A diode chip photoelectric performance testing device and use method

Abstract

The present invention relates to the field of diode chip testing technology, specifically to a diode chip photoelectric performance testing device and a method of use, including a detection seat, a chip slot is provided inside the detection seat, and a plurality of connecting pins matching with chip pins are provided on the inner side wall of the chip slot, and the plurality of connecting pins are equally divided into four groups. The diode chip photoelectric performance testing device and method of use pulls the pin to slide toward the positioning slot through a guide slope, at which time the pin can be centrally connected along the connecting pin. Compared with the existing method of inserting the pin into the gap of the contact sheet, the guide slope composed of the adjacent convex edges can pull the pin of the chip so that the pin actively enters the positioning slot, thereby ensuring that after the chip is installed, its pin can always be centrally connected with the connecting pin. On the one hand, there is no need for the user to control the pin to be precisely aligned with the test component, and the operation is convenient. On the other hand, the contact between the connecting pin and the pin can be made more stable.

Description

Technical Field

[0001] The present invention relates to the technical field of diode chip testing, and in particular to a diode chip photoelectric performance testing device and a use method thereof. Background Art

[0002] Diode chips are mainly composed of multiple diodes, resistors, metal wires and other devices. By engraving circuit patterns on the chip, these devices are connected to each other to achieve various circuit functions. Common diode chips include rectifier diode chips, voltage regulator diode chips, switch diode chips and amplifier diode chips. After the chip is produced, various tests are generally required to detect and evaluate the various performance of the chip to verify whether the chip meets its design requirements and specifications, such as photoelectric testing.

[0003] The existing patent (publication number: CN118348394B) discloses a chip socket for testing semiconductor chips, including a base and a vertical pole, which also includes a connecting seat, a frame assembly and a pin contact assembly. The base is provided with a chip placement table and a mounting seat, the connecting seat is provided with a limit assembly, the mounting seat is provided with a plug-in slot, and the connecting seat is plugged into the plug-in slot. In this invention, a frame assembly and a pin contact assembly are provided, and the pin connection of the direct-insert chip and the surface-mount chip can be achieved by flipping the frame assembly and the pin contact assembly, and the number of pin contact assemblies can be adjusted to adapt the number of pins of the chip. When the above-mentioned prior art tests different chips, it is necessary to manually adjust the link components, which is not convenient to use, and after the test is completed, the user is required to pick up the chip, which affects the test efficiency.

[0004] In view of this, we propose a diode chip photoelectric performance testing device and a method for use. Summary of the invention

[0005] The purpose of the present invention is to provide a diode chip photoelectric performance test device and a method of use, so as to solve the problem that when the prior art proposed in the above background technology tests different chips, it is necessary to manually adjust the link components, which is inconvenient to use, and after the test is completed, the user is required to pick up the chip, which affects the test efficiency. To achieve the above purpose, the present invention provides the following technical solutions: a diode chip photoelectric performance test device, including a detection seat, a chip slot is opened inside the detection seat, and a plurality of connecting pins that match the chip pins are arranged on the inner side wall of the chip slot, and the plurality of connecting pins are equally divided into four groups, and the four groups of connecting pins are respectively located on the four sides of the chip slot, and the connecting pins are provided with a positioning component that matches the chip pins.

[0006] The positioning assembly includes a convex edge fixedly arranged on the top of the connecting leg, and the convex edge is set as a triangular block structure. The convex edges are symmetrically distributed on the connecting leg in groups of two, and a positioning groove with an inverted triangle structure is set between the two convex edges.

[0007] A guide slope of an equilateral triangle structure is provided between two adjacent groups of convex edges.

[0008] Pin fixers are arranged on the connecting pins and the chip slots.

[0009] Preferably, the pin holder includes a slide groove opened on the inner wall of the chip slot, and the number and position of the slide groove correspond to the connecting pin, a slide seat is slidably connected in the slide groove, and the connecting pin is connected to the slide seat.

[0010] Spring teeth are arranged on the inner side wall of the slide groove.

[0011] A column groove is provided on the side of the slide seat surface opposite to the spring tooth, and a rotary column is rotatably connected in the column groove. A tooth groove matching the spring tooth is provided on the side surface of the rotary column, and a release cut matching the spring tooth is cut on the side surface of the rotary column.

