Heat dissipation device based on optical module

Abstract

The embodiment of the application provides a heat dissipation device based on an optical module, which comprises a circuit board and a heat-conducting substrate; wherein the circuit board is provided with a containing cavity for containing the optical module and a heat sink; one end of the containing cavity is provided with a first opening through which the optical module enters the containing cavity; the top end of the containing cavity is provided with a second opening; the periphery of the heat-conducting substrate is provided with at least two first through holes; the first through holes are used for penetrating a screw rod; the screw rod is fixedly connected with the circuit board through the first through holes; the bottom end of the heat-conducting substrate is provided with a heat-conducting boss and a first heat pipe groove for placing a heat pipe; the heat-conducting boss is in contact with the optical module through the second opening; and the heat pipe is connected with the heat sink. The heat sink is avoided from being placed above the heat-conducting substrate, the height of the heat dissipation device is further avoided from being doubled, the height dimension of the heat-conducting substrate is effectively reduced, and the flatness of the heat dissipation device is realized.

Description

Technical Field

[0001] This application relates to the field of optical device technology, and specifically to a heat dissipation device based on an optical module. Background Technology

[0002] As optical module boards become increasingly miniaturized and flattened, the issue of board space utilization has received more attention. The largest component on an optical module board is the optical module itself. Taking heat dissipation of the optical module assembly as an example, how to design the optical module assembly to achieve both good heat dissipation and meet the requirements of board flatness and miniaturization has become a hot research topic in the field of optical communication technology. Currently, there is no effective solution to this problem. Summary of the Invention

[0003] In view of this, embodiments of this application provide a heat dissipation device based on an optical module, which aims to effectively reduce the height of the heat-conducting substrate and achieve a flattened heat dissipation device.

[0004] The technical solution of this application embodiment is implemented as follows:

[0005] This application provides a heat dissipation device based on an optical module, the heat dissipation device including a circuit board and a thermally conductive substrate; wherein,

[0006] The circuit board is equipped with a cavity for accommodating the optical module and a heat sink; a first opening is provided at one end of the cavity, through which the optical module enters the cavity; a second opening is provided at the top of the cavity.

[0007] The thermally conductive substrate has at least two first through holes around its perimeter; the first through holes are used to pass through a screw; the screw passes through the first through holes and is fixedly connected to the circuit board; the bottom end of the thermally conductive substrate has a thermally conductive boss and a first heat pipe groove for placing a heat pipe; the thermally conductive boss passes through the second opening and contacts the optical module; the heat pipe is connected to the heat sink.

[0008] In the above scheme, at least two fixing blocks are provided at the top of the circuit board, and each fixing block is provided with a threaded hole; the screw includes a tail end, the tail end is provided with a thread, and the thread of the screw is fixedly connected to the threaded hole of the fixing block.

[0009] In the above scheme, the heat pipe includes a first end and a second end, the first end being placed in the first heat pipe groove; the second end being connected to the heat sink.

[0010] In the above scheme, the first through hole is used for fixed connection with the rivet post, and the bottom end of the rivet post is provided with a second through hole, which is used for the screw rod to pass through.

[0011] In the above scheme, the thermally conductive substrate includes at least a first part and a second part; the first part includes a first screw hole, and the second part includes a second screw hole; the screw includes a first screw and a second screw; the first screw passes through the first screw hole in at least two first through holes; the second screw passes through the second screw hole in at least two first through holes.

[0012] In the above scheme, an elastic element is provided inside the rivet post; an open retaining ring is provided at the bottom end of the rivet post; the screw includes a head and a middle part, and the middle part includes a locking groove; the open retaining ring is engaged with the locking groove; one end of the elastic element contacts the second through hole, the middle part passes through the elastic element, and the other end of the elastic element contacts the bottom end of the head.

[0013] In the above scheme, a second heat pipe groove is provided at the bottom end of the thermally conductive substrate, a thermally conductive buffer block is provided in the second heat pipe groove, and a thermally conductive boss is provided at the bottom end of the thermally conductive buffer block.

[0014] In the above scheme, the inner diameter of the second heat pipe groove is larger than the inner diameter of the first heat pipe groove; the two ends of the heat-conducting easing block adjacent to the bottom end of the heat-conducting easing block are respectively provided with a first side wing and a second side wing; the first side wing and the second side wing are respectively in contact with the top end of the second heat pipe groove.

