Chemical vapor deposition equipment reaction system and usage method, transportation system

Abstract

This patent relates to the field of clean room technology, and in particular to a chemical vapor deposition equipment reaction system and a method of use, and a transportation system. The transportation system includes: a reaction vessel, two movable rails, and two driving devices. The reaction vessel is used to provide a reaction space for the chemical vapor deposition reaction. The two movable rails are arranged parallel to each other on both sides of the preset motion trajectory of the reaction vessel. The two driving devices are respectively arranged on the two movable rails and move along the movable rails. The two driving devices are used to carry the reaction vessel to drive the reaction vessel to move along the preset motion trajectory to the target position. The driving devices can also unload the reaction vessel at the target position. The reaction vessel is lifted from both sides of the reaction vessel by the two driving devices, and the reaction vessel is driven to be transported along the movable rails. After reaching the target position, the reaction vessel is put down, so that the reaction vessel can be moved between various stations in the reaction system to meet the working requirements of the chemical vapor deposition equipment.

Description

Technical Field

[0001] The present application relates to the field of chemical vapor deposition, and in particular to a chemical vapor deposition equipment reaction system, a use method, and a transportation system. Background Art

[0002] Silicon carbide is a representative ceramic material that has been widely used throughout the industrial field due to its excellent physical, chemical and electrical properties.

[0003] In recent years, the importance of silicon carbide has been increasing as the development of semiconductor processing components using it has been actively progressing. In particular, silicon carbide is widely used as a component for etching processes in semiconductor processing components due to its high plasma resistance.

[0004] The silicon carbide material used for semiconductor etching process parts is manufactured by the traditional method of silicon carbide. Because this method cannot meet the quality and performance requirements, it is manufactured by chemical vapor deposition.

[0005] Chemical vapor deposition of silicon carbide uses a mixture of Si-containing gases such as SiH4, SiCl2, SiCl4 and C-containing gases such as C2H2, CH4, C3H8 as raw material gases, or CH3SiCl3, CH3SiH3, (CH3)3SiH3, etc. There are some deposition methods using monolithic raw materials, but the production of silicon carbide materials by chemical vapor deposition has the disadvantage of low productivity because the process is carried out in a batch heating furnace.

[0006] In order to improve the efficiency of the reaction, the intermittent heating furnace needs to be replaced with a continuous one. However, how to transport the reaction container in the continuous reaction system has become a major problem. Summary of the Invention

[0007] In order to solve or at least partially solve the above technical problems, the present application provides a chemical vapor deposition equipment reaction system and a use method and a transportation system.

[0008] The present application provides a transport system for a chemical vapor deposition (CVD) equipment reaction system, comprising a reaction vessel, two movable rails, and two drive devices. The reaction vessel is used to provide a reaction space for a CVD reaction. The two movable rails are arranged parallel to each other on either side of a preset motion trajectory of the reaction vessel. The two drive devices are respectively arranged on the two movable rails and move along the movable rails. The two drive devices are used to carry the reaction vessel and drive the reaction vessel along the preset motion trajectory to a target location. The drive devices are also capable of unloading the reaction vessel at the target location.

[0009] Preferably, the drive device includes a moving assembly and a lifting mechanism. The moving assembly is disposed on a moving track and moves along the moving track. The lifting mechanism is disposed on the moving assembly and moves along the moving track with the moving assembly. The lifting mechanism is capable of abutting against the reaction vessel and lifting the reaction vessel so that the reaction vessel is suspended in the air and moves with the moving assembly.

[0010] Preferably, the outer surface of the reaction vessel is provided with a connecting assembly having a connecting groove defined therein. The lifting mechanism comprises a lifting assembly and a docking assembly. The docking assembly is mounted on the lifting assembly and drives the docking assembly to move upward and downward. The docking assembly comprises a supporting member. The supporting member is provided with a docking pin that corresponds to and is inserted into the connecting groove. The supporting member is configured to support the connecting assembly and thereby support the reaction vessel.

