Method for producing workpiece having structured layer

Abstract

The present disclosure relates to a method of producing at least one workpiece having a structured layer on a support, the method comprising the steps of: S10: providing a support having a liquid curable layer on a surface thereof; s12, a masking agent is applied to the layer, the masking agent has a first layer thickness at a first position on the layer, the masking agent has a second layer thickness at a second position on the layer, and the first layer thickness is larger than the second layer thickness; s14, the layer is cured, and the material of the layer below the first position where the masking agent is applied is not cured or the curing degree of the material of the layer below the second position where the masking agent is applied is lower than that of the material of the layer below the second position where the masking agent is applied; and S16: removing the uncured material in the layer, so that the cured material of the layer forms a structured layer with a height profile on the support. The present disclosure also relates to a device for carrying out the method.

Description

Technical Field

[0001] The invention relates to a method for producing at least one workpiece having a structured layer on a support, and to a device for carrying out the method. Background Art

[0002] The production of workpieces with structured layers, in particular workpieces for decorative purposes, is known. For example, parts for flooring or furniture production with a wooden decoration have, in addition to a wooden appearance, a tactilely perceptible wooden structure. Various methods have been developed in the past for this purpose. For example, the wooden structure is embossed into a plastic layer using an embossing tool, such as an embossing roller or an embossing plate, in order to obtain a typical wood impression in the plastic layer. The use of embossing tools is usually not very flexible, since the design of the structure is limited to the pattern on the embossing tool.

[0003] The workpiece with the structured layer can also be further processed in subsequent production steps. For example, the edges of the structured layer (especially the edges that can later serve as visible edges) can be provided with chamfers or roundings. This involves removing material, especially from the structured layer. This is time-consuming because at least one additional process step is required. Summary of the invention

[0004] Therefore, it is an object of the present invention to provide an alternative to the above method in order to solve at least one of the above problems.

[0005] In order to achieve the above object, the present disclosure provides a method for producing at least one workpiece having a structured layer on a support, the method comprising the following steps:

[0006] - Step S10: providing a support having a liquid and curable layer on its surface;

[0007] - Step S12: applying a masking agent on the layer, so that the masking agent has a first layer thickness at a first position on the layer, and has a second layer thickness at a second position on the layer, wherein the first layer thickness is greater than the second layer thickness;

[0008] - step S14: curing the layers, wherein the material of the layer below the masking agent applied at the first position is not cured or is cured to a lesser extent than the material of the layer below the masking agent applied at the second position; and

[0009] - Step S16: removing the uncured material in the layer, so that the cured material of the layer forms a structured layer with a height profile on the support.

[0010] Preferably, the workpiece or the support member is plate-shaped.

[0011] Preferably, the structured layer forms a surface on the support which is characterized by a height profile. This means that, in a cross-sectional view of a workpiece produced in this way, the thickness of the layer of the support varies in at least one direction, thereby guiding the cutting in such a way that both the support and the layer are cut.

[0012] During the curing process, the masking agent may protect the layer or material of the layer below the masking agent from being completely cured. It is also conceivable that a complete blocking of curing occurs at the first location, the layer remaining in a liquid state or at least in a state prior to step S14.

[0013] Preferably, the height of the height profile in the first position is lower than in the second position. In this way, a structure can be formed in the layer, which structure is modeled, for example, on any decoration (such as wood, stone or tile decoration). Generally, a lower height means that less layer material has been solidified in the first position, so after step S16, this part of material has been removed and the corresponding depression remains in the layer, i.e. a lower height profile is formed than in the second position.

[0014] Preferably, the first position and the second position are directly adjacent to each other. If the masking agent is applied on the directly adjacent position with different layer thicknesses, in the curing process of step S14, it is possible to realize that the adjacent position is cured to different degrees. According to the amount of the masking agent applied at these two positions and possible other adjacent positions, the gradual curing of the following layer material can be realized. If the amount of the masking agent applied is carried out to corresponding fine classification between each position, the continuous variable curing of the layer from one position to another position can also be realized. For example, if the layer thickness of the masking agent is maximum at the first position, smaller at the second position and further reduced at more adjacent positions, starting from the minimum curing at the first position, the following layer can be cured more and more. Remove uncured material from the layer, thereby forming a corresponding gradient height profile.

[0015] Preferably, the first position or the second position is located at the edge of the layer. In this way, the height profile may also be affected at the edge of the layer. If the first position is located at the edge of the layer and the second position is adjacent to the first position, then starting from the edge of the layer towards the center of the layer, a curing of the layer rising from the edge can be achieved and finally, after removing the uncured material in the layer, a height profile rising from the edge towards the center of the layer is formed.