[0015] In the above scheme, the first heat pipe groove is disposed between the heat-conducting boss and the first side wing or the second side wing.

[0016] In the above scheme, the first heat pipe groove is disposed between the heat-conducting boss and the first part or the second part.

[0017] This application provides a heat dissipation device based on an optical module. The heat dissipation device includes a circuit board and a thermally conductive substrate. The circuit board has a receiving cavity for accommodating the optical module and a heat sink. One end of the receiving cavity has a first opening through which the optical module enters the receiving cavity. A second opening is provided at the top of the receiving cavity. At least two first through holes are provided around the thermally conductive substrate. The first through holes are used to pass through a screw, which passes through the first through holes and is fixedly connected to the circuit board. The bottom end of the thermally conductive substrate has a thermally conductive boss and a first heat pipe groove for placing a heat pipe. The thermally conductive boss passes through the second opening and contacts the optical module. The heat pipe is connected to the heat sink. By using the technical solution of this application embodiment, by providing a first heat pipe groove in the heat dissipation device, placing the heat pipe in the first heat pipe groove, and connecting the heat pipe to the heat sink, the heat sink is avoided from being placed on top of the thermally conductive substrate, further preventing the height of the heat dissipation device from increasing exponentially, effectively reducing the height of the thermally conductive substrate, and achieving a flattened heat dissipation device. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the composition structure of the heat dissipation device based on the optical module in an embodiment of this application;

[0019] Figure 2 This is a schematic diagram of the composition structure of another heat dissipation device based on an optical module according to an embodiment of this application;

[0020] Figure 3 This is a schematic diagram of the screw structure of the heat dissipation device based on the optical module in an embodiment of this application;

[0021] Figure 4 This is a schematic diagram of the composition structure of another heat dissipation device based on an optical module according to an embodiment of this application;

[0022] Figure 5 This is a schematic diagram of the composition structure of another heat dissipation device based on an optical module according to an embodiment of this application;

[0023] Figure 6 This application also provides a schematic diagram of the composition of a heat dissipation device based on an optical module. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the specific technical solutions of the invention will be further described in detail below with reference to the accompanying drawings of the embodiments of the present invention. The following embodiments are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0025] In related technologies, commonly used optical module heat dissipation devices are as follows: the optical module board has a front panel, a circuit board, and an optical module cage mounted on the front panel. The heat sink is fixed to the cage by spring clips, and the optical module enters the cage through openings in the front panel. To dissipate heat from the optical module, the heat dissipation fins on the heat sink extend upwards away from the optical module. This heat dissipation structure causes the overall height of the optical module board to increase several times, which is not conducive to the miniaturization and flattening of the board. Furthermore, the use of elastic spring clips to fix the heat sink to the main heat dissipation surface of the optical module results in relatively low pressure at the contact interface, leading to uneven stress and thus higher thermal resistance, which is detrimental to heat dissipation.

[0026] This application provides a heat dissipation device based on an optical module, which will be described below in conjunction with... Figures 1-6For illustrative purposes, the heat dissipation device includes a circuit board 300 and a thermally conductive substrate 120. The circuit board 300 has a receiving cavity 110 for accommodating an optical module and a heat sink 200 mounted on it. A first opening is provided on one side of the receiving cavity 110, through which the optical module 100 enters the receiving cavity 110. A second opening 111 is provided at the top of the receiving cavity 110. At least two first through holes 123 are provided around the thermally conductive substrate 120. The first through holes 123 are used to pass through a screw 130. The screw 130 passes through the first through holes 123 and is fixedly connected to the circuit board 300. A thermally conductive boss 121 and a first heat pipe groove 122 for placing a heat pipe 140 are provided at the bottom of the thermally conductive substrate 120. The thermally conductive boss 121 passes through the second opening 111 and contacts the optical module 100. The heat pipe 140 is connected to the heat sink 200.

[0027] Exemplary, the thermally conductive substrate 120 can be determined according to actual conditions and is not limited here. As an example, it can be a substrate used to transfer heat from the optical module 100. The material of the thermally conductive substrate 120 can be determined according to actual conditions and is not limited here. The receiving cavity 110 can be determined according to actual conditions and is not limited here. As an example, it can be a mouse cage.