[0011] Preferably, the docking assembly further comprises a first sensor, which is communicatively connected to a control module of the chemical vapor deposition equipment reaction system and is configured to send a connection signal to the control module after detecting that the docking pin is movably connected to the connection groove.

[0012] Preferably, a mounting groove is provided on the top of the docking pin, the first sensor is provided in the mounting groove, and a portion of the first sensor is exposed in the mounting groove. The docking pin extends into the connecting groove, the first sensor abuts against the groove top of the connecting groove and activates to send a connection signal to the control module.

[0013] Preferably, the moving assembly further comprises a sliding wheel, wherein a rolling groove is provided on the rim of the sliding wheel, and the track of the moving track is engaged with the rolling groove so that the sliding wheel moves along the moving track.

[0014] A chemical vapor deposition equipment reaction system, characterized in that the reaction system includes the above-mentioned chemical vapor deposition equipment reaction system transportation system. The chemical vapor deposition equipment reaction system also includes: a reaction base and a control module. The reaction base, two movable tracks are both set on the reaction base, and a reaction tank is set at the position corresponding to the work station of the reaction base, and the reaction tank is located between the two movable tracks. The reaction tank is used to accommodate the reaction vessel that has reached the target position. The control module is communicatively connected to the drive device and is used to control the drive device to drive the reaction vessel to move along the movable track.

[0015] Preferably, the reaction system further includes a position sensor module. The position sensor module is disposed within the reaction tank and is communicatively connected to the control module. The position sensor module is configured to send a first position signal to the control module when the reaction container reaches directly above the reaction tank. The position sensor module is also configured to send a readiness signal to the control module when the reaction container is placed within the reaction tank.

[0016] Preferably, the drive device is provided with a positioning slot. The reaction base is also provided with at least two positioning assemblies. The positioning assembly includes a telescopic portion and a positioning portion. The positioning portion is fixed to the telescopic portion, and the telescopic portion drives the positioning portion to move. After the drive device reaches the target position, it is inserted into the positioning slot to position the drive device. A second sensor is provided on the positioning portion, which is communicatively connected to the control module and is configured to send a second positioning signal to the control module when the positioning portion is inserted into the positioning slot.

[0017] A method for using a chemical vapor deposition equipment reaction system, comprising:

[0018] In response to the start signal, the two driving devices are started so that the two driving devices are respectively connected to the reaction container from both sides of the reaction container at the initial position and lift the reaction container.

[0019] In response to the connection signal, the driving device is driven to drive the reaction container to move along the moving track toward the target position.

[0020] In response to the first in-position signal, the driving device is controlled to place the reaction container at the target position, and then the two driving devices are driven to move along the moving track to leave the target position.

[0021] Preferably, in response to the first in-position signal, the step of controlling the driving device to place the reaction container at the target position specifically includes:

[0022] In response to the first in-position signal sent to the control module after the in-position sensor module detects the reaction container, the driving device is controlled to stop moving.

[0023] The positioning assembly is activated to connect the positioning assembly to the drive device.

[0024] In response to the second in-position signal, the lifting mechanism of the driving device is controlled to descend to put down the reaction container.

[0025] In response to the preparation signal, the lifting mechanism is controlled to further descend so as to separate the driving device from the reaction container.

[0026] Compared to existing technologies, this application utilizes a drive device to move the reaction vessel along a movable track, enabling movement of the reaction vessel between various workstations within the reaction system. Furthermore, the reaction vessel can be positioned at its workstation, ensuring accurate positioning of the reaction vessel after movement to the workstation. This accurately positioned reaction vessel can be connected to the gas supply line of the gas supply assembly, ensuring smooth gas supply and facilitating the reaction. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] To more clearly illustrate the embodiments of the present application, the following briefly introduces the relevant drawings. It should be understood that the drawings described below are only used to illustrate some embodiments of the present application, and those skilled in the art can also obtain many other technical features and connection relationships not mentioned herein based on these drawings.