[0012] The upper and lower ends of the rotating column are both provided with spiral bevels, and the inner bottom wall and the inner top wall of the sliding groove are both fixedly connected with ejector pins matched with the bevels on the same side.

[0013] A notch is provided on the side of the sliding seat surface opposite to the connecting leg, and a spring sheet that can be bent under pressure is arranged in the notch, the top of the spring sheet is rotatably connected in the notch, and the bottom of the spring sheet is rotatably connected in the sliding groove, and a through groove is provided on the connecting leg for the spring sheet to pass through.

[0014] The connecting pins, the slide seat and the chip slot are provided with a chip releasing component.

[0015] Preferably, the chip release assembly includes two wall grooves respectively opened along the side surfaces of both sides of the connecting pin, and a connecting pin is fixedly arranged in the wall groove, and two buckle plates are fixedly arranged on the side surface of the sliding seat, and the connecting pin is rotatably inserted into the buckle plate.

[0016] The outer surface of the buckle plate is provided with an embedding groove, and an embedding block is slidably connected in the embedding groove. A top spring is arranged in the embedding groove, and the top spring pushes the embedding block to slide outward. The outer end of the connecting pin is fixedly connected with a limit strip restricted by the embedding block.

[0017] The side surface of the insert block is provided with an oblique opening, and the lower side of the chip slot is fixedly provided with a stop block matched with the oblique opening.

[0018] The side surface of the insert block is provided with an arc-shaped oblique groove matched with the limiting strip.

[0019] Preferably, a ball is rollingly embedded in the end of the ejector pin that contacts the bevel.

[0020] Preferably, a shock-absorbing pad matching the slide seat is provided on the inner bottom wall of the slide seat.

[0021] Preferably, a paddle that matches the tooth groove is fixedly provided on the inner side wall of the slide groove, and the paddle is located on the upper side of the stop block.

[0022] Preferably, the limiting strip and the connecting pin are mounted via screws.

[0023] A method for using a diode chip photoelectric performance testing device comprises the following steps:

[0024] S1. When testing a direct-insert chip, place it in the chip slot. During this process, the pins on the four sides of the chip touch the connecting pins, and then the connecting pins are connected to the pins to perform an optoelectronic test on the chip;

[0025] S2. When the pin falls between the two connecting legs, it is pulled by the guide slope and slides toward the positioning groove. At this time, the pin can be centrally connected along the connecting legs;

[0026] S3, the chip is loaded into the chip slot, and the chip is pressed down continuously, so that the chip moves down along the connecting pin, and the spring clamping teeth are engaged in the tooth groove to lock the slide. During this process, the slide squeezes the spring sheet to bend, and the bent spring sheet extends along the through slot to press the chip pin or pin;

[0027] S4. After the chip test is completed, the chip and the slide are pressed down. After the slide moves down to the bottom, the stop block contacts the bevel and presses the embedding block into the embedding groove, releasing the lock of the embedding block on the connecting pin along the limit bar. At this time, the connecting pin is flipped downward by the connecting pin, canceling the support for the chip, allowing the tested chip to fall and be released from the chip slot, and then the spring piece and the embedding block are used to return to their original position to reset the components, and the chip can be loaded again from the upper side of the chip slot for testing.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] In the present invention, the pin is pulled toward the positioning groove by the guide slope, and the pin can be connected in the center along the connecting pin. Compared with the existing method of inserting the pin into the gap of the contact sheet, the guide slope composed of the adjacent convex edges can pull the pin of the chip, so that the pin actively enters the positioning groove, thereby ensuring that after the chip is installed, its pin can always be connected in the center with the connecting pin. On the one hand, there is no need for the user to control the pin and the test component to be accurately aligned, and the operation is convenient. On the other hand, the contact between the connecting pin and the pin can be made more stable.

[0030] In the present invention, the spring sheet is bent by moving the slide seat downward, and the bent spring sheet extends out along the through groove to press and fix the patch pins or pins of the chip. Compared with the existing method of fixing the patch pins and pins separately by flipping the contact sheet, the above-mentioned connecting pins can carry out the same treatment on the patch pins and pins, and then cooperate with the spring sheet for secondary fixed connection. On the one hand, different chips can be installed and connected without adjusting the connection parts, which has better test adaptability and strong operation convenience. On the other hand, the spring sheet is bent and fixed again after the chip is installed, and does not contact the patch pins and pins during installation, which can avoid wear marks caused by the insertion of the chip connection point.