[0028] For example, the first through hole 123 can be determined according to the actual situation, and is not limited here. As one example, it can be a through hole with a unique diameter; as another example, it can also be a stepped hole with the upper part set as the first diameter and the lower part set as the second diameter, and the first diameter is greater than the second diameter; wherein, the length of the upper part of the first diameter can also be less than or equal to the length of the lower part of the second diameter, and the length of the upper part of the first diameter can be greater than the length of the lower part of the second diameter.

[0029] For example, the thermally conductive protrusion 121 can contact the main heat dissipation surface 101 of the optical module 100. The heat pipe 140 can be connected to the heat dissipation substrate 201 of the heat sink 200.

[0030] In some embodiments, the thermally conductive substrate 120 can be a flexible beam structure. By designing a flexible beam structure, the thermally conductive substrate 120 can be directly fixed above the optical module 100 and the receiving cavity 110 by screws 130, reducing the number of parts and the complexity of the heat dissipation system. Furthermore, by tightening the screws 130, the pressure between the thermally conductive protrusions 121 on the thermally conductive substrate 120 and the main heat dissipation surface 101 of the optical module 100 can be increased, reducing the contact thermal resistance at the contact interface between the thermally conductive protrusions 121 and the main heat dissipation surface 101, which is beneficial for efficiently dissipating the heat of the optical module 100.

[0031] In one application example, the top of the circuit board 300 is provided with at least two fixing blocks 160, each fixing block 160 having a threaded hole; the screw 130 includes a tail 134, the tail 134 having a thread, the thread of the tail 134 being fixedly connected to the threaded hole of the fixing block 160. This achieves a fixed connection between the screw 130 and the circuit board 300.

[0032] In one application example, the heat pipe 140 includes a first end 141 and a second end 142, the first end 141 being placed in a first heat pipe groove 122; the second end 142 being connected to a heat sink 200.

[0033] Exemplarily, the first end 141 can be determined according to the actual situation, and is not limited here. As an example, it can be an evaporation end, and the first end 141 can be fixed in the first heat pipe groove 122 by welding or other means. The second end 142 can be determined according to the actual situation, and is not limited here. As an example, it can be a condensation end, and the second end 142 can be connected to the heat dissipation substrate 201 of the heat sink 200.

[0034] In some embodiments, the upper surface of the first end 141 is flush with the upper surface of the thermally conductive substrate 120.

[0035] In one application example, the first through hole 123 is used for fixed connection with the rivet 150, and the bottom end of the rivet 150 is provided with a second through hole for the threaded rod 130 to pass through.

[0036] For example, the rivet post 150 can be determined according to the actual situation, and is not limited here. As an example, it can be a press-fit nut post, also known as a press-fit stud or nut post, which has a hexagonal top and a cylindrical bottom. The rivet post 150 is fixed to the first through hole 123 of the heat-conducting substrate 120 by riveting. Specifically, the bottom end of the top of the rivet post 150 contacts the top end of the lower part of the first through hole 123.

[0037] For example, the second through hole can be determined according to actual conditions and is not limited here. As an example, it can be a stepped hole with the upper part set as the third diameter and the lower part set as the fourth diameter, and the third diameter is greater than the fourth diameter; wherein, the length of the upper part of the third diameter can also be less than or equal to the length of the lower part of the fourth diameter, and the length of the upper part of the third diameter can be greater than the length of the lower part of the fourth diameter. The screw 130 passes through the upper and lower parts of the second through hole.

[0038] In one application example, the thermally conductive substrate 120 includes at least a first portion 125 and a second portion 126; the first portion 125 includes a first screw hole, and the second portion 126 includes a second screw hole; the screw 130 includes a first screw and a second screw; the first screw passes through the first screw hole in at least two first through holes; and the second screw passes through the second screw hole in at least two first through holes.