[0016] Preferably, the first position and the second position extend along a first direction parallel to the surface of the support. In this way, it can be achieved that the height profile formed after removing the uncured material of the layer extends along this direction. For example, if a depression is formed by removing the uncured material of the layer at the first position or the second position, the depression will extend along this direction. For example, the height profile can be directed to other contours of the workpiece. For example, the direction can extend parallel to the edge of the layer or the support.

[0017] Preferably, the separating tool is used to separate the support with the layer thereon in the first direction. In particular when producing a large number of such workpieces, a large support with the layer thereon can be cut into smaller forms. For this purpose, for example, a saw is used as a separating tool to cut the support and the layer thereon to obtain the desired form. The cutting is preferably carried out after the layer has been solidified according to step S14. However, the cutting can be carried out before or after the removal of unsolidified material in the layer in step S16.

[0018] Preferably, the height profile is in the form of a chamfer or a rounding. The chamfer or rounding preferably extends along the edge of the layer or the support. In this way, an additional processing step of introducing the chamfer or rounding by means of a tool can be omitted, because the chamfer or rounding is already formed as a height profile or part of the height profile according to step S16 as the uncured material in the layer is removed.

[0019] The following method is preferred. The cutting direction or cutting line is defined as the above-mentioned first direction, along which the tool separates the workpiece and the layer thereon. The masking material is applied to the layer parallel to this direction, so that the first position and the second position and possible other positions at which the masking material is applied to the layer extend parallel to this direction, wherein the first position is preferably directly adjacent to the area through which the tool is guided when performing the cutting. For example, this can be an area on the layer through which the saw blade is guided as a tool. After the layer is cured, the material of the layer below the masking material is correspondingly less cured. Then the cutting is performed to separate the workpiece, followed by removing the uncured material from the layer (step S16). Alternatively, the uncured material in the layer can be removed first (step S16) and then the cutting for separating the workpiece is performed. After removing the uncured material from the layer, a height profile is retained adjacent to the cutting edge, and if corresponding masking is performed at the first and second positions, the height profile will especially form a chamfer or rounding parallel to the cutting edge. Therefore, there is no need to perform subsequent chamfering or rounding in a separate processing step.

[0020] Preferably, the height profile has different heights along a second direction, which extends perpendicularly to the first direction and parallel to the surface of the support. Thus, the cross section of the workpiece determined by the height profile varies in height along the second direction. Preferably, the cross section is constant in the first direction. In this way, grooves or height profiles corresponding to milled grooves, chamfers or edge fillets or similar elements can be formed in the layer. However, it is not necessary to actually introduce the grooves in a post-processing step.

[0021] Preferably, the height profile rises in the second direction starting from the cutting edge produced by the separating tool. In this way, a height profile is formed starting from the cutting edge, which height profile can be formed as a chamfer, rounding, etc. In this way, mechanical post-processing of the workpiece edge can be omitted.

[0022] Preferably, a masking agent is applied to a partial area of ​​the layer so that at least a third location of the layer remains uncovered by the masking agent. This location is then exposed and is not prevented from curing during the curing process (step S14). Preferably, after the location is cured, no material is removed from the location during the removal of uncured material in the layer (step S16).

[0023] Preferably, in step S12, the masking agent is applied to the layer in liquid form. In this way, quantitative dosing can be easily achieved.

[0024] Preferably, in step S12, the masking agent is applied to the layer in the form of droplets, and particularly preferably, a digital printing device is used. The digital printing device can apply the masking agent flexibly and accurately, and can also apply the masking agent in a corresponding quantitative manner.

[0025] Preferably, before step S12, the layer has been partially dried or cured so that the masking agent can be carried by the layer. For example, drying can be performed by heating the layer, thereby removing liquid from the layer, for example by evaporation, so that its viscosity, surface tension and / or density change accordingly, so that the masking agent can be supported. Curing with corresponding changes in viscosity, surface tension and / or density can be performed in the same curing manner as according to step S14, as described below. However, in each case, drying or curing is performed before step S12 so that the layer is not completely cured, so that material can still be removed from the layer in step S16.

[0026] Preferably, the curing in step S14 includes radiation curing, heat curing and / or drying curing. The layer is preferably in the form of a polymerizable layer, which can be polymerized by radiation from a curing device. In particular, ultraviolet radiation, infrared radiation or electron radiation can be used for this purpose. For example, when heated, the solvent or liquid in the layer can evaporate during drying, and / or remove the liquid from the layer.