[0031] In the present invention, the block contacts the bevel and presses the embedding block into the embedding groove, thereby releasing the lock of the embedding block on the connecting pin along the limit bar. At this time, the connecting pin flips downward through the connecting pin, cancels the support on the chip, and allows the tested chip to fall and be released from the chip slot. Then, the spring sheet and the embedding block are used to return to their original position to reset the components, and the chip can be loaded into the chip slot again for testing. Compared with the existing method of taking the chip out of the equipment after the test, the test can be carried out when the embedding block locks the limit bar and the connecting pin. Subsequently, when the slide seat moves downward, the block is used to unlock the connecting pin, so that the connecting pin can be rotated downward to release the chip, thereby realizing the automatic detachment of the test chip from the test equipment, without the need for the user to pick up the chips one by one, and further improving the convenience of the test operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the structure of the detection seat and the surface mount chip of the present invention;

[0033] Figure 2 It is a schematic diagram of the structure of the detection seat and the pin-type chip of the present invention;

[0034] Figure 3 It is a three-dimensional structural cross-sectional view of the detection seat of the present invention;

[0035] Figure 4 For the present invention Figure 3 The enlarged view of point A in the middle;

[0036] Figure 5 It is a structural schematic diagram of the slideway and the connecting foot of the present invention;

[0037] Figure 6 An exploded view of the slideway and the slide seat of the present invention;

[0038] Figure 7 It is a three-dimensional structural schematic diagram of the slideway of the present invention;

[0039] Figure 8 It is a schematic diagram of the three-dimensional structure of the sliding seat and the connecting foot of the present invention;

[0040] Fig. 9 For the present invention Figure 8 The enlarged view of point B in the middle;

[0041] Fig.10 It is an exploded view of the slide seat, the rotary column and the spring piece of the present invention;

[0042] Fig.11 For the present invention Fig.10 Enlarged view of point C in the middle.

[0043] In the figure: 1, detection seat; 2, chip slot; 3, connecting foot; 4, positioning assembly; 41, convex edge; 42, positioning slot; 43, guide slope; 44, pin holder; 441, slide slot; 442, slide seat; 443, spring clamp; 444, column slot; 445, rotary column; 446, tooth slot; 447, release cut; 448, bevel edge; 449, ejector pin; 4410, notch; 4411, spring piece; 4412, through slot; 4413, chip release assembly; 44131, wall slot; 44132, connecting pin; 44133, buckle plate; 44134, embedded slot; 44135, embedded block; 44136, top spring; 44137, limit strip; 44138, oblique mouth; 44139, stop block; 441310, arc-shaped oblique slot. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technical staff in this field without creative work are within the scope of protection of the present invention.

[0045] See also Figures 1 to 11 The present invention provides a technical solution: a diode chip photoelectric performance test device, including a detection seat 1, a chip slot 2 is opened inside the detection seat 1, and a plurality of connecting pins 3 matching with chip pins are arranged on the inner side wall of the chip slot 2, the plurality of connecting pins 3 are equally divided into four groups, and the four groups of connecting pins 3 are respectively located at the four sides of the chip slot 2. When testing a direct-insert chip, it is placed in the chip slot 2. During this process, the pins on the four sides of the chip contact the connecting pins 3, and then the connecting pins 3 are connected to the pins to perform a photoelectric test on the chip, and a positioning component 4 matching with the chip pins is arranged on the connecting pins 3.

[0046] The positioning assembly 4 includes a flange 41 fixedly arranged on the top of the connecting foot 3, and the flange 41 is set as a triangular block structure. The flanges 41 are symmetrically distributed on the connecting foot 3 in groups of two, and a positioning groove 42 with an inverted triangle structure is set between the two flanges 41.

[0047] A guide slope 43 of an equilateral triangle structure is provided between two adjacent groups of convex edges 41 . When the pin falls between two connecting pins 3 , it is pulled by the guide slope 43 and slides toward the positioning groove 42 . At this time, the pin can be centrally connected along the connecting pins 3 .

[0048] A pin fixer 44 is provided on the connecting pin 3 and the chip slot 2 .

[0049] In this embodiment, Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figures 5 to 11 As shown, the pin holder 44 includes a slide groove 441 opened on the inner wall of the chip slot 2, and the number and position of the slide groove 441 correspond to the connecting pin 3. A slide seat 442 is slidably connected in the slide groove 441, and the connecting pin 3 is connected to the slide seat 442.