[0039] In one application example, an elastic element 170 is provided inside the rivet post 150; an open retaining ring 180 is provided at the bottom end of the rivet post 150; the screw 130 includes a head 131 and a middle part 132, the middle part 132 includes a locking groove 133; the open retaining ring 180 is engaged with the locking groove 133; one end of the elastic element 170 contacts the second through hole, the middle part 132 passes through the elastic element 170, and the other end of the elastic element 170 contacts the bottom end of the head 131.

[0040] Exemplary, the elastic element 170 can be determined according to actual conditions and is not limited here. As an example, it can be a spring. One end of the elastic element 170 contacts the top end of the lower part of the second through hole, and the open retaining ring 180 contacts the bottom end of the rivet 150. The combination of spring 170, screw 130 and open retaining ring 180 realizes the floating design of the heat-conducting substrate 120, and by tightening the screw 130, the pressure of the heat-conducting boss 121 on the main heat dissipation surface 101 of the optical module 100 can be increased, and the contact thermal resistance of the contact interface between the heat-conducting boss 121 and the main heat dissipation surface 101 can be reduced, which is beneficial to efficiently dissipate the heat of the optical module 100.

[0041] In some embodiments, the head 131 contacts the inner wall of the top of the rivet 150. In other embodiments, the bottom end of the head 131 contacts the top end of the rivet 150, and the head 131 contacts the inner wall of the top of the first through hole 123.

[0042] In one application example, a second heat pipe groove 124 is provided at the bottom end of the thermally conductive substrate 120, a thermally conductive buffer block 190 is provided in the second heat pipe groove 124, and a thermally conductive boss 121 is provided at the bottom end of the thermally conductive buffer block 190.

[0043] For example, the fixing method of the first end 141 can be determined according to the actual situation and is not limited here. As an example, it can be fixed in the first heat pipe groove 122 by welding or other means, and the first end 141 can be fixed to the heat-conducting easing block 190 by welding or other means.

[0044] In one application example, the inner diameter of the second heat pipe groove 124 is larger than the inner diameter of the first heat pipe groove 122; the two ends of the heat-conducting easing block 190 adjacent to the bottom end of the heat-conducting easing block 190 are respectively provided with a first side wing 191 and a second side wing 192; the first side wing 191 and the second side wing 192 are respectively in contact with the top end of the second heat pipe groove 124.

[0045] In one application example, the first heat pipe groove 122 is disposed between the heat-conducting boss 121 and the first side wing 191 or the second side wing 192.

[0046] In one application example, the first heat pipe groove 122 is disposed between the heat-conducting boss 121 and the first portion 125 or the second portion 126.

[0047] The embodiments of this application can apply the force generated by the spring and screw to the contact interface between the optical module and the heat-conducting boss through the coupling of the heat-conducting substrate and the easing block, thereby increasing the contact pressure and reducing the contact thermal resistance; it can also reduce the height of the heat-conducting substrate through the design and arrangement of heat pipes, thereby achieving the flattening of the board; and it can further reduce the number of parts and the complexity of the board system while achieving the heat dissipation effect of the heat dissipation system through the integrated elastic beam structure design.

[0048] To understand the embodiments of the present invention, the following description uses an optical module board heat dissipation device as an example, wherein the optical module board is also called an optical module card.

[0049] Application Example 1: For example Figure 1 , Figure 2 and Figure 3 As shown, the optical module board is equipped with a cage 110 and a circuit board 300. The circuit board 300 is fixed on the board panel, the cage 110 is mounted on the circuit board 300, and the optical module 100 is inserted into the cage 110 along the inside of the cage 110.

[0050] The heat-conducting substrate 120 is provided with a first heat pipe groove 122, and the heat pipe 140 is provided with an evaporation end 141 and a condensation end 142. The evaporation end 141 of the heat pipe 140 is fixed in the first heat pipe groove 122 by welding or other means, and the condensation end 142 of the heat pipe 140 is fixed to the heat dissipation substrate 201 of the heat sink 200 fixed on the circuit board 300.

[0051] The heat-conducting substrate 120 has a first through hole 123 around its interior. It can be a stepped hole with a first diameter at the top and a second diameter at the bottom, and the first diameter is larger than the second diameter. The bottom end of the top of the rivet 150 is riveted and fixed to the top end of the lower part of the first through hole 123 by riveting.