[0028] Figure 1 This is a three-dimensional schematic diagram of a transportation system of a chemical vapor deposition equipment reaction system according to an embodiment of the present application;

[0029] Figure 2 This is a three-dimensional schematic diagram of a transportation system of a chemical vapor deposition equipment reaction system according to an embodiment of the present application;

[0030] Figure 3 This is a three-dimensional schematic diagram of a transportation system of a chemical vapor deposition equipment reaction system according to an embodiment of the present application;

[0031] Figure 4 is a schematic diagram of a chemical vapor deposition equipment reaction system according to an embodiment of the present application;

[0032] Figure 5 is a schematic diagram of a chemical vapor deposition equipment reaction system according to an embodiment of the present application;

[0033] Figure 6 This is a schematic structural diagram of a driving device according to an embodiment of the present application;

[0034] Figure 7 This is a schematic structural diagram of a driving device according to an embodiment of the present application;

[0035] Figure 8 This is a method for using a chemical vapor deposition equipment reaction system according to an embodiment of the present application;

[0036] Figure 9 This is a control module diagram of a chemical vapor deposition equipment reaction system according to an embodiment of the present application;

[0037] Figure 10 This is a signal flow module diagram of a chemical vapor deposition equipment reaction system according to an embodiment of the present application.

[0038] Description of reference numerals:

[0039] 1. Reaction vessel; 11. Connecting assembly; 111. Connecting groove; 2. Driving device; 21. Lifting mechanism; 211. Docking assembly; 212. Lifting assembly; 2111. Carrying component; 2112. Docking pin; 23. Moving assembly; 231. Sliding wheel; 232. Positioning groove; 3. Moving track; 4. Work station; 5. Reaction base; 51. Positioning assembly. DETAILED DESCRIPTION

[0040] The present application is described in detail below with reference to the accompanying drawings.

[0041] refer to Figure 4 and Figure 5 , shown is the chemical vapor deposition equipment reaction system, the reaction system is set up with three stations, in which the reaction vessel will be pre-treated, gas supplied and heated respectively. When the reaction vessel passes through the three different stations in sequence, the chemical vapor deposition work can be completed. At the same time, Figure 4 and Figure 5 It is not difficult to see that gates are set between the three stations to isolate the three stations from each other to avoid interference during the reaction process. Therefore, in order for the reaction vessel to successfully complete chemical vapor deposition, it is necessary to allow the reaction vessel to pass through the three stations in sequence to complete the chemical vapor deposition work.

[0042] And we pass Figure 5 As can be seen in the figure, a docking pipe is provided on the side wall of the reaction vessel. When the reaction vessel is in the second station, a docking pipe is provided on its side wall for connecting to the gas supply equipment. This docking process is crucial because it determines whether the reaction vessel can be smoothly connected to the gas supply equipment. In short, the orientation of the reaction vessel needs to facilitate the docking of the gas supply equipment with it. In order to ensure smooth docking between the gas supply pipeline and the reaction vessel, the side wall of the reaction vessel should be kept perpendicular to the gas supply pipeline of the gas supply equipment. In this way, the gas can enter the reaction vessel smoothly and effectively, meeting the gas conditions required for the reaction.

[0043] In view of this, an embodiment of the present invention provides a transportation system for a chemical vapor deposition equipment reaction system to solve the above problems.

[0044] First embodiment

[0045] like Figure 1 、 Figure 2 The first embodiment of the present application provides a transport system for a chemical vapor deposition equipment reaction system, comprising: a reaction vessel, two movable rails, and two driving devices. The reaction vessel is used to provide a reaction space for a chemical vapor deposition reaction. The two movable rails are arranged parallel to each other on both sides of a preset motion trajectory of the reaction vessel. The two driving devices are respectively arranged on the two movable rails and move along the movable rails. The two driving devices are used to carry the reaction vessel to drive the reaction vessel to move along the preset motion trajectory to a target position. The driving devices can also unload the reaction vessel at the target position.

