A test model testing method, system and terminal for chip testing

Abstract

The present invention relates to a test template test method, system and terminal for chip testing, and relates to the technical field of tooling, which includes obtaining top image information of a template test block; determining the test hole position according to the top image information and preset test hole features; controlling a preset inner clamping device to clamp the preset inner wall of a connection terminal to clamp the connection terminal, inserting the connection terminal into the test hole position of the template test block, and obtaining the overall image information of the template base; determining the test slot feature position according to the overall image information and preset test slot features; controlling a preset suction cup device to suck up the template test block and position it at the test slot feature position to control the radio frequency probe preset in the test slot to center and abut with the connection terminal installed on the template test block. By setting a template test block that simulates the test point arrangement of the chip to be tested to assist in testing, the test efficiency of the test template is improved.

Description

Technical Field

[0001] The present invention relates to the field of tooling, and in particular to a test prototype test method, system and terminal for chip testing. Background Art

[0002] A test template is a test tooling, which is used to test the performance of the chip in the field of chip manufacturing.

[0003] The test master usually includes a test base, which is provided with a test slot for the chip to be tested, and the bottom of the test slot is designed with a radio frequency probe for testing the test points of the chip. When testing the chip, the chip to be tested is placed in the test slot and the test points of the chip to be tested are in contact with the radio frequency probe. At this time, the test master can test the performance of the chip.

[0004] In order to ensure the accuracy of the test master when testing the chip, the test master needs to be tested first, and it must be ensured that the position of the RF probe in the test slot can be aligned with the test point on the chip. In the prior art, the above test is usually performed manually, and the staff needs to check the position of the RF probes in the test slot one by one, which is inefficient. Summary of the invention

[0005] In order to improve the test efficiency when testing a test template, the present invention provides a test template testing method, system and terminal for chip testing.

[0006] In a first aspect, the present invention provides a test model testing method for chip testing, which adopts the following technical solution:

[0007] A test model testing method for chip testing, comprising:

[0008] Obtain the top image information of the prototype test block;

[0009] Determine the test hole position according to the top image information and the preset test hole features;

[0010] Controlling a preset inner clamping device to clamp the preset inner wall of the connection terminal to clamp the connection terminal, inserting the connection terminal into the test hole position of the prototype test block, and obtaining the overall image information of the prototype base;

[0011] Determine the test slot feature position according to the overall image information and the preset test slot features;

[0012] The preset suction cup device is controlled to suck up the prototype test block and position it at the characteristic position of the test slot to control the radio frequency probe preset in the test slot to abut against the connection terminal installed on the prototype test block.

[0013] By adopting the above technical solution, a template test block is set up to simulate the test point arrangement of the chip to be tested, and the connecting terminal is installed at the test hole position of the template test block. Then, the template test block is processed and installed at the test slot. By determining whether the connecting terminal is aligned with the RF probe and whether the position arrangement of the RF probe in the test slot is accurate, the above method improves the test efficiency of the test template.

[0014] Optionally, before installing the mastering test block on the mastering base, the mastering test block needs to be picked up from the preset part placement area to the preset test area to install the connection terminal in the test area. The processing method of the mastering test block includes:

[0015] Obtain the model information of the prototype test block and the inner cavity image of the test hole position;

[0016] Retrieve the weight value of the prototype test block from the model information of the prototype test block;

[0017] Match the suction power of the suction cup device according to the weight value of the prototype test block;

[0018] The suction cup device is controlled according to the suction power to suck up the prototype test block from the part placement area, and the heating element preset on the suction cup device is controlled with a preset heating power to preheat the prototype test block;

[0019] Determine whether there is a foreign body at the test hole position according to the inner cavity image at the test hole position and the test hole characteristics;

[0020] If and only if there is foreign matter at the test hole position, the suction power is corrected by a preset correction amount to remove the foreign matter at the test hole position during the process of picking up the prototype test block from the part placement area to the test area.

[0021] Optionally, when the connection terminal is installed at the test hole position, it is installed by a connection terminal installation control method, and the connection terminal installation control method includes:

[0022] Get the model information of the connection terminal;

[0023] Retrieve the terminal inner diameter value of the connection terminal from the model information of the connection terminal;

[0024] Match the opening width of the clamping jaws of the inner clamping device according to the inner diameter of the terminal;

[0025] According to the opening width of the clamping jaws, the inner clamping device is controlled to extend into the connecting terminal to clamp the connecting terminal and insert it into the test hole position;

[0026] When the connecting terminal is at the test hole position, the inner clamping device is controlled to rotate in the connecting terminal at a preset rotation speed so as to clean the inner wall of the connecting terminal through a wiping cloth preset on the clamping claw of the inner clamping device and detect abnormalities of the inner wall of the connecting terminal.

[0027] Optionally, the method for detecting abnormality on the inner wall of the connection terminal includes:

[0028] When the inner clamping device rotates on the inner wall of the connecting terminal, a rotation resistance value of the inner clamping device and an image of the inner wall of the connecting terminal are obtained;

[0029] When the rotation resistance value exceeds the lower limit of the preset reference friction range, it is defined as abnormal surface cracking and is processed with the preset internal surface cracking treatment method;

[0030] acquiring a state image of the connection terminal based on the rotation resistance value exceeding an upper limit of a reference friction range;

[0031] determining whether the connection terminal rotates synchronously with the inner clamping device according to the state image of the connection terminal;

[0032] When the connection terminal rotates synchronously with the inner clamping device, it is defined as abnormal misalignment after surface cracking, and it is handled in the same way as the inner surface cracking treatment method;

[0033] When the connection terminal does not rotate synchronously with the inner clamping device, it is defined as a surface protrusion abnormality, and the protrusion angle position is determined according to the inner wall image of the connection terminal and the preset protrusion feature;

[0034] The inner clamping device is controlled to apply force at the protruding angle position with a preset clamping jaw tension to flatten the protruding feature.

