Wafer baking device

Abstract

The embodiment of the invention discloses a wafer baking device. The wafer baking device comprises a pressure cavity, a baking cavity and a circulation assembly, and at least one side of the baking cavity is provided with a plurality of airflow channels. According to the embodiment of the invention, when'water vapor 'and'holes' in the wafer are removed, the circulation assembly is utilized to introduce gas into the pressure cavity and drive the gas to flow in the gas flow channel, and when the gas flows through the gas flow channel, part of the gas flows into the baking cavity through the gas flow channel due to irregular movement of the gas, so that the baking efficiency is improved. The other part of the gas flows in the gas flow channel and enters the baking cavity, that is, the part of the gas is intercepted through the gas flow hole channel and enters the baking cavity, so that the gas can uniformly flow to the wafer, the wafer in the baking cavity is uniformly baked and heated, and bubbles and cavities in the wafer are effectively removed.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor processing equipment, and in particular to a wafer baking device. Background Art

[0002] Wafer packaging is a common semiconductor processing technology. During the packaging process, in order to achieve grain miniaturization, multifunctionality and meet green manufacturing requirements, wafer sealing / injection and stacking technology are often used. However, the materials used for sealing / stacking will absorb or encapsulate water vapor, which will then volatilize substances or generate bubbles during the process.

[0003] For example, during the reflow process of IC (integrated circuit) components, the "water vapor" and "voids" will expand in volume instantly due to sudden boiling after being heated, causing the chip and the package itself to be subjected to great stress, which may cause the IC component to fail; of course, these stresses may not necessarily cause the IC component to fail immediately, but they will seriously affect the reliability and quality of the product. However, the existing devices for removing "water vapor" and "voids" from wafers have poor removal effects and are prone to only partially removing "water vapor" and "voids".

[0004] Therefore, there is an urgent need for a technology that can at least solve at least one of the above problems. Summary of the invention

[0005] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a wafer baking device to solve the "water vapor" and "void" problems generated in the wafer packaging process in the prior art.

[0006] The present application provides a wafer baking device, comprising a pressure chamber, a baking chamber and a circulation component, wherein:

[0007] The baking cavity is disposed in the pressure cavity, a gap space is defined between the baking cavity and the pressure cavity, and the gap space and the inner space of the baking cavity together constitute an air flow passage;

[0008] The circulation component is configured to drive the gas in the pressure chamber to circulate in the gas flow passage;

[0009] A plurality of air flow channels are formed on at least one side of the baking cavity, and the gas can enter the inner space through the air flow channels when flowing through the gap space during the circulation process.

[0010] Based on the above-mentioned wafer baking device, when removing "water vapor" and "voids" in the wafer, the circulation component is used to introduce gas into the pressure chamber, and the gas is driven to flow in the air flow passage. When flowing through the air flow channel, due to the irregular movement of the gas, part of the gas will flow into the baking chamber through the air flow channel, and the remaining part of the gas will flow in the air flow passage and enter the baking chamber, that is, part of the gas is "intercepted" by the air flow channel and enters the baking chamber, so that the gas can flow to the wafer more evenly, thereby achieving uniform baking and heating of the wafer in the baking chamber, so as to effectively remove the "water bubbles" and "voids" in the wafer.

[0011] In one or more embodiments of the above-mentioned wafer baking device, the outer side surface of the baking chamber with air flow channels is provided with multiple flow shielding structures, and the flow shielding structures are configured to change the flow direction of part of the gas so that part of the gas enters the baking chamber through the air flow channels close to it. Along the circulation direction of the gas, the flow shielding structures can gradually increase the amount of gas flowing into the baking chamber.

[0012] In one or more embodiments of the above-mentioned wafer baking device, there is a preset angle between the flow shielding structure and the outer side surface of the baking chamber where it is located, and the preset angle gradually increases along the circulation direction of the gas, and the preset angle is an acute angle.

[0013] In one or more embodiments of the above-mentioned wafer baking device, the side of the flow shielding structure facing the baking chamber has a drainage surface, and the area of ​​the drainage surface gradually increases along the circulation direction of the gas.