[0046] Two movable rails are arranged in parallel and spaced apart from each other along the preset moving track of the reaction vessel. Two driving devices are respectively located on both sides of the reaction vessel for lifting the reaction device. The reaction vessel is located between the two movable rails so that the driving devices are respectively connected to them. When the two driving devices are connected to the reaction vessel, they move together along their respective movable rails to move the reaction vessel along the preset moving track. When the reaction vessel reaches the target station, the driving device will put it down. Since the two driving devices are respectively located on both sides of the reaction vessel, they jointly carry the reaction vessel. Therefore, the movement speed of the reaction vessel on both sides during the movement depends on the movement speed of the driving device, and the movement speed of the driving device is relatively easy to control to ensure that the posture of the reaction vessel does not deviate during the movement, thereby ensuring the accuracy of the reaction vessel after movement.

[0047] In addition, if Figure 6 The drive device shown includes a moving assembly and a lifting mechanism. The moving assembly is mounted on a moving track and moves along the track. The lifting mechanism is mounted on the moving assembly and moves along the track with the moving assembly. The lifting mechanism can abut against a reaction vessel and lift the reaction vessel, causing it to be suspended and thus move with the moving assembly.

[0048] The moving assembly causes the drive device to move along the moving track, and the lifting mechanism provided on the moving assembly also moves accordingly. Specifically, the lifting mechanism is located on both sides of the reaction vessel and is used to lift the reaction vessel so that its bottom is kept at a certain distance from the ground. When the moving assembly moves along the track, the lifted reaction vessel also moves together. Since the reaction vessel is in a vacant state, the bottom is not affected by the friction of the ground, so the posture of the reaction vessel remains stable during the movement. The reaction vessel, which always maintains a stable posture and orientation, ensures that the reaction vessel can be smoothly docked with the gas supply equipment during the subsequent reaction process.

[0049] At the same time, if Figure 3 The reaction vessel shown is provided with a connecting assembly on its outer surface, which is provided with a connecting groove. The lifting mechanism includes a lifting assembly and a docking assembly. The docking assembly is mounted on the lifting assembly and drives the docking assembly to move up and down. The docking assembly includes a supporting member. The supporting member is provided with a docking pin that corresponds to the connecting groove and is inserted into the connecting groove. The supporting member is used to support the connecting assembly and thus support the reaction vessel.

[0050] When the lifting mechanism and the reaction vessel are loaded, the moving assembly first moves the lifting mechanism to the corresponding position of the connecting assembly. The lifting assembly within the lifting mechanism then performs a lifting operation to push the docking assembly toward the connecting assembly. During this movement, the docking pin gradually moves and inserts into the connecting groove. Specifically, the side walls of the docking pin extend at an angle away from the insertion end. The side walls of the connecting groove extend at an angle toward each other from the opening end. It can be seen that the cross-sectional area of ​​the docking pin at the insertion end is smaller than that of the rest of the body, while the cross-sectional area at the opening of the connecting groove is larger than that of the rest of the groove. Therefore, during insertion, the portion of the docking pin with the smallest cross-sectional area first enters the portion of the connecting groove with the largest cross-sectional area, facilitating insertion of the docking pin. Furthermore, because the outer surface of the docking pin and the walls of the connecting groove are both inclined, and their outer surface and walls have the same inclination, the outer surface of the docking pin and the walls of the connecting groove guide each other during insertion, facilitating faster insertion and docking.

[0051] Furthermore, when the lifting assembly continues to rise, the bearing component that has completed the docking will abut against the connecting assembly. In this way, the reaction vessel connected to the connecting assembly will also be lifted. At this time, the docking pin has been inserted into the connecting groove. Therefore, when the driving device moves, the bearing component and the connecting assembly not only rely on friction to remain relatively still, but the butt-cut side walls and the inner side walls of the connecting groove will abut against each other, and when the driving device moves, the side walls of the docking pin and the inner side walls of the connecting groove will generate an interaction force to prevent the bearing component from separating from the connecting assembly. This ensures that the driving device stably supports the reaction vessel, prevents the reaction vessel from tipping over during movement, and thus ensures safety.