[0035] Optional methods for treating inner surface cracking include:

[0036] When the connection terminal and the inner clamping device rotate synchronously, the inner clamping device is controlled to rotate in the opposite direction, and the inner ring crack position is determined according to the inner wall image of the connection terminal and the preset cracking characteristics;

[0037] Control the inner clamping device to rotate in the opposite direction to the inner ring cracking position to form a filling cavity between the inner ring cracking position of the connecting terminal and the clamping claws of the inner clamping device, and control the inner clamping device to take the connecting terminal out of the test hole position;

[0038] Controlling a preset clamping device to apply force to the circumference of the connection terminal with a preset clamping force, and determining a clamping inner diameter value of the connection terminal according to an image of the inner wall of the connection terminal;

[0039] When the clamping inner diameter value is consistent with the terminal inner diameter value, the preset injection device is controlled to fill the metal bonding glue into the filling cavity at the crack position of the inner ring;

[0040] After filling the metal adhesive, the inner clamping device is controlled to reinstall the connection terminal at the test hole position, and the inner clamping device is controlled to apply force at the cracked position of the inner ring with a preset clamping claw tension.

[0041] Optionally, when the inner clamping device inserts the connecting terminal into the test hole, the outer wall of the connecting terminal needs to be processed. The method for processing the outer wall of the connecting terminal includes:

[0042] When the connecting terminal is inserted into the test hole, the inner clamping device is controlled to rotate with the connecting terminal at a rotation speed;

[0043] Controlling a preset blowing device to blow air to the outer wall of the connection terminal to remove surface impurities, and obtaining a reaction force of the blowing device on the outer wall of the connection terminal;

[0044] When the reaction force is not less than the preset reference force, it is defined as an outer wall bulge, and the outer diameter information of the connection terminal is retrieved from the model information of the connection terminal according to the model information of the connection terminal;

[0045] Matching a preset grinding device according to the outer diameter information of the connection terminal and sleeve the grinding device on the outer side of the connection terminal;

[0046] controlling the inner clamping device to rotate at a preset grinding speed to grind the raised feature;

[0047] When the reaction force is less than the reference force, it is defined as outer wall cracking, and the connection terminal is repaired using a preset outer wall crack repair method.

[0048] Optional methods for repairing cracks in the outer wall include:

[0049] Acquire an outer surface image of the connection terminal;

[0050] Determine the outer ring crack position according to the outer surface image of the connection terminal and the preset crack characteristics;

[0051] Controlling the inner clamping device to rotate the metal powder generated when grinding the raised features to the cracked position of the outer ring to fill the cracked features;

[0052] The preset injection device is controlled to fill the metal adhesive into the crack feature of the outer ring crack position, and the inner clamping device is controlled to continuously rotate the connection terminal at a grinding speed to generate heat to accelerate the curing of the metal adhesive.

[0053] Optionally, the positioning and installation method of the prototype test block at the characteristic position of the test slot includes:

[0054] When the connection terminal is installed at the test hole position, the suction cup device is controlled to pick up the prototype test block to a preset pre-positioning position above the characteristic position of the test slot;

[0055] Controlling a preset laser device to penetrate the central hole of the connection terminal vertically downward through the template test block to irradiate the test slot features, and obtaining the bottom surface image information of the test slot;

[0056] Determine the position of the radio frequency probe and the position of the red light spot generated by the laser device irradiating the bottom surface of the test slot according to the image information of the bottom surface of the test slot;

[0057] Determine the azimuth deviation according to the position of the radio frequency probe and the position of the red light spot;

[0058] According to the azimuth deviation, the suction cup device is controlled to adjust the prototype test block horizontally until the position of the radio frequency probe coincides with the position of the red light spot;

[0059] The suction cup device is controlled to lower the prototype test block to fit with the prototype base so as to be installed at the characteristic position of the test slot.

[0060] In a second aspect, the present application provides a test model test system for chip testing, which adopts the following technical solution:

[0061] A test model test system for chip testing, comprising:

[0062] An acquisition module is used to acquire top image information of the prototype test block, overall image information of the prototype base, model information of the connection terminal, rotation resistance value of the inner clamping device, inner wall image of the connection terminal, state image of the connection terminal, outer surface image of the connection terminal, and bottom surface image information of the test slot;

[0063] A memory for storing a program of any of the above-mentioned test profile test methods for chip testing;

[0064] The program in the memory can be loaded and executed by the processor and realize a test model test method for chip testing.

[0065] In a third aspect, the present application provides a smart terminal, which adopts the following technical solution:

[0066] An intelligent terminal comprises a memory and a processor. The memory stores a computer program which can be loaded by the processor and execute any one of the above-mentioned test profile test methods for chip testing.

[0067] In summary, the present application includes at least one of the following beneficial technical effects:

[0068] By setting a template test block that simulates the test point arrangement of the chip to be tested, installing the connection terminal at the test hole position of the template test block, and then processing the template test block to install it at the test slot, by determining whether the connection terminal is aligned with the RF probe to determine whether the position arrangement of the RF probe in the test slot is accurate, the above method improves the test efficiency of the test template;

[0069] The inner and outer walls of the connection terminal are cleaned and abnormalities are handled in sequence during the process of installing the connection terminal on the prototype test block; when handling the outer wall, the system blows air through the blowing device to obtain the reaction force to determine the bulge and crack of the outer wall of the connection terminal, and when handling the inner wall, the bulge and crack of the inner wall of the connection terminal are determined by detecting the rotation resistance of the clamping claws of the inner clamping device; when the outer wall is bulged, it is polished by the polishing device and the metal powder is recovered, and when the outer wall is cracked, the recovered metal powder is filled into the cracked position, and then connected by metal adhesive, so that the connection terminal is repaired with high efficiency and the normal use of the connection terminal can be determined;