[0014] In one or more embodiments of the above-mentioned wafer baking device, along the circulation direction of the gas, the length of the flow shielding structure gradually decreases.

[0015] In one or more embodiments of the above-mentioned wafer baking device, the outer side surface of the baking chamber having an air flow channel is provided with a partition plate extending along the gas circulation direction, and a gas space is formed between the partition plate and the flow shielding structure, so that part of the gas enters the baking space through the air flow channel at the gas space.

[0016] In one or more embodiments of the above-mentioned wafer baking device, flow shielding structures are provided on both sides of the partition plate in the thickness direction.

[0017] In one or more embodiments of the above-mentioned wafer baking device, the flow shielding structure is in the shape of a right-angled trapezoid, and the right-angled side of the flow shielding structure is arranged on a side close to the partition plate.

[0018] In one or more embodiments of the above-mentioned wafer baking device, a plurality of the air flow channels are respectively opened on two opposite sides of the baking cavity.

[0019] In one or more embodiments of the above-mentioned wafer baking device, the circulation component includes a heating element arranged in the pressure chamber, and the heating element includes a plurality of heating rings. The heating rings are coaxially arranged with the baking chamber, and along the circulation direction of the gas, the orthographic projections of all the heating rings are distributed in a ring-like manner.

[0020] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The disclosure of the present application will become more easily understood with reference to the accompanying drawings. It is easy for those skilled in the art to understand that these drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present application. In addition, similar numbers in the drawings are used to represent similar components, among which:

[0022] Figure 1 This is a schematic diagram of the structure of a wafer baking device provided by the present application;

[0023] Figure 2 It is a structural schematic diagram for showing a baking cavity provided by the implementation of the present application;

[0024] Figure 3 yes Figure 2 Enlarged view of point A in the middle.

[0025] Description of reference numerals:

[0026] 1. Pressure chamber; 11. Opening; 12. Shielding member; 2. Baking chamber; 21. Inlet and outlet; 22. Flow shielding structure; 221. Drainage surface; 23. Partition plate; 24. Air flow channel; 3. Circulation component; 31. Heating element; 32. Fan; 4. Air flow passage; 41. Gap space. DETAILED DESCRIPTION

[0027] Some embodiments of the present application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the protection scope of the present application.

[0028] As described in the background art, for example, during the reflow process of IC components, the "water vapor" and "voids" will expand in volume instantly due to sudden boiling after being heated, causing the chip and the package itself to be subjected to great stress, which may cause the IC component to fail; of course, these stresses may not necessarily cause the IC component to fail immediately, but will seriously affect the reliability and quality of the product.

[0029] Therefore, the present application creatively proposes a wafer baking device, which includes a pressure chamber, a baking chamber and a circulation component. When removing "water vapor" and "voids" in the wafer, the circulation component is used to introduce gas into the pressure chamber, and the gas is driven to flow in the air flow passage. When flowing through the air flow channel, due to the irregular movement of the gas, part of the gas will flow into the baking chamber through the air flow channel, and the remaining gas will flow in the air flow passage and enter the baking chamber, that is, part of the gas is "intercepted" by the air flow channel and enters the baking chamber, so that the gas can flow to the wafer more evenly, thereby achieving uniform baking and heating of the wafer in the baking chamber, so as to effectively remove the "water bubbles" and "voids" in the wafer.

[0030] The present application will be described in detail below through specific embodiments.

[0031] Reference Figures 1 to 3 As shown, the wafer baking device includes a pressure chamber 1, a baking chamber 2 and a circulation component 3. The baking chamber 2 is arranged in the pressure chamber 1. A gap space 41 is formed between the baking chamber 2 and the pressure chamber 1. The gap space 41 and the internal space of the baking chamber 2 together constitute an air flow passage; the circulation component 3 is configured to drive the gas in the pressure chamber 1 to circulate in the air flow passage 4; a plurality of air flow channels 24 are opened on at least one side of the baking chamber 2, and the gas can enter the internal space through the air flow channels 24 when flowing through the gap space 41 during the circulation process.