[0027] The masking agent is preferably a solvent-based or water-based digital printable ink or analog printable ink. Alternatively, the masking agent may also be water.

[0028] Preferably, in step S16, the uncured material in the layer is removed mechanically and / or contactlessly. In the case of mechanical removal, the removal may be performed by a contact element. In particular, the contact element may comprise a brush element, such as a fixed or rotating brush, and / or a planar element, which removes the uncured material in the layer when in contact with the layer. In the case of contactless removal, in particular a fluid ejected from a nozzle may be used, the fluid being directed onto the layer and removing the uncured material on the layer. The fluid may preferably contain solids, such as sand, dry ice, etc. Preferably, the removed material of the layer is sucked by a suction device. Preferably, the suction device is positioned so that the layer material removed by the contact element or the fluid flow moves toward the suction device. The contact element, the nozzle and / or the suction device may be part of a removal device of the device further described below.

[0029] Preferably, step S10 comprises applying a layer to the support. The layer may be applied by a digital printing device or by other methods. Specifically, the layer may be applied by an analog printing process using a printing roller or a casting device.

[0030] Alternatively or additionally, step S10 comprises providing or applying a base decoration below the structured layer, wherein the base decoration is visible through the structured layer. The base decoration may typically be a decorative image. For example, if a wooden decoration is to be produced, the wooden decoration may be present on the workpiece or applied to the workpiece as a base decoration. This application may use digital or analog printing equipment. The structured layer itself, i.e. the solidified layer on the support provided with the height profile, is preferably configured to be at least partially transparent so that the base decoration can be identified, the structured layer in combination with the visible base decoration forming an optical entity for an observer.

[0031] A device for executing the above method is described below. It is clear to those skilled in the art that the embodiments of the above method should also be understood as corresponding structural features of the device.

[0032] Preferably, a device for performing the above method is provided, the device comprising the following elements:

[0033] - an application device configured to apply a masking agent to the layer;

[0034] - curing means configured to cure said layer; and

[0035] - a removal device configured to remove uncured material from the layer;

[0036] Therein, the apparatus comprises a control device, which is configured to control the applying device, the curing device and the removing device according to steps S12, S14 and S16.

[0037] Preferably, the device comprises at least one of the following elements:

[0038] - a preparation device, the preparation device being configured to provide a support; in particular, to perform step S10 as described above; and / or

[0039] - a separating device comprising a separating tool, the separating device being configured to separate the support having the layer thereon along a first direction.

[0040] Preferably, the apparatus comprises a conveying device; in particular, preferably a belt conveyor, the conveying device being configured to convey the support or the workpiece to the corresponding element.

[0041] The present invention will be described below with reference to preferred embodiments in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 A flowchart of a preferred embodiment of the method;

[0043] Figure 2a -c is a production phase for producing a workpiece according to a first embodiment of the method;

[0044] Figure 3a -c is a production phase in which a workpiece is produced according to a second embodiment of the method; and

[0045] Figure 4a -c is a stage of production of the workpiece according to a third embodiment of the method.

[0046] Description of Reference Numerals

[0047] 1. Support; 2. Layer; 3. Masking agent; 4. First position of layer; 5. Second position of layer; 6. Third position of layer; 7. Support surface; S10, S12, S14, S16: method steps. DETAILED DESCRIPTION

[0048] Figure 1 A flow chart showing a preferred embodiment of the method is shown.

[0049] The method described is for producing at least one workpiece having a structured layer on a support, the method comprising the following steps:

[0050] - Step S10: providing a support having a liquid and curable layer on its surface;

[0051] - step S12: applying a masking agent on the layer such that the masking agent has a first layer thickness at a first location of the layer and such that the masking agent has a second layer thickness at at least a second location of the layer, wherein the first layer thickness is greater than the second layer thickness;

[0052] - step S14: curing the layer, wherein the material of the layer below the first location where the masking agent is applied is not cured or is less cured than the material of the layer below the second location where the masking agent is applied; and

[0053] - Step S16: removing the uncured material in the layer, so that the cured material of the layer forms a structured layer with a height profile on the support.

[0054] In the following Figure 2a The production phases of the workpiece described in 3a-c, 3a-c and 4a-c refer to the above-mentioned method steps.

[0055] Figure 2a -c shows a production phase of a workpiece according to a first embodiment of the method.

[0056] exist Figure 2a In the figure, a workpiece is shown in cross section, which workpiece comprises a support 1 and a layer 2 on a support surface 7. A substrate decoration, such as a decorative image, may be present on the support surface 7. Figure 1 As explained in the overview, the state of the workpiece shown here corresponds to the state at the end of step S10 .