[0052] The rivet post 150 has a spring 170 inside and a second through hole. The tail 134 of the screw 130 has a thread. The thread of the tail 134 passes through the second through hole of the rivet post 150 and is connected and fixed to the threaded hole inside the fixing block 160 on the circuit board 300.

[0053] One end of the spring 170 contacts the top of the lower part of the second through hole of the rivet 150 and the inner side of the upper part of the second through hole of the rivet 150; the other end of the spring 170 contacts the bottom of the head 131 of the screw 130, the middle part 132 of the screw 130 passes through the spring 170, and the middle part 132 of the screw 130 is provided with a locking groove 133; the open retaining ring 180 is locked in the locking groove 133 and contacts the bottom end of the bottom of the rivet 150.

[0054] The thermally conductive substrate 120 is provided with a thermally conductive protrusion 121, which passes through the second opening 111 at the upper end of the cage 110 and contacts the main heat dissipation surface 101 of the optical module 100. The upper surface of the thermally conductive substrate 120 is flush with the upper surface of the heat pipe 140.

[0055] When the optical module 100 is not inserted into the cage 110, the spring 170 is compressed by tightening the screw 130. The spring 170 applies pressure to the rivet 150 and conducts it to the heat-conducting substrate 120, so that the heat-conducting substrate 120 presses on the cage 110.

[0056] When the optical module 100 is inserted into the cage 110, the main heat dissipation surface 101 of the optical module 100 lifts the heat-conducting protrusion 121 on the heat-conducting substrate 120. The compressed spring 170 will be partially relaxed, but still in a compressed state, so that the heat-conducting protrusion 121 is pressed tightly on the main heat dissipation surface 101 of the optical module 100.

[0057] The combination of spring 170, screw 130 and open retaining ring 180 enables the floating design of the heat-conducting substrate 120. Tightening the screw 130 increases the pressure of the heat-conducting protrusion 121 on the main heat dissipation surface 101 of the optical module 100, reduces the contact thermal resistance at the contact interface between the heat-conducting protrusion 121 and the main heat dissipation surface 101 of the optical module 100, and facilitates the heat dissipation of the optical module 100.

[0058] The heat pipe 140 adopts a rectangular cross-section structure, which reduces the height of the heat-conducting substrate 120 that fixes the heat pipe. In addition, through the design of the heat pipe 140, heat can be directly conducted to the heat sink 200 on the back of the single board, without the need to add heat dissipation fins above the heat-conducting substrate 120 to achieve heat dissipation, which is conducive to the miniaturization and flattening of the optical module board.

[0059] Application Example 2: (e.g.) Figure 4As shown, the optical module board is equipped with a cage 110 and a circuit board 300. The circuit board 300 is fixed on the board panel, the cage 110 is mounted on the circuit board 300, and the optical module 100 is inserted into the cage 110 along the inside of the cage 110.

[0060] The thermally conductive substrate 120 is provided with a first heat pipe groove 122, and the heat pipe 140 is provided with an evaporation end 141 and a condensation end 142. A second heat pipe groove 124 is provided at the bottom of the thermally conductive substrate 120, and a thermally conductive buffer block 190 is provided in the second heat pipe groove 124. A thermally conductive boss 121 is provided at the bottom of the thermally conductive buffer block 190. The evaporation end 141 of the heat pipe 140 is placed in the first heat pipe groove 122 of the thermally conductive substrate 120, and the evaporation end 141 of the heat pipe 140 is fixed to the thermally conductive buffer block 190 by means of welding or the like. The condensation end 142 of the heat pipe 140 is fixed to the heat dissipation substrate 201 of the heat sink 200 fixed on the circuit board 300.

[0061] The heat-conducting substrate 120 has a first through hole 123 around its interior. It can be a stepped hole with a first diameter at the top and a second diameter at the bottom, and the first diameter is larger than the second diameter. The bottom end of the top of the rivet 150 is riveted and fixed to the top end of the lower part of the first through hole 123 by riveting.

[0062] The rivet post 150 has a spring 170 inside and a second through hole. The tail 134 of the screw 130 is threaded, and the thread of the tail 134 passes through the second through hole of the rivet post 150 and is connected and fixed to the threaded hole inside the fixing block 160 on the circuit board 300. The bottom end of the head 131 contacts the top end of the rivet post 150, and the head 131 contacts the inner wall of the top of the first through hole 123.