[0032] Specifically, when removing "water vapor" and "voids" in the wafer, gas is introduced into the pressure chamber 1 by using the circulation component 3, and then the gas begins to flow in the air flow passage 4. When flowing through the air flow channel 24, due to the irregular movement of the gas, part of the gas will flow into the baking chamber 2 through the air flow channel 24, and the remaining part of the gas will flow in the air flow passage 4 and enter the baking chamber 2, that is, part of the gas is "intercepted" by the air flow channel 24 and enters the baking chamber 2, so that the gas can flow to the wafer more evenly, thereby achieving uniform baking heating of the wafer in the baking chamber 2, so as to effectively remove the "water bubbles" and "voids" in the wafer.

[0033] In some examples, the pressure cavity 1 is cylindrical, the baking cavity 2 is rectangular, and the baking cavity 2 is coaxially arranged with the pressure cavity 1, so that the gas can flow evenly around the baking cavity 2. Of course, in other examples, the pressure cavity 1 can also be a polyhedral prism such as a triangular prism or a quadrangular prism, or a curved surface such as a sphere, or other irregular shapes, and the baking cavity 2 can also be a regular shape such as a cylinder, a sphere or a triangular prism, as well as other irregular shapes, as long as the positional relationship between the baking cavity 2 and the pressure cavity 1 can be satisfied, and the gas can flow evenly around the baking cavity 2.

[0034] It is understandable that, referring to Figure 1 As shown, the direction of the arrow is the flow direction of the gas, wherein the solid arrow represents the flow direction of the gas in the gas flow passage 4, and the dashed arrow represents the flow direction of the gas in the gas flow channel 24.

[0035] In some examples, the interior of the pressure chamber 1 is a space with an opening 11 at one end, and a shielding member 12 is provided at the opening 11 to flexibly open and close the interior space of the pressure chamber 1; in addition, in order to facilitate the flow of gas in the air flow passage 4, the baking chamber 2 is provided with an inlet and outlet 21 along its own axial direction and on one side close to the opening 11, so that gas can flow into the baking chamber 2 from the inlet and outlet 21.

[0036] Furthermore, in some examples, a plurality of flow shielding structures 22 are provided on the outer side of the baking cavity 2 having an air flow duct 24. The flow shielding structures 22 are configured to change the flow direction of part of the gas so that part of the gas enters the baking cavity 2 through the air flow duct 24 close thereto. Along the circulation direction of the gas, the flow shielding structures 22 can gradually increase the amount of gas flowing into the baking cavity 2.

[0037] It should be noted that the circulation direction of the gas is generally a ring-shaped ring connected end to end. In the present embodiment, the flow shielding structure 22 is arranged on the outer side of a rectangular structure. Therefore, for the flow shielding structure 22, the circulation direction of the gas refers to a linear direction of the side where the flow shielding structure 22 is located, such as the length direction of the baking cavity 2.

[0038] Specifically, when the gas flows in the airflow passage 4, the flow shielding structure 22 allows part of the gas to flow into the baking chamber 2 through the airflow duct 24, and along the circulation direction of the gas, the flow shielding structure 22 closer to the opening 11 will cause more gas to flow into the baking chamber 2 through the airflow duct 24 close to the flow shielding structure 22, thereby partially offsetting the heat loss of the gas caused by the increase in the path, that is, by increasing the gas to balance the heat transferred to the wafer in the circulation direction of the gas, so as to further improve the uniformity of heating the wafer.

[0039] It is understandable that the flow shielding structures 22 can be arranged regularly on the outside of the baking cavity 2, such as being arranged at equal intervals along the circulation direction of the gas, or arranged irregularly, as long as the flow shielding structures 22 can gradually increase the amount of gas flowing into the baking cavity 2 along the circulation direction of the gas. In addition, when the flow shielding structures 22 are arranged at equal intervals along the linear direction, the flow shielding structures 22 can be arranged in multiple rows and columns, or in a single row and multiple columns.

[0040] In an alternative example, there is a preset angle between the flow shielding structure 22 and the outer side surface of the baking chamber 2 where it is located, and the preset angle gradually increases along the circulation direction of the gas, and the preset angle is an acute angle. By increasing the preset angle, the flow shielding structure 22 closer to the opening 11 can intercept more gas, so that the gas flow channels 24 at different distances from the opening 11 can flow into the gas with similar total heat, thereby achieving uniform heating of the wafer in the circulation direction of the gas (i.e., the axial direction of the baking chamber 2).