[0050] A spring tooth 443 is provided on the inner wall of the slide groove 441. The chip is loaded into the chip groove 2, and the chip is pressed down continuously, so that the slide seat 442 moves downward along the connecting foot 3, and the spring tooth 443 is engaged with the tooth groove 446 to lock the slide seat 442.

[0051] A column groove 444 is provided on the side of the sliding seat 442 opposite to the spring tooth 443, and a rotary column 445 is rotatably connected in the column groove 444. A tooth groove 446 matching the spring tooth 443 is provided on the side surface of the rotary column 445, and a release cut 447 matching the spring tooth 443 is cut on the side surface of the rotary column 445.

[0052] The upper and lower ends of the rotary post 445 are provided with spiral bevels 448, and the inner bottom wall and the inner top wall of the slide groove 441 are fixedly connected with ejector pins 449 that cooperate with the bevels 448 on the same side. When the slide 442 drives the rotary post 445 to move down to the bottom, the lower ejector pin 449 pushes the rotary post 445 to rotate along the lower bevel 448, so that the release cutout 447 is aligned with the spring tooth 443 and the tooth groove 446 is disengaged from the spring tooth 443. At this time, the slide 442 is not locked and can move up freely. When the slide 442 drives the rotary post 445 to move up and to the top, the upper ejector pin 449 pushes the rotary post 445 and the tooth groove 446 to return to their original position along the upper bevel 448, so that the slide 442 can be locked by the spring tooth 443 when it moves down again.

[0053] A notch 4410 is provided on the side of the slide 442 opposite to the connecting pin 3, and a spring piece 4411 that can be bent under pressure is provided in the notch 4410, the top of the spring piece 4411 is rotatably connected in the notch 4410, and the bottom of the spring piece 4411 is rotatably connected in the slide groove 441, and a through groove 4412 for the spring piece 4411 to pass through is provided on the connecting pin 3, and when the slide 442 moves downward, the spring piece 4411 is squeezed to bend, and the bent spring piece 4411 extends out along the through groove 4412 to press the patch pin or pin of the chip.

[0054] A chip release component 4413 is disposed on the connecting pin 3 , the slide seat 442 , and the chip slot 2 .

[0055] In this embodiment, Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figures 5 to 11 As shown, the chip release component 4413 includes two wall grooves 44131 respectively opened along the side surfaces of the connecting pin 3, and a connecting pin 44132 is fixedly arranged in the wall groove 44131, and two buckle plates 44133 are fixedly arranged on the side surface of the slide seat 442, and the connecting pin 3 is rotatably inserted into the buckle plate 44133.

[0056] An embedding groove 44134 is provided on the outer surface of the buckle plate 44133, and an embedding block 44135 is slidably connected in the embedding groove 44134. A top spring 44136 is provided in the embedding groove 44134, and the top spring 44136 pushes the embedding block 44135 to slide outward. The outer end of the connecting pin 44132 is fixedly connected to a limiting strip 44137 restricted by the embedding block 44135.

[0057] A bevel 44138 is provided on the side surface of the embedding block 44135, and a stop block 44139 matching the bevel 44138 is fixedly arranged on the lower side of the chip slot 2. After the chip test is completed, the chip and the slide 442 are pressed down. After the slide 442 moves down to the bottom, the stop block 44139 contacts the bevel 44138 and presses the embedding block 44135 into the embedding slot 44134, releasing the lock of the embedding block 44135 on the connecting pin 3 along the limit strip 44137. At this time, the connecting pin 3 is flipped downward by the connecting pin 44132, canceling the support for the chip, so that the tested chip falls and is released from the chip slot 2.

[0058] The side surface of the insert 44135 is provided with an arc-shaped inclined groove 441310 that cooperates with the limit strip 44137. After the block 44139 squeezes the insert 44135 along the inclined opening 44138 and enters the insert groove 44134, the connecting pin 44132 can drive the limit strip 44137 to rotate downward. After the block 44139 leaves the inclined opening 44138, the reset insert 44135 can use the arc-shaped inclined groove 441310 to push the limit strip 44137 and the connecting pin 44132 to rotate synchronously.