[0070] When the prototype test block is installed on the prototype base, first suspend the prototype test block above the characteristic position of the test slot, and use the laser device to emit laser vertically downward through the center hole of the connecting terminal. The position of the prototype test block can be adjusted by adjusting the overlap between the red dot light spot and the RF probe, which is more efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0071] Figure 1 is a method flow chart of a test model testing method for chip testing according to an embodiment of the present invention;

[0072] Figure 2 is a method flow chart of a method for processing a prototype test block according to an embodiment of the present invention;

[0073] Figure 3 is a method flow chart of a connection terminal installation control method according to an embodiment of the present invention;

[0074] Figure 4 is a method flow chart of a method for detecting abnormality of the inner wall of a connection terminal according to an embodiment of the present invention;

[0075] Figure 5 is a method flow chart of the inner surface cracking treatment method according to an embodiment of the present invention;

[0076] Figure 6 is a method flow chart of a method for processing an outer wall of a connection terminal according to an embodiment of the present invention;

[0077] Figure 7 is a method flow chart of a method for repairing cracks in an outer wall according to an embodiment of the present invention;

[0078] Figure 8 It is a method flow chart of a method for positioning and installing a prototype test block at a characteristic position of a test slot according to an embodiment of the present invention. DETAILED DESCRIPTION

[0079] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0080] The embodiment of the present application discloses a test template test method for chip testing. First, a connection terminal is installed in the test hole position of a template test block, and the connection terminal is cleaned, abnormality detected and repaired during the installation of the connection terminal, and then the template test block is installed in the test slot position of the test template, and the accuracy of the position of the template test block is located when installing the template test block.

[0081] Reference Figure 1 A test model testing method for chip testing comprises the following steps:

[0082] Step S100: obtaining top image information of a prototype test block.

[0083] A test hole is provided on the top of the prototype test block and extends through the bottom surface. The top image information refers to an image of the top of the prototype test block obtained by a camera arranged on the test bench, and the test hole will appear in the top image information.

[0084] Step S101: determining the position of the test hole according to the top image information and preset test hole features.

[0085] The test hole position refers to the opening position of the test hole feature at the top of the prototype test block. The test hole position is determined by performing image recognition analysis on the test hole feature from the top image information.

[0086] Step S102: controlling a preset inner clamping device to clamp on a preset inner wall of a connection terminal to clamp the connection terminal, inserting the connection terminal into a test hole position of a prototype test block, and acquiring overall image information of the prototype base.

[0087] In this embodiment, the inner clamping device is used to clamp the connection terminal so as to install it into the test hole of the prototype test block, and the suction cup device is used to install the prototype test block into the test slot position of the prototype base.

[0088] Since the connecting terminal is in a hollow cylindrical shape, when the inner clamping device is used, the clamping claws of the inner clamping device extend into the inner cavity of the connecting terminal and expand outwards to support the inner wall of the connecting terminal, thereby clamping the connecting terminal.

[0089] The overall image information of the mastering base refers to the image of the mastering base placed on the test bench acquired by the camera, and the test slots on the mastering base can be identified in the overall image information of the mastering base.

[0090] Step S103: determining the characteristic position of the test slot according to the overall image information and the preset test slot characteristics.

[0091] The characteristic position of the test slot refers to the opening position of the test slot feature on the prototype base. The characteristic position of the test slot can be obtained by identifying and analyzing the test slot feature from the overall image information of the prototype base.

[0092] Step S104: Control the preset suction cup device to suck up the master test block and position it at a characteristic position of the test slot to control the RF probe preset in the test slot to align and abut with the connection terminal installed on the master test block.

[0093] After the connecting terminal is first installed at the test hole position and the characteristic position of the test slot is determined through the internal clamping device, the suction cup device is controlled to install the prototype test block at the characteristic position of the test slot. At this time, the RF probe in the test slot can be centered and abutted with the connecting terminal on the prototype test block, indicating that the test prototype performance is qualified.

[0094] Reference Figure 2 , the processing method of the prototype test block includes the following steps:

[0095] In this embodiment, before installing the master test block on the master base, it is necessary to first pick up the master test block from the part placement area to the test area. The master test block is initially stacked in the part placement area. When testing the new test master, the master test block is first picked up from the part placement area to the test area through the suction cup device. The test area is on the test bench, and the installation of the connecting terminals is completed in the test area.

[0096] Step S200: obtaining the model information of the master test block and the inner cavity image of the test hole position.

[0097] The model information of the prototype test block includes parameters such as the size and weight of the prototype test block. A barcode including the model information is affixed to the prototype test block. The model information of the prototype test block is obtained by scanning the barcode with a camera.

[0098] The inner cavity image at the test hole position refers to the image of the inside of the test hole obtained by the camera. Before installing the connection terminal in the test hole, the inside of the test hole needs to be processed first.

[0099] Step S201: Retrieve the weight value of the prototype test block from the model information of the prototype test block.

[0100] When the model information of the prototype test block is obtained by scanning, the system can directly retrieve the weight value of the prototype test block from the database according to the model information.

[0101] Step S202: matching the suction power of the suction cup device according to the weight value of the prototype test block.

[0102] The suction power refers to the power of the suction cup device when it sucks and picks up the prototype test block. The suction power is proportional to the weight value of the prototype test block. The greater the weight value of the prototype test block, the greater the suction power.

[0103] Step S203: Controlling the suction cup device to suck up the prototype test block from the part placement area according to the suction power, and controlling the heating element preset on the suction cup device to preheat the prototype test block with a preset heating power.