[0041] In another alternative example, the flow shielding structure 22 has a drainage surface 221 on the side facing the baking chamber 2, and the area of ​​the drainage surface 221 gradually increases along the circulation direction of the gas. By increasing the area of ​​the drainage surface 221, the drainage surface 221 can occupy a larger cross-section (along the radial direction of the pressure chamber 1) in the airflow passage 4, thereby allowing more gas to flow into the baking chamber 2 through the airflow duct 24 close to the drainage surface 221, so that more gas can flow into the part of the airflow duct 24 closer to the opening 11, thereby balancing the heat of the gas flowing into the airflow duct 24 at different positions, so as to achieve uniform heating of the wafer.

[0042] In some examples, along the circulation direction of the gas, the length of the flow shielding structure 22 gradually decreases, so as to balance the amount of gas flowing into the baking cavity 2 from the air flow channel 24 and from the opening 11 .

[0043] It should be noted that, refer to Figure 2 As shown, the direction indicated by the arrow Z represents the length direction of the flow shielding structure 22 .

[0044] Further, see Figure 2 and Figure 3 As shown, in some examples, the outer side of the baking cavity 2 having the air flow channel 24 is provided with a partition plate 23 extending along the gas circulation direction, and a gas space is formed between the partition plate 23 and the flow blocking structure 22, so that part of the gas enters the baking space through the air flow channel 24 at the gas space. Through the relatively independent gas space, after the gas flows into the gas space, the gas can be gradually diffused in the independent space, further increasing the amount of gas flowing into the baking cavity 2 from the air flow channel 24 at the gas space.

[0045] It is understandable that the number of the partition plates 23 can be one, two, three or more, and the user can adjust the number of the partition plates 23 according to actual needs, as long as they can form a relatively independent gas space corresponding to the flow shielding structure 22.

[0046] In this embodiment, both sides of the partition plate 23 in the thickness direction are provided with flow shielding structures 22 , so that one partition plate 23 cooperates with two groups of flow shielding structures 22 , thereby saving the space occupied by the partition plate 23 .

[0047] In some examples, the flow shielding structure 22 is in the shape of a right-angled trapezoid, and the right-angled side of the flow shielding structure 22 is arranged on a side close to the partition plate 23. The above arrangement reduces the shielding of the flow shielding structure 22 on the gas flowing along the air flow passage 4 into the baking cavity 2. Of course, the flow shielding structure 22 can also be arranged in other shapes, such as a prismatic plate, a rectangular plate, and the like.

[0048] In some examples, two opposite sides of the baking cavity 2 are respectively provided with a plurality of air flow channels 24. Of course, the baking cavity 2 can also be provided with more air flow channels 24 on its three sides, and the sides do not need to meet a specific relationship, and the user can adjust according to actual needs.

[0049] It is understandable that multiple wafers can be placed in the baking chamber 2, and the placement of the wafers can also be arranged according to actual needs, such as stacking multiple wafers at intervals to form a stack of wafers, and multiple stacks of wafers can be placed in the baking chamber 2. Generally, for cost and baking convenience considerations, only one stack of wafers will be placed in the baking chamber 2. In this embodiment, along the circulation direction of the gas, a plurality of air flow channels 24 are respectively opened on opposite sides of the baking chamber 2 perpendicular to the circulation direction of the gas, and at the same time, the stacking direction of the wafers is perpendicular to the axial direction of the baking chamber 2, so that the gas can enter the baking chamber 2 evenly from both sides of the baking chamber 2, and the wafers are further evenly baked.

[0050] In some examples, along the gas circulation direction, the air flow channels 24 are evenly spaced and arranged along a linear direction, so that the amount of gas entering the baking cavity 2 through different air flow channels 24 is relatively uniform.

[0051] In some examples, there are at least two rows of air flow channels 24 on each side, and there is a preset distance between each air flow channel 24 and the air flow channels 24 in an adjacent row in the height direction of the baking chamber 2. When the gas flows in the air flow passage 4, the "offset" setting between the air flow channels 24 in two adjacent rows increases the number of air flow channels 24 per unit area on the side of the baking chamber 2, thereby increasing the air intake per unit area on the side of the baking chamber 2, so as to improve the uniform baking efficiency of the wafers.