[0052] The docking assembly may also include a first sensor, which is communicatively connected to the control module of the chemical vapor deposition equipment reaction system and is configured to send a connection signal to the control module upon detecting that the docking pin is actively connected to the connection slot. Specifically, a mounting slot is provided at the top of the docking pin, and the first sensor is disposed within the mounting slot, with a portion of the first sensor exposed. When the docking pin extends into the connection slot, the first sensor abuts against the top of the slot and activates, thereby sending a connection signal to the control module.

[0053] During the docking process between the connecting component and the docking component, the docking pin will first be inserted into the connecting groove. As the docking pin is inserted, the first sensor located at the top will abut against the bottom of the connecting groove. At this time, the docking pin has been fully inserted into the connecting groove, thereby completing the operation of inserting the docking pin into the connecting groove. After the abutment, the first sensor is activated and sends a signal to the control module to indicate that the docking pin and the connecting groove have been matched and the connection between the connecting component and the docking component has been completed. After the connecting component and the docking component are connected, the lifting assembly continues to lift, and the bottom of the reaction vessel can be lifted off the ground. The lower surface of the reaction vessel after lifting is no longer in direct contact, so it will not be affected by friction during the movement. The drive device can directly drive the reaction vessel to move along the laying direction of the movable track, ensuring that the reaction vessel can smoothly reach the target station.

[0054] In addition, the moving assembly further comprises a sliding wheel, wherein a rolling groove is provided on the wheel rim of the sliding wheel, and the track of the moving track is engaged with the rolling groove so that the sliding wheel moves along the moving track.

[0055] When the sliding wheel moves along the moving track, the rolling groove on the sliding wheel will be stuck on the moving track. During the rolling process of the sliding wheel, the rolling groove on the sliding wheel will always remain in meshing state with the moving track, preventing the sliding wheel from separating from the moving track during the rolling process, thereby preventing the driving device from derailing during the movement, thereby ensuring the normal operation of the driving device.

[0056] Second embodiment

[0057] In the first embodiment, a transport system for a chemical vapor deposition (CVD) reactor system is described to facilitate the movement of reaction vessels between various stations within the reactor system. The orientation of the reaction vessels during movement is also maintained, ensuring that upon arrival at a reaction station, the reaction vessels are positioned to meet the docking requirements of the gas supply system. However, the advantages of the transport system can be further enhanced by integrating the CVD reactor system with the transport system.

[0058] In view of this, a second embodiment of the present invention provides a chemical vapor deposition equipment reaction system.

[0059] like Figure 4 、 Figure 5 、 Figure 9A chemical vapor deposition equipment reaction system is shown, and the reaction system includes the transportation system of the chemical vapor deposition equipment reaction system described above. The chemical vapor deposition equipment reaction system also includes: a reaction base and a control module. The reaction base, two movable tracks are both provided on the reaction base, and a reaction tank is provided at the position corresponding to the work station of the reaction base, and the reaction tank is located between the two movable tracks. The reaction tank is used to accommodate the reaction vessel that has reached the target position. The control module is communicatively connected to the drive device and is used to control the drive device to drive the reaction vessel to move along the movable track.

[0060] It's easy to see that the two moving tracks of the transport system are both located on the reaction base. The workstations used to perform reactions on the reaction vessels are naturally also located on the reaction base, allowing all work in the reaction system to be completed on the reaction base. The reaction tanks on the reaction base corresponding to the workstations are capable of positioning the reaction vessels brought by the driven device. The position of the reaction tanks is identical to the projection of the reaction vessels onto the reaction base when the reaction vessels can be smoothly docked with the gas supply equipment within the workstations. The walls of the reaction tanks act on the reaction vessels during placement to correct for any directional deviations that may occur during lowering, ensuring smooth docking between the reaction vessels and the gas supply equipment.

[0061] The control module controls the drive units that move along the track, carrying the reaction vessel along the track. Because two sets of drive units work together to move the reaction vessel from either side, automated control improves their collaborative capabilities, reduces errors during transport, and ensures the correct posture of the reaction vessel during transport.

[0062] The reaction system further includes a position sensor module. The position sensor module is disposed within the reaction tank and is communicatively connected to the control module. The position sensor module is configured to send a first position signal to the control module when the reaction vessel reaches directly above the reaction tank. The position sensor module is also configured to send a readiness signal to the control module when the reaction vessel is placed within the reaction tank.