[0057] exist Figure 2b In the workpiece, a masking agent 3 is applied to the layer 2 at a first location 4 and a second location 5. The masking agent 3 is applied in such a way that the first layer thickness of the masking agent 3 at the first location 4 is greater than the layer thickness of the masking agent 3 at the second location 5. A third location 6 of the layer 2 is not covered by the masking agent 3. This location is exposed. Figure 2b The state shown corresponds to the state after executing step S12.

[0058] The masking agent 3 is configured to weaken the curing effect on the material of the layer 2 below the masking agent at the first position 4 and the second position 5 during the subsequent curing of the layer according to step S14, or if the layer thickness of the masking agent 3 is selected accordingly, it can be completely masked in the first position 4. The curing according to step S14 is then carried out, for example, by radiation from a curing device, such as ultraviolet radiation, infrared radiation or electronic radiation. The layer 2 is thus cured to the highest degree at position 6 and to the lowest degree at position 4. The masking agent 3 here serves to block the radiation input or at least attenuate the radiation input.

[0059] Figure 2cThe state of the workpiece after step S16 has been performed and the uncured material in layer 2 has been removed is shown. As mentioned above, the removal can be carried out in particular by mechanical and / or non-contact means. In the first position 4, a greater masking effect on layer 2 is achieved by the masking agent 3 applied with a greater layer thickness, so only a slight curing is performed here, and a relatively large amount of material can be removed. In contrast, in the second position 5, the masking effect on layer 2 is weaker, so its curing is not hindered to the same extent, so there is less uncured material here, which has been removed. On the other hand, the exposed third position 6 of layer 2 has been completely cured, so there is no uncured material here, so it cannot be removed. This can be explained by the fact that after curing in S14, layer 2 is suitable for removal according to step S16 without removing the cured material of layer 2. Therefore, there are indentations at positions 4 and 5, wherein the first position 4 has a larger indentation because more uncured material is removed here.

[0060] Figure 3a -c shows a production phase of a workpiece according to a second embodiment of the method.

[0061] exist Figure 3a In the figure, a workpiece is shown in cross section, which workpiece has a support 1 and a layer 2 on a support surface 7. The support surface 7 may have a base decoration, such as a decorative image. Figure 1 As explained in the overview, the state of the workpiece shown here corresponds to the state at the end of step S10 .

[0062] The status shown here is the same as Figure 2a However, in contrast, step S12, i.e. the application of the masking agent 3, is performed in such a way that the first position 4 is adjacent to the left edge of the layer 2 and the second position 5 is adjacent to the right edge of the first position 4. Figure 3b As shown. Therefore, it is achieved that the curing degree of the material of the layer 2 under the masking agent 3 at the first position 4 is lower than the curing degree of the material of the layer 2 under the masking agent 3 at the second position 5. At positions 4 and 5, the effect of curing S14 gradually increases from left to right until finally the entire layer 2 is cured according to the exposed third position 6.

[0063] If the uncured material in layer 2 is now removed according to step S16, then Figure 3c In the cross section shown, the height profile rises from left to right up to the maximum height of layer 2. If the masking agent 3 is applied in such a way that positions 4 and 5 extend parallel to the edge or border of layer 2, i.e. perpendicular to Figure 3b , the left edge of layer 2 and the corresponding edge of the workpiece can be chamfered here.

[0064] Figure 4a-c shows a production stage of a workpiece according to a third embodiment of the process.

[0065] exist Figure 4a In the figure, a workpiece is shown in cross section, which workpiece has a support 1 and a layer 2 on a support surface 7. The support surface 7 may have a base decoration, such as a decorative image. Figure 1 As explained in the overview, the state of the workpiece shown here corresponds to the state at the end of step S10 .

[0066] like Figure 4b As shown, the masking agent in step S12 is not Figure 3b The masking agent 3 is applied to the edge of the layer 2 as shown. In contrast, according to step S12, the masking agent 3 is applied here so that there is a first position 4, whose layer thickness of the masking agent 3 is greater than the adjacent second position 5. In addition, the application is performed in such a way that another configuration with a first position 4 and a second position 5 is present on the workpiece. At the dot-dash line drawn vertically in the figure, the arrangement of the first position 4 and the second position 5 is mirrored, so that between the two configurations of the first position 4 and the second position 5, there is an area marked by two vertical dashed lines. This area represents the area in which the separation tool is subsequently guided. The respective first position 4 is directly adjacent to this area. Positions 4 and 5 extend perpendicular to the drawing plane and are therefore parallel to the first direction of guiding the separation tool.