[0059] In this embodiment, Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figures 5 to 11 As shown, a ball is embedded in the end of the ejector pin 449 that contacts the bevel 448. When the rotary column 445 moves down to the bottom following the slide 442, the ball is used for rolling friction during the contact process between the ejector pin 449 and the bevel 448, which can avoid excessive wear caused by hard friction between the ejector pin 449 and the bevel 448.

[0060] In this embodiment, Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figures 5 to 11 As shown, a shock-absorbing pad that cooperates with the slide 442 is provided on the inner bottom wall of the slide 442. When the slide 442 moves down to the bottom along the slide groove 441, the slide 442 can use the shock-absorbing pad for cushioning to reduce the damage to the test structure and chip caused by the slide 442 moving down and colliding with the slide groove 441.

[0061] In this embodiment, Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figures 5 to 11 As shown, a paddle that cooperates with the tooth groove 446 is fixedly provided on the inner wall of the slide groove 441, and the paddle is located on the upper side of the stop block 44139. During the process of loading the chip, when the rotary column 445 and the slide seat 442 move down to the upper side of the stop block 44139, the paddle is pressed by the tooth groove 446 to prompt the user to stop pressing the chip. Continuing to press the chip will release it downward.

[0062] In this embodiment, Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figures 5 to 11 As shown, the limit strip 44137 and the connecting pin 44132 are installed by screws. After removing the screws, the limit strip 44137 can be separated from the connecting pin 44132, so that the user can replace the worn limit strip 44137.

[0063] A method for using a diode chip photoelectric performance testing device comprises the following steps:

[0064] S1. When testing a direct-insertion chip, place it into the chip slot 2. During this process, the pins on the four sides of the chip contact the connecting pins 3, and then the connecting pins 3 are connected to the pins to perform an optoelectronic test on the chip.

[0065] S2. When the pin falls between the two connecting pins 3, it is pulled by the guide slope 43 and slides toward the positioning groove 42. At this time, the pin can be centrally connected along the connecting pins 3.

[0066] S3. The chip is loaded into the chip slot 2, and the chip is continuously pressed down so that it drives the slide 442 downward along the connecting pin 3, and the slide 442 is locked by the spring tooth 443 engaging the tooth groove 446. During this process, the slide 442 squeezes the spring sheet 4411 to bend, and the bent spring sheet 4411 extends out along the through slot 4412 to press the chip pin or pin.

[0067] S4. After the chip test is completed, the chip and the slide 442 are pressed down. After the slide 442 moves down to the bottom, the stop block 44139 contacts the bevel 44138, and the insert block 44135 is pressed into the insert groove 44134, and the lock of the insert block 44135 on the connecting pin 3 along the limit bar 44137 is released. At this time, the connecting pin 3 is flipped downward by the connecting pin 44132, and the support for the chip is cancelled, so that the tested chip falls and is released from the chip slot 2, and then the spring piece 4411 and the insert block 44135 are returned to their original positions to reset the components, and the chip can be loaded again from the upper side of the chip slot 2 for testing.