[0063] When the drive unit drives the reaction vessel to directly above the reaction tank, the in-position sensor module located in the reaction tank can identify the reaction vessel in position and, after identification, send a first in-position signal to the control module indicating that the reaction vessel has reached the target position. The drive unit then stops moving, allowing the reaction vessel to remain above the reaction tank. The control room drive unit lowers the reaction vessel and places it into the reaction tank. When the in-position sensor module located in the reaction tank abuts the lower surface of the reaction vessel, it indicates that the reaction vessel has been placed into the reaction tank. At this point, the in-position sensor module sends a signal to the control module indicating that the reaction vessel is in position and that the gas supply device and the reaction vessel can be docked. Specifically, the in-position sensor module integrates a photoelectric sensor and a pressure sensor. The photoelectric sensor is used to detect whether the reaction vessel has reached directly above the reaction tank. The pressure sensor is activated by the pressure of the reaction vessel after it is placed into the reaction tank. After activation, the pressure sensor sends a signal to the control module indicating that the reaction vessel is in the reaction tank. Of course, in other embodiments, the in-place sensor module may also be manufactured by combining other sensors, so as to meet the requirements of identifying the reaction container and detecting whether the reaction container is placed in the reaction tank.

[0064] Third embodiment

[0065] like Figure 2 、 Figure 7 、 Figure 9 In the second embodiment shown, a position sensor module located within the reaction tank identifies the reaction vessel, ensuring that it is accurately placed within the reaction tank to meet the reaction requirements of subsequent reaction vessels. However, due to the large mass of the reaction vessel, the lowering of the reaction vessel will cause impact within the reaction tank. Therefore, the position sensor module located within the reaction tank may be damaged by the reaction vessel after prolonged use, increasing the maintenance cost of the reaction system.

[0066] In view of this, in a third embodiment of the present invention, a positioning slot is provided on the drive device. The reaction base is also provided with at least two positioning assemblies. The positioning assemblies include a telescopic portion and a positioning portion. The positioning portion is fixed to the telescopic portion, which drives the positioning portion to move. Once the drive device reaches the target position, it is inserted into the positioning slot to position the drive device. A second sensor is provided on the positioning portion, which is in communication with the control module and is configured to send a second positioning signal to the control module when the positioning portion is inserted into the positioning slot.

[0067] The two positioning assemblies are positioned to correspond to the reaction slots. When the two positioning assemblies are inserted into the corresponding positioning slots of the two drive mechanisms, they restrict the movement of the drive mechanisms. This allows the reaction vessel carried by the drive mechanisms to be precisely positioned within the workstation. Since the reaction vessel is transported by the drive mechanisms, the position of the reaction vessel can be confirmed by determining the position of the drive mechanisms. The positioning drive mechanisms can be used to accurately position the reaction vessel within the workstation.

[0068] In particular, Figure 7 As shown in the present embodiment, the positioning groove is arranged at the bottom of the driving device, and the telescopic portion of the positioning assembly extends upward from the bottom of the driving device so that the positioning portion extends into the positioning groove. The positioning portion and the positioning groove cooperate with each other so that the stopped driving device can remain stationary and avoid sliding relative to the moving track. The second sensor arranged on the positioning portion can be activated after contacting the bottom of the positioning groove and sends a signal to the control module indicating that the driving device is in place at this time. So relatively, it means that the reaction vessel also reaches directly above the reaction tank. At this time, it is only necessary to control the driving device to put down the reaction vessel so that the reaction vessel can be accurately placed in the reaction tank, and since the positioning assembly can limit the movement of the driving device, no shaking or deviation will occur during the process of the reaction vessel below the driving device, thereby ensuring that the subsequent gas supply equipment can accurately complete the docking work with the reaction vessel.