[0104] In this embodiment, a heating element is also provided on the suction cup device. When the suction cup device sucks the prototype test block, the heating element can generate heat to preheat the prototype test block. The purpose of heating the prototype test block is to make the prototype test block expand due to heat, so that the connecting terminal can be more easily installed into the test hole, and the connecting terminal can be firmly stuck in the test hole after the prototype test block cools and shrinks. The heating power is the power of the heating element to generate heat set by the technician, which will not be elaborated here.

[0105] Step S204: determining whether there is a foreign object at the test hole position according to the inner cavity image at the test hole position and the test hole features.

[0106] The suction cup device has the function of sucking foreign matter. When the suction cup device sucks the prototype test block, if there is foreign matter in the test hole, the suction cup device can suck the foreign matter away. Whether there is foreign matter in the test hole can be determined by performing image recognition analysis on the inner cavity image of the test hole position.

[0107] Step S205: If and only if there is foreign matter at the test hole position, the suction power is corrected by a preset correction amount to remove the foreign matter at the test hole position during the process of picking up the prototype test block from the part placement area to the test area.

[0108] If there is foreign matter in the test hole, the suction cup device needs to adjust the suction power to increase the suction power to absorb the foreign matter. The correction amount is the increase in suction power set by the technician when adjusting the suction power, which will not be described here. By increasing the suction power of the suction cup device, the suction cup device can simultaneously remove foreign matter in the test hole when transporting the prototype test block.

[0109] Reference Figure 3When the connecting terminal is installed at the test hole position, it is installed by a connecting terminal installation control method, and the connecting terminal installation control method includes the following steps:

[0110] Step S300: Obtain model information of the connection terminal.

[0111] The model information of the connecting terminal includes parameters such as the size and weight of the connecting terminal. A barcode containing the model information is affixed to a parts box for placing the connecting terminal. The model information of the connecting terminal is obtained by scanning the barcode with a camera.

[0112] Step S301: Retrieve the terminal inner diameter value of the connection terminal from the model information of the connection terminal.

[0113] The connection terminal is a hollow cylindrical part, and the terminal inner diameter value of the connection terminal refers to the inner diameter of the hollow inner cavity. The system can directly retrieve the terminal inner diameter value from the database according to the model information of the connection terminal.

[0114] Step S302: matching the opening width of the clamping jaws of the inner clamping device according to the inner diameter value of the terminal.

[0115] Since the inner clamping device clamps the connection terminal from the inner cavity of the connection terminal, the clamping claws of the inner clamping device need to be opened to support the connection terminal. The opening width of the clamping claws is consistent with the inner diameter of the terminal.

[0116] Step S303: controlling the inner clamping device to extend into the connection terminal according to the opening width of the clamping jaws to clamp the connection terminal and insert the connection terminal into the test hole position.

[0117] When the inner clamping device controls the clamping jaws with the opening width of the clamping jaws, the clamping jaws can clamp the connecting terminals and are not likely to cause damage to the connecting terminals.

[0118] Step S304: When the connecting terminal is at the test hole position, the inner clamping device is controlled to rotate in the connecting terminal at a preset rotation speed to clean the inner wall of the connecting terminal with a cloth preset on the clamping claws of the inner clamping device, and detect abnormalities of the inner wall of the connecting terminal.

[0119] In this embodiment, the surface of the clamping claw of the inner clamping device is covered with a thin layer of wiping cloth, which protects the inner wall of the connecting terminal and can also wipe and clean the inner wall of the connecting terminal.

[0120] After the connection terminal is installed in the test hole position through the inner clamping device, the system controls the clamping claws of the inner clamping device to rotate one circle in the circumferential direction to wipe the inner wall of the connection terminal with the wiping cloth on the surface, and detects abnormalities on the inner wall of the connection terminal during the wiping process, and handles them after abnormalities are found. The rotation speed is the rotation speed of the inner clamping device inside the connection terminal set by the technician, which will not be described here.

[0121] Reference Figure 4 The method for detecting abnormality of the inner wall of the connection terminal comprises the following steps:

[0122] Step S400: when the inner clamping device rotates on the inner wall of the connecting terminal, the rotation resistance value of the inner clamping device and the image of the inner wall of the connecting terminal are obtained.

[0123] The rotation resistance value refers to the resistance encountered by the inner clamping device's jaws when rotating in the connection terminal. Under normal circumstances, this resistance is the friction between the jaws and the inner wall of the connection terminal. When the resistance changes, the connection terminal may become abnormal. A pressure sensor is integrated in the inner clamping device's jaws, which can obtain the rotation resistance value in real time.

[0124] The connection terminal inner wall image refers to an image of the inner wall of the connection terminal obtained by a camera, and the image includes abnormal conditions that may appear on the inner wall.

[0125] Step S401: Based on the rotation resistance value exceeding the lower limit of the preset reference friction range, it is defined as a surface cracking abnormality, and a preset inner surface cracking processing method is used for processing.

[0126] The reference friction range is the friction generated when the clamping claws of the inner clamping device rotate on the inner wall of the normal connection terminal. The friction is measured in advance by the technicians and will not be described in detail here.

[0127] When the rotation resistance value exceeds the lower limit of the reference friction range, it means that the rotation resistance value suddenly decreases during the rotation process. It may be that there is a crack in the connecting terminal. At the crack, the friction force is small because the clamping claws are not in contact with the inner wall surface of the connecting terminal.

[0128] The inner surface crack treatment method is not described in detail here, but will be described in detail in the subsequent embodiments.

[0129] Step S402: Based on the rotation resistance value exceeding the upper limit of the reference friction range, a state image of the connection terminal is acquired.

