached the processing end position ("YES" in step S230), the control unit 50 switches control to step S232. Otherwise ("NO" in step S230), the control unit 50 executes the process of step S230 again.

[0125] In step S232, the control unit 50 stops the additive processing by the laser head 140. More specifically, the control unit 50 stops the supply of the powder material and the irradiation of the laser by the laser head 140. In addition, the control unit 50 stops the rotation of the workpiece W by the workpiece spindle 22.

[0126] <J. Modification 2>

[0127] Next, the simultaneous processing according to Modification Example 2 will be described.

[0128] In the above Figure 4 In the example of , the simultaneous processing is performed in the following state: the additive processing point LP is ahead of the turning processing point TP. Fig. 9 In the example of , simultaneous machining is performed in the following state: the turning machining point TP is ahead of the additive machining point LP. In contrast, in this modified example, the machining device 100 performs a combination of simultaneous machining in which the additive machining point LP is ahead of the turning machining point TP and simultaneous machining in which the turning machining point TP is ahead of the additive machining point LP.

[0129] More specifically, first, the control unit 50 performs simultaneous machining in a state where the turning machining point TP is ahead of the additive machining point LP. Next, the control unit 50 returns the tool holder 31 to the machining start position based on the turning machining point TP having reached the machining end position. Thereafter, the control unit 50 performs simultaneous machining in a state where the additive machining point LP is ahead of the turning machining point TP.

[0130] Next, the control unit 50 returns the laser head 140 to the processing start position based on the fact that the additive processing point LP has reached the processing end position. Thereafter, the control unit 50 performs simultaneous processing in a state where the turning processing point TP is ahead of the additive processing point LP.

[0131] As described above, in this modification, the machining apparatus 100 alternately and repeatedly performs simultaneous machining in which the turning machining point TP leads the additive machining point LP and simultaneous machining in which the additive machining point LP leads the turning machining point TP.

[0132] <K. Modification 3>

[0133] Next, refer to Fig.11 , the simultaneous processing of variant example 3 is explained. Fig.11 This is a diagram schematically showing a scheme of simultaneous processing according to Modification Example 3.

[0134] In this modification, the processing device 100 further includes a spray mechanism 60 for spraying a fluid onto the workpiece W. Furthermore, the processing device 100 performs simultaneous processing while spraying the fluid onto the workpiece W. Thus, the processing device 100 can cool the workpiece W heated by additive processing.

[0135] It should be noted that the fluid ejected by the ejection mechanism 60 may be air, a coolant, or other types of gas or liquid. When the coolant is used to cool the workpiece W, the processing device 100 can more efficiently reduce the temperature of the workpiece W and suppress the reduction in processing accuracy caused by temperature changes. On the other hand, when air is used to cool the workpiece W, the reduction in processing accuracy associated with the attachment of liquid to the workpiece surface can be suppressed.

[0136] The ejection mechanism 60 is configured to be drivable in the Z-axis direction. As an example, the ejection mechanism 60 is provided on the tool holder 31 and is fed and driven integrally with the tool holder 31. As another example, the drive unit (not shown) of the ejection mechanism 60 is connected to the drive unit 240 (see FIG. 24) of the tool holder 31. Figure 6 ) is separately provided in the processing device 100. The driving unit of the ejection mechanism 60 is configured to be able to drive the ejection mechanism 60 at least in the Z-axis direction.

[0137] The processing device 100 performs simultaneous processing while feeding and driving the ejection mechanism 60, the laser head 140, and the tool T at the same speed toward one side in the Z-axis direction. At this time, the simultaneous processing is performed in the following state: the additive processing point LP is ahead of the ejection site AP of the fluid for the workpiece W, and the ejection site AP is ahead of the turning processing point TP. As a result, each site on the workpiece W is processed in the order of "additive processing → fluid ejection → turning processing".

[0138] Thus, the processing apparatus 100 can perform turning after more reliably lowering the temperature of the workpiece W. As a result, the processing apparatus 100 can suppress thermal wear of the tool T. Furthermore, the processing apparatus 100 can perform turning without expanding the workpiece W, thereby preventing a decrease in processing accuracy.

[0139] The embodiments disclosed this time should be considered as illustrative in all aspects and not restrictive. The scope of the present invention is indicated by the claims rather than the above description, and is intended to include all modifications within the meaning and scope equivalent to the claims.