[0069] Fourth embodiment

[0070] like Figure 8 、 Figure 10 Based on the transport system of the chemical vapor deposition equipment reaction system in the second and third embodiments, the fourth embodiment of the present invention further provides a method for using the chemical vapor deposition equipment reaction system. The method for using the chemical vapor deposition equipment reaction system includes:

[0071] In response to the start signal, the two driving devices are started so that the two driving devices are respectively connected to the reaction container from both sides of the reaction container at the initial position and lift the reaction container.

[0072] In response to the connection signal, the driving device is driven to drive the reaction container to move along the moving track toward the target position.

[0073] In response to the first in-position signal, the driving device is controlled to place the reaction container at the target position, and then the two driving devices are driven to move along the moving track to leave the target position.

[0074] When the reaction system needs to be used, the reaction vessel needs to be moved between the various stations in the reaction system to enable different stations of the reaction vessel to perform different tasks. The reaction vessel is located between two movable rails. The two driving devices can lift the reaction vessel from both sides of the reaction vessel, so that the lower surface of the reaction vessel is vacant, thereby preventing the lower surface of the reaction vessel from being affected by friction during use. The reaction vessel moves to the target position under the drive of the synchronous movement of the driving devices on both sides, and since the driving devices can drive the reaction vessel to move from both sides of the reaction vessel, the movement speed of both sides of the reaction vessel depends on the driving devices, making it easier to keep the movement speed on both sides of the reaction vessel the same, reducing the possibility of the reaction vessel offset during movement. When the first in-position signal is received, it indicates that the reaction vessel has reached the target station, and the driving device is controlled to lower the reaction vessel to the target position and wait for reaction. At this time, in order to avoid the reaction work in the station affecting the driving device, it is necessary to drive the driving device away from the station and return to the initial position. And we refer to Figure 4 and Figure 5 It can be seen that there are three stations in the reaction system. After the driving device moves the reaction vessel in the second station to the third station, the reaction vessel originally in the first station can be moved to the second station, and then a new reaction vessel can be moved to the first station. In this way, the three stations of the reaction system can process the internal reaction system simultaneously, thereby improving the working efficiency of the reaction system.

[0075] In addition, in response to the first in-position signal, the step of controlling the driving device to place the reaction container at the target position specifically includes:

[0076] In response to the first in-position signal sent to the control module after the in-position sensor module detects the reaction container, the driving device is controlled to stop moving.

[0077] The positioning assembly is activated to connect the positioning assembly to the drive device.

[0078] In response to the second in-position signal, the lifting mechanism of the driving device is controlled to descend to put down the reaction container.

[0079] In response to the preparation signal, the lifting mechanism is controlled to further descend so as to separate the driving device from the reaction container.

[0080] The in-position sensor module identifies and locates the reaction vessel, and the positioning assembly, combined with the drive mechanism, ensures that the reaction vessel moves to the exact target location. Once the target location is reached, the drive mechanism is controlled to lower the reaction vessel to the exact position. This ensures that the reaction vessel is accurately placed within the workstation and that the reaction proceeds normally.

[0081] Finally, it should be noted that those skilled in the art will appreciate that, in order to facilitate a better understanding of this application, the embodiments of this application set forth numerous technical details. However, even without these technical details and the various variations and modifications based on the above-described embodiments, the technical solutions claimed in the claims of this application can be substantially achieved. Therefore, in actual practice, various modifications may be made to the above-described embodiments in form and detail without departing from the spirit and scope of this application.

Claims

1. A transport system for a chemical vapor deposition equipment reaction system, characterized in that: The transportation system comprises: A reaction container, used to provide a reaction space for chemical vapor deposition reaction; Two movable rails are arranged parallel to each other on both sides of the preset motion track of the reaction container; Two driving devices are respectively arranged on the two moving rails and move along the moving rails. The two driving devices are used to carry the reaction containers to drive the reaction containers to move along the preset motion trajectory to the target position. The driving devices can also unload the reaction containers at the target position. The driving devices include: A moving component is arranged on the moving track and moves along the moving track; a lifting mechanism, disposed on the moving assembly, and moving along the moving track with the moving assembly; the lifting mechanism is capable of abutting against the reaction vessel and lifting the reaction vessel so that the reaction vessel is suspended in the air and moves with the moving assembly; The outer surface of the reaction container is provided with a connecting assembly, and a connecting groove is provided on the connecting assembly; the lifting mechanism includes: a lifting assembly; a docking assembly, which is provided on the lifting assembly and drives the docking assembly to move up and down; the docking assembly includes: a bearing component, which is provided with a docking pin, and the docking pin corresponds to the connecting groove and is inserted into the connecting groove; the bearing component is used to support the connecting assembly to carry the reaction container; The mobile component also includes: The sliding wheel has a rolling groove on its rim, and the track of the moving track is inserted into the rolling groove so that the sliding wheel moves along the moving track.