[0130] When the rotation resistance value exceeds the upper limit of the reference friction range, it means that the rotation resistance value suddenly increases during the rotation process. At this time, there are two situations. The first situation is that there is a protrusion on the inner wall of the connection terminal, which increases the friction when the clamp passes through the protrusion. The second situation is that there is a crack in the connection terminal and the two ends of the crack are misaligned, so that the clamp abuts against one end and cannot continue to rotate in the connection terminal. At this time, the connection terminal will rotate synchronously with the clamp of the internal clamping device. By analyzing the state of the connection terminal, it can be determined which of the above situations the connection terminal has.

[0131] The state image of the connection terminal refers to an image of the state of the connection terminal when the inner clamping device rotates inside the connection terminal, which is obtained by a camera. The state of the connection terminal includes a stationary state and a rotating state.

[0132] Step S403: determining whether the connecting terminal rotates synchronously with the inner clamping device according to the state image of the connecting terminal.

[0133] By performing image recognition on the state image of the connection terminal, it is possible to determine whether it is in a stationary state or a rotating state.

[0134] Step S4041: When the connection terminal and the inner clamping device rotate synchronously, it is defined as abnormal misalignment after surface cracking, and is processed by the inner surface cracking processing method.

[0135] If the connection terminal rotates synchronously with the inner clamping device, it means that the connection terminal has an abnormal misalignment due to surface cracking. The method for processing the inner surface cracking will not be described here, but will be described in detail in subsequent embodiments.

[0136] Step S4042: When the connection terminal does not rotate synchronously with the inner clamping device, it is defined as a surface protrusion abnormality, and the protrusion angle position is determined according to the inner wall image of the connection terminal and the preset protrusion feature.

[0137] If the connection terminal is in a stationary state, it means that the connection terminal only has protrusions on the inner wall, which increases the friction.

[0138] The convex angle position refers to the position of the convex feature on the inner wall of the connection terminal. The convex angle position can be determined by performing image recognition analysis on the convex feature in the image of the inner wall of the connection terminal.

[0139] Step S40421: Control the inner clamping device to apply force at the protruding angle position with a preset clamping jaw tension to flatten the protruding feature.

[0140] After determining the raised angle position of the raised feature, the system controls the jaws of the inner clamping device to rotate to the raised angle position, at which time the jaws press on the raised feature, and then the system controls the jaws to open outwards with the jaw tension, thereby flattening the raised feature. The jaw tension is the force set by the technician that the inner clamping device applies to the raised feature when flattening it, which will not be described in detail here.

[0141] Reference Figure 5 , the inner surface cracking treatment method includes the following steps:

[0142] Step S500: When the connection terminal and the inner clamping device rotate synchronously, the inner clamping device is controlled to rotate in the opposite direction, and the inner ring crack position is determined according to the inner wall image of the connection terminal and the preset cracking feature.

[0143] The inner ring crack position refers to the position where the crack feature of the inner wall of the connection terminal is located. The inner ring crack position can be determined by performing image recognition analysis on the crack feature in the image of the inner wall of the connection terminal.

[0144] When the connecting terminal rotates synchronously with the inner clamping device, it means that the clamping claw of the inner clamping device abuts against one end of the cracking feature, and at this time, the clamping claw rotates in the opposite direction for one circle.

[0145] Step S501: Control the inner clamping device to rotate in the opposite direction to the inner ring cracking position to form a filling cavity between the inner ring cracking position of the connection terminal and the clamping claws of the inner clamping device, and control the inner clamping device to take the connection terminal out of the test hole position.

[0146] After the clamping jaws rotate one circle in the opposite direction, they can pass over the previously stuck position and press on the cracked position to flatten the two ends of the cracked position. At this time, a filling cavity is formed between the cracked position of the inner ring and the clamping jaws of the inner clamping device. The filling cavity needs to be filled with material in subsequent embodiments to repair the connection terminal.

[0147] Step S502: controlling a preset clamping device to apply force to the circumference of the connection terminal with a preset clamping force, and determining a clamping inner diameter value of the connection terminal according to the inner wall image of the connection terminal.

[0148] In this embodiment, the inner diameter of the connecting terminal expands after the cracking, and the system clamps the connecting terminal from the outer circumference of the connecting terminal through the clamping device, so that the cracked position of the connecting terminal is merged and the inner diameter value of the terminal returns to normal.

[0149] The clamping inner diameter value refers to the inner diameter value of the connection terminal when the clamping device clamps the connection terminal, and the clamping inner diameter value will gradually decrease to the terminal inner diameter value as the clamping device clamps it. The clamping inner diameter value can be obtained by performing image recognition analysis on the inner wall image of the connection terminal.

[0150] The clamping force is the force applied by the clamping device to the connection terminal when clamped by the technician, which will not be described in detail here.

[0151] Step S503: When the clamping inner diameter value is consistent with the terminal inner diameter value, the preset injection device is controlled to fill the metal adhesive into the filling cavity at the crack position of the inner ring.

[0152] When the clamping inner diameter value is consistent with the terminal inner diameter value, the two ends of the cracking feature of the connecting terminal are basically abutted together. At this time, the metal adhesive is filled into the filling cavity through the injection device, and the metal adhesive can connect the two ends of the cracking feature of the connecting terminal.

[0153] Step S504: After filling the metal adhesive, control the inner clamping device to reinstall the connection terminal at the test hole position, and control the inner clamping device to apply force at the inner ring crack position with a preset clamping claw tension.

[0154] After the metal adhesive is filled, the connection terminal is reinstalled at the test hole position, and force is applied to the cracked position of the inner ring through the inner clamping device, so that the cracked position is further reinforced and repaired.

[0155] Reference Figure 6 In the process of inserting the connecting terminal into the test hole position by the inner clamping device, the outer wall of the connecting terminal needs to be processed. The method for processing the outer wall of the connecting terminal includes the following steps:

[0156] Step S600: When the connecting terminal is inserted into the testing hole, the inner clamping device is controlled to rotate with the connecting terminal at a rotation speed.