[0063] One end of the spring 170 contacts the top of the lower part of the second through hole of the rivet 150 and the inner side of the upper part of the second through hole of the rivet 150; the other end of the spring 170 contacts the bottom of the head 131 of the screw 130, the middle part 132 of the screw 130 passes through the spring 170, and the middle part 132 of the screw 130 is provided with a locking groove 133; the open retaining ring 180 is locked in the locking groove 133 and contacts the bottom end of the bottom of the rivet 150.

[0064] The thermally conductive buffer block 190 has a first side wing 191 and a second side wing 192, which respectively contact the top end of the second heat pipe groove 124. A thermally conductive protrusion 121 on the thermally conductive buffer block 190 passes through the second opening 111 at the upper end of the cage 110 and contacts the main heat dissipation surface 101 of the optical module 100. The upper surface of the thermally conductive substrate 120 is flush with the upper surface of the heat pipe 140.

[0065] When the optical module 100 is not inserted into the cage 110, tightening one screw 130 compresses the spring 170, which applies pressure to the rivet 150 and transmits it to the heat-conducting substrate 120. At the same time, the screw 130 applies pressure F1 to the heat-conducting substrate 120. The heat-conducting substrate 120 acts as a beam structure, applying pressure F1 to the heat-conducting buffer block 190. Tightening the screw 130 on the other side of the heat-conducting substrate 120 compresses the spring 170, applying pressure F2 to the heat-conducting substrate 120 and transmitting it to the heat-conducting buffer block 190. The force applied to the heat-conducting buffer block 190 is F (i.e., the sum of F1 and F2), causing the heat-conducting substrate 120 to press against the cage 110.

[0066] When the optical module 100 is inserted into the cage 110, the main heat dissipation surface 101 of the optical module 100 lifts the heat-conducting protrusion 121 on the heat-conducting buffer block 190. The compressed spring 170 will partially relax, but will still be in a compressed state, so that the heat-conducting protrusion 121 is pressed tightly against the main heat dissipation surface 101 of the optical module 100. By adjusting the screws 130 on both sides, the forces F1 and F2 are balanced, which can increase the pressure at the contact interface between the heat-conducting protrusion 121 on the heat-conducting buffer block 190 and the main heat dissipation surface 101 of the optical module 100, reduce the contact thermal resistance at the contact interface between the heat-conducting protrusion 121 and the main heat dissipation surface 101 of the optical module 100, and facilitate the heat dissipation of the optical module 100.

[0067] The thermally conductive buffer block 190 can be made of a high thermal conductivity material. It can be fixed to the evaporation end 141 of the heat pipe 140 by welding or integrally formed with the evaporation end 141 of the heat pipe 140. The first side wing 191 and the second side wing 192 of the thermally conductive buffer block 190 can extend downward to contact the cage 110 to achieve an auxiliary support function.

[0068] Application Example 3: (e.g.) Figure 5 As shown, the optical module board is equipped with a cage 110 and a circuit board 300. The circuit board 300 is fixed on the board panel, the cage 110 is mounted on the circuit board 300, and the optical module 100 is inserted into the cage 110 along the inside of the cage 110.

[0069] The heat-conducting substrate 120 has a first through hole 123 around its interior. It can be a stepped hole with a first diameter at the top and a second diameter at the bottom, and the first diameter is larger than the second diameter. The bottom end of the top of the rivet 150 is riveted and fixed to the top end of the lower part of the first through hole 123 by riveting.

[0070] The rivet post 150 has a spring 170 inside and a second through hole. The tail 134 of the screw 130 is threaded, and the thread of the tail 134 passes through the second through hole of the rivet post 150 and is connected and fixed to the threaded hole inside the fixing block 160 on the circuit board 300. The bottom end of the head 131 contacts the top end of the rivet post 150, and the head 131 contacts the inner wall of the top of the first through hole 123.

[0071] One end of the spring 170 contacts the top of the lower part of the second through hole of the rivet 150 and the inner side of the upper part of the second through hole of the rivet 150; the other end of the spring 170 contacts the bottom of the head 131 of the screw 130, the middle part 132 of the screw 130 passes through the spring 170, and the middle part 132 of the screw 130 is provided with a locking groove 133; the open retaining ring 180 is locked in the locking groove 133 and contacts the bottom end of the bottom of the rivet 150.