2. The transport system of the chemical vapor deposition equipment reaction system according to claim 1, characterized in that: The docking assembly further includes a first sensor, which is communicatively connected to a control module of the chemical vapor deposition equipment reaction system and is configured to send a connection signal to the control module after detecting that the docking pin is movably connected to the connection groove.

3. The transport system of the chemical vapor deposition equipment reaction system according to claim 2, characterized in that: A mounting groove is provided on the top of the docking pin, the first sensor is provided in the mounting groove, and a portion of the first sensor is exposed from the mounting groove; The docking pin extends into the connecting slot, and the first sensor abuts against the slot top of the connecting slot and is activated to send a connection signal to the control module.

4. A chemical vapor deposition equipment reaction system, characterized in that: The reaction system comprises a transportation system of the chemical vapor deposition equipment reaction system according to any one of claims 1 to 3; The chemical vapor deposition equipment reaction system also includes: A reaction base, wherein the two movable rails are both provided on the reaction base, and a reaction tank is provided at a position corresponding to the work station of the reaction base, and the reaction tank is located between the two movable rails; The reaction tank is used to accommodate the reaction container that has reached the target position; The control module is in communication with the driving device and is used to control the driving device to drive the reaction container to move along the moving track.

5. The chemical vapor deposition equipment reaction system according to claim 4, characterized in that: The reaction system further comprises: an in-situ sensor module, disposed in the reaction tank, the in-situ sensor module being communicatively connected to the control module; The in-position sensor module is used to send a first in-position signal to the control module after the reaction container reaches directly above the reaction tank; The in-place sensor module is further configured to send a preparation signal to the control module after the reaction container is placed in the reaction tank.

6. The chemical vapor deposition equipment reaction system according to claim 4, characterized in that: The driving device is provided with a positioning groove; The reaction base is also provided with: At least two positioning components, each comprising a telescopic portion and a positioning portion, wherein the positioning portion is fixed to the telescopic portion and the telescopic portion drives the positioning portion to move so as to insert the positioning portion into the positioning slot to position the driving device after the driving device reaches a target position; The positioning portion is provided with a second sensor, which is in communication with the control module and is used to send a second positioning signal to the control module when the positioning portion is inserted into the positioning slot.

7. A method for using a chemical vapor deposition equipment reaction system, applicable to the chemical vapor deposition equipment reaction system according to any one of claims 4 to 6, characterized in that: include: In response to a start signal, the two driving devices are started so that the two driving devices are connected to the reaction container from both sides of the reaction container at an initial position and lift the reaction container; In response to the connection signal, the driving device is driven to drive the reaction container to move toward the target position along the moving track; In response to a first in-position signal, the driving device is controlled to place the reaction container at the target position, and then the two driving devices are driven to move along the moving track to leave the target position.

8. The method for using the chemical vapor deposition equipment reaction system according to claim 7, characterized in that: In response to the first in-position signal, the step of controlling the driving device to place the reaction container at the target position specifically includes: In response to a first in-position signal sent to the control module by the in-position sensor module after detecting the reaction container, controlling the driving device to stop moving; Starting the positioning assembly to connect the positioning assembly with the driving device; In response to a second in-position signal, controlling the lifting mechanism of the driving device to descend so as to place the reaction container; In response to a preparation signal, the lifting mechanism is controlled to further descend so as to separate the driving device from the reaction container.

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