[0157] In this embodiment, in addition to detecting abnormalities on the inner wall of the connection terminal, the outer wall thereof also needs to be cleaned and detected for abnormalities to avoid abnormalities between the outer wall of the connection terminal and the test hole after the connection terminal is installed at the test hole position.

[0158] The system processes the outer wall of the connection terminal before the inner wall. The outer wall is processed first, and then the connection terminal is installed at the test hole position, and then the inner wall is inspected.

[0159] The outer wall of the connecting terminal is processed when the connecting terminal is inserted into the test hole. During this process, the inner clamping device is controlled to carry the connecting terminal to rotate, and some impurities on the outer wall of the connecting terminal can be thrown off.

[0160] Step S601: controlling a preset blowing device to blow air to the outer wall of the connection terminal to remove surface impurities, and obtaining the reaction force of the blowing device on the outer wall of the connection terminal.

[0161] During the rotation of the inner clamping device, the outer wall of the connecting terminal is blown synchronously by the blowing device to further blow away impurities on the outer wall of the connecting terminal.

[0162] When the blowing device blows air on the surface of the connection terminal, the blowing device will be subjected to a reaction force. The distance between the blowing device and the connection terminal remains unchanged, and the magnitude of the reaction force is related to the distance between the two. A pressure sensor is provided on the blowing device to collect the reaction force.

[0163] Step S6021: When the reaction force is not less than the preset reference force, it is defined as an outer wall protrusion, and the outer diameter information of the connection terminal is retrieved from the model information of the connection terminal according to the model information of the connection terminal.

[0164] When the surface of the connection terminal is smooth, the reaction force exerted on it by the blowing device when blowing air is constant. The magnitude of the reaction force at this time is the reference force, which is collected in advance by the technicians and will not be elaborated here.

[0165] When the reaction force is not less than the reference force, it means that the reaction force exerted on the blowing device during the blowing process suddenly increases, indicating that the distance between the blowing device and the surface of the connecting terminal decreases. At this time, a possible situation is that a protrusion appears on the surface of the connecting terminal, and the blowing device blows on the protruding feature.

[0166] The outer diameter information of the connection terminal refers to the outer diameter value of the connection terminal. The outer diameter information of the connection terminal is directly obtained by retrieving the model information of the connection terminal from the database.

[0167] Step S60211: matching a preset grinding device according to the outer diameter information of the connection terminal and sleeve the grinding device on the outer side of the connection terminal.

[0168] In this embodiment, when a raised feature is detected on the surface of the connection terminal, the system sets a grinding device on the outside of the connection terminal. The grinding device is annular and has an inner diameter that is the same as the outer diameter of the connection terminal. The inner wall of the grinding device is a friction belt.

[0169] Step S60212: Control the inner clamping device to rotate at a preset grinding speed to grind the raised features.

[0170] When the grinding device is placed on the outside of the connection terminal, the system controls the inner clamping device to rotate, and the connection terminal rubs against the friction belt on the inner wall of the grinding device, thereby grinding the raised features flat. The metal powder generated during the grinding process will be collected by the grinding device and can be recycled.

[0171] The grinding speed is the rotation speed of the inner clamping device when grinding the raised features on the outer wall of the connection terminal set by the technician, which will not be described in detail here.

[0172] Step S6022: When the reaction force is less than the reference force, it is defined as an outer wall crack, and the connection terminal is repaired using a preset outer wall crack repair method.

[0173] When the reaction force is less than the reference force, it means that the reaction force on the blowing device during the blowing process suddenly decreases, indicating that the distance between the blowing device and the surface of the connection terminal increases, indicating that the surface of the connection terminal may be cracked, and the blowing device blows on the crack feature, and the reaction force is small at this time. If the outer wall of the connection terminal has crack features, the system repairs the crack features through the outer wall crack repair method. The outer wall crack repair method is not described here in detail and will be described in detail in subsequent embodiments.

[0174] Reference Figure 7 , the outer wall crack repair method includes the following steps:

[0175] Step S700: Acquire an outer surface image of the connection terminal.

[0176] The outer surface image of the connection terminal refers to the outer surface image of the connection terminal acquired by the camera, and abnormal conditions on the outer surface of the connection terminal can be identified in the outer surface image.

[0177] Step S701: determining the outer ring crack position according to the outer surface image of the connection terminal and the preset crack feature.

[0178] The outer ring crack position refers to the position of the crack feature on the outer surface of the connection terminal. The system can obtain the outer ring crack position by performing image recognition analysis on the crack feature in the outer surface image of the connection terminal.

[0179] Step S702: Control the inner clamping device to rotate the metal powder generated when grinding the raised features to the cracked position of the outer ring to fill the cracked features.

[0180] After the crack position of the outer ring is determined, the metal powder originally obtained by grinding from the protruding feature can be transferred to the crack position of the outer ring by relatively rotating the connecting terminal and the grinding device, thereby filling the crack position of the outer ring.

[0181] If the connection terminal does not originally have raised features, the system can fill the cracked position of the outer ring with metal powder recovered from grinding other connection terminals.

[0182] Step S703: controlling the preset injection device to fill the metal adhesive into the crack feature of the outer ring crack position, and controlling the inner clamping device to continuously rotate the connection terminal at a grinding speed to generate heat to accelerate the curing of the metal adhesive.

[0183] When the cracked position of the outer ring is filled with metal powder, the system injects metal adhesive into the cracked position of the outer ring through the injection device to solidify the metal powder. In addition, the inner clamping device continuously rotates the connection terminal, so that the connection terminal and the grinding device move relative to each other, and friction heat can be generated in this process to accelerate the solidification of the metal adhesive.