[0072] The thermally conductive buffer block 190 has a first side wing 191 and a second side wing 192, which respectively contact the top end of the second heat pipe groove 124. A thermally conductive protrusion 121 on the thermally conductive buffer block 190 passes through the second opening 111 at the upper end of the cage 110 and contacts the main heat dissipation surface 101 of the optical module 100. The upper end of the thermally conductive buffer block 190 is flush with the upper end of the thermally conductive substrate 120.

[0073] The heat pipe 140 has an evaporation end 141 and a condensation end 142. The condensation end 142 of the heat pipe 140 is fixed to the heat dissipation substrate 201 of the heat sink 200, which is fixed on the circuit board 300. A first heat pipe groove 122 is provided between the second side wing 192 of the thermally conductive buffer block 190 and the thermally conductive boss 121. The evaporation end 141 of the heat pipe 140 is placed in the first heat pipe groove 122 of the thermally conductive buffer block 190, and the evaporation end 141 of the heat pipe 140 is fixed to the thermally conductive buffer block 190 by means of welding or the like.

[0074] The evaporation end 141 of the heat pipe 140 is located on one side of the heat-conducting protrusion 121 in the heat-conducting buffer block 190. The heat pipe 140 is placed in the space between the heat-conducting buffer block 190 and the cage 110, which helps to reduce the height of the upper end of the heat-conducting buffer block 190 and also helps to reduce the height of the upper end of the heat-conducting substrate 120, thereby realizing the miniaturization and flattening of the optical module board.

[0075] When the optical module 100 is not inserted into the cage 110, tightening one screw 130 compresses the spring 170, which applies pressure to the rivet 150 and transmits it to the heat-conducting substrate 120. At the same time, the screw 130 applies pressure F1 to the heat-conducting substrate 120. The heat-conducting substrate 120 acts as a beam structure, applying pressure F1 to the heat-conducting buffer block 190. Tightening the screw 130 on the other side of the heat-conducting substrate 120 compresses the spring 170, applying pressure F2 to the heat-conducting substrate 120 and transmitting it to the heat-conducting buffer block 190. The force applied to the heat-conducting buffer block 190 is F (i.e., the sum of F1 and F2), causing the heat-conducting substrate 120 to press against the cage 110.

[0076] When the optical module 100 is inserted into the cage 110, the main heat dissipation surface 101 of the optical module 100 lifts the heat-conducting protrusion 121 on the heat-conducting buffer block 190. The compressed spring 170 will partially relax, but will still be in a compressed state, so that the heat-conducting protrusion 121 is pressed tightly against the main heat dissipation surface 101 of the optical module 100. By adjusting the screws 130 on both sides, the forces F1 and F2 are balanced, which can increase the pressure at the contact interface between the heat-conducting protrusion 121 on the heat-conducting buffer block 190 and the main heat dissipation surface 101 of the optical module 100, reduce the contact thermal resistance at the contact interface between the heat-conducting protrusion 121 and the main heat dissipation surface 101 of the optical module 100, and facilitate the heat dissipation of the optical module 100.

[0077] As part of the heat conduction system, the thermally conductive buffer block 190 conducts heat from the optical module 100 to the heat pipe 140 on the side of the thermally conductive boss 121, and then carries the heat away through the heat pipe 140. By increasing the cross-sectional width of the heat pipe 140 and utilizing its lateral displacement, the reduction in thermal efficiency caused by the interface between the thermally conductive buffer block 190 and the heat pipe 140 can be mitigated to some extent.

[0078] Application Example 4: (e.g.) Figure 6 As shown, the optical module board is equipped with a cage 110 and a circuit board 300. The circuit board 300 is fixed on the board panel, the cage 110 is mounted on the circuit board 300, and the optical module 100 is inserted into the cage 110 along the inside of the cage 110.

[0079] The thermally conductive substrate 120 has a first through hole 123 around its perimeter, which can be a through hole with a single diameter; the thread of the tail 134 of the screw 130 passes through the first through hole 123 and is connected and fixed to the threaded hole inside the fixing block 160 on the circuit board 300.