[0052] It is understandable that the gas introduced into the pressure chamber 1 by the circulation component 3 generally needs to meet a certain pressure and a certain temperature, and the time and frequency of gas introduction are selected according to actual needs, and parts are also required to make the fan 32 flow. There are many ways to control the pressure and temperature of the gas. In some examples, the circulation component 3 includes a heating element 31, a fan 32 and a pressure gas source provided in the pressure chamber 1. The pressure gas source introduces a gas with a certain pressure into the pressure chamber 1, and then the gas flows through the heating element 31 and is heated to a certain temperature, thereby achieving the temperature conditions for baking the wafer.

[0053] In this embodiment, the heating element 31 includes a plurality of heating rings, which are coaxially arranged with the baking cavity 2. Along the circulation direction of the gas, the orthographic projections of all the heating rings are distributed in a sleeve-shaped manner. In this embodiment, the heating rings of the inner circle and the heating rings of the outer circle are distributed at intervals in the circulation direction of the gas (the axial direction of the baking cavity 2), so that the gas can fully contact the heating element 31 in time and space, thereby ensuring the heating effect on the gas.

[0054] In some examples, reference Figure 1 As shown, the fan 32 is disposed between the baking cavity 2 and the heating element 31. Of course, the positional relationship between the fan 32 and the heating element 31 can also be adjusted according to actual needs.

[0055] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0056] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0057] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A wafer baking device, characterized in that: The wafer baking device comprises a pressure chamber, a baking chamber and a circulation component, wherein: The baking cavity is disposed in the pressure cavity, a gap space is defined between the baking cavity and the pressure cavity, and the gap space and the inner space of the baking cavity together constitute an air flow passage; The circulation component is configured to drive the gas in the pressure chamber to circulate in the gas flow passage; A plurality of air flow channels are formed on at least one side of the baking cavity, and the gas can enter the inner space through the air flow channels when flowing through the gap space during the circulation process.

2. The wafer baking device according to claim 1, characterized in that: The outer side surface of the baking cavity having the air flow channel is provided with a plurality of flow shielding structures, and the flow shielding structures are configured to change the flow direction of part of the gas so that part of the gas enters the baking cavity through the air flow channel close thereto, and along the circulation direction of the gas, the flow shielding structures can gradually increase the amount of gas flowing into the baking cavity.

3. The wafer baking device according to claim 2, characterized in that: There is a preset angle between the flow shielding structure and the outer side surface of the baking cavity where it is located. Along the circulation direction of the gas, the preset angle gradually increases, and the preset angle is an acute angle.

4. The wafer baking device according to claim 2, characterized in that: The side of the flow shielding structure facing the baking cavity has a flow guiding surface, and the area of ​​the flow guiding surface gradually increases along the circulation direction of the gas.

5. The wafer baking device according to claim 2, characterized in that: Along the circulation direction of the gas, the length of the flow-shielding structure gradually decreases.

6. The wafer baking device according to claim 2, characterized in that: The outer side of the baking cavity having the air flow channel is provided with a partition plate extending along the gas circulation direction, and a gas space is formed between the partition plate and the flow shielding structure, so that part of the gas enters the baking space through the air flow channel at the gas space.

7. The wafer baking device according to claim 6, characterized in that: Both sides of the partition plate in the thickness direction are provided with flow shielding structures.

8. The wafer baking device according to claim 7, characterized in that: The flow shielding structure is in the shape of a right-angled trapezoid, and the right-angled side of the flow shielding structure is arranged at a side close to the partition plate.

9. The wafer baking device according to claim 1, characterized in that: A plurality of air flow channels are respectively provided on opposite sides of the baking cavity.

10. The wafer baking device according to claim 1, characterized in that: The circulation component comprises a heating element arranged in the pressure cavity, the heating element comprises a plurality of heating rings, the heating rings are coaxially arranged with the baking cavity, and along the circulation direction of the gas, the orthographic projections of all the heating rings are distributed in a sleeve ring shape.

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