[0067] Figure 4c The state after curing the layer 2 according to step S14 and removing the uncured material of the layer 2 according to step S16 is shown. In addition, a separation tool (such as a saw) is used to separate the workpiece, thereby removing the material of the support 1 and the material of the layer 2 located in the area shown by the dotted line. Now, two independent workpieces can be seen on the left and right sides of this area.

[0068] By distributing the layer thickness of the masking agent 3 at positions 4 and 5 accordingly, the material of the underlying layer 2 can be prevented from solidifying, so that after step S16, a height profile corresponding to the chamfer is formed on the layer 2 near the area indicated by the dotted line.

[0069] Therefore, a further processing step of subsequently generating a chamfer can be omitted, since the chamfer has already been generated as a height profile. The generated chamfer extends from the corresponding cutting edge (i.e. the area marked by the dashed line) to the left or right along a second direction with increasing height. The second direction extends in a drawing plane perpendicular to the first direction and parallel to the support surface 7.

Claims

1. A method for producing at least one workpiece having a structured layer on a support (1), comprising the following steps: - Step (S10): providing a support (1) having a liquid and curable layer (2) on its surface (7); - Step (S12): applying a masking agent (3) on the layer (2), so that the masking agent (3) has a first layer thickness at a first position (4) on the layer (2), and so that the masking agent (3) has a second layer thickness at a second position (5) on the layer (2), wherein the first layer thickness is greater than the second layer thickness; - step (S14): curing the layer (2), wherein the material of the layer (2) below the masking agent (3) applied at the first position (4) is not cured or is cured to a lesser extent than the material of the layer (2) below the masking agent (3) applied at the second position (5); and - Step (S16): removing the uncured material in the layer (2), so that the cured material of the layer (2) forms a structured layer with a height profile on the support (1).

2. The method according to claim 1, wherein: The height profile in the first position (4) has a lower height than in the second position (5).

3. A method according to any one of the preceding claims, wherein: The first position (4) and the second position (5) are directly adjacent to each other.

4. A method according to any one of the preceding claims, wherein: The first position (4) or the second position (5) is located at the edge of the layer (2).

5. A method according to any one of the preceding claims, wherein: The first position (4) and the second position (5) extend along a first direction parallel to the surface (7) of the support.

6. The method according to claim 5, wherein: The support (1) having the layer (2) thereon is separated along the first direction by a separation tool.

7. A method according to any one of the preceding claims, wherein: The height profile has a chamfered or rounded shape.

8. The method according to any one of claims 5 to 7, wherein: The height profile has different heights along a second direction, which is perpendicular to the first direction and extends along a surface (7) parallel to the support.

9. The method according to claim 6 or 8, wherein: The height profile rises in the second direction starting from a cutting edge produced by the separation tool.

10. A method according to any one of the preceding claims, wherein: The masking agent (3) is applied to a partial area of ​​the layer (2), and at least a third location (6) of the layer (2) remains uncovered by the masking agent (3).

11. A method according to any one of the preceding claims, wherein: In step (S12), the masking agent (3) is applied to the layer (2) in liquid form.

12. A method according to any one of the preceding claims, wherein: In step (S12), the masking agent (3) is applied to the layer (2) in the form of droplets using a digital printing device.

13. A method according to any one of the preceding claims, wherein: Prior to step (S12), the layer (2) is partially dried or cured so that the masking agent (3) can be carried by the layer (2).

14. A method according to any one of the preceding claims, wherein: In step (S14), the curing includes radiation curing, heating curing and / or drying curing.

15. A method according to any one of the preceding claims, wherein: In step (S16), uncured material in the layer (2) is removed mechanically and / or non-contactly.

16. A method according to any one of the preceding claims, wherein: Step (S10) comprises: The layer (2) is applied to the support (1) and / or a substrate decoration is arranged or applied underneath the layer (2), wherein the substrate decoration is visible through the structured layer.

17. Apparatus for carrying out the method according to any one of the preceding claims, comprising the following elements: - an application device configured to apply the masking agent (3) to the layer (2); - curing means, configured to cure the layer (2); and - a removal device configured to remove uncured material from the layer (2); Wherein, the apparatus comprises a control device, which is configured to control the applying device, the curing device and the removing device according to steps (S12, S14 and S16).

18. The apparatus according to claim 17, wherein: The device comprises at least one of the following elements: - a preparation device configured to provide a support (1); and / or - a separation device comprising a separation tool, the separation device being configured to separate the support (1) with the layer (2) thereon in a first direction.

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