[0140] Description of reference numerals:

[0141] 11: base; 16: tool rest; 18: turret; 22: workpiece spindle; 23: chuck mechanism; 25: tailstock; 30: tool spindle; 31: tool rest; 50: control unit; 60: ejection mechanism; 100: processing device; 101: control circuit; 102: ROM; 103: RAM; 104: communication interface; 109: internal bus; 120: auxiliary storage device; 122: processing program; 130: cover; 140: laser head; 142: head body; 146: laser nozzle; 200: operation table; 210: drive unit; 211C: motor driver; 212C: motor; 220: drive unit; 221Z: motor driver; 222Z: motor; 230A: drive unit; 230B: drive unit; 231 A: motor driver; 231B: motor driver; 231X: motor driver; 231Y: motor driver; 231Z: motor driver; 232A: motor; 232B: motor; 232X: motor; 232Y: motor; 232Z: motor; 240: driving unit; 241C: motor driver; 241Y: motor driver; 241Z: motor driver; 242C: motor; 242Y: motor; 242Z: motor; AP: ejection part; AR: processing area; AX1: axis; AX2: axis; AX3: axis; CP: rotation center; DR: door; LP: additive processing point; LS: laser; MP: molten pool; PM: powder material; SL: layer; T: tool; TP: turning processing point; W: workpiece.

Claims

1. A processing method is a method for processing a workpiece by a processing device, The processing device comprises: A workpiece spindle, used for rotationally driving the workpiece; a laser head capable of performing additive processing by supplying powder material to the workpiece and irradiating the workpiece with laser light; and Tool holder, used to hold the tool, The processing method comprises the following steps: rotating the workpiece on the workpiece spindle; and performing simultaneous machining, wherein the workpiece being rotated is subjected to additive machining by the laser head and turning machining by the tool at the same time, The simultaneous processing is performed in the following state: the laser head and the tool are driven to one side in the rotation axis direction of the workpiece spindle, and the additive processing point of the workpiece by the laser head and the turning processing point of the workpiece by the tool are separated by more than a specified distance in the rotation axis direction.

2. The processing method according to claim 1, wherein: The simultaneous machining is performed in a state where the additive machining point is ahead of the turning machining point on the one side.

3. The processing method according to claim 1, wherein: The simultaneous machining is performed in a state where the turning machining point is ahead of the additive machining point on the one side.

4. The processing method according to any one of claims 1 to 3, wherein: When viewed from the rotation axis direction, the additive processing point, the rotation center of the workpiece, and the turning processing point are arranged in the order of the additive processing point, the rotation center of the workpiece, and the turning processing point.

5. The processing method according to claim 1 or 2, wherein: The processing device further comprises a spraying mechanism for spraying a fluid toward the workpiece. The simultaneous machining is performed while the fluid is ejected toward the workpiece.

6. The processing method according to claim 5, wherein: The fluid is air or coolant.

7. The processing method according to claim 5, wherein: The simultaneous machining is performed in a state where the additive machining point is ahead of a portion where the fluid is ejected to the workpiece on the one side, and the ejection portion is ahead of the turning machining point on the one side.

8. A processing device is a processing device for a workpiece, wherein: The processing device comprises: A workpiece spindle, used for rotationally driving the workpiece; a laser head capable of performing additive processing by supplying powder material to the workpiece and irradiating the workpiece with laser light; a knife holder for holding knives; and A control unit, used to control the processing device, The control unit performs the following processing: rotating the workpiece on the workpiece spindle; and performing simultaneous machining, wherein the workpiece being rotated is subjected to additive machining by the laser head and turning machining by the tool at the same time, The simultaneous processing is performed in the following state: the laser head and the tool are driven to one side in the rotation axis direction of the workpiece spindle, and the additive processing point of the workpiece by the laser head and the turning processing point of the workpiece by the tool are separated by more than a specified distance in the rotation axis direction.

9. A processing program is a processing program executed by a processing device for a workpiece, wherein: The processing device comprises: A workpiece spindle, used for rotationally driving the workpiece; a laser head capable of performing additive processing by supplying powder material to the workpiece and irradiating the workpiece with laser light; and Tool holder, used to hold the tool, The processing program causes the processing device to perform the following steps: rotating the workpiece on the workpiece spindle; and performing simultaneous machining, wherein the workpiece being rotated is subjected to additive machining by the laser head and turning machining by the tool at the same time, The simultaneous processing is performed in the following state: the laser head and the tool are driven to one side in the rotation axis direction of the workpiece spindle, and the additive processing point of the workpiece by the laser head and the turning processing point of the workpiece by the tool are separated by more than a specified distance in the rotation axis direction.

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