[0080] The thermally conductive substrate 120 is an integrated elastic beam structure. The first part 125 and the second part 126 of the thermally conductive substrate 120 are respectively fixed to the screw 130 through the first through hole 123. The thermally conductive substrate 120 is provided with a thermally conductive boss 121, which passes through the second opening 111 at the upper end of the cage 110 and contacts the main heat dissipation surface 101 of the optical module 100. The thermally conductive boss 121 and the second part 126 of the thermally conductive substrate are provided with a first heat pipe groove 122. The heat pipe 140 is provided with an evaporation end 141 and a condensation end 142. The evaporation end 141 of the heat pipe 140 is fixed in the first heat pipe groove 122 by welding or other means, and the condensation end 142 of the heat pipe 140 is fixed to the heat dissipation substrate 201 of the heat sink 200 fixed on the circuit board 300.

[0081] By designing the thermally conductive substrate 120 as an elastic beam structure, and directly fixing the elastic beam above the optical module 100 and the cage 110 with screws 130, the number of components and the complexity of the heat dissipation system are reduced. The heat pipe 140 can move laterally on one side or the other side of the thermally conductive boss 121. In this way, the thermal resistance of lateral heat transfer from the thermally conductive boss 121 to the heat pipe 140 through the thermally conductive substrate 120 can be minimized. By placing the heat pipe in the lower space of the second part 126 of the thermally conductive boss 121 and the thermally conductive substrate 120, the upper height of the thermally conductive substrate 120 can be reduced, which is beneficial for miniaturization and flattening of the optical module board.

[0082] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention.

Claims

1. A heat dissipating device based on an optical module, characterized by, The heat dissipation device includes a circuit board and a thermally conductive substrate; wherein... The circuit board is equipped with a housing cavity and a heat sink for accommodating the optical module; a first opening is provided at one end of the housing cavity, through which the optical module enters the housing cavity; a second opening is provided at the top of the housing cavity; at least two first through holes are provided around the perimeter of the thermally conductive substrate; the first through holes are used for passing through a screw; the first through holes are fixedly connected to a rivet post by riveting; the bottom end of the top of the rivet post contacts the top end of the lower part of the first through hole; a second through hole is provided at the bottom end of the rivet post; the second through hole is used for passing through a screw; the screw passes through the first through hole and the second through hole and is fixedly connected to the circuit board; an elastic element is provided inside the rivet post; an open retaining ring is provided at the bottom end of the rivet post; the screw includes a head and a middle part, the middle part including a locking groove; the open retaining ring engages with the locking groove; one end of the elastic element engages with the second through hole. The thermally conductive substrate has a heat-conducting boss and a first heat pipe groove for placing a heat pipe at its bottom end. A second heat pipe groove with an inner diameter larger than the first heat pipe groove is also provided at the bottom end of the thermally conductive substrate. A thermally conductive buffer block is provided inside the second heat pipe groove, with a first side wing and a second side wing respectively located at the two ends adjacent to the bottom end of the thermally conductive buffer block. The first side wing and the second side wing respectively contact the top end of the second heat pipe groove. The thermally conductive boss is located at the bottom end of the thermally conductive buffer block. The first heat pipe groove is located between the thermally conductive boss and either the first or second side wing. The thermally conductive substrate is an elastic beam structure. The thermally conductive boss passes through the second opening and contacts the optical module. The heat pipe is connected to the heat sink.

2. The apparatus according to claim 1, characterized in that, The circuit board has at least two fixing blocks at its top, each fixing block having a threaded hole; the screw includes a tail end with a thread, the thread of the screw being fixedly connected to the threaded hole of the fixing block.

3. The apparatus according to claim 1, characterized in that, The heat pipe includes a first end and a second end, the first end being placed in the first heat pipe groove; the second end being connected to the radiator.

4. The apparatus according to claim 1, characterized in that, The thermally conductive substrate includes at least a first part and a second part; the first part includes a first screw hole, and the second part includes a second screw hole; the screw includes a first screw and a second screw; the first screw passes through the first screw hole in at least two first through holes; the second screw passes through the second screw hole in at least two first through holes.

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