[0184] Reference Figure 8 The method for positioning and installing the template test block at the characteristic position of the test slot includes the following steps:

[0185] Step S800: After the connection terminal is installed at the test hole position, the suction cup device is controlled to pick up the prototype test block to a preset pre-positioning position above the characteristic position of the test slot.

[0186] In this embodiment, when the template test block is installed at the characteristic position of the test slot, it is necessary to first locate the position of the template test block to ensure that the RF probe and the connection terminal can be aligned and abutted. In order to locate the template test block, the system first moves the template test block to a specific position above the characteristic position of the test slot through a suction cup device. The specific position is the pre-positioning position, and the template test block is horizontally moved and adjusted at the pre-positioning position. Since there is a gap between the template test block and the characteristic position of the test slot when it is in the pre-positioning position, it is convenient to observe the docking condition of the RF probe and the connection terminal.

[0187] Step S801: Control a preset laser device to penetrate the central hole of the connection terminal vertically downward through the template test block to irradiate the inside of the test slot feature, and obtain the bottom surface image information of the test slot.

[0188] A laser device is provided on the top of the test bench. In this embodiment, the laser device emits laser vertically downward through the center hole of the connecting terminal. At this time, a red dot light spot will appear in the test slot. When the red dot light spot is offset from the RF probe, the prototype test block is adjusted.

[0189] The image information of the bottom surface of the test slot refers to the image of the bottom surface of the test slot obtained by the camera. Both the radio frequency probe and the red dot light spot can be identified in the image information of the bottom surface of the test slot.

[0190] Step S802: Determine the position of the radio frequency probe and the position of the red light spot generated by the laser device irradiating the bottom surface of the test slot according to the image information of the bottom surface of the test slot.

[0191] The RF probe position refers to the designed position of the RF probe at the bottom of the test slot. The red light spot position refers to the position of the red spot formed by the laser device irradiating the bottom of the test slot. Both the RF probe position and the red light spot position can be obtained by image recognition and analysis of the bottom surface image information of the test slot.

[0192] Step S803: Determine the orientation deviation according to the position of the radio frequency probe and the position of the red light spot.

[0193] Azimuth deviation refers to the position deviation between the RF probe position and the red light spot position, including the offset distance and the offset angle. After the RF probe position and the red light spot position are determined in the bottom surface image information of the test slot, the azimuth deviation can be determined by directly analyzing the two in the bottom surface image information of the test slot.

[0194] Step S804: Control the suction cup device to adjust the prototype test block horizontally according to the azimuth deviation until the position of the radio frequency probe coincides with the position of the red light spot.

[0195] After determining the azimuth deviation, the prototype test block is adjusted horizontally through the suction cup device until the position of the RF probe and the position of the red light spot overlap, which indicates that the positioning of the prototype test block is completed.

[0196] Step S805: Control the suction cup device to lower the prototype test block to fit with the prototype base so as to be installed at the characteristic position of the test slot.

[0197] After the positioning of the prototype test block is completed, the prototype test block is directly moved vertically downward and fixed on the prototype base. At this time, the RF probe can be aligned and abutted against the connection terminal.

[0198] Based on the same inventive concept, an embodiment of the present invention provides a test model test system for chip testing, including:

[0199] The acquisition module is used to obtain the top image information of the prototype test block, the overall image information of the prototype base, the model information of the connecting terminal, the rotational resistance value of the internal clamping device, the inner wall image of the connecting terminal, the state image of the connecting terminal, the outer surface image of the connecting terminal and the bottom surface image information of the test slot.

[0200] The memory is used to store a program of a test model test method for chip testing.

[0201] The program in the memory can be loaded and executed by the processor and realize a test model test method for chip testing.

[0202] Based on the same inventive concept, an embodiment of the present invention provides an intelligent terminal, including a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executes a test profile test method for chip testing.

[0203] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A test model testing method for chip testing, characterized in that: include: Obtain the top image information of the prototype test block; Determine the test hole position according to the top image information and the preset test hole features; Controlling a preset inner clamping device to clamp the preset inner wall of the connection terminal to clamp the connection terminal, inserting the connection terminal into the test hole position of the prototype test block, and obtaining the overall image information of the prototype base; Determine the test slot feature position according to the overall image information and the preset test slot features; Controlling the preset suction cup device to suck up the prototype test block and position it at the characteristic position of the test slot to control the radio frequency probe preset in the test slot to abut against the connection terminal installed on the prototype test block; When the connection terminal is installed at the test hole position, it is installed by the connection terminal installation control method, and the connection terminal installation control method includes: Get the model information of the connection terminal; Retrieve the terminal inner diameter value of the connection terminal from the model information of the connection terminal; Match the opening width of the clamping jaws of the inner clamping device according to the inner diameter of the terminal; According to the opening width of the clamping jaws, the inner clamping device is controlled to extend into the connecting terminal to clamp the connecting terminal and insert it into the test hole position; When the connecting terminal is at the test hole position, the inner clamping device is controlled to rotate in the connecting terminal at a preset rotation speed so as to clean the inner wall of the connecting terminal through a cloth preset on the clamping claw of the inner clamping device, and detect abnormalities of the inner wall of the connecting terminal; The method for detecting abnormalities on the inner wall of the connection terminal includes: When the inner clamping device rotates on the inner wall of the connecting terminal, a rotation resistance value of the inner clamping device and an image of the inner wall of the connecting terminal are obtained; When the rotation resistance value exceeds the lower limit of the preset reference friction range, it is defined as abnormal surface cracking and is processed with the preset internal surface cracking treatment method; acquiring a state image of the connection terminal based on the rotation resistance value exceeding an upper limit of a reference friction range; determining whether the connection terminal rotates synchronously with the inner clamping device according to the state image of the connection terminal; When the connection terminal rotates synchronously with the inner clamping device, it is defined as abnormal misalignment after surface cracking, and it is handled in the same way as the inner surface cracking treatment method; When the connection terminal does not rotate synchronously with the inner clamping device, it is defined as a surface protrusion abnormality, and the protrusion angle position is determined according to the inner wall image of the connection terminal and the preset protrusion feature; Controlling the inner clamping device to apply force at the raised angle position with a preset clamping jaw tension to flatten the raised feature; Internal surface cracking treatment methods include: When the connection terminal and the inner clamping device rotate synchronously, the inner clamping device is controlled to rotate in the opposite direction, and the inner ring crack position is determined according to the inner wall image of the connection terminal and the preset cracking characteristics; Control the inner clamping device to rotate in the opposite direction to the inner ring cracking position to form a filling cavity between the inner ring cracking position of the connecting terminal and the clamping claws of the inner clamping device, and control the inner clamping device to take the connecting terminal out of the test hole position; Controlling a preset clamping device to apply force to the circumference of the connection terminal with a preset clamping force, and determining a clamping inner diameter value of the connection terminal according to an image of the inner wall of the connection terminal; When the clamping inner diameter value is consistent with the terminal inner diameter value, the preset injection device is controlled to fill the metal bonding glue into the filling cavity at the crack position of the inner ring; After filling the metal adhesive, the inner clamping device is controlled to reinstall the connection terminal at the test hole position, and the inner clamping device is controlled to apply force at the cracked position of the inner ring with a preset clamping claw tension.