[0068] The above shows and describes the basic principles, main features and advantages of the present invention. Technical personnel in this industry should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not used to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A diode chip photoelectric performance testing device, comprising a testing seat (1), characterized in that: The detection seat (1) has a chip slot (2) formed inside, and a plurality of connecting pins (3) matching with the chip pins are arranged on the inner side wall of the chip slot (2), the plurality of connecting pins (3) are equally divided into four groups, and the four groups of connecting pins (3) are respectively located at four sides of the chip slot (2), and a positioning component (4) matching with the chip pins is arranged on the connecting pins (3); The positioning assembly (4) comprises a convex edge (41) fixedly arranged on the top of the connecting foot (3), and the convex edge (41) is configured as a triangular block structure, the convex edges (41) are symmetrically distributed on the connecting foot (3) in a group of two, and a positioning groove (42) of an inverted triangular structure is configured between the two convex edges (41); A guide slope (43) having an equilateral triangle structure is provided between two adjacent groups of the convex edges (41); A pin fixer (44) is provided on the connecting pin (3) and the chip slot (2); The pin holder (44) comprises a slide groove (441) formed on the inner side wall of the chip slot (2), and the number and position of the slide grooves (441) correspond to the connecting pin (3), a slide seat (442) is slidably connected in the slide groove (441), and the connecting pin (3) is connected to the slide seat (442); A spring latch (443) is provided on the inner side wall of the slide groove (441); A column groove (444) is provided on a side of the surface of the slide seat (442) opposite to the spring tooth (443), and a rotating column (445) is rotatably connected in the column groove (444), a tooth groove (446) matching with the spring tooth (443) is provided on the side surface of the rotating column (445), and a release notch (447) matching with the spring tooth (443) is cut on the side surface of the rotating column (445); The upper and lower ends of the rotating column (445) are both provided with spiral bevels (448), and the inner bottom wall and the inner top wall of the sliding groove (441) are both fixedly connected with ejector pins (449) that match the bevels (448) on the same side; A notch (4410) is provided on a side of the surface of the slide seat (442) opposite to the connecting leg (3), and a spring sheet (4411) capable of bending under pressure is arranged in the notch (4410), the top of the spring sheet (4411) is rotatably connected in the notch (4410), and the bottom of the spring sheet (4411) is rotatably connected in the slide groove (441), and a through groove (4412) for the spring sheet (4411) to pass through is provided on the connecting leg (3); The connecting pin (3), the slide seat (442) and the chip slot (2) are provided with a chip release component (4413); The chip release component (4413) comprises two wall grooves (44131) respectively opened along the side surfaces of both sides of the connecting foot (3), and a connecting pin (44132) is fixedly arranged in the wall groove (44131), and two buckle plates (44133) are fixedly arranged on the side surface of the sliding seat (442), and the connecting foot (3) is rotatably inserted into the buckle plates (44133); The outer surface of the buckle plate (44133) is provided with an embedding groove (44134), and an embedding block (44135) is slidably connected in the embedding groove (44134), a top spring (44136) is arranged in the embedding groove (44134), and the top spring (44136) pushes the embedding block (44135) to slide outward, and the outer end of the connecting pin (44132) is fixedly connected with a limiting strip (44137) limited by the embedding block (44135); The side surface of the insert block (44135) is provided with an oblique opening (44138), and the lower side of the chip slot (2) is fixedly provided with a stop block (44139) that matches the oblique opening (44138); The side surface of the insert (44135) is provided with an arc-shaped inclined groove (441310) that matches the limiting strip (44137).

2. A diode chip photoelectric performance testing device according to claim 1, characterized in that: A ball is rolled and embedded in the end of the ejector pin (449) that contacts the bevel edge (448).

3. A diode chip photoelectric performance testing device according to claim 2, characterized in that: A shock-absorbing pad matching the sliding seat (442) is arranged on the inner bottom wall of the sliding seat (442).

4. A diode chip photoelectric performance testing device according to claim 3, characterized in that: A paddle that matches the tooth groove (446) is fixedly arranged on the inner side wall of the slide groove (441), and the paddle is located on the upper side of the stop block (44139).

5. A diode chip photoelectric performance testing device according to claim 4, characterized in that: The limiting strip (44137) and the connecting pin (44132) are mounted via screws.

6. A method for using a diode chip photoelectric performance test device, using a diode chip photoelectric performance test device as claimed in any one of claims 1 to 5, characterized in that: The steps include: S1. When testing a direct-insertion chip, place it into the chip slot (2). During this process, the pins on the four sides of the chip contact the connecting pins (3), and then use the connecting pins (3) to connect with the pins to perform an optoelectronic test on the chip; S2, when the pin falls between the two connecting legs (3), it is pulled by the guide slope (43) and slides toward the positioning groove (42), and the pin can be centrally connected along the connecting legs (3); S3, the chip is loaded into the chip slot (2), and the chip is pressed down continuously so that the chip drives the slide seat (442) to move downward along the connecting foot (3), and the slide seat (442) is locked by the spring clamping teeth (443) engaging the tooth grooves (446). During this process, the slide seat (442) squeezes the spring sheet (4411) to bend, and the bent spring sheet (4411) extends along the through groove (4412) to press and fix the chip pin or the pin; S4. After the chip test is completed, the chip and the slide (442) are pressed down. After the slide (442) moves down to the bottom, the stopper (44139) contacts the bevel (44138), and the insert (44135) is pressed into the insert groove (44134). The lock of the insert (44135) on the connecting foot (3) along the limit strip (44137) is released. At this time, the connecting foot (3) is turned downward by the connecting pin (44132), and the support for the chip is cancelled, so that the tested chip falls and is released from the chip slot (2). Then, the spring (4411) and the insert (44135) are returned to their original positions to reset the components, and the chip can be loaded again from the upper side of the chip slot (2) for testing.

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