2. A test model testing method for chip testing according to claim 1, characterized in that: Before installing the mastering test block to the mastering base, it is necessary to first pick up the mastering test block from the preset part placement area to the preset test area to install the connection terminal in the test area. The processing method of the mastering test block includes: Obtain the model information of the prototype test block and the inner cavity image of the test hole position; Retrieve the weight value of the prototype test block from the model information of the prototype test block; Match the suction power of the suction cup device according to the weight value of the prototype test block; The suction cup device is controlled according to the suction power to suck up the prototype test block from the part placement area, and the heating element preset on the suction cup device is controlled with a preset heating power to preheat the prototype test block; Determine whether there is a foreign body at the test hole position according to the inner cavity image at the test hole position and the test hole characteristics; If and only if there is foreign matter at the test hole position, the suction power is corrected by a preset correction amount to remove the foreign matter at the test hole position during the process of picking up the prototype test block from the part placement area to the test area.

3. A test model testing method for chip testing according to claim 1, characterized in that: When the inner clamping device inserts the connection terminal into the test hole, the outer wall of the connection terminal needs to be processed. The method for processing the outer wall of the connection terminal includes: When the connecting terminal is inserted into the test hole, the inner clamping device is controlled to rotate with the connecting terminal at a rotation speed; Controlling a preset blowing device to blow air to the outer wall of the connection terminal to remove surface impurities, and obtaining a reaction force of the blowing device on the outer wall of the connection terminal; When the reaction force is not less than the preset reference force, it is defined as an outer wall bulge, and the outer diameter information of the connection terminal is retrieved from the model information of the connection terminal according to the model information of the connection terminal; Matching a preset grinding device according to the outer diameter information of the connection terminal and sleeve the grinding device on the outer side of the connection terminal; controlling the inner clamping device to rotate at a preset grinding speed to grind the raised feature; When the reaction force is less than the reference force, it is defined as outer wall cracking, and the connection terminal is repaired using a preset outer wall crack repair method.

4. A test model testing method for chip testing according to claim 3, characterized in that: The methods for repairing cracks in the outer wall include: Acquire an outer surface image of the connection terminal; Determine the outer ring crack position according to the outer surface image of the connection terminal and the preset crack characteristics; Controlling the inner clamping device to rotate the metal powder generated when grinding the raised features to the cracked position of the outer ring to fill the cracked features; The preset injection device is controlled to fill the metal adhesive into the crack feature of the outer ring crack position, and the inner clamping device is controlled to continuously rotate the connection terminal at a grinding speed to generate heat to accelerate the curing of the metal adhesive.

5. A test model testing method for chip testing according to claim 2, characterized in that: The method for positioning and installing the prototype test block at the characteristic position of the test slot includes: When the connection terminal is installed at the test hole position, the suction cup device is controlled to pick up the prototype test block to a preset pre-positioning position above the characteristic position of the test slot; Controlling a preset laser device to penetrate the central hole of the connection terminal vertically downward through the template test block to irradiate the test slot features, and obtaining the bottom surface image information of the test slot; Determine the position of the radio frequency probe and the position of the red light spot generated by the laser device irradiating the bottom surface of the test slot according to the image information of the bottom surface of the test slot; Determine the azimuth deviation according to the position of the radio frequency probe and the position of the red light spot; According to the azimuth deviation, the suction cup device is controlled to adjust the prototype test block horizontally until the position of the radio frequency probe coincides with the position of the red light spot; The suction cup device is controlled to lower the prototype test block to fit with the prototype base so as to be installed at the characteristic position of the test slot.

6. A test model test system for chip testing, characterized in that: include: An acquisition module is used to acquire top image information of the prototype test block, overall image information of the prototype base, model information of the connection terminal, rotation resistance value of the inner clamping device, inner wall image of the connection terminal, state image of the connection terminal, outer surface image of the connection terminal, and bottom surface image information of the test slot; A memory for storing a program of a test model testing method for chip testing according to any one of claims 1 to 5; The program in the memory can be loaded and executed by the processor and realize a test model test method for chip testing.

7. An intelligent terminal, characterized in that: The invention comprises a memory and a processor, wherein the memory stores a computer program which can be loaded by the processor and executes a test model testing method for chip testing as claimed in any one of claims 1 